LM2889N [NSC]

LM2889 TV Video Modulator; LM2889电视视频调制器
LM2889N
型号: LM2889N
厂家: National Semiconductor    National Semiconductor
描述:

LM2889 TV Video Modulator
LM2889电视视频调制器

商用集成电路 电视 光电二极管
文件: 总10页 (文件大小:222K)
中文:  中文翻译
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December 1994  
LM2889 TV Video Modulator  
General Description  
The LM2889 is designed to interface audio and video sig-  
nals to the antenna terminals of a TV receiver. It consists of  
Features  
Y
Pin for pin compatible with LM1889 RF section  
Low distortion FM sound modulator (less than 1%  
THD)  
Y
a
sound subcarrier oscillator and FM modulator, video  
Y
Y
Y
Y
Y
Y
clamp, and RF oscillators and modulators for two low-VHF  
channels.  
Video clamp for AC-coupled video  
Low sound oscillator harmonic levels  
10V to 16V supply operation  
The LM2889 allows video information from VTRs, video disk  
systems, games, test equipment, or similar sources to be  
displayed on black and white or color TV receivers.  
DC channel switching  
Excellent oscillator stability  
Low intermodulation products  
Block and Connection Diagrams (Dual-In-Line Package)  
Order Number LM2889N  
See NS Package Number N14A  
DC Test Circuit  
TL/H/5079–1  
C
1995 National Semiconductor Corporation  
TL/H/5079  
RRD-B30M115/Printed in U. S. A.  
Absolute Maximum Ratings  
If Military/Aerospace specified devices are required,  
please contact the National Semiconductor Sales  
Office/Distributors for availability and specifications.  
b
a
55 C to 150 C  
Storage Temperature Range  
(V14V13) Max  
§
§
g
5V  
DC  
7V  
DC  
7V  
DC  
(V12V8) Max  
Supply Voltage  
18V  
DC  
(V12V9) Max  
Power Dissipation Package (Note 1)  
Operating Temperature Range  
700 mW  
Lead Temperature (Soldering, 10 seconds)  
260 C  
§
a
0 C to 70 C  
§
§
DC Electrical Characteristics  
(DC test circuit, all switches normally pos. 1, V  
e
e
e
e
V 10V)  
C
12V, V  
2V, V  
S
A
B
Parameter  
Conditions  
Min  
10  
Typ  
16  
Max  
Units  
mA  
Supply Current I  
25  
S
b
a
Change V from 2V to 2V  
Sound Oscillator Current DI  
0.2  
0.35  
0.85  
0.9  
0.6  
mA  
13  
A
Sound Oscillator Zener Current I  
mA  
13  
Sound Modulator Audio Current DI  
Change SW2 from Pos. 1 to Pos. 2  
mA  
13  
Video Clamp Voltage V2  
Unloaded  
5.0  
5.25  
5.1  
5.5  
5.0  
V
V
DC  
Loaded  
SW3 Pos. 3  
SW3 Pos. 2  
DC  
Video Clamp Capacitor Discharge  
5
20  
mA  
Current (V V2)/10  
S
Ch. A Oscillator OFF Voltage, V6, V7  
Ch. A Oscillator Current Level I  
SW1 Pos. 2  
2
mV  
DC  
e
e
11V  
V
B
10V, V  
C
2.5  
3.5  
2
mA  
mV  
7
Ch. B Oscillator OFF Voltage V4, V5  
Ch. B Oscillator Current Level I  
DC  
e
e
10V, V  
C
SW1 Pos. 2, V  
11V  
2.5  
0.3  
3.5  
5.0  
mA  
4
B
Ch. A Modulator Conversion Ratio  
Measure DV9 by Changing from  
e
e
e
e
11V, to V  
B
DV9/(V11-V10)  
V
V
10V, V  
11V,  
0.50  
0.50  
0.75  
V/V  
B
C
10V; Divide by V11V10  
C
Ch. B Modulator Conversion Ratio  
SW1 Pos. 2, Measure DV8 by  
e
e
11V,  
DV8/(V11V10)  
Changing from V  
e
V11V10  
10V, V  
B
C
0.3  
0.75  
V/V  
e
10V; Divide by  
to V  
11V, V  
B
C
e
AC Electrical Characteristics (AC test circuit, V 12V)  
S
Parameter  
Sound Carrier Oscillator Level (V13)  
Sound Modulator Deviation  
Conditions  
Min Typ Max  
Units  
3.4  
Vp-p  
Df/DV , SW1 Pos. 2, Change V from 1.4V  
IN IN  
to 1.0V, Measure Df at Pin 13, Divide as Shown  
250  
Hz/mV  
e
Ch. 3 RF Oscillator Level n6, n7  
Ch. 4 RF Oscillator Level, n4, n5,  
Ch. Sw. Pos. 3, f 61.25 MHz, Use FET Probe  
550  
550  
10  
mVp-p  
mVp-p  
e
Ch. Sw. Pos. 4, f 67.25 MHz, Use FET Probe  
e
RF Modulator Conversion Gain n  
/(V10±V11) Ch. Sw. Pos. 3, f 61.25 MHz. (Note 2)  
OUT  
mVrms/V  
Note 1: For operation in ambient temperatures above 25 C, the device must be derated based on a 150 C maximum junction temperature and a thermal resistance  
§
§
of 80 C/W junction to ambient.  
§
Note 2: Conversion gain shown is measured with 75X input RF meter which makes the AC RF output load 37.5X.  
2
e
Design Characteristics (AC test circuit, V 12V)  
S
Parameter  
Typ  
Units  
g
Sound Modulator Audio THD at 25 kHz Deviation, V must be 1 kHz Source,  
Demodulate as Shown inFigure 1  
0.8  
%
IN  
Sound Modulator Input Impedance (Pin 1)  
Sound Modulator Bandwidth  
1.5  
100  
kX  
kHz  
Oscillator Supply Dependence, Sound Carrier, RF  
See Curves  
Oscillator Temperature Dependence (IC Only)  
b
b
Sound Carrier  
RF  
15  
50  
ppm/ C  
§
ppm/ C  
§
RF Oscillator Maximum Operating Frequency (Temperature Stability Degraded)  
RF Modulator  
100  
MHz  
dB  
Carrier Suppression (Adjust Video Bias for Minimum RF Carrier at n  
30  
OUT  
with 3V Offset at Pins 10 and 11, See Applications  
and Reference to n  
OUT  
Information, RF Modulation Section)  
3.58 MHz Differential Gain  
Differential Phase  
5
3
%
degrees  
2.5V Vp-p Video, 87.5% Mod  
Output Harmonics below RF Carrier  
2nd, 3rd  
b
b
12  
20  
dB  
dB  
4th and Above  
Input Impedance, Pin 10, Pin 11  
1 MX//2 pF  
AC Test Circuit  
TL/H/5079–2  
3
Test Circuit  
TL/H/5079–3  
FIGURE 1. 4.5 MHz Sound FM Demodulator  
Typical Performance Characteristics (Refer to AC test circuit unless noted)  
Sound Carrier Oscillator  
Supply Dependence  
RF Oscillator Frequency  
Supply Dependence  
TL/H/5079–4  
4
Circuit Description (Refer to Circuit Diagrams)  
The sound carrier oscillator is formed by differential amplifi-  
er Q3, Q4 operated with positive feedback from the pin 13  
tank to the base of Q4. Frequency modulation is obtained  
by varying the 90 degree phase shifted current of Q9. Q14’s  
emitter is a virtual ground, so the voltage at pin 1 deter-  
mines the current R11, which ultimately modulates the col-  
lector current of Q9.  
supply. The channel B modulator consists of multiplier de-  
vices Q28Q31, Q34 and Q35. The top quad is coupled to  
the channel B tank through isolating devices Q26 and Q27.  
A DC potential between pins 10 and 11 offsets the lower  
pair to produce an output RF carrier at pin 8. That carrier is  
then modulated by both the sound subcarrier at pin 10 and  
the composite video signal at pin 11. The channel A modu-  
lator shares pin 10 and 11 buffers, Q32 and Q33, with chan-  
nel B and operates in an identical manner.  
The video clamp is comprised of devices Q58-Q60. The  
clamp voltage is set by resistors R40, R41, R49, and R50.  
The DV /R42 current sets the capacitor discharge cur-  
rent. Q59 and the above mentioned resistor string help  
maintain a temperature stable clamp voltage.  
The current flowing through channel B oscillator diodes  
Q22, Q23 is turned around in Q36Q38 to source current  
for the channel B RF modulator. In the same manner, the  
channel A oscillator Q54Q57 uses turn-around Q49Q51  
to source the channel A modulator. One oscillator at a time  
may be activated by its current turn-around, and the other  
oscillator/modulator combination remains off.  
BE  
The channel B oscillator consists of devices Q24 and Q25  
cross-coupled through level-shift zener diodes Q22 and  
Q23. A current regulator consisting of devices Q17Q21 is  
used to achieve good RF stability over temperature and  
Circuit Diagrams  
TL/H/5079–5  
5
Circuit Diagrams (Continued)  
6
Applications Information  
SOUND FM MODULATOR  
RF MODULATION  
Frequency deviation is determined by the Q of the tank cir-  
cuit at pin 13 and the current entering the audio input, pin 1.  
Two RF channels are available, with carrier frequencies up  
to 100 MHz being determined by L-C tank circuits at pins  
4/ 5 and 6/7. The signal inputs (pins 10 and 11) are com-  
mon to both modulators, but removing the power supply  
from an RF oscillator will also disable that modulator.  
This current is set by the input voltage V , the device input  
IN  
impedance (1.5 kX), and any impedance network connect-  
ed externally. A signal of 60 mVrms at pin 1 will yield about  
g
25 kHz deviation when configured as shown in Figure 2.  
The offset between the two signal pins determines the level  
of the RF carrier output. To preserve the DC content of the  
video signal, amplitude modulation of the RF carrier is done  
in one direction only, with increasing video (toward peak  
white) decreasing the carrier level. This means the active  
composite video signal at pin 11 must be offset with respect  
to pin 10 and the sync pulse should produce the largest  
offset.  
VIDEO CLAMP  
When video is not available at DC levels within the RF mod-  
ulator common-mode range, or if the DC level of the video is  
not temperature stable, then it should be AC-coupled as  
shown in the typical applications circuit (Figure 2). The  
e
clamp holds the horizontal sync pulses at 5.2V for V  
12V.  
S
The clamp coupling capacitor is charged during every sync  
pulse and discharged when video information is present.  
The discharge current is approximately 20 mA. This current  
and the amount of acceptable tilt over a line of video deter-  
mines the value of the coupling capacitor C1. For most ap-  
plications 1 mF is sufficient.  
The largest video signal (peak white) should not be able to  
suppress the carrier completely, particularly if sound trans-  
mission is needed. This requires that pin 10 be biased  
above the largest expected video signal. Because peak  
white level is often difficult to define, a good rule to follow is  
to bias pin 10 at a level which is four times the sync ampli-  
tude above the sync tip level at pin 11. For example, the DC  
bias at pin 10 with 0.5V sync clamped to 5.2V on pin 11,  
a
c
e
should be 5.2 (4 0.5) 7.2V.  
Typical Application  
TL/H/5079–7  
FIGURE 2. Two Channel Video Modulator with FM Sound  
7
Pin 2ÐVideo Clamp: The video clamp restores the DC  
component to AC-coupled video. The video is AC-coupled  
to the clamp via C3. Decreasing C3 will cause a larger tilt  
between vertical sync pulses in the clamped video wave-  
form.  
Applications Information (Continued)  
When the signal inputs are exactly balanced, ideally there is  
no RF carrier at the output. Circuit board layout is critical to  
this measurement. For optimum performance, the output  
and supply decoupling circuitry should be configured as  
shown in Figure 3.  
Pin 3ÐGround: Although separate on the chip level, all  
ground terminate at pin 3.  
Pins 4/5ÐChannel 4 Oscillator: Pins 4 and 5 are the col-  
lector outputs of the channel 4 oscillator. L1 and C5 set the  
e
oscillator frequency defined by f  
0.159/ L1C5. Increas-  
S
O
ing L1 will decrease the oscillator frequency while decreas-  
ing L1 will increase the oscillator frequency. Decreasing C5  
will increase the oscillator frequency and lower the tank Q  
causing possible drift problems. R2 and R3 are the oscillator  
loads which determine the oscillator amplitude and the tank  
Q. Increasing these resistors increases the Q and the oscil-  
lator amplitude, possibly overdriving the RF modulator,  
which will increase output RF harmonics. Decreasing R2  
and R3 reduces the tank Q and may cause increased drift.  
C4 is an RF decoupling capacitor. Increasing C4 may result  
in less effective decoupling at RF. Decreasing C4 may intro-  
duce RF to supply coupling.  
TL/H/5079–8  
RF decouple supply directly to output ground.  
FIGURE 3. Correct RF Supply Decoupling  
The video clamp level is derived from a resistive divider con-  
nected to supply (V ). To maintain good supply rejection,  
S
pin 10, which is biased externally, should also be referenced  
to supply (see Figure 2).  
Pins 6/7ÐChannel 3 Oscillator; Pins 6 and 7 are the chan-  
nel 3 oscillator outputs. Every component at these pins has  
the same purpose and effect as those at pins 4 and 5.  
Pin Description (Refer toFigure 2)  
Pin 8ÐChannel 4 RF Output: Pin 8 is the channel 4 RF  
output and R13 is the load resistor. The RF signal is AC  
coupled via C15 to the output filter which is a two channel  
VSB filter. L5 is parallel resonant with the filter input capaci-  
tance minimizing loss in the output network. R14 terminated  
the filter output.  
Pin 1ÐAudio Input: Pin 1 is the audio input to the sound  
FM generator. Frequency deviation is proportional to the  
signal at this pin. A pre-emphasis network comprised of R1,  
C2, and the device input impedance yields the following re-  
sponse with an 80 mVrms audio input.  
Pin 9ÐChannel 3 RF Output: Pin 9 is the channel 3 RF  
output with all components performing the same functions  
as those in the pin 8 description.  
Pre-Emphasis Network  
Response  
Pin 10ÐRF Modulator Sound Subcarrier Input: Pin 10 is  
one of the RF modulator inputs and may be used for video  
or sound. It is used as a sound subcarrier input in Figure 2.  
R8, R9, and R10 set the DC bias on this pin which deter-  
mines the modulation depth of the RF output (see Applica-  
tion Notes). R12 and C11 AC-couple the sound subcarrier  
from the sound modulator to the RF modulator. R12 and  
R11 form a resistive divider that determines the level of  
sound at pin 10, which in turn sets the picture carrier to  
sound subcarrier ratio. Increasing the ratio of R11/R12 will  
increase the sound subcarrier at the output. C10 forms an  
AC ground, preventing R8, R9, and R10 from having any  
effects on the circuit other than setting the DC potential at  
pin 10. R11 and R12 also effect the FM sound modulator  
(see pin 13 description).  
TL/H/5079–9  
Increasing R1 lowers the boost frequency, and decreases  
deviation below the boost frequency. Increasing C2 only  
lowers the boost frequency. C1 is a coupling capacitor, and  
must be a low impedance compared to the sum of R1 and  
the device input impedance (1.5 kX).  
8
Pin Description (Continued)  
Pin 11ÐVideo Input: Pin 11, when configured as shown, is  
the RF modulator video input. In this application, video is  
coupled directly from the video clamp. Alternatively, video  
could be DC-coupled directly to pin 11 if it is already within  
the DC common-mode input range of the RF modulator (see  
curves). In any case, the video sync tip at pin 11 must have  
a constant DC level independent of video content. Because  
of circuit symmetry, pins 10 and 11 may be interchanged.  
external resistance across the tank. The series combination  
a
R11 R12 usually dominates the tank Q. Decreasing this  
resistive network will decrease Q and increase deviation. It  
should be noted that because the level of phase modulation  
of the 4.5 MHz signal remains constant, variation in Q will  
not effect distortion of the frequency modulation process if  
the audio at pin 1 is left constant. The amplitude of the  
sound subcarrier is directly proportional to Q, so increasing  
the unloaded Q or either of the resistors mentioned above  
will increase the sound subcarrier amplitude. For proper op-  
eration of the frequency modulator, the sound subcarrier  
amplitude should be greater than 2 Vp-p.  
Pin 12ÐRF Supply: Pin 12 is the RF supply, with C12 and  
C7 serving as RF decouple capacitors. Increasing C12 or  
C7 may result in less effective RF decoupling, while de-  
creasing them may cause supply interaction. It is important  
that C7 be grounded at the RF output ground.  
Pin 14ÐSound Supply: Pin 14 is the sound supply and C14  
is an RF decouple capacitor. Decreasing C14 may result in  
increased supply interaction.  
Pin 13ÐSound Tank: Pin 13 is the collector output of the  
sound oscillator. L3 and C13 determine the oscillating fre-  
e
quency by the relationship f  
0.159/ L3C13. Increasing  
S
O
Printed Circuit Layout  
L3 or C13 will lower the operating frequency, while decreas-  
ing them will raise the frequency. L3 and C13 also help  
define the Q of the tank, on which FM modulator de-  
viation level depends. As C13 increases, Q increases, and  
frequency deviation decreases. Likewise, decreasing C13  
increases deviation. The other factor concerning Q is the  
Printed circuit board layout is critical in preventing RF feed-  
through. The location of RF bypass capacitors on supply is  
very important. Figure 4 shows an example of a properly  
layed out circuit board. It is recommended that this layout be  
used.  
TL/H/507910  
FIGURE 4. Printed Circuit Board and Component Diagram  
(Component Side 1X)  
9
Physical Dimensions inches (millimeters)  
Molded Dual-In-Line Package (N)  
Order Number LM2889N  
NS Package Number N14A  
LIFE SUPPORT POLICY  
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DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL  
SEMICONDUCTOR CORPORATION. As used herein:  
1. Life support devices or systems are devices or  
systems which, (a) are intended for surgical implant  
into the body, or (b) support or sustain life, and whose  
failure to perform, when properly used in accordance  
with instructions for use provided in the labeling, can  
be reasonably expected to result in a significant injury  
to the user.  
2. A critical component is any component of a life  
support device or system whose failure to perform can  
be reasonably expected to cause the failure of the life  
support device or system, or to affect its safety or  
effectiveness.  
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Corporation  
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Europe  
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Hong Kong Ltd.  
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Japan Ltd.  
a
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Tel: 1(800) 272-9959  
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National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.  

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