1PS79SB10115 [NXP]
Schottky barrier single diode; 肖特基势垒二极管单
| 型号： | 1PS79SB10115 |
| 厂家： | 
NXP |
| 描述： | Schottky barrier single diode |
| 文件： | 总8页 (文件大小：132K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
1PS79SB10
Schottky barrier single diode
14 August 2012
Product data sheet
1. Product profile
1.1 General description
Planar Schottky barrier diode with an integrated guard ring for stress protection,
encapsulated in a SOD523 (SC-79) ultra small Surface-Mounted Device (SMD) plastic
package.
1.2 Features and benefits
Low forward voltage
Guard ring protected
Ultra small plastic SMD package
AEC-Q101 qualified
•
•
•
•
1.3 Applications
Ultra high-speed switching
•
•
•
•
Voltage clamping
Protection circuits
Blocking diodes
1.4 Quick reference data
Table 1.
Symbol
Quick reference data
Parameter
Conditions
Min
Typ
Max
200
30
Unit
mA
V
IF
forward current
reverse voltage
forward voltage
-
-
-
-
-
-
VR
VF
IF = 10 mA; Tamb = 25 °C
400
mV
2. Pinning information
Table 2.
Pin
Pinning information
Symbol Description
Simplified outline
Graphic symbol
1
2
K
A
cathode[1]
anode
K
A
1
2
aaa-003679
SOD523
[1] The marking bar indicates the cathode.
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NXP Semiconductors
1PS79SB10
Schottky barrier single diode
3. Ordering information
Table 3.
Ordering information
Type number
Package
Name
Description
Version
1PS79SB10
SOD523
plastic surface-mounted package; 2 leads
SOD523
4. Marking
Table 4.
Marking codes
Type number
Marking code
1PS79SB10
F
5. Limiting values
Table 5.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
VR
Parameter
Conditions
Min
Max
30
Unit
V
reverse voltage
forward current
-
-
-
-
IF
200
300
600
mA
mA
mA
IFRM
IFSM
repetitive peak forward current tp ≤ 1 s; δ ≤ 0.5
non-repetitive peak forward
current
tp < 10 ms; Tj(init) = 25 °C
Tj
junction temperature
ambient temperature
storage temperature
-
125
125
150
°C
°C
°C
Tamb
Tstg
-65
-65
6. Thermal characteristics
Table 6.
Symbol
Thermal characteristics
Parameter
Conditions
Min
Typ
Max
Unit
Rth(j-a)
thermal resistance
from junction to
ambient
in free air
[1]
-
-
450
K/W
[1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
1PS79SB10
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Product data sheet
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NXP Semiconductors
1PS79SB10
Schottky barrier single diode
7. Characteristics
Table 7.
Symbol
Characteristics
Parameter
Conditions
Min
Typ
Max
240
320
400
500
800
2
Unit
mV
mV
mV
mV
mV
µA
VF
forward voltage
IF = 0.1 mA; Tamb = 25 °C
IF = 1 mA; Tamb = 25 °C
IF = 10 mA; Tamb = 25 °C
IF = 30 mA; Tamb = 25 °C
IF = 100 mA; Tamb = 25 °C
-
-
-
-
-
-
-
-
-
-
-
-
IR
reverse current
VR = 25 V; Tamb = 25 °C; pulsed;
tp = 300 µs; δ = 0.02
Cd
diode capacitance
f = 1 MHz; Tamb = 25 °C; VR = 1 V
-
-
10
pF
msa892
msa893
3
2
3
10
10
I
I
(1)
(2)
R
F
(1) (2) (3)
(µA)
(mA)
2
10
10
10
1
10
(1)
(2) (3)
1
(3)
- 1
- 1
10
10
0
10
20
30
0
0.4
0.8
1.2
V (V)
R
V
(V)
F
(1) Tamb = 125 °C
(2) Tamb = 85 °C
(3) Tamb = 25 °C
(1) Tamb = 125 °C
(2) Tamb = 85 °C
(3) Tamb = 25 °C
Fig. 1. Forward current as a function of forward
voltage; typical values
Fig. 2. Reverse current as a function of reverse
voltage; typical values
1PS79SB10
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Product data sheet
14 August 2012
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NXP Semiconductors
1PS79SB10
Schottky barrier single diode
msa891
15
C
d
(pF)
10
5
0
0
10
20
30
V
(V)
R
f = 1 MHz; Tamb = 25 °C
Fig. 3. Diode capacitance as a function of reverse voltage; typical values
8. Test information
8.1 Quality information
This product has been qualified in accordance with the Automotive Electronics Council
(AEC) standard Q101 - Stress test qualification for discrete semiconductors, and is
suitable for use in automotive applications.
9. Package outline
0.85
0.75
0.65
0.58
1
1.65 1.25
1.55 1.15
2
0.34
0.26
0.17
0.11
Dimensions in mm
02-12-13
Fig. 4. SOD523
1PS79SB10
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© NXP B.V. 2012. All rights reserved
Product data sheet
14 August 2012
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NXP Semiconductors
1PS79SB10
Schottky barrier single diode
10. Soldering
Footprint information for reflow soldering of plastic surface-mounted, 2 leads package
SOD523
2.15
1.4
0.5 0.6
(2×) (2×)
1.2
0.4
(2×)
0.5
(2×)
solder land
solder land plus solder paste
solder paste deposit
occupied area
solder resist
Dimensions in mm
sod523_fr
Fig. 5. Reflow soldering footprint for SOD523 (SOD523)
11. Revision history
Table 8.
Revision history
Data sheet ID
1PS79SB10 v.2
Modifications:
Release date
Data sheet status
Change notice
Supersedes
20120814
Product data sheet
-
1PS79SB10 v.1
The format of this document has been redesigned to comply with the new identity guidelines
of NXP Semiconductors.
•
Legal texts have been adapted to the new company name where appropriate.
Package outline drawing replaced by minimized package outline drawing.
Section "Test information" added.
•
•
•
•
Section "Soldering" added.
1PS79SB10 v.1
19980716
Product data sheet
-
-
1PS79SB10
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© NXP B.V. 2012. All rights reserved
Product data sheet
14 August 2012
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NXP Semiconductors
1PS79SB10
Schottky barrier single diode
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation -
lost profits, lost savings, business interruption, costs related to the removal
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12. Legal information
12.1 Data sheet status
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customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Document
Product
Definition
status [1][2] status [3]
Objective
[short] data
sheet
Development This document contains data from
the objective specification for product
development.
Right to make changes — NXP Semiconductors reserves the right to
make changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Preliminary
[short] data
sheet
Qualification This document contains data from the
preliminary specification.
Suitability for use in automotive applications — This NXP
Semiconductors product has been qualified for use in automotive
applications. Unless otherwise agreed in writing, the product is not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
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risk.
Product
[short] data
sheet
Production
This document contains the product
specification.
[1] Please consult the most recently issued document before initiating or
completing a design.
[2] The term 'short data sheet' is explained in section "Definitions".
[3] The product status of device(s) described in this document may have
changed since this document was published and may differ in case of
multiple devices. The latest product status information is available on
the Internet at URL http://www.nxp.com.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
12.2 Definitions
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Preview — The document is a preview version only. The document is still
subject to formal approval, which may result in modifications or additions.
NXP Semiconductors does not give any representations or warranties as to
the accuracy or completeness of information included herein and shall have
no liability for the consequences of use of such information.
Customers are responsible for the design and operation of their
applications and products using NXP Semiconductors products, and NXP
Semiconductors accepts no liability for any assistance with applications or
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of use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is
intended for quick reference only and should not be relied upon to contain
detailed and full information. For detailed and full information see the
relevant full data sheet, which is available on request via the local NXP
Semiconductors sales office. In case of any inconsistency or conflict with the
short data sheet, the full data sheet shall prevail.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default
in the customer’s applications or products, or the application or use by
customer’s third party customer(s). Customer is responsible for doing all
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Semiconductors products in order to avoid a default of the applications
and the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product
is deemed to offer functions and qualities beyond those described in the
Product data sheet.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those
given in the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
12.3 Disclaimers
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
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applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
Limited warranty and liability — Information in this document is believed
to be accurate and reliable. However, NXP Semiconductors does not give
any representations or warranties, expressed or implied, as to the accuracy
or completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
1PS79SB10
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© NXP B.V. 2012. All rights reserved
Product data sheet
14 August 2012
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NXP Semiconductors
1PS79SB10
Schottky barrier single diode
No offer to sell or license — Nothing in this document may be interpreted
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grant, conveyance or implication of any license under any copyrights, patents
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Export control — This document as well as the item(s) described herein
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Translations — A non-English (translated) version of a document is for
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12.4 Trademarks
Notice: All referenced brands, product names, service names and
trademarks are the property of their respective owners.
Adelante, Bitport, Bitsound, CoolFlux, CoReUse, DESFire, EZ-HV,
FabKey, GreenChip, HiPerSmart, HITAG, I²C-bus logo, ICODE, I-CODE,
ITEC, Labelution, MIFARE, MIFARE Plus, MIFARE Ultralight, MoReUse,
QLPAK, Silicon Tuner, SiliconMAX, SmartXA, STARplug, TOPFET,
TrenchMOS, TriMedia and UCODE — are trademarks of NXP B.V.
HD Radio and HD Radio logo — are trademarks of iBiquity Digital
Corporation.
1PS79SB10
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© NXP B.V. 2012. All rights reserved
Product data sheet
14 August 2012
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NXP Semiconductors
1PS79SB10
Schottky barrier single diode
13. Contents
1
Product profile ....................................................... 1
General description .............................................. 1
Features and benefits ...........................................1
Applications ..........................................................1
Quick reference data ............................................ 1
1.1
1.2
1.3
1.4
2
3
4
5
6
7
Pinning information ...............................................1
Ordering information .............................................2
Marking ...................................................................2
Limiting values .......................................................2
Thermal characteristics .........................................2
Characteristics .......................................................3
8
Test information .....................................................4
8.1
Quality information .........................................
9
Package outline ..................................................... 4
Soldering ................................................................ 5
Revision history .....................................................5
10
11
12
Legal information ...................................................6
Data sheet status ................................................. 6
Definitions .............................................................6
Disclaimers ...........................................................6
Trademarks .......................................................... 7
12.1
12.2
12.3
12.4
© NXP B.V. 2012. All rights reserved
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 14 August 2012
1PS79SB10
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2012. All rights reserved
Product data sheet
14 August 2012
8 / 8
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