LM78M05CDT/NOPB [NSC]

IC VREG 5 V FIXED POSITIVE REGULATOR, PSSO3, ROHS COMPLIANT, TO-252, 3 PIN, Fixed Positive Single Output Standard Regulator;
LM78M05CDT/NOPB
型号: LM78M05CDT/NOPB
厂家: National Semiconductor    National Semiconductor
描述:

IC VREG 5 V FIXED POSITIVE REGULATOR, PSSO3, ROHS COMPLIANT, TO-252, 3 PIN, Fixed Positive Single Output Standard Regulator

输出元件 调节器
文件: 总11页 (文件大小:726K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
August 2005  
LM341/LM78MXX Series  
3-Terminal Positive Voltage Regulators  
General Description  
Features  
n Output current in excess of 0.5A  
n No external components  
The LM341 and LM78MXX series of three-terminal positive  
voltage regulators employ built-in current limiting, thermal  
shutdown, and safe-operating area protection which makes  
them virtually immune to damage from output overloads.  
n Internal thermal overload protection  
n Internal short circuit current-limiting  
n Output transistor safe-area compensation  
n Available in TO-220, TO-39, and TO-252 D-PAK  
packages  
With adequate heatsinking, they can deliver in excess of  
0.5A output current. Typical applications would include local  
(on-card) regulators which can eliminate the noise and de-  
graded performance associated with single-point regulation.  
n Output voltages of 5V, 12V, and 15V  
Connection Diagrams  
TO-39 Metal Can Package (H)  
01048405  
Bottom View  
Order Number LM78M05CH, LM78M12CH or LM78M15CH  
See NS Package Number H03A  
TO-220 Power Package (T)  
01048406  
Top View  
Order Number LM341T-5.0, LM341T-12, LM341T-15, LM78M05CT, LM78M12CT or LM78M15CT  
See NS Package Number T03B  
TO-252  
01048419  
Top View  
Order Number LM78M05CDT  
See NS Package Number TD03B  
© 2005 National Semiconductor Corporation  
DS010484  
www.national.com  
Absolute Maximum Ratings (Note 1)  
If Military/Aerospace specified devices are required,  
please contact the National Semiconductor Sales Office/  
Distributors for availability and specifications.  
Operating Junction Temperature  
Range  
−40˚C to +125˚C  
Internally Limited  
Power Dissipation (Note 2)  
Input Voltage  
Lead Temperature (Soldering, 10 seconds)  
5V VO 15V  
35V  
TO-39 Package (H)  
TO-220 Package (T)  
300˚C  
260˚C  
ESD Susceptibility  
TBD  
Storage Temperature Range  
−65˚C to +150˚C  
Electrical Characteristics  
Limits in standard typeface are for TJ = 25˚C, and limits in boldface type apply over the −40˚C to +125˚C operating temperature  
range. Limits are guaranteed by production testing or correlation techniques using standard Statistical Quality Control (SQC)  
methods.  
LM341-5.0, LM78M05C  
Unless otherwise specified: VIN = 10V, CIN = 0.33 µF, CO = 0.1 µF  
Symbol  
VO  
Parameter  
Output Voltage  
Conditions  
Min  
4.8  
Typ  
5.0  
5.0  
Max  
5.2  
Units  
IL= 500 mA  
V
5 mA IL 500 mA  
4.75  
5.25  
PD 7.5W, 7.5V VIN 20V  
VR LINE  
Line Regulation  
7.2V VIN 25V  
IL = 100 mA  
IL = 500 mA  
50  
100  
100  
10.0  
0.5  
mV  
mA  
VR LOAD  
IQ  
Load Regulation  
5 mA IL 500 mA  
IL = 500 mA  
Quiescent Current  
4
IQ  
Quiescent Current Change  
5 mA IL 500 mA  
7.5V VIN 25V, IL = 500 mA  
f = 10 Hz to 100 kHz  
1.0  
Vn  
Output Noise Voltage  
Ripple Rejection  
40  
78  
µV  
dB  
V
f = 120 Hz, IL = 500 mA  
VIN  
Input Voltage Required  
to Maintain Line Regulation  
Long Term Stability  
IL = 500 mA  
IL = 500 mA  
7.2  
VO  
20  
mV/khrs  
www.national.com  
2
Electrical Characteristics  
Limits in standard typeface are for TJ = 25˚C, and limits in boldface type apply over the −40˚C to +125˚C operating temperature  
range. Limits are guaranteed by production testing or correlation techniques using standard Statistical Quality Control (SQC)  
methods. (Continued)  
LM341-12, LM78M12C  
Unless otherwise specified: VIN = 19V, CIN = 0.33 µF, CO = 0.1 µF  
Symbol  
VO  
Parameter  
Output Voltage  
Conditions  
Min  
11.5  
11.4  
Typ  
12  
Max  
12.5  
12.6  
Units  
IL= 500 mA  
V
5 mA IL 500 mA  
12  
PD 7.5W, 14.8V VIN 27V  
VR LINE  
Line Regulation  
14.5V VIN 30V  
IL = 100 mA  
IL = 500 mA  
120  
240  
240  
10.0  
0.5  
mV  
mA  
VR LOAD  
IQ  
Load Regulation  
5 mA IL 500 mA  
IL = 500 mA  
Quiescent Current  
4
IQ  
Quiescent Current Change  
5 mA IL 500 mA  
14.8V VIN 30V, IL = 500 mA  
f = 10 Hz to 100 kHz  
1.0  
Vn  
Output Noise Voltage  
Ripple Rejection  
75  
71  
µV  
dB  
V
f = 120 Hz, IL = 500 mA  
VIN  
Input Voltage Required  
to Maintain Line Regulation  
Long Term Stability  
IL = 500 mA  
IL = 500 mA  
14.5  
VO  
48  
mV/khrs  
LM341-15, LM78M15C  
Unless otherwise specified: VIN = 23V, CIN = 0.33 µF, CO = 0.1 µF  
Symbol Parameter Conditions  
VO Output Voltage  
Min  
14.4  
Typ  
15  
Max  
15.6  
Units  
IL= 500 mA  
V
5 mA IL 500 mA  
14.25  
15  
15.75  
PD 7.5W, 18V VIN 30V  
VR LINE  
Line Regulation  
17.6V VIN 30V  
IL = 100 mA  
IL = 500 mA  
150  
300  
300  
10.0  
0.5  
mV  
mA  
VR LOAD  
IQ  
Load Regulation  
5 mA IL 500 mA  
IL = 500 mA  
Quiescent Current  
4
IQ  
Quiescent Current Change  
5 mA IL 500 mA  
18V VIN 30V, IL = 500 mA  
f = 10 Hz to 100 kHz  
1.0  
Vn  
Output Noise Voltage  
Ripple Rejection  
90  
69  
µV  
dB  
V
f = 120 Hz, IL = 500 mA  
VIN  
Input Voltage Required  
to Maintain Line Regulation  
Long Term Stability  
IL = 500 mA  
IL = 500 mA  
17.6  
VO  
60  
mV/khrs  
Note 1: Absolute maximum ratings indicate limits beyond which damage to the component may occur. Electrical specifications do not apply when operating the  
device outside of its rated operating conditions.  
Note 2: The typical thermal resistance of the three package types is:  
T (TO-220) package: θ  
H (TO-39) package: θ  
= 60 ˚C/W, θ  
= 5 ˚C/W  
= 18 ˚C/W  
= 10 ˚C/W  
(JA)  
(JC)  
= 120 ˚C/W, θ  
(JA)  
(JC)  
DT (TO-252) package: θ  
= 92 ˚C/W, θ  
(JC)  
(JA)  
3
www.national.com  
Schematic Diagram  
01048401  
www.national.com  
4
Typical Performance Characteristics  
Peak Output Current  
Ripple Rejection  
01048410  
01048411  
Ripple Rejection  
Dropout Voltage  
01048412  
01048413  
Output Voltage (Normalized  
to 1V at TJ = 25˚C)  
Quiescent Current  
01048415  
01048414  
5
www.national.com  
Typical Performance Characteristics (Continued)  
Quiescent Current  
Output Impedance  
01048416  
01048417  
Line Transient Response  
Load Transient Response  
01048407  
01048408  
duction heat transfer is demonstrated in The heat generated  
at the device junction flows through the die to the die attach  
pad, through the lead frame to the surrounding case mate-  
rial, to the printed circuit board, and eventually to the ambi-  
ent environment. Below is a list of variables that may affect  
the thermal resistance and in turn the need for a heatsink.  
Design Considerations  
The LM78MXX/LM341XX fixed voltage regulator series has  
built-in thermal overload protection which prevents the de-  
vice from being damaged due to excessive junction tem-  
perature.  
The regulators also contain internal short-circuit protection  
which limits the maximum output current, and safe-area  
protection for the pass transistor which reduces the short-  
circuit current as the voltage across the pass transistor is  
increased.  
RθJC(Component  
Variables)  
RθCA(Application  
Variables)  
Leadframe Size & Material Mounting Pad Size,  
Material, & Location  
Although the internal power dissipation is automatically lim-  
ited, the maximum junction temperature of the device must  
be kept below +125˚C in order to meet data sheet specifica-  
tions. An adequate heatsink should be provided to assure  
this limit is not exceeded under worst-case operating condi-  
tions (maximum input voltage and load current) if reliable  
performance is to be obtained).  
No. of Conduction Pins  
Die Size  
Placement of Mounting Pad  
PCB Size & Material  
Traces Length & Width  
Adjacent Heat Sources  
Die Attach Material  
Molding Compound Size  
and Material  
Volume of Air  
1.0 HEATSINK CONSIDERATIONS  
Air Flow  
When an integrated circuit operates with appreciable cur-  
rent, its junction temperature is elevated. It is important to  
quantify its thermal limits in order to achieve acceptable  
performance and reliability. This limit is determined by sum-  
ming the individual parts consisting of a series of tempera-  
ture rises from the semiconductor junction to the operating  
environment. A one-dimension steady-state model of con-  
Ambient Temperature  
Shape of Mounting Pad  
www.national.com  
6
The LM78MXX/LM341XX regulators have internal thermal  
shutdown to protect the device from over-heating. Under all  
possible operating conditions, the junction temperature of  
the LM78MXX/LM341XX must be within the range of 0˚C to  
125˚C. A heatsink may be required depending on the maxi-  
mum power dissipation and maximum ambient temperature  
of the application. To determine if a heatsink is needed, the  
power dissipated by the regulator, PD, must be calculated:  
Application Information  
IIN = IL + IG  
PD = (VIN−VOUT) IL + VIN G  
I
01048423  
shows the voltages and currents which are present in the  
circuit.  
FIGURE 1. Cross-sectional view of Integrated Circuit  
Mounted on a printed circuit board. Note that the case  
temperature is measured at the point where the leads  
contact with the mounting pad surface  
01048424  
FIGURE 2. Power Dissipation Diagram  
The next parameter which must be calculated is the maxi-  
mum allowable temperature rise, TR(max):  
we used to measure these θJA are shown at the end of the  
Application Note Section. reflects the same test results as  
what are in the Table 1  
θJA = TR (max)/PD  
shows the maximum allowable power dissipation vs. ambi-  
ent temperature for theTO-252 device. shows the maximum  
allowable power dissipation vs. copper area (in2) for the  
TO-252 device. Please see AN1028 for power enhancement  
techniques to be used with TO-252 package.  
If the maximum allowable value for θJA˚C/w is found to be  
60˚C/W for TO-220 package or 92˚C/W for TO-252 pack-  
age, no heatsink is needed since the package alone will  
dissipate enough heat to satisfy these requirements. If the  
calculated value for θJA fall below these limits, a heatsink is  
required.  
As a design aid, Table 1 shows the value of the θJA of  
TO-252 for different heatsink area. The copper patterns that  
7
www.national.com  
Application Information (Continued)  
TABLE 1. θJA Different Heatsink Area  
Layout  
Copper Area  
Thermal Resistance  
Top Sice (in2)*  
Bottom Side (in2)  
(θJA, ˚C/W) TO-252  
1
2
0.0123  
0.066  
0.3  
0
0
103  
87  
60  
54  
52  
47  
84  
70  
63  
57  
57  
89  
72  
61  
55  
53  
3
0
4
0.53  
0.76  
1
0
5
0
6
0
7
0
0.2  
0.4  
0.6  
0.8  
1
8
0
9
0
10  
11  
12  
13  
14  
15  
16  
0
0
0.066  
0.175  
0.284  
0.392  
0.5  
0.066  
0.175  
0.284  
0.392  
0.5  
*Tab of device attached to topside copper  
www.national.com  
8
Application Information (Continued)  
01048421  
01048420  
FIGURE 5. Maximum Allowable Power Dissipation vs.  
2oz. Copper Area for TO-252  
FIGURE 3. θJA vs. 2oz Copper Area for TO-252  
Typical Application  
01048409  
*Required if regulator input is more than 4 inches from input filter capacitor  
(or if no input filter capacitor is used).  
01048422  
**Optional for improved transient response.  
FIGURE 4. Maximum Allowable Power Dissipation vs.  
Ambient Temperature for TO-252  
9
www.national.com  
Physical Dimensions inches (millimeters) unless otherwise noted  
TO-39 Metal Can Package (H)  
Order Number LM78M05CH, LM78M12CH or LM78M15CH  
NS Package Number H03A  
TO-220 Power Package (T)  
Order Number LM341T-5.0, LM341T-12, LM341T-15, LM78M05CT, LM78M12CT or LM78M15CT  
NS Package Number T03B  
www.national.com  
10  
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)  
TO-252  
Order Number LM78M05CDT  
NS Package Number TD03B  
National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves  
the right at any time without notice to change said circuitry and specifications.  
For the most current product information visit us at www.national.com.  
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NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS  
WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT AND GENERAL COUNSEL OF NATIONAL SEMICONDUCTOR  
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which, (a) are intended for surgical implant into the body, or  
(b) support or sustain life, and whose failure to perform when  
properly used in accordance with instructions for use  
provided in the labeling, can be reasonably expected to result  
in a significant injury to the user.  
2. A critical component is any component of a life support  
device or system whose failure to perform can be reasonably  
expected to cause the failure of the life support device or  
system, or to affect its safety or effectiveness.  
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