ADC12040CIVYX [NSC]
12-Bit, 40 MSPS, 340 mW A/D Converter with Internal Sample-and-Hold; 12位， 40 MSPS ， 340 mW的A / D转换器，具有内部采样和保持
| 型号： | ADC12040CIVYX |
| 厂家： | 
National Semiconductor |
| 描述： | 12-Bit, 40 MSPS, 340 mW A/D Converter with Internal Sample-and-Hold |
| 文件： | 总20页 (文件大小：515K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
June 2003
ADC12040
12-Bit, 40 MSPS, 340 mW A/D Converter with Internal
Sample-and-Hold
General Description
Features
n Single supply operation
n Internal sample-and-hold
n Outputs 2.5V to 5V compatible
n TTL/CMOS compatible input/outputs
n Low power consumption
n Power down mode
The ADC12040 is a monolithic CMOS analog-to-digital con-
verter capable of converting analog input signals into 12-bit
digital words at 40 Megasamples per second (MSPS), mini-
mum. This converter uses a differential, pipeline architecture
with digital error correction and an on-chip sample-and-hold
circuit to minimize die size and power consumption while
providing excellent dynamic performance. Operating on a
single 5V power supply, this device consumes just 340 mW
at 40 MSPS, including the reference current. The Power
Down feature reduces power consumption to 40 mW.
n On-chip reference buffer
Key Specifications
n Resolution
n Conversion Rate
n DNL
12 Bits
40 MSPS (min)
0.4 LSB (typ)
0.7 LSB (typ)
69 dB (typ)
11.2 bits (typ)
6 Clock Cycles
+5V 5%
The differential inputs provide a full scale input swing equal
to VREF with the possibility of a single-ended input. Full use
of the differential input is recommended for optimum perfor-
mance. For ease of use, the buffered, high impedance,
single-ended reference input is converted on-chip to a differ-
ential reference for use by the processing circuitry. Output
data format is 12-bit offset binary.
n INL
n SNR (fIN = 10MHz)
n ENOB (fIN = 10MHz)
n Data Latency
n Supply Voltage
n Power Consumption, 40 MHz
This device is available in the 32-lead LQFP package and
will operate over the industrial temperature range of −40˚C to
+85˚C.
340 mW (typ)
Applications
n Ultrasound and Imaging
n Instrumentation
n Cellular Base Stations/Communications Receivers
n Sonar/Radar
n xDSL
n Wireless Local Loops/Cable Modems
n HDTV/DTV
n DSP Front Ends
Connection Diagram
20014801
© 2003 National Semiconductor Corporation
DS200148
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Ordering Information
Industrial (−40˚C ≤ TA ≤ +85˚C)
Package
32 Pin LQFP
ADC12040CIVY
ADC12040CIVYX
ADC12040EVAL
32 Pin LQFP Tape and Reel
Evaluation Board
Block Diagram
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2
Pin Descriptions and Equivalent Circuits
Pin No.
Symbol
Equivalent Circuit
Description
ANALOG I/O
Non-Inverting analog signal Input. With a 2.0V reference
voltage, the differential input signal level is 2.0 VP-P centered
+
2
3
VIN
on VCM
.
Inverting analog signal Input. With a 2.0V reference voltage
the input signal level is 2.0 VP-P centered on VCM. This pin
may be connected to VCM for single-ended operation, but a
differential input signal is required for best performance.
−
VIN
Reference input. This pin should be bypassed to AGND with
a 0.1 µF monolithic capacitor. VREF is 2.0V nominal and
should be between 1.0V to 2.2V.
1
VREF
31
32
30
VRP
VRM
VRN
These pins are high impedance reference bypass pins only.
Connect a 0.1 µF capacitor from each of these pins to AGND.
DO NOT connect anything else to these pins.
DIGITAL I/O
Digital clock input. The range of frequencies for this input is
100 kHz to 50 MHz (typical) with guaranteed performance at
40 MHz. The input is sampled on the rising edge of this input.
10
CLK
OE
OE is the output enable pin that, when low, enables the
™
TRI-STATE data output pins. When this pin is high, the
11
8
outputs are in a high impedance state.
PD is the Power Down input pin. When high, this input puts
the converter into the power down mode. When this pin is
low, the converter is in the active mode.
PD
3
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Pin Descriptions and Equivalent Circuits (Continued)
Pin No.
Symbol
Equivalent Circuit
Description
Digital data output pins that make up the 12-bit conversion
results. D0 is the LSB, while D11 is the MSB of the offset
binary output word. Output levels are TTL/CMOS compatible.
14–19,
22–27
D0–D11
ANALOG POWER
Positive analog supply pins. These pins should be connected
to a quiet +5V voltage source and bypassed to AGND with
0.1 µF monolithic capacitors located within 1 cm of these
power pins, and with a 10 µF capacitor.
5, 6, 29
VA
4, 7, 28
AGND
The ground return for the analog supply.
DIGITAL POWER
Positive digital supply pin. This pin should be connected to
the same quiet +5V source as is VA and bypassed to DGND
with a 0.1 µF monolithic capacitor in parallel with a 10 µF
capacitor, both located within 1 cm of the power pin.
The ground return for the digital supply.
13
VD
9, 12
DGND
Positive digital supply pin for the ADC12040’s output drivers.
This pin should be connected to a voltage source of +2.5V to
+5V and bypassed to DR GND with a 0.1 µF monolithic
capacitor. If the supply for this pin is different from the supply
used for VA and VD, it should also be bypassed with a 10 µF
tantalum capacitor. VDR should never exceed the voltage on
VD. All bypass capacitors should be located within 1 cm of the
supply pin.
21
20
VDR
The ground return for the digital supply for the ADC12040’s
output drivers. This pin should be connected to the system
digital ground, but not be connected in close proximity to the
ADC12040’s DGND or AGND pins. See Section 5 (Layout
and Grounding) for more details.
DR GND
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Absolute Maximum Ratings (Notes 1,
Operating Ratings (Notes 1, 2)
2)
Operating Temperature
Supply Voltage (VA, VD)
Output Driver Supply (VDR
VREF Input
−40˚C ≤ TA ≤ +85˚C
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
+4.75V to +5.25V
+2.35V to VD
)
1.0V to 2.2V
VA, VD, VDR
6.5V
≤ 100 mV
CLK, PD, OE
−0.05V to (VD + 0.05V)
−0V to (VA − 0.5V)
≤100mV
|VA–VD|
VIN Input
Voltage on Any Input or Output Pin
−0.3V to (VA or VD
+0.3V)
|AGND–DGND|
Input Current at Any Pin (Note 3)
Package Input Current (Note 3)
Package Dissipation at TA = 25˚C
ESD Susceptibility
25 mA
50 mA
See (Note 4)
Human Body Model (Note 5)
Machine Model (Note 5)
Soldering Temperature,
2500V
250V
Infrared, 10 sec. (Note 6)
Storage Temperature
235˚C
−65˚C to +150˚C
Converter Electrical Characteristics
Unless otherwise specified, the following specifications apply for AGND = DGND = DR GND = 0V, VA = VD = +5V, VDR
=
+3.0V, PD = 0V, VREF = +2.0V, fCLK = 40 MHz, tr = tf = 3 ns, CL = 20 pF/pin. Boldface limits apply for TA = TJ = TMIN to
TMAX: all other limits TA = TJ = 25˚C (Notes 7, 8, 9)
Typical
(Note 10) (Note 10)
Limits
Units
(Limits)
Symbol
Parameter
Conditions
STATIC CONVERTER CHARACTERISTICS
Resolution with No Missing Codes
12
Bits (min)
LSB (max)
LSB (max)
%FS (max)
%FS (max)
INL
DNL
GE
Integral Non Linearity (Note 11)
Differential Non Linearity
Gain Error
0.7
0.4
1.8
1.0
2.1
0.9
0
0.1
Offset Error (VIN+ = VIN−)
Under Range Output Code
Over Range Output Code
−0.1
0
4095
4095
DYNAMIC CONVERTER CHARACTERISTICS
FPBW
Full Power Bandwidth
0 dBFS Input, Output at −3 dB
fIN 1 MHz, VIN −0.5 dBFS
100
70
MHz
dB
SNR
Signal-to-Noise Ratio
fIN = 10 MHz, VIN = −0.5 dBFS
fIN = 1 MHz, VIN = −0.5 dBFS
fIN = 10 MHz, VIN = −0.5 dBFS
fIN = 1 MHz, VIN = −0,5 dBFS
fIN = 10 MHz, VIN = −0,5 dBFS
fIN = 1 MHz, VIN = −0,5 dBFS
fIN = 10 MHz, VIN = −0,5 dBFS
fIN = 1 MHz, VIN = −0,5 dBFS
fIN = 10 MHz, VIN = −0.5 dBFS
fIN = 9.5 MHz and 10.5 MHz,
each = −8 dBFS
69.5
69.5
69
66.5
66
dB (min)
dB
SINAD
ENOB
THD
Signal-to-Noise and Distortion
Effective Number of Bits
dB (min)
Bits
11.2
11.2
−82
−80
86
10.7
−67
-68
Bits (min)
dB
Total Harmonic Distortion
Spurious Free Dynamic Range
Intermodulation Distortion
dB (max)
dB
SFDR
IMD
84
dB (min)
−75
dBFS
5
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Converter Electrical Characteristics (Continued)
Unless otherwise specified, the following specifications apply for AGND = DGND = DR GND = 0V, VA = VD = +5V, VDR
=
+3.0V, PD = 0V, VREF = +2.0V, fCLK = 40 MHz, tr = tf = 3 ns, CL = 20 pF/pin. Boldface limits apply for TA = TJ = TMIN to
TMAX: all other limits TA = TJ = 25˚C (Notes 7, 8, 9)
Typical
(Note 10) (Note 10)
Limits
Units
(Limits)
Symbol
Parameter
Conditions
REFERENCE AND ANALOG INPUT CHARACTERISTICS
VCM
CIN
Common Mode Input Voltage
VA/2
V
pF
(CLK LOW)
(CLK HIGH)
8
7
VIN Input Capacitance (each pin to
GND)
VIN = 2.5 Vdc
+ 0.7 Vrms
pF
1.0
V (min)
V (max)
MΩ (min)
VREF
Reference Voltage (Note 13)
Reference Input Resistance
2.00
2.2
100
DC and Logic Electrical Characteristics
Unless otherwise specified, the following specifications apply for AGND = DGND = DR GND = 0V, VA = VD = +5V, VDR
=
+3.0V, PD = 0V, VREF = +2.0V, fCLK = 40 MHz, tr = tf = 3 ns, CL = 20 pF/pin. Boldface limits apply for TA = TJ = TMIN to
TMAX: all other limits TA = TJ = 25˚C (Notes 7, 8, 9)
Typical
(Note 10) (Note 10)
Limits
Units
(Limits)
Symbol
Parameter
Conditions
CLK, PD, OE DIGITAL INPUT CHARACTERISTICS
VIN(1)
VIN(0)
IIN(1)
IIN(0)
CIN
Logical “1” Input Voltage
Logical “0” Input Voltage
Logical “1” Input Current
Logical “0” Input Current
Digital Input Capacitance
VD = 5.25V
VD = 4.75V
VIN = 5.0V
VIN = 0V
2.0
V (min)
V (max)
µA
1.0
10
−10
5
µA
pF
D0–D11 DIGITAL OUTPUT CHARACTERISTICS
VDR = 2.5V
VDR = 3V
2.3
V (min)
V (min)
V (max)
nA
VOUT(1)
VOUT(0)
IOZ
Logical “1” Output Voltage
Logical “0” Output Voltage
TRI-STATE Output Current
IOUT = −0.5 mA
2.7
IOUT = 1.6 mA, VDR = 3V
VOUT = 2.5V or 5V
0.4
100
VOUT = 0V
−100
nA
+ISC
Output Short Circuit Source
Current
VOUT = 0V
−20
20
mA (min)
mA (min)
−ISC
Output Short Circuit Sink Current
VOUT = VDR
POWER SUPPLY CHARACTERISTICS
PD Pin = DGND, VREF = 2.0V
PD Pin = VDR
59
8
66
mA (max)
mA
IA
Analog Supply Current
PD Pin = DGND
6
7.3
mA (max)
mA
ID
Digital Supply Current
PD Pin = VDR, fCLK = 0
0
PD Pin = DGND, CL = 0 pF (Note 14)
PD Pin = VDR, fCLK = 0
3
mA (max)
mA
IDR
Digital Output Supply Current
Total Power Consumption
0
PD Pin = DGND, CL = 0 pF (Note 15)
PD Pin = VDR, fCLK = 0
340
40
366
mW
mW
Rejection of Full-Scale Error with
VA = 4.75V vs. 5.25V
PSRR1 Power Supply Rejection
PSRR2 Power Supply Rejection
58
50
dB
dB
SNR Degradation w/10 MHz,
200 mVP-P riding on VA
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6
AC Electrical Characteristics
Unless otherwise specified, the following specifications apply for AGND = DGND = DR GND = 0V, VA = VD = +5V, VDR
=
+3.0V, PD = 0V, VREF = +2.0V, fCLK = 40 MHz, tr = tf = 3 ns, CL = 20 pF/pin. Boldface limits apply for TA = TJ = TMIN to
TMAX: all other limits TA = TJ = 25˚C (Notes 7, 8, 9, 12)
Typical
(Note 10) (Note 10)
Limits
Units
(Limits)
MHz (min)
kHz
Symbol
Parameter
Conditions
1
fCLK
Maximum Clock Frequency
Minimum Clock Frequency
Clock High Time
50
40
2
fCLK
100
tCH
tCL
11.25
11.25
ns (min)
ns (min)
Clock
Clock Low Time
tCONV
tOD
Conversion Latency
6
Cycles
ns (max)
ns (min)
ns (max)
ns (min)
ns
Data Output Delay after Rising
CLK Edge
16.3
15.9
15.7
14.9
VDR = 2.5V
VDR = 3.0V
12
11
tAD
tAJ
Aperture Delay
1.2
1.2
Aperture Jitter
ps rms
tDIS
Data outputs into TRI-STATE
4
ns
™
Mode
tEN
tPD
Data Outputs Active after
TRI-STATE
4
ns
Power Down Mode Exit Cycle
20
tCLK
Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is
functional, but do not guarantee specific performance limits. For guaranteed specifications and test conditions, see the Electrical Characteristics. The guaranteed
specifications apply only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under the listed test
conditions.
Note 2: All voltages are measured with respect to GND = AGND = DGND = 0V, unless otherwise specified.
<
>
V ), the current at that pin should be limited to 25 mA. The
Note 3: When the input voltage at any pin exceeds the power supplies (that is, V
AGND, or V
IN
IN
A
50 mA maximum package input current rating limits the number of pins that can safely exceed the power supplies with an input current of 25 mA to two.
Note 4: The absolute maximum junction temperature (T max) for this device is 150˚C. The maximum allowable power dissipation is dictated by T max, the
J
J
junction-to-ambient thermal resistance (θ ), and the ambient temperature, (T ), and can be calculated using the formula P MAX = (T max - T )/θ . In the 32-pin
JA
A
D
J
A
JA
LQFP, θ is 79˚C/W, so P MAX = 1,582 mW at 25˚C and 823 mW at the maximum operating ambient temperature of 85˚C. Note that the power consumption of
JA
D
this device under normal operation will typically be about 360 mW (340 typical power consumption + 20 mW TTL output loading). The values for maximum power
dissipation listed above will be reached only when the device is operated in a severe fault condition (e.g. when input or output pins are driven beyond the power
supply voltages, or the power supply polarity is reversed). Obviously, such conditions should always be avoided.
Note 5: Human body model is 100 pF capacitor discharged through a 1.5 kΩ resistor. Machine model is 220 pF discharged through 0Ω.
Note 6: The 235˚C reflow temperature refers to infrared reflow. For Vapor Phase Reflow (VPR), the following Conditions apply: Maintain the temperature at the top
of the package body above 183˚C for a minimum 60 seconds. The temperature measured on the package body must not exceed 220˚C. Only one excursion above
183˚C is allowed per reflow cycle.
Note 7: The inputs are protected as shown below. Input voltage magnitudes above V or below GND will not damage this device, provided current is limited per
A
(Note 3). However, errors in the A/D conversion can occur if the input goes above V or below GND by more than 100 mV. As an example, if V is 4.75V, the full-scale
A
A
input voltage must be ≤4.85V to ensure accurate conversions.
20014807
Note 8: To guarantee accuracy, it is required that |V –V | ≤ 100 mV and separate bypass capacitors are used at each power supply pin.
A
D
Note 9: With the test condition for V
= +2.0V (4V
differential input), the 12-bit LSB is 977 µV.
P-P
REF
7
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AC Electrical Characteristics (Continued)
Note 10: Typical figures are at T = T = 25˚C, and represent most likely parametric norms. Test limits are guaranteed to National’s AOQL (Average Outgoing Quality
A
J
Level).
Note 11: Integral Non Linearity is defined as the deviation of the analog value, expressed in LSBs, from the straight line that passes through positive and negative
full-scale.
Note 12: Timing specifications are tested at TTL logic levels, V = 0.4V for a falling edge and V = 2.4V for a rising edge.
IL
IH
Note 13: Optimum performance will be obtained by keeping the reference input in the 1.8V to 2.2V range. The LM4051CIM3-ADJ (SOT-23 package) is
recommended for this application.
Note 14: I is the current consumed by the switching of the output drivers and is primarily determined by load capacitance on the output pins, the supply voltage,
DR
V
, and the rate at which the outputs are switching (which is signal dependent). I =V (C x f + C x f +....C x f ) where V is the output driver power supply
DR
DR DR 0 0 1 1 11 11 DR
voltage, C is total capacitance on the output pin, and f is the average frequency at which that pin is toggling.
n
n
Note 15: Excludes I . See note 14.
DR
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NEGATIVE FULL SCALE ERROR is the difference between
Specification Definitions
1
the actual first code transition and its ideal value of
⁄2 LSB
APERTURE DELAY is the time after the rising edge of the
clock to when the input signal is acquired or held for conver-
sion.
above negative full scale.
OFFSET ERROR is the difference between the two input
voltages (VIN + –VIN−) required to cause a transition from
code 2047 to 2048.
APERTURE JITTER (APERTURE UNCERTAINTY) is the
variation in aperture delay from sample to sample. Aperture
jitter manifests itself as noise in the output.
OUTPUT DELAY is the time delay after the rising edge of
the clock before the data update is presented at the output
pins.
COMMON MODE VOLTAGE (VCM) is the d.c. potential
present at both signal inputs to the ADC.
PIPELINE DELAY (LATENCY) is the number of clock cycles
between initiation of conversion and when that data is pre-
sented to the output driver stage. Data for any given sample
is available at the output pins the Pipeline Delay plus the
Output Delay after the sample is taken. New data is available
at every clock cycle, but the data lags the conversion by the
pipeline delay.
CONVERSION LATENCY See PIPELINE DELAY.
DIFFERENTIAL NON-LINEARITY (DNL) is the measure of
the maximum deviation from the ideal step size of 1 LSB.
DUTY CYCLE is the ratio of the time during one cycle that a
repetitive digital waveform is high to the total time of one
period. The specification here refers to the ADC clock input
signal.
POSITIVE FULL SCALE ERROR is the difference between
the actual last code transition and its ideal value of 11⁄
below positive full scale.
2
LSB
EFFECTIVE NUMBER OF BITS (ENOB, or EFFECTIVE
BITS) is another method of specifying Signal-to-Noise and
Distortion or SINAD. ENOB is defined as (SINAD - 1.76) /
6.02 and says that the converter is equivalent to a perfect
ADC of this (ENOB) number of bits.
POWER SUPPLY REJECTION RATIO (PSRR) is a mea-
sure of how well the ADC rejects a change in the power
supply voltage. For the ADC12040, PSRR1 is the ratio of the
change in Full-Scale Error that results from a change in the
dc power supply voltage, expressed in dB. PSRR2 is a
measure of how well an a.c. signal riding upon the power
supply is rejected at the output.
FULL POWER BANDWIDTH is a measure of the frequency
at which the reconstructed output fundamental drops 3 dB
below its low frequency value for a full scale input.
GAIN ERROR is the deviation from the ideal slope of the
SIGNAL TO NOISE RATIO (SNR) is the ratio, expressed in
dB, of the rms value of the input signal to the rms value of the
sum of all other spectral components below one-half the
sampling frequency, not including harmonics or dc,
transfer function. It can be calculated as:
Gain Error = Positive Full Scale Error − Offset Error
INTEGRAL NON LINEARITY (INL) is a measure of the
deviation of each individual code from a line drawn from
SIGNAL TO NOISE PLUS DISTORTION (S/N+D or SINAD)
Is the ratio, expressed in dB, of the rms value of the input
signal to the rms value of all of the other spectral compo-
nents below half the clock frequency, including harmonics
but excluding dc.
negative full scale (1⁄
2
LSB below the first code transition)
through positive full scale (1⁄
2
LSB above the last code
transition). The deviation of any given code from this straight
line is measured from the center of that code value.
INTERMODULATION DISTORTION (IMD) is the creation of
additional spectral components as a result of two sinusoidal
frequencies being applied to the ADC input at the same time.
It is defined as the ratio of the power in the intermodulation
products to the total power in the original frequencies. IMD is
usually expressed in dBFS.
SPURIOUS FREE DYNAMIC RANGE (SFDR) is the differ-
ence, expressed in dB, between the rms values of the input
signal and the peak spurious signal, where a spurious signal
is any signal present in the output spectrum that is not
present at the input.
TOTAL HARMONIC DISTORTION (THD) is the ratio, ex-
pressed in dB or dBc, of the rms total of the first six harmonic
components to the rms value of the input signal.
MISSING CODES are those output codes that will never
appear at the ADC outputs. The ADC12040 is guaranteed
not to have any missing codes.
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Timing Diagram
20014809
Output Timing
Transfer Characteristic
20014810
FIGURE 1. Transfer Characteristic
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Typical Performance Characteristics VA = VD = 5V, VDR = 3V, fCLK = 40 MHz, fIN = 10 MHz unless
otherwise stated
DNL
DNL vs. Temperature
INL
DNL vs. VA
DNL vs. Clock Duty Cycle
INL vs. VA
20014818
20014821
20014819
20014822
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Typical Performance Characteristics VA = VD = 5V, VDR = 3V, fCLK = 40 MHz, fIN = 10 MHz unless
otherwise stated (Continued)
INL vs. Temperature
SNR vs. Temperature
SINAD vs. Temperature
INL vs. Clock Duty Cycle
20014824
20014827
20014826
20014831
THD vs. Temperature
20014828
SNR vs. Clock Duty Cycle
20014825
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Typical Performance Characteristics VA = VD = 5V, VDR = 3V, fCLK = 40 MHz, fIN = 10 MHz unless
otherwise stated (Continued)
THD vs. Clock Duty Cycle
SINAD and ENOB vs. Clock Duty Cycle
20014832
20014833
@
IMD F1 = 9.5MHz, F2 = 10.5MHz
Spectral Response
20014829
20014834
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Functional Description
Operating on a single +5V supply, the ADC12040 uses a
pipeline architecture and has error correction circuitry to help
ensure maximum performance. The differential analog input
signal is digitized to 12 bits.
The reference input is buffered to ease the task of driving
that pin.
The output word rate is the same as the clock frequency,
which can be between 100 kSPS and 50 MSPS (typical).
The analog input voltage is acquired at the rising edge of the
clock and the digital data for a given sample is delayed by
the pipeline for 6 clock cycles.
A logic high on the power down (PD) pin reduces the con-
verter power consumption to 70 mW.
20014811
FIGURE 2. Expected Input Signal Range
Applications Information
The ADC12040 performs best with a differential input with
each input centered around VCM. The peak-to-peak voltage
swing at both VIN+ and VIN− should not exceed the value of
the reference voltage or the output data will be clipped. The
two input signals should be exactly 180˚ out of phase from
each other and of the same amplitude. For single frequency
inputs, angular errors result in a reduction of the effective full
scale input. For a complex waveform, however, angular
errors will result in distortion.
1.0 OPERATING CONDITIONS
We recommend that the following conditions be observed for
operation of the ADC12040:
4.75V ≤ VA ≤ 5.25V
VD = VA
2.35V ≤ VDR ≤ VD
100 kHz ≤ fCLK ≤ 50 MHz
1.0V ≤ VREF ≤ 2.2V
For angular deviations of up to 10 degrees from these two
signals being 180 out of phase, the full scale error in LSB
can be described as approximately
1.1 ANALOG INPUTS
EFS = dev1.79
The ADC12040 has two analog signal inputs, VIN+ and VIN−.
These two pins form a differential input pair. There is one
Where dev is the angular difference between the two signals
having a 180˚ relative phase relationship to each other (see
Figure 3). Drive the analog inputs with a source impedance
less than 100Ω.
reference input pin, VREF
.
1.2 REFERENCE PINS
The ADC12040 is designed to operate with a 2.0V reference,
but performs well with reference voltages in the range of
1.0V to 2.2V. Lower reference voltages will decrease the
signal-to-noise ratio (SNR) of the ADC12040. Increasing the
reference voltage (and the input signal swing) beyond 2.2V
will degrade THD for a full-scale input. It is very important
that all grounds associated with the reference voltage and
the input signal make connection to the analog ground plane
at a single point to minimize the effects of noise currents in
the ground path.
20014812
The three Reference Bypass Pins (VRP, VRM and VRN) are
made available for bypass purposes only. These pins should
each be bypassed to ground with a 0.1 µF capacitor. DO
NOT LOAD these pins.
FIGURE 3. Angular Errors Between the Two Input
Signals Will Reduce the Output Level
For differential operation, each analog input signal should
have a peak-to-peak voltage equal to the input reference
1.3 SIGNAL INPUTS
voltage, VREF, and be centered around VCM
.
The signal inputs are VIN+ and VIN−. The input signal, VIN, is
defined as
TABLE 1. Input to Output Relationship—
Differential Input
VIN = (VIN+) – (VIN−)
Figure 2 shows the expected input signal range.
+
VIN
−
VIN
Output
Note that the common mode input voltage range is 1V to 3V
with a nominal value of VA/2. The input signals should re-
main between ground and 4V.
VCM − VREF/2
VCM − VREF/4
VCM
VCM + VREF/2
VCM + VREF/4
VCM
0000 0000 0000
0100 0000 0000
1000 0000 0000
1100 0000 0000
1111 1111 1111
The Peaks of the individual input signals (VIN+ and VIN−)
should each never exceed the voltage described as
VCM + VREF/2
VCM + VREF/2
VCM − VREF/4
VCM − VRE/2F
VIN+, VIN− = VREF/2 + VCM ≤ 4V (differential)
to maintain THD and SINAD performance.
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14
1.3.3 Input Common Mode Voltage
Applications Information (Continued)
The input common mode voltage, VCM, should be in the
range of 0.4V to 4.0V and be of a value such that the peak
excursions of the analog input signal do not go more nega-
tive than ground or more positive than 1V below the VA
supply voltage. The nominal VCM should generally be equal
to VREF/2, but VRM can be used as a VCM source as long as
VRM need not supply more than 10 µA of current.
TABLE 2. Input to Output Relationship—
Single-Ended Input
+
VIN
−
VIN
Output
VCM − VREF
VCM − VREF/2
VCM
VCM
VCM
VCM
VCM
VCM
0000 0000 0000
0100 0000 0000
1000 0000 0000
1100 0000 0000
1111 1111 1111
2.0 DIGITAL INPUTS
VCM + VREF/2
VCM +VREF
Digital inputs consist of CLK, OE and PD.
2.1 CLK
The CLK signal controls the timing of the sampling process.
Drive the clock input with a stable, low jitter clock signal in
the range of 100 kHz to 50 MHz with rise and fall times of
less than 3ns. The trace carrying the clock signal should be
as short as possible and should not cross any other signal
line, analog or digital, not even at 90˚.
1.3.1 Single-Ended Operation
single-ended performance is lower than with differential input
signals, so single-ended operation is not recommended.
However, if single-ended operation is required, one of the
analog inputs should be connected to the d.c. common
mode voltage of the driven input. The peak-to-peak differen-
tial input signal should be twice the reference voltage to
maximize SNR and SINAD performance (Figure 2b).
If the CLK is interrupted, or its frequency too low, the charge
on internal capacitors can dissipate to the point where the
accuracy of the output data will degrade. This is what limits
the lowest sample rate to 100 kSPS.
For example, set VREF to 1.0V and bias VIN− to 1.0V and
drive VIN+ with a signal range of 0V to 2.0V.
The CLK pin should be terminated with a series 100Ω resis-
tor and 51 pF capacitor to ground located within two centi-
meters of the ADC12040 clock pin, as shown in Figure 4.
Whenever the trace between the clock source and the ADC
clock pin is greater than 1 cm, use a 50Ω series resistor in
the clock line, located within 1 cm of the driving source.
Because very large input signal swings can degrade distor-
tion performance, better performance with a single-ended
input can be obtained by reducing the reference voltage
while maintaining a full-range output. Table 1 and Table 2
indicate the input to output relationship of the ADC12040.
2.2 OE
1.3.2 Driving the Analog Inputs
The OE pin, when high, puts the output pins into a high
impedance state. When this pin is low the outputs are in the
active state. The ADC12040 will continue to convert whether
this pin is high or low, but the output can not be read while
the OE pin is high.
The VIN+ and the VIN− inputs of the ADC12040 consist of an
analog switch followed by a switched-capacitor amplifier.
The capacitance seen at the analog input pins changes with
the clock level, appearing as 8 pF when the clock is low, and
7 pF when the clock is high. Although this difference is small,
a dynamic capacitance is more difficult to drive than is a
fixed capacitance, so choose the driving amplifier carefully.
The LMH6702 is a good amplifier for driving the ADC12040.
2.3 PD
The PD pin, when high, holds the ADC12040 in a power-
down mode to conserve power when the converter is not
being used. The power consumption in this state is 70 mW
with a 40MHz clock and 40mW if the clock is stopped. The
output data pins are undefined in this mode. The data in the
pipeline is corrupted while in the power down mode.
The internal switching action at the analog inputs causes
energy to be output from the input pins. As the driving source
tries to compensate for this, it adds noise to the signal. To
prevent this, use 33Ω series resistors at each of the signal
inputs with a 10 pF capacitor across the inputs, as can be
seen in Figure 5 and Figure 6. These components should be
placed close to the ADC because the input pins of the ADC
is the most sensitive part of the system and this is the last
opportunity to filter the input. The 10 pF capacitor is for
undersampling applications and should be replaced with a
68 pF capacitor for Nyquist applications.
3.0 OUTPUTS
The ADC12040 has 12 TTL/CMOS compatible Data Output
pins. Valid data is present at these outputs while the OE and
PD pins are low. While the tOD time provides information
about output timing, a simple way to capture a valid output is
to latch the data on the falling edge of the conversion clock
(pin 10). The output data format is offset binary.
Table 3 gives component values for Figure 5 to convert
signals to a range of 2.0V 1.0V at each of the differential
input pins of the ADC12040, assuming a VREF of 2.0V.
Be very careful when driving a high capacitance bus. The
more capacitance the output drivers must charge for each
conversion, the more instantaneous digital current flows
through VDR and DR GND. These large charging current
spikes can cause on-chip ground noise and couple into the
analog circuitry, degrading dynamic performance. Adequate
bypassing and careful attention to the ground plane will
reduce this problem. Additionally, bus capacitance beyond
the specified 20 pF/pin will cause tOD to increase, making it
difficult to properly latch the ADC output data. The result
could be an apparent reduction in dynamic performance.
TABLE 3. Resistor Values for Circuit of Figure 5
SIGNAL
R1
R2
R3
R4
R5, R6
RANGE
0 - 0.5V
0 - 1.0V
0.25V
392Ω 1540Ω 102Ω
115Ω 1000Ω
634Ω 1470Ω 2490Ω 1050Ω 499Ω
499Ω
100Ω
499Ω
200Ω
499Ω
100Ω
499Ω 1000Ω
200Ω 499Ω
0.5V
To minimize noise due to output switching, minimize the load
currents at the digital outputs. This can be done by connect-
15
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sistors of 47Ω to 100Ω at the digital outputs, close to the
ADC pins, will isolate the outputs from trace and other circuit
capacitances and limit the output currents, which could oth-
erwise result in performance degradation. See Figure 4.
Applications Information (Continued)
ing buffers between the ADC outputs and any other circuitry
(74ACQ541, for example). Only one input should be con-
nected to each output pin. Additionally, inserting series re-
20014813
FIGURE 4. Simple Application Circuit with Single-Ended to Differential Buffer
20014814
FIGURE 5. Differential Drive Circuit of Figure 4
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16
Applications Information (Continued)
20014815
FIGURE 6. Driving the Signal Inputs with a Transformer
4.0 POWER SUPPLY CONSIDERATIONS
process. To prevent this from happening, the DR GND pins
should NOT be connected to system ground in close prox-
imity to any of the ADC12040’s other ground pins.
The power supply pins should be bypassed with a 10 µF
capacitor and with a 0.1 µF ceramic chip capacitor within a
centimeter of each power pin. Leadless chip capacitors are
preferred because they have low series inductance.
Capacitive coupling between the typically noisy digital cir-
cuitry and the sensitive analog circuitry can lead to poor
performance. The solution is to keep the analog circuitry
separated from the digital circuitry, and to keep the clock line
as short as possible.
As is the case with all high-speed converters, the ADC12040
is sensitive to power supply noise. Accordingly, the noise on
the analog supply pin should be kept below 100 mVP-P
.
Digital circuits create substantial supply and ground current
transients. The logic noise thus generated could have sig-
nificant impact upon system noise performance. The best
logic family to use in systems with A/D converters is one
which employs non-saturating transistor designs, or has low
noise characteristics, such as the 74LS, 74HC(T) and
74AC(T)Q families. The worst noise generators are logic
families that draw the largest supply current transients dur-
ing clock or signal edges, like the 74F and the 74AC(T)
families.
No pin should ever have a voltage on it that is in excess of
the supply voltages, not even on a transient basis. Be espe-
cially careful of this during turn on and turn off of power.
The VDR pin provides power for the output drivers and may
be operated from a supply in the range of 2.35V to VD
(nominal 5V). This can simplify interfacing to 3V devices and
systems. DO NOT operate the VDR pin at a voltage higher
than VD.
5.0 LAYOUT AND GROUNDING
The effects of the noise generated from the ADC output
switching can be minimized through the use of 47Ω to 100Ω
resistors in series with each data output line. Locate these
resistors as close to the ADC output pins as possible.
Proper grounding and proper routing of all signals are es-
sential to ensure accurate conversion. Maintaining separate
analog and digital areas of the board, with the ADC12040
between these areas, is required to achieve specified per-
formance.
Since digital switching transients are composed largely of
high frequency components, total ground plane copper
weight will have little effect upon the logic-generated noise.
This is because of the skin effect. Total surface area is more
important than is total ground plane volume.
The ground return for the data outputs (DR GND) carries the
ground current for the output drivers. The output current can
exhibit high transients that could add noise to the conversion
17
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can cause problems at high frequencies. This is because
other lines can introduce jitter into the clock line, which can
lead to degradation of SNR. Also, the high speed clock can
introduce noise into the analog chain.
Applications Information (Continued)
Generally, analog and digital lines should cross each other at
90˚ to avoid crosstalk. To maximize accuracy in high speed,
high resolution systems, however, avoid crossing analog and
digital lines altogether. It is important to keep clock lines as
short as possible and isolated from ALL other lines, including
other digital lines. Even the generally accepted 90˚ crossing
should be avoided with the clock line as even a little coupling
Best performance at high frequencies and at high resolution
is obtained with a straight signal path. That is, the signal path
through all components should form a straight line wherever
possible.
20014816
FIGURE 7. Example of a Suitable Layout
Be especially careful with the layout of inductors. Mutual
inductance can change the characteristics of the circuit in
which they are used. Inductors should not be placed side by
side, even with just a small part of their bodies beside each
other.
mance, and the clock can introduce noise into other lines.
Even lines with 90˚ crossings have capacitive coupling, so
try to avoid even these 90˚ crossings of the clock line.
The analog input should be isolated from noisy signal traces
to avoid coupling of spurious signals into the input. Any
external component (e.g., a filter capacitor) connected be-
tween the converter’s input pins and ground or to the refer-
ence input pin and ground should be connected to a very
clean point in the analog ground plane.
Figure 7 gives an example of a suitable layout. All analog
circuitry (input amplifiers, filters, reference components, etc.)
should be placed over the analog ground plane. All digital
circuitry and I/O lines should be placed over the digital
ground plane. Furthermore, all components in the reference
circuitry and the input signal chain that are connected to
ground should be connected together with short traces and
enter the analog ground plane at a single point. All ground
connections should have a low inductance path to ground.
20014817
FIGURE 8. Isolating the ADC Clock from other Circuitry
with a Clock Tree
6.0 DYNAMIC PERFORMANCE
To achieve the best dynamic performance, the clock source
driving the CLK input must be free of jitter. Isolate the ADC
clock from any digital circuitry with buffers, as with the clock
tree shown in Figure 8.
7.0 COMMON APPLICATION PITFALLS
Driving the inputs (analog or digital) beyond the power
supply rails. For proper operation, all inputs should not go
more than 100 mV beyond the supply rails (more than
100 mV below the ground pins or 100 mV above the supply
pins). Exceeding these limits on even a transient basis may
cause faulty or erratic operation. It is not uncommon for high
As mentioned in Section 5.0, it is good practice to keep the
ADC clock line as short as possible and to keep it well away
from any other signals. Other signals can introduce jitter into
the clock signal, which can lead to reduced SNR perfor-
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18
Using an inadequate amplifier to drive the analog input.
As explained in Section 1.3, the capacitance seen at the
input alternates between 8 pF and 7 pF, depending upon the
phase of the clock. This dynamic load is more difficult to
drive than is a fixed capacitance.
Applications Information (Continued)
speed digital components (e.g., 74F and 74AC devices) to
exhibit overshoot or undershoot that goes above the power
supply or below ground. A resistor of about 50Ω to 100Ω in
series with any offending digital input, close to the signal
source, will eliminate the problem.
If the amplifier exhibits overshoot, ringing, or any evidence of
instability, even at a very low level, it will degrade perfor-
mance. A small series resistor at each amplifier output and a
capacitor across the analog inputs (as shown in Figures 5, 6)
will improve performance. The CLC409 has been success-
fully used to drive the analog inputs of the ADC12040.
Do not allow input voltages to exceed the supply voltage,
even on a transient basis. Not even during power up or
power down.
Be careful not to overdrive the inputs of the ADC12040 with
a device that is powered from supplies outside the range of
the ADC12040 supply. Such practice may lead to conversion
inaccuracies and even to device damage.
Also, it is important that the signals at the two inputs have
exactly the same amplitude and be exactly 180o out of phase
with each other. Board layout, especially equality of the
length of the two traces to the input pins, will affect the
effective phase between these two signals. Remember that
an operational amplifier operated in the non-inverting con-
figuration will exhibit more time delay than will the same
device operating in the inverting configuration.
Attempting to drive a high capacitance digital data bus.
The more capacitance the output drivers must charge for
each conversion, the more instantaneous digital current
flows through VDR and DR GND. These large charging cur-
rent spikes can couple into the analog circuitry, degrading
dynamic performance. Adequate bypassing and maintaining
separate analog and digital areas on the pc board will reduce
this problem.
Operating with the reference pins outside of the speci-
fied range. As mentioned in Section 1.2, VREF should be in
the range of
Additionally, bus capacitance beyond the specified 20 pF/pin
will cause tOD to increase, making it difficult to properly latch
the ADC output data. The result could, again, be an apparent
reduction in dynamic performance.
1.0V ≤ VREF ≤ 2.2V
Operating outside of these limits could lead to performance
degradation.
Using a clock source with excessive jitter, using exces-
sively long clock signal trace, or having other signals
coupled to the clock signal trace. This will cause the
sampling interval to vary, causing excessive output noise
and a reduction in SNR and SINAD performance.
The digital data outputs should be buffered (with 74ACQ541,
for example). Dynamic performance can also be improved
by adding series resistors at each digital output, close to the
ADC12040, which reduces the energy coupled back into the
converter output pins by limiting the output current. A rea-
sonable value for these resistors is 47Ω to 100Ω.
19
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Physical Dimensions inches (millimeters) unless otherwise noted
32-Lead LQFP Package
Ordering Number ADC12040CIVY
NS Package Number VBE32A
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