NS41256S15J-SMD [NSC]
IC,SRAM,32KX8,CMOS,DIP,28PIN,CERAMIC;![NS41256S15J-SMD](http://pdffile.icpdf.com/pdf2/p00314/img/icpdf/NS41256S15J-_1885773_icpdf.jpg)
型号: | NS41256S15J-SMD |
厂家: | ![]() |
描述: | IC,SRAM,32KX8,CMOS,DIP,28PIN,CERAMIC 静态存储器 内存集成电路 |
文件: | 总18页 (文件大小:39K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
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MICROCIRCUIT DATA SHEET
Original Creation Date: 11/28/95
Last Update Date: 02/05/97
MDNS41256S15-X REV 0A0
Last Major Revision Date: 11/28/95
256K Static RAM (32K x 8 bit)
General Description
NS41256S15 is a high performance, standard power version CMOS static RAM organized as
32,768 X 8 bits with 15nS address to access time. NS41256 operates from a single +5V power
supply and all the inputs and outputs are fully TTL compatible.
Industry Part Number
NS Part Numbers
NS41256S15
NS41256S15E-SMD *
NS41256S15J-SMD **
Prime Die
PDM41256V
Controlling Document
5962-8866208YA*, UA** REV C
Processing
Subgrp Description
Temp (oC)
MIL-STD-883, Method 5004
1
Static tests at
+25
2
Static tests at
+125
-55
3
Static tests at
4
Dynamic tests at
Dynamic tests at
Dynamic tests at
Functional tests at
Functional tests at
Functional tests at
Switching tests at
Switching tests at
Switching tests at
+25
Quality Conformance Inspection
5
+125
-55
6
MIL-STD-883, Method 5005
7
+25
8A
8B
9
+125
-55
+25
10
11
+125
-55
1
MICROCIRCUIT DATA SHEET
MDNS41256S15-X REV 0A0
Features
Truth Table:
CE
WE
X
OE
X
I/O
FUNCTION
H
HI-Z
HI-Z
HI-Z
DOUT
DIN
STANDBY (ICC2)
STANDBY (ICC3)
OUTPUT DISABLE
READ
> VCC -0.2V
X
X
L
L
L
H
H
H
L
L
X
WRITE
Applications
Graphic Notes: * = This note does not apply for this device.
*1. The parameter is tested with CL = 5pF as shown in Fig. 2. Transition is
measured +200mV from steady state voltage.
*2. At any given temperature and voltage condition, tHZCE is less than tLZCE.
*3. This parameter is sampled.
*4. WE is high for a READ cycle.
5. The device is continously selected. All the Chip Enables are held in their
active state. Applies to READ cycle 1.
6. The address is valid prior to or coincident with the latest occuring Chip
Enable. Applies to READ cycle 2.
*7. Vcc = 5V +10%.
2
MICROCIRCUIT DATA SHEET
MDNS41256S15-X REV 0A0
(Absolute Maximum Ratings)
(Note 1)
Supply Voltage Range (VCC)
(Note 2)
-0.5Vdc to +7.0Vdc
Input Voltage Range
-0.5Vdc to +6.0Vdc
-65 C to +150 C
See MIL-STD-1835
Ambient Storage Temperature
Thermal Resistance
Junction-to-Case (ThetaJC)
Junction Temperature (TJ)
(Note 3)
+150 C
1.0W
Power Dissipation (PD)
Lead Temperature
(Soldering, 10 seconds)
+260 C
Note 1: Generic numbers are listed on the Standardized Military Drawing Source Approval
Bulletin at the end of document 5962-88662, and will also be listed in MIL-BUL-103.
Note 2: All voltages referenced to VSS.
Note 3: Maximum junction temperature shall not be exceeded except for allowable short
duration burn-in screening conditions in accordance with method 5004 of MIL-STD-883.
Recommended Operating Conditions
Supply Voltage Range (VCC)
(Note 1)
4.5Vdc to 5.5Vdc
Ground Voltage (VSS)
0 Vdc
Input High Voltage Range (VIH)
2.2Vdc to Vcc +0.5Vdc
Input Low Voltage Range (VIL)
-0.5Vdc to 0.8Vdc
Operating Case Temperature (TC)
-55 C to +125 C
Note 1: All voltages referenced to VSS.
3
MICROCIRCUIT DATA SHEET
MDNS41256S15-X REV 0A0
Electrical Characteristics
DC PARAMETERS: ELECTRICAL CHARACTERISTICS
(The following conditions apply to all the following parameters, unless otherwise specified.)
DC: -55 C < Tc < +125 C, Vss = 0V, 4.5V < Vcc < 5.5V
PIN-
NAME
SUB-
SYMBOL
ILI
PARAMETER
CONDITIONS
NOTES
MIN
MAX UNIT
GROUPS
Input Leakage
Current
Vcc = max, Vin = Gnd to Vcc
10
uA
uA
V
1, 2,
3
ILO
Vol
Voh
Output Leakage
Current
Vcc = max, Vout = Gnd to Vcc,
CE > Vih; WE < Vil
10
1, 2,
3
Output Low
Voltage
Vcc = 4.5V, Iol = 8mA, Vil=0.8V,
Vih=2.2V
0.4
1, 2,
3
Output High
Voltage
Vcc = 4.5V, Ioh = -4mA, Vil = 0.8V,
Vih = 2.2V
2.4
V
1, 2,
3
DC PARAMETERS: Maximum Operating Conditions
(The following conditions apply to all the following parameters, unless otherwise specified.)
DC: -55 C < Tc < +125 C, Vss = 0V, 4.5V < Vcc < 5.5V
Icc1
Operating Supply Vcc=5.5V, f=fmax, CE = Vil,
1
180
mA
mA
1, 2,
3
Current
outputs open, all other inputs at Vil
Icc2
Standby Power
Supply Current
(TTL)
CE > Vih, outputs open,
Vcc=5.5V
50
1, 2,
3
Icc3
Standby Power
Supply Current
(CMOS)
CE > (Vcc-0.2V), f=0MHz,
outputs open, Vcc=5.5Vall other
inputs < 0.2V or > (Vcc-0.2V)
20
mA
1, 2,
3
AC PARAMETERS: Capacitance
(The following conditions apply to all the following parameters, unless otherwise specified.)
DC: -55 C < Tc < +125 C, Vss = 0V, 4.5V < Vcc < 5.5V
Cin
Input Capacitance Vi=5.0V or Gnd, f=1MHz, TC=+25 C
2, 6
2, 6
11
11
pF
pF
4
4
Cout
Output
Vo=5.0V or Gnd, f=1MHz, TC=+25 C
Capacitance
4
MICROCIRCUIT DATA SHEET
MDNS41256S15-X REV 0A0
Electrical Characteristics
AC PARAMETERS: ELECTRICAL CHARACTERISTICS
(The following conditions apply to all the following parameters, unless otherwise specified.)
AC: -55 C < Tc < +125 C, Vss = 0V, 4.5V < Vcc < 5.5V
PIN-
NAME
SUB-
SYMBOL
tAVAV
PARAMETER
CONDITIONS
NOTES
MIN
15
MAX UNIT
GROUPS
Read Cycle Time
3
nS
9, 10,
11
tAVQV
tELQV
tAVQX
tOLQV
tELQX
tEHQZ
Address Access
Time
3
15
nS
nS
ns
nS
nS
nS
9, 10,
11
Chip Enable
Access Time
3
15
9, 10,
11
Output Hold after
Address Change
3
3
3
9, 10,
11
Output Enable to
Output Valid
3, 5
8
9, 10,
11
Chip Select to
Output in Low Z
2,
3, 4
9, 10,
11
Chip Deselect to
Output in High Z
2,
10
10
10
9, 10,
11
3,
4, 5
tOHQZ
tWLQZ
tOLQX
Output Disable to
Output in High Z
2,
nS
nS
9, 10,
11
3,
4, 5
Write Enable to
Output in High Z
2,
9, 10,
11
3,
4, 5
Output Enable to
Output in Low Z
2,
3, 4
0
nS
nS
nS
nS
nS
nS
nS
nS
nS
nS
9, 10,
11
tDVWH/
tDVEH
Data Valid to end
of Write
3, 5
10
0
9, 10,
11
tWHDX/
tEHDX
Data Hold Time
3
9, 10,
11
tWHQX
tAVAV
tELWH
tAVWH
tAVWL
tWLWH
Output Active
from end of Write
2,
3, 4
0
9, 10,
11
Write Cycle Time
3
3
3
3
3
3
15
12
12
0
9, 10,
11
Chip Select to
end of Write
9, 10,
11
Address Valid to
end of Write
9, 10,
11
Address-setup
Time
9, 10,
11
Write Pulse Width
12
0
9, 10,
11
tWHAX/
tEHAX
Write Recovery
Time
9, 10,
11
Note 1: fmax = 1/tAVAV (minimum).
5
MICROCIRCUIT DATA SHEET
MDNS41256S15-X REV 0A0
(Continued)
Note 2: This parameter tested initially and after any design or process change which could
affect this parameter, and therefore shall be guaranteed to the limits specified in
table I.
Note 3: For load circuits see figure 3 and for timing waveforms see figure 4.
Note 4: Transition is measured +500mV from steady state voltage.
Note 5: This parameter has been tightened for device type 04. Any date code prior to the date
of Rev C of this drawing may not meet this limit. See Rev B for the electrical
parameter value that applies to prior date codes.
Note 6: Subgroup 4 (Cin and Cout measurements) shall be measured only for the initial test
and after any process or design changes which may affect capacitance. Sample size is
fifteen devices with no failures, and all input and output terminals tested.
6
MICROCIRCUIT DATA SHEET
MDNS41256S15-X REV 0A0
Graphics and Diagrams
GRAPHICS#
DESCRIPTION
AN00012A
AN00016A
AN00017A
AN00019A
AN00020A
AN00022A
AN00025A
AN00027A
AN00029A
P000141A
P000142A
BLOCK DIAGRAM - NS41256
FIGURE 1 - OUTPUT LOAD EQUIVALENT
FIGURE 2 - OUTPUT LOAD EQUIVALENT
FIGURE 4 - CAPACITIVE LOADING GRAPH
READ CYCLE 1 (APPLICATION NOTES)
READ CYCLE 2 (APPLICATION NOTES)
WRITE CYCLE 1 - WRITE ENABLE CONTROLLED
WRITE CYCLE 2 - CHIP ENABLE CONTROLLED
LOW VCC DATA RETENTION WAVEFORM
CERDIP (J), 28 LEAD, 300 MIL (PIN OUT)
CERAMIC LCC (E), 32 LEAD, 450 X 550 MIL (PIN OUT)
See attached graphics following this page.
7
AN00012A
Functional Block Diagram
A
•
0
Decoder
Memory
Matrix
•
•
•
•
•
•
•
•
Addresses
•
•
A 14
• • • • •
I/O0
Input
Column I/O
Data
Control
•
•
I/O7
•
•
•
CE
WE
OE
NS41256
AN00016A
Output Load Equivalent
+5V
480Ω
D
OUT
255Ω
30 pF
FIG. 1
AN00017A
FIG. 2
Output Load Equivalent
(for tLZCE, tHZWE, tLZWE, tHZWE, tLZOE, tHZOE)
+5V
480Ω
D
OUT
255Ω
5 pF
NS41024
NS41096
NS41256
NS4A024
NS4A028
NS4M096
NS4R024
AN00019A
FIG. 4
Typical Delta t
AA
vs Capacitive Loading
5
4
3
2
1
0
0
30
60
90
120
Additional Lumped Capacitive Loading (pF)
NS41256
NS41257
NS41258
NS4A024
NS4A028
AN00020A
Read Cycle #1
Notes : 4,5,6 apply
t
RC
ADDR
t
AA
t
OH
D
DATA VALID
PREVIOUS DATA VALID
OUT
NS41024
NS41096
NS41256
NS41257
NS41258
NS4A024
NS4A028
NS4M096
NS4R024
AN00022A
Read Cycle #2 Notes 2,4,6 & 7
t
RC
CE
OE
t
t
HZCE
ACE
t
HZOE
t
AOE
t
LZOE
D
HIGH Z
DATA VALID
OUT
t
LZCE
NS41096
NS41256
NS4M096
AN00025A
Write Cycle #1 (write enable controlled)
t
WC
ADDR
t
AW
t
t
t
t
AH
CW
CE
t
AS
WP
WE
t
DH
DS
D
IN
DATA VALID
t
t
HZWE
LZWE
HIGH Z
D
OUT
NS41096
NS41256
NS41257
NS41258
NS4A028
NS4M096
AN00027A
Write Cycle #2 (chip enable controlled)
t
WC
ADDR
CE
t
AW
t
t
t
AS
CW
AH
t
WP
UNDEFINED
DON'T CARE
WE
t
t
DS
DATA VALID
DH
D
IN
NS41096
NS41256
NS41257
NS41258
NS4A028
NS4M096
AN00029A
Low Vcc Data Retention Waveform
Data Retention Mode
V
4.5V
4.5V
CC
V
DR
t
t
CDR
R
V
V
DR
IH
CE
V
IL
DON'T CARE
NS41096
NS41256
NS41257
NS41258
NS4A028
NS4M096
P000141A
Pin Configuration
CERDIP (J Suffix)
28LD (pinout)
Vcc
WE
A13
A8
1
2
3
4
5
6
7
8
A14
A12
A7
28
27
26
25
24
23
A6
A9
A5
A11
OE
A4
A3
22
21
20
19
18
17
16
15
A10
CE
A2
9
A1
10
11
12
13
14
I/O7
I/O6
I/O5
I/O4
I/O3
A0
I/O0
I/O1
I/O2
GND
NS41256
P000142A
Pin Configuration
32LD (pinout)
LCC (E Suffix)
4 3 2
32 31 30
1
A6
A5
A4
A3
A2
A1
A0
NC
I/O0
5
29
A8
6
28
27
26
25
24
23
22
21
A9
7
A11
NC
OE
A10
CE
I/07
I/06
8
9
10
11
12
13
14 15 16 17 18 19 20
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