M29W400DB45ZE6E [NUMONYX]
4 Mbit (512 Kb x 8 or 256 Kb x 16, boot block) 3 V supply Flash memory; 4兆位（ 512 KB ×8或256 KB ×16 ，引导块） 3 V电源闪存
| 型号： | M29W400DB45ZE6E |
| 厂家： | 
NUMONYX B.V |
| 描述： | 4 Mbit (512 Kb x 8 or 256 Kb x 16, boot block) 3 V supply Flash memory |
| 文件： | 总48页 (文件大小：1025K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
M29W400DT
M29W400DB
4 Mbit (512 Kb x 8 or 256 Kb x 16, boot block)
3 V supply Flash memory
Features
■ Supply voltage
– V = 2.7 V to 3.6 V for Program, Erase
CC
and Read
(1)
SO44 (M)
■ Access time: 45, 55, 70 ns
■ Programming time
– 10 µs per byte/word typical
■ 11 memory blocks
– 1 boot block (top or bottom location)
– 2 parameter and 8 main blocks
TSOP48 (N)
12 x 20 mm
■ Program/Erase controller
FBGA
– Embedded byte/word program algorithms
■ Erase Suspend and Resume modes
– Read and Program another block during
Erase Suspend
(1)
TFBGA48 (ZA)
6 x 9 mm
■ Unlock bypass program command
– Faster production/batch programming
FBGA
■ Temporary block unprotection mode
■ Low power consumption
– Standby and Automatic Standby
TFBGA48 (ZE)
6 x 8 mm
■ 100,000 Program/Erase cycles per block
■ Electronic signature
– Manufacturer code: 0020h
1. These packages are no more in mass production.
– Top device code M29W400DT: 00EEh
– Bottom device code M29W400DB: 00EFh
®
– ECOPACK packages
December 2007
Rev 6
1/48
www.numonyx.com
1
Contents
M29W400DT, M29W400DB
Contents
1
2
Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Signal descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
2.1
2.2
2.3
2.4
2.5
2.6
2.7
2.8
2.9
Address inputs (A0-A17) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Data inputs/outputs (DQ0-DQ7) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Data inputs/outputs (DQ8-DQ14) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Data input/output or Address input (DQ15A-1) . . . . . . . . . . . . . . . . . . . . 13
Chip Enable (E) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Output Enable (G) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Write Enable (W) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Reset/Block Temporary Unprotect (RP) . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Ready/Busy output (RB) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
2.10 Byte/Word Organization Select (BYTE) . . . . . . . . . . . . . . . . . . . . . . . . . . 14
2.11 VCC supply voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
2.12
VSS ground . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
3
Bus operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
3.1
3.2
3.3
3.4
3.5
3.6
3.7
3.8
Bus Read . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Bus Write . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Output Disable . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Standby . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Automatic Standby . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Special bus operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Electronic signature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Block protection and blocks unprotection . . . . . . . . . . . . . . . . . . . . . . . . . 17
4
Command interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
4.1
4.2
4.3
4.4
4.5
Read/Reset command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Auto Select command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Program command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Unlock Bypass command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Unlock Bypass Program command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
2/48
M29W400DT, M29W400DB
Contents
4.6
4.7
4.8
4.9
Unlock Bypass Reset command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Chip Erase command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Block Erase command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Erase Suspend command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
4.10 Erase Resume command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
4.11 Block Protect and Chip Unprotect commands . . . . . . . . . . . . . . . . . . . . . 22
5
Status Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
5.1
5.2
5.3
5.4
5.5
Data Polling bit (DQ7) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Toggle bit (DQ6) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Error bit (DQ5) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Erase Timer bit (DQ3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Alternative Toggle bit (DQ2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
6
7
8
9
Maximum rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
DC and AC parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Package mechanical . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
Part numbering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
Appendix A Block address table. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
Appendix B Block protection. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
B.1
B.2
Programmer technique . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
In-system technique . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
10
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
3/48
List of tables
M29W400DT, M29W400DB
List of tables
Table 1.
Table 2.
Table 3.
Table 4.
Table 5.
Table 6.
Table 7.
Table 8.
Table 9.
Table 10.
Table 11.
Table 12.
Table 13.
Table 14.
Table 15.
Table 16.
Table 17.
Table 18.
Table 19.
Table 20.
Table 21.
Table 22.
Table 23.
Table 24.
Signal names . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Bus operations, BYTE = V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
IL
Bus operations, BYTE = V
IH. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18
Program, Erase times and Program, Erase endurance cycles. . . . . . . . . . . . . . . . . . . . . . 22
Commands, 16-bit mode, BYTE = V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
IH
Commands, 8-bit mode, BYTE = V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
IL
Status Register bits. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
Operating and AC measurement conditions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Device capacitance. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
DC characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Read AC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
Write AC characteristics, Write Enable controlled . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
Write AC characteristics, Chip Enable controlled . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
Reset/Block Temporary Unprotect AC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
SO44 – 44 lead plastic small outline, 525 mils body width, package mechanical data . . . 35
TSOP48 – 48 lead plastic thin small outline, 12 x 20 mm, package mechanical data . . . . 36
TFBGA48 6 x 9 mm, 6 x 8 active ball array, 0.80 mm pitch, package mechanical data. . . 37
TFBGA48 6 x 8 mm, 6 x 8 active ball array, 0.80 mm pitch, package mechanical data. . . 38
Ordering information scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
Top boot block addresses M29W400DT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
Bottom boot block addresses M29W400DB. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
Programmer technique bus operations, BYTE = V or V
IH
IL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .42
Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
4/48
M29W400DT, M29W400DB
List of figures
List of figures
Figure 1.
Figure 2.
Figure 3.
Figure 4.
Figure 5.
Figure 6.
Figure 7.
Figure 8.
Figure 9.
Logic diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
SO connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
TSOP connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
TFBGA connections (top view through package) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Block addresses (x 8) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Block addresses (x 16) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Data polling flowchart . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Data toggle flowchart . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
AC measurement I/O waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Figure 10. AC measurement load circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Figure 11. Read mode AC waveforms. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Figure 12. Write AC waveforms, Write Enable controlled . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
Figure 13. Write AC waveforms, Chip Enable controlled. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
Figure 14. Reset/Block Temporary Unprotect AC waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
Figure 15. SO44 - 44 lead plastic small outline, 525 mils body width, package outline. . . . . . . . . . . . 35
Figure 16. TSOP48 – 48 lead plastic thin small outline, 12 x 20 mm, package outline . . . . . . . . . . . . 36
Figure 17. TFBGA48 6 x 9 mm, 6 x 8 active ball array, 0.80 mm pitch, bottom view package outline 37
Figure 18. TFBGA48 6 x 8 mm, 6 x 8 active ball array, 0.80 mm pitch, bottom view package outline 38
Figure 19. Programmer equipment block protect flowchart . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
Figure 20. Programmer equipment chip unprotect flowchart . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
Figure 21. In-system equipment block protect flowchart . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
Figure 22. In-system equipment chip unprotect flowchart . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
5/48
Description
M29W400DT, M29W400DB
1
Description
The M29W400D is a 4 Mbit (512 K x 8 or 256 K x 16) non-volatile memory that can be read,
erased and reprogrammed. These operations can be performed using a single low voltage
(2.7 to 3.6 V) supply. On power-up the memory defaults to its Read mode where it can be
read in the same way as a ROM or EPROM.
The memory is divided into blocks that can be erased independently so it is possible to
preserve valid data while old data is erased. Each block can be protected independently to
prevent accidental Program or Erase commands from modifying the memory. Program and
Erase commands are written to the command interface of the memory. An on-chip
Program/Erase controller simplifies the process of programming or erasing the memory by
taking care of all of the special operations that are required to update the memory contents.
The end of a program or erase operation can be detected and any error conditions
identified. The command set required to control the memory is consistent with JEDEC
standards.
The blocks in the memory are asymmetrically arranged, see Figure 5 and Figure 6, Block
addresses. The first or last 64 Kbytes have been divided into four additional blocks. The
16 Kbyte boot block can be used for small initialization code to start the microprocessor, the
two 8 Kbyte parameter blocks can be used for parameter storage and the remaining
32 Kbyte is a small main block where the application may be stored.
Chip Enable, Output Enable and Write Enable signals control the bus operation of the
memory. They allow simple connection to most microprocessors, often without additional
logic.
The memory is offered in SO44, TSOP48 (12 x 20 mm), TFBGA48 0.8 mm pitch (6 x 9 mm
and 6 x 8 mm) packages. The memory is supplied with all the bits erased (set to ’1’).
In order to meet environmental requirements, Numonyx offers the M29W400D in
®
ECOPACK packages. ECOPACK packages are Lead-free. The category of second level
interconnect is marked on the package and on the inner box label, in compliance with
JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also
marked on the inner box label.
6/48
M29W400DT, M29W400DB
Figure 1. Logic diagram
Description
V
CC
18
15
A0-A17
DQ0-DQ14
W
E
DQ15A–1
BYTE
RB
M29W400DT
M29W400DB
G
RP
V
SS
AI06853
Table 1.
Signal names
Signal name
Function
Direction
A0-A17
DQ0-DQ7
DQ8-DQ14
DQ15A–1
E
Address inputs
Inputs
I/O
Data inputs/outputs
Data inputs/outputs
Data input/output or Address input
Chip Enable
I/O
I/O
Input
Input
Input
Input
Output
Output
G
Output Enable
W
Write Enable
RP
Reset/Block Temporary Unprotect
Ready/Busy output
Byte/word organization select
Supply voltage
RB
BYTE
VCC
VSS
Ground
NC
Not connected internally
7/48
Description
M29W400DT, M29W400DB
Figure 2.
SO connections
NC
RB
1
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
RP
2
W
A17
A7
A6
A5
A4
A3
A2
A1
A0
E
3
A8
4
A9
5
A10
A11
A12
A13
A14
A15
A16
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
M29W400DT
M29W400DB
BYTE
V
V
SS
DQ15A–1
SS
G
DQ0
DQ8
DQ7
DQ14
DQ6
DQ1
DQ9
DQ13
DQ5
DQ2
DQ10
DQ3
DQ12
DQ4
DQ11
V
CC
AI06855
1. NC = Not connected.
8/48
M29W400DT, M29W400DB
Description
Figure 3.
TSOP connections
A15
A14
A13
A12
A11
A10
A9
1
48
A16
BYTE
V
SS
DQ15A–1
DQ7
DQ14
DQ6
A8
DQ13
DQ5
NC
NC
W
DQ12
DQ4
RP
NC
NC
RB
NC
A17
A7
12
13
37
36
V
M29W400DT
M29W400DB
CC
DQ11
DQ3
DQ10
DQ2
DQ9
DQ1
DQ8
DQ0
G
A6
A5
A4
A3
V
E
SS
A2
A1
24
25
A0
AI06854
1. NC = Not connected.
9/48
Description
M29W400DT, M29W400DB
Figure 4.
TFBGA connections (top view through package)
1
2
3
4
5
6
A9
A8
A
B
C
D
E
F
A3
A4
A7
RB
NC
W
A13
A12
RP
A17
A2
A1
A6
A5
NC
NC
NC
NC
A10
A11
A14
A15
A0
DQ0
DQ2
DQ5
DQ7
A16
DQ12
DQ14
DQ13
DQ6
E
DQ8
DQ9
DQ1
DQ10
DQ11
DQ3
BYTE
DQ15
A–1
G
H
G
V
CC
V
DQ4
V
SS
SS
AI06856
1. NC = Not connected.
10/48
M29W400DT, M29W400DB
Figure 5. Block addresses (x 8)
Description
M29W400DT
Top boot block addresses (x 8)
M29W400DB
Bottom boot block addresses (x 8)
7FFFFh
7FFFFh
16 Kbyte
8 Kbyte
8 Kbyte
32 Kbyte
64 Kbyte
64 Kbyte
64 Kbyte
7C000h
7BFFFh
70000h
6FFFFh
7A000h
79FFFh
60000h
Total of 7
64 Kbyte blocks
78000h
77FFFh
70000h
6FFFFh
1FFFFh
64 Kbyte
32 Kbyte
8 Kbyte
8 Kbyte
16 Kbyte
60000h
10000h
0FFFFh
08000h
07FFFh
Total of 7
64 Kbyte blocks
06000h
05FFFh
1FFFFh
64 Kbyte
64 Kbyte
10000h
0FFFFh
04000h
03FFFh
00000h
00000h
AI06857b
1. Also see Appendix A: Block address table, Table 21: Top boot block addresses M29W400DT and
Table 22: Bottom boot block addresses M29W400DB for a full listing of the block addresses.
11/48
Description
M29W400DT, M29W400DB
Figure 6.
Block addresses (x 16)
M29W400DT
Top boot block addresses (x 16)
M29W400DB
Bottom boot block addresses (x 16)
3FFFFh
3FFFFh
8 Kword
4 Kword
4 Kword
16 Kword
32 Kword
32 Kword
32 Kword
3E000h
3DFFFh
38000h
37FFFh
3D000h
3CFFFh
30000h
Total of 7
32 Kword blocks
3C000h
3BFFFh
38000h
37FFFh
0FFFFh
32 Kword
16 Kword
4 Kword
4 Kword
8 Kword
30000h
08000h
07FFFh
04000h
03FFFh
Total of 7
32 Kword blocks
03000h
02FFFh
0FFFFh
32 Kword
32 Kword
08000h
07FFFh
02000h
01FFFh
00000h
00000h
AI06858b
1. Also see Appendix A: Block address table, Table 21: Top boot block addresses M29W400DT and
Table 22: Bottom boot block addresses M29W400DB for a full listing of the block addresses.
12/48
M29W400DT, M29W400DB
Signal descriptions
2
Signal descriptions
See Figure 1: Logic diagram, and Table : , for a brief overview of the signals connected to
this device.
2.1
2.2
2.3
Address inputs (A0-A17)
The Address inputs select the cells in the memory array to access during Bus Read
operations. During Bus Write operations they control the commands sent to the command
interface of the Program/Erase controller.
Data inputs/outputs (DQ0-DQ7)
The Data inputs/outputs output the data stored at the selected address during a Bus Read
operation. During Bus Write operations they represent the commands sent to the command
interface of the Program/Erase controller.
Data inputs/outputs (DQ8-DQ14)
The Data inputs/outputs output the data stored at the selected address during a Bus Read
operation when BYTE is High, V . When BYTE is Low, V , these pins are not used and are
IH
IL
high impedance. During Bus Write operations the Command Register does not use these
bits. When reading the Status Register these bits should be ignored.
2.4
Data input/output or Address input (DQ15A-1)
When BYTE is High, V , this pin behaves as a Data input/output pin (as DQ8-DQ14). When
IH
BYTE is Low, V , this pin behaves as an address pin; DQ15A–1 Low will select the LSB of
IL
the word on the other addresses, DQ15A–1 High will select the MSB. Throughout the text
consider references to the Data input/output to include this pin when BYTE is High and
references to the Address inputs to include this pin when BYTE is Low except when stated
explicitly otherwise.
2.5
2.6
Chip Enable (E)
The Chip Enable, E, activates the memory, allowing Bus Read and Bus Write operations to
be performed. When Chip Enable is High, V , all other pins are ignored.
IH
Output Enable (G)
The Output Enable, G, controls the Bus Read operation of the memory.
13/48
Signal descriptions
M29W400DT, M29W400DB
2.7
2.8
Write Enable (W)
The Write Enable, W, controls the Bus Write operation of the memory’s command interface.
Reset/Block Temporary Unprotect (RP)
The Reset/Block Temporary Unprotect pin can be used to apply a hardware reset to the
memory or to temporarily unprotect all blocks that have been protected.
A hardware reset is achieved by holding Reset/Block Temporary Unprotect Low, V , for at
IL
least t
. After Reset/Block Temporary Unprotect goes High, V , the memory will be
PLPX
IH
ready for Bus Read and Bus Write operations after t
or t
, whichever occurs last.
RHEL
PHEL
See the Ready/Busy output section, Table 15: Reset/Block Temporary Unprotect AC
characteristics and Figure 14: Reset/Block Temporary Unprotect AC waveforms, for more
details.
Holding RP at V will temporarily unprotect the protected blocks in the memory. Program
ID
and Erase operations on all blocks will be possible. The transition from V to V must be
IH
ID
slower than t
.
PHPHH
2.9
Ready/Busy output (RB)
The Ready/Busy pin is an open-drain output that can be used to identify when the memory
array can be read. Ready/Busy is high-impedance during Read mode, Auto Select mode
and Erase Suspend mode.
After a Hardware Reset, Bus Read and Bus Write operations cannot begin until Ready/Busy
becomes high-impedance. See Table 15: Reset/Block Temporary Unprotect AC
characteristics and Figure 14: Reset/Block Temporary Unprotect AC waveforms.
During Program or Erase operations Ready/Busy is Low, V . Ready/Busy will remain Low
OL
during Read/Reset commands or hardware resets until the memory is ready to enter Read
mode.
2.10
Byte/Word Organization Select (BYTE)
The Byte/Word Organization Select pin is used to switch between the 8-bit and 16-bit Bus
modes of the memory. When Byte/Word Organization Select is Low, V , the memory is in 8-
IL
bit mode, when it is High, V , the memory is in 16-bit mode.
IH
14/48
M29W400DT, M29W400DB
Signal descriptions
2.11
VCC supply voltage
The V supply voltage supplies the power for all operations (Read, Program, Erase etc.).
CC
The command interface is disabled when the V supply voltage is less than the lockout
CC
voltage, V
. This prevents Bus Write operations from accidentally damaging the data
LKO
during power-up, power-down and power surges. If the Program/Erase controller is
programming or erasing during this time then the operation aborts and the memory contents
being altered will be invalid.
A 0.1 µF capacitor should be connected between the V supply voltage pin and the V
CC
SS
ground pin to decouple the current surges from the power supply. The PCB track widths
must be sufficient to carry the currents required during program and erase operations, I
.
CC3
2.12
VSS ground
The V ground is the reference for all voltage measurements.
SS
15/48
Bus operations
M29W400DT, M29W400DB
3
Bus operations
There are five standard bus operations that control the device. These are Bus Read, Bus
Write, Output Disable, Standby and Automatic Standby. See Table 2 and Table 3, Bus
operations, for a summary. Typically glitches of less than 5 ns on Chip Enable or Write
Enable are ignored by the memory and do not affect bus operations.
3.1
Bus Read
Bus Read operations read from the memory cells, or specific registers in the command
interface. A valid Bus Read operation involves setting the desired address on the Address
inputs, applying a Low signal, V , to Chip Enable and Output Enable and keeping Write
IL
Enable High, V . The Data inputs/outputs will output the value, see Figure 11: Read mode
IH
AC waveforms, and Table 12: Read AC characteristics, for details of when the output
becomes valid.
3.2
Bus Write
Bus Write operations write to the command interface. A valid Bus Write operation begins by
setting the desired address on the Address inputs. The Address inputs are latched by the
command interface on the falling edge of Chip Enable or Write Enable, whichever occurs
last. The Data inputs/outputs are latched by the command interface on the rising edge of
Chip Enable or Write Enable, whichever occurs first. Output Enable must remain High, V ,
IH
during the whole Bus Write operation. See Figure 12 and Figure 13, Write AC waveforms,
and Table 13 and Table 14, Write AC characteristics, for details of the timing requirements.
3.3
3.4
Output Disable
The Data inputs/outputs are in the high impedance state when Output Enable is High, V .
IH
Standby
When Chip Enable is High, V , the memory enters Standby mode and the Data
IH
inputs/outputs pins are placed in the high-impedance state. To reduce the Supply current to
the Standby Supply current, I
, Chip Enable should be held within V
0.2 V. For the
CC2
CC
Standby current level see Table 11: DC characteristics.
During program or erase operations the memory will continue to use the Program/Erase
Supply current, I , for Program or Erase operations until the operation completes.
CC3
3.5
Automatic Standby
If CMOS levels (V
0.2 V) are used to drive the bus and the bus is inactive for 150 ns or
CC
more the memory enters Automatic Standby where the internal Supply current is reduced to
the Standby Supply current, I
operation is in progress.
. The Data inputs/outputs will still output data if a Bus Read
CC2
16/48
M29W400DT, M29W400DB
Bus operations
3.6
Special bus operations
Additional bus operations can be performed to read the electronic signature and also to
apply and remove block protection. These bus operations are intended for use by
programming equipment and are not usually used in applications. They require V to be
ID
applied to some pins.
3.7
3.8
Electronic signature
The memory has two codes, the manufacturer code and the device code, that can be read
to identify the memory. These codes can be read by applying the signals listed in Table 2
and Table 3, Bus operations.
Block protection and blocks unprotection
Each block can be separately protected against accidental Program or Erase. Protected
blocks can be unprotected to allow data to be changed.
There are two methods available for protecting and unprotecting the blocks, one for use on
programming equipment and the other for in-system use. Block Protect and Chip Unprotect
operations are described in Appendix B: Block protection.
(1)
Table 2.
Bus operations, BYTE = V
IL
Data inputs/outputs
Address inputs
DQ15A–1, A0-A17
Operation
E
G
W
DQ14-DQ8
DQ7-DQ0
Bus Read
Bus Write
Output Disable
Standby
VIL
VIL
X
VIL
VIH
VIH
X
VIH Cell address
Hi-Z
Hi-Z
Hi-Z
Hi-Z
Data output
Data input
Hi-Z
VIL
VIH
X
Command address
X
VIH
X
Hi-Z
A0 = VIL, A1 = VIL,
VIH A9 = VID,
others VIL or VIH
Read
manufacturer code
VIL
VIL
Hi-Z
20h
EEh
(M29W400DT)
A0 = VIH, A1 = VIL,
VIH A9 = VID,
others VIL or VIH
Read device code
VIL
VIL
Hi-Z
EFh
(M29W400DB)
1. X = VIL or VIH
.
17/48
Bus operations
M29W400DT, M29W400DB
Table 3.
Bus operations, BYTE = V
IH
Address inputs
A0-A17
Data inputs/outputs
DQ15A–1, DQ14-DQ0
Operation
E
G
W
Bus Read
Bus Write
Output Disable
Standby
VIL
VIL
X
VIL
VIH
VIH
X
VIH Cell address
Data output
Data input
Hi-Z
VIL
VIH
X
Command address
X
VIH
X
Hi-Z
A0 = VIL, A1 = VIL,
VIH A9 = VID,
others VIL or VIH
Read manufacturer
code
VIL
VIL
VIL
VIL
0020h
A0 = VIH, A1 = VIL,
VIH A9 = VID,
others VIL or VIH
00EEh (M29W400DT)
00EFh (M29W400DB)
Read device code
1. X = VIL or VIH
.
18/48
M29W400DT, M29W400DB
Command interface
4
Command interface
All Bus Write operations to the memory are interpreted by the command interface.
Commands consist of one or more sequential Bus Write operations. Failure to observe a
valid sequence of Bus Write operations will result in the memory returning to Read mode.
The long command sequences are imposed to maximize data security.
The address used for the commands changes depending on whether the memory is in 16-
bit or 8-bit mode. See either Table 5, or Table 6, depending on the configuration that is being
used, for a summary of the commands.
4.1
4.2
Read/Reset command
The Read/Reset command returns the memory to its Read mode where it behaves like a
ROM or EPROM, unless otherwise stated. It also resets the errors in the Status Register.
Either one or three Bus Write operations can be used to issue the Read/Reset command.
The Read/Reset command can be issued, between Bus Write cycles before the start of a
program or erase operation, to return the device to Read mode. Once the program or erase
operation has started the Read/Reset command is no longer accepted. The Read/Reset
command will not abort an Erase operation when issued while in Erase Suspend.
Auto Select command
The Auto Select command is used to read the manufacturer code, the device code and the
Block Protection status. Three consecutive Bus Write operations are required to issue the
Auto Select command. Once the Auto Select command is issued the memory remains in
Auto Select mode until another command is issued.
From the Auto Select mode the manufacturer code can be read using a Bus Read operation
with A0 = V and A1 = V . The other address bits may be set to either V or V . The
IL
IL
IL
IH
manufacturer code for Numonyx is 0020h.
The device code can be read using a Bus Read operation with A0 = V and A1 = V . The
IH
IL
other address bits may be set to either V or V . The device code for the M29W400DT is
IL
IH
00EEh and for the M29W400DB is 00EFh.
The Block Protection status of each block can be read using a Bus Read operation with
A0 = V , A1 = V , and A12-A17 specifying the address of the block. The other address bits
IL
IH
may be set to either V or V . If the addressed block is protected then 01h is output on
IL
IH
Data inputs/outputs DQ0-DQ7, otherwise 00h is output.
4.3
Program command
The Program command can be used to program a value to one address in the memory array
at a time. The command requires four Bus Write operations, the final write operation latches
the address and data and starts the Program/Erase controller.
If the address falls in a protected block then the Program command is ignored, the data
remains unchanged. The Status Register is never read and no error condition is given.
19/48
Command interface
M29W400DT, M29W400DB
During the program operation the memory will ignore all commands. It is not possible to
issue any command to abort or pause the operation. Typical program times are given in
Table 4: Program, Erase times and Program, Erase endurance cycles. Bus Read operations
during the program operation will output the Status Register on the Data inputs/outputs. See
the section on the Status Register for more details.
After the program operation has completed the memory will return to the Read mode, unless
an error has occurred. When an error occurs the memory will continue to output the Status
Register. A Read/Reset command must be issued to reset the error condition and return to
Read mode.
Note that the Program command cannot change a bit set at ’0’ back to ’1’. One of the Erase
commands must be used to set all the bits in a block or in the whole memory from ’0’ to ’1’.
4.4
4.5
Unlock Bypass command
The Unlock Bypass command is used in conjunction with the Unlock Bypass Program
command to program the memory. When the access time to the device is long (as with
some EPROM programmers) considerable time saving can be made by using these
commands. Three Bus Write operations are required to issue the Unlock Bypass command.
Once the Unlock Bypass command has been issued the memory will only accept the Unlock
Bypass Program command and the Unlock Bypass Reset command. The memory can be
read as if in Read mode.
Unlock Bypass Program command
The Unlock Bypass Program command can be used to program one address in memory at
a time. The command requires two Bus Write operations, the final write operation latches
the address and data and starts the Program/Erase controller.
The Program operation using the Unlock Bypass Program command behaves identically to
the Program operation using the Program command. A protected block cannot be
programmed; the operation cannot be aborted and the Status Register is read. Errors must
be reset using the Read/Reset command, which leaves the device in Unlock Bypass mode.
See the Program command for details on the behavior.
4.6
4.7
Unlock Bypass Reset command
The Unlock Bypass Reset command can be used to return to Read/Reset mode from
Unlock Bypass mode. Two Bus Write operations are required to issue the Unlock Bypass
Reset command. Read/Reset command does not exit from Unlock Bypass mode.
Chip Erase command
The Chip Erase command can be used to erase the entire chip. Six Bus Write operations
are required to issue the Chip Erase command and start the Program/Erase controller.
If any blocks are protected then these are ignored and all the other blocks are erased. If all
of the blocks are protected the Chip Erase operation appears to start but will terminate
20/48
M29W400DT, M29W400DB
Command interface
within about 100 µs, leaving the data unchanged. No error condition is given when protected
blocks are ignored.
During the erase operation the memory will ignore all commands. It is not possible to issue
any command to abort the operation. Typical chip erase times are given in Table 4. All Bus
Read operations during the Chip Erase operation will output the Status Register on the Data
inputs/outputs. See the section on the Status Register for more details.
After the Chip Erase operation has completed the memory will return to the Read mode,
unless an error has occurred. When an error occurs the memory will continue to output the
Status Register. A Read/Reset command must be issued to reset the error condition and
return to Read mode.
The Chip Erase command sets all of the bits in unprotected blocks of the memory to ’1’. All
previous data is lost.
4.8
Block Erase command
The Block Erase command can be used to erase a list of one or more blocks. Six Bus Write
operations are required to select the first block in the list. Each additional block in the list can
be selected by repeating the sixth Bus Write operation using the address of the additional
block. The Block Erase operation starts the Program/Erase controller about 50 µs after the
last Bus Write operation. Once the Program/Erase controller starts it is not possible to select
any more blocks. Each additional block must therefore be selected within 50 µs of the last
block. The 50 µs timer restarts when an additional block is selected. The Status Register
can be read after the sixth Bus Write operation. See the Status Register for details on how
to identify if the Program/Erase controller has started the Block Erase operation.
If any selected blocks are protected then these are ignored and all the other selected blocks
are erased. If all of the selected blocks are protected the Block Erase operation appears to
start but will terminate within about 100 µs, leaving the data unchanged. No error condition
is given when protected blocks are ignored.
During the Block Erase operation the memory will ignore all commands except the Erase
Suspend command. Typical block erase times are given in Table 4. All Bus Read operations
during the Block Erase operation will output the Status Register on the Data inputs/outputs.
See the section on the Status Register for more details.
After the Block Erase operation has completed the memory will return to the Read mode,
unless an error has occurred. When an error occurs the memory will continue to output the
Status Register. A Read/Reset command must be issued to reset the error condition and
return to Read mode.
The Block Erase command sets all of the bits in the unprotected selected blocks to ’1’. All
previous data in the selected blocks is lost.
4.9
Erase Suspend command
The Erase Suspend command may be used to temporarily suspend a Block Erase operation
and return the memory to Read mode. The command requires one Bus Write operation.
The Program/Erase controller will suspend within the Erase Suspend Latency time after the
Erase Suspend command is issued (see Table 4 for numerical values). Once the
Program/Erase controller has stopped the memory will be set to Read mode and the Erase
21/48
Command interface
M29W400DT, M29W400DB
will be suspended. If the Erase Suspend command is issued during the period when the
memory is waiting for an additional block (before the Program/Erase controller starts) then
the Erase is suspended immediately and will start immediately when the Erase Resume
command is issued. It is not possible to select any further blocks to erase after the Erase
Resume.
During Erase Suspend it is possible to Read and Program cells in blocks that are not being
erased; both Read and Program operations behave as normal on these blocks. If any
attempt is made to program in a protected block or in the suspended block then the Program
command is ignored and the data remains unchanged. The Status Register is not read and
no error condition is given. Reading from blocks that are being erased will output the Status
Register.
It is also possible to issue the Auto Select and Unlock Bypass commands during an Erase
Suspend. The Read/Reset command must be issued to return the device to Read Array
mode before the Resume command will be accepted.
4.10
4.11
Erase Resume command
The Erase Resume command must be used to restart the Program/Erase controller from
Erase Suspend. An erase can be suspended and resumed more than once.
Block Protect and Chip Unprotect commands
Each block can be separately protected against accidental program or erase. The whole
chip can be unprotected to allow the data inside the blocks to be changed.
Block Protect and Chip Unprotect operations are described in Appendix B: Block protection.
Table 4.
Program, Erase times and Program, Erase endurance cycles
Parameter
Min
Typ(1)(2)
Max(2)
Unit
Chip Erase (all bits in the memory set to ‘0’)
Chip Erase
2.5
6
s
35(3)
6(4)
s
s
Block Erase (64 Kbytes)
Program (byte or word)
0.8
10
5.5
2.8
18
200(3)
30(3)
15(3)
25(4)
µs
Chip Program (byte by byte)
Chip Program (word by word)
Erase Suspend latency time
Program/Erase cycles (per block)
Data retention
s
s
µs
100,000
20
cycles
years
1. Typical values measured at room temperature and nominal voltages.
2. Sampled, but not 100% tested.
3. Maximum value measured at worst case conditions for both temperature and VCC after 100,000
Program/Erase cycles.
4. Maximum value measured at worst case conditions for both temperature and VCC
.
22/48
M29W400DT, M29W400DB
Command interface
(1)
Table 5.
Commands, 16-bit mode, BYTE = V
IH
Bus Write operations
3rd 4th
Addr Data Addr Data Addr Data Addr Data Addr Data Addr Data
Command
1st
2nd
5th
6th
1
3
3
4
3
X
F0
AA
AA
AA
AA
Read/Reset
555
555
555
555
2AA
2AA
2AA
2AA
55
55
55
55
X
F0
90
A0
20
Auto Select
Program
555
555
555
PA
PD
Unlock Bypass
Unlock Bypass
Program
2
2
X
X
A0
90
PA
X
PD
00
Unlock Bypass
Reset
Chip Erase
6
6+
1
555
555
X
AA
AA
B0
30
2AA
2AA
55
55
555
555
80
80
555
555
AA
AA
2AA
2AA
55
55
555
BA
10
30
Block Erase
Erase Suspend
Erase Resume
1
X
1. X Don’t care, PA Program Address, PD Program Data, BA Any address in the block. All values in the table are in
hexadecimal. The command interface only uses A-1; A0-A10 and DQ0-DQ7 to verify the commands; A11-A17, DQ8-DQ14
and DQ15 are Don't care. DQ15A-1 is A-1 when BYTE is VIL or DQ15 when BYTE is VIH
.
(1)
Table 6.
Commands, 8-bit mode, BYTE = V
IL
Bus Write operations
Command
1st
2nd
3rd
4th
5th
6th
Addr Data Addr Data Addr Data Addr Data Addr Data Addr Data
1
3
3
4
3
X
F0
AA
AA
AA
AA
Read/Reset
AAA
AAA
AAA
AAA
555
555
555
555
55
55
55
55
X
F0
90
A0
20
Auto Select
Program
AAA
AAA
AAA
PA
PD
Unlock Bypass
Unlock Bypass
Program
2
X
A0
PA
PD
Unlock Bypass Reset
Chip Erase
2
6
X
90
AA
AA
B0
30
X
00
55
55
AAA
555
555
AAA
AAA
80
80
AAA
AAA
AA
AA
555
555
55
55
AAA
BA
10
30
Block Erase
6+ AAA
Erase Suspend
Erase Resume
1
1
X
X
1. X Don’t care, PA Program Address, PD Program Data, BA Any address in the block. All values in the table are in
hexadecimal. The command interface only uses A-1; A0-A10 and DQ0-DQ7 to verify the commands; A11-A17, DQ8-DQ14
and DQ15 are Don't care. DQ15A-1 is A-1 when BYTE is VIL or DQ15 when BYTE is VIH
.
23/48
Status Register
M29W400DT, M29W400DB
5
Status Register
Bus Read operations from any address always read the Status Register during Program and
Erase operations. It is also read during Erase Suspend when an address within a block
being erased is accessed.
The bits in the Status Register are summarized in Table 7: Status Register bits.
5.1
Data Polling bit (DQ7)
The Data Polling bit can be used to identify whether the Program/Erase controller has
successfully completed its operation or if it has responded to an Erase Suspend. The Data
Polling bit is output on DQ7 when the Status Register is read.
During Program operations the Data Polling bit outputs the complement of the bit being
programmed to DQ7. After successful completion of the Program operation the memory
returns to Read mode and Bus Read operations from the address just programmed output
DQ7, not its complement.
During Erase operations the Data Polling bit outputs ’0’, the complement of the erased state
of DQ7. After successful completion of the Erase operation the memory returns to Read
mode.
In Erase Suspend mode the Data Polling bit will output a ’1’ during a Bus Read operation
within a block being erased. The Data Polling bit will change from a ’0’ to a ’1’ when the
Program/Erase controller has suspended the Erase operation.
Figure 7: Data polling flowchart, gives an example of how to use the Data Polling bit. A valid
address is the address being programmed or an address within the block being erased.
5.2
Toggle bit (DQ6)
The Toggle bit can be used to identify whether the Program/Erase controller has
successfully completed its operation or if it has responded to an Erase Suspend. The Toggle
bit is output on DQ6 when the Status Register is read.
During Program and Erase operations the Toggle bit changes from ’0’ to ’1’ to ’0’, etc., with
successive Bus Read operations at any address. After successful completion of the
operation the memory returns to Read mode.
During Erase Suspend mode the Toggle bit will output when addressing a cell within a block
being erased. The Toggle bit will stop toggling when the Program/Erase controller has
suspended the Erase operation.
If any attempt is made to erase a protected block, the operation is aborted, no error is
signalled and DQ6 toggles for approximately 100 µs. If any attempt is made to program a
protected block or a suspended block, the operation is aborted, no error is signalled and
DQ6 toggles for approximately 1 µs.
Figure 8: Data toggle flowchart, gives an example of how to use the Data Toggle bit.
24/48
M29W400DT, M29W400DB
Status Register
5.3
Error bit (DQ5)
The Error bit can be used to identify errors detected by the Program/Erase controller. The
Error bit is set to ’1’ when a Program, Block Erase or Chip Erase operation fails to write the
correct data to the memory. If the Error bit is set a Read/Reset command must be issued
before other commands are issued. The Error bit is output on DQ5 when the Status Register
is read.
Note that the Program command cannot change a bit set to ’0’ back to ’1’ and attempting to
do so will set DQ5 to ‘1’. A Bus Read operation to that address will show the bit is still ‘0’.
One of the Erase commands must be used to set all the bits in a block or in the whole
memory from ’0’ to ’1’
5.4
5.5
Erase Timer bit (DQ3)
The Erase Timer bit can be used to identify the start of Program/Erase controller operation
during a Block Erase command. Once the Program/Erase controller starts erasing, the
Erase Timer bit is set to ’1’. Before the Program/Erase controller starts the Erase Timer bit is
set to ‘0’ and additional blocks to be erased may be written to the command interface. The
Erase Timer bit is output on DQ3 when the Status Register is read.
Alternative Toggle bit (DQ2)
The Alternative Toggle bit can be used to monitor the Program/Erase controller during Erase
operations. The Alternative Toggle bit is output on DQ2 when the Status Register is read.
During Chip Erase and Block Erase operations the Toggle bit changes from ’0’ to ’1’ to ’0’,
etc., with successive Bus Read operations from addresses within the blocks being erased. A
protected block is treated the same as a block not being erased. Once the operation
completes the memory returns to Read mode.
During Erase Suspend the Alternative Toggle bit changes from ’0’ to ’1’ to ’0’, etc. with
successive Bus Read operations from addresses within the blocks being erased. Bus Read
operations to addresses within blocks not being erased will output the memory cell data as if
in Read mode.
After an Erase operation that causes the Error bit to be set the Alternative Toggle bit can be
used to identify which block or blocks have caused the error. The Alternative Toggle bit
changes from ’0’ to ’1’ to ’0’, etc. with successive Bus Read operations from addresses
within blocks that have not erased correctly. The Alternative Toggle bit does not change if
the addressed block has erased correctly.
(1)
Table 7.
Status Register bits
Operation
Address
DQ7
DQ6
DQ5
DQ3
DQ2
RB
Program
Any address
DQ7
Toggle
0
–
–
0
Program during
Erase Suspend
Any address
DQ7
Toggle
0
–
–
0
Program Error
Chip Erase
Any address
Any address
DQ7
0
Toggle
Toggle
1
0
–
1
–
0
0
Toggle
25/48
Status Register
M29W400DT, M29W400DB
(1)
Table 7.
Status Register bits (continued)
Operation
Address
DQ7
DQ6
DQ5
DQ3
DQ2
RB
Erasing block
0
Toggle
0
0
Toggle
0
Block Erase
before timeout
Non-erasing
block
No
Toggle
0
0
0
Toggle
Toggle
Toggle
0
0
0
0
1
1
0
0
0
Erasing block
Toggle
Block Erase
Non-erasing
block
No
Toggle
No
Toggle
Erasing block
1
0
–
Toggle
1
1
0
0
Erase Suspend
Non-erasing
block
Data read as normal
Good block
address
No
Toggle
0
0
Toggle
Toggle
1
1
1
1
Erase Error
Faulty block
address
Toggle
1. Unspecified data bits should be ignored.
Figure 7.
Data polling flowchart
START
READ DQ5 & DQ7
at VALID ADDRESS
DQ7
=
YES
DATA
NO
NO
DQ5
= 1
YES
READ DQ7
at VALID ADDRESS
DQ7
=
YES
DATA
NO
FAIL
PASS
AI03598
26/48
M29W400DT, M29W400DB
Figure 8. Data toggle flowchart
Status Register
START
READ DQ6
READ
DQ5 & DQ6
DQ6
=
NO
TOGGLE
YES
NO
DQ5
= 1
YES
READ DQ6
TWICE
DQ6
=
NO
TOGGLE
YES
FAIL
PASS
AI01370C
27/48
Maximum rating
M29W400DT, M29W400DB
6
Maximum rating
Stressing the device above the rating listed in Table 8: Absolute maximum ratings may
cause permanent damage to the device. Exposure to absolute maximum rating conditions
for extended periods may affect device reliability. These are stress ratings only and
operation of the device at these or any other conditions above those indicated in the
operating sections of this specification is not implied. Refer also to the Numonyx SURE
Program and other relevant quality documents.
Table 8.
Symbol
Absolute maximum ratings
Parameter
Min
Max
Unit
TBIAS
TSTG
TLEAD
VIO
Temperature under bias
Storage temperature
–50
–65
125
°C
°C
°C
V
150
(1)
Lead temperature during soldering
Input or output voltage(2)(3)
Supply voltage
–0.6
–0.6
–0.6
VCC+0.6
4
VCC
V
VID
Identification voltage
13.5
V
1. Compliant with the JEDEC Std J-STD-020B (for small body, Sn-Pb or Pb assermbly), the Numonyx
ECOPACK® 7191395 specification, and the European directive on Restrictions on Hazardous Substances
(RoHS) 2002/95/EU.
2. Minimum voltage may undershoot to –2 V during transition and for less than 20 ns during transitions.
3. Maximum voltage may overshoot to VCC+2 V during transition and for less than 20 ns during transitions.
28/48
M29W400DT, M29W400DB
DC and AC parameters
7
DC and AC parameters
This section summarizes the operating measurement conditions, and the DC and AC
characteristics of the device. The parameters in the DC and AC characteristics tables that
follow, are derived from tests performed under the measurement conditions summarized in
Table 9: Operating and AC measurement conditions. Designers should check that the
operating conditions in their circuit match the operating conditions when relying on the
quoted parameters.
Table 9.
Operating and AC measurement conditions
M29W400D
Parameter
45
55
70
Unit
Min
Max
Min
Max
Min
Max
V
CC supply voltage
3.0
–40
0
3.6
85
70
2.7
–40
0
3.6
85
70
2.7
–40
0
3.6
85
70
V
Ambient operating temperature (range 6)
Ambient operating temperature (range 1)
Load capacitance (CL)
°C
30
30
100
pF
ns
V
Input rise and fall times
10
10
10
Input pulse voltages
0 to VCC
VCC/2
0 to VCC
VCC/2
0 to VCC
VCC/2
Input and output timing ref. voltages
V
Figure 9.
AC measurement I/O waveform
V
CC
V
/2
CC
0 V
AI04498
Figure 10. AC measurement load circuit
V
V
CC
CC
25 kΩ
DEVICE
UNDER
TEST
25 kΩ
0.1 µF
C
L
AI04499
C
includes JIG capacitance
L
29/48
DC and AC parameters
M29W400DT, M29W400DB
(1)
Table 10. Device capacitance
Symbol
Parameter
Test Condition
Min
Max
Unit
CIN
Input capacitance
Output capacitance
VIN = 0 V
6
pF
pF
COUT
VOUT = 0 V
12
1. Sampled only, not 100% tested.
Table 11. DC characteristics
Symbol
Parameter
Test condition
Min
Max
Unit
ILI
Input Leakage current
Output Leakage current
0 V ≤VIN ≤VCC
1
1
µA
µA
ILO
0 V ≤VOUT ≤VCC
E = VIL, G = VIH,
f = 6 MHz
ICC1
Supply current (Read)
10
mA
µA
E = VCC 0.2 V,
RP = VCC 0.2 V
ICC2
Supply current (Standby)
100
Supply current
(Program/Erase)
Program/Erase
controller active
(1)
ICC3
20
mA
VIL
VIH
VOL
VOH
VID
IID
Input Low voltage
Input High voltage
Output Low voltage
Output High voltage
Identification voltage
Identification current
–0.5
0.8
V
V
0.7VCC
VCC + 0.3
0.45
IOL = 1.8 mA
V
IOH = –100 µA
VCC – 0.4
11.5
V
12.5
100
V
A9 = VID
µA
Program/Erase Lockout supply
voltage
VLKO
1.8
2.3
V
1. Sampled only, not 100% tested.
Figure 11. Read mode AC waveforms
tAVAV
VALID
A0-A17/
A–1
tAVQV
tAXQX
E
tELQV
tEHQX
tELQX
tEHQZ
G
tGLQX
tGLQV
tGHQX
tGHQZ
DQ0-DQ7/
DQ8-DQ15
VALID
tBHQV
BYTE
tELBL/tELBH
tBLQZ
AI02907
30/48
M29W400DT, M29W400DB
DC and AC parameters
Table 12. Read AC characteristics
M29W400D
Unit
Symbol
Alt
Parameter
Test condition
45
55
70
E = VIL,
G = VIL
tAVAV
tAVQV
tRC
Address Valid to Next Address Valid
Address Valid to Output Valid
Min
45
55
70
ns
ns
E = VIL,
G = VIL
tACC
Max
45
55
70
(1)
tELQX
tLZ
Chip Enable Low to Output Transition
Chip Enable Low to Output Valid
G = VIL
G = VIL
Min
0
0
0
ns
ns
tELQV
tCE
Max
45
55
70
Output Enable Low to Output
Transition
(1)
tGLQX
tOLZ
E = VIL
Min
0
0
0
ns
tGLQV
tOE
tHZ
tDF
Output Enable Low to Output Valid
Chip Enable High to Output Hi-Z
Output Enable High to Output Hi-Z
E = VIL
G = VIL
E = VIL
Max
Max
Max
25
20
20
30
25
25
35
30
30
ns
ns
ns
(1)
tEHQZ
(1)
tGHQZ
tEHQX
tGHQX
Chip Enable, Output Enable or
Address Transition to Output Transition
tOH
Min
0
5
0
5
0
5
ns
ns
tAXQX
tELBL
tELBH
tBLQZ
tBHQV
tELFL
tELFH
Chip Enable to BYTE Low or High
BYTE Low to Output Hi-Z
Max
tFLQZ
Max
Max
25
30
25
30
30
40
ns
ns
tFHQV BYTE High to Output Valid
1. Sampled only, not 100% tested.
31/48
DC and AC parameters
M29W400DT, M29W400DB
Figure 12. Write AC waveforms, Write Enable controlled
tAVAV
A0-A17/
VALID
A–1
tWLAX
tAVWL
tWHEH
E
tELWL
tWHGL
G
tGHWL
tWLWH
W
tWHWL
tWHDX
tDVWH
VALID
DQ0-DQ7/
DQ8-DQ15
V
CC
tVCHEL
RB
tWHRL
AI01869C
Table 13. Write AC characteristics, Write Enable controlled
M29W400D
Symbol
Alt
Parameter
Unit
45
55
70
tAVAV
tELWL
tWLWH
tDVWH
tWHDX
tWHEH
tWHWL
tAVWL
tWLAX
tGHWL
tWHGL
tWC
tCS
tWP
tDS
Address Valid to Next Address Valid
Chip Enable Low to Write Enable Low
Write Enable Low to Write Enable High
Input Valid to Write Enable High
Min
Min
Min
Min
Min
Min
Min
Min
Min
Min
Min
Max
Min
45
0
55
0
70
0
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
µs
30
25
0
30
30
0
30
45
0
tDH
tCH
tWPH
tAS
Write Enable High to Input Transition
Write Enable High to Chip Enable High
Write Enable High to Write Enable Low
Address Valid to Write Enable Low
Write Enable Low to Address Transition
Output Enable High to Write Enable Low
Write Enable High to Output Enable Low
Program/Erase Valid to RB Low
0
0
0
30
0
30
0
30
0
tAH
40
0
45
0
45
0
tOEH
tBUSY
tVCS
0
0
0
(1)
tWHRL
30
50
30
50
35
50
tVCHEL
VCC High to Chip Enable Low
1. Sampled only, not 100% tested.
32/48
M29W400DT, M29W400DB
DC and AC parameters
Figure 13. Write AC waveforms, Chip Enable controlled
tAVAV
A0-A17/
VALID
A–1
tELAX
tAVEL
tEHWH
W
tWLEL
tEHGL
G
tGHEL
tELEH
E
tEHEL
tEHDX
tDVEH
VALID
DQ0-DQ7/
DQ8-DQ15
V
CC
tVCHWL
RB
tEHRL
AI01870C
Table 14. Write AC characteristics, Chip Enable controlled
M29W400D
Symbol
Alt
Parameter
Unit
45
55
70
tAVAV
tWLEL
tELEH
tDVEH
tEHDX
tEHWH
tEHEL
tAVEL
tELAX
tGHEL
tEHGL
tWC
tWS
tCP
Address Valid to Next Address Valid
Write Enable Low to Chip Enable Low
Chip Enable Low to Chip Enable High
Input Valid to Chip Enable High
Min
Min
Min
Min
Min
Min
Min
Min
Min
Min
Min
Max
Min
45
0
55
0
70
0
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
µs
30
25
0
30
30
0
30
45
0
tDS
tDH
tWH
tCPH
tAS
Chip Enable High to Input Transition
Chip Enable High to Write Enable High
Chip Enable High to Chip Enable Low
Address Valid to Chip Enable Low
Chip Enable Low to Address Transition
Output Enable High Chip Enable Low
Chip Enable High to Output Enable Low
Program/Erase Valid to RB Low
0
0
0
30
0
30
0
30
0
tAH
40
0
45
0
45
0
tOEH
tBUSY
tVCS
0
0
0
(1)
tEHRL
30
50
30
50
35
50
tVCHWL
VCC High to Write Enable Low
1. Sampled only, not 100% tested.
33/48
DC and AC parameters
M29W400DT, M29W400DB
Figure 14. Reset/Block Temporary Unprotect AC waveforms
W, E, G
tPHWL, tPHEL, tPHGL
RB
tRHWL, tRHEL, tRHGL
tPLPX
RP
tPHPHH
tPLYH
AI02931
Table 15. Reset/Block Temporary Unprotect AC characteristics
M29W400D
55
Symbol
Alt
Parameter
Unit
45
70
(1)
tPHWL
RP High to Write Enable Low, Chip Enable
Low, Output Enable Low
tPHEL
tRH
Min
Min
50
50
0
50
ns
ns
(1)
tPHGL
(1)
tRHWL
RB High to Write Enable Low, Chip Enable
Low, Output Enable Low
(1)
tRHEL
tRB
0
0
(1)
tRHGL
tPLPX
tRP
RP Pulse width
Min
Max
Min
500 500 500
10 10 10
500 500 500
ns
µs
ns
(1)
tPLYH
tREADY RP Low to Read mode
tVIDR RP Rise time to VID
(1)
tPHPHH
1. Sampled only, not 100% tested.
34/48
M29W400DT, M29W400DB
Package mechanical
8
Package mechanical
Figure 15. SO44 - 44 lead plastic small outline, 525 mils body width, package outline
A2
A
C
b
e
CP
D
N
E
EH
1
A1
α
L
SO-d
1. Drawing is not to scale.
Table 16. SO44 – 44 lead plastic small outline, 525 mils body width, package
mechanical data
millimeters
Min
inches
Min
Symbol
Typ
Max
Typ
Max
A
A1
A2
b
2.80
0.110
0.10
2.20
0.35
0.10
0.004
0.087
0.014
0.004
2.30
0.40
0.15
2.40
0.50
0.20
0.08
28.40
13.50
16.25
–
0.091
0.016
0.006
0.094
0.020
0.008
0.003
1.118
0.531
0.640
–
C
CP
D
28.20
13.30
16.00
1.27
28.00
13.20
15.75
–
1.110
0.524
0.630
0.050
0.031
1.102
0.520
0.620
–
E
EH
e
L
0.80
a
8
8
N
44
44
35/48
Package mechanical
M29W400DT, M29W400DB
Figure 16. TSOP48 – 48 lead plastic thin small outline, 12 x 20 mm, package outline
1
48
e
D1
B
L1
24
25
A2
A
E1
E
A1
α
L
DIE
C
CP
TSOP-G
1. Drawing is not to scale.
Table 17. TSOP48 – 48 lead plastic thin small outline, 12 x 20 mm, package
mechanical data
millimeters
Min
inches
Min
Symbol
Typ
Max
Typ
Max
A
A1
A2
B
1.20
0.15
1.05
0.27
0.21
0.08
12.10
20.20
18.50
–
0.047
0.006
0.041
0.011
0.008
0.003
0.476
0.795
0.728
–
0.10
1.00
0.22
0.05
0.95
0.17
0.10
0.004
0.039
0.009
0.002
0.037
0.007
0.004
C
CP
D1
E
12.00
20.00
18.40
0.50
0.60
0.80
3
11.90
19.80
18.30
–
0.472
0.787
0.724
0.020
0.024
0.031
3
0.468
0.779
0.720
–
E1
e
L
0.50
0.70
0.020
0.028
L1
a
0
5
0
5
36/48
M29W400DT, M29W400DB
Package mechanical
Figure 17. TFBGA48 6 x 9 mm, 6 x 8 active ball array, 0.80 mm pitch, bottom view
package outline
D
D1
FD
FE
SD
SE
BALL "A1"
E
E1
ddd
e
e
b
A
A2
A1
BGA-Z00
1. Drawing is not to scale.
Table 18. TFBGA48 6 x 9 mm, 6 x 8 active ball array, 0.80 mm pitch, package
mechanical data
millimeters
Min
inches
Min
Symbol
Typ
Max
Typ
Max
A
A1
A2
b
1.20
0.047
0.20
0.008
1.00
0.45
6.10
–
0.039
0.40
6.00
4.00
0.35
5.90
–
0.016
0.236
0.157
0.014
0.232
–
0.018
D
0.240
D1
ddd
E
–
0.10
9.10
–
0.004
9.00
0.80
5.60
1.00
1.70
0.40
0.40
8.90
–
0.354
0.031
0.220
0.039
0.067
0.016
0.016
0.350
0.358
e
–
–
–
–
–
–
–
–
–
–
–
–
E1
FD
FE
SD
SE
–
–
–
–
–
–
–
–
–
–
37/48
Package mechanical
M29W400DT, M29W400DB
Figure 18. TFBGA48 6 x 8 mm, 6 x 8 active ball array, 0.80 mm pitch, bottom view
package outline
D
D1
FD
FE
SD
SE
BALL "A1"
E
E1
ddd
e
e
b
A
A2
A1
BGA-Z32
1. Drawing is not to scale.
Table 19. TFBGA48 6 x 8 mm, 6 x 8 active ball array, 0.80 mm pitch, package
mechanical data
millimeters
Min
inches
Min
Symbol
Typ
Max
Typ
Max
A
A1
A2
b
1.20
0.047
0.26
0.010
0.90
0.45
6.10
–
0.035
0.35
5.90
–
0.014
0.232
–
0.018
D
6.00
4.00
0.236
0.157
0.240
D1
ddd
E
–
0.10
8.10
–
0.004
8.00
5.60
0.80
1.00
1.20
0.40
0.40
7.90
–
0.315
0.220
0.031
0.039
0.047
0.016
0.016
0.311
0.319
E1
e
–
–
–
–
–
–
–
–
–
–
–
–
–
–
FD
FE
SD
SE
–
–
–
–
–
–
–
–
38/48
M29W400DT, M29W400DB
Part numbering
9
Part numbering
Table 20. Ordering information scheme
Example:
M29W400DT
55
N
6
T
Device type
M29
Operating voltage
W = VCC = 2.7 to 3.6 V
Device Function
400D = 4 Mbit (512 K x 8 or 256 K x 16), boot block
Array matrix
T = Top boot
B = Bottom boot
Speed
45 = 45 ns
55 = 55 ns
70 = 70 ns
Package
M = SO44
N = TSOP48: 12 x 20 mm
ZA = TFBGA48: 6 x 9 mm
ZE = TFBGA48: 6 x 8 mm
Temperature range
6 = –40 to 85 °C
1 = 0 to 70 °C
Option
Blank = Standard packing
T = Tape & Reel packing
E = ECOPACK package, standard packing
F = ECOPACK package, Tape & Reel packing
Devices are shipped from the factory with the memory content bits erased to ’1’.
For a list of available options (speed, package, etc.) or for further information on any aspect
of this device, please contact the Numonyx Sales Office nearest to you.
39/48
Block address table
M29W400DT, M29W400DB
Appendix A
Block address table
Table 21. Top boot block addresses M29W400DT
#
Size (Kbytes)
Address range (x 8)
Address range (x 16)
10
9
8
7
6
5
4
3
2
1
0
16
8
7C000h-7FFFFh
7A000h-7BFFFh
78000h-79FFFh
70000h-77FFFh
60000h-6FFFFh
50000h-5FFFFh
40000h-4FFFFh
30000h-3FFFFh
20000h-2FFFFh
10000h-1FFFFh
00000h-0FFFFh
3E000h-3FFFFh
3D000h-3DFFFh
3C000h-3CFFFh
38000h-3BFFFh
30000h-37FFFh
28000h-2FFFFh
20000h-27FFFh
18000h-1FFFFh
10000h-17FFFh
08000h-0FFFFh
00000h-07FFFh
8
32
64
64
64
64
64
64
64
Table 22. Bottom boot block addresses M29W400DB
#
Size (Kbytes)
Address range (x 8)
Address range (x 16)
10
9
8
7
6
5
4
3
2
1
0
64
64
64
64
64
64
64
32
8
70000h-7FFFFh
60000h-6FFFFh
50000h-5FFFFh
40000h-4FFFFh
30000h-3FFFFh
20000h-2FFFFh
10000h-1FFFFh
08000h-0FFFFh
06000h-07FFFh
04000h-05FFFh
00000h-03FFFh
38000h-3FFFFh
30000h-37FFFh
28000h-2FFFFh
20000h-27FFFh
18000h-1FFFFh
10000h-17FFFh
08000h-0FFFFh
04000h-07FFFh
03000h-03FFFh
02000h-02FFFh
00000h-01FFFh
8
16
40/48
M29W400DT, M29W400DB
Block protection
Appendix B
Block protection
Block protection can be used to prevent any operation from modifying the data stored in the
Flash. Each block can be protected individually. Once protected, Program and Erase
operations on the block fail to change the data.
There are three techniques that can be used to control block protection, these are the
programmer technique, the in-system technique and temporary unprotection. temporary
unprotection is controlled by the Reset/Block Temporary Unprotection pin, RP; this is
described in the Section 2: Signal descriptions.
Unlike the command interface of the Program/Erase controller, the techniques for protecting
and unprotecting blocks change between different Flash memory suppliers. For example,
the techniques for AMD parts will not work on Numonyx parts. Care should be taken when
changing drivers for one part to work on another.
B.1
Programmer technique
The programmer technique uses high (V ) voltage levels on some of the bus pins. These
ID
cannot be achieved using a standard microprocessor bus, therefore the technique is
recommended only for use in programming equipment.
To protect a block follow the flowchart in Figure 19: Programmer equipment block protect
flowchart. To unprotect the whole chip it is necessary to protect all of the blocks first, then all
blocks can be unprotected at the same time. To unprotect the chip follow Figure 20:
Programmer equipment chip unprotect flowchart. Table 23: Programmer technique bus
operations, BYTE = V or V , gives a summary of each operation.
IH
IL
The timing on these flowcharts is critical. Care should be taken to ensure that, where a
pause is specified, it is followed as closely as possible. Do not abort the procedure before
reaching the end. Chip Unprotect can take several seconds and a user message should be
provided to show that the operation is progressing.
B.2
In-system technique
The in-system technique requires a high voltage level on the Reset/Blocks Temporary
Unprotect pin, RP. This can be achieved without violating the maximum ratings of the
components on the microprocessor bus, therefore this technique is suitable for use after the
Flash has been fitted to the system.
To protect a block follow the flowchart in Figure 21: In-system equipment block protect
flowchart. To unprotect the whole chip it is necessary to protect all of the blocks first, then all
the blocks can be unprotected at the same time. To unprotect the chip follow Figure 22: In-
system equipment chip unprotect flowchart.
The timing on these flowcharts is critical. Care should be taken to ensure that, where a
pause is specified, it is followed as closely as possible. Do not allow the microprocessor to
service interrupts that will upset the timing and do not abort the procedure before reaching
the end. Chip Unprotect can take several seconds and a user message should be provided
to show that the operation is progressing.
41/48
Block protection
M29W400DT, M29W400DB
Table 23. Programmer technique bus operations, BYTE = V or V
IH
IL
Address inputs
A0-A17
Data inputs/outputs
DQ15A–1, DQ14-DQ0
Operation
E
G
W
A9 = VID,
A12-A17 block address,
VIL
pulse
Block Protect
VIL VID
X
X
others = X
VIL
pulse
A9 = VID, A12 = VIH, A15 = VIH,
others = X
Chip Unprotect
VID VID
A0 = VIL, A1 = VIH, A6 = VIL,
A9 = VID,
A12-A17 block address,
Pass = XX01h
Retry = XX00h
Block Protection
Verify
VIL VIL
VIH
others = X
A0 = VIL, A1 = VIH, A6 = VIH,
A9 = VID,
A12-A17 block address,
Block
Unprotection
Verify
Retry = XX01h
Pass = XX00h
VIL VIL
VIH
others = X
42/48
M29W400DT, M29W400DB
Figure 19. Programmer equipment block protect flowchart
Block protection
START
ADDRESS = BLOCK ADDRESS
W = V
IH
n = 0
G, A9 = V
E = V
,
ID
IL
Wait 4 µs
W = V
IL
Wait 100 µs
W = V
IH
E, G = V
,
IH
A0, A6 = V
A1 = V
,
IL
IH
E = V
IL
Wait 4 µs
G = V
IL
Wait 60 ns
Read DATA
DATA
=
01h
NO
YES
++n
= 25
NO
A9 = V
E, G = V
IH
IH
YES
PASS
A9 = V
IH
E, G = V
IH
AI03469
FAIL
43/48
Block protection
M29W400DT, M29W400DB
Figure 20. Programmer equipment chip unprotect flowchart
START
PROTECT ALL BLOCKS
n = 0
CURRENT BLOCK = 0
A6, A12, A15 = V
IH
E, G, A9 = V
ID
Wait 4 µs
W = V
IL
Wait 10 ms
W = V
IH
E, G = V
IH
ADDRESS = CURRENT BLOCK ADDRESS
A0 = V , A1, A6 = V
IL
IH
E = V
IL
Wait 4 µs
G = V
IL
INCREMENT
CURRENT BLOCK
Wait 60 ns
Read DATA
NO
YES
DATA
=
00h
LAST
BLOCK
NO
NO
++n
= 1000
YES
YES
A9 = V
A9 = V
IH
IH
E, G = V
E, G = V
IH
IH
FAIL
PASS
AI03470
44/48
M29W400DT, M29W400DB
Figure 21. In-system equipment block protect flowchart
Block protection
START
n = 0
RP = V
ID
WRITE 60h
ADDRESS = BLOCK ADDRESS
A0 = V , A1 = V , A6 = V
IL
IH
IL
WRITE 60h
ADDRESS = BLOCK ADDRESS
A0 = V , A1 = V , A6 = V
IL
IH
IL
Wait 100 µs
WRITE 40h
ADDRESS = BLOCK ADDRESS
A0 = V , A1 = V , A6 = V
IL
IH
IL
Wait 4 µs
READ DATA
ADDRESS = BLOCK ADDRESS
A0 = V , A1 = V , A6 = V
IL
IH
IL
DATA
NO
=
01h
YES
++n
= 25
NO
RP = V
IH
YES
ISSUE READ/RESET
COMMAND
RP = V
IH
PASS
ISSUE READ/RESET
COMMAND
FAIL
AI03471
45/48
Block protection
Figure 22. In-system equipment chip unprotect flowchart
M29W400DT, M29W400DB
START
PROTECT ALL BLOCKS
n = 0
CURRENT BLOCK = 0
RP = V
ID
WRITE 60h
ANY ADDRESS WITH
A0 = V , A1 = V , A6 = V
IL
IH
IH
IH
WRITE 60h
ANY ADDRESS WITH
A0 = V , A1 = V , A6 = V
IL
IH
Wait 10 ms
WRITE 40h
ADDRESS = CURRENT BLOCK ADDRESS
A0 = V , A1 = V , A6 = V
IL
IH
IH
Wait 4 µs
INCREMENT
CURRENT BLOCK
READ DATA
ADDRESS = CURRENT BLOCK ADDRESS
A0 = V , A1 = V , A6 = V
IL
IH
IH
DATA
NO
YES
=
00h
++n
= 1000
NO
NO
LAST
BLOCK
YES
RP = V
YES
RP = V
IH
IH
ISSUE READ/RESET
COMMAND
ISSUE READ/RESET
COMMAND
PASS
FAIL
AI03472
46/48
M29W400DT, M29W400DB
Revision history
10
Revision history
Table 24. Document revision history
Date
Revision
Changes
26-Jul-2002
01
Initial release
Revision numbering modified: a minor revision will be indicated by
incrementing the digit after the dot, and a major revision, by incrementing
the digit before the dot (revision version 01 equals 1.0). Revision history
moved to end of document.
Typical after 100k W/E cycles column removed from Table 4: Program,
Erase times and Program, Erase endurance cycles, Data retention and
Erase Suspend latency time parameters added. Common Flash
interface removed from datasheet.
19-Feb-2003
2.0
Lead-free package options E and F added to Table 20: Ordering
information scheme.
Document promoted from Product Preview to Preliminary Data status.
tWLWH and tELEH parameters modified for all speed classes in Table 13:
Write AC characteristics, Write Enable controlled and Table 14: Write AC
characteristics, Chip Enable controlled. Minor text changes. TSOP48
package updated (Figure 16 and Table 17).
28-May-2003
30-Sep-2003
2.1
2.2
Document status changed to Full datasheet. TFBGA48 6 x 8 package
added.
TLEAD parameter added in Table 8: Absolute maximum ratings.
tGLQV modified in Table 12: Read AC characteristics.
RB pin description corrected in Table : .
6-Oct-2003
2.3
3
16-Jan-2004
Tape and Reel option updated in Table 20: Ordering information scheme.
8-Jun-2004
4
Lead-free packaging promotion updated in Section 1: Description,
Section 6: Maximum rating and Section 9: Part numbering.
ECOPACK® text added in Section 1: Description.
Updated options E and F in Table 20: Ordering information scheme.
Small text changes.
07-Aug-2007
10-Dec-2007
5
6
Applied Numonyx branding.
47/48
M29W400DT, M29W400DB
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