LM3670MFX-ADJ/NOPB [NSC]

IC 0.75 A SWITCHING REGULATOR, 1300 kHz SWITCHING FREQ-MAX, PDSO5, ROHS COMPLIANT, SOT-23, 5 PIN, Switching Regulator or Controller;
LM3670MFX-ADJ/NOPB
型号: LM3670MFX-ADJ/NOPB
厂家: National Semiconductor    National Semiconductor
描述:

IC 0.75 A SWITCHING REGULATOR, 1300 kHz SWITCHING FREQ-MAX, PDSO5, ROHS COMPLIANT, SOT-23, 5 PIN, Switching Regulator or Controller

开关 光电二极管
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中文:  中文翻译
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January 2006  
LM3670  
Miniature Step-Down DC-DC Converter for Ultra Low  
Voltage Circuits  
General Description  
Features  
n VOUT = Adj (0.7V min), 1.2, 1.5, 1.6, 1.8, 1.875, 2.5,  
3.3V  
The LM3670 step-down DC-DC converter is optimized for  
powering ultra-low voltage circuits from a single Li-Ion cell or  
3 cell NiMH/NiCd batteries. It provides up to 350 mA load  
current, over an input voltage range from 2.5V to 5.5V. There  
are several different fixed voltage output options available as  
well as an adjustable output voltage version (see ordering  
information).  
n 2.5V VIN 5.5V  
n 15 µA typical quiescent current  
n 350 mA maximum load capability  
n 1 MHz PWM fixed switching frequency (typ.)  
n Automatic PFM/PWM mode switching  
n Available in fixed output voltages as well as an  
adjustable version  
The device offers superior features and performance for  
mobile phones and similar portable applications with com-  
plex power management systems. Automatic intelligent  
switching between PWM low-noise and PFM low-current  
mode offers improved system control. During full-power op-  
eration, a fixed-frequency 1 MHz (typ). PWM mode drives  
loads from 70 mA to 350 mA max, with up to 95% efficiency.  
Hysteretic PFM mode extends the battery life through reduc-  
tion of the quiescent current to 15 µA (typ) during light  
current loads and system standby. Internal synchronous rec-  
tification provides high efficiency (90 to 95% typ. at loads  
between 1 mA and 100 mA). In shutdown mode (Enable pin  
pulled low) the device turns off and reduces battery con-  
sumption to 0.1 µA (typ.).  
n SOT23-5 package  
n Low drop out operation - 100% duty cycle mode  
n Internal synchronous rectification for high efficiency  
n Internal soft start  
n 0.1 µA typical shutdown current  
n Operates from a single Li-Ion cell or 3 cell NiMH/NiCd  
batteries  
n Only three tiny surface-mount external components  
required (one inductor, two ceramic capacitors)  
n Current overload protection  
The LM3670 is available in a SOT23-5 package. A high  
switching frequency - 1 MHz (typ) - allows use of tiny  
surface-mount components. Only three external surface-  
mount components, an inductor and two ceramic capacitors,  
are required.  
Applications  
n Mobile phones  
n HandHeld  
n PDAs  
n Palm-top PCs  
n Portable Instruments  
n Battery Powered Devices  
Typical Application  
20075801  
FIGURE 1. Fixed Output Voltage - Typical Application Circuit  
© 2006 National Semiconductor Corporation  
DS200758  
www.national.com  
Typical Application (Continued)  
20075830  
FIGURE 2. Adjustable Output Voltage - Typical Application Circuit  
Connection Diagram and Package Mark Information  
SOT23-5 Package  
NS Package Number MF05A  
20075802  
Note: The actual physical placement of the package marking will vary from part to part.  
FIGURE 3. Top View  
Pin Descriptions  
Pin #  
Name  
Description  
1
2
3
4
5
VIN  
Power supply input. Connect to the input filter capacitor (Figure 1).  
Ground pin.  
GND  
EN  
Enable input.  
FB  
Feedback analog input. Connect to the output filter capacitor (Figure 1).  
Switching node connection to the internal PFET switch and NFET synchronous  
rectifier. Connect to an inductor with a saturation current rating that exceeds the  
750 mA max. Switch Peak Current Limit specification.  
SW  
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2
Ordering Information  
Voltage Option  
Order Number  
(Level 95)  
SPEC  
Supplied As  
(#/reel)  
1000  
3000  
1000  
3000  
1000  
3000  
1000  
3000  
1000  
3000  
1000  
3000  
1000  
3000  
1000  
3000  
1000  
3000  
1000  
3000  
1000  
3000  
1000  
3000  
1000  
3000  
1000  
3000  
1000  
3000  
1000  
3000  
Package Marking  
(V)  
3.3  
LM3670MF-3.3  
LM3670MFX-3.3  
LM3670MF-3.3  
LM3670MFX-3.3  
LM3670MF-2.5  
LM3670MFX-2.5  
LM3670MF-2.5  
LM3670MFX-2.5  
LM3670MF-1.875  
LM3670MFX-1.875  
LM3670MF-1.875  
LM3670MFX-1.875  
LM3670MF-1.8  
LM3670MFX-1.8  
LM3670MF-1.8  
LM3670MFX-1.8  
LM3670MF-1.6  
LM3670MFX-1.6  
LM3670MF-1.6  
LM3670MFX-1.6  
LM3670MF-1.5  
LM3670MFX-1.5  
LM3670MF-1.5  
LM3670MFX-1.5  
LM3670MF-1.2  
LM3670MFX-1.2  
LM3670MF-1.2  
LM3670MFX-1.2  
LM3670MF-ADJ  
LM3670MFX-ADJ  
LM3670MF-ADJ  
LM3670MFX-ADJ  
NOPB  
NOPB  
SDEB  
2.5  
1.875  
1.8  
NOPB  
NOPB  
SDDB  
SEFB  
SDCB  
SDBB  
S82B  
SCZB  
SDFB  
NOPB  
NOPB  
NOPB  
NOPB  
1.6  
NOPB  
NOPB  
1.5  
NOPB  
NOPB  
1.2  
NOPB  
NOPB  
Adjustable  
NOPB  
NOPB  
3
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Absolute Maximum Ratings (Note 1)  
If Military/Aerospace specified devices are required,  
please contact the National Semiconductor Sales Office/  
Distributors for availability and specifications.  
ESD Rating (Note 3)  
Human Body Model:  
VIN, SW, FB, EN, GND  
Machine Model:  
2.0kV  
200V  
VIN Pin: Voltage to GND  
EN Pin: Voltage to GND  
FB, SW Pin:  
−0.2V to 6.0V  
−0.2V to 6.0V  
(GND−0.2V) to  
(VIN + 0.2V)  
Operating Ratings (Notes 1, 2)  
Input Voltage Range  
2.5V to 5.5V  
Recommended Load Current  
0A to 350 mA  
Junction Temperature (TJ-MAX  
Storage Temperature Range  
Maximum Lead Temperature  
(Soldering, 10 sec.)  
)
−45˚C to +125˚C  
−45˚C to +150˚C  
260˚C  
Junction Temperature (TJ) Range  
Ambient Temperature (TA) Range  
−40˚C to +125˚C  
−40˚C to +85˚C  
Thermal Properties  
Junction-to-Ambient  
250˚C/W  
Thermal Resistance (θJA  
)
(SOT23-5)  
Electrical Characteristics Limits in standard typeface are for TJ = 25˚C. Limits in boldface type apply over  
the full operating junction temperature range (−40˚C TJ +125˚C). Unless otherwise noted VIN = 3.6V, VOUT = 1.8V, IO  
150mA, EN = VIN  
=
Symbol  
VIN  
Parameter  
Input Voltage Range  
Condition  
Min  
2.5  
Typ  
Max  
5.5  
Units  
V
(Note 5)  
VOUT  
Fixed Output Voltage: 1.2V  
2.5V VIN 5.5V  
IO = 10 mA  
-2.0  
+4.0  
%
2.5V VIN 5.5V  
0 mA IO 150 mA  
2.5V VIN 5.5V  
IO = 10 mA  
-4.5  
-2.5  
-5.0  
-2.5  
-5.5  
-1.5  
−4.5  
-2.0  
-6.0  
-2.5  
-4.0  
+4.0  
+4.0  
+4.0  
+4.0  
+4.0  
+3.0  
+3.0  
+4.0  
+4.0  
+4.5  
+4.5  
Fixed Output Voltage: 1.5V  
%
%
2.5V VIN 5.5V  
0 mA IO 350 mA  
2.5V VIN 5.5V  
IO = 10 mA  
Fixed Output Voltage: 1.6V,  
1.875V  
2.5V VIN 5.5V  
0 mA IO 350 mA  
2.5V VIN 5.5V  
IO = 10 mA  
Fixed Output Voltage: 1.8V  
%
2.5V VIN 5.5V  
0 mA IO 350 mA  
3.6V VIN 5.5V  
IO = 10 mA  
Fixed Output Voltage: 2.5V,  
3.3V  
%
3.6V VIN 5.5V  
0 mA IO 350 mA  
2.5V VIN 5.5V  
IO = 10 mA  
Adjustable Output Voltage  
(Note 4)  
%
2.5V VIN 5.5V  
0 mA IO 150 mA  
2.5V VIN 5.5V  
IO = 10 mA  
Line_reg  
Line Regulation  
0.26  
%/V  
Load_reg  
VREF  
Load Regulation  
150 mA IO 350 mA  
0.0014  
0.5  
%/mA  
V
Internal Reference Voltage  
Shutdown Supply Current  
IQ_SHDN  
TA=85oC  
0.1  
1
µA  
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4
Electrical Characteristics Limits in standard typeface are for TJ = 25˚C. Limits in boldface type apply over  
the full operating junction temperature range (−40˚C TJ +125˚C). Unless otherwise noted VIN = 3.6V, VOUT = 1.8V, IO  
150mA, EN = VIN (Continued)  
=
Symbol  
Parameter  
Condition  
Min  
Typ  
Max  
30  
Units  
IQ  
DC Bias Current into VIN  
No load, device is not switching  
(VOUT forced higher than  
programmed output voltage)  
15  
µA  
VUVLO  
Minimum VIN below which VOUT  
will be disabled  
V
2.4  
RDSON (P)  
RDSON (N)  
ILKG (P)  
ILKG (N)  
ILIM  
Pin-Pin Resistance for PFET  
Pin-Pin Resistance for NFET  
P Channel Leakage Current  
N Channel Leakage Current  
Switch Peak Current Limit  
Efficiency  
VIN=VGS=3.6V  
VIN=VGS=3.6V  
VDS=5.5V  
360  
250  
0.1  
0.1  
620  
91  
690  
660  
1
mΩ  
mΩ  
µA  
VDS=5.5V  
1.5  
750  
µA  
400  
mA  
η
ILOAD = 1 mA  
(VIN = 3.6V, VOUT = 1.8V)  
ILOAD = 10 mA  
ILOAD = 100 mA  
ILOAD = 200 mA  
ILOAD = 300 mA  
ILOAD = 350 mA  
94  
94  
%
94  
92  
90  
VIH  
Logic High Input  
1.3  
V
V
VIL  
Logic Low Input  
0.4  
1
IEN  
Enable (EN) Input Current  
Internal Oscillator Frequency  
0.01  
µA  
kHz  
FOSC  
PWM Mode  
550  
1000  
1300  
Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under which operation of  
the device is guaranteed. Operating Ratings do not imply guaranteed performance limits. For guaranteed performance limits and associated test conditions, see the  
Electrical Characteristics tables.  
Note 2: All voltages are with respect to the potential at the GND pin.  
Note 3: The Human body model is a 100 pF capacitor discharged through a 1.5 kresistor into each pin. The machine model is a 200 pF capacitor discharged  
directly into each pin. MIL-STD-883 3015.7  
Note 4: Output voltage specification for the adjustable version includes tolerance of the external resistor divider.  
Note 5: The input voltage range recommended for the specified output voltages are given below:  
<
OUT  
V
IN  
V
IN  
= 2.5V to 5.5V for 0.7V V  
1.875V  
= ( V  
+ V  
) to 5.5V for 1.875 V  
3.3V  
OUT  
OUT  
DROP OUT  
Where V  
= I  
* (R  
+ R  
)
INDUCTOR  
DROP OUT  
LOAD  
DSON (P)  
5
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20075832  
FIGURE 4. Simplified Functional Diagram  
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6
Typical Performance Characteristics (unless otherwise stated: VIN= 3.6V, VOUT= 1.8V)  
IQ (Non-switching) vs. VIN  
IQ vs. Temp  
20075805  
20075804  
VOUT vs. VIN  
VOUT vs. IOUT  
20075806  
20075807  
Efficiency vs. IOUT  
Efficiency vs. VIN  
20075808  
20075809  
7
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Typical Performance Characteristics (unless otherwise stated: VIN= 3.6V, VOUT= 1.8V) (Continued)  
RDSON vs. VIN  
Frequency vs. Temperature  
P & N Channel  
20075810  
20075811  
Line Transient  
(VIN = 2.6V to 3.6V, ILOAD = 100 mA)  
Line Transient  
(VIN = 3.6V to 4.6V , ILOAD = 100 mA)  
20075812  
20075813  
Load Transient  
Load Transient  
ILOAD = 3mA to 280mA  
ILOAD = 0mA to 70mA  
20075817  
20075816  
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8
Typical Performance Characteristics (unless otherwise stated: VIN= 3.6V, VOUT= 1.8V) (Continued)  
Load Transient  
Load Transient  
ILOAD = 0mA to 280mA  
ILOAD = 0mA to 350mA  
20075818  
20075819  
Load Transient  
Load Transient  
ILOAD = 50mA to 350mA  
ILOAD = 100mA to 300mA  
20075820  
20075821  
PFM Mode  
PWM Mode  
VSW, VOUT, IINDUCTOR vs. Time  
VSW, VOUT, IINDUCTOR vs. Time  
20075822  
20075823  
9
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Typical Performance Characteristics (unless otherwise stated: VIN= 3.6V, VOUT= 1.8V) (Continued)  
Soft Start  
V
IN, VOUT, IINDUCTOR vs. Time  
(ILOAD = 350mA)  
20075824  
by storing energy in a magnetic field. During the second  
portion of each cycle, the controller turns the PFET switch  
off, blocking current flow from the input, and then turns the  
NFET synchronous rectifier on. The inductor draws current  
from ground through the NFET to the output filter capacitor  
and load, which ramps the inductor current down with a  
slope of  
Operation Description  
DEVICE INFORMATION  
The LM3670, a high efficiency step down DC-DC switching  
buck converter, delivers a constant voltage from either a  
single Li-Ion or three cell NiMH/NiCd battery to portable  
devices such as cell phones and PDAs. Using a voltage  
mode architecture with synchronous rectification, the  
LM3670 has the ability to deliver up to 350 mA depending on  
the input voltage and output voltage (voltage head room),  
and the inductor chosen (maximum current capability).  
There are three modes of operation depending on the cur-  
rent required - PWM (Pulse Width Modulation), PFM (Pulse  
Frequency Modulation), and shutdown. PWM mode handles  
current loads of approximately 70 mA or higher. Lighter  
output current loads cause the device to automatically switch  
into PFM for reduced current consumption (IQ = 15 µA typ)  
and a longer battery life. Shutdown mode turns off the de-  
The output filter stores charge when the inductor current is  
high, and releases it when low, smoothing the voltage across  
the load.  
PWM OPERATION  
During PWM operation the converter operates as a voltage-  
mode controller with input voltage feed forward. This allows  
the converter to achieve excellent load and line regulation.  
The DC gain of the power stage is proportional to the input  
voltage. To eliminate this dependence, feed forward in-  
versely proportional to the input voltage is introduced.  
vice,  
offering  
the  
lowest  
current  
consumption  
(ISHUTDOWN = 0.1 µA typ).  
The LM3670 can operate up to a 100% duty cycle (PMOS  
switch always on) for low drop out control of the output  
voltage. In this way the output voltage will be controlled  
down to the lowest possible input voltage.  
Internal Synchronous Rectification  
Additional features include soft-start, under voltage lock out,  
current overload protection, and thermal overload protection.  
As shown in Figure 1, only three external power components  
are required for implementation.  
While in PWM mode, the LM3670 uses an internal NFET as  
a synchronous rectifier to reduce rectifier forward voltage  
drop and associated power loss. Synchronous rectification  
provides a significant improvement in efficiency whenever  
the output voltage is relatively low compared to the voltage  
drop across an ordinary rectifier diode.  
CIRCUIT OPERATION  
The LM3670 operates as follows. During the first portion of  
each switching cycle, the control block in the LM3670 turns  
on the internal PFET switch. This allows current to flow from  
the input through the inductor to the output filter capacitor  
and load. The inductor limits the current to a ramp with a  
slope of  
Current Limiting  
A current limit feature allows the LM3670 to protect itself and  
external components during overload conditions PWM mode  
implements cycle-by-cycle current limiting using an internal  
comparator that trips at 620 mA (typ).  
PFM OPERATION  
At very light load, the converter enters PFM mode and  
operates with reduced switching frequency and supply cur-  
rent to maintain high efficiency.  
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10  
Operation Description (Continued)  
The part automatically transition into PFM mode when either  
of two conditions occurs for a duration of 32 or more clock  
cycles:  
Once the PMOS power switch is turned off, the NMOS  
power switch is turned on until the inductor current ramps to  
zero. When the NMOS zero-current condition is detected,  
the NMOS power switch is turned off. If the output voltage is  
below the ‘high’ PFM comparator threshold (see Figure 5),  
the PMOS switch is again turned on and the cycle is re-  
peated until the output reaches the desired level. Once the  
output reaches the ‘high’ PFM threshold, the NMOS switch is  
turned on briefly to ramp the inductor current to zero and  
then both output switches are turned off and the part enters  
an extremely low power mode. Quiescent supply current  
during this ‘sleep’ mode is less than 30 µA, which allows the  
part to achieve high efficiencies under extremely light load  
conditions. When the output drops below the ‘low’ PFM  
threshold, the cycle repeats to restore the output voltage to  
1.6% above the nominal PWM output voltage.  
A. The inductor current becomes discontinuous  
B. The peak PMOS switch current drops below the IMODE  
level:  
During PFM operation, the converter positions the output  
voltage slightly higher than the nominal output voltage in  
PWM operation, allowing additional headroom for voltage  
drop during a load transient from light to heavy load. The  
PFM comparator senses the output voltage via the feedback  
pin and control the switching of the output FETs such that the  
output voltage ramps between 0.8% and 1.6% (typ) above  
the nominal PWM output voltage. If the output voltage is  
below the ‘high’ PFM comparator threshold, the PMOS  
power switch is turned on. It remains on until the output  
voltage exceeds the ‘high’ PFM threshold or the peak current  
exceeds the IPFM level set for PFM mode. The peak current  
in PFM mode is:  
If the load current should increase during PFM mode (see  
Figure 5) causing the output voltage to fall below the ‘low2’  
PFM threshold, the part automatically transitions into fixed-  
frequency PWM mode.  
20075803  
FIGURE 5. Operation in PFM Mode and Transition to PWM Mode  
Soft-Start  
Inrush Current (mA)  
Duration (µSec)  
256  
The LM3670 has a soft-start circuit that limits in-rush current  
during start-up. Typical start-up times with a 10µF output  
capacitor and 350mA load is 400µs:  
280  
620  
until soft start ends  
Note 6: The first 32µS are to allow the bias currents to stabilize  
Inrush Current (mA)  
Duration (µSec)  
0
32  
70  
224  
256  
140  
11  
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Operation Description (Continued)  
LDO - Low Drop Out Operation  
The LM3670 can operate at 100% duty cycle (no switching,  
PMOS switch is completely on) for low drop out support of  
the output voltage. In this way the output voltage is con-  
trolled down to the lowest possible input voltage.  
A pole can also be used at higher output voltages. For  
example, in the table Table 3, there is an entry for 1.24V with  
both a pole and zero at approximately 10kHz for noise  
rejection.  
The minimum input voltage needed to support the output  
voltage is  
INDUCTOR SELECTION  
There are two main considerations when choosing an induc-  
tor; the inductor current should not saturate, and the inductor  
current ripple is small enough to achieve the desired output  
voltage ripple.  
ILOAD  
Load current  
RDSON,  
Drain to source resistance of PFET switch  
in the triode region  
There are two methods to choose the inductor current rating.  
PFET  
Method 1:  
RINDUCTOR Inductor resistance  
The total current is the sum of the load and the inductor  
ripple current. This can be written as  
Application Information  
OUTPUT VOLTAGE SELECTION FOR ADJUSTABLE  
LM3670  
The output voltage of the adjustable parts can be pro-  
grammed through the resistor network connected from VOUT  
to VFB then to GND. VOUT is adjusted to make VFB equal to  
0.5V. The resistor from VFB to GND (R2) should be at least  
100Kto keep the current sunk through this network well  
below the 15µA quiescent current level (PFM mode with no  
switching) but large enough that it is not susceptible to noise.  
If R2 is 200K, and VFB is 0.5V, then the current through the  
resistor feedback network is 2.5µA ( IFB =0.5V/R2). The  
output voltage formula is:  
ILOAD load current  
VIN input voltage  
L inductor  
f switching frequency  
IRIPPLE peak-to-peak  
Method 2:  
A more conservative approach is to choose an inductor that  
can handle the current limit of 700 mA.  
VOUT Output Voltage (V)  
Given a peak-to-peak current ripple (IPP) the inductor needs  
to be at least  
VFB Feedback Voltage (0.5V typ)  
R1 Resistor from VOUT to VFB ()  
R2 Resistor from VOUT to GND ()  
For any output voltage greater than or equal to 0.7V a  
frequency zero must be added at 10kHz for stability. The  
formula is:  
A 10 µH inductor with a saturation current rating of at least  
800 mA is recommended for most applications. The induc-  
tor’s resistance should be less than around 0.3for good  
efficiency. Table 1 lists suggested inductors and suppliers.  
For low-cost applications, an unshielded bobbin inductor is  
suggested. For noise critical applications, a toroidal or  
shielded-bobbin inductor should be used. A good practice is  
to lay out the board with overlapping footprints of both types  
for design flexibility. This allows substitution of a low-noise  
toroidal inductor, in the event that noise from low-cost bobbin  
models is unacceptable.  
For any output voltages below 0.7 and above or equal to  
2.5V, a pole must also be placed at 10kHz as well. The  
lowest output voltage possible is 0.7V. At low output voltages  
the duty cycle is very small and, as the input voltage in-  
creases, the duty cycle decreases even further. Since the  
duty cycle is so low any change due to noise is an appre-  
ciable percentage. In other words, it is susceptible to noise.  
Capacitors C1 and C2 act as noise filters rather than fre-  
quency poles and zeros. If the pole and zero are at the same  
frequency the formula is:  
INPUT CAPACITOR SELECTION  
A ceramic input capacitor of 4.7 µF is sufficient for most  
applications. A larger value may be used for improved input  
voltage filtering. The input filter capacitor supplies current to  
the PFET switch of the LM3670 in the first half of each cycle  
and reduces voltage ripple imposed on the input power  
source. A ceramic capcitor’s low ESR provides the best  
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12  
Application Information (Continued)  
noise filtering of the input voltage spikes due to this rapidly  
changing current. Select an input filter capacitor with a surge  
current rating sufficient for the power-up surge from the input  
power source. The power-up surge current is approximately  
the capacitor’s value (µF) times the voltage rise rate (V/µs).  
The input current ripple can be calculated as:  
TABLE 1. Suggested Inductors and Their Suppliers  
Model  
Vendor  
Vishay  
Phone  
FAX  
IDC2512NB100M  
DO1608C-103  
ELL6RH100M  
CDRH5D18-100  
408-727-2500  
847-639-6400  
714-373-7366  
847-956-0666  
408-330-4098  
847-639-1469  
714-373-7323  
847-956-0702  
Coilcraft  
Panasonic  
Sumida  
OUTPUT CAPACITOR SELECTION  
The output filter capacitor smoothes out current flow from the  
inductor to the load, maintaining a steady output voltage  
during transient load changes and reduces output voltage  
ripple. These capacitors must be selected with sufficient  
capacitance and sufficiently low ESR to perform these func-  
tions.  
Voltage peak-to-peak ripple, root mean squared =  
The output ripple current can be calculated as:  
Voltage peak-to-peak ripple due to capacitance =  
Note that the output ripple is dependent on the current ripple  
and the equivalent series resistance of the output capacitor  
(RESR).  
Because these two components are out of phase the rms  
value is used. The RESR is frequency dependent (as well as  
temperature dependent); make sure the frequency of the  
RESR given is the same order of magnitude as the switching  
frequency.  
Voltage peak-to-peak ripple due to ESR =  
TABLE 2. Suggested Capacitors and Their Suppliers  
Model  
Type  
Vendor  
Phone  
FAX  
10 µF for COUT  
VJ1812V106MXJAT  
LMK432BJ106MM  
JMK325BJ106MM  
4.7 µF for CIN  
Ceramic  
Ceramic  
Ceramic  
Vishay  
408-727-2500  
847-925-0888  
847-925-0888  
408-330-4098  
847-925-0899  
847-925-0899  
Taiyo-Yuden  
Taiyo-Yuden  
VJ1812V475MXJAT  
EMK325BJ475MN  
C3216X5R0J475M  
Ceramic  
Ceramic  
Ceramic  
Vishay  
Taiyo-Yuden  
TDK  
408-727-2500  
847-925-0888  
847-803-6100  
408-330-4098  
847-925-0899  
847-803-6296  
TABLE 3. Adjustable LM3670 Configurations for Various VOUT  
VOUT (V)  
0.7  
R1 (K)  
R2 (K)  
200  
C1 (pF)  
200  
C2 (pF)  
150  
L (µH)  
4.7  
CIN (µF)  
4.7  
COUT (µF)  
80.6  
120  
160  
200  
10  
10  
10  
10  
0.8  
200  
130  
none  
none  
none  
4.7  
4.7  
0.9  
200  
100  
4.7  
4.7  
1.0  
200  
82  
4.7  
4.7  
13  
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Application Information (Continued)  
TABLE 3. Adjustable LM3670 Configurations for Various VOUT (Continued)  
VOUT (V)  
1.1  
R1 (K)  
240  
R2 (K)  
200  
C1 (pF)  
68  
C2 (pF)  
none  
none  
none  
120  
L (µH)  
4.7  
4.7  
4.7  
4.7  
10  
CIN (µF)  
4.7  
COUT (µF)  
10  
10  
1.2  
280  
200  
56  
4.7  
1.24  
1.24  
1.5  
300  
200  
56  
4.7  
10  
221  
150  
75  
4.7  
10  
402  
200  
39  
none  
none  
none  
none  
4.7  
10  
1.6  
442  
200  
39  
10  
4.7  
10  
1.7  
487  
200  
33  
10  
4.7  
10  
1.875  
549  
200  
30  
10  
4.7  
14.7  
Note: (10 ||  
4.7)  
2.5  
806  
200  
22  
82  
10  
4.7  
22  
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14  
DC-DC converter and surrounding circuitry by contributing to  
EMI, ground bounce, and resistive voltage loss in the traces.  
These can send erroneous signals to the DC-DC converter  
IC, resulting in poor regulation or instability.  
Application Information (Continued)  
BOARD LAYOUT CONSIDERATIONS  
PC board layout is an important part of DC-DC converter  
design. Poor board layout can disrupt the performance of a  
20075831  
FIGURE 6. Board Layout Design Rules for the LM3670  
Good layout for the LM3670 can be implemented by follow-  
ing a few simple design rules, as illustrated in .  
the ground-plane (if one is used) with several vias. This  
reduces ground-plane noise by preventing the switching  
currents from circulating through the ground plane. It  
also reduces ground bounce at the LM3670 by giving it  
a low-impedance ground connection.  
1. Place the LM3670, inductor and filter capacitors close  
together and make the traces short. The traces between  
these components carry relatively high switching cur-  
rents and act as antennas. Following this rule reduces  
radiated noise. Place the capacitors and inductor within  
0.2 in. (5 mm) of the LM3670.  
4. Use wide traces between the power components and for  
power connections to the DC-DC converter circuit. This  
reduces voltage errors caused by resistive losses across  
the traces.  
2. Arrange the components so that the switching current  
loops curl in the same direction. During the first half of  
each cycle, current flows from the input filter capacitor,  
through the LM3670 and inductor to the output filter  
capacitor and back through ground, forming a current  
loop. In the second half of each cycle, current is pulled  
up from ground, through the LM3670 by the inductor, to  
the output filter capacitor and then back through ground,  
forming a second current loop. Routing these loops so  
the current curls in the same direction prevents mag-  
netic field reversal between the two half-cycles and re-  
duces radiated noise.  
5. Route noise sensitive traces, such as the voltage feed-  
back path, away from noisy traces between the power  
components. The voltage feedback trace must remain  
close to the LM3670 circuit and should be direct but  
should be routed opposite to noisy components. This  
reduces EMI radiated onto the DC-DC converter’s own  
voltage feedback trace.  
6. Place noise sensitive circuitry, such as radio IF blocks,  
away from the DC-DC converter, CMOS digital blocks  
and other noisy circuitry. Interference with noise-  
sensitive circuitry in the system can be reduced through  
distance.  
3. Connect the ground pins of the LM3670, and filter ca-  
pacitors together using generous component-side cop-  
per fill as a pseudo-ground plane. Then, connect this to  
In mobile phones, for example, a common practice is to  
place the DC-DC converter on one corner of the board,  
15  
www.national.com  
IF stages on the diagonally opposing corner. Often, the  
sensitive circuitry is shielded with a metal pan and power to  
it is post-regulated to reduce conducted noise, using low-  
dropout linear regulators.  
Application Information (Continued)  
arrange the CMOS digital circuitry around it (since this also  
generates noise), and then place sensitive preamplifiers and  
www.national.com  
16  
Physical Dimensions inches (millimeters) unless otherwise noted  
5-Lead SOT23-5 Package  
NS Package Number MF05A  
National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves  
the right at any time without notice to change said circuitry and specifications.  
For the most current product information visit us at www.national.com.  
LIFE SUPPORT POLICY  
NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS  
WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT AND GENERAL COUNSEL OF NATIONAL SEMICONDUCTOR  
CORPORATION. As used herein:  
1. Life support devices or systems are devices or systems  
which, (a) are intended for surgical implant into the body, or  
(b) support or sustain life, and whose failure to perform when  
properly used in accordance with instructions for use  
provided in the labeling, can be reasonably expected to result  
in a significant injury to the user.  
2. A critical component is any component of a life support  
device or system whose failure to perform can be reasonably  
expected to cause the failure of the life support device or  
system, or to affect its safety or effectiveness.  
BANNED SUBSTANCE COMPLIANCE  
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