LMH6626 [NSC]

Single/Dual Ultra Low Noise Wideband Operational Amplifier; 单/双超低噪声宽带运算放大器
LMH6626
型号: LMH6626
厂家: National Semiconductor    National Semiconductor
描述:

Single/Dual Ultra Low Noise Wideband Operational Amplifier
单/双超低噪声宽带运算放大器

运算放大器
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中文:  中文翻译
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September 2005  
LMH6624/LMH6626  
Single/Dual Ultra Low Noise Wideband Operational  
Amplifier  
General Description  
The LMH6624/LMH6626 offer wide bandwidth (1.5GHz for  
single, 1.3GHz for dual) with very low input noise (0.92nV/  
Features  
VS  
=
6V, TA = 25˚C, AV = 20, (Typical values unless  
specified)  
, 2.3pA/  
) and ultra low dc errors (100µV VOS,  
n Gain bandwidth (LMH6624)  
n Input voltage noise  
n Input offset voltage (limit over temp)  
n Slew rate  
1.5GHz  
0.92nV/  
0.1µV/˚C drift) providing very precise operational amplifiers  
with wide dynamic range. This enables the user to achieve  
closed-loop gains of greater than 10, in both inverting and  
non-inverting configurations.  
700uV  
350V/µs  
400V/µs  
−63dBc  
−80dBc  
n Slew rate (AV = 10)  
The LMH6624 (single) and LMH6626’s (dual) traditional volt-  
age feedback topology provide the following benefits: bal-  
anced inputs, low offset voltage and offset current, very low  
offset drift, 81dB open loop gain, 95dB common mode rejec-  
tion ratio, and 88dB power supply rejection ratio.  
@
n HD2 f = 10MHz, RL = 100  
@
n HD3 f = 10MHz, RL = 100Ω  
n Supply voltage range (dual supply)  
n Supply voltage range (single supply)  
n Improved replacement for the CLC425  
n Stable for closed loop |AV| 10  
2.5V to 6V  
+5V to +12V  
(LMH6624)  
The LMH6624/LMH6626 operate from  
dual supply mode and from +5V to +12V in single supply  
configuration.  
2.5V to  
6V in  
Applications  
LMH6624 is offered in SOT23-5 and SOIC-8 packages.  
The LMH6626 is offered in SOIC-8 and MSOP-8 packages.  
n Instrumentation sense amplifiers  
n Ultrasound pre-amps  
n Magnetic tape & disk pre-amps  
n Wide band active filters  
n Professional Audio Systems  
n Opto-electronics  
n Medical diagnostic systems  
Connection Diagrams  
5-Pin SOT23  
8−Pin SOIC  
8−Pin SOIC/MSOP  
20058961  
20058952  
20058951  
Top View  
Top View  
Top View  
© 2005 National Semiconductor Corporation  
DS200589  
www.national.com  
Absolute Maximum Ratings (Note 1)  
If Military/Aerospace specified devices are required,  
please contact the National Semiconductor Sales Office/  
Distributors for availability and specifications.  
Wave Soldering (10 sec.)  
260˚C  
−65˚C to +150˚C  
+150˚C  
Storage Temperature Range  
Junction Temperature (Note 3), (Note 4)  
ESD Tolerance  
Operating Ratings (Note 1)  
Operating Temperature Range  
Human Body Model  
Machine Model  
2000V (Note 2)  
200V (Note 9)  
1.2V  
(Note 3), (Note 4)  
−40˚C to +125˚C  
VIN Differential  
Package Thermal Resistance (θJA)(Note 4)  
Supply Voltage (V+ - V)  
Voltage at Input pins  
Soldering Information  
Infrared or Convection (20 sec.)  
13.2V  
V+ +0.5V, V−0.5V  
SOIC-8  
166˚C/W  
265˚C/W  
235˚C/W  
SOT23–5  
MSOP-8  
235˚C  
2.5V Electrical Characteristics  
Unless otherwise specified, all limits guaranteed at TA = 25˚C, V+ = 2.5V, V= −2.5V, VCM = 0V, AV = +20, RF = 500, RL  
100. Boldface limits apply at the temperature extremes. See (Note 12).  
=
Symbol  
Parameter  
Conditions  
Min  
Typ  
Max  
Units  
(Note 6)  
(Note 5)  
(Note 6)  
Dynamic Performance  
fCL  
SR  
−3dB BW  
VO = 400mVPP (LMH6624)  
90  
80  
MHz  
V/µs  
VO = 400mVPP (LMH6626)  
Slew Rate(Note 8)  
VO = 2VPP, AV = +20 (LMH6624)  
VO = 2VPP, AV = +20 (LMH6626)  
VO = 2VPP, AV = +10 (LMH6624)  
VO = 2VPP, AV = +10 (LMH6626)  
VO = 400mV Step, 10% to 90%  
VO = 400mV Step, 10% to 90%  
VO = 2VPP (Step)  
300  
290  
360  
340  
4.1  
4.1  
20  
tr  
tf  
Rise Time  
ns  
ns  
ns  
Fall Time  
ts  
Settling Time 0.1%  
Distortion and Noise Response  
en  
in  
Input Referred Voltage Noise  
f = 1MHz (LMH6624)  
0.92  
1.0  
nV/  
pA/  
dBc  
f = 1MHz (LMH6626)  
Input Referred Current Noise  
f = 1MHz (LMH6624)  
2.3  
f = 1MHz (LMH6626)  
1.8  
HD2  
HD3  
2nd Harmonic Distortion  
3rd Harmonic Distortion  
fC = 10MHz, VO = 1VPP, RL 100Ω  
fC = 10MHz, VO = 1VPP, RL 100Ω  
−60  
−76  
dBc  
Input Characteristics  
VOS  
IOS  
IB  
Input Offset Voltage  
VCM = 0V  
−0.75  
−0.25  
+0.75  
mV  
−0.95  
+0.95  
Average Drift (Note 7)  
Input Offset Current  
VCM = 0V  
VCM = 0V  
0.25  
µV/˚C  
µA  
−1.5  
−0.05  
+1.5  
−2.0  
+2.0  
Average Drift (Note 7)  
Input Bias Current  
VCM = 0V  
VCM = 0V  
2
nA/˚C  
µA  
13  
+20  
+25  
Average Drift (Note 7)  
VCM = 0V  
12  
6.6  
4.6  
0.9  
2.0  
nA/˚C  
MΩ  
kΩ  
RIN  
Input Resistance (Note 10)  
Common Mode  
Differential Mode  
Common Mode  
Differential Mode  
Input Referred,  
CIN  
Input Capacitance (Note 10)  
pF  
CMRR  
Common Mode Rejection  
Ratio  
dB  
VCM = −0.5 to +1.9V  
VCM = −0.5 to +1.75V  
87  
90  
85  
www.national.com  
2
2.5V Electrical Characteristics (Continued)  
Unless otherwise specified, all limits guaranteed at TA = 25˚C, V+ = 2.5V, V= −2.5V, VCM = 0V, AV = +20, RF = 500, RL  
100. Boldface limits apply at the temperature extremes. See (Note 12).  
=
Symbol  
Parameter  
Conditions  
Min  
Typ  
Max  
Units  
(Note 6)  
(Note 5)  
(Note 6)  
Transfer Characteristics  
AVOL Large Signal Voltage Gain  
(LMH6624)  
75  
70  
72  
67  
79  
79  
RL = 100, VO = −1V to +1V  
(LMH6626)  
dB  
dB  
RL = 100, VO = −1V to +1V  
f = 1MHz (LMH6626)  
Xt  
Crosstalk Rejection  
−75  
1.5  
1.7  
Output Characteristics  
VO  
Output Swing  
RL = 100Ω  
1.1  
1.0  
V
No Load  
1.4  
1.25  
RO  
ISC  
Output Impedance  
f 100KHz  
10  
mΩ  
Output Short Circuit Current  
(LMH6624)  
90  
145  
Sourcing to Ground  
VIN = 200mV (Note 3), (Note 11)  
(LMH6624)  
75  
90  
145  
120  
120  
100  
75  
Sinking to Ground  
VIN = −200mV (Note 3), (Note 11)  
(LMH6626)  
75  
mA  
60  
Sourcing to Ground  
VIN = 200mV (Note 3),(Note 11)  
(LMH6626)  
50  
60  
Sinking to Ground  
VIN = −200mV (Note 3),(Note 11)  
(LMH6624)  
50  
IOUT  
Output Current  
Sourcing, VO = +0.8V  
Sinking, VO = −0.8V  
(LMH6626)  
mA  
Sourcing, VO = +0.8V  
Sinking, VO = −0.8V  
Power Supply  
PSRR  
Power Supply Rejection Ratio VS  
=
2.0V to 3.0V  
82  
90  
dB  
80  
IS  
Supply Current (per channel) No Load  
11.4  
16  
mA  
18  
6V Electrical Characteristics  
Unless otherwise specified, all limits guaranteed at TA = 25˚C, V+ = 6V, V= −6V, VCM = 0V, AV = +20, RF = 500, RL  
100. Boldface limits apply at the temperature extremes. See (Note 12).  
=
Symbol  
Parameter  
Conditions  
Min  
Typ  
Max  
Units  
(Note 6)  
(Note 5)  
(Note 6)  
Dynamic Performance  
fCL  
SR  
−3dB BW  
VO = 400mVPP (LMH6624)  
95  
85  
MHz  
V/µs  
VO = 400mVPP (LMH6626)  
Slew Rate (Note 8)  
VO = 2VPP, AV = +20 (LMH6624)  
VO = 2VPP, AV = +20 (LMH6626)  
VO = 2VPP, AV = +10 (LMH6624)  
VO = 2VPP, AV = +10 (LMH6626)  
VO = 400mV Step, 10% to 90%  
350  
320  
400  
360  
3.7  
tr  
Rise Time  
ns  
3
www.national.com  
6V Electrical Characteristics (Continued)  
Unless otherwise specified, all limits guaranteed at TA = 25˚C, V+ = 6V, V= −6V, VCM = 0V, AV = +20, RF = 500, RL  
100. Boldface limits apply at the temperature extremes. See (Note 12).  
=
Symbol  
Parameter  
Conditions  
Min  
(Note 6)  
Typ  
(Note 5)  
3.7  
Max  
(Note 6)  
Units  
tf  
ts  
Distortion and Noise Response  
Fall Time  
VO = 400mV Step, 10% to 90%  
VO = 2VPP (Step)  
ns  
ns  
Settling Time 0.1%  
18  
en  
Input Referred Voltage Noise  
f = 1MHz (LMH6624)  
0.92  
1.0  
nV/  
pA/  
dBc  
f = 1MHz (LMH6626)  
in  
Input Referred Current Noise  
f = 1MHz (LMH6624)  
2.3  
f = 1MHz (LMH6626)  
1.8  
HD2  
HD3  
2nd Harmonic Distortion  
3rd Harmonic Distortion  
fC = 10MHz, VO = 1VPP, RL 100Ω  
fC = 10MHz, VO = 1VPP, RL 100Ω  
−63  
−80  
dBc  
Input Characteristics  
VOS Input Offset Voltage  
VCM = 0V  
−0.5  
0.10  
+0.5  
mV  
−0.7  
+0.7  
Average Drift (Note 7)  
Input Offset Current Average  
Drift (Note 7)  
VCM = 0V  
(LMH6624)  
VCM = 0V  
(LMH6626)  
VCM = 0V  
VCM = 0V  
VCM = 0V  
0.2  
µV/˚C  
µA  
IOS  
−1.1  
−2.5  
−2.0  
−2.5  
0.05  
1.1  
2.5  
2.0  
2.5  
0.1  
0.7  
13  
nA/˚C  
µA  
IB  
Input Bias Current  
+20  
+25  
Average Drift (Note 7)  
VCM = 0V  
12  
6.6  
4.6  
0.9  
2.0  
nA/˚C  
MΩ  
RIN  
Input Resistance (Note 10)  
Common Mode  
Differential Mode  
Common Mode  
Differential Mode  
Input Referred,  
kΩ  
CIN  
Input Capacitance (Note 10)  
pF  
dB  
CMRR  
Common Mode Rejection  
Ratio  
VCM = −4.5 to +5.25V  
VCM = −4.5 to +5.0V  
90  
95  
87  
Transfer Characteristics  
AVOL Large Signal Voltage Gain  
(LMH6624)  
77  
72  
74  
70  
81  
80  
RL = 100, VO = −3V to +3V  
(LMH6626)  
dB  
dB  
RL = 100, VO = −3V to +3V  
f = 1MHz (LMH6626)  
Xt  
Crosstalk Rejection  
−75  
4.9  
5.2  
4.8  
5.2  
10  
Output Characteristics  
VO  
Output Swing  
(LMH6624)  
RL = 100Ω  
(LMH6624)  
No Load  
4.4  
4.3  
4.8  
4.65  
4.3  
V
(LMH6626)  
RL = 100Ω  
(LMH6626)  
No Load  
4.2  
4.8  
4.65  
RO  
Output Impedance  
f 100KHz  
mΩ  
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4
6V Electrical Characteristics (Continued)  
Unless otherwise specified, all limits guaranteed at TA = 25˚C, V+ = 6V, V= −6V, VCM = 0V, AV = +20, RF = 500, RL  
100. Boldface limits apply at the temperature extremes. See (Note 12).  
=
Symbol  
Parameter  
Conditions  
Min  
(Note 6)  
100  
Typ  
(Note 5)  
156  
Max  
(Note 6)  
Units  
ISC  
Output Short Circuit Current  
(LMH6624)  
Sourcing to Ground  
VIN = 200mV (Note 3), (Note 11)  
(LMH6624)  
85  
100  
156  
120  
120  
100  
80  
Sinking to Ground  
85  
VIN = −200mV (Note 3), (Note 11)  
(LMH6626)  
mA  
65  
Sourcing to Ground  
VIN = 200mV (Note 3), (Note 11)  
(LMH6626)  
55  
65  
Sinking to Ground  
55  
VIN = −200mV (Note 3), (Note 11)  
(LMH6624)  
IOUT  
Output Current  
Sourcing, VO = +4.3V  
Sinking, VO = −4.3V  
(LMH6626)  
mA  
Sourcing, VO = +4.3V  
Sinking, VO = −4.3V  
Power Supply  
PSRR  
Power Supply Rejection Ratio VS  
=
5.4V to 6.6V  
82  
88  
12  
dB  
80  
IS  
Supply Current (per channel) No Load  
16  
mA  
18  
Note 1: Absolute maximum ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is  
intended to be functional, but specific performance is not guaranteed. For guaranteed specifications and the test conditions, see the Electrical Characteristics.  
Note 2: Human body model, 1.5kin series with 100pF.  
Note 3: Applies to both single-supply and split-supply operation. Continuous short circuit operation at elevated ambient temperature can result in exceeding the  
maximum allowed junction temperature of 150˚C.  
Note 4: The maximum power dissipation is a function of T  
, θ , and T . The maximum allowable power dissipation at any ambient temperature is  
JA A  
J(MAX)  
P
= (T  
- T )/ θ . All numbers apply for packages soldered directly onto a PC board.  
D
J(MAX) A JA  
Note 5: Typical Values represent the most likely parametric norm.  
Note 6: All limits are guaranteed by testing or statistical analysis.  
Note 7: Average drift is determined by dividing the change in parameter at temperature extremes into the total temperature change.  
Note 8: Slew rate is the slowest of the rising and falling slew rates.  
Note 9: Machine Model, 0in series with 200pF.  
Note 10: Simulation results.  
Note 11: Short circuit test is a momentary test. Output short circuit duration is 1.5ms.  
Note 12: Electrical table values apply only for factory testing conditions at the temperature indicated. Factory testing conditions result in very limited self-heating of  
>
the device such that T = T . No guarantee of parametric performance is indicated in the electrical tables under conditions of internal self-heating where T  
Absolute maximum ratings indicate junction temperature limits beyond which the device may be permanently degraded, either mechanically or electrically.  
T .  
A
J
A
J
Ordering Information  
Package  
Part Number  
LMH6624MF  
LMH6624MFX  
LMH6624MA  
LMH6624MAX  
LMH6626MA  
LMH6626MAX  
LMH6626MM  
LMH6626MMX  
Package Marking  
Transport Media  
1k Units Tape and Reel  
3k Units Tape and Reel  
95 Units/Rail  
NSC Drawing  
SOT23-5  
A94A  
MF05A  
SOIC-8  
SOIC-8  
MSOP-8  
LMH6624MA  
LMH6626MA  
A98A  
M08A  
M08A  
2.5k Units Tape and Reel  
95 Units/Rail  
2.5k Units Tape and Reel  
1k Units Tape and Reel  
3.5k Units Tape and Reel  
MUA08A  
5
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Typical Performance Characteristics  
Voltage Noise vs. Frequency  
Current Noise vs. Frequency  
20058962  
20058963  
Inverting Frequency Response  
Inverting Frequency Response  
20058989  
20058988  
Non-Inverting Frequency Response  
Non-Inverting Frequency Response  
20058904  
20058903  
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6
Typical Performance Characteristics (Continued)  
Open Loop Frequency Response Over Temperature  
Open Loop Frequency Response Over Temperature  
20058964  
20058966  
Frequency Response with Cap. Loading  
Frequency Response with Cap. Loading  
20058984  
20058986  
Frequency Response with Cap. Loading  
Frequency Response with Cap. Loading  
20058987  
20058985  
7
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Typical Performance Characteristics (Continued)  
Non-Inverting Frequency Response Varying VIN  
Non-Inverting Frequency Response Varying VIN  
20058906  
20058905  
Non-Inverting Frequency Response Varying VIN  
(LMH6624)  
Non-Inverting Frequency Response Varying VIN  
(LMH6626)  
20058908  
20058981  
Non-Inverting Frequency Response Varying VIN  
(LMH6624)  
Non-Inverting Frequency Response Varying VIN  
(LMH6626)  
20058907  
20058980  
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8
Typical Performance Characteristics (Continued)  
Sourcing Current vs. VOUT (LMH6624)  
Sourcing Current vs. VOUT (LMH6626)  
20058957  
20058972  
Sourcing Current vs. VOUT (LMH6624)  
Sourcing Current vs. VOUT (LMH6626)  
20058954  
20058969  
VOS vs. VSUPPLY (LMH6624)  
VOS vs. VSUPPLY (LMH6626)  
20058967  
20058968  
9
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Typical Performance Characteristics (Continued)  
Sinking Current vs. VOUT (LMH6624)  
Sinking Current vs. VOUT (LMH6626)  
20058958  
20058971  
Sinking Current vs. VOUT (LMH6624)  
Sinking Current vs. VOUT (LMH6626)  
20058956  
20058970  
IOS vs. VSUPPLY  
Crosstalk Rejection vs. Frequency (LMH6626)  
20058979  
20058953  
www.national.com  
10  
Typical Performance Characteristics (Continued)  
Distortion vs. Frequency  
Distortion vs. Frequency  
20058944  
20058946  
Distortion vs. Frequency  
Distortion vs. Gain  
20058945  
20058978  
Distortion vs. VOUT Peak to Peak  
Distortion vs. VOUT Peak to Peak  
20058943  
20058977  
11  
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Typical Performance Characteristics (Continued)  
Non-Inverting Large Signal Pulse Response  
Non-Inverting Large Signal Pulse Response  
20058973  
20058974  
Non-Inverting Small Signal Pulse Response  
Non-Inverting Small Signal Pulse Response  
20058975  
20058976  
PSRR vs. Frequency  
PSRR vs. Frequency  
20058948  
20058949  
www.national.com  
12  
Typical Performance Characteristics (Continued)  
Input Referred CMRR vs. Frequency  
Input Referred CMRR vs. Frequency  
20058901  
20058902  
Amplifier Peaking with Varying RF  
Amplifier Peaking with Varying RF  
20058982  
20058983  
13  
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Application Section  
20058919  
20058918  
FIGURE 2. Inverting Amplifier Configuration  
FIGURE 1. Non-Inverting Amplifier Configuration  
INTRODUCTION  
TOTAL INPUT NOISE vs. SOURCE RESISTANCE  
To determine maximum signal-to-noise ratios from the  
LMH6624/LMH6626, an understanding of the interaction be-  
tween the amplifier’s intrinsic noise sources and the noise  
arising from its external resistors is necessary.  
The LMH6624/LMH6626 are very wide gain bandwidth, ultra  
low noise voltage feedback operational amplifiers. Their ex-  
cellent performances enable applications such as medical  
diagnostic ultrasound, magnetic tape & disk storage and  
fiber-optics to achieve maximum high frequency signal-to-  
noise ratios. The set of characteristic plots in the "Typical  
Performance" section illustrates many of the performance  
trade offs. The following discussion will enable the proper  
selection of external components to achieve optimum sys-  
tem performance.  
Figure 3 describes the noise model for the non-inverting  
amplifier configuration showing all noise sources. In addition  
to the intrinsic input voltage noise (en) and current noise  
+
(in = in = in) source, there is also thermal voltage noise  
(et = (4KTR)) associated with each of the external resistors.  
Equation 1 provides the general form for total equivalent  
input voltage noise density (eni). Equation 2 is a simplifica-  
tion of Equation 1 that assumes  
BIAS CURRENT CANCELLATION  
To cancel the bias current errors of the non-inverting con-  
figuration, the parallel combination of the gain setting (Rg)  
and feedback (Rf) resistors should equal the equivalent  
source resistance (Rseq) as defined in Figure 1. Combining  
this constraint with the non-inverting gain equation also seen  
in Figure 1, allows both Rf and Rg to be determined explicitly  
from the following equations:  
Rf = AVRseq and Rg = Rf/(AV-1)  
When driven from a 0source, such as the output of an op  
amp, the non-inverting input of the LMH6624/LMH6626  
should be isolated with at least a 25series resistor.  
As seen in Figure 2, bias current cancellation is accom-  
plished for the inverting configuration by placing a resistor  
(Rb) on the non-inverting input equal in value to the resis-  
tance seen by the inverting input (Rf||(Rg+Rs)). Rb should to  
be no less than 25for optimum LMH6624/LMH6626 per-  
formance. A shunt capacitor can minimize the additional  
noise of Rb.  
20058920  
FIGURE 3. Non-Inverting Amplifier Noise Model  
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14  
Rf||Rg should be as low as possible to minimize noise.  
Results similar to Equation 1 are obtained for the inverting  
configuration of Figure 2 if Rseq is replaced by Rb and Rg is  
replaced by Rg + Rs. With these substitutions, Equation 1 will  
yield an eni referred to the non-inverting input. Referring eni  
to the inverting input is easily accomplished by multiplying  
eni by the ratio of non-inverting to inverting gains.  
Application Section (Continued)  
(1)  
Rf||Rg = Rseq for bias current cancellation. Figure 4 illustrates  
the equivalent noise model using this assumption. Figure 5  
is a plot of eni against equivalent source resistance (Rseq  
)
NOISE FIGURE  
with all of the contributing voltage noise source of Equation  
2. This plot gives the expected eni for a given (Rseq) which  
assumes Rf||Rg = Rseq for bias current cancellation. The total  
equivalent output voltage noise (eno) is eni*AV.  
Noise Figure (NF) is a measure of the noise degradation  
caused by an amplifier.  
(3)  
The Noise Figure formula is shown in Equation 3. The addi-  
tion of a terminating resistor RT, reduces the external ther-  
mal noise but increases the resulting NF. The NF is in-  
creased because RT reduces the input signal amplitude thus  
reducing the input SNR.  
20058921  
FIGURE 4. Noise Model with Rf||Rg = Rseq  
(4)  
The noise figure is related to the equivalent source resis-  
tance (Rseq) and the parallel combination of Rf and Rg. To  
minimize noise figure.  
(2)  
As seen in Figure 5, eni is dominated by the intrinsic voltage  
noise (en) of the amplifier for equivalent source resistances  
below 33.5. Between 33.5and 6.43k, eni is dominated  
Minimize Rf||Rg  
Choose the Optimum RS (ROPT  
)
(4kT(2Rseq)) of the external  
by the thermal noise (et  
=
ROPT is the point at which the NF curve reaches a minimum  
and is approximated by:  
resistor. Above 6.43k, eni is dominated by the amplifier’s  
(2) inRseq). When Rseq = 464(ie.,  
current noise (in  
=
ROPT en/in  
en/ (2) in) the contribution from voltage noise and current  
noise of LMH6624/LMH6626 is equal.. For example, config-  
ured with a gain of +20V/V giving a −3dB of 90MHz and  
driven from Rseq = 25, the LMH6624 produces a total  
SINGLE SUPPLY OPERATION  
The LMH6624/LMH6626 can be operated with single power  
supply as shown in Figure 6. Both the input and output are  
capacitively coupled to set the DC operating point.  
equivalent input noise voltage (eni  
16.5µVrms  
x
1.57*90MHz) of  
.
20058926  
20058922  
FIGURE 6. Single Supply Operation  
FIGURE 5. Voltage Noise Density vs. Source  
Resistance  
LOW NOISE TRANSIMPEDANCE AMPLIFIER  
Figure 7 implements a low-noise transimpedance amplifier  
commonly used with photo-diodes. The transimpedance  
gain is set by Rf. Equation 4 provides the total input current  
If bias current cancellation is not a requirement, then Rf||Rg  
need not equal Rseq. In this case, according to Equation 1,  
15  
www.national.com  
Application Section (Continued)  
noise density (ini) equation for the basic transimpedance  
configuration and is plotted against feedback resistance (Rf)  
showing all contributing noise sources in Figure 8. This plot  
indicates the expected total equivalent input current noise  
density (ini) for a given feedback resistance (Rf). The total  
equivalent output voltage noise density (eno) is ini*Rf.  
20058929  
FIGURE 9. Low Noise Integrator  
HIGH-GAIN SALLEN-KEY ACTIVE FILTERS  
20058927  
The LMH6624/LMH6626 are well suited for high gain Sallen-  
Key type of active filters. Figure 10 shows the 2nd order  
Sallen-Key low pass filter topology. Using component predis-  
tortion methods discussed in OA-21 enables the proper  
selection of components for these high-frequency filters.  
FIGURE 7. Transimpedance Amplifier Configuration  
20058930  
20058928  
FIGURE 10. Sallen-Key Active Filter Topology  
FIGURE 8. Current Noise Density vs. Feedback  
Resistance  
LOW NOISE MAGNETIC MEDIA EQUALIZER  
The LMH6624/LMH6626 implement a high-performance low  
noise equalizer for such application as magnetic tape chan-  
nels as shown in Figure 11. The circuit combines an integra-  
tor with a bandpass filter to produce the low noise equaliza-  
tion. The circuit’s simulated frequency response is illustrated  
in Figure 12.  
(5)  
LOW NOISE INTEGRATOR  
The LMH6624/LMH6626 implement a deBoo integrator  
shown in Figure 9. Positive feedback maintains integration  
linearity. The LMH6624/LMH6626’s low input offset voltage  
and matched inputs allow bias current cancellation and pro-  
vide for very precise integration. Keeping RG and RS low  
helps maintain dynamic stability.  
www.national.com  
16  
the PCB layout is mandatory. Generally, a good high fre-  
quency layout exhibits a separation of power supply and  
ground traces from the inverting input and output pins. Para-  
sitic capacitances between these nodes and ground may  
cause frequency response peaking and possible circuit os-  
cillations (see Application Note OA-15 for more information).  
Use high quality chip capacitors with values in the range of  
1000pF to 0.1F for power supply bypassing. One terminal of  
each chip capacitor is connected to the ground plane and the  
other terminal is connected to a point that is as close as  
possible to each supply pin as allowed by the manufacturer’s  
design rules. In addition, connect a tantalum capacitor with a  
value between 4.7µF and 10µF in parallel with the chip  
capacitor. Signal lines connecting the feedback and gain  
resistors should be as short as possible to minimize induc-  
tance and microstrip line effect. Place input and output ter-  
mination resistors as close as possible to the input/output  
pins. Traces greater than 1 inch in length should be imped-  
ance matched to the corresponding load termination.  
Application Section (Continued)  
20058931  
FIGURE 11. Noise Magnetic Media Equalizer  
Symmetry between the positive and negative paths in the  
layout of differential circuitry should be maintained to mini-  
mize the imbalance of amplitude and phase of the differential  
signal.  
These free evaluation boards are shipped when a device  
sample request is placed with National Semiconductor.  
Component value selection is another important parameter  
in working with high speed/high performance amplifiers.  
Choosing external resistors that are large in value compared  
to the value of other critical components will affect the closed  
loop behavior of the stage because of the interaction of  
these resistors with parasitic capacitances. These parasitic  
capacitors could either be inherent to the device or be a  
by-product of the board layout and component placement.  
Moreover, a large resistor will also add more thermal noise to  
the signal path. Either way, keeping the resistor values low  
will diminish this interaction. On the other hand, choosing  
very low value resistors could load down nodes and will  
contribute to higher overall power dissipation and high dis-  
tortion.  
20058932  
FIGURE 12. Equalizer Frequency Response  
Device  
Package  
Evaluation Board Part  
Number  
LAYOUT CONSIDERATION  
LMH6624MF  
SOT23–5  
CLC730216  
National Semiconductor suggests the copper patterns on the  
evaluation boards listed below as a guide for high frequency  
layout. These boards are also useful as an aid in device  
testing and characterization. As is the case with all high-  
speed amplifiers, accepted-practice RF design technique on  
LMH6624MA SOIC-8  
LMH6626MA SOIC-8  
LMH6626MM MSOP-8  
CLC730227  
CLC730036  
CLC730123  
17  
www.national.com  
Physical Dimensions inches (millimeters) unless otherwise noted  
5-Pin SOT23  
NS Package Number MF05A  
8-Pin SOIC  
NS Package Number M08A  
www.national.com  
18  
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)  
8-Pin MSOP  
NS Package Number MUA08A  
National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves  
the right at any time without notice to change said circuitry and specifications.  
For the most current product information visit us at www.national.com.  
LIFE SUPPORT POLICY  
NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS  
WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT AND GENERAL COUNSEL OF NATIONAL SEMICONDUCTOR  
CORPORATION. As used herein:  
1. Life support devices or systems are devices or systems  
which, (a) are intended for surgical implant into the body, or  
(b) support or sustain life, and whose failure to perform when  
properly used in accordance with instructions for use  
provided in the labeling, can be reasonably expected to result  
in a significant injury to the user.  
2. A critical component is any component of a life support  
device or system whose failure to perform can be reasonably  
expected to cause the failure of the life support device or  
system, or to affect its safety or effectiveness.  
BANNED SUBSTANCE COMPLIANCE  
National Semiconductor manufactures products and uses packing materials that meet the provisions of the Customer Products  
Stewardship Specification (CSP-9-111C2) and the Banned Substances and Materials of Interest Specification (CSP-9-111S2) and contain  
no ‘‘Banned Substances’’ as defined in CSP-9-111S2.  
Leadfree products are RoHS compliant.  
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Fax: +49 (0) 180-530 85 86  
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