1N4007 [NXP]
Rectifiers(Rugged glass package, using a high temperature alloyed construction); 整流器（坚固的玻璃封装，采用了高温合金结构）
| 型号： | 1N4007 |
| 厂家： | 
NXP |
| 描述： | Rectifiers(Rugged glass package, using a high temperature alloyed construction) |
| 文件： | 总5页 (文件大小：42K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
DISCRETE SEMICONDUCTORS
DATA SHEET
1N4001G to 1N4007G
Rectifiers
1996 May 24
Product specification
Supersedes data of April 1992
Philips Semiconductors
Product specification
Rectifiers
1N4001G to 1N4007G
This package is hermetically sealed
and fatigue free as coefficients of
expansion of all used parts are
matched.
FEATURES
DESCRIPTION
• Glass passivated
Rugged glass package, using a high
temperature alloyed construction.
• High maximum operating
temperature
• Low leakage current
• Excellent stability
k
a
• Available in ammo-pack.
MAM047
Fig.1 Simplified outline (SOD57) and symbol.
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
VRRM
repetitive peak reverse voltage
1N4001G
−
−
−
−
−
−
−
50
100
200
400
600
800
V
V
V
V
V
V
V
1N4002G
1N4003G
1N4004G
1N4005G
1N4006G
1N4007G
1000
VR
continuous reverse voltage
1N4001G
−
−
−
−
−
−
−
−
50
100
V
V
V
V
V
V
V
1N4002G
1N4003G
200
1N4004G
400
1N4005G
600
1N4006G
800
1N4007G
1000
IF(AV)
1.00 A
0.75 A
1.00 A
average forward current
averaged over any 20 ms
period; Tamb = 75 °C; see Fig.2
−
averaged over any 20 ms
period; Tamb = 100 °C; see Fig.2
IF
continuous forward current
repetitive peak forward current
non-repetitive peak forward current
storage temperature
−
−
Tamb = 75 °C; see Fig.2
IFRM
IFSM
Tstg
Tj
10
A
A
half sinewave; 60 Hz
−
30
+175
+175
−65
−65
°C
°C
junction temperature
1996 May 24
2
Philips Semiconductors
Product specification
Rectifiers
1N4001G to 1N4007G
ELECTRICAL CHARACTERISTICS
Tj = 25 °C; unless otherwise specified.
SYMBOL
PARAMETER
forward voltage
CONDITIONS
IF = 1 A; see Fig.3
MAX.
UNIT
VF
1.1
0.8
10
V
V
VF(AV)
IR
full-cycle average forward voltage
reverse current
IF(AV) = 1 A
VR = VRmax
µA
µA
µA
VR = VRmax; Tamb = 100 °C
VR = VRRMmax; Tamb = 75 °C
50
IR(AV)
full-cycle average reverse current
30
THERMAL CHARACTERISTICS
SYMBOL
PARAMETER
CONDITIONS
VALUE
46
UNIT
Rth j-tp
Rth j-a
thermal resistance from junction to tie-point
thermal resistance from junction to ambient
lead length = 10 mm
note 1
K/W
K/W
100
Note
1. Device mounted on epoxy-glass printed-circuit board, 1.5 mm thick; thickness of copper ≥40 µm, see Fig.4.
For more information please refer to the “General Part of associated Handbook”.
1996 May 24
3
Philips Semiconductors
Product specification
Rectifiers
1N4001G to 1N4007G
GRAPHICAL DATA
MBH385
10
handbook, halfpage
MBH386
1.5
handbook, halfpage
I
F
I
F
(A)
(A)
1
1
0.5
(1)
(2)
(3)
1
−1
10
0
0.5
1.5
V
(V)
F
0
0
100
200
T
(°C)
amb
(1) Tamb = 100 °C.
(2) Tamb = 20 °C.
(3) Tamb = −50 °C.
Fig.2 Maximum forward current as a function of
ambient temperature.
Fig.3 Forward current as a function of forward
voltage; typical values.
50
handbook, halfpage
25
7
50
2
3
MGA200
Dimensions in mm.
Fig.4 Device mounted on a printed-circuit board.
1996 May 24
4
Philips Semiconductors
Product specification
Rectifiers
1N4001G to 1N4007G
PACKAGE OUTLINE
k
a
0.81
max
3.81
max
4.57
max
MBC880
28 min
28 min
Dimensions in mm.
Fig.5 SOD57.
DEFINITIONS
Data sheet status
Objective specification
Preliminary specification
Product specification
This data sheet contains target or goal specifications for product development.
This data sheet contains preliminary data; supplementary data may be published later.
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
1996 May 24
5
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