LM4570 [NSC]
Single-Ended Input Motor Driver; 单端输入电机驱动器![LM4570](http://pdffile.icpdf.com/pdf1/p00101/img/icpdf/LM4570_540297_icpdf.jpg)
型号: | LM4570 |
厂家: | ![]() |
描述: | Single-Ended Input Motor Driver |
文件: | 总12页 (文件大小:620K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
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April 2006
LM4570
Single-Ended Input Motor Driver
General Description
Key Specifications
The LM4570 is a single supply motor driver for improved
sensory experience in mobile phones and other handheld
devices. The LM4570 is capable of driving up to 192mA
while operating from a 3V supply. Near rail-to-rail output
swing under load ensures sufficient voltage drive for most
DC motors, while the differential output drive allows the
voltage polarity across the motor to be reversed quickly.
Reversing the voltage gives the LM4570 the ability to drive a
motor both clock-wise and counter clock-wise from a single
supply.
j
j
j
j
@
High Output Current VDD = 3V
192mA
2.4ms
@
Fast Turn On Time 3V
@
Quiescent Power Supply Current 3V
Shutdown Current
1.9mA
0.1µA (typ)
Features
n Output Short Circuit Protection
n High Output Current Capability
n Wide Output Voltage Range
n Fast Turn on Time
The LM4570 features fast turn on time, and a wide input
voltage range for precise speed control. A low power shut-
down mode minimizes power consumption.
n Output Short Circuit Protection
n Low Power Shutdown Mode
n Minimum external components
n Available in space-saving LLP package
Thermal and output short circuit protection prevents the
device from being damaged during fault conditions.
Applications
n Mobile Phones
n PDAs
n Video Game Systems
Typical Application
20186326
FIGURE 1. Typical Motor Driver Application Circuit
© 2006 National Semiconductor Corporation
DS201863
www.national.com
Connection Diagrams
Leadless Leadframe Package (LLP)
LQ Package
20186325
Top View
Order Number LM4570LQ
See NS Package Number LQB08A
LLP Marking
20186327
Top View
X - One digit date code
TT - Lot traceability
G - Boomer Family
C8 - LM4570LQ
www.national.com
2
Absolute Maximum Ratings (Note 2)
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
Junction Temperature (TJMAX
Thermal Resistance
θJA (LLP)
)
150˚C
140˚C/W
Supply Voltage (Note 1)
Storage Temperature
6.0V
−65˚C to +150˚C
−0.3V ≥ to VDD +0.3V
Internally Limited
2000V
Operating Ratings
Temperature Range
TMIN ≤ TA ≤ TMAX
Supply Voltage
Voltage at Any Input Pin
Power Dissipation (Note 3)
ESD Susceptibility (Note 4)
ESD Susceptibility (Note 5)
−40˚C ≤ TA ≤ 85˚C
2.4V ≤ VDD ≤ 5.5V
200V
Electrical Characteristics VDD = 5V (Notes 1, 2)
The following specifications apply for VDD = 5V, AV-BTL = 6dB unless otherwise specified. Limits apply for TA = 25˚C.
LM4570
Units
(Limits)
Symbol
Parameter
Conditions
Typical
(Note 6)
2.5
Limit
(Notes 7, 8)
VIN = 0V, IL = 0A, No Load
VIN = 0V, IL = 0A, RL = 30Ω
VSD = GND
5.5
5.5
1.5
1.4
0.4
35
IDD
Quiescent Power Supply Current
mA (max)
2.6
ISD
Shutdown Current
Logic Input High
Logic Input Low
Output Offset Voltage
Output Current
0.1
µA (max)
V (min)
V (max)
mV (max)
mA
VIH
VIL
VOS
IOUT
TWU
5
VOH, VOL ≤ 250mV
268
2.5
Wake-up time
ms (max)
RL = 30Ω specified as
VOH
VOL
Output High Voltage
Output Low Voltage
146
106
200
200
mV (max)
mV (max)
|VDD - VOH
RL = 30Ω specified as
|GND + VOH
|
|
Electrical Characteristics VDD = 3V (Notes 1, 2)
The following specifications apply for VDD = 3V, AV-BTL = 6dB unless otherwise specified. Limits apply for TA = 25˚C.
LM4570
Units
(Limits)
Symbol
Parameter
Conditions
Typical
(Note 6)
1.9
Limit
(Notes 7, 8)
VIN = 0V, IL = 0A, No Load
VIN = 0V, IL = 0A, RL = 30Ω
VSD = GND
4
IDD
Quiescent Power Supply Current
mA (max)
1.95
4
ISD
Shutdown Current
Logic Input High
Logic Input Low
Output Offset Voltage
Output Current
0.1
1.0
1.4
0.4
35
µA (max)
V (min)
V (max)
mV (max)
mA
VIH
VIL
VOS
IOUT
TWU
5
VOH, VOL ≤ 200mV
192
2.4
Wake-up time
ms (max)
RL = 30Ω specified as
VOH
VOL
Output High Voltage
Output Low Voltage
90
63
110
110
mV (max)
mV (max)
|VDD - VOH
RL = 30Ω specified as
|VDD - VOH
|
|
3
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Note 1: All voltages are measured with respect to the ground pin, unless otherwise specified.
Note 2: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is
functional, but do not guarantee specific performance limits. Electrical Characteristics state DC and AC electrical specifications under particular test conditions which
guarantee specific performance limits. This assumes that the device is within the Operating Ratings. Specifications are not guaranteed for parameters where no limit
is given; however, the typical value is a good indication of device performance.
Note 3: The maximum power dissipation must be de-rated at elevated temperatures and is dictated by T
, θ , and the ambient temperature T . The maximum
A
JMAX JC
allowable power dissipation is P
= (T
–T )/ θ or the number given in the Absolute Maximum Ratings, whichever is lower. For the LM4570, T
= 150˚C
DMAX
JMAX
A
JA
JMAX
and the typical θ for the LLP package is 140˚C/W.
JA
Note 4: Human body model, 100pF discharged through a 1.5kΩ resistor.
Note 5: Machine Model, 220pF–240pF discharged through all pins.
Note 6: Typicals are measured at 25˚C and represent the parametric norm.
Note 7: Limits are guaranteed to National’s AOQL (Average Outgoing Quality Level).
Note 8: Datasheet min/max specification limits are guaranteed by design, test, or statistical analysis.
Note 9: Shutdown current is measured in a normal room environment. Exposure to direct sunlight will increase I by a maximum of 2µA.
SD
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4
Typical Performance Characteristics
Output Low Voltage vs Load Current
VDD = 3V
Output Low Voltage vs Load Current
VDD = 5V
20186313
20186312
Output High Voltage vs Load Current
VDD = 3V
Output High Voltage vs Load Current
VDD = 5V
20186310
20186311
Output Voltage vs Input Voltage
Output Voltage vs Input Voltage
VDD = 3V, RL = 20Ω
VDD = 3V, RL = 30Ω
20186314
20186315
5
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Typical Performance Characteristics (Continued)
Output Voltage vs Input Voltage
Output Voltage vs Input Voltage
VDD = 5V, RL = 20Ω
VDD = 5V, RL = 30Ω
20186316
20186317
Power Dissipation vs Supply Voltage
Supply Current vs Supply Voltage
20186320
20186321
Slew Rate vs Supply Voltage
Shutdown Supply Current vs Supply Voltage
RL = 30Ω
20186323
20186319
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6
Typical Performance Characteristics (Continued)
Output Transition High to Low, Low to High
VDD = 3V, 1V/div, 400ns/div
Output Transition High to Low, Low to High
VDD = 5V, 1V/div, 1µs/div
20186306
20186307
Turn-Off Time
Turn-On Time
VDD = 5V, 2V/div, 1ms/div
VDD = 5V, 2V/div, 1ms/div
20186308
20186309
7
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Application Information
BRIDGE CONFIGURATION EXPLANATION
The LM4570 uses a bridged architecture that drives a load
differentially. The BTL design offers several advantages over
a single-ended design. The the device outputs, VO1 and
VO2, both source and sink current, which means that the
polarity of the voltage across the motor can be reversed
quickly (Figure 2). A single-ended device would need to
operate from split supplies to achieve this behavior. The
ability to reverse the voltage polarity is necessary in appli-
cations where a negative (reverse polarity) pulse is used to
quickly stop the motor. If the drive voltage is just removed
from the motor (not reversed) then the motor will continue to
spin until the residual energy stored in the windings has
dissipated.
VO1–VO2 = AVD(VIN–VREF1)
For input voltages that are less than the reference voltage,
the differential output voltage is negative. For input voltages
that are greater than the reference voltage, the differential
output voltage is positive. For example, when operating from
a 5V supply (VREF1 = 2.5V) and with a differential gain of
6dB, with a 1V input, the voltage measured across VO1 and
VO2 is -3V, with a 4V input, the differential output voltage is
+3V.
The output voltage of the LM4570 is determined by the
difference between the input voltage and VREF1 , as well as
the differential gain of the device. The output voltage is given
by the following:
20186302
FIGURE 2. Voltage Polarity and Motor Direction
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8
LM4570 with the input equal to the supply voltage, meaning
the outputs swing rail-to-rail. This configuration results in the
output devices of the LM4570 operating in the linear region,
essentially very small resistors determined by the RDS(ON) of
the output devices. Under these conditions, the power dissi-
pation is dominated by the I*R drop associated with the
output current across the RDS(ON) of the output transistors,
thus the power dissipation is very low (60mW for a 800mW
output).
Application Information (Continued)
GAIN SETTING
The resistors RIN and RF set the gain of the LM4570, given
by:
VVD = 2 x (RF / RIN
)
Where AVD is the differential gain. AVD differs from single-
ended gain by a factor of 2. This doubling is due to the
differential output architecture of the LM4570. Driving the
load differentially doubles the output voltage compared to a
single-ended output amplifier under the same conditions.
When the input voltage is not equal to GND or VDD, the
power dissipation of the LM4570 increases (Figure 3). Under
these conditions, the output devices operate in the satura-
tion region, where the devices consume current in addition to
the current being steered to the load, increasing the power
dissipation. Power dissipation for typical motor driving appli-
cations should not be an issue since the most of the time the
device outputs will be driven rail-to-rail.
POWER DISSIPATION
The Power Dissipation vs. Supply Voltage graph in the Op-
erating Curves section shows the power dissipation of the
20186328
FIGURE 3. Power Dissipation vs. Input Voltage
EXPOSED-DAP MOUNTING CONSIDERATIONS
to the device as possible. Typical applications employ a
regulator with a 10µF tantalum or electrolytic capacitor and a
ceramic bypass capacitor which aid in supply stability. This
does not eliminate the need for bypass capacitors near the
LM4570. Place a 1µF ceramic capacitor as close to VDD as
possible. Place a 0.1µF capacitor as close to REF1 as
possible. Smaller values of CREF1 may be chosen for de-
creased turn on times.
The LM4570 is available in an 8-pin LLP package which
features an exposed DAP (die attach paddle). The exposed
DAP provides a direct thermal conduction path between the
die and the PCB, improving the thermal performance by
reducing the thermal resistance of the package. Connect the
exposed DAP to GND through a large pad beneath the
device, and multiple vias to a large unbroken GND plane.
For best thermal performance, connect the DAP pad to a
GND plane on an outside layer of the PCB. Connecting the
DAP to a plane on an inner layer will result in a higher
thermal resistance. Ensure efficient thermal conductivity by
plugging and tenting the vias with plating and solder mask,
respectively.
SHUTDOWN FUNCTION
The LM4570 features a low power shutdown mode that
disables the device and reduces quiescent current con-
sumption to 0.1µA. Driving /SD Low disables the amplifiers
and bias circuitry, and drives VREF1and the outputs to GND.
Connect /SD to VDD for normal operation.
POWER SUPPLY BYPASSING
Good power supply bypassing is critical for proper operation.
Locate both the REF1 and VDD bypass capacitors as close
9
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Application Information (Continued)
DEMO BOARD LAYOUT
20186324
www.national.com
10
Revision History
Rev
Date
Description
1.0
04/13/06
Initial release
11
www.national.com
Physical Dimensions inches (millimeters) unless otherwise noted
LLP Package
Order Number LM4570LQ
NS Package Number LQB08A
National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves
the right at any time without notice to change said circuitry and specifications.
For the most current product information visit us at www.national.com.
LIFE SUPPORT POLICY
NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS
WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT AND GENERAL COUNSEL OF NATIONAL SEMICONDUCTOR
CORPORATION. As used herein:
1. Life support devices or systems are devices or systems
which, (a) are intended for surgical implant into the body, or
(b) support or sustain life, and whose failure to perform when
properly used in accordance with instructions for use
provided in the labeling, can be reasonably expected to result
in a significant injury to the user.
2. A critical component is any component of a life support
device or system whose failure to perform can be reasonably
expected to cause the failure of the life support device or
system, or to affect its safety or effectiveness.
BANNED SUBSTANCE COMPLIANCE
National Semiconductor manufactures products and uses packing materials that meet the provisions of the Customer Products
Stewardship Specification (CSP-9-111C2) and the Banned Substances and Materials of Interest Specification (CSP-9-111S2) and contain
no ‘‘Banned Substances’’ as defined in CSP-9-111S2.
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