ADC10D1500CIUT/NOPB [NSC]
IC 1-CH 10-BIT DELTA-SIGMA ADC, PARALLEL ACCESS, PBGA292, 27 X 27 MM, 2.40 MM HEIGHT, 1.27 MM PITCH, LEAD FREE, MS-034BAL-2, BGA-292, Analog to Digital Converter;
| 型号： | ADC10D1500CIUT/NOPB |
| 厂家： | 
National Semiconductor |
| 描述： | IC 1-CH 10-BIT DELTA-SIGMA ADC, PARALLEL ACCESS, PBGA292, 27 X 27 MM, 2.40 MM HEIGHT, 1.27 MM PITCH, LEAD FREE, MS-034BAL-2, BGA-292, Analog to Digital Converter 转换器 |
| 文件： | 总70页 (文件大小：2077K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
January 6, 2010
ADC10D1000/ADC10D1500
Low Power, 10-Bit, Dual 1.0/1.5 GSPS or Single 2.0/3.0
GSPS ADC
1.0 General Description
2.0 Features
The ADC10D1000/1500 is the latest advance in National's
Ultra-High-Speed ADC family. This low-power, high-perfor-
mance CMOS analog-to-digital converter digitizes signals at
10-bit resolution for dual channels at sampling rates of up to
1.0/1.5 GSPS (Non-DES Mode) or for a single channel up to
2.0/3.0 GSPS (DES Mode). The ADC10D1000/1500
achieves excellent accuracy and dynamic performance while
dissipating less than 2.8/3.6 Watts. The product is packaged
in a leaded or lead-free 292-ball thermally enhanced BGA
package over the rated industrial temperature range of
-40°C to +85°C.
Excellent accuracy and dynamic performance
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Low power consumption, further reduced at lower Fs
Internally terminated, buffered, differential analog inputs
R/W SPI Interface for Extended Control Mode
Dual-Edge Sampling Mode, in which the I- and Q-channels
sample one input at twice the sampling clock rate
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Test patterns at output for system debug
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Programmable 15-bit gain and 12-bit plus sign offset
Programmable tAD adjust feature
1:1 non-demuxed or 1:2 demuxed LVDS outputs
The ADC10D1000/1500 builds upon the features, architec-
ture and functionality of the 8-bit GHz family of ADCs. An
expanded feature set includes AutoSync for multi-chip syn-
chronization, 15-bit programmable gain and 12-bit plus sign
programmable offset adjustment for each channel. The im-
proved internal track-and-hold amplifier and the extended
self-calibration scheme enable a very flat response of all dy-
namic parameters beyond Nyquist, producing 9.1/9.0 Effec-
tive Number of Bits (ENOB) with a 100 MHz input signal and
a 1.0/1.5 GHz sample rate while providing a 10-18 Code Error
Rate (CER) Dissipating a typical 2.77/3.59 Watts in Non-De-
multiplex Mode at 1.0/1.5 GSPS from a single 1.9V supply,
this device is guaranteed to have no missing codes over the
full operating temperature range.
AutoSync feature for multi-chip systems
Single 1.9V ± 0.1V power supply
292-ball BGA package (27mm x 27mm x 2.4mm with
1.27mm ball-pitch); no heat sink required
LC sampling clock filter for jitter reduction
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3.0 Key Specifications
(Non-Demux Non-DES Mode, Fs=1.0/1.5 GSPS, Fin = 100
MHz)
Resolution
10 Bits
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Conversion Rate
Dual channels at 1.0/1.5 GSPS (typ)
Single channel at 2.0/3.0 GSPS (typ)
Code Error Rate
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Each channel has its own independent DDR Data Clock,
DCLKI and DCLKQ, which are in phase when both channels
are powered up, so that only one Data Clock could be used
to capture all data, which is sent out at the same rate as the
input sample clock. If the 1:2 Demux Mode is selected, a sec-
ond 10-bit LVDS bus becomes active for each channel, such
that the output data rate is sent out two times slower to relax
data-capture timing requirements. The part can also be used
as a single 2.0/3.0 GSPS ADC to sample one of the I or Q
inputs. The output formatting can be programmed to be offset
binary or two's complement and the Low Voltage Differential
Signaling (LVDS) digital outputs are compatible with IEEE
1596.3-1996, with the exception of an adjustable common
mode voltage between 0.8V and 1.2V to allow for power re-
duction for well-controlled back planes.
10-18/10-18 (typ)
9.1/9.0 bits (typ)
57/56.8 dB (typ)
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ENOB
SNR
SFDR
Full Power Bandwidth
DNL
70/68 dBc (typ)
2.8/3.1 GHz (typ)
±0.25/±0.25 LSB (typ)
Power Consumption
Single Channel Enabled
Dual Channels Enabled
Power Down Mode
1.61/1.92W (typ)
2.77/3.59W (typ)
6/6 mW (typ)
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4.0 Applications
Wideband Communications
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Data Acquisition Systems
Digital Oscilloscopes
5.0 Ordering Information
Industrial Temperature Range (-40°C < TA < +85°C)
ADC10D1000/1500CIUT/NOPB
ADC10D1000/1500CIUT
NS Package
Lead-free 292-Ball BGA Thermally Enhanced Package
Leaded 292-Ball BGA Thermally Enhanced Package
Reference Board
ADC10D1000/1500RB
If Military/Aerospace specified devices are required, please contract the National Semiconductor Sales Office/Dis-
tributors for availability and specifications. IBIS models are available at: http://www.national.com/analog/adc/
ibis_models.
© 2010 National Semiconductor Corporation
300663
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6.0 Block Diagram
30066353
FIGURE 1. Simplified Block Diagram
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Table of Contents
1.0 General Description ......................................................................................................................... 1
2.0 Features ........................................................................................................................................ 1
3.0 Key Specifications ........................................................................................................................... 1
4.0 Applications .................................................................................................................................... 1
5.0 Ordering Information ....................................................................................................................... 1
6.0 Block Diagram ................................................................................................................................ 2
7.0 Connection Diagram ........................................................................................................................ 6
8.0 Ball Descriptions and Equivalent Circuits ............................................................................................ 7
9.0 Absolute Maximum Ratings ............................................................................................................ 16
10.0 Operating Ratings ....................................................................................................................... 16
11.0 Converter Electrical Characteristics ................................................................................................ 16
12.0 Specification Definitions ................................................................................................................ 27
13.0 Transfer Characteristic ................................................................................................................. 29
14.0 Timing Diagrams ......................................................................................................................... 30
15.0 Typical Performance Plots ............................................................................................................ 33
16.0 Functional Description .................................................................................................................. 43
16.1 OVERVIEW ......................................................................................................................... 43
16.2 CONTROL MODES .............................................................................................................. 43
16.2.1 Non-Extended Control Mode ........................................................................................ 43
16.2.1.1 Dual Edge Sampling Pin (DES) ........................................................................... 43
16.2.1.2 Non-Demultiplexed Mode Pin (NDM) ................................................................... 43
16.2.1.3 Dual Data Rate Phase Pin (DDRPh) .................................................................... 44
16.2.1.4 Calibration Pin (CAL) ......................................................................................... 44
16.2.1.5 Calibration Delay Pin (CalDly) ............................................................................ 44
16.2.1.6 Power Down I-channel Pin (PDI) ......................................................................... 44
16.2.1.7 Power Down Q-channel Pin (PDQ) ...................................................................... 44
16.2.1.8 Test Pattern Mode Pin (TPM) ............................................................................. 44
16.2.1.9 Full-Scale Input Range Pin (FSR) ....................................................................... 44
16.2.1.10 AC/DC-Coupled Mode Pin (VCMO) ..................................................................... 44
16.2.1.11 LVDS Output Common-mode Pin (VBG) ............................................................. 44
16.2.2 Extended Control Mode ............................................................................................... 45
16.2.2.1 The Serial Interface ........................................................................................... 45
16.3 FEATURES ......................................................................................................................... 47
16.3.1 Input Control and Adjust .............................................................................................. 48
16.3.1.1 AC/DC-coupled Mode ........................................................................................ 48
16.3.1.2 Input Full-Scale Range Adjust ............................................................................ 48
16.3.1.3 Input Offset Adjust ............................................................................................ 48
16.3.1.4 DES/Non-DES Mode ......................................................................................... 48
16.3.1.5 Sampling Clock Phase Adjust ............................................................................. 48
16.3.1.6 LC Filter on Sampling Clock ............................................................................... 48
16.3.1.7 VCMO Adjust ..................................................................................................... 49
16.3.2 Output Control and Adjust ............................................................................................ 49
16.3.2.1 DDR Clock Phase ............................................................................................. 49
16.3.2.2 LVDS Output Differential Voltage ........................................................................ 49
16.3.2.3 LVDS Output Common-Mode Voltage ................................................................. 49
16.3.2.4 Output Formatting ............................................................................................. 49
16.3.2.5 Demux/Non-demux Mode .................................................................................. 49
16.3.2.6 Test Pattern Mode ............................................................................................ 49
16.3.3 Calibration Feature ..................................................................................................... 50
16.3.3.1 Calibration Control Pins and Bits ......................................................................... 50
16.3.3.2 How to Execute a Calibration .............................................................................. 50
16.3.3.3 Power-on Calibration ......................................................................................... 50
16.3.3.4 On-command Calibration ................................................................................... 51
16.3.3.5 Calibration Adjust .............................................................................................. 51
16.3.3.6 Read/Write Calibration Settings .......................................................................... 51
16.3.3.7 Calibration and Power-Down .............................................................................. 51
16.3.3.8 Calibration and the Digital Outputs ...................................................................... 51
16.3.4 Power Down .............................................................................................................. 51
17.0 Applications Information ............................................................................................................... 52
17.1 THE ANALOG INPUTS ......................................................................................................... 52
17.1.1 Acquiring the Input ...................................................................................................... 52
17.1.2 FSR and the Reference Voltage ................................................................................... 52
17.1.3 Out-Of-Range Indication .............................................................................................. 52
17.1.4 Maximum Input Range ................................................................................................ 52
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17.1.5 AC-coupled Input Signals ............................................................................................ 52
17.1.6 DC-coupled Input Signals ............................................................................................ 53
17.1.7 Single-Ended Input Signals .......................................................................................... 53
17.2 THE CLOCK INPUTS ........................................................................................................... 53
17.2.1 CLK Coupling ............................................................................................................. 53
17.2.2 CLK Frequency .......................................................................................................... 53
17.2.3 CLK Level .................................................................................................................. 53
17.2.4 CLK Duty Cycle .......................................................................................................... 53
17.2.5 CLK Jitter .................................................................................................................. 54
17.2.6 CLK Layout ................................................................................................................ 54
17.3 THE LVDS OUTPUTS ........................................................................................................... 54
17.3.1 Common-mode and Differential Voltage ......................................................................... 54
17.3.2 Output Data Rate ........................................................................................................ 54
17.3.3 Terminating RSV Pins ................................................................................................. 54
17.3.4 Terminating Unused LVDS Output Pins ......................................................................... 54
17.4 SYNCHRONIZING MULTIPLE ADC10D1000/1500S IN A SYSTEM ............................................ 54
17.4.1 AutoSync Feature ....................................................................................................... 55
17.4.2 DCLK Reset Feature ................................................................................................... 55
17.5 SUPPLY/GROUNDING, LAYOUT AND THERMAL RECOMMENDATIONS ................................. 55
17.5.1 Power Planes ............................................................................................................. 55
17.5.2 Bypass Capacitors ...................................................................................................... 56
17.5.3 Ground Planes ........................................................................................................... 56
17.5.4 Power System Example ............................................................................................... 56
17.5.5 Thermal Management ................................................................................................. 57
17.6 SYSTEM POWER-ON CONSIDERATIONS ............................................................................. 57
17.6.1 Power-on, Configuration, and Calibration ....................................................................... 57
17.6.2 Power-on and Data Clock (DCLK) ................................................................................. 59
17.7 RECOMMENDED SYSTEM CHIPS ........................................................................................ 59
17.7.1 Temperature Sensor ................................................................................................... 59
17.7.2 Clocking Device ......................................................................................................... 60
17.7.3 Amplifier .................................................................................................................... 60
18.0 Register Definitions ...................................................................................................................... 61
19.0 Physical Dimensions .................................................................................................................... 68
List of Figures
FIGURE 1. Simplified Block Diagram ............................................................................................................. 2
FIGURE 2. ADC10D1000/1500 Connection Diagram ......................................................................................... 6
FIGURE 3. LVDS Output Signal Levels ......................................................................................................... 27
FIGURE 4. Input / Output Transfer Characteristic ............................................................................................ 29
FIGURE 5. Clocking in 1:2 Demux Non-DES Mode* ......................................................................................... 30
FIGURE 6. Clocking in Non-Demux Non-DES Mode* ........................................................................................ 30
FIGURE 7. Clocking in 1:4 Demux DES Mode* ............................................................................................... 31
FIGURE 8. Clocking in Non-Demux Mode DES Mode* ...................................................................................... 31
FIGURE 9. Data Clock Reset Timing (Demux Mode) ........................................................................................ 32
FIGURE 10. Power-on and On-Command Calibration Timing .............................................................................. 32
FIGURE 11. Serial Interface Timing ............................................................................................................. 32
FIGURE 12. Serial Data Protocol - Read Operation .......................................................................................... 45
FIGURE 13. Serial Data Protocol - Write Operation .......................................................................................... 46
FIGURE 14. DDR DCLK-to-Data Phase Relationship ........................................................................................ 49
FIGURE 15. AC-coupled Differential Input ..................................................................................................... 53
FIGURE 16. Single-Ended to Differential Conversion Using a Balun ...................................................................... 53
FIGURE 17. Differential Input Clock Connection .............................................................................................. 53
FIGURE 18. RSV Pin Connection ................................................................................................................ 54
FIGURE 19. AutoSync Example ................................................................................................................. 55
FIGURE 20. Power and Grounding Example .................................................................................................. 56
FIGURE 21. HSBGA Conceptual Drawing ..................................................................................................... 57
FIGURE 22. Power-on with Control Pins set by Pull-up/down Resistors .................................................................. 58
FIGURE 23. Power-on with Control Pins set by FPGA pre Power-on Cal ................................................................ 58
FIGURE 24. Power-on with Control Pins set by FPGA post Power-on Cal ............................................................... 59
FIGURE 25. Supply and DCLK Ramping ....................................................................................................... 59
FIGURE 26. Typical Temperature Sensor Application ....................................................................................... 60
List of Tables
TABLE 1. Analog Front-End and Clock Balls ................................................................................................... 7
TABLE 2. Control and Status Balls .............................................................................................................. 10
TABLE 3. Power and Ground Balls .............................................................................................................. 13
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TABLE 4. High-Speed Digital Outputs .......................................................................................................... 14
TABLE 5. Package Thermal Resistance ........................................................................................................ 16
TABLE 6. Static Converter Characteristics ..................................................................................................... 16
TABLE 7. Dynamic Converter Characteristics ................................................................................................ 17
TABLE 8. Analog Input/Output and Reference Characteristics ............................................................................. 20
TABLE 9. I-Channel to Q-Channel Characteristics ............................................................................................ 21
TABLE 10. Sampling Clock Characteristics ................................................................................................... 21
TABLE 11. Digital Control and Output Pin Characteristics ................................................................................... 22
TABLE 12. Power Supply Characteristics ...................................................................................................... 23
TABLE 13. AC Electrical Characteristics ........................................................................................................ 24
TABLE 14. Non-ECM Pin Summary ............................................................................................................. 43
TABLE 15. Serial Interface Pins .................................................................................................................. 45
TABLE 16. Command and Data Field Definitions ............................................................................................. 45
TABLE 17. Features and Modes ................................................................................................................ 47
TABLE 18. LC Filter Code vs. fc .................................................................................................................. 49
TABLE 19. LC Filter Bandwidth vs. Level ....................................................................................................... 49
TABLE 20. Test Pattern by Output Port in Demux Mode .................................................................................... 50
TABLE 21. Test Pattern by Output Port in Non-Demux Mode .............................................................................. 50
TABLE 22. Calibration Pins ....................................................................................................................... 50
TABLE 23. Output Latency in Demux Mode ................................................................................................... 52
TABLE 24. Output Latency in Non-Demux Mode ............................................................................................. 52
TABLE 25. Unused AutoSync and DCLK Reset Pin Recommendation ................................................................... 55
TABLE 26. Temperature Sensor Recommendation .......................................................................................... 59
TABLE 27. Amplifier Recommendation ......................................................................................................... 60
TABLE 28. Register Addresses .................................................................................................................. 61
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7.0 Connection Diagram
30066301
FIGURE 2. ADC10D1000/1500 Connection Diagram
The center ground pins are for thermal dissipation and must be soldered to a ground plane to ensure rated performance.
See Section 17.5 SUPPLY/GROUNDING, LAYOUT AND THERMAL RECOMMENDATIONS for more information.
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8.0 Ball Descriptions and Equivalent Circuits
TABLE 1. Analog Front-End and Clock Balls
Ball No.
Name
Equivalent Circuit
Description
Differential signal I- and Q-inputs. In the Non-Du-
al Edge Sampling (Non-DES) Mode, each I- and
Q-input is sampled and converted by its respec-
tive channel with each positive transition of the
CLK input. In Non-ECM (Non-Extended Control
Mode) and DES Mode, both channels sample the
I-input. In Extended Control Mode (ECM), the Q-
input may optionally be selected for conversion
in DES Mode by the DEQ Bit (Addr: 0h, Bit 6).
Each I- and Q-channel input has an internal com-
mon mode bias that is disabled when DC-cou-
pled Mode is selected. Both inputs must be either
AC- or DC-coupled. The coupling mode is se-
lected by the VCMO Pin.
H1/J1
N1/M1
VinI+/-
VinQ+/-
In Non-ECM, the full-scale range of these inputs
is determined by the FSR Pin; both I- and Q-
channels have the same full-scale input range. In
ECM, the full-scale input range of the I- and Q-
channel inputs may be independently set via the
Control Register (Addr: 3h and Addr: Bh). Note
that the high and low full-scale input range setting
in Non-ECM corresponds to the mid and mini-
mum full-scale input range in ECM.
The input offset may also be adjusted in ECM.
Differential Converter Sampling Clock. In the
Non-DES Mode, the analog inputs are sampled
on the positive transitions of this clock signal. In
the DES Mode, the selected input is sampled on
both transitions of this clock. This clock must be
AC-coupled.
U2/V1
CLK+/-
Differential DCLK Reset. A positive pulse on this
input is used to reset the DCLKI and DCLKQ
outputs of two or more ADC10D1000/1500s in
order to synchronize them with other
ADC10D1000/1500s in the system. DCLKI and
DCLKQ are always in phase with each other,
unless one channel is powered down, and do not
require a pulse from DCLK_RST to become
synchronized. The pulse applied here must meet
timing relationships with respect to the CLK input.
Although supported, this feature has been
superseded by AutoSync.
V2/W1
DCLK_RST+/-
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Ball No.
Name
Equivalent Circuit
Description
Common Mode Voltage Output or Signal
Coupling Select. If AC-coupled operation at the
analog inputs is desired, this pin should be held
at logic-low level. This pin is capable of sourcing/
sinking up to 100 µA. For DC-coupled operation,
this pin should be left floating or terminated into
high-impedance. In DC-coupled Mode, this pin
provides an output voltage which is the optimal
common-mode voltage for the input signal and
should be used to set the common-mode voltage
of the driving buffer.
VCMO
C2
Bandgap Voltage Output or LVDS Common-
mode Voltage Select. This pin provides a
buffered version of the bandgap output voltage
and is capable of sourcing/sinking 100 uA and
driving a load of up to 80 pF. Alternately, this pin
may be used to select the LVDS digital output
common-mode voltage. If tied to logic-high, the
1.2V LVDS common-mode voltage is selected;
0.8V is the default.
VBG
B1
External Reference Resistor terminals. A 3.3 kΩ
±0.1% resistor should be connected between
Rext+/-. The Rext resistor is used as a reference
to trim internal circuits which affect the linearity of
the converter; the value and precision of this
resistor should not be compromised.
C3/D3
Rext+/-
Input Termination Trim Resistor terminals. A 3.3
kΩ ±0.1% resistor should be connected between
Rtrim+/-. The Rtrim resistor is used to establish
the calibrated 100Ω input impedance of VinI,
VinQ and CLK. These impedances may be fine
tuned by varying the value of the resistor by a
corresponding percentage; however, the tuning
range and performance is not guaranteed for
such an alternate value.
C1/D2
Rtrim+/-
Temperature Sensor Diode Positive (Anode) and
Negative (Cathode) Terminals. This set of pins is
used for die temperature measurements. It has
not been fully characterized.
E2/F3
Tdiode+/-
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Ball No.
Name
Equivalent Circuit
Description
Reference Clock Input. When the AutoSync
feature is active, and the ADC10D1000/1500 is
in Slave Mode, the internal divided clocks are
synchronized with respect to this input clock. The
delay on this clock may be adjusted when
synchronizing multiple ADCs. This feature is
available in ECM via Control Register (Addr:
Eh).
Y4/W5
RCLK+/-
Reference Clock Output 1 and 2. These signals
provide a reference clock at a rate of CLK/4,
when enabled, independently of whether the
ADC is in Master or Slave Mode. They are used
to drive the RCLK of another
ADC10D1000/1500, to enable automatic
synchronization for multiple ADCs (AutoSync
feature). The impedance of each trace from
RCOut1 and RCOut2 to the RCLK of another
ADC10D1000/1500 should be 100Ω differential.
Having two clock outputs allows the auto-
synchronization to propagate as a binary tree.
Use the DOC Bit (Addr: Eh, Bit 1) to enable/
disable this feature; default is disabled.
Y5/U6
V6/V7
RCOut1+/-
RCOut2+/-
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TABLE 2. Control and Status Balls
Equivalent Circuit
Ball No.
Name
Description
Dual Edge Sampling (DES) Mode select. In the
Non-Extended Control Mode (Non-ECM), when
this input is set to logic-high, the DES Mode of
operation is selected, meaning that the VinI input
is sampled by both channels in a time-interleaved
manner. The VinQ input is ignored. When this
input is set to logic-low, the device is in Non-DES
Mode, i.e. the I- and Q-channels operate
independently. In the Extended Control Mode
(ECM), this input is ignored and DES Mode
selection is controlled through the Control
Register by the DES Bit (Addr: 0h, Bit 7); default
is Non-DES Mode operation.
V5
DES
Calibration Delay select. By setting this input
logic-high or logic-low, the user can select the
device to wait a longer or shorter amount of time,
respectively, before the automatic power-on self-
calibration is initiated. This feature is pin-
controlled only and is always active during ECM
and Non-ECM.
V4
CalDly
Calibration cycle initiate. The user can command
the device to execute a self-calibration cycle by
holding this input high a minimum of tCAL_H after
having held it low a minimum of tCAL_L. If this input
is held high at the time of power-on, the automatic
power-on calibration cycle is inhibited until this
input is cycled low-then-high. This pin is active in
both ECM and Non-ECM. In ECM, this pin is
logically OR'd with the CAL Bit (Addr: 0h, Bit 15)
in the Control Register. Therefore, both pin and
bit must be set low and then either can be set high
to execute an on-command calibration.
D6
CAL
Calibration Running indication. This output is
logic-high while the calibration sequence is
executing. This output is logic-low otherwise.
B5
CalRun
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Ball No.
Name
Equivalent Circuit
Description
Power Down I- and Q-channel. Setting either
input to logic-high powers down the respective I-
or Q-channel. Setting either input to logic-low
brings the respective I- or Q-channel to a
operational state after a finite time delay. This pin
is active in both ECM and Non-ECM. In ECM,
each Pin is logically OR'd with its respective Bit.
Therefore, either this pin or the PDI and PDQ Bit
in the Control Register can be used to power-
down the I- and Q-channel (Addr: 0h, Bit 11 and
Bit 10), respectively.
U3
V3
PDI
PDQ
Test Pattern Mode select. With this input at logic-
high, the device continuously outputs a fixed,
repetitive test pattern at the digital outputs. In the
ECM, this input is ignored and the Test Pattern
Mode can only be activated through the Control
Register by the TPM Bit (Addr: 0h, Bit 12).
A4
A5
Y3
TPM
NDM
FSR
Non-Demuxed Mode select. Setting this input to
logic-high causes the digital output bus to be in
the 1:1 Non-Demuxed Mode. Setting this input to
logic-low causes the digital output bus to be in the
1:2 Demuxed Mode. This feature is pin-controlled
only and remains active during ECM and Non-
ECM.
Full-Scale input Range select. In Non-ECM,
when this input is set to logic-low or logic-high,
the full-scale differential input range for both I-
and Q-channel inputs is set to the lower or higher
FSR value, respectively. In the ECM, this input is
ignored and the full-scale range of the I- and Q-
channel inputs is independently determined by
the setting of Addr: 3h and Addr: Bh, respective-
ly. Note that the high (lower) FSR value in Non-
ECM corresponds to the mid (min) available
selection in ECM; the FSR range in ECM is
greater.
DDR Phase select. This input, when logic-low,
selects the 0° Data-to-DCLK phase relationship.
When logic-high, it selects the 90° Data-to-DCLK
phase relationship, i.e. the DCLK transition
indicates the middle of the valid data outputs.
This pin only has an effect when the chip is in 1:2
Demuxed Mode, i.e. the NDM pin is set to logic-
low. In ECM, this input is ignored and the DDR
phase is selected through the Control Register by
the DPS Bit (Addr: 0h, Bit 14); the default is 0°
Mode.
W4
DDRPh
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Ball No.
Name
Equivalent Circuit
Description
Extended Control Enable bar. Extended feature
control through the SPI interface is enabled when
this signal is asserted (logic-low). In this case,
most of the direct control pins have no effect.
When this signal is de-asserted (logic-high), the
SPI interface is disabled, all SPI registers are
reset to their default values, and all available
settings are controlled via the control pins.
B3
ECE
Serial Chip Select bar. In ECM, when this signal
is asserted (logic-low), SCLK is used to clock in
serial data which is present on SDI and to source
serial data on SDO. When this signal is de-
asserted (logic-high), SDI is ignored and SDO is
in tri-stated.
C4
SCS
Serial Clock. In ECM, serial data is shifted into
and out of the device synchronously to this clock
signal. This clock may be disabled and held logic-
low, as long as timing specifications are not
violated when the clock is enabled or disabled.
C5
SCLK
Serial Data-In. In ECM, serial data is shifted into
the device on this pin while SCS signal is
asserted (logic-low).
B4
SDI
Serial Data-Out. In ECM, serial data is shifted out
of the device on this pin while SCS signal is
asserted (logic-low). This output is tri-stated
when SCS is de-asserted.
A3
SDO
Do Not Connect. These pins are used for internal
purposes and should not be connected, i.e. left
floating. Do not ground.
D1, D7, E3, F4,
W3, U7
DNC
NC
NONE
NONE
Not Connected. This pin is not bonded and may
be left floating or connected to any potential.
C7
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TABLE 3. Power and Ground Balls
Equivalent Circuit
Ball No.
Name
Description
A2, A6, B6, C6,
D8, D9, E1, F1,
H4, N4, R1, T1,
U8, U9, W6, Y2,
Y6
Power Supply for the Analog circuitry. This
supply is tied to the ESD ring. Therefore, it must
be powered up before or with any other supply.
VA
NONE
NONE
G1, G3, G4, H2,
J3, K3, L3, M3,
N2, P1, P3, P4,
R3, R4
Power Supply for the Track-and-Hold and Clock
circuitry.
VTC
A11, A15, C18,
D11, D15, D17,
J17, J20, R17,
R20, T17, U11,
U15, U16, Y11,
Y15
VDR
NONE
Power Supply for the Output Drivers.
Power Supply for the Digital Encoder.
A8, B9, C8, V8,
W9, Y8
VE
NONE
NONE
Bias Voltage I-channel. This is an externally
decoupled bias voltage for the I-channel. Each
pin should individually be decoupled with a 100
nF capacitor via a low resistance, low inductance
path to GND.
J4, K2
L2, M4
VbiasI
Bias Voltage Q-channel. This is an externally
decoupled bias voltage for the Q-channel. Each
pin should individually be decoupled with a 100
nF capacitor via a low resistance, low inductance
path to GND.
VbiasQ
NONE
A1, A7, B2, B7,
D4, D5, E4, K1,
L1, T4, U4, U5,
W2, W7, Y1, Y7,
H8:N13
GND
NONE
NONE
Ground Return for the Analog circuitry.
F2, G2, H3, J2,
K4, L4, M2, N3,
P2, R2, T2, T3, U1
Ground Return for the Track-and-Hold and Clock
circuitry.
GNDTC
A13, A17, A20,
D13, D16, E17,
F17, F20, M17,
M20, U13, U17,
V18, Y13, Y17,
Y20
GNDDR
GNDE
NONE
NONE
Ground Return for the Output Drivers.
Ground Return for the Digital Encoder.
A9, B8, C9, V9,
W8, Y9
13
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TABLE 4. High-Speed Digital Outputs
Ball No.
Name
Equivalent Circuit
Description
Data Clock Output for the I- and Q-channel data
bus. These differential clock outputs are used to
latch the output data and, if used, should always
be terminated with a 100Ω differential resistor
placed as closely as possible to the differential
receiver. Delayed and non-delayed data outputs
are supplied synchronously to this signal. In 1:2
Demux Mode or Non-Demux Mode, this signal is
at ¼ or ½ the sampling clock rate, respectively.
DCLKI and DCLKQ are always in phase with
each other, unless one channel is powered down,
and do not require a pulse from DCLK_RST to
become synchronized.
K19/K20
L19/L20
DCLKI+/-
DCLKQ+/-
Out-of-Range Output for the I- and Q-channel.
This differential output is asserted logic-high
while the over- or under-range condition exists,
i.e. the differential signal at each respective
analog input exceeds the full-scale value. Each
OR result refers to the current Data, with which it
is clocked out. If used, each of these outputs
should always be terminated with a 100Ω
differential resistor placed as closely as possible
to the differential receiver.
K17/K18
L17/L18
ORI+/-
ORQ+/-
www.national.com
14
Ball No.
Name
Equivalent Circuit
Description
J18/J19
H19/H20
H17/H18
G19/G20
G17/G18
F18/F19
E19/E20
D19/D20
D18/E18
C19/C20
·
M18/M19
N19/N20
N17/N18
P19/P20
P17/P18
R18/R19
T19/T20
U19/U20
U18/T18
V19/V20
DI9+/-
DI8+/-
DI7+/-
DI6+/-
DI5+/-
DI4+/-
DI3+/-
DI2+/-
DI1+/-
DI0+/-
·
DQ9+/-
DQ8+/-
DQ7+/-
DQ6+/-
DQ5+/-
DQ4+/-
DQ3+/-
DQ2+/-
DQ1+/-
DQ0+/-
I- and Q-channel Digital Data Outputs. In Non-
Demux Mode, this LVDS data is transmitted at
the sampling clock rate. In Demux Mode, these
outputs provide ½ the data at ½ the sampling
clock rate, synchronized with the delayed data,
i.e. the other ½ of the data which was sampled
one clock cycle earlier. Compared with the DId
and DQd outputs, these outputs represent the
later time samples. If used, each of these outputs
should always be terminated with a 100Ω
differential resistor placed as closely as possible
to the differential receiver.
A18/A19
B17/C16
A16/B16
B15/C15
C14/D14
A14/B14
B13/C13
C12/D12
A12/B12
B11/C11
·
Y18/Y19
W17/V16
Y16/W16
W15/V15
V14/U14
Y14/W14
W13/V13
V12/U12
Y12/W12
W11/V11
DId9+/-
DId8+/-
DId7+/-
DId6+/-
DId5+/-
DId4+/-
DId3+/-
DId2+/-
DId1+/-
DId0+/-
·
DQd9+/-
DQd8+/-
DQd7+/-
DQd6+/-
DQd5+/-
DQd4+/-
DQd3+/-
DQd2+/-
DQd1+/-
DQd0+/-
Delayed I- and Q-channel Digital Data Outputs.
In Non-Demux Mode, these outputs are tri-
stated. In Demux Mode, these outputs provide ½
the data at ½ the sampling clock rate,
synchronized with the non-delayed data, i.e. the
other ½ of the data which was sampled one clock
cycle later. Compared with the DI and DQ
outputs, these outputs represent the earlier time
samples. If used, each of these outputs should
always be terminated with a 100Ω differential
resistor placed as closely as possible to the
differential receiver.
V10/U10
Y10/W10
W19/W20
W18/V17
B19/B20
B18/C17
C10/D10
A10/B10
RSV7+/-
RSV6+/-
RSV5+/-
RSV4+/-
RSV3+/-
RSV2+/-
RSV1+/-
RSV0+/-
Reserved. These pins are used for internal
purposes. They may be left unconnected and
floating or connected as recommended in
Section 17.3.3 Terminating RSV Pins.
NONE
15
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9.0 Absolute Maximum Ratings
(Note 1, Note 2)
10.0 Operating Ratings
(Note 1, Note 2)
Ambient Temperature Range
ADC10D1000
Supply Voltage (VA, VTC, VDR, VE)
2.2V
−40°C ≤ TA ≤ +85°C
−40°C ≤ TA ≤ +70°C
Supply Difference
max(VA/TC/DR/E)-
ADC10D1500 (Standard JEDEC
thermal model)
min(VA/TC/DR/E
)
0V to 100 mV
ADC10D1500 (Enhanced thermal
model/heatsink)
Junction Temperature Range
Voltage on Any Input Pin
(except VIN+/-)
−0.15V to
(VA + 0.15V)
−40°C ≤ TA ≤ +85°C
TJ ≤ +138°C
VIN+/- Voltage Range
Ground Difference
-0.15V to 2.5V
Supply Voltage (VA, VTC, VE)
+1.8V to +2.0V
max(GNDTC/DR/E
)
Driver Supply Voltage (VDR
)
+1.8V to VA
-min(GNDTC/DR/E
)
0V to 100 mV
±50 mA
VIN+/- Voltage Range (Maintaining
Common Mode)
0V to 2.15V
(100% duty cycle)
0V to 2.5V
Input Current at Any Pin (Note 3)
ADC10D1000 Package Power
Dissipation at TA ≤ 85°C (Note 3)
ADC10D1500 Package Power
Dissipation at TA ≤ 70°C (Note 3)
ESD Susceptibility (Note 4)
Human Body Model
Charged Device Model
Machine Model
(10% duty cycle)
3.7 W
Ground Difference
max(GNDTC/DR/E
)
4.4 W
-min(GNDTC/DR/E
)
0V
0V to VA
ꢀ
2500V
750V
CLK+/- Voltage Range
Differential CLK Amplitude
Common Mode Input Voltage
0.4VP-P to 2.0VP-P
VCMO - 150mV <
250V
VCMI < VCMO +150mV
Storage Temperature
−65°C to +150°C
TABLE 5. Package Thermal Resistance
Package
θJC2
θJA
θJC1
292-Ball BGA Thermally 16°C/W 2.9°C/W 2.5°C/W
Enhanced Package
Soldering
process
must
comply
with
National
Semiconductor’s Reflow Temperature Profile specifications.
Refer to www.national.com/packaging. (Note 5)
11.0 Converter Electrical Characteristics
The following specifications apply after calibration for VA = VDR = VTC = VE = +1.9V; I- and Q-channels, AC-coupled, unused channel
terminated to AC ground, FSR Pin = High; CL = 10 pF; Differential, AC coupled Sine Wave Sampling Clock, fCLK = 1.0/1.5 GHz at
0.5 VP-P with 50% duty cycle (as specified); VBG = Floating; Non-Extended Control Mode; Rext = Rtrim = 3300Ω ± 0.1%; Analog
Signal Source Impedance = 100Ω Differential; 1:2 Demultiplex Non-DES Mode; Duty Cycle Stabilizer on. Boldface limits apply
for TA = TMIN to TMAX. All other limits TA = 25°C, unless otherwise noted. (Note 6, Note 7, Note 8, Note 12)
TABLE 6. Static Converter Characteristics
ADC10D1000
ADC10D1500
Units
(Limits)
Symbol
Parameter
Conditions
Typ
Lim
10
Typ
Lim
10
Resolution with No Missing Codes
bits
INL
Integral Non-Linearity
(Best fit)
1 MHz DC-coupled over-ranged
sine wave
±0.65
±0.25
±1.4
±0.5
±0.65
±1.4 LSB (max)
DNL
Differential Non-Linearity
1 MHz DC-coupled over-ranged
sine wave
±0.25 ±0.55 LSB (max)
VOFF
Offset Error
-2
-2
LSB
mV
VOFF_ADJ
PFSE
Input Offset Adjustment Range
Positive Full-Scale Error
Negative Full-Scale Error
Extended Control Mode
(Note 9)
±45
±45
±25
±25
1023
0
±25
±25
1023
0
mV (max)
mV (max)
NFSE
(Note 9)
Out-of-Range Output Code (Note (VIN+) − (VIN−) > + Full Scale
10)
(VIN+) − (VIN−) < − Full Scale
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16
TABLE 7. Dynamic Converter Characteristics
ADC10D1000
ADC10D1500
Units
(Limits)
Symbol
FPBW
Parameter
Conditions
Typ
2.8
Lim
Typ
3.1
Lim
Full Power Bandwidth
Non-DES Mode
GHz
GHz
DES Mode
DESIQ Mode
D.C. to Fs/2
D.C. to Fs
1.25
2.15
±0.35
±0.5
1.25
2.15
±0.4
±1.2
GHz
Gain Flatness
dBFS
dBFS
CER
NPR
Code Error Rate
Error/
Sample
10-18
10-18
Noise Power Ratio
fc,notch = 325 MHz,
Notch width = 5%
48
48
dB
1:2 Demux Non-DES Mode
ENOB
SINAD
SNR
Effective Number of Bits
AIN = 100 MHz @ -0.5 dBFS
AIN = 248 MHz @ -0.5 dBFS
AIN = 373 MHz @ -0.5 dBFS
AIN = 498 MHz @ -0.5 dBFS
AIN = 748 MHz @ -0.5 dBFS
AIN = 100 MHz @ -0.5 dBFS
AIN = 248 MHz @ -0.5 dBFS
AIN = 373 MHz @ -0.5 dBFS
AIN = 498 MHz @ -0.5 dBFS
AIN = 748 MHz @ -0.5 dBFS
AIN = 100 MHz @ -0.5 dBFS
AIN = 248 MHz @ -0.5 dBFS
AIN = 373 MHz @ -0.5 dBFS
AIN = 498 MHz @ -0.5 dBFS
AIN = 748 MHz @ -0.5 dBFS
AIN = 100 MHz @ -0.5 dBFS
AIN = 248 MHz @ -0.5 dBFS
AIN = 373 MHz @ -0.5 dBFS
AIN = 498 MHz @ -0.5 dBFS
AIN = 748 MHz @ -0.5 dBFS
AIN = 100 MHz @ -0.5 dBFS
AIN = 248 MHz @ -0.5 dBFS
AIN = 373 MHz @ -0.5 dBFS
AIN = 498 MHz @ -0.5 dBFS
AIN = 748 MHz @ -0.5 dBFS
AIN = 100 MHz @ -0.5 dBFS
AIN = 248 MHz @ -0.5 dBFS
AIN = 373 MHz @ -0.5 dBFS
AIN = 498 MHz @ -0.5 dBFS
AIN = 748 MHz @ -0.5 dBFS
AIN = 100 MHz @ -0.5 dBFS
AIN = 248 MHz @ -0.5 dBFS
AIN = 373 MHz @ -0.5 dBFS
AIN = 498 MHz @ -0.5 dBFS
AIN = 748 MHz @ -0.5 dBFS
9.1
9.1
9.0
8.9
8.8
bits (min)
bits (min)
bits (min)
bits (min)
bits (min)
dB (min)
dB (min)
dB (min)
dB (min)
dB (min)
dB (min)
dB (min)
dB (min)
dB (min)
dB (min)
dB (max)
dB (max)
dB (max)
dB (max)
dB (max)
dBc
8.3
8.3
7.8
48.4
50
9.0
8.8
Signal-to-Noise Plus Distortion
Ratio
56.5
56.5
56.1
55.6
54.9
52
52
56
54.5
56.8
56.4
56.4
Signal-to-Noise Ratio
57
57
52.7
52.7
56.5
55
-65
-63
-60
THD
Total Harmonic Distortion
Second Harmonic Distortion
Third Harmonic Distortion
Spurious-Free Dynamic Range
-67
-69
-60
-60
-53.6
-66
-63
-76
-71
-71
2nd Harm
3rd Harm
SFDR
-76
-71
dBc
dBc
-71
dBc
-70
-68
-72
-63
dBc
-70
-70
dBc
dBc
dBc
-69
dBc
-65
68
68
63
dBc
70
66
dBc (min)
dBc (min)
dBc (min)
dBc (min)
dBc (min)
57.9
57.9
54
66
65
17
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ADC10D1000
ADC10D1500
Units
(Limits)
Symbol
Parameter
Conditions
Typ
Lim
Typ
Lim
Non-Demux Non-DES Mode (Fclk = 1GHz) (Note 12)
ENOB
SINAD
SNR
Effective Number of Bits
AIN = 100 MHz @ -0.5 dBFS
AIN = 248 MHz @ -0.5 dBFS
AIN = 373 MHz @ -0.5 dBFS
AIN = 498 MHz @ -0.5 dBFS
AIN = 748 MHz @ -0.5 dBFS
AIN = 100 MHz @ -0.5 dBFS
AIN = 248 MHz @ -0.5 dBFS
AIN = 373 MHz @ -0.5 dBFS
AIN = 498 MHz @ -0.5 dBFS
AIN = 748 MHz @ -0.5 dBFS
AIN = 100 MHz @ -0.5 dBFS
AIN = 248 MHz @ -0.5 dBFS
AIN = 373 MHz @ -0.5 dBFS
AIN = 498 MHz @ -0.5 dBFS
AIN = 748 MHz @ -0.5 dBFS
AIN = 100 MHz @ -0.5 dBFS
AIN = 248 MHz @ -0.5 dBFS
AIN = 373 MHz @ -0.5 dBFS
AIN = 498 MHz @ -0.5 dBFS
AIN = 748 MHz @ -0.5 dBFS
AIN = 100 MHz @ -0.5 dBFS
AIN = 248 MHz @ -0.5 dBFS
AIN = 373 MHz @ -0.5 dBFS
AIN = 498 MHz @ -0.5 dBFS
AIN = 748 MHz @ -0.5 dBFS
AIN = 100 MHz @ -0.5 dBFS
AIN = 248 MHz @ -0.5 dBFS
AIN = 373 MHz @ -0.5 dBFS
AIN = 498 MHz @ -0.5 dBFS
AIN = 748 MHz @ -0.5 dBFS
AIN = 100 MHz @ -0.5 dBFS
AIN = 248 MHz @ -0.5 dBFS
AIN = 373 MHz @ -0.5 dBFS
AIN = 498 MHz @ -0.5 dBFS
AIN = 748 MHz @ -0.5 dBFS
9.1
9.1
9.1
9.1
bits (min)
bits (min)
bits (min)
bits (min)
bits (min)
dB (min)
dB (min)
dB (min)
dB (min)
dB (min)
dB (min)
dB (min)
dB (min)
dB (min)
dB (min)
dB (max)
dB (max)
dB (max)
dB (max)
dB (max)
dBc
8.4
8.3
9.0
9.0
Signal-to-Noise Plus Distortion
Ratio
56.6
56.5
56.5
56.5
52.6
52.0
56
56
Signal-to-Noise Ratio
57
57
57
57
53.5
52.7
56.5
56.5
THD
Total Harmonic Distortion
Second Harmonic Distortion
Third Harmonic Distortion
Spurious-Free Dynamic Range
-67
-66
-67
-66
-60
-60
-66
-66
2nd Harm
3rd Harm
SFDR
-85
-71
-85
-71
dBc
dBc
-71
-71
dBc
dBc
-68
-70
-68
-70
dBc
dBc
dBc
-70
-70
dBc
dBc
68
66
68
66
dBc (min)
dBc (min)
dBc (min)
dBc (min)
dBc (min)
59
66
57.9
66
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18
ADC10D1000
ADC10D1500
Units
(Limits)
Symbol
Parameter
Conditions
Typ
Lim
Typ
Lim
DES Mode (Demux and Non-Demux Modes, Q-input only)
ENOB
SINAD
SNR
Effective Number of Bits
AIN = 100 MHz @ -0.5 dBFS
AIN = 248 MHz @ -0.5 dBFS
AIN = 373 MHz @ -0.5 dBFS
AIN = 498 MHz @ -0.5 dBFS
AIN = 748 MHz @ -0.5 dBFS
AIN = 100 MHz @ -0.5 dBFS
AIN = 248 MHz @ -0.5 dBFS
AIN = 373 MHz @ -0.5 dBFS
AIN = 498 MHz @ -0.5 dBFS
AIN = 748 MHz @ -0.5 dBFS
AIN = 100 MHz @ -0.5 dBFS
AIN = 248 MHz @ -0.5 dBFS
AIN = 373 MHz @ -0.5 dBFS
AIN = 498 MHz @ -0.5 dBFS
AIN = 748 MHz @ -0.5 dBFS
AIN = 100 MHz @ -0.5 dBFS
AIN = 248 MHz @ -0.5 dBFS
AIN = 373 MHz @ -0.5 dBFS
AIN = 498 MHz @ -0.5 dBFS
AIN = 748 MHz @ -0.5 dBFS
AIN = 100 MHz @ -0.5 dBFS
AIN = 248 MHz @ -0.5 dBFS
AIN = 373 MHz @ -0.5 dBFS
AIN = 498 MHz @ -0.5 dBFS
AIN = 748 MHz @ -0.5 dBFS
AIN = 100 MHz @ -0.5 dBFS
AIN = 248 MHz @ -0.5 dBFS
AIN = 373 MHz @ -0.5 dBFS
AIN = 498 MHz @ -0.5 dBFS
AIN = 748 MHz @ -0.5 dBFS
AIN = 100 MHz @ -0.5 dBFS
AIN = 248 MHz @ -0.5 dBFS
AIN = 373 MHz @ -0.5 dBFS
AIN = 498 MHz @ -0.5 dBFS
AIN = 748 MHz @ -0.5 dBFS
8.6
8.5
8.9
8.7
8.5
bits
bits
bits
bits
bits
dB
8.4
8.3
Signal-to-Noise Plus Distortion
Ratio
53.6
52.9
55.5
53.9
52.7
dB
dB
52.3
dB
51.7
55.9
54.6
53.8
dB
Signal-to-Noise Ratio
53.8
53.3
dB
dB
dB
52.7
dB
52.1
-66
-62
-59
dB
THD
Total Harmonic Distortion
Second Harmonic Distortion
Third Harmonic Distortion
Spurious-Free Dynamic Range
-67
-64
dB
dB
dB
-63
dB
-62
-80
-66
-64
dB
2nd Harm
3rd Harm
SFDR
-77
-66
dBc
dBc
dBc
dBc
dBc
dBc
dBc
dBc
dBc
dBc
dBc
dBc
dBc
dBc
dBc
-66
-70
-67
-70
-62
-69
-65
-63
-62
67
62
60
59.3
58.9
57.4
59
19
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TABLE 8. Analog Input/Output and Reference Characteristics
ADC10D1000
ADC10D1500
Units
(Limits)
Symbol
Parameter
Conditions
Typ
Lim
Typ
Lim
Analog Inputs
VIN_FSR
Analog Differential Input Full Scale Non-Extended Control Mode
Range
FSR Pin Low
mVP-P
(min)
540
660
720
860
540
660
720
860
600
790
600
790
mVP-P
(max)
mVP-P
(min)
FSR Pin High
mVP-P
(max)
Extended Control Mode
FM(14:0) = 0000h
FM(14:0) = 4000h (default)
FM(14:0) = 7FFFh
Differential
mVP-P
mVP-P
mVP-P
pF
600
790
980
0.02
1.6
600
790
980
0.02
1.6
CIN
Analog Input Capacitance,
Non-DES Mode (Note 10)
Each input pin to ground
Differential
pF
Analog Input Capacitance,
DES Mode (Note 10)
0.08
2.2
0.08
2.2
pF
Each input pin to ground
pF
RIN
Differential Input Resistance
96
93
Ω (min)
Ω (max)
100
100
104
107
Common Mode Output
VCMO
Common Mode Output Voltage
ICMO = ±100 µA
ICMO = ±100 µA
1.15
1.35
1.15
1.35
V (min)
V (max)
1.25
38
1.25
38
TC_VCMO
VCMO_LVL
CL_VCMO
Common Mode Output Voltage
Temperature Coefficient
ppm/°C
VCMO input threshold to set
DC-coupling Mode
0.63
0.63
V
Maximum VCMO Load Capacitance (Note 10)
80
80
pF
Bandgap Reference
VBG
Bandgap Reference Output
Voltage
IBG = ±100 µA
1.15
1.35
1.15
1.35
V (min)
V (max)
1.25
32
1.25
32
TC_VBG
CL_VBG
Bandgap Reference Voltage
Temperature Coefficient
IBG = ±100 µA
ppm/°C
pF
Maximum Bandgap Reference
load Capacitance
(Note 10)
80
80
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20
TABLE 9. I-Channel to Q-Channel Characteristics
ADC10D1000
ADC10D1500
Units
(Limits)
Symbol
Parameter
Conditions
Typ
Lim
Typ
Lim
Offset Match
2
2
LSB
Positive Full-Scale Match
Negative Full-Scale Match
Zero offset selected in
Control Register
2
2
LSB
Zero offset selected in
Control Register
2
2
LSB
Degree
dB
Phase Matching (I, Q)
fIN = 1.0 GHz
< 1
−70
< 1
−70
X-TALK
Crosstalk from I-channel
Aggressor = 867 MHz F.S.
(Aggressor) to Q-channel (Victim) Victim = 100 MHz F.S.
Crosstalk from Q-channel Aggressor = 867 MHz F.S.
(Aggressor) to I-channel (Victim) Victim = 100 MHz F.S.
−70
−70
dB
TABLE 10. Sampling Clock Characteristics
ADC10D1000
ADC10D1500
Units
(Limits)
Symbol
VIN_CLK
Parameter
Conditions
Typ
Lim
0.4
2.0
0.4
2.0
Typ
Lim
0.4
2.0
0.4
2.0
Differential Sampling Clock Input Sine Wave Clock
Level (Note 11) Differential Peak-to-Peak
VP-P (min)
VP-P (max)
VP-P (min)
VP-P (max)
pF
0.6
0.6
Square Wave Clock
Differential Peak-to-Peak
0.6
0.6
CIN_CLK
RIN_CLK
Sampling Clock Input Capacitance Differential
0.1
1
0.1
1
(Note 10)
Each input to ground
pF
Sampling Clock Differential Input
Resistance
100
100
Ω
21
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TABLE 11. Digital Control and Output Pin Characteristics
ADC10D1000
ADC10D1500
Units
(Limits)
Symbol
Parameter
Conditions
Typ
Lim
Typ
Lim
Digital Control Pins (DES, CalDly, CAL, PDI, PDQ, TPM, NDM, FSR, DDRPh, ECE, SCLK, SDI, SCS)
VIH
VIL
IIH
Logic High Input Voltage
Logic Low Input Voltage
0.7×VA
0.3×VA
0.7×VA
0.3×VA
V (min)
V (max)
Input Leakage Current;
VIN = VA
0.02
0.02
μA
μA
IIL
Input Leakage Current;
VIN = GND
FSR, CalDly, CAL, NDM, TPM,
DDRPh, DES
-0.02
-0.02
SCS, SCLK, SDI
PDI, PDQ, ECE
-17
-38
-17
-38
μA
μA
CIN_DIG
Digital Control Pin Input
Capacitance
Measured from each control pin to
GND
1.5
1.5
pF
(Note 10)
Digital Output Pins (Data, DCLKI, DCLKQ, ORI, ORQ)
VOD
LVDS Differential Output Voltage VBG = Floating, OVS = High
mVP-P
(min)
375
750
260
560
375
750
260
560
560
400
560
400
mVP-P
(max)
mVP-P
(min)
VBG = Floating, OVS = Low
mVP-P
(max)
mVP-P
VBG = VA, OVS = High
VBG = VA, OVS = Low
600
440
600
440
mVP-P
Change in LVDS Output Swing
Between Logic Levels
ΔVO DIFF
±1
±1
mV
VOS
Output Offset Voltage
VBG = Floating
VBG = VA
0.8
1.2
0.8
1.2
V
V
Output Offset Voltage Change
Between Logic Levels
ΔVOS
±1
±1
mV
mA
IOS
Output Short Circuit Current
VBG = Floating;
±4
±4
D+ and D− connected to 0.8V
ZO
Differential Output Impedance
Logic High Output Level
100
1.65
100
1.65
Ω
VOH
CalRun, SDO
IOH = −400 µA (Note 11)
1.5
0.3
1.5
0.3
V
VOL
Logic Low Output Level
CalRun, SDO
IOL = 400 µA (Note 11)
0.15
0.15
V
Differential DCLK Reset Pins (DCLK_RST)
VCMI_DRST
VID_DRST
RIN_DRST
DCLK_RST Common Mode Input
Voltage
1.25
±0.15
1.25
±0.15
V
Differential DCLK_RST Input
Voltage
VIN_CLK
100
VIN_CLK
100
VP-P
Differential DCLK_RST Input
Resistance
(Note 10)
Ω
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22
TABLE 12. Power Supply Characteristics
ADC10D1000
ADC10D1500
Units
(Limits)
Symbol
Parameter
Conditions
Typ
Lim
Typ
Lim
IA
Analog Supply Current
1:2 Demux Mode
PDI = PDQ = Low
895
510
510
2
985
1170
645
645
2
mA (max)
mA
PDI = Low; PDQ = High
PDI = High; PDQ = Low
PDI = PDQ = High
mA
mA
Non-Demux Mode (Note 12)
PDI = PDQ = Low
895
510
510
2
985
400
400
260
170
100
1095
600
600
2
mA (max)
mA
PDI = Low; PDQ = High
PDI = High; PDQ = Low
PDI = PDQ = High
mA
mA
ITC
IDR
IE
Track-and-Hold and Clock Supply 1:2 Demux Mode
Current
PDI = PDQ = Low
360
220
220
1
425
260
260
1.5
mA (max)
mA
PDI = Low; PDQ = High
PDI = High; PDQ = Low
PDI = PDQ = High
mA
mA
Non-Demux Mode (Note 12)
PDI = PDQ = Low
360
220
220
1
370
225
225
1.5
mA (max)
mA
PDI = Low; PDQ = High
PDI = High; PDQ = Low
PDI = PDQ = High
mA
mA
Output Driver Supply Current
1:2 Demux Mode
PDI = PDQ = Low
210
115
115
10
220
120
120
15
mA (max)
mA
PDI = Low; PDQ = High
PDI = High; PDQ = Low
PDI = PDQ = High
mA
µA
Non-Demux Mode (Note 12)
PDI = PDQ = Low
135
80
125
75
mA (max)
mA
PDI = Low; PDQ = High
PDI = High; PDQ = Low
PDI = PDQ = High
80
75
mA
10
15
µA
Digital Encoder Supply Current
1:2 Demux Mode
PDI = PDQ = Low
60
35
35
10
100
50
mA (max)
mA
PDI = Low; PDQ = High
PDI = High; PDQ = Low
PDI = PDQ = High
50
mA
70
µA
Non-Demux Mode (Note 12)
PDI = PDQ = Low
68
40
40
10
100
65
40
40
70
mA (max)
mA
PDI = Low; PDQ = High
PDI = High; PDQ = Low
PDI = PDQ = High
mA
µA
ITOTAL
Total Supply Current
1:2 Demux Mode
PDI = PDQ = Low
1525
1745
1915
2092 mA (max)
23
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ADC10D1000
ADC10D1500
Units
(Limits)
Symbol
Parameter
Conditions
1:2 Demux Mode
Typ
Lim
Typ
Lim
PC
Power Consumption
PDI = PDQ = Low
2.90
1.66
1.66
6
3.31
3.64
2.00
2.00
7
3.98
W (max)
W
PDI = Low; PDQ = High
PDI = High; PDQ = Low
PDI = PDQ = High
W
mW
Non-Demux Mode (Note 12)
PDI = PDQ = Low
2.77
1.61
1.61
6
3.14
3.14
1.68
1.68
7
W (max)
W
PDI = Low; PDQ = High
PDI = High; PDQ = Low
PDI = PDQ = High
W
mW
TABLE 13. AC Electrical Characteristics
ADC10D1000
ADC10D1500
Units
(Limits)
Symbol
Parameter
Conditions
Typ
Lim
Typ
Lim
Sampling Clock (CLK)
fCLK (max)
Maximum Sampling Clock
Frequency
1.0
1.5
GHz (min)
fCLK (min)
Minimum Sampling Clock
Frequency
Non-DES Mode
200
250
200
250
MHz
DES Mode
MHz
Sampling Clock Duty Cycle
20
80
20
80
% (min)
% (max)
ps (min)
ps (min)
fCLK(min) ≤ fCLK ≤ fCLK(max)
(Note 11)
50
50
tCL
tCH
Sampling Clock Low Time
Sampling Clock High Time
(Note 10)
500
500
200
200
333
333
133
133
(Note 10)
(Note 10)
Data Clock (DCLKI, DCLKQ)
DCLK Duty Cycle
45
55
45
55
% (min)
% (max)
ps
50
50
tSR
Setup Time DCLK_RST±
(Note 11)
(Note 11)
(Note 10)
45
45
45
45
tHR
Hold Time DCLK_RST±
Pulse Width DCLK_RST±
ps
tPWR
Sampling
Clock
Cycles
(min)
5
5
tSYNC_DLY
DCLK Synchronization Delay
90° Mode (Note 10)
0° Mode (Note 10)
4
5
4
5
Sampling
Clock
Cycles
tLHT
tHLT
Differential Low-to-High Transition 10%-to-90%, CL = 2.5 pF
Time
220
220
220
220
ps
ps
Differential High-to-Low Transition 10%-to-90%, CL = 2.5 pF
Time
tSU
tH
Data-to-DCLK Setup Time
DCLK-to-Data Hold Time
DCLK-to-Data Output Skew
90° Mode (Note 10)
90° Mode (Note 10)
850
850
545
570
ps
ps
tOSK
50% of DCLK transition to 50% of
Data transition (Note 10)
±50
±50
ps (max)
Data Input-to-Output
tAD
Aperture Delay
Sampling CLK+ Rise to
Acquisition of Data
1.1
0.2
2.4
1.1
0.2
2.4
ns
ps (rms)
ns
tAJ
Aperture Jitter
tOD
Sampling Clock-to Data Output
Delay (in addition to Latency)
50% of Sampling Clock transition
to 50% of Data transition
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24
ADC10D1000
ADC10D1500
Units
(Limits)
Symbol
tLAT
Parameter
Conditions
Typ
Lim
34
Typ
Lim
34
Latency in 1:2 Demux Non-DES DI, DQ Outputs
Mode (Note 10)
Latency in 1:4 Demux DES Mode DI Outputs
DId, DQd Outputs
35
35
34
34
(Note 10)
DQ Outputs
DId Outputs
DQd Outputs
34.5
35
34.5
35
Sampling
Clock
Cycles
35.5
34
35.5
34
Latency in Non-Demux Non-DES DI Outputs
Mode (Note 10)
Latency in Non-Demux DES Mode DI Outputs
DQ Outputs
34
34
34
34
(Note 10)
DQ Outputs
34.5
34.5
tORR
Over Range Recovery Time
Differential VIN step from ±1.2V to
0V to accurate conversion
Sampling
Clock
1
1
Cycle
tWU
Wake-Up Time (PDI/PDQ low to Non-DES Mode (Note 10)
500
1
500
1
ns
µs
Rated Accuracy Conversion)
DES Mode (Note 10)
Serial Port Interface
fSCLK
Serial Clock Frequency
(Note 10)
15
15
MHz
Serial Clock Low Time
Serial Clock High Time
30
30
30
30
ns (min)
ns (min)
tSSU
tSH
tSCS
tHCS
Serial Data-to-Serial Clock Rising (Note 10)
Setup Time
2.5
1
2.5
1
ns (min)
ns (min)
ns
Serial Data-to-Serial Clock Rising (Note 10)
Hold Time
SCS-to-Serial Clock Rising Setup
Time
2.5
2.5
SCS-to-Serial Clock Falling Hold
Time
1.5
10
1.5
10
ns
ns
tBSU
Bus turn-around time
Calibration
tCAL
Calibration Cycle Time
Non-ECM
2.4·107
2.3·107
2.4·107
2.3·107
Sampling
Clock
Cycles
ECM CSS = 0b
ECM; CSS = 1b
CMS(1:0) = 00b
CMS(1:0) = 01b
CMS(1:0) = 10b (ECM default)
(Note 10)
0.8·107
1.5·107
2.4·107
0.8·107
1.5·107
2.4·107
Sampling
Clock
Cycles
tCAL_L
CAL Pin Low Time
CAL Pin High Time
Clock
Cycles
(min)
1280
1280
1280
1280
tCAL_H
(Note 10)
Clock
Cycles
(min)
Calibration delay determined by
CalDly Pin (Note 10)
CalDly = Low
CalDly = High
224
230
224
230
Clock
Cycles
(max)
tCalDly
Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. There is no guarantee of operation at the Absolute Maximum
Ratings. Operating Ratings indicate conditions for which the device is functional, but do not guarantee specific performance limits. For guaranteed specifications
and test conditions, see the Electrical Characteristics. The guaranteed specifications apply only for the test conditions listed. Some performance characteristics
may degrade when the device is not operated under the listed test conditions.
Note 2: All voltages are measured with respect to GND = GNDTC = GNDDR = GNDE = 0V, unless otherwise specified.
Note 3: When the input voltage at any pin exceeds the power supply limits, i.e. less than GND or greater than VA, the current at that pin should be limited to 50
mA. In addition, over-voltage at a pin must adhere to the maximum voltage limits. Simultaneous over-voltage at multiple pins requires adherence to the maximum
25
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package power dissipation limits. These dissipation limits are calculated using JEDEC JESD51-7 thermal model. Higher dissipation may be possible based on
specific customer thermal situation and specified package thermal resistances from junction to case.
Note 4: Human body model is 100 pF capacitor discharged through a 1.5 kΩ resistor. Machine model is 220 pF discharged through 0Ω. Charged device model
simulates a pin slowly acquiring charge (such as from a device sliding down the feeder in an automated assembler) then rapidly being discharged.
Note 5: Reflow temperature profiles are different for lead-free and non-lead-free packages.
Note 6: The analog inputs, labeled "I/O", are protected as shown below. Input voltage magnitudes beyond the Absolute Maximum Ratings may damage this
device.
30066304
Note 7: To guarantee accuracy, it is required that VA, VTC, VE and VDR be well-bypassed. Each supply pin must be decoupled with separate bypass capacitors.
Note 8: Typical figures are at TA = 25°C, and represent most likely parametric norms. Test limits are guaranteed to National's AOQL (Average Outgoing Quality
Level).
Note 9: Calculation of Full-Scale Error for this device assumes that the actual reference voltage is exactly its nominal value. Full-Scale Error for this device,
therefore, is a combination of Full-Scale Error and Reference Voltage Error. See Figure 4. For relationship between Gain Error and Full-Scale Error, see
Specification Definitions for Gain Error.
Note 10: This parameter is guaranteed by design and is not tested in production.
Note 11: This parameter is guaranteed by design and/or characterization and is not tested in production.
Note 12: The maximum clock frequency for Non-Demux Mode is tested up to only 1.0 GHz for both the ADC10D1000 and the ADC10D1500.
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26
12.0 Specification Definitions
APERTURE (SAMPLING) DELAY is the amount of delay,
measured from the sampling edge of the CLK input, after
which the signal present at the input pin is sampled inside the
device.
APERTURE JITTER (tAJ) is the variation in aperture delay
from sample-to-sample. Aperture jitter can be effectively con-
sidered as noise at the input.
CODE ERROR RATE (CER) is the probability of error and is
defined as the probable number of word errors on the ADC
output per unit of time divided by the number of words seen
in that amount of time. A CER of 10-18 corresponds to a sta-
tistical error in one word about every 31.7 years.
30066346
FIGURE 3. LVDS Output Signal Levels
LVDS OUTPUT OFFSET VOLTAGE (VOS) is the midpoint
between the D+ and D- pins output voltage with respect to
ground; i.e., [(VD+) +( VD-)]/2. See Figure 3.
CLOCK DUTY CYCLE is the ratio of the time that the clock
waveform is at a logic high to the total time of one clock period.
DIFFERENTIAL NON-LINEARITY (DNL) is the measure of
the maximum deviation from the ideal step size of 1 LSB. It is
measured at the relevant sample rate, fCLK, with fIN = 1MHz
sine wave.
MISSING CODES are those output codes that are skipped
and will never appear at the ADC outputs. These codes can-
not be reached with any input value.
MSB (MOST SIGNIFICANT BIT) is the bit that has the largest
value or weight. Its value is one half of full scale.
EFFECTIVE NUMBER OF BITS (ENOB, or EFFECTIVE
BITS) is another method of specifying Signal-to-Noise and
Distortion Ratio, or SINAD. ENOB is defined as (SINAD −
1.76) / 6.02 and states that the converter is equivalent to a
perfect ADC of this many (ENOB) number of bits.
NEGATIVE FULL-SCALE ERROR (NFSE) is a measure of
how far the first code transition is from the ideal 1/2 LSB above
a
differential −VIN/2 with the FSR pin low. For the
ADC10D1000/1500 the reference voltage is assumed to be
ideal, so this error is a combination of full-scale error and ref-
erence voltage error.
FULL POWER BANDWIDTH (FPBW) is a measure of the
frequency at which the reconstructed output fundamental
drops to 3 dB below its low frequency value for a full-scale
input.
NOISE POWER RATIO (NPR) is the ratio of the sum of the
power inside the notched bins to the sum of the power in an
equal number of bins outside the notch, expressed in dB. NPR
is similar to, but more complete than intermodulation distor-
tion measurements.
GAIN ERROR is the deviation from the ideal slope of the
transfer function. It can be calculated from Offset and Full-
Scale Errors. The Positive Gain Error is the Offset Error minus
the Positive Full-Scale Error. The Negative Gain Error is the
Negative Full-Scale Error minus the Offset Error. The Gain
Error is the Negative Full-Scale Error minus the Positive Full-
Scale Error; it is also equal to the Positive Gain Error plus the
Negative Gain Error.
OFFSET ERROR (VOFF) is a measure of how far the mid-
scale point is from the ideal zero voltage differential input.
Offset Error = Actual Input causing average of 8k samples to
result in an average code of 511.5.
INTEGRAL NON-LINEARITY (INL) is a measure of worst
case deviation of the ADC transfer function from an ideal
straight line drawn through the ADC transfer function. The
deviation of any given code from this straight line is measured
from the center of that code value step. The best fit method
is used.
OUTPUT DELAY (tOD) is the time delay (in addition to Laten-
cy) after the rising edge of CLK+ before the data update is
present at the output pins.
OVER-RANGE RECOVERY TIME is the time required after
the differential input voltages goes from ±1.2V to 0V for the
converter to recover and make a conversion with its rated ac-
curacy.
LSB (LEAST SIGNIFICANT BIT) is the bit that has the small-
est value or weight of all bits. This value is
PIPELINE DELAY (LATENCY) is the number of input clock
cycles between initiation of conversion and when that data is
presented to the output driver stage. The data lags the con-
VFS / 2N
where VFS is the differential full-scale amplitude VIN_FSR as set
by the FSR input and "N" is the ADC resolution in bits, which
is 10 for the ADC10D1000/1500.
version by the Latency plus the tOD
.
POSITIVE FULL-SCALE ERROR (PFSE) is a measure of
how far the last code transition is from the ideal 1-1/2 LSB
below a differential +VIN/2. For the ADC10D1000/1500 the
reference voltage is assumed to be ideal, so this error is a
combination of full-scale error and reference voltage error.
LOW VOLTAGE DIFFERENTIAL SIGNALING (LVDS)
DIFFERENTIAL OUTPUT VOLTAGE (VID and VOD) is two
times the absolute value of the difference between the VD+
and VD- signals; each signal measured with respect to
Ground. VOD peak is VOD,P= (VD+ - VD-) and VOD peak-to-peak
is VOD,P-P= 2*(VD+ - VD-); for this product, the VOD is measured
peak-to-peak.
SIGNAL TO NOISE RATIO (SNR) is the ratio, expressed in
dB, of the rms value of the fundamental for a single-tone to
the rms value of the sum of all other spectral components
below one-half the sampling frequency, not including har-
monics or DC.
SIGNAL TO NOISE PLUS DISTORTION (S/(N+D) or
SINAD) is the ratio, expressed in dB, of the rms value of the
fundamental for a single-tone to the rms value of all of the
other spectral components below half the input clock frequen-
cy, including harmonics but excluding DC.
27
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SPURIOUS-FREE DYNAMIC RANGE (SFDR) is the differ-
ence, expressed in dB, between the rms values of the input
signal at the output and the peak spurious signal, where a
spurious signal is any signal present in the output spectrum
that is not present at the input, excluding DC.
where Af1 is the RMS power of the fundamental (output) fre-
quency and Af2 through Af10 are the RMS power of the first 9
harmonic frequencies in the output spectrum.
– Second Harmonic Distortion (2nd Harm) is the differ-
ence, expressed in dB, between the RMS power in the input
frequency seen at the output and the power in its 2nd har-
monic level at the output.
θ
θ
JA is the thermal resistance between the junction to ambient.
JC1 represents the thermal resistance between the die and
the exposed metal area on the top of the HSBGA package.
– Third Harmonic Distortion (3rd Harm) is the difference
expressed in dB between the RMS power in the input fre-
quency seen at the output and the power in its 3rd harmonic
level at the output.
θ
JC2 represents the thermal resistance between the die and
the center group of balls on the bottom of the HSBGA pack-
age.
TOTAL HARMONIC DISTORTION (THD) is the ratio ex-
pressed in dB, of the rms total of the first nine harmonic levels
at the output to the level of the fundamental at the output. THD
is calculated as
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28
13.0 Transfer Characteristic
30066322
FIGURE 4. Input / Output Transfer Characteristic
29
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14.0 Timing Diagrams
30066359
FIGURE 5. Clocking in 1:2 Demux Non-DES Mode*
30066360
FIGURE 6. Clocking in Non-Demux Non-DES Mode*
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30
30066399
FIGURE 7. Clocking in 1:4 Demux DES Mode*
30066396
FIGURE 8. Clocking in Non-Demux Mode DES Mode*
* The timing for these figures is shown for the one input only (I or Q). However, both I- and Q-inputs may be used. For this case,
the I-channel functions precisely the same as the Q-channel, with VinI, DCLKI, DId and DI instead of VinQ, DCLKQ, DQd and DQ.
Both I- and Q-channel use the same CLK.
31
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30066320
FIGURE 9. Data Clock Reset Timing (Demux Mode)
30066325
FIGURE 10. Power-on and On-Command Calibration Timing
30066319
FIGURE 11. Serial Interface Timing
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32
15.0 Typical Performance Plots
VA = VDR = VTC = VE = 1.9V, fCLK = 1.0/1.5 GHz, fIN = 498/748 MHz, TA= 25°C, I-channel, 1:2 Demux Non-DES Mode (1:1 Demux
Non-DES Mode has similar performance), unless otherwise stated. For NPR plots, notch width = 5%, fc = 325 MHz.
INL vs. CODE (ADC10D1000)
INL vs. CODE (ADC10D1500)
30066338
30066349
INL vs. TEMPERATURE (ADC10D1000)
INL vs. TEMPERATURE (ADC10D1500)
30066340
30066350
DNL vs. CODE (ADC10D1000)
DNL vs. CODE (ADC10D1500)
30066339
30066351
33
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DNL vs. TEMPERATURE (ADC10D1000)
DNL vs. TEMPERATURE (ADC10D1500)
30066341
30066352
ENOB vs. TEMPERATURE (ADC10D1000)
ENOB vs. TEMPERATURE (ADC10D1500)
30066376
30066354
ENOB vs. SUPPLY VOLTAGE (ADC10D1000)
ENOB vs. SUPPLY VOLTAGE (ADC10D1500)
30066377
30066355
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34
ENOB vs. CLOCK FREQUENCY (ADC10D1000)
ENOB vs. CLOCK FREQUENCY (ADC10D1500)
30066378
30066356
ENOB vs. INPUT FREQUENCY (ADC10D1000)
ENOB vs. INPUT FREQUENCY (ADC10D1500)
30066379
30066357
ENOB vs. VCMI (ADC10D1000)
ENOB vs. VCMI (ADC10D1500)
30066342
30066358
35
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SNR vs. TEMPERATURE (ADC10D1000)
SNR vs. TEMPERATURE (ADC10D1500)
30066368
30066311
SNR vs. SUPPLY VOLTAGE (ADC10D1000)
SNR vs. SUPPLY VOLTAGE (ADC10D1500)
30066369
30066315
SNR vs. CLOCK FREQUENCY (ADC10D1000)
SNR vs. CLOCK FREQUENCY (ADC10D1500)
30066370
30066316
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36
SNR vs. INPUT FREQUENCY (ADC10D1000)
SNR vs. INPUT FREQUENCY (ADC10D1500)
30066371
30066317
THD vs. TEMPERATURE (ADC10D1000)
THD vs. TEMPERATURE (ADC10D1500)
30066372
30066318
THD vs. SUPPLY VOLTAGE (ADC10D1000)
THD vs. SUPPLY VOLTAGE (ADC10D1500)
30066373
30066321
37
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THD vs. CLOCK FREQUENCY (ADC10D1000)
THD vs. CLOCK FREQUENCY (ADC10D1500)
30066374
30066395
THD vs. INPUT FREQUENCY (ADC10D1000)
THD vs. INPUT FREQUENCY (ADC10D1500)
30066375
30066323
SFDR vs. TEMPERATURE (ADC10D1000)
SFDR vs. TEMPERATURE (ADC10D1500)
30066385
30066324
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38
SFDR vs. SUPPLY VOLTAGE (ADC10D1000)
SFDR vs. SUPPLY VOLTAGE (ADC10D1500)
30066384
30066328
SFDR vs. CLOCK FREQUENCY (ADC10D1000)
SFDR vs. CLOCK FREQUENCY (ADC10D1500)
30066382
30066361
SFDR vs. INPUT FREQUENCY (ADC10D1000)
SFDR vs. INPUT FREQUENCY (ADC10D1500)
30066383
30066362
39
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SPECTRAL RESPONSE AT FIN = 248 MHz (ADC10D1000) SPECTRAL RESPONSE AT FIN = 373 MHz (ADC10D1500)
30066387
30066367
SPECTRAL RESPONSE AT FIN = 498 MHz (ADC10D1000) SPECTRAL RESPONSE AT FIN = 748 MHz (ADC10D1500)
30066388
30066380
CROSSTALK vs. SOURCE FREQUENCY (ADC10D1000)
CROSSTALK vs. SOURCE FREQUENCY (ADC10D1500)
30066363
30066386
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40
FULL POWER BANDWIDTH (ADC10D1000)
FULL POWER BANDWIDTH (ADC10D1500)
30066348
30066389
POWER CONSUMPTION vs. CLOCK FREQUENCY
(ADC10D1000)
POWER CONSUMPTION vs. CLOCK FREQUENCY
(ADC10D1500)
30066381
30066391
NPR vs. RMS NOISE LOADING LEVEL (ADC10D1000)
NPR vs. FC,NOTCH (ADC10D1000)
30066331
30066332
41
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NPR SPECTRAL RESPONSE (ADC10D1000)
30066333
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42
for AC/DC-coupled Mode selection and LVDS output com-
mon-mode voltage selection. See Table 14 for a summary.
16.0 Functional Description
The ADC10D1000/1500 is a versatile A/D converter with an
innovative architecture which permits very high speed oper-
ation. The controls available ease the application of the de-
vice to circuit solutions. Optimum performance requires
adherence to the provisions discussed here and in the Appli-
cations Information Section. This section covers an overview,
a description of control modes (Extended Control Mode and
Non-Extended Control Mode), and features.
TABLE 14. Non-ECM Pin Summary
Pin
Name
Logic-Low
Logic-High
Floating
Dedicated Control Pins
Non-DES
Mode
DES
Mode
DES
Not valid
Demux
NDM
Non-Demux
Mode
16.1 OVERVIEW
Not valid
Not valid
Not valid
Not valid
Mode
The ADC10D1000/1500 uses a calibrated folding and inter-
polating architecture that achieves a high 9.1/9.0 Effective
Number of Bits (ENOB). The use of folding amplifiers greatly
reduces the number of comparators and power consumption.
Interpolation reduces the number of front-end amplifiers re-
quired, minimizing the load on the input signal and further
reducing power requirements. In addition to correcting other
non-idealities, on-chip calibration reduces the INL bow often
seen with folding architectures. The result is an extremely
fast, high performance, low power converter.
DDRPh
CAL
0° Mode
90° Mode
See Section 16.2.1.4
Calibration Pin (CAL)
CalDly Shorter delay Longer delay
I-channel
active
Power Down Power Down
I-channel I-channel
Power Down Power Down
PDI
PDQ
TPM
FSR
Q-channel
active
Q-channel
Q-channel
The analog input signal (which is within the converter's input
voltage range) is digitized to ten bits at speeds of 200/200
MSPS to 1.0/1.5 GSPS, typical. Differential input voltages
below negative full-scale will cause the output word to consist
of all zeroes. Differential input voltages above positive full-
scale will cause the output word to consist of all ones. Either
of these conditions at the I- or Q-input will cause the Out-of-
Range I-channel or Q-channel output (ORI or ORQ), respec-
tively, to output a logic-high signal.
Non-Test
Pattern Mode
Test Pattern
Mode
Not valid
Lower FS input
Range
Higher FS
input Range
Not valid
Dual-purpose Control Pins
AC-coupled
operation
DC-coupled
operation
VCMO
Not allowed
In ECM, an expanded feature set is available via the Serial
Interface. The ADC10D1000/1500 builds upon previous ar-
chitectures, introducing a new AutoSync feature for multi-chip
synchronization and increasing to 15-bit for gain and 12-bit
plus sign for offset the independent programmable adjust-
ment for each channel.
Higher LVDS Lower LVDS
common- common-
mode voltage mode voltage
VBG
Not allowed
16.2.1.1 Dual Edge Sampling Pin (DES)
The Dual Edge Sampling (DES) Pin selects whether the
ADC10D1000/1500 is in DES Mode (logic-high) or Non-DES
Mode (logic-low). DES Mode means that a single input is
sampled by both I- and Q-channels in a time-interleaved man-
ner and the other input is deactivated. One of the ADCs
samples the input signal on the rising sampling clock edge
(duty cycle corrected); the other ADC samples the input signal
on the falling sampling clock edge (duty cycle corrected). In
Non-ECM, only the I-input may be used for DES Mode. In
ECM, the Q-input may be selected via the DEQ Bit (Addr:
0h, Bit: 6).
Each channel has a selectable output demultiplexer which
feeds two LVDS buses. If the 1:2 Demux Mode is selected,
the output data rate is reduced to half the input sample rate
on each bus. When Non-Demux Mode is selected, the output
data rate on each channel is at the same rate as the input
sample clock and only one 10-bit bus per channel is active.
16.2 CONTROL MODES
The ADC10D1000/1500 may be operated in one of two con-
trol modes: Non-extended Control Mode (Non-ECM) or Ex-
tended Control Mode (ECM). In the simpler Non-ECM (also
sometimes referred to as Pin Control Mode), the user affects
available configuration and control of the device through the
control pins. The ECM provides additional configuration and
control options through a serial interface and a set of 16 reg-
isters, most of which are available to the customer.
To use this feature in ECM, use the DES bit in the Configu-
ration Register (Addr: 0h; Bit: 7). See Section 16.3.1.4 DES/
Non-DES Mode for more information.
16.2.1.2 Non-Demultiplexed Mode Pin (NDM)
The Non-Demultiplexed Mode (NDM) Pin selects whether the
ADC10D1000/1500 is in Demux Mode (logic-low) or Non-De-
mux Mode (logic-high). In Non-Demux Mode, the data from
the input is produced at the sampled rate at a single 10-bit
output bus. In Demux Mode, the data from the input is pro-
duced at half the sampled rate at twice the number of output
buses. For Non-DES Mode, each I- or Q-channel will produce
its data on one or two buses for Non-Demux or Demux Mode,
respectively. For DES Mode, the Q-channel will produce its
data on two or four buses for Non-Demux or Demux Mode,
respectively.
16.2.1 Non-Extended Control Mode
In Non-extended Control Mode (Non-ECM), the Serial Inter-
face is not active and all available functions are controlled via
various pin settings. Non-ECM is selected by setting the
ECE Pin to logic-high. Note that, for the control pins, "logic-
high" and "logic-low" refer to VA and GND, respectively. Nine
dedicated control pins provide a wide range of control for the
ADC10D1000/1500 and facilitate its operation. These control
pins provide DES Mode selection, Demux Mode selection,
DDR Phase selection, execute Calibration, Calibration Delay
setting, Power Down I-channel, Power Down Q-channel, Test
Pattern Mode selection, and Full-Scale Input Range selec-
tion. In addition to this, two dual-purpose control pins provide
This feature is pin-controlled only and remains active during
both Non-ECM and ECM. See Section 16.3.2.5 Demux/Non-
demux Mode for more information.
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16.2.1.3 Dual Data Rate Phase Pin (DDRPh)
16.2.1.7 Power Down Q-channel Pin (PDQ)
The Dual Data Rate Phase (DDRPh) Pin selects whether the
ADC10D1000/1500 is in 0° Mode (logic-low) or 90° Mode
(logic-high). The Data is always produced in DDR Mode on
the ADC10D1000/1500. The Data may transition either with
the DCLK transition (0° Mode) or halfway between DCLK
transitions (90° Mode). The DDRPh Pin selects 0° Mode or
90° Mode for both the I-channel: DI- and DId-to-DCLKI phase
relationship and for the Q-channel: DQ- and DQd-to-DCLKQ
phase relationship.
The Power Down Q-channel (PDQ) Pin selects whether the
Q-channel is powered down (logic-high) or active (logic-low).
This pin functions similarly to the PDI pin, except that it applies
to the Q-channel. The PDI and PDQ pins function indepen-
dently of each other to control whether each I- or Q-channel
is powered down or active.
This pin remains active in ECM. In ECM, either this pin or the
PDQ bit (Addr: 0h; Bit: 10) in the Control Register may be
used to power-down the Q-channel. See Section 16.3.4 Pow-
er Down for more information.
To use this feature in ECM, use the DPS bit in the Configu-
ration Register (Addr: 0h; Bit: 14). See Section 16.3.2.1 DDR
Clock Phase for more information.
16.2.1.8 Test Pattern Mode Pin (TPM)
The Test Pattern Mode (TPM) Pin selects whether the
output of the ADC10D1000/1500 is a test pattern (logic-high)
or the converted analog input (logic-low). The
ADC10D1000/1500 can provide a test pattern at the four out-
put buses independently of the input signal to aid in system
debug. In TPM, the ADC is disengaged and a test pattern
generator is connected to the outputs, including ORI and
ORQ. SeeSection 16.3.2.6 Test Pattern Mode for more infor-
mation.
16.2.1.4 Calibration Pin (CAL)
The Calibration (CAL) Pin may be used to execute an on-
command calibration or to disable the power-on calibration.
The effect of calibration is to maximize the dynamic perfor-
mance. To initiate an on-command calibration via the CAL
pin, bring the CAL pin high for a minimum of tCAL_H input clock
cycles after it has been low for a minimum of tCAL_L input clock
cycles. Holding the CAL pin high upon power-on will prevent
execution of the power-on calibration. In ECM, this pin re-
mains active and is logically OR'd with the CAL bit.
16.2.1.9 Full-Scale Input Range Pin (FSR)
The Full-Scale Input Range (FSR) Pin selects whether the
full-scale input range for both the I- and Q-channel is higher
(logic-high) or lower (logic-low). The input full-scale range is
specified as VIN_FSR in Table 8. In Non-ECM, the full-scale
input range for each I- and Q-channel may not be set inde-
pendently, but it is possible to do so in ECM. The device must
be calibrated following a change in FSR to obtain optimal
performance.
To use this feature in ECM, use the CAL bit in the Configu-
ration Register (Addr: 0h; Bit: 15). See Section 16.3.3 Cali-
bration Feature for more information.
16.2.1.5 Calibration Delay Pin (CalDly)
The Calibration Delay (CalDly) Pin selects whether a shorter
or longer delay time is present, after the application of power,
until the start of the power-on calibration. The actual delay
time is specified as tCalDly and may be found in Table 13. This
feature is pin-controlled only and remains active in ECM. It is
recommended to select the desired delay time prior to power-
on and not dynamically alter this selection.
To use this feature in ECM, use the Configuration Registers
(Addr: 3h and Bh). See Section 16.3.1 Input Control and Ad-
just for more information.
16.2.1.10 AC/DC-Coupled Mode Pin (VCMO
)
See Section 16.3.3 Calibration Feature for more information.
The VCMO Pin serves a dual purpose. When functioning as an
output, it provides the optimal common-mode voltage for the
DC-coupled analog inputs. When functioning as an input, it
selects whether the device is AC-coupled (logic-low) or DC-
coupled (floating). This pin is always active, in both ECM and
Non-ECM.
16.2.1.6 Power Down I-channel Pin (PDI)
The Power Down I-channel (PDI) Pin selects whether the I-
channel is powered down (logic-high) or active (logic-low).
The digital data output pins, DI and DId, (both positive and
negative) are put into a high impedance state when the I-
channel is powered down. Upon return to the active state, the
pipeline will contain meaningless information and must be
flushed. The supply currents (typicals and limits) are available
for the I-channel powered down or active and may be found
in Table 12. The device should be recalibrated following a
power-cycle of PDI (or PDQ).
16.2.1.11 LVDS Output Common-mode Pin (VBG
)
The VBG Pin serves a dual purpose. When functioning as an
output, it provides the bandgap reference. When functioning
as an input, it selects whether the LVDS output common-
mode voltage is higher (logic-high) or lower (floating). The
LVDS output common-mode voltage is specified as VOS and
may be found in Table 11. This pin is always active, in both
ECM and Non-ECM.
This pin remains active in ECM. In ECM, either this pin or the
PDI bit (Addr: 0h; Bit: 11) in the Control Register may be used
to power-down the I-channel. See Section 16.3.4 Power
Down for more information.
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44
16.2.2 Extended Control Mode
clocks, the SDO output will hold the D0 bit until SCS is de-
asserted. For a write operation, if the SCS is asserted longer
than 24 clocks, data write will occur normally through the SDI
input upon the 24th clock. Setup and hold times, tSCS and
tHCS, with respect to the SCLK must be observed. SCS must
be toggled in between register access cycles.
In Extended Control Mode (ECM), most functions are con-
trolled via the Serial Interface. In addition to this, several of
the control pins remain active. See Table 17 for details. ECM
is selected by setting the ECE Pin to logic-low. If the ECE Pin
is set to logic-high (Non-ECM), then the registers are reset to
their default values. So, a simple way to reset the registers is
by toggling the ECE pin. Four pins on the
ADC10D1000/1500 control the Serial Interface: SCS, SCLK,
SDI and SDO. This section covers the Serial Interface. The
Register Definitions are located at the end of the datasheet
so that they are easy to find, see Section 18.0 Register Defi-
nitions.
SCLK: This signal is used to register the input data (SDI) on
the rising edge; and to source the output data (SDO) on the
falling edge. The user may disable the clock and hold it at
logic-low. There is no minimum frequency requirement for
SCLK; see fSCLK in Table 13 for more details.
SDI: Each register access requires a specific 24-bit pattern at
this input, consisting of a command field and a data field.
When in read mode, the data field is high impedance in case
the bidirectional SDI/O option is used. Setup and hold times,
tSH and tSSU, with respect to the SCLK must be observed.
16.2.2.1 The Serial Interface
The ADC10D1000/1500 offers a Serial Interface that allows
access to the sixteen control registers within the device. The
Serial Interface is a generic 4-wire (optionally 3-wire) syn-
chronous interface that is compatible with SPI type interfaces
that are used on many micro-controllers and DSP controllers.
Each serial interface access cycle is exactly 24 bits long. A
register-read or register-write can be accomplished in one
cycle. The signals are defined in such a way that the user can
opt to simply join SDI and SDO signals in his system to ac-
complish a single, bidirectional SDI/O signal. A summary of
the pins for this interface may be found in Table 15. See Fig-
ure 11 for the timing diagram and Table 13 for timing specifi-
cation details. Control register contents are retained when the
device is put into power-down mode.
SDO: This output is normally tri-stated and is driven only
when SCS is asserted, the first 8 bits of command data have
been received and it is a READ operation. The data is shifted
out, MSB first, starting with the 8th clock's falling edge. At the
end of the access, when SCS is de-asserted, this output is tri-
stated once again. If an invalid address is accessed, the data
sourced will consist of all zeroes. If it is a read operation, there
will be a bus turnaround time, tBSU, from when the last bit of
the command field was read in until the first bit of the data field
is written out.
Table 16 shows the Serial Interface bit definitions.
TABLE 16. Command and Data Field Definitions
TABLE 15. Serial Interface Pins
Bit No.
Name
Read/Write (R/W)
Reserved
A<3:0>
Comments
Pin
C4
C5
B4
A3
Name
1b indicates a read operation
0b indicates a write operation
1
SCS (Serial Chip Select bar)
SCLK (Serial Clock)
SDI (Serial Data In)
2-3
4-7
8
Bits must be set to 10b
16 registers may be addressed.
The order is MSB first
SDO (Serial Data Out)
X
This is a "don't care" bit
SCS: Each assertion (logic-low) of this signal starts a new
register access, i.e. the SDI command field must be ready on
the following SCLK rising edge. The user is required to de-
assert this signal after the 24th clock. If the SCS is de-
asserted before the 24th clock, no data read/write will occur.
For a read operation, if the SCS is asserted longer than 24
Data written to or read from
addressed register
9-24
D<15:0>
The serial data protocol is shown for a read and write opera-
tion in Figure 12 and Figure 13, respectively.
30066392
FIGURE 12. Serial Data Protocol - Read Operation
45
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30066393
FIGURE 13. Serial Data Protocol - Write Operation
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46
16.3 FEATURES
Table 17 is a summary of the features available, as well as
details for the control mode chosen.
The ADC10D1000/1500 offers many features to make the
device convenient to use in a wide variety of applications.
TABLE 17. Features and Modes
Control Pin
Active in ECM
Feature
Non-ECM
ECM
Default ECM State
Input Control and Adjust
Selected via VCMO
AC/DC-coupled Mode Selection
Input Full-scale Range Adjust
Input Offset Adjust Setting
LC Filter on Clock
Yes
No
Not available
N/A
(Pin C2)
Selected via FSR
(Pin Y3)
Selected via the Config Reg
Mid FSR value
Offset = 0 mV
LC Filter off
(Addr: 3h and Bh)
Selected via the Config Reg
Not available
Not available
N/A
N/A
No
(Addr: 2h and Ah)
Selected via the Config Reg
(Addr: Dh)
Selected via DES
(Pin V5)
Selected via the DES Bit
DES/Non-DES Mode Selection
Sampling Clock Phase Adjust
VCMO Adjust
Non-DES Mode
tAD adjust disabled
Default VCMO
(Addr: 0h; Bit: 7)
Selected via the Config Reg
Not available
Not available
N/A
N/A
(Addr: Ch and Dh)
Selected via the Config Reg
(Addr: 1h)
Output Control and Adjust
Selected via DDRPh
Selected via the DPS Bit
DDR Clock Phase Selection
No
N/A
Yes
N/A
No
0° Mode
Higher amplitude
N/A
(Pin W4)
(Addr: 0h; Bit: 14)
LVDS Differential Output
Voltage Amplitude Selection
Selected via the OVS Bit
Higher amplitude only
(Addr: 0h; Bit: 13)
Selected via VBG
(Pin B1)
LVDS Common-Mode Output
Voltage Amplitude Selection
Not available
Selected via the 2SC Bit
Output Formatting Selection
Test Pattern Mode at Output
Offset Binary only
Offset Binary
TPM disabled
N/A
(Addr: 0h; Bit: 4)
Selected via TPM
(Pin A4)
Selected via the TPM Bit
(Addr: 0h; Bit: 12)
Demux/Non-Demux Mode
Selection
Selected via NDM
(Pin A5)
Yes
N/A
Not available
Selected via the Config Reg
Master Mode,
RCOut1/2 disabled
AutoSync
Not available
Not available
(Addr: Eh)
Selected via the Config Reg
DCLK Reset
N/A
Calibration
Yes
DCLK Reset disabled
(Addr: Eh)
Selected via CAL
(Pin D6)
Selected via the CAL Bit
N/A
(CAL = 0)
On-command Calibration
(Addr: 0h; Bit: 15)
Power-on Calibration Delay
Selection
Selected via CalDly
(Pin V4)
Yes
N/A
Not available
N/A
tCAL
Selected via the Config Reg
Calibration Adjust
Not available
(Addr: 4h)
Power-Down
Selected via PDI
(Pin U3)
Selected via the PDI Bit
Power down I-channel
Yes
I-channel operational
Q-channel operational
(Addr: 0h; Bit: 11)
Selected via PDQ
(Pin V3)
Selected via the PDQ Bit
Power down Q-channel
Yes
(Addr: 0h; Bit: 10)
"N/A" means "Not Applicable."
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16.3.1 Input Control and Adjust
MSPS. All data is available in parallel. To properly reconstruct
the sampled waveform, the four bytes of parallel data that are
output with each DCLK must be correctly interleaved. The
sampling order is as follows, from the earliest to the latest:
DQd, DId, DQ, DI. See Figure 7. If the device is programmed
into the Non-Demux DES Mode, two bytes of parallel data are
output with each edge of the DCLK in the following sampling
order, from the earliest to the latest: DQ, DI. See Figure 8.
There are several features and configurations for the input of
the ADC10D1000/1500 so that it may be used in many dif-
ferent applications. This section covers AC/DC-coupled
Mode, input full-scale range adjust, input offset adjust, DES/
Non-DES Mode, sampling clock phase adjust, an LC filter on
the sampling clock, and VCMO Adjust.
16.3.1.1 AC/DC-coupled Mode
The performance of the ADC10D1000/1500 in DES Mode
depends on how well the two channels are interleaved, i.e.
that the clock samples either channel with precisely a 50%
duty-cycle, each channel has the same offset (nominally code
511/512), and each channel has the same full-scale range.
The ADC10D1000/1500 includes an automatic clock phase
background adjustment in DES Mode to automatically and
continuously adjust the clock phase of the I- and Q-channels,
which also removes the need to adjust the clock phase setting
manually. A difference exists in the typical offset between the
I- and Q-channels, which can be removed via the offset adjust
feature in ECM, to optimize DES Mode performance. If pos-
sible, it is recommended to use the Q-input for better DES
Mode performance with no offset adjustment required. To ad-
just the I- or Q-channel offset, measure a histogram of the
digital data and adjust the offset via the Control Register until
the histogram is centered at code 511/512. Similarly, the full-
scale range of each channel may be adjusted for optimal
performance.
The analog inputs may be AC or DC-coupled. See Sec-
tion 16.2.1.10 AC/DC-Coupled Mode Pin (VCMO) for informa-
tion on how to select the desired mode and Section 17.1.6
DC-coupled Input Signals and Section 17.1.5 AC-coupled In-
put Signals for applications information.
16.3.1.2 Input Full-Scale Range Adjust
The input full-scale range for the ADC10D1000/1500 may be
adjusted via Non-ECM or ECM. In Non-ECM, a control pin
selects a higher or lower value; see Section 16.2.1.9 Full-
Scale Input Range Pin (FSR). In ECM, the input full-scale
range may be adjusted with 15-bits of precision. See
VIN_FSR in Table 8 for electrical specification details. Note that
the higher and lower full-scale input range settings in Non-
ECM correspond to the mid and min full-scale input range
settings in ECM. It is necessary to execute an on-command
calibration following a change of the input full-scale range.
See Section 18.0 Register Definitions for information about
the registers.
16.3.1.5 Sampling Clock Phase Adjust
16.3.1.3 Input Offset Adjust
The sampling clock (CLK) phase may be delayed internally to
the ADC up to 825 ps in ECM. This feature is intended to help
the system designer remove small imbalances in clock distri-
bution traces at the board level when multiple ADCs are used,
or to simplify complex system functions such as beam steer-
ing for phase array antennas.
The input offset adjust for the ADC10D1000/1500 may be
adjusted with 12-bits of precision plus sign via ECM. See
Section 18.0 Register Definitions for information about the
registers.
16.3.1.4 DES/Non-DES Mode
Additional delay in the clock path also creates additional jitter,
so a clock jitter-cleaner is made available when using the
sampling clock phase adjust, see Section 16.3.1.6 LC Filter
on Sampling Clock. Nevertheless, because the sampling
clock phase adjust delays all clocks, including the DCLKs and
output data, the user is strongly advised to use the minimal
amount of adjustment and verify the net benefit of this feature
in his system before relying on it.
The ADC10D1000/1500 can operate in Dual-Edge Sampling
(DES) or Non-DES Mode. The DES Mode allows for one of
the ADC10D1000/1500's inputs to be sampled by both chan-
nels' ADCs. One ADC samples the input on the rising edge
of the sampling clock and the other ADC samples the same
input on the falling edge of the sampling clock. A single input
is thus sampled twice per clock cycle, resulting in an overall
sample rate of twice the sampling clock frequency, e.g.
2.0/3.0 GSPS with a 1.0/1.5 GHz sampling clock. See Sec-
tion 16.2.1.1 Dual Edge Sampling Pin (DES) for information
on how to select the desired mode. Since DES Mode uses
both I- and Q-channels to process the input signal, both chan-
nels must be powered up for the DES Mode to function
properly.
16.3.1.6 LC Filter on Sampling Clock
A LC bandpass filter is available on the ADC10D1000/1500
sampling clock to clean jitter on the incoming clock. This fea-
ture is only available when the CLK phase adjust feature is
also used. This feature was designed to minimize the dynamic
performance degradation resulting from additional clock jitter
as much as possible. It is available in ECM via the LCF (LC
Filter) bits in the Control Register (Addr: Dh, Bits 7:0).
If the clock phase adjust feature is enabled, the sampling
clock passes through additional gate delay, which adds jitter
to the clock signal. The LC filter helps to remove this additional
jitter, so it is only available when the clock phase adjust fea-
ture is also enabled. To enable both features, use SA (Addr:
Dh, Bit 8). The LCF bits are thermometer encoded and may
be used to set a filter center frequency ranging from 0.8 GHz
to 1.5 GHz; see Table 18.
In Non-ECM, only the I-input may be used for the DES Mode
input. In ECM, either the I- or Q-input may be selected by first
using the DES bit (Addr: 0h, Bit 7) to select the DES Mode.
The DEQ Bit (Addr: 0h, Bit: 6) is used to select the Q-input,
but the I-input is used by default.
In this mode, the outputs must be carefully interleaved in order
to reconstruct the sampled signal. If the device is pro-
grammed into the 1:4 Demux DES Mode, the data is effec-
tively demultiplexed by 1:4. If the sampling clock is 1.0/1.5
GHz, the effective sampling rate is doubled to 2.0/3.0 GSPS
and each of the 4 output buses has an output rate of 500
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TABLE 18. LC Filter Code vs. fc
LCF(7:0)
LCF(7:0)
fc (GHz)
0
1
2
3
4
5
6
7
8
0000 0000b
0000 0001b
0000 0011b
0000 0111b
0000 1111b
0001 1111b
0011 1111b
0111 1111b
1111 1111b
1.5
1.4
1.3
1.2
1.1
1.0
0.92
0.85
0.8
30066394
FIGURE 14. DDR DCLK-to-Data Phase Relationship
The LC filter is a second-order bandpass filter, which has the
following simulated bandwidth for a center frequency at
1GHz, see Table 19.
16.3.2.2 LVDS Output Differential Voltage
The ADC10D1000/1500 is available with a selectable higher
or lower LVDS output differential voltage. This parameter is
VOD and may be found in Table 11. The desired voltage may
be selected via the OVS Bit (Addr: 0h, Bit 13); see Sec-
tion 18.0 Register Definitions for more information.
TABLE 19. LC Filter Bandwidth vs. Level
Bandwidth at [dB]
Bandwidth [MHz]
-3
-6
-9
-12
±135 ±235 ±360 ±525
16.3.2.3 LVDS Output Common-Mode Voltage
The ADC10D1000/1500 is available with a selectable higher
or lower LVDS output common-mode voltage. This parameter
is VOS and may be found in Table 11. See Section 16.2.1.11
LVDS Output Common-mode Pin (VBG) for information on
how to select the desired voltage.
16.3.1.7 VCMO Adjust
The VCMO of the ADC10D1000/1500 is generated as a
buffered version of the internal bandgap reference; see
VCMO in Table 8. This pin provides an output voltage which is
the optimal common-mode voltage for the input signal and
should be used to set the common-mode voltage of the driving
buffer. However, in order to accommodate larger signals at
the analog inputs, the VCMO may be adjust to a lower value.
From its typical default value, the VCMO may be lowered by
approximately 200 mV via the Control Register 1h. See Sec-
tion 18.0 Register Definitions for more information. Adjusting
the VCMO away from its optimal value will also degrade the
dynamic performance; see ENOB vs. VCMO in Section 15.0
Typical Performance Plots for a typical plot. The performance
of the device, when using a VCMO other than the default value,
is not guaranteed.
16.3.2.4 Output Formatting
The formatting at the digital data outputs may be either offset
binary or two's complement. The default formatting is offset
binary, but two's complement may be selected via the 2SC
Bit (Addr: 0h, Bit 4); see Section 18.0 Register Definitions for
more information.
16.3.2.5 Demux/Non-demux Mode
The ADC10D1000/1500 may be in one of two demultiplex
modes: Demux Mode or Non-Demux Mode (also sometimes
referred to as 1:1 Demux Mode). In Non-Demux Mode, the
data from the input is simply output at the sampling rate at
which it was sampled on one 10-bit bus. In Demux Mode, the
data from the input is output at half the sampling rate, on twice
the number of buses. See Figure 1. Demux/Non-Demux
Mode may only be selected by the NDM pin; see Sec-
tion 16.2.1.2 Non-Demultiplexed Mode Pin (NDM). In Non-
DES Mode, the output data from each channel may be
demultiplexed by a factor of 1:2 (1:2 Demux Non-DES Mode)
or not demultiplexed (Non-Demux Non-DES Mode). In DES
Mode, the output data from both channels interleaved may be
demultiplexed (1:4 Demux DES Mode) or not demultiplexed
(Non-Demux DES Mode).
16.3.2 Output Control and Adjust
There are several features and configurations for the output
of the ADC10D1000/1500 so that it may be used in many dif-
ferent applications. This section covers DDR clock phase,
LVDS output differential and common-mode voltage, output
formatting, Demux/Non-demux Mode, and Test Pattern
Mode.
16.3.2.1 DDR Clock Phase
The ADC10D1000/1500 output data is always delivered in
Double Data Rate (DDR). With DDR, the DCLK frequency is
half the data rate and data is sent to the outputs on both edges
of DCLK; see Figure 14. The DCLK-to-Data phase relation-
ship may be either 0° or 90°. For 0° Mode, the Data transitions
on each edge of the DCLK. Any offset from this timing is
tOSK; see Table 13 for details. For 90° Mode, the DCLK tran-
sitions in the middle of each Data cell. Setup and hold times
for this transition, tSU and tH, may also be found in Table 13.
The DCLK-to-Data phase relationship may be selected via
the DDRPh Pin in Non-ECM (see Section 16.2.1.3 Dual Data
Rate Phase Pin (DDRPh)) or the DPS bit in the Configuration
Register (Addr: 0h; Bit: 14) in ECM.
16.3.2.6 Test Pattern Mode
The ADC10D1000/1500 can provide a test pattern at the four
output buses independently of the input signal to aid in system
debug. In Test Pattern Mode, the ADC is disengaged and a
test pattern generator is connected to the outputs, including
ORI and ORQ. The test pattern output is the same in DES
Mode or Non-DES Mode. Each port is given a unique 10-bit
word, alternating between 1's and 0's. When the part is pro-
grammed into the Demux Mode, the test pattern’s order is
described in Table 20. If the I- or Q-channel is powered down,
the test pattern will not be output for that channel.
49
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TABLE 20. Test Pattern by Output Port in
Demux Mode
TABLE 22. Calibration Pins
Pin/Bit
Name
Function
Time Qd
Id
Q
I
ORQ ORI Comments
D6
(Addr: 0h;
Bit 15)
CAL
(Calibration)
T0 000h 001h 002h 004h 0b 0b
T1 3FFh 3FEh 3FDh 3FBh 1b 1b
T2 000h 001h 002h 004h 0b 0b
T3 3FFh 3FEh 3FDh 3FBh 1b 1b
T4 000h 001h 002h 004h 0b 0b
T5 000h 001h 002h 004h 0b 0b
T6 3FFh 3FEh 3FDh 3FBh 1b 1b
T7 000h 001h 002h 004h 0b 0b
T8 3FFh 3FEh 3FDh 3FBh 1b 1b
T9 000h 001h 002h 004h 0b 0b
T10 000h 001h 002h 004h 0b 0b
T11 3FFh 3FEh 3FDh 3FBh 1b 1b
T12 000h 001h 002h 004h 0b 0b
Initiate calibration
Pattern
Sequence
n
CalDly
(Calibration
Delay)
V4
Select calibration delay
Adjust calibration
sequence and mode
Addr: 4h Calibration Adjust
Pattern
Sequence
n+1
CalRun
(Calibration
Running)
Indicates while
calibration is running
B5
Rtrim+/-
(Input termination
trim resistor)
External resistor used to
calibrate analog and
CLK inputs
C1/D2
Pattern
Sequence
n+2
Rext+/-
(External
Reference
resistor)
External resistor used to
calibrate internal linearity
T13
...
...
...
...
...
...
C3/D3
When the part is programmed into the Non-Demux Mode, the
test pattern’s order is described in Table 21.
16.3.3.2 How to Execute a Calibration
TABLE 21. Test Pattern by Output Port in
Non-Demux Mode
Calibration may be initiated by holding the CAL pin low for at
least tCAL_L clock cycles, and then holding it high for at least
another tCAL_H clock cycles, as defined in Table 13. The min-
imum tCAL_L and tCAL_H input clock cycle sequences are re-
quired to ensure that random noise does not cause a
calibration to begin when it is not desired. The time taken by
the calibration procedure is specified as tCAL. The CAL Pin is
active in both ECM and Non-ECM. However, in ECM, the CAL
Pin is logically OR'd with the CAL Bit, so both the pin and bit
are required to be set low before executing another calibration
via either pin or bit.
Time
T0
I
Q
ORI ORQ
Comments
001h
001h
3FEh
3FEh
001h
3FEh
001h
3FEh
3FEh
3FEh
001h
001h
3FEh
3FEh
...
000h
000h
3FFh
3FFh
000h
3FFh
000h
3FFh
3FFh
3FFh
000h
000h
3FFh
3FFh
...
0b
0b
1b
1b
0b
1b
0b
1b
1b
1b
0b
0b
1b
1b
...
0b
0b
1b
1b
0b
1b
0b
1b
1b
1b
0b
0b
1b
1b
...
T1
T2
T3
Pattern
Sequence
n
T4
T5
T6
16.3.3.3 Power-on Calibration
T7
For standard operation, power-on calibration begins after a
time delay following the application of power, as determined
by the setting of the CalDly Pin and measured by tCalDly (see
Table 13). This delay allows the power supply to come up and
stabilize before the power-on calibration takes place. The
best setting (short or long) of the CalDly Pin depends upon
the settling time of the power supply.
T8
T9
T10
T11
T12
T13
T14
Pattern
Sequence
n+1
It is strongly recommended to set CalDly Pin (to either logic-
high or logic-low) before powering the device on since this pin
affects the power-on calibration timing. This may be accom-
plished by setting CalDly via an external 1kΩ resistor con-
nected to GND or VA. If the CalDly Pin is toggled while the
device is powered-on, it can execute a calibration even
though the CAL Pin/Bit remains logic-low.
16.3.3 Calibration Feature
The ADC10D1000/1500 calibration must be run to achieve
specified performance. The calibration procedure is exactly
the same regardless of how it was initiated or when it is run.
Calibration trims the analog input differential termination re-
sistors, the CLK input resistor, and sets internal bias currents
which affect the linearity of the converter. This minimizes full-
scale error, offset error, DNL and INL, resulting in maximizing
the dynamic performance, as measured by: SNR, THD,
SINAD (SNDR) and ENOB.
The power-on calibration will be not be performed if the CAL
pin is logic-high at power-on. In this case, the calibration cycle
will not begin until the on-command calibration conditions are
met. The ADC10D1000/1500 will function with the CAL pin
held high at power up, but no calibration will be done and
performance will be impaired.
If it is necessary to toggle the CalDly Pin during the system
power up sequence, then the CAL Pin/Bit must be set to logic-
high during the toggling and afterwards for 109 Sampling
Clock cycles. This will prevent the power-on calibration, so an
on-command calibration must be executed or the perfor-
mance will be impaired.
16.3.3.1 Calibration Control Pins and Bits
Table 22 is a summary of the pins and bits used for calibration.
See Section 8.0 Ball Descriptions and Equivalent Circuits for
complete pin information and Figure 10 for the timing dia-
gram.
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50
16.3.3.4 On-command Calibration
To read calibration values from the SPI, do the following:
1. Set ADC to desired operating conditions.
2. Set SSC (Addr: 4h, Bit 7) to 1.
In addition to the power-on calibration, it is recommended to
execute an on-command calibration whenever the settings or
conditions to the device are altered significantly, in order to
obtain optimal parametric performance. Some examples in-
clude: changing the FSR via either ECM or Non-ECM, power-
cycling either channel, and switching into or out of DES Mode.
For best performance, it is also recommended that an on-
command calibration be run 20 seconds or more after appli-
cation of power and whenever the operating temperature
changes significantly, relative to the specific system perfor-
mance requirements.
3. Power down both I- and Q-channels.
4. Read exactly 184 times the Calibration Values register
(Addr: 5h). The register values are R0, R1, R2... R183 and
R0 is a dummy value.
5. Power up I- and Q-channels to original setting.
6. Set SSC (Addr: 4h, Bit 7) to 0.
7. Continue with normal operation.
To write calibration values to the SPI, do the following:
Due to the nature of the calibration feature, it is recommended
to avoid unnecessary activities on the device while the cali-
bration is taking place. For example, do not read or write to
the Serial Interface or use the DCLK Reset feature while cal-
ibrating the ADC. Doing so will impair the performance of the
device until it is re-calibrated correctly. Also, it is recommend-
ed to not apply a strong narrow-band signal to the analog
inputs during calibration because this may impair the accu-
racy of the calibration; broad spectrum noise is acceptable.
1. Set ADC to operating conditions at which Calibration Val-
ues were previously read.
2. Set SSC (Addr: 4h, Bit 7) to 1.
3. Power down both I- and Q-channels.
4. Write exactly 185 times the Calibration Values register (Ad-
dr: 5h). The registers should be written R1, R2... R183, dum-
my1, dummy2.
5. Power up I- and Q-channels to original setting.
6. Set SSC (Addr: 4h, Bit 7) to 0.
7. Continue with normal operation.
16.3.3.5 Calibration Adjust
The calibration event itself may be adjusted, for sequence and
mode. This feature can be used if a shorter calibration time
than the default is required; see tCAL in Table 13. However,
the performance of the device, when using a shorter calibra-
tion time than the default setting, is not guaranteed.
16.3.3.7 Calibration and Power-Down
If PDI and PDQ are simultaneously asserted during a cali-
bration cycle, the ADC10D1000/1500 will immediately power
down. The calibration cycle will continue when either or both
channels are powered back up, but the calibration will be
compromised due to the incomplete settling of bias currents
directly after power up. Therefore, a new calibration should
be executed upon powering the ADC10D1000/1500 back up.
In general, the ADC10D1000/1500 should be recalibrated
when either or both channels are powered back up, or after
one channel is powered down. For best results, this should
be done after the device has stabilized to its operating tem-
perature.
The calibration sequence may be adjusted via CSS (Addr:
4h, Bit 14). The default setting of CSS = 1b executes both
RIN and RIN_CLK Calibration (using Rtrim) and internal linearity
Calibration (using Rext). Executing a calibration with CSS =
0b executes only the internal linearity Calibration. The first
time that Calibration is executed, it must be with CSS = 1b to
trim RIN and RIN_CLK. However, once the device is at its op-
erating temperature and RIN has been trimmed at least one
time, it will not drift significantly. To save time in subsequent
calibrations, trimming RIN and RIN_CLK may be skipped, i.e. by
setting CSS = 0b.
16.3.3.8 Calibration and the Digital Outputs
The mode may be changed, to save calibration execution time
for the internal linearity Calibration. See tCAL in Table 13. Ad-
justing CMS(1:0) will select three different pre-defined cali-
bration times. A larger amount of time will calibrate each
channel more closely to the ideal values, but choosing shorter
times will not significantly impact the performance. The fourth
setting, CMS(1:0) = 11b, is not available.
During calibration, the digital outputs (including DI, DId, DQ,
DQd and OR) are set logic-low, to reduce noise. The DCLK
runs continuously during calibration. After the calibration is
completed and the CalRun signal is logic-low, it takes an ad-
ditional 60 Sampling Clock cycles before the output of the
ADC10D1000/1500 is valid converted data from the analog
inputs. This is the time it takes for the pipeline to flush, as well
as for other internal processes.
16.3.3.6 Read/Write Calibration Settings
16.3.4 Power Down
When the ADC performs a calibration, the calibration con-
stants are stored in an array which is accessible via the
Calibration Values register (Addr: 5h). To save the time which
it takes to execute a calibration, tCAL, or if re-using a previous
calibration result, these values can be read from and written
to the register at a later time. For example, if an application
requires the same input impedance, RIN, this feature can be
used to load a previously determined set of values. For the
calibration values to be valid, the ADC must be operating un-
der the same conditions, including temperature, at which the
calibration values were originally read from the ADC.
On the ADC10D1000/1500, the I- and Q-channels may be
powered down individually. This may be accomplished via the
control pins, PDI and PDQ, or via ECM. In ECM, the PDI and
PDQ pins are logically OR'd with the Control Register setting.
See Section 16.2.1.6 Power Down I-channel Pin (PDI)
andSection 16.2.1.7 Power Down Q-channel Pin (PDQ) for
more information.
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17.1.2 FSR and the Reference Voltage
17.0 Applications Information
The full-scale analog differential input range (VIN_FSR) of the
ADC10D1000/1500 is derived from an internal 1.254V
bandgap reference. In Non-ECM, this full-scale range has two
settings controlled by the FSR Pin; see Section 16.2.1.9 Full-
Scale Input Range Pin (FSR). The FSR Pin operates on both
I- and Q-channels. In ECM, the full-scale range may be inde-
pendently set for each channel via Addr:3h and Bh with 15
bits of precision; see Section 18.0 Register Definitions. The
best SNR is obtained with a higher full-scale input range, but
better distortion and SFDR are obtained with a lower full-scale
input range. It is not possible to use an external analog ref-
erence voltage to modify the full-scale range, and this adjust-
ment should only be done digitally, as described.
17.1 THE ANALOG INPUTS
The ADC10D1000/1500 will continuously convert any signal
which is present at the analog inputs, as long as a CLK signal
is also provided to the device. This section covers important
aspects related to the analog inputs including: acquiring the
input, the reference voltage and FSR, out-of-range indication,
AC/DC-coupled signals, and single-ended input signals.
17.1.1 Acquiring the Input
Data is acquired at the rising edge of CLK+ in Non-DES Mode
and both the falling and rising edges of CLK+ in DES Mode.
The digital equivalent of that data is available at the digital
outputs a constant number of sampling clock cycles later for
the DI, DQ, DId and DQd output buses, a.k.a. Latency, de-
pending on the demultiplex mode which is selected. See
tLAT in Table 13. In addition to the Latency, there is a constant
output delay, tOD, before the data is available at the outputs.
See tOD in Table 13 and the Timing Diagrams.
A buffered version of the internal 1.254V bandgap reference
voltage is made available at the VBG Pin for the user. The
VBG pin can drive a load of up to 80 pF and source or sink up
to 100 μA. It should be buffered if more current than this is
required. This pin remains as a constant reference voltage
regardless of what full-scale range is selected and may be
used for a system reference. VBG is a dual-purpose pin and it
may also be used to select a higher LVDS output common-
mode voltage; see Section 16.2.1.11 LVDS Output Common-
mode Pin (VBG).
The output latency versus Demux/Non-Demux Mode is
shown in Table 23 and Table 24, respectively. For DES Mode,
note that the I- and Q-channel inputs are available in ECM,
but only the I-channel input is available in Non-ECM.
17.1.3 Out-Of-Range Indication
TABLE 23. Output Latency in Demux Mode
Differential input signals are digitized to 10 bits, based on the
full-scale range. Signal excursions beyond the full-scale
range, i.e. greater than +VIN_FSR/2 or less than -VIN_FSR/2, will
be clipped at the output. An input signal which is above the
FSR will result in all 1's at the output and an input signal which
is below the FSR will result in all 0's at the output. When the
conversion result is clipped for the I-channel input, the Out-
of-Range I-channel (ORI) output is activated such that ORI+
goes high and ORI- goes low while the signal is out of range.
This output is active as long as accurate data on either or both
of the buses would be outside the range of 000h to 3FFh. The
Q-channel has a separate ORQ which functions similarly.
DES Mode
Data Non-DES Mode
Q-input*
I-input
I-input sampled Q-input sampled I-input sampled
DI with rise of CLK, with rise of CLK, with rise of CLK,
34 cycles earlier 34 cycles earlier 34 cycles earlier
Q-input sampled I-input sampled
Q-input sampled
with fall of CLK, with fall of CLK,
DQ with rise of CLK,
34.5 cycles
earlier
34.5 cycles
earlier
34 cycles earlier
I-input sampled Q-input sampled I-input sampled
DId with rise of CLK, with rise of CLK, with rise of CLK,
35 cycles earlier 35 cycles earlier 35 cycles earlier
17.1.4 Maximum Input Range
The recommended operating and absolute maximum input
range may be found in Section 10.0 Operating Ratings and
Section 9.0 Absolute Maximum Ratings, respectively. Under
the stated allowed operating conditions, each Vin+ and Vin-
input pin may be operated in the range from 0V to 2.15V if the
input is a continuous 100% duty cycle signal and from 0V to
2.5V if the input is a 10% duty cycle signal. The absolute
maximum input range for Vin+ and Vin- is from -0.15V to 2.5V.
These limits apply only for AC input signals for which the input
common mode voltage is properly maintained.
Q-input sampled I-input sampled
Q-input sampled
with fall of CLK, with fall of CLK,
DQd with rise of CLK,
35.5 cycles
earlier
35.5 cycles
earlier
35 cycles earlier
TABLE 24. Output Latency in Non-Demux Mode
DES Mode
Data Non-DES Mode
Q-input*
I-input
I-input sampled Q-input sampled I-input sampled
DI with rise of CLK, with rise of CLK, with rise of CLK,
34 cycles earlier 34 cycles earlier 34 cycles earlier
17.1.5 AC-coupled Input Signals
The ADC10D1000/1500 analog inputs require a precise com-
mon-mode voltage. This voltage is generated on-chip when
AC-coupling Mode is selected. See Section 16.2.1.10 AC/
DC-Coupled Mode Pin (VCMO) for more information about how
to select AC-coupled Mode.
Q-input sampled I-input sampled
Q-input sampled
with rise of CLK, with rise of CLK,
DQ with rise of CLK,
34.5 cycles
earlier
34.5 cycles
earlier
34 cycles earlier
In AC-coupled Mode, the analog inputs must of course be AC-
coupled. For an ADC10D1000/1500 used in a typical appli-
cation, this may be accomplished by on-board capacitors, as
shown in Figure 15. For the ADC10D1000/1500RB, the SMA
inputs on the Reference Board are directly connected to the
analog inputs on the ADC10D1000/1500, so this may be ac-
complished by DC blocks (included with the hardware kit).
No output;
high impedance.
DId
No output;
high impedance.
DQd
*Available in ECM only.
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When the AC-coupled Mode is selected, an analog input
channel that is not used (e.g. in DES Mode) should be con-
52
nected to AC ground, e.g. through capacitors to ground . Do
not connect an unused analog input directly to ground.
100Ω differential input termination resistor. The range of this
termination resistor is specified as RIN in Table 8.
17.2 THE CLOCK INPUTS
The ADC10D1000/1500 has a differential clock input, CLK+
and CLK-, which must be driven with an AC-coupled, differ-
ential clock signal. This provides the level shifting to the clock
to be driven with LVDS, PECL, LVPECL, or CML levels. The
clock inputs are internally terminated to 100Ω differential and
self-biased. This section covers coupling, frequency range,
level, duty-cycle, jitter, and layout considerations.
17.2.1 CLK Coupling
The clock inputs of the ADC10D1000/1500 must be capaci-
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tively coupled to the clock pins as indicated in Figure 17.
FIGURE 15. AC-coupled Differential Input
The analog inputs for the ADC10D1000/1500 are internally
buffered, which simplifies the task of driving these inputs and
the RC pole which is generally used at sampling ADC inputs
is not required. If the user desires to place an amplifier circuit
before the ADC, care should be taken to choose an amplifier
with adequate noise and distortion performance, and ade-
quate gain at the frequencies used for the application.
17.1.6 DC-coupled Input Signals
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In DC-coupled Mode, the ADC10D1000/1500 differential in-
puts must have the correct common-mode voltage. This volt-
age is provided by the device itself at the VCMO output pin. It
is recommended to use this voltage because the VCMO output
potential will change with temperature and the common-mode
voltage of the driving device should track this change. Full-
scale distortion performance falls off as the input common
mode voltage deviates from VCMO. Therefore, it is recom-
mended to keep the input common-mode voltage within 100
mV of VCMO (typical), although this range may be extended to
±150 mV (maximum). See VCMI in Table 8 and ENOB vs.
VCMI in Section 15.0 Typical Performance Plots . Performance
in AC- and DC-coupled Mode are similar, provided that the
input common mode voltage at both analog inputs remains
FIGURE 17. Differential Input Clock Connection
The choice of capacitor value will depend on the clock fre-
quency, capacitor component characteristics and other sys-
tem
economic
factors.
For
example,
on
the
ADC10D1000/1500RB, the capacitors have the value Ccou-
= 4.7 nF which yields a highpass cutoff frequency, fc =
6pl7e 7.2 kHz.
17.2.2 CLK Frequency
Although the ADC10D1000/1500 is tested and its perfor-
mance is guaranteed with a differential 1.0/1.5 GHz sampling
clock, it will typically function well over the input clock fre-
quency range; see fCLK(min) and fCLK(max) in Table 13. Op-
eration up to fCLK(max) is possible if the maximum ambient
temperatures indicated are not exceeded. Operating at sam-
ple rates above fCLK(max) for the maximum ambient temper-
ature may result in reduced device reliability and product
lifetime. This is due to the fact that higher sample rates results
within 100 mV of VCMO
.
17.1.7 Single-Ended Input Signals
The analog inputs of the ADC10D1000/1500 are not designed
to accept single-ended signals. The best way to handle sin-
gle-ended signals is to first convert them to differential signals
before presenting them to the ADC. The easiest way to ac-
complish single-ended to differential signal conversion is with
an appropriate balun-transformer, as shown in Figure 16.
in higher power consumption and die temperatures. If fCLK
300 MHz, enable LFS in the Control Register (Addr: 0h, Bit
<
8).
17.2.3 CLK Level
The input clock amplitude is specified as VIN_CLK in Table
10. Input clock amplitudes above the max VIN_CLK may result
in increased input offset voltage. This would cause the con-
verter to produce an output code other than the expected
511/512 when both input pins are at the same potential. In-
sufficient input clock levels will result in poor dynamic perfor-
mance. Both of these results may be avoided by keeping the
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clock input amplitude within the specified limits of VIN_CLK
.
FIGURE 16. Single-Ended to Differential Conversion
Using a Balun
17.2.4 CLK Duty Cycle
The duty cycle of the input clock signal can affect the perfor-
mance of any A/D converter. The ADC10D1000/1500 fea-
tures a duty cycle clock correction circuit which can maintain
performance over the 20%-to-80% specified clock duty-cycle
range. This feature is enabled by default and provides im-
When selecting a balun, it is important to understand the input
architecture of the ADC. The impedance of the analog source
should be matched to the ADC10D1000/1500's on-chip
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proved ADC clocking, especially in the Dual-Edge Sampling
(DES) Mode.
possible to operate the device in 1:2 Demux Mode and cap-
ture data from just one 10-bit bus, e.g. just DI (or DId) although
both DI and DId are fully operational. This will decimate the
data by two and effectively halve the data rate.
17.2.5 CLK Jitter
High speed, high performance ADCs such as the AD-
C10D1000/1500 require a very stable input clock signal with
minimum phase noise or jitter. ADC jitter requirements are
defined by the ADC resolution (number of bits), maximum
ADC input frequency and the input signal amplitude relative
to the ADC input full scale range. The maximum jitter (the sum
of the jitter from all sources) allowed to prevent a jitter-induced
reduction in SNR is found to be
17.3.3 Terminating RSV Pins
The RSV pins are used for internal purposes. They may be
left unconnected and floating or connected as shown in Figure
18.
tJ(MAX) = ( VIN(P-P)/ VFSR) x (1/(2(N+1) x π x fIN))
where tJ(MAX) is the rms total of all jitter sources in seconds,
VIN(P-P) is the peak-to-peak analog input signal, VFSR is the
full-scale range of the ADC, "N" is the ADC resolution in bits
and fIN is the maximum input frequency, in Hertz, at the ADC
analog input.
tJ(MAX) is the square root of the sum of the squares (RSS) sum
of the jitter from all sources, including: the ADC input clock,
system, input signals and the ADC itself. Since the effective
jitter added by the ADC is beyond user control, it is recom-
mended to keep the sum of all other externally added jitter to
a minimum.
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17.2.6 CLK Layout
The ADC10D1000/1500 clock input is internally terminated
with a trimmed 100Ω resistor. The differential input clock line
pair should have a characteristic impedance of 100Ω and
(when using a balun), be terminated at the clock source in that
(100Ω) characteristic impedance.
It is good practice to keep the ADC input clock line as short
as possible, to keep it well away from any other signals and
to treat it as a transmission line. Otherwise, other signals can
introduce jitter into the input clock signal. Also, the clock signal
can introduce noise into the analog path if it is not properly
isolated.
FIGURE 18. RSV Pin Connection
This board configuration is recommended if the RSV pins are
connected to FPGA input pins and must be forced to a known
voltage. The value of the 100Ω resistor should not be
changed, but the 1kΩ resistors may be changed based upon
the requirements of the specific FPGA.
17.3.4 Terminating Unused LVDS Output Pins
If the ADC is used in Non-Demux Mode, then only the DI and
DQ data outputs will have valid data present on them. The
DId and DQd data outputs may be left not connected; if un-
used, they are internally tri-stated.
17.3 THE LVDS OUTPUTS
The Data, ORI, ORQ, DCLKI and DCLKQ outputs are LVDS.
The electrical specifications of the LVDS outputs are com-
patible with typical LVDS receivers available on ASIC and
FPGA chips; but they are not IEEE or ANSI communications
standards compliant due to the low +1.9V supply used on this
chip. These outputs should be terminated with a 100Ω differ-
ential resistor placed as closely to the receiver as possible.
This section covers common-mode and differential voltage,
and data rate.
Similarly, if the Q-channel is powered-down (i.e. PDQ is logic-
high), the DQ data output pins, DCLKQ and ORQ should be
left not connected.
17.4 SYNCHRONIZING MULTIPLE ADC10D1000/1500S IN
A SYSTEM
The ADC10D1000/1500 has two features to assist the user
with synchronizing multiple ADCs in a system; AutoSync and
DCLK Reset. The AutoSync feature is new and designates
one ADC10D1000/1500 as the Master ADC and other
ADC10D1000/1500s in the system as Slave ADCs. The
DCLK Reset feature performs the same function as the Au-
toSync feature, but is the first generation solution to synchro-
nizing multiple ADCs in a system; it is disabled by default. For
the application in which there are multiple Master and Slave
ADC10D1000/1500s in a system, AutoSync may be used to
synchronize the Slave ADC10D1000/1500(s) to each respec-
tive Master ADC10D1000/1500 and the DCLK Reset may be
used to synchronize the Master ADC10D1000/1500s to each
other.
17.3.1 Common-mode and Differential Voltage
The LVDS outputs have selectable common-mode and dif-
ferential voltage, VOS and VOD; see Table 11. See Sec-
tion 16.3.2 Output Control and Adjust for more information.
Selecting the higher VOS will also increase VOD slightly. The
differential voltage, VOD, may be selected for the higher or
lower value. For short LVDS lines and low noise systems,
satisfactory performance may be realized with the lower
VOD. This will also result in lower power consumption. If the
LVDS lines are long and/or the system in which the
ADC10D1000/1500 is used is noisy, it may be necessary to
If the AutoSync or DCLK Reset feature is not used, see Table
25 for recommendations about terminating unused pins.
select the higher VOD
.
17.3.2 Output Data Rate
The data is produced at the output at the same rate as it is
sampled at the input. The minimum recommended input clock
rate for this device is fCLK(MIN); see Table 13. However, it is
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54
TABLE 25. Unused AutoSync and DCLK Reset Pin
Recommendation
may be used to synchronize the DCLK and data outputs of
one or more Slave ADC10D1000/1500s to one Master AD-
C10D1000/1500. Several advantages of this feature include:
no special synchronization pulse required, any upset in syn-
chronization is recovered upon the next DCLK cycle, and the
Master/Slave ADC10D1000/1500s may be arranged as a bi-
nary tree so that any upset will quickly propagate out of the
system.
Pin(s)
Unused termination
Do not connect.
RCLK+/-
RCOUT1+/-
RCOUT2+/-
DCLK_RST+
DCLK_RST-
Do not connect.
Do not connect.
Connect to GND via 1kΩ resistor.
Connect to VA via 1kΩ resistor.
An example system is shown below in Figure 19 which con-
sists of one Master ADC and two Slave ADCs. For simplicity,
only one DCLK is shown; in reality, there is DCLKI and
DCLKQ, but they are always in phase with one another.
17.4.1 AutoSync Feature
AutoSync is a new feature which continuously synchronizes
the outputs of multiple ADC10D1000/1500s in a system. It
30066303
FIGURE 19. AutoSync Example
In order to synchronize the DCLK (and Data) outputs of mul-
tiple ADCs, the DCLKs must transition at the same time, as
well as be in phase with one another. The DCLK at each ADC
is generated from the CLK after some latency, plus tOD minus
tAD. Therefore, in order for the DCLKs to transition at the same
time, the CLK signal must reach each ADC at the same time.
To tune out any differences in the CLK path to each ADC, the
tAD adjust feature may be used. However, using the tAD adjust
feature will also affect when the DCLK is produced at the out-
put. If the device is in Demux Mode, then there are four
possible phases which each DCLK may be generated on be-
cause the typical CLK = 1GHz and DCLK = 250 MHz for this
case. The RCLK signal controls the phase of the DCLK, so
that each Slave DCLK is on the same phase as the Master
DCLK.
Non-Demux Mode, the DCLK continues to function normally.
Depending upon when the DCLK_RST signal is asserted,
there may be a narrow pulse on the DCLK line during this
reset event. When the DCLK_RST signal is de-asserted,
there are tSYNC_DLY CLK cycles of systematic delay and the
next CLK rising edge synchronizes the DCLK output with
those of other ADC10D1000/1500s in the system. For 90°
Mode (DDRPh = logic-high), the synchronizing edge occurs
on the rising edge of CLK, 4 cycles after the first rising edge
of CLK after DCLK_RST is released. For 0° Mode (DDRPh =
logic-low), this is 5 cycles instead. The DCLK output is en-
abled again after a constant delay of tOD
.
For both Demux and Non-Demux Modes, there is some un-
certainty about how DCLK comes out of the reset state for the
first DCLK_RST pulse. For the second (and subsequent)
DCLK_RST pulses, the DCLK will come out of the reset state
in a known way. Therefore, if using the DCLK Reset feature,
it is recommended to apply one "dummy" DCLK_RST pulse
before using the second DCLK_RST pulse to synchronize the
outputs. This recommendation applies each time the device
or channel is powered-on.
The AutoSync feature may only be used via the Control Reg-
isters.
17.4.2 DCLK Reset Feature
The DCLK reset feature is available via ECM, but it is disabled
by default. DCLKI and DCLKQ are always synchronized, by
design, and do not require a pulse from DCLK_RST to be-
come synchronized.
When using DCLK_RST to synchronize multiple
ADC10D1000/1500s, it is required that the Select Phase bits
in the Control Register (Addr: Eh, Bits 3,4) be the same for
each Master ADC10D1000/1500.
The DCLK_RST signal must observe certain timing require-
ments, which are shown in Figure 9 of the Timing Diagrams.
The DCLK_RST pulse must be of a minimum width and its
deassertion edge must observe setup and hold times with re-
spect to the CLK input rising edge. These timing specifica-
tions are listed as tPWR, tSR and tHR and may be found in Table
13.
17.5 SUPPLY/GROUNDING, LAYOUT AND THERMAL
RECOMMENDATIONS
17.5.1 Power Planes
All supply buses for the ADC should be sourced from a com-
mon linear voltage regulator. This ensures that all power
buses to the ADC are turned on and off simultaneously. This
The DCLK_RST signal can be asserted asynchronously to
the input clock. If DCLK_RST is asserted, the DCLK output is
held in a designated state (logic-high) in Demux Mode; in
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single source will be split into individual sections of the power
plane, with individual decoupling and connection to the dif-
ferent power supply buses of the ADC. Due to the low voltage
but relatively high supply current requirement, the optimal so-
lution may be to use a switching regulator to provide an
intermediate low voltage, which is then regulated down to the
final ADC supply voltage by a linear regulator. Please refer to
the documentation provided for the ADC10D1000/1500RB for
additional details on specific regulators that are recommend-
ed for this configuration.
17.5.2 Bypass Capacitors
The general recommendation is to have one 100nF capacitor
for each power/ground pin pair. The capacitors should be
surface mount multi-layer ceramic chip capacitors similar to
Panasonic part number ECJ-0EB1A104K.
17.5.3 Ground Planes
Grounding should be done using continuous full ground
planes to minimize the impedance for all ground return paths,
and provide the shortest possible image/return path for all
signal traces.
Power for the ADC should be provided through a broad plane
which is located on one layer adjacent to the ground plane(s).
Placing the power and ground planes on adjacent layers will
provide low impedance decoupling of the ADC supplies, es-
pecially at higher frequencies. The output of a linear regulator
should feed into the power plane through a low impedance
multi-via connection. The power plane should be split into in-
dividual power peninsulas near the ADC. Each peninsula
should feed a particular power bus on the ADC, with decou-
pling for that power bus connecting the peninsula to the
ground plane near each power/ground pin pair. Using this
technique can be difficult on many printed circuit CAD tools.
To work around this, zero ohm resistors can be used to con-
nect the power source net to the individual nets for the differ-
ent ADC power buses. As a final step, the zero ohm resistors
can be removed and the plane and peninsulas can be con-
nected manually after all other error checking is completed.
17.5.4 Power System Example
The ADC10D1000/1500RB uses continuous ground planes
(except where clear areas are needed to provide appropriate
impedance management for specific signals), see Figure 20.
Power is provided on one plane, with the 1.9V ADC supply
being split into multiple zones or peninsulas for the specific
power buses of the ADC. Decoupling capacitors are connect-
ed between these power bus peninsulas and the adjacent
power planes using vias. The capacitors are located as close
to the individual power/ground pin pairs of the ADC as possi-
ble. In most cases, this means the capacitors are located on
the opposite side of the PCB to the ADC.
30066302
FIGURE 20. Power and Grounding Example
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17.5.5 Thermal Management
attached to the substrate top with exposed metal in the center
top area of the package. This results in a 20% improvement
(typical) in thermal performance over the standard plastic
BGA package.
The Heat Slug Ball Grid Array (HSBGA) package is a modified
version of the industry standard plastic BGA (Ball Grid Array)
package. Inside the package, a copper heat spreader cap is
30066309
FIGURE 21. HSBGA Conceptual Drawing
The center balls are connected to the bottom of the die by vias
in the package substrate, Figure 21. This gives a low thermal
resistance between the die and these balls. Connecting these
balls to the PCB ground planes with a low thermal resistance
path is the best way dissipate the heat from the ADC. These
pins should also be connected to the ground plane via a low
impedance path for electrical purposes. The direct connection
to the ground planes is an easy method to spread heat away
from the ADC. Along with the ground plane, the parallel power
planes will provide additional thermal dissipation.
added. Representative heat sinks which might be used with
the ADC10D1000/1500 include the Cool Innovations p/n
3-1212XXG and similar products from other vendors. In many
applications, the printed circuit board will provide the primary
thermal path conducting heat away from the ADC package.
In those cases, θJC2 can be used in conjunction with printed
circuit board thermal modeling software to determine the al-
lowed operating conditions that will maintain the die temper-
ature below the maximum allowable limit. Additional dissipa-
tion can be achieved by coupling a heat sink to the copper
pour area on the bottom side of the printed circuit board.
The center ground balls should be soldered down to the rec-
ommended ball pads (See AN-1126). These balls will have
wide traces which in turn have vias which connect to the in-
ternal ground planes, and a bottom ground pad/pour if pos-
sible. This ensures a good ground is provided for these balls,
and that the optimal heat transfer will occur between these
balls and the PCB ground planes.
Typically, dissipation will occur through one predominant
thermal path. In these cases, the following calculations can
be used to determine the maximum safe ambient operating
temperature:
TJ = TA + PD × (θJC+θCA
)
138°C = TA + 3.98W × (θJC+θCA
)
In spite of these package enhancements, analysis using the
standard JEDEC JESD51-7 four-layer PCB thermal model
shows that ambient temperatures must be limited to a max of
70°C to ensure a safe operating junction temperature for the
ADC10D1500. However, most applications using the AD-
C10D1500 will have a printed circuit board which is more
complex than that used in JESD51-7. Typical circuit boards
will have more layers than the JESD51-7 (eight or more),
several of which will be used for ground and power planes. In
those applications, the thermal resistance parameters of the
ADC10D1500 and the circuit board can be used to determine
the actual safe ambient operating temperature up to a maxi-
mum of 85°C.
For θJC, the value for the primary thermal path in the given
application environment should be used (θJC1 or θJC2). θCA is
the thermal resistance from the case to ambient, which would
typically be that of the heat sink used. Using this relationship
and the desired ambient temperature, the required heat sink
thermal resistance can be found. Alternately, the heat sink
thermal resistance can be used to find the maximum ambient
temperature. For more complex systems, thermal modeling
software can be used to evaluate the printed circuit board
system and determine the expected junction temperature giv-
en the total system dissipation and ambient temperature.
17.6 SYSTEM POWER-ON CONSIDERATIONS
Three key parameters are provided to allow for modeling and
calculations. Because there are two main thermal paths be-
tween the ADC die and external environment, the thermal
resistance for each of these paths is provided. θJC1 represents
the thermal resistance between the die and the exposed met-
al area on the top of the HSBGA package. θJC2 represents the
thermal resistance between the die and the center group of
balls on the bottom of the HSBGA package. The final param-
eter is the allowed maximum junction temperature, which is
138°C.
There are a couple important topics to consider associated
with the system power-on event including configuration and
calibration, and the Data Clock.
17.6.1 Power-on, Configuration, and Calibration
Following the application of power to the ADC10D1000/1500,
several events must take place before the output from the
ADC10D1000/1500 is valid and at full performance; at least
one full calibration must be executed with the device config-
ured in the desired mode.
In other applications, a heat sink or other thermally conductive
path can be added to the top of the HSBGA package to re-
move heat. In those cases, θJC1 can be used along with the
thermal parameters for the heat sink or other thermal coupling
Following the application of power to the ADC10D1000/1500,
there is a delay of tCalDly and then the Power-on Calibration is
executed. This is why it is recommended to set the CalDly Pin
via an external pull-up or pull-down resistor. Then, the state
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of that input will be determined at the same time that power
is applied to the ADC and tCalDly will be a known quantity. For
the purpose of this section, it is assumed that CalDly is set as
recommended.
Another case is when the FPGA writes to the Control Pins
(Non-ECM) or to the SPI (ECM), see Figure 23. It is always
necessary to comply with the Operating Ratings and Absolute
Maximum ratings, i.e. the Control Pins may not be driven be-
low the ground or above the supply, regardless of what the
voltage currently applied to the supply is. Therefore, it is not
recommended to write to the Control Pins or SPI before power
is applied to the ADC10D1000/1500. As long as the FPGA
has completed writing to the Control Pins or SPI, the Power-
on Calibration will result in a valid output at full performance.
Once again, if it takes longer than tCalDly for the system to sta-
bilize at its operating temperature, it is recommended to ex-
ecute an on-command calibration at that time.
The Control Bits or Pins must be set or written to configure
the ADC10D1000/1500 in the desired mode. This must take
place via either Extended Control Mode or Non-ECM (Pin
Control Mode) before subsequent calibrations will yield an
output at full performance in that mode. Some examples of
modes include DES/Non-DES Mode, Demux/Non-demux
Mode, and Full-Scale Range.
The simplest case is when device is in Non-ECM and the
Control Pins are set by pull-up/down resistors, see Figure
22. For this case, the settings to the Control Pins ramp con-
currently to the ADC voltage. Following the delay of tCalDly and
the calibration execution time, tCAL, the output of the AD-
C10D1000/1500 is valid and at full performance. If it takes
longer than tCalDly for the system to stabilize at its operating
temperature, it is recommended to execute an on-command
calibration at that time.
Due to system requirements, it may not be possible for the
FPGA to write to the Control Pins or SPI before the Power-on
Calibration takes place, see Figure 24. It is not critical to con-
figure the device before the Power-on Calibration, but it is
critical to realize that the output for such a case is not at its
full performance. Following an On-command Calibration, the
device will be at its full performance.
30066364
FIGURE 22. Power-on with Control Pins set by Pull-up/down Resistors
30066365
FIGURE 23. Power-on with Control Pins set by FPGA pre Power-on Cal
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30066366
FIGURE 24. Power-on with Control Pins set by FPGA post Power-on Cal
17.6.2 Power-on and Data Clock (DCLK)
17.7.1 Temperature Sensor
Many applications use the DCLK output for a system clock.
For the ADC10D1000/1500, each I- and Q-channel has its
own DCLKI and DCLKQ, respectively. The DCLK output is
always active, unless that channel is powered-down or the
DCLK Reset feature is used while the device is in Demux
Mode. As the supply to the ADC10D1000/1500 ramps, the
DCLK also comes up, see this example from the
ADC10D1000/1500RB: Figure 25. While the supply is too
low, there is no output at DCLK. As the supply continues to
ramp, DCLK functions intermittently with irregular frequency,
but the amplitude continues to track with the supply. Much
below the low end of operating supply range of the AD-
C10D1000/1500, the DCLK is already fully operational.
The ADC10D1000/1500 has an on-die temperature diode
connected to pins Tdiode+/- which may be used to monitor
the die temperature. National also provides a family of tem-
perature sensors for this application which monitor different
numbers of external devices, see Table 26.
TABLE 26. Temperature Sensor Recommendation
Number of External Recommended Temperature
Devices Monitored
Sensor
LM95235
LM95213
LM95214
1
2
4
The temperature sensor (LM95235/13/14) is an 11-bit digital
temperature sensor with a 2-wire System Management Bus
(SMBus) interface that can monitor the temperature of one,
two, or four remote diodes as well as its own temperature. It
can be used to accurately monitor the temperature of up to
one, two, or four external devices such as the AD-
C10D1000/1500, a FPGA, other system components, and the
ambient temperature.
The temperature sensor reports temperature in two different
formats for +127.875°C/-128°C range and 0°/255°C range. It
has a Sigma-Delta ADC core which provides the first level of
noise immunity. For improved performance in a noise envi-
ronment, the temperature sensor includes programmable dig-
ital filters for Remote Diode temperature readings. When the
digital filters are invoked, the resolution for the Remote Diode
readings increases to 0.03125°C. For maximum flexibility and
best accuracy, the temperature sensor includes offset regis-
ters that allow calibration of other diode types.
Diode fault detection circuitry in the temperature sensor can
detect the absence or fault state of a remote diode: whether
D+ is shorted to the power supply, D- or ground, or floating.
30066390
In the following of a typical application, the LM95213 is used
to monitor the temperature of an ADC10D1000/1500 as well
as a FPGA, see Figure 26.
FIGURE 25. Supply and DCLK Ramping
17.7 RECOMMENDED SYSTEM CHIPS
National recommends these other chips including tempera-
ture sensors, clocking devices, and amplifiers in order to
support the ADC10D1000/1500 in a system design.
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30066397
FIGURE 26. Typical Temperature Sensor Application
17.7.2 Clocking Device
neither of which can be provided with a transformer coupled
input circuit:
The clock source can be a PLL/VCO device such as the
LMX2531LQxxxx family of products. The specific device
should be selected according to the desired ADC sampling
clock frequency. The ADC10D1000/1500RB uses the
LMX2531LQ1510E, with the ADC clock source provided by
the Aux PLL output. Other devices which may be considered
based on clock source, jitter cleaning, and distribution pur-
poses are the LMK01XXX, LMK02XXX, LMK03XXX and
LMK04XXX product families.
TABLE 27. Amplifier Recommendation
Amplifier
LMH6552
LMH6553
Bandwidth Brief features
1.5 GHz
900 MHz
Configurable gain
Output clamp and
configurable gain
LMH6554
LMH6555
2.5 GHz
1.2 GHz
Configurable gain
Fixed gain
17.7.3 Amplifier
The following amplifiers can be used for ADC10D1000/1500
applications which require DC coupled input or signal gain,
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18.0 Register Definitions
Ten read/write registers provide several control and configuration options in the Extended Control Mode. These registers have no
effect when the device is in the Non-extended Control Mode. Each register description below also shows the Power-On Reset
(POR) state of each control bit. See Table 28 for a summary.
TABLE 28. Register Addresses
A3
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
A2
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
A1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
A0
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
Hex
0h
1h
2h
3h
4h
5h
6h
7h
8h
9h
Ah
Bh
Ch
Dh
Eh
Fh
Register Addressed
Configuration Register 1
VCMO Adjust
I-channel Offset
I-channel FSR
Calibration Adjust
Reserved
Reserved
Reserved
Reserved
Reserved
Q-channel Offset
Q-channel FSR
Aperture Delay Coarse Adjust
Aperture Delay Fine Adjust and LC Filter Adjust
AutoSync
Reserved
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Configuration Register 1
Addr: 0h (0000b)
POR state: 2000h
Bit
15
14
13
12
11
10
9
8
7
6
5
4
3
0
2
1
0
Name CAL DPS OVS TPM PDI PDQ Res LFS DES DEQ DIQ 2SC
Res
POR
0
0
1
0
0
0
0
0
0
0
0
0
0
0
0
Bit 15
CAL: Calibration Enable. When this bit is set to 1b, an on-command calibration is initiated. This bit is not reset
automatically upon completion of the calibration. Therefore, the user must reset this bit to 0b and then set it to
1b again to execute another calibration. This bit is logically OR'd with the CAL Pin; both bit and pin must be set
to 0b before either is used to execute a calibration.
Bit 14
Bit 13
Bit 12
DPS: DDR Phase Select. Set this bit to 0b to select the 0° Mode DDR Data-to-DCLK phase relationship and to
1b to select the 90° Mode. This bit has no effect when the device is in Non-Demux Mode.
OVS: Output Voltage Select. This bit sets the differential voltage level for the LVDS outputs including Data, OR,
and DCLK. 0b selects the lower level and 1b selects the higher level. See VOD in Table 11for details.
TPM: Test Pattern Mode. When this bit is set to 1b, the device will continually output a fixed digital pattern at the
digital Data and OR outputs. When set to 0b, the device will continually output the converted signal, which was
present at the analog inputs. See Section 16.3.2.6 Test Pattern Mode for details about the TPM pattern.
PDI: Power-down I-channel. When this bit is set to 0b, the I-channel is fully operational, but when it is set to
1b, the I-channel is powered-down. The I-channel may be powered-down via this bit or the PDI Pin, which is
active, even in ECM.
Bit 11
Bit 10
PDQ: Power-down Q-channel. When this bit is set to 0b, the Q-channel is fully operational, but when it is set to
1b, the Q-channel is powered-down. The Q-channel may be powered-down via this bit or the PDQ Pin, which is
active, even in ECM.
Bit 9
Bit 8
Bit 7
Reserved. Must be set to 0b.
LFS: Low-Frequency Select. If the sampling clock (CLK) is at or below 300 MHz, set this bit to 1b.
DES: Dual-Edge Sampling Mode select. When this bit is set to 0b, the device will operate in the Non-DES Mode;
when it is set to 1b, the device will operate in the DES Mode. See Section 16.3.1.4 DES/Non-DES Mode for more
information.
Bit 6
Bit 5
DEQ: DES Q-input select. When the device is in DES Mode, this bit can select the input that the device will
operate on. The default setting of 0b selects the I-input and 1b selects the Q-input.
DIQ: DES I- and Q-input. When in DES Mode, setting this bit to 1b shorts the I- and Q-inputs. If the bit is left at
its default 0b, the I- and Q-inputs remain electrically separate. For this bit to function correctly, DEQ (Bit 6) must
also be set to 0b.
Bit 4
2SC: Two's Complement output. For the default setting of 0b, the data is output in Offset Binary format; when
set to 1b, the data is output in Two's Complement format.
Bits 3:0
Reserved. Must be set to 0b.
VCMO Adjust
Addr: 1h (0001b)
POR state: 2A00h
Bit
15
14
13
1
12
0
11
1
10
0
9
1
8
0
7
0
6
VCA(2:0)
0
5
0
4
0
3
0
2
Res
0
1
0
Name
POR
Res
0
0
0
0
Bits 15:8 Reserved. Must be set as shown.
Bits 7:5
VCA(2:0): VCMO Adjust. Adjusting from the default VCA(2:0) = 0d to VCA(2:0) = 7d decreases VCMO from it's
typical value (see VCMO in Table 8) to 1.05V by increments of ~28.6 mV.
Code
VCMO
000 (default)
VCMO
100
VCMO- 114 mV
VCMO- 200 mV
111
Bits 4:0
Reserved. Must be set as shown.
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I-channel Offset Adjust
Addr: 2h (0010b)
POR state: 0000h
Bit
15
14
Res
0
13
0
12
OS
0
11
0
10
0
9
0
8
0
7
0
6
5
4
0
3
0
2
1
0
Name
POR
OM(11:0)
0
0
0
0
0
0
Bits 15:13 Reserved. Must be set to 0b.
Bit 12
OS: Offset Sign. The default setting of 0b incurs a positive offset of a magnitude set by Bits 11:0 to the ADC
output. Setting this bet to 1b incurs a negative offset of the set magnitude.
Bits 11:0 OM(11:0): Offset Magnitude. These bits determine the magnitude of the offset set at the ADC output (straight
binary coding). The range is from 0 mV for OM(11:0) = 0d to 45 mV for OM(11:0) = 4095d in steps of ~11 µV.
Monotonicity is guaranteed by design only for the 9 MSBs.
Code
Offset [mV]
0000 0000 0000 (default)
1000 0000 0000
1111 1111 1111
0
22.5
45
I-channel Full Scale Range Adjust
Addr: 3h (0011b)
POR state: 4000h
Bit
15
14
13
0
12
0
11
0
10
0
9
0
8
0
7
FM(14:0)
0
6
0
5
0
4
0
3
0
2
1
0
Name Res
POR
0
1
0
0
0
Bit 15
Reserved. Must be set to 0b.
Bits 14:0 FM(14:0): FSR Magnitude. These bits increase the ADC full-scale range magnitude (straight binary coding.) The
range is from 600 mV (0d) to 980 mV (32767d) with the default setting at 790 mV (16384d). Monotonicity is
guaranteed by design only for the 9 MSBs. The mid-range (low) setting in ECM corresponds to the nominal (low)
setting in Non-ECM. A greater range of FSR values is available in ECM, i.e. FSR values above 790 mV. See
VIN_FSR in Table 8 for characterization details.
Code
FSR [mV]
600
000 0000 0000 0000
100 0000 0000 0000 (default)
111 1111 1111 1111
790
980
Calibration Adjust
Addr: 4h (0100b)
Bit 15 14
Name Res CSS
POR
POR state: DA7Fh
13
0
12
1
11
1
10
0
9
8
7
SSC
0
6
1
5
1
4
1
3
Res
1
2
1
0
Res
CMS(1:0)
1
1
1
0
1
1
1
63
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Bit 15
Bit 14
Reserved. Must be set as shown.
CSS: Calibration Sequence Select. The default 1b selects the following calibration sequence: reset all previously
calibrated elements to nominal values, do RIN Calibration, do internal linearity Calibration. Setting CSS = 0b
selects the following calibration sequence: do not reset RIN to its nominal value, skip RIN calibration, do internal
linearity Calibration. The calibration must be completed at least one time with CSS = 1b to calibrate RIN.
Subsequent calibrations may be run with CSS = 0b (skip RIN calibration) or 1b (full RIN and internal linearity
Calibration).
Bits 13:10 Reserved. Must be set as shown.
Bits 9:8
CMS(1:0): Calibration Mode Select. These bits affect the length of time taken to calibrate the internal linearity.
See tCAL in Table 13.
Bit 7
SSC: SPI Scan Control. Setting this control bit to 1b allows the calibration values, stored in Addr: 5h, to be read/
written. When not reading/writing the calibration values, this control bit should left at its default 0b setting.
Reserved. Must be set as shown.
Bits 6:0
Calibration Values
Addr: 5h (0101b)
POR state: XXXXh
Bit
15
14
13
X
12
X
11
X
10
X
9
8
7
6
5
4
3
2
1
0
Name
POR
SS(15:0)
X
X
X
X
X
X
X
X
X
X
X
X
Bits 15:0 SS(15:0): SPI Scan. When the ADC performs a self-calibration, the values for the calibration are stored in this
register and may be read from/ written to it. Set SSC (Addr: 4h, Bit 7) to read/write.
Reserved
Addr: 6h (0110b)
POR state: 1C70h
Bit
15
14
13
0
12
1
11
1
10
1
9
0
8
0
7
0
6
1
5
1
4
1
3
0
2
1
0
Name
POR
Res
Res
Res
0
0
0
0
0
Bits 15:0 Reserved. Must be set as shown.
Reserved
Addr: 7h (0111b)
POR state: 0000h
Bit
15
14
13
0
12
0
11
0
10
0
9
0
8
0
7
0
6
0
5
0
4
0
3
0
2
1
0
Name
POR
0
0
0
0
0
Bits 15:0 Reserved. Must be set as shown.
Reserved
Addr: 8h (1000b)
POR state: 0000h
Bit
15
14
13
0
12
0
11
0
10
0
9
0
8
0
7
0
6
0
5
0
4
0
3
0
2
1
0
Name
POR
0
0
0
0
0
Bits 15:0 Reserved. Must be set as shown.
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64
Reserved
Addr: 9h (1001b)
POR state: 0000h
Bit
15
14
13
0
12
0
11
0
10
0
9
0
8
0
7
0
6
0
5
0
4
0
3
0
2
1
0
Name
POR
Res
0
0
0
0
0
Bits 15:0 Reserved. Must be set as shown.
65
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Q-channel Offset Adjust
Addr: Ah (1010b)
POR state: 0000h
Bit
15
14
Res
0
13
0
12
OS
0
11
0
10
0
9
0
8
0
7
0
6
5
4
0
3
0
2
1
0
Name
POR
OM(11:0)
0
0
0
0
0
0
Bits 15:13 Reserved. Must be set to 0b.
Bit 12
OS: Offset Sign. The default setting of 0b incurs a positive offset of a magnitude set by Bits 11:0 to the ADC
output. Setting this bet to 1b incurs a negative offset of the set magnitude.
Bits 11:0 OM(11:0): Offset Magnitude. These bits determine the magnitude of the offset set at the ADC output (straight
binary coding). The range is from 0 mV for OM(11:0) = 0d to 45 mV for OM(11:0) = 4095d in steps of ~11 µV.
Monotonicity is guaranteed by design only for the 9 MSBs.
Code
Offset [mV]
0000 0000 0000 (default)
1000 0000 0000
1111 1111 1111
0
22.5
45
Q-channel Full-Scale Range Adjust
Addr: Bh (1011b)
POR state: 4000h
Bit
15
14
13
0
12
0
11
0
10
0
9
0
8
0
7
FM(14:0)
0
6
0
5
0
4
0
3
0
2
1
0
Name Res
POR
0
1
0
0
0
Bit 15
Reserved. Must be set to 0b.
Bits 14:0 FM(14:0): FSR Magnitude. These bits increase the ADC full-scale range magnitude (straight binary coding.) The
range is from 600 mV (0d) to 980 mV (32767d) with the default setting at 790 mV (16384d). Monotonicity is
guaranteed by design only for the 9 MSBs. The mid-range (low) setting in ECM corresponds to the nominal (low)
setting in Non-ECM. A greater range of FSR values is available in ECM, i.e. FSR values above 790 mV. See
VIN_FSR in Table 8 for characterization details.
Code
FSR [mV]
600
000 0000 0000 0000
100 0000 0000 0000 (default)
111 1111 1111 1111
790
980
Aperture Delay Coarse Adjust
Addr: Ch (1100b)
POR state: 0004h
Bit
15
14
13
0
12
0
11
0
10
9
8
0
7
0
6
0
5
0
4
0
3
2
1
0
Name
POR
CAM(11:0)
STA DCC
Res
0
0
0
0
0
1
0
0
Bits 15:4 CAM(11:0): Coarse Adjust Magnitude. This 12-bit value determines the amount of delay that will be applied to
the input CLK signal. The range is 0 ps delay for CAM(11:0) = 0d to a maximum delay of 825 ps for
CAM(11:0) = 2431d (±95 ps due to PVT variation) in steps of ~340 fs. For code CAM(11:0) = 2432d and above,
the delay saturates and the maximum delay applies. Additional, finer delay steps are available in register Dh.
Either STA (Bit 3) or SA (Addr: Dh, Bit 8) must be selected to enable this function.
Bit 3
STA: Select tAD Adjust. Set this bit to 1b to enable the tAD adjust feature, which will make both coarse and fine
adjustment settings, i.e. CAM(11:0) and FAM(5:0), available.
Bit 2
DCC: Duty Cycle Correct. This bit can be set to 0b to disable the automatic duty-cycle stabilizer feature of the
chip. This feature is enabled by default.
Bits 1:0
Reserved. Must be set to 0b.
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66
Aperture Delay Fine Adjust and LC Filter Adjust
Addr: Dh (1101b)
POR state: 0000h
Bit
15
14
13
12
11
0
10
0
9
Res
0
8
SA
0
7
0
6
0
5
0
4
3
2
1
0
Name
POR
FAM(5:0)
LCF(7:0)
0
0
0
0
0
0
0
0
0
Bits 15:10 FAM(5:0): Fine Aperture Adjust Magnitude. This 6-bit value determines the amount of additional delay that will
be applied to the input CLK when the Clock Phase Adjust feature is enabled via STA (Addr: Ch, Bit 3) or SA
(Addr: Dh, Bit 8). The range is straight binary from 0 ps delay for FAM(5:0) = 0d to 2.3 ps delay for
FAM(5:0) = 63d (±300 fs due to PVT variation) in steps of ~36 fs.
Bit 9
Bit 8
Reserved. Must be set to 0b.
SA: Select tAD and LC filter Adjust. Set this bit to 1b to enable the tAD and LC filter adjust features. Using this bit
is the same as enabling STA (Addr: Ch, Bit 3), but also enables the LC filter to clean the clock jitter. If SA is
enabled, then the value of the STA bit is ignored.
Bits 7:0
LCF(7:0): LC tank select Frequency. Use these bits to select the center frequency of the LC filter on the clock
input. The range is from 0.8 GHz (255d) to 1.5 GHz (0d). Note that the tuning range is not binary encoded, and
the eight bits are thermometer encoded, i.e. the mid value of 1.1 GHz tuning is achieved with
LCF(7:0) = 0000 1111b.
AutoSync
Addr: Eh (1110b)
POR state: 0003h
Bit
15
14
13
0
12
0
11
10
9
0
8
0
7
0
6
0
5
Res
0
4
3
0
2
1
0
Name
POR
DRC(9:0)
SP(1:0)
ES DOC DR
0
0
0
0
0
0
1
1
Bits 15:6 DRC(9:0): Delay Reference Clock (9:0). These bits may be used to increase the delay on the input reference
clock when synchronizing multiple ADCs. The minimum delay is 0s (0d) to 1000 ps (639d). The delay remains
the maximum of 1000 ps for any codes above or equal to 639d.
Bit 5
Reserved. Must be set to 0b.
Bits 4:3
SP(1:0): Select Phase. These bits select the phase of the reference clock which is latched. The codes correspond
to the following phase shift:
00 = 0°
01 = 90°
10 = 180°
11 = 270°
Bit 2
Bit 1
Bit 0
ES: Enable Slave. Set this bit to 1b to enable the Slave Mode of operation. In this mode, the internal divided
clocks are synchronized with the reference clock coming from the master ADC. The master clock is applied on
the input pins RCLK. If this bit is set to 0b, then the device is in Master Mode.
DOC: Disable Output reference Clocks. Setting this bit to 0b sends a CLK/4 signal on RCOut1 and RCOut2. The
default setting of 1b disables these output drivers. This bit functions as described, regardless of whether the
device is operating in Master or Slave Mode, as determined by ES (Bit 2).
DR: Disable Reset. The default setting of 1b leaves the DCLK_RST functionality disabled. Set this bit to 0b to
enable DCLK_RST functionality.
Reserved
Addr: Fh (1111b)
POR state: 000Ch
Bit
15
14
13
0
12
0
11
0
10
0
9
0
8
0
7
0
6
0
5
0
4
0
3
1
2
1
0
Name
POR
Res
0
0
1
0
0
Bits 15:0 Reserved. This address is read only.
67
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19.0 Physical Dimensions inches (millimeters) unless otherwise noted
NOTES: UNLESS OTHERWISE SPECIFIED
REFERENCE JEDEC REGISTRATION MS-034, VARIATION BAL-2.
292-Ball BGA Thermally Enhanced Package
Order Number ADC10D1000/1500CUIT
NS Package Number UFH292A
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68
Notes
69
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Notes
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