ADC124S021 [NSC]

4 Channel, 200 kSPS, 12-Bit A/D Converter; 4通道, 200 kSPS时, 12位A / D转换器
ADC124S021
型号: ADC124S021
厂家: National Semiconductor    National Semiconductor
描述:

4 Channel, 200 kSPS, 12-Bit A/D Converter
4通道, 200 kSPS时, 12位A / D转换器

转换器
文件: 总19页 (文件大小:905K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
April 2005  
ADC124S021  
4 Channel, 200 kSPS, 12-Bit A/D Converter  
General Description  
Features  
n Specified over a range of sample rates.  
n Four input channels  
The ADC124S021 is a low-power, four-channel CMOS 12-bit  
analog-to-digital converter with a high-speed serial interface.  
Unlike the conventional practice of specifying performance  
at a single sample rate only, the ADC124S021 is fully speci-  
fied over a sample rate range of 50 kSPS to 200 kSPS. The  
converter is based on a successive-approximation register  
architecture with an internal track-and-hold circuit. It can be  
configured to accept up to four input signals at inputs IN1  
through IN4.  
n Variable power management  
n Single power supply with 2.7V - 5.25V range  
Key Specifications  
n DNL  
n INL  
+0.4 / −0.2 LSB (typ)  
0.35 LSB (typ)  
n SNR  
72.0 dB (typ)  
The output serial data is straight binary, and is compatible  
n Power Consumption  
— 3V Supply  
— 5V Supply  
with several standards, such as SPI , QSPI , MICROW-  
IRE, and many common DSP serial interfaces.  
2.2 mW (typ)  
7.9 mW (typ)  
The ADC124S021 operates with a single supply that can  
range from +2.7V to +5.25V. Normal power consumption  
using a +3V or +5V supply is 2.2 mW and 7.9 mW, respec-  
tively. The power-down feature reduces the power consump-  
tion to just 0.14 µW using a +3V supply, or 0.32 µW using a  
+5V supply.  
Applications  
n Portable Systems  
n Remote Data Aquisitions  
n Instrumentation and Control Systems  
The ADC124S021 is packaged in a 10-lead MSOP package.  
Operation over the industrial temperature range of −40˚C to  
+85˚C is guaranteed.  
Pin-Compatible Alternatives by Resolution and Speed  
All devices are fully pin and function compatible.  
Resolution  
Specified for Sample Rate Range of:  
200 to 500 kSPS  
50 to 200 kSPS  
ADC124S021  
ADC104S021  
ADC084S021  
500 kSPS to 1 MSPS  
ADC124S101  
12-bit  
10-bit  
8-bit  
ADC124S051  
ADC104S051  
ADC104S101  
ADC084S051  
ADC084S101  
Connection Diagram  
20124305  
TRI-STATE® is a trademark of National Semiconductor Corporation  
QSPI and SPI are trademarks of Motorola, Inc.  
© 2005 National Semiconductor Corporation  
DS201243  
www.national.com  
Ordering Information  
Order Code  
Temperature Range  
Description  
10-Lead MSOP Package  
10-Lead MSOP Package, Tape & Reel  
Evaluation Board  
Top Mark  
X21C  
ADC124S021CIMM  
ADC124S021CIMMX  
ADC124S021EVAL  
−40˚C to +85˚C  
−40˚C to +85˚C  
X21C  
Block Diagram  
20124307  
Pin Descriptions and Equivalent Circuits  
Pin No.  
ANALOG I/O  
4-7  
Symbol  
Description  
IN1 to IN4  
Analog inputs. These signals can range from 0V to VA.  
DIGITAL I/O  
Digital clock input. This clock directly controls the conversion  
and readout processes.  
10  
9
SCLK  
DOUT  
DIN  
Digital data output. The output samples are clocked out of this  
pin on falling edges of the SCLK pin.  
Digital data input. The ADC124S021’s Control Register is  
loaded through this pin on rising edges of the SCLK pin.  
Chip select. On the falling edge of CS, a conversion process  
begins. Conversions continue as long as CS is held low.  
8
1
CS  
POWER SUPPLY  
Positive supply pin. This pin should be connected to a quiet  
+2.7V to +5.25V source and bypassed to GND with a 1 µF  
capacitor and a 0.1 µF monolithic capacitor located within 1  
cm of the power pin.  
2
3
VA  
GND  
The ground return for the analog supply and signals.  
www.national.com  
2
Absolute Maximum Ratings (Notes 1, 2)  
Operating Ratings (Notes 1, 2)  
If Military/Aerospace specified devices are required,  
please contact the National Semiconductor Sales Office/  
Distributors for availability and specifications.  
Operating Temperature Range  
−40˚C TA +85˚C  
VA Supply Voltage  
+2.7V to +5.25V  
−0.3V to VA  
Digital Input Pins Voltage Range  
Clock Frequency  
Supply Voltage VA  
−0.3V to 6.5V  
−0.3V to VA +0.3V  
10 mA  
0.8 MHz to 3.2 MHz  
0V to VA  
Voltage on Any Pin to GND  
Input Current at Any Pin (Note 3)  
Package Input Current(Note 3)  
Power Consumption at TA = 25˚C  
ESD Susceptibility (Note 5)  
Human Body Model  
Analog Input Voltage  
20 mA  
Package Thermal Resistance  
See (Note 4)  
Package  
θJA  
10-lead MSOP  
190˚C / W  
2500V  
250V  
Machine Model  
Soldering process must comply with National Semiconduc-  
tor’s Reflow Temperature Profile specifications. Refer to  
www.national.com/packaging. (Note 6)  
Junction Temperature  
+150˚C  
Storage Temperature  
−65˚C to +150˚C  
ADC124S021 Converter Electrical Characteristics (Note 9)  
The following specifications apply for VA = +2.7V to 5.25V, GND = 0V, fSCLK = 0.8 MHz to 3.2 MHz, fSAMPLE = 50 kSPS to 200  
kSPS, CL = 35 pF, unless otherwise noted. Boldface limits apply for TA = TMIN to TMAX: all other limits TA = 25˚C.  
Limits  
(Note 7)  
Symbol  
Parameter  
Conditions  
Typical  
Units  
STATIC CONVERTER CHARACTERISTICS  
Resolution with No Missing Codes  
12  
Bits  
+0.35  
−0.35  
+0.4  
+0.8  
−1.1  
+1.1  
−0.8  
1.3  
LSB (max)  
LSB (min)  
LSB (max)  
LSB (min)  
LSB (max)  
INL  
Integral Non-Linearity  
DNL  
Differential Non-Linearity  
−0.2  
VOFF  
OEM  
FSE  
Offset Error  
+0.37  
Channel to Channel Offset Error  
0.1  
0.52  
0.1  
1.0  
1.5  
1.0  
LSB (max)  
LSB (max)  
LSB (max)  
Match  
Full-Scale Error  
Channel to Channel Full-Scale Error  
Match  
FSEM  
DYNAMIC CONVERTER CHARACTERISTICS  
VA = +2.7 to 5.25V  
SINAD  
SNR  
Signal-to-Noise Plus Distortion Ratio  
Signal-to-Noise Ratio  
72  
72  
69.2  
70.6  
−75  
dB (min)  
dB (min)  
dB (max)  
fIN = 39.9 kHz, −0.02 dBFS  
VA = +2.7 to 5.25V  
fIN = 39.9 kHz, −0.02 dBFS  
VA = +2.7 to 5.25V  
fIN = 39.9 kHz, −0.02 dBFS  
VA = +2.7 to 5.25V  
fIN = 39.9 kHz, −0.02 dBFS  
VA = +2.7 to 5.25V  
VA = +5.25V  
THD  
Total Harmonic Distortion  
−84  
SFDR  
ENOB  
Spurious-Free Dynamic Range  
Effective Number of Bits  
86  
76  
dB (min)  
Bits (min)  
dB  
11.7  
−86  
11.2  
Channel-to-Channel Crosstalk  
fIN = 39.9 kHz  
Intermodulation Distortion, Second  
Order Terms  
VA = +5.25V  
−87  
−88  
dB  
dB  
fa = 40.161 kHz, fb = 41.015 kHz  
VA = +5.25V  
IMD  
Intermodulation Distortion, Third  
Order Terms  
fa = 40.161 kHz, fb = 41.015 kHz  
VA = +5V  
11  
8
MHz  
MHz  
FPBW  
-3 dB Full Power Bandwidth  
VA = +3V  
3
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ADC124S021 Converter Electrical Characteristics (Note 9) (Continued)  
The following specifications apply for VA = +2.7V to 5.25V, GND = 0V, fSCLK = 0.8 MHz to 3.2 MHz, fSAMPLE = 50 kSPS to 200  
kSPS, CL = 35 pF, unless otherwise noted. Boldface limits apply for TA = TMIN to TMAX: all other limits TA = 25˚C.  
Limits  
(Note 7)  
Symbol  
Parameter  
Conditions  
Typical  
Units  
ANALOG INPUT CHARACTERISTICS  
VIN  
Input Range  
0 to VA  
0.02  
33  
V
µA (max)  
pF  
IDCL  
DC Leakage Current  
1
Track Mode  
Hold Mode  
CINA  
Input Capacitance  
3
pF  
DIGITAL INPUT CHARACTERISTICS  
VA = +5.25V  
VA = +3.6V  
2.4  
2.1  
0.8  
10  
4
V (min)  
V (min)  
VIH  
Input High Voltage  
VIL  
Input Low Voltage  
Input Current  
V (max)  
µA (max)  
pF (max)  
IIN  
VIN = 0V or VA  
0.02  
2
CIND  
Digital Input Capacitance  
DIGITAL OUTPUT CHARACTERISTICS  
ISOURCE = 200 µA  
ISOURCE = 1 mA  
ISINK = 200 µA  
ISINK = 1 mA  
VA − 0.03  
VA − 0.1  
0.02  
VA − 0.5  
0.4  
V (min)  
VOH  
VOL  
Output High Voltage  
V
V (max)  
V
Output Low Voltage  
0.1  
IOZH  
IOZL  
COUT  
,
TRI-STATE® Leakage Current  
0.01  
2
1
4
µA (max)  
pF (max)  
TRI-STATE® Output Capacitance  
Output Coding  
Straight (Natural) Binary  
POWER SUPPLY CHARACTERISTICS (CL = 10 pF)  
2.7  
V (min)  
VA  
Supply Voltage  
5.25  
V (max)  
VA = +5.25V  
1.5  
0.62  
60  
2.1  
1.0  
mA (max)  
fSAMPLE = 200 kSPS, fIN = 39.9 kHz  
VA = +3.6V,  
Supply Current, Normal Mode  
(Operational, CS low)  
mA (max)  
fSAMPLE = 200 kSPS, fIN = 39.9 kHz  
VA = +5.25V  
IA  
nA  
nA  
fSAMPLE = 0 kSPS  
VA = +3.6V,  
Supply Current, Shutdown (CS high)  
38  
fSAMPLE = 0 kSPS  
VA = +5.25V  
7.9  
2.2  
11.0  
3.6  
mW (max)  
mW (max)  
µW  
Power Consumption, Normal Mode  
(Operational, CS low)  
VA = +3.6V,  
PD  
VA = +5.25V  
0.32  
0.14  
Power Consumption, Shutdown (CS  
high)  
VA = +3.6V,  
µW  
AC ELECTRICAL CHARACTERISTICS  
0.8  
3.2  
50  
200  
13  
30  
70  
3
MHz (min)  
MHz (max)  
kSPS (min)  
kSPS (max)  
SCLK cycles  
% (min)  
fSCLK  
Maximum Clock Frequency  
(Note 8)  
(Note 8)  
fS  
Sample Rate  
tCONV  
DC  
Conversion Time  
SCLK Duty Cycle  
fSCLK = 3.2 MHz  
50  
% (max)  
tACQ  
Track/Hold Acquisition Time  
Throughput Time  
Full-Scale Step Input  
SCLK cycles  
SCLK cycles  
Acquisition Time + Conversion Time  
16  
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4
ADC124S021 Timing Specifications  
The following specifications apply for VA = +2.7V to 5.25V, GND = 0V, fSCLK = 0.8 MHz to 3.2 MHz, fSAMPLE = 50 kSPS to 200  
kSPS, CL = 35 pF, Boldface limits apply for TA = TMIN to TMAX: all other limits TA = 25˚C.  
Limits  
(Note 7)  
Symbol  
tCSU  
Parameter  
Conditions  
VA = +3.0V  
Typical  
Units  
−3.5  
−0.5  
+4.5  
+1.5  
+4  
Setup Time SCLK High to CS Falling Edge  
Hold time SCLK Low to CS Falling Edge  
Delay from CS Until DOUT active  
(Note 10)  
(Note 10)  
10  
ns (min)  
ns (min)  
VA = +5.0V  
VA = +3.0V  
VA = +5.0V  
VA = +3.0V  
VA = +5.0V  
VA = +3.0V  
VA = +5.0V  
tCLH  
10  
30  
30  
ns  
tEN  
(max)  
+2  
+14.5  
+13  
+3  
ns  
tACC  
Data Access Time after SCLK Falling Edge  
(max)  
tSU  
tH  
Data Setup Time Prior to SCLK Rising Edge  
Data Valid SCLK Hold Time  
10  
ns (min)  
ns (min)  
+3  
10  
0.5 x  
tSCLK  
0.5 x  
tSCLK  
1.8  
0.3 x  
tSCLK  
0.3 x  
tSCLK  
tCH  
tCL  
SCLK High Pulse Width  
SCLK Low Pulse Width  
ns (min)  
ns (min)  
VA = +3.0V  
VA = +5.0V  
VA = +3.0V  
VA = +5.0V  
Output Falling  
Output Rising  
1.3  
ns  
tDIS  
CS Rising Edge to DOUT High-Impedance  
20  
(max)  
1.0  
1.0  
Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is  
functional, but do not guarantee specific performance limits. For guaranteed specifications and test conditions, see the Electrical Characteristics. The guaranteed  
specifications apply only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under the listed test  
conditions.  
Note 2: All voltages are measured with respect to GND = 0V, unless otherwise specified.  
<
>
V ), the current at that pin should be limited to 10 mA. The 20  
Note 3: When the input voltage at any pin exceeds the power supply (that is, V  
GND or V  
IN  
IN  
A
mA maximum package input current rating limits the number of pins that can safely exceed the power supplies with an input current of 10 mA to two. The Absolute  
Maximum Rating specification does not apply to the V pin. The current into the V pin is limited by the Analog Supply Voltage specification.  
A
A
Note 4: The absolute maximum junction temperature (T max) for this device is 150˚C. The maximum allowable power dissipation is dictated by T max, the  
J
J
junction-to-ambient thermal resistance (θ ), and the ambient temperature (T ), and can be calculated using the formula P MAX = (T max − T )/θ . The values  
JA  
A
D
J
A
JA  
for maximum power dissipation listed above will be reached only when the device is operated in a severe fault condition (e.g. when input or output pins are driven  
beyond the power supply voltages, or the power supply polarity is reversed). Obviously, such conditions should always be avoided.  
Note 5: Human body model is 100 pF capacitor discharged through a 1.5 kresistor. Machine model is 220 pF discharged through zero ohms.  
Note 6: Reflow temperature profiles are different for lead-free and non-lead-free packages.  
Note 7: Tested limits are guaranteed to National’s AOQL (Average Outgoing Quality Level).  
Note 8: This is the frequency range over which the electrical performance is guaranteed. The device is functional over a wider range which is specified under  
Operating Ratings.  
Note 9: Datasheet min/max specification limits are guaranteed by design, test, or statistical analysis.  
Note 10: Clock may be in any state (high or low) when CS is asserted, with the restrictions on setup and hold time given by t  
and t  
.
CLH  
CSU  
5
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Timing Diagrams  
20124351  
ADC124S021 Operational Timing Diagram  
20124308  
Timing Test Circuit  
20124306  
ADC124S021 Serial Timing Diagram  
20124350  
SCLK and CS Timing Parameters  
www.national.com  
6
order intermodulation products to the sum of the power in  
both of the original frequencies. IMD is usually expressed in  
dB.  
Specification Definitions  
ACQUISITION TIME is the time required to acquire the input  
voltage. That is, it is time required for the hold capacitor to  
charge up to the input voltage.  
MISSING CODES are those output codes that will never  
appear at the ADC outputs. The ADC124S021 is guaranteed  
not to have any missing codes.  
APERTURE DELAY is the time between the fourth falling  
SCLK edge of a conversion and the time when the input  
signal is acquired or held for conversion.  
OFFSET ERROR is the deviation of the first code transition  
(000...000) to (000...001) from the ideal (i.e. GND + 0.5  
LSB).  
CONVERSION TIME is the time required, after the input  
voltage is acquired, for the ADC to convert the input voltage  
to a digital word.  
SIGNAL TO NOISE RATIO (SNR) is the ratio, expressed in  
dB, of the rms value of the input signal to the rms value of the  
sum of all other spectral components below one-half the  
sampling frequency, not including harmonics or d.c.  
CROSSTALK is the coupling of energy from one channel  
into the other channel, or the amount of signal energy from  
one analog input that appears at the measured analog input.  
SIGNAL TO NOISE PLUS DISTORTION (S/N+D or SINAD)  
Is the ratio, expressed in dB, of the rms value of the input  
signal to the rms value of all of the other spectral compo-  
nents below half the clock frequency, including harmonics  
but excluding d.c.  
DIFFERENTIAL NON-LINEARITY (DNL) is the measure of  
the maximum deviation from the ideal step size of 1 LSB.  
DUTY CYCLE is the ratio of the time that a repetitive digital  
waveform is high to the total time of one period. The speci-  
fication here refers to the SCLK.  
SPURIOUS FREE DYNAMIC RANGE (SFDR) is the differ-  
ence, expressed in dB, between the rms values of the input  
signal and the peak spurious signal where a spurious signal  
is any signal present in the output spectrum that is not  
present at the input, excluding d.c.  
EFFECTIVE NUMBER OF BITS (ENOB, or EFFECTIVE  
BITS) is another method of specifying Signal-to-Noise and  
Distortion or SINAD. ENOB is defined as (SINAD − 1.76) /  
6.02 and says that the converter is equivalent to a perfect  
ADC of this (ENOB) number of bits.  
TOTAL HARMONIC DISTORTION (THD) is the ratio, ex-  
pressed in dB or dBc, of the rms total of the first five  
harmonic components at the output to the rms level of the  
input signal frequency as seen at the output. THD is calcu-  
lated as  
FULL POWER BANDWIDTH is a measure of the frequency  
at which the reconstructed output fundamental drops 3 dB  
below its low frequency value for a full scale input.  
GAIN ERROR is the deviation of the last code transition  
(111...110) to (111...111) from the ideal (VREF − 1.5 LSB),  
after adjusting for offset error.  
INTEGRAL NON-LINEARITY (INL) is a measure of the  
deviation of each individual code from a line drawn from  
negative full scale (1⁄  
2
LSB below the first code transition)  
through positive full scale (1⁄  
2
LSB above the last code  
where Af1 is the RMS power of the input frequency at the  
output and Af2 through Af6 are the RMS power in the first 5  
harmonic frequencies.  
transition). The deviation of any given code from this straight  
line is measured from the center of that code value.  
THROUGHPUT TIME is the minimum time required between  
the start of two successive conversion. It is the acquisition  
time plus the conversion time. In the case of the  
ADC124S021, this is 16 SCLK periods.  
INTERMODULATION DISTORTION (IMD) is the creation of  
additional spectral components as a result of two sinusoidal  
frequencies being applied to the ADC input at the same time.  
It is defined as the ratio of the power in the second and third  
7
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Typical Performance Characteristics TA = +25˚C, fSAMPLE = 50 kSPS to 200 kSPS, fSCLK = 0.8  
MHz to 3.2 MHz, fIN = 39.9 kHz unless otherwise stated.  
DNL - VA = 3.0V  
DNL - VA = 5.0V  
DNL vs. Supply  
INL - VA = 3.0V  
INL - VA = 5.0V  
INL vs. Supply  
20124320  
20124362  
20124322  
20124321  
20124363  
20124323  
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8
Typical Performance Characteristics TA = +25˚C, fSAMPLE = 50 kSPS to 200 kSPS, fSCLK = 0.8 MHz  
to 3.2 MHz, fIN = 39.9 kHz unless otherwise stated. (Continued)  
DNL vs. Clock Frequency  
DNL vs. Clock Duty Cycle  
DNL vs. Temperature  
INL vs. Clock Frequency  
INL vs. Clock Duty Cycle  
INL vs. Temperature  
20124324  
20124326  
20124328  
20124325  
20124327  
20124329  
9
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Typical Performance Characteristics TA = +25˚C, fSAMPLE = 50 kSPS to 200 kSPS, fSCLK = 0.8 MHz  
to 3.2 MHz, fIN = 39.9 kHz unless otherwise stated. (Continued)  
SNR vs. Supply  
THD vs. Supply  
20124330  
20124331  
20124332  
20124335  
20124336  
20124337  
SNR vs. Clock Frequency  
THD vs. Clock Frequency  
SNR vs. Clock Duty Cycle  
THD vs. Clock Duty Cycle  
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10  
Typical Performance Characteristics TA = +25˚C, fSAMPLE = 50 kSPS to 200 kSPS, fSCLK = 0.8 MHz  
to 3.2 MHz, fIN = 39.9 kHz unless otherwise stated. (Continued)  
SNR vs. Input Frequency  
SNR vs. Temperature  
SFDR vs. Supply  
THD vs. Input Frequency  
THD vs. Temperature  
SINAD vs. Supply  
20124333  
20124334  
20124340  
20124338  
20124339  
20124345  
11  
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Typical Performance Characteristics TA = +25˚C, fSAMPLE = 50 kSPS to 200 kSPS, fSCLK = 0.8 MHz  
to 3.2 MHz, fIN = 39.9 kHz unless otherwise stated. (Continued)  
SFDR vs. Clock Frequency  
SFDR vs. Clock Duty Cycle  
SFDR vs. Input Frequency  
SINAD vs. Clock Frequency  
SINAD vs. Clock Duty Cycle  
SINAD vs. Input Frequency  
20124341  
20124342  
20124343  
20124346  
20124347  
20124348  
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12  
Typical Performance Characteristics TA = +25˚C, fSAMPLE = 50 kSPS to 200 kSPS, fSCLK = 0.8 MHz  
to 3.2 MHz, fIN = 39.9 kHz unless otherwise stated. (Continued)  
SFDR vs. Temperature  
SINAD vs. Temperature  
ENOB vs. Clock Frequency  
ENOB vs. Input Frequency  
20124344  
20124352  
20124354  
20124349  
20124353  
20124355  
ENOB vs. Supply  
ENOB vs. Clock Duty Cycle  
13  
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Typical Performance Characteristics TA = +25˚C, fSAMPLE = 50 kSPS to 200 kSPS, fSCLK = 0.8 MHz  
to 3.2 MHz, fIN = 39.9 kHz unless otherwise stated. (Continued)  
ENOB vs. Temperature  
Spectral Response - 3V, 200 ksps  
20124356  
20124359  
Spectral Response - 5V, 200 ksps  
Power Consumption vs. Throughput  
20124360  
20124361  
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14  
sampled voltage, and switch SW2 unbalances the compara-  
tor. The control logic then instructs the charge-redistribution  
DAC to add fixed amounts of charge to the sampling capaci-  
tor until the comparator is balanced. When the comparator is  
balanced, the digital word supplied to the DAC is the digital  
representation of the analog input voltage. The  
ADC124S021 is in this state for the fourth through sixteenth  
SCLK cycles after CS is brought low.  
Applications Information  
1.0 ADC124S021 OPERATION  
The ADC124S021 is a successive-approximation analog-to-  
digital converter designed around a charge-redistribution  
digital-to-analog converter. Simplified schematics of the  
ADC124S021 in both track and hold modes are shown in  
Figures 1, 2, respectively. In Figure 1, the ADC124S021 is in  
track mode: switch SW1 connects the sampling capacitor to  
one of four analog input channels through the multiplexer,  
and SW2 balances the comparator inputs. The  
ADC124S021 is in this state for the first three SCLK cycles  
after CS is brought low.  
The time when CS is low is considered a serial frame. Each  
of these frames should contain an integer multiple of 16  
SCLK cycles, during which time a conversion is performed  
and clocked out at the DOUT pin and data is clocked into the  
DIN pin to indicate the multiplexer address for the next  
conversion.  
Figure 2 shows the ADC124S021 in hold mode: switch SW1  
connects the sampling capacitor to ground, maintaining the  
20124309  
FIGURE 1. ADC124S021 in Track Mode  
20124310  
FIGURE 2. ADC124S021 in Hold Mode  
2.0 USING THE ADC124S021  
During the first 3 cycles of SCLK, the ADC is in the track  
mode, acquiring the input voltage. For the next 13 SCLK  
cycles the conversion is accomplished and the data is  
clocked out, MSB first, starting on the 5th clock. If there is  
more than one conversion in a frame, the ADC will re-enter  
the track mode on the falling edge of SCLK after the N*16th  
rising edge of SCLK, and re-enter the hold/convert mode on  
the N*16+4th falling edge of SCLK, where "N" is an integer.  
An ADC124S021 timing diagram and a serial interface timing  
diagram for the ADC124S021 are shown in the Timing Dia-  
grams section. CS is chip select, which initiates conversions  
and frames the serial data transfers. SCLK (serial clock)  
controls both the conversion process and the timing of serial  
data. DOUT is the serial data output pin, where a conversion  
result is sent as a serial data stream, MSB first. Data to be  
written to the ADC124S021’s Control Register is placed on  
DIN, the serial data input pin. New data is written to DIN with  
each conversion.  
When CS is brought high, SCLK is internally gated off. If  
SCLK is stopped in the low state while CS is high, the  
subsequent fall of CS will generate a falling edge of the  
internal version of SCLK, putting the ADC into the track  
mode. This is seen by the ADC as the first falling edge of  
SCLK. If SCLK is stopped with SCLK high, the ADC enters  
the track mode on the first falling edge of SCLK after the  
falling edge of CS.  
A serial frame is initiated on the falling edge of CS and ends  
on the rising edge of CS. Each frame must contain an integer  
multiple of 16 rising SCLK edges. The ADC output data  
(DOUT) is in a high impedance state when CS is high and is  
active when CS is low. Thus, CS acts as an output enable.  
Additionally, the device goes into a power down state when  
CS is high, and also between continuous conversion cycles.  
During each conversion, data is clocked into the DIN pin on  
the first 8 rising edges of SCLK after the fall of CS. For each  
15  
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There are no power-up delays or dummy conversions re-  
quired with the ADC124S021. The ADC is able to sample  
and convert an input to full conversion immediately following  
power up. The first conversion result after power-up will be  
that of IN1.  
Applications Information (Continued)  
conversion, it is necessary to clock in the data indicating the  
input that is selected for the conversion after the current one.  
See Tables 1, 2 and 3.  
If CS and SCLK go low simultaneously, it is the following  
rising edge of SCLK that is considered the first rising edge  
for clocking data into DIN.  
TABLE 1. Control Register Bits  
Bit 4 Bit 3  
ADD1 ADD0  
Bit 7 (MSB)  
Bit 6  
Bit 5  
Bit 2  
Bit 1  
Bit 0  
DONTC  
DONTC  
ADD2  
DONTC  
DONTC  
DONTC  
TABLE 2. Control Register Bit Descriptions  
Description  
Bit #:  
Symbol:  
DONTC  
ADD2  
7 - 6, 2 - 0  
Don’t care. The value of these bits do not affect device operation.  
These three bits determine which input channel will be sampled and  
5
4
3
converted in the next track/hold cycle. The mapping between codes and  
ADD1  
channels is shown in Table 3.  
ADD0  
TABLE 3. Input Channel Selection  
ADD2  
ADD1  
ADD0  
Input Channel  
x
x
x
x
0
0
1
1
0
1
0
1
IN1 (Default)  
IN2  
IN3  
IN4  
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16  
LSB values. The LSB width for the ADC124S021 is VA/4096.  
The ideal transfer characteristic is shown in Figure 3. The  
transition from an output code of 0000 0000 0000 to a code  
of 0000 0000 0001 is at 1/2 LSB, or a voltage of VA/8192.  
Other code transitions occur at steps of one LSB.  
Applications Information (Continued)  
3.0 ADC124S021 TRANSFER FUNCTION  
The output format of the ADC124S021 is straight binary.  
Code transitions occur midway between successive integer  
20124311  
FIGURE 3. Ideal Transfer Characteristic  
4.0 TYPICAL APPLICATION CIRCUIT  
will degrade device noise performance. To keep noise off the  
supply, use a dedicated linear regulator for this device, or  
provide sufficient decoupling from other circuitry to keep  
noise off the ADC124S021 supply pin. Because of the  
ADC124S021’s low power requirements, it is also possible to  
use a precision reference as a power supply to maximize  
performance. The four-wire interface is also shown con-  
nected to a microprocessor or DSP.  
A typical application of the ADC124S021 is shown in Figure  
4. Power is provided in this example by the National Semi-  
conductor LP2950 low-dropout voltage regulator, available in  
a variety of fixed and adjustable output voltages. The power  
supply pin is bypassed with a capacitor network located  
close to the ADC124S021. Because the reference for the  
ADC124S021 is the supply voltage, any noise on the supply  
20124313  
FIGURE 4. Typical Application Circuit  
17  
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The user may trade off throughput for power consumption by  
simply performing fewer conversions per unit time. The  
Power Consumption vs. Sample Rate curve in the Typical  
Performance Curves section shows the typical power con-  
sumption of the ADC124S021 versus throughput. To calcu-  
late the power consumption, simply multiply the fraction of  
time spent in the normal mode by the normal mode power  
consumption , and add the fraction of time spent in shutdown  
mode multiplied by the shutdown mode power dissipation.  
Applications Information (Continued)  
5.0 ANALOG INPUTS  
An equivalent circuit for one of the ADC124S021’s input  
channels is shown in Figure 5. Diodes D1 and D2 provide  
ESD protection for the analog inputs. At no time should any  
input go beyond (VA + 300 mV) or (GND − 300 mV), as these  
ESD diodes will begin conducting, which could result in  
erratic operation.  
The capacitor C1 in Figure 5 has a typical value of 3 pF, and  
is mainly the package pin capacitance. Resistor R1 is the on  
resistance of the multiplexer and track / hold switch, and is  
typically 500 ohms. Capacitor C2 is the ADC124S021 sam-  
pling capacitor, and is typically 30 pF. The ADC124S021 will  
deliver best performance when driven by a low-impedance  
source to eliminate distortion caused by the charging of the  
sampling capacitance. This is especially important when  
using the ADC124S021 to sample AC signals. Also important  
when sampling dynamic signals is a band-pass or low-pass  
filter to reduce harmonics and noise, improving dynamic  
performance.  
7.1 Power Management  
When the ADC124S021 is operated continuously in normal  
mode, the maximum throughput is fSCLK/16. Throughput  
may be traded for power consumption by running fSCLK at its  
maximum 3.2 MHz and performing fewer conversions per  
unit time, putting the ADC124S021 into shutdown mode  
between conversions. A plot of typical power consumption  
versus throughput is shown in the Typical Performance  
Curves section. To calculate the power consumption for a  
given throughput, multiply the fraction of time spent in the  
normal mode by the normal mode power consumption and  
add the fraction of time spent in shutdown mode multiplied  
by the shutdown mode power consumption. Generally, the  
user will put the part into normal mode and then put the part  
back into shutdown mode. Note that the curve of power  
consumption vs. throughput is nearly linear. This is because  
the power consumption in the shutdown mode is so small  
that it can be ignored for all practical purposes.  
7.2 Power Supply Noise Considerations  
The charging of any output load capacitance requires cur-  
rent from the power supply, VA. The current pulses required  
from the supply to charge the output capacitance will cause  
voltage variations on the supply. If these variations are large  
enough, they could degrade SNR and SINAD performance  
of the ADC. Furthermore, discharging the output capaci-  
tance when the digital output goes from a logic high to a logic  
low will dump current into the die substrate, which is resis-  
tive. Load discharge currents will cause "ground bounce"  
noise in the substrate that will degrade noise performance if  
that current is large enough. The larger is the output capaci-  
tance, the more current flows through the die substrate and  
the greater is the noise coupled into the analog channel,  
degrading noise performance.  
20124314  
FIGURE 5. Equivalent Input Circuit  
6.0 DIGITAL INPUTS AND OUTPUTS  
The ADC124S021’s digital output DOUT is limited by, and  
cannot exceed, the supply voltage, VA. The digital input pins  
are not prone to latch-up and, and although not recom-  
mended, SCLK, CS and DIN may be asserted before VA  
without any latchup risk.  
7.0 POWER SUPPLY CONSIDERATIONS  
To keep noise out of the power supply, keep the output load  
capacitance as small as practical. If the load capacitance is  
greater than 35 pF, use a 100 series resistor at the ADC  
output, located as close to the ADC output pin as practical.  
This will limit the charge and discharge current of the output  
capacitance and improve noise performance.  
The ADC124S021 is fully powered-up whenever CS is low,  
and fully powered-down whenever CS is high, with one  
exception: the ADC124S021 automatically enters power-  
down mode between the 16th falling edge of a conversion  
and the 1st falling edge of the subsequent conversion (see  
Timing Diagrams).  
The ADC124S021 can perform multiple conversions back to  
back; each conversion requires 16 SCLK cycles. The  
ADC124S021 will perform conversions continuously as long  
as CS is held low.  
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18  
Physical Dimensions inches (millimeters) unless otherwise noted  
10-Lead MSOP  
Order Number ADC124S021CIMM, ADC124S021CIMMX  
NS Package Number P0MUB10A  
National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves  
the right at any time without notice to change said circuitry and specifications.  
For the most current product information visit us at www.national.com.  
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NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS  
WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT AND GENERAL COUNSEL OF NATIONAL SEMICONDUCTOR  
CORPORATION. As used herein:  
1. Life support devices or systems are devices or systems  
which, (a) are intended for surgical implant into the body, or  
(b) support or sustain life, and whose failure to perform when  
properly used in accordance with instructions for use  
provided in the labeling, can be reasonably expected to result  
in a significant injury to the user.  
2. A critical component is any component of a life support  
device or system whose failure to perform can be reasonably  
expected to cause the failure of the life support device or  
system, or to affect its safety or effectiveness.  
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