74ABT373CLCX [NSC]

Octal Transparent Latch with TRI-STATE Outputs; 八路透明锁存器具有三态输出
74ABT373CLCX
型号: 74ABT373CLCX
厂家: National Semiconductor    National Semiconductor
描述:

Octal Transparent Latch with TRI-STATE Outputs
八路透明锁存器具有三态输出

锁存器
文件: 总16页 (文件大小:331K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
September 1995  
54ABT/74ABT373  
Octal Transparent Latch with TRI-STATE Outputs  
É
Guaranteed output skew  
Y
General Description  
The ’ABT373 consists of eight latches with TRI-STATE out-  
Y
Guaranteed multiple output switching specifications  
Y
Output switching specified for both 50 pF and 250 pF  
puts for bus organized system applications. The flip-flops  
loads  
appear transparent to the data when Latch Enable (LE) is  
HIGH. When LE is LOW, the data that meets the setup  
times is latched. Data appears on the bus when the Output  
Enable (OE) is LOW. When OE is HIGH the bus output is in  
the high impedance state.  
Y
Guaranteed simultaneous switching, noise level and  
dynamic threshold performance  
Y
Guaranteed latchup protection  
Y
High impedance glitch free bus loading during entire  
power up and power down  
Y
Y
Nondestructive hot insertion capability  
Features  
Y
Standard Military Drawing (SMD) 5962-9321801  
TRI-STATE outputs for bus interfacing  
Y
Output sink capability of 64 mA, source capability of  
32 mA  
Package  
Commercial  
Military  
Package Description  
Number  
M20B  
M20D  
N20B  
74ABT373CSC (Note 1)  
74ABT373CSJ (Note 1)  
74ABT373CPC  
20-Lead (0.300 Wide) Molded Small Outline, JEDEC  
×
20-Lead (0.300 Wide) Molded Small Outline, EIAJ  
×
20-Lead (0.300 Wide) Molded Dual-In-Line  
×
54ABT373J/883  
J20A  
20-Lead Ceramic Dual-In-Line  
74ABT373CMSA (Note 1)  
MSA20 20-Lead Molded Shrink Small Outline, EIAJ Type II  
54ABT373W/883 W20A  
54ABT373E/883 E20A  
20-Lead Cerpack  
20-Lead Ceramic Leadless Chip Carrier, Type C  
74ABT373CMTC (Notes 1, 2)  
MTC20 20-Lead Molded Thin Shrink Small Outline, JEDEC  
e
Note 1: Devices also available in 13 reel. Use suffix  
×
Note 2: Contact factory for package availability.  
SCX, SJX, MSAX, and MTCX.  
Connection Diagrams  
Pin Assignment  
for DIP, SOIC, SSOP and Flatpak  
Pin Assignment  
for LCC  
Pin Names  
Description  
Data Inputs  
D D  
0
7
LE  
Latch Enable Input  
(Active HIGH)  
OE  
Output Enable Input  
(Active LOW)  
O O  
0
TRI-STATE Latch  
Outputs  
7
TL/F/11547–2  
TL/F/11547–1  
TRI-STATEÉ is a registered trademark of National Semiconductor Corporation.  
C
1995 National Semiconductor Corporation  
TL/F/11547  
RRD-B30M115/Printed in U. S. A.  
Functional Description  
The ’ABT373 contains eight D-type latches with  
Truth Table  
Inputs  
Output  
TRI-STATE output buffers. When the Latch Enable (LE) in-  
put is HIGH, data on the D inputs enters the latches. In this  
n
LE  
OE  
D
n
O
n
condition the latches are transparent, i.e., a latch output will  
change state each time its D input changes. When LE is  
LOW, the latches store the information that was present on  
the D inputs a setup time preceding the HIGH-to-LOW tran-  
sition of LE. The TRI-STATE buffers are controlled by the  
Output Enable (OE) input. When OE is LOW, the buffers are  
in the bi-state mode. When OE is HIGH the buffers are in  
the high impedance mode but this does not interfere with  
entering new data into the latches.  
H
H
L
L
L
H
H
L
X
X
L
L
O
(no change)  
Z
n
X
H
e
e
e
e
H
L
HIGH Voltage Level  
LOW Voltage Level  
Immaterial  
X
Z
High Impedance State  
Logic Diagram  
TL/F/11547–3  
Please note that this diagram is provided only for the understanding of logic operations and should not be used to estimate propagation delays.  
2
Absolute Maximum Ratings (Note 1)  
If Military/Aerospace specified devices are required,  
please contact the National Semiconductor Sales  
Office/Distributors for availability and specifications.  
b
b
DC Latchup Source Current: OE Pin  
(Across Comm Operating Range) Other Pins  
150 mA  
500 mA  
Over Voltage Latchup (I/O)  
10V  
b
b
a
65 C to 150 C  
Storage Temperature  
Note 1: Absolute maximum ratings are values beyond which the device may  
be damaged or have its useful life impaired. Functional operation under  
these conditions is not implied.  
§
§
a
55 C to 125 C  
Ambient Temperature under Bias  
§
§
Junction Temperature under Bias  
Ceramic  
Plastic  
Note 2: Either voltage limit or current limit is sufficient to protect inputs.  
b
b
a
55 C to 175 C  
§
§
a
55 C to 150 C  
§
§
Recommended Operating  
Conditions  
V
Pin Potential to  
CC  
Ground Pin  
b
a
0.5V to 7.0V  
Free Air Ambient Temperature  
Military  
Commercial  
Supply Voltage  
Military  
Commercial  
Minimum Input Edge Rate  
Data Input  
b
a
0.5V to 7.0V  
Input Voltage (Note 2)  
Input Current (Note 2)  
b
a
55 C to 125 C  
§
40 C to 85 C  
§
§
b
a
30 mA to 5.0 mA  
b a  
§
Voltage Applied to Any Output  
in the Disabled or  
Power-Off State  
a
a
a
4.5V to 5.5V  
a
b
a
0.5V to 5.5V  
4.5V to 5.5V  
b
in the HIGH State  
0.5V to V  
CC  
(DV/Dt)  
50 mV/ns  
20 mV/ns  
Current Applied to Output  
in LOW State (Max)  
Enable Input  
twice the rated I (mA)  
OL  
DC Electrical Characteristics  
ABT373  
Typ  
Symbol  
Parameter  
Units  
V
CC  
Conditions  
Min  
Max  
V
V
V
V
Input HIGH Voltage  
2.0  
V
V
V
Recognized HIGH Signal  
Recognized LOW Signal  
IH  
Input LOW Voltage  
0.8  
IL  
b
e b  
18 mA  
Input Clamp Diode Voltage  
Output HIGH Voltage  
1.2  
Min  
Min  
I
CD  
OH  
IN  
e b  
e b  
e b  
54ABT/74ABT  
54ABT  
74ABT  
2.5  
2.0  
2.0  
I
I
I
3 mA  
24 mA  
32 mA  
OH  
OH  
OH  
V
V
e
e
V
OL  
Output LOW Voltage  
Input HIGH Current  
54ABT  
74ABT  
0.55  
0.55  
I
I
48 mA  
64 mA  
OL  
OL  
Min  
e
e
I
5
5
V
IN  
V
IN  
2.7V (Note 2)  
V
IH  
mA  
mA  
mA  
Max  
Max  
Max  
CC  
e
I
I
Input HIGH Current Breakdown Test  
Input LOW Current  
7
V
IN  
7.0V  
BVI  
IL  
b
b
e
e
5
5
V
IN  
V
IN  
0.5V (Note 2)  
0.0V  
e
ID  
V
ID  
Input Leakage Test  
I
All Other Pins Grounded  
1.9 mA  
4.75  
V
0.0  
b
e
e
e
e
e
e
e
I
I
I
I
I
I
I
I
Output Leakage Current  
Output Leakage Current  
Output Short-Circuit Current  
Output High Leakage Current  
Bus Drainage Test  
50  
mA  
mA  
0
0
5.5V  
5.5V  
V
V
V
V
V
2.7V; OE  
0.5V; OE  
0.0V  
2.0V  
2.0V  
OZH  
OZL  
OS  
OUT  
OUT  
OUT  
OUT  
OUT  
b
b
50  
b
b
275 mA  
100  
Max  
50  
mA  
mA  
mA  
mA  
Max  
0.0  
V
CC  
CEX  
ZZ  
100  
50  
5.5V; All Others GND  
Power Supply Current  
Power Supply Current  
Power Supply Current  
Max  
Max  
All Outputs HIGH  
All Outputs LOW  
CCH  
CCL  
CCZ  
30  
e
OE  
V
CC  
50  
mA  
Max  
All Others at V or GND  
CC  
2.1V  
e
V
b
I
Additional I /Input  
CC  
Outputs Enabled  
Outputs TRI-STATE  
Outputs TRI-STATE  
2.5  
2.5  
2.5  
mA  
mA  
mA  
V
I
CCT  
CC  
e
b
2.1V  
2.1V  
Enable Input V  
Data Input V  
V
I
CC  
b
Max  
e
V
I
CC  
All Others at V or GND  
CC  
e
Outputs Open, LE  
GND, (Note 1)  
I
Dynamic I  
(Note 2)  
No Load  
V
CC  
CCD  
CC  
mA/  
MHz  
e
One Bit Toggling, 50% Duty Cycle  
0.12  
OE  
Max  
k
Note 1: For 8 bits toggling, I  
0.8 mA/MHz.  
CCD  
Note 2: Guaranteed, but not tested.  
3
DC Electrical Characteristics (SOIC Package) (Continued)  
Conditions  
Symbol  
Parameter  
Min  
Typ  
Max  
Units  
V
CC  
e
e
500X  
C
L
50 pF, R  
L
e
e
e
e
e
V
Quiet Output Maximum Dynamic V  
Quiet Output Minimum Dynamic V  
0.4  
0.8  
V
V
V
V
V
5.0  
5.0  
5.0  
5.0  
5.0  
T
25 C (Note 1)  
§
25 C (Note 1)  
OLP  
OL  
A
A
A
A
A
b
b
0.8  
3.0  
V
1.2  
2.5  
2.0  
T
§
25 C (Note 3)  
OLV  
OL  
V
Minimum High Level Dynamic Output Voltage  
T
T
T
§
25 C (Note 2)  
OHV  
V
Minimum High Level Dynamic Input Voltage  
Maximum Low Level Dynamic Input Voltage  
1.7  
0.9  
§
25 C (Note 2)  
IHD  
V
0.6  
§
ILD  
b
Note 1: Max number of outputs defined as (n). n  
1 data inputs are driven 0V to 3V. One output at Low. Guaranteed, but not tested.  
b
Note 2: Max number of data inputs (n) switching. n  
1 inputs switching 0V to 3V. Input-under-test switching: 3V to theshold (V ), 0V to threshold (V ).  
ILD IHD  
Guaranteed, but not tested.  
b
Note 3: Max number of outputs defined as (n). n  
1 data inputs are driven 0V to 3V. One output HIGH. Guaranteed, but not tested.  
AC Electrical Characteristics  
74ABT  
54ABT  
74ABT  
e a  
e b  
a
55 C to 125 C  
4.5V to 5.5V  
e b a  
40 C to 85 C  
T
25 C  
§
T
T
A
§
§
§
4.5V to 5.5V  
§
A
A
e a  
5.0V  
50 pF  
e
e
Symbol  
Parameter  
Units  
V
V
V
CC  
CC  
CC  
e
e
e
C 50 pF  
L
C
C
L
50 pF  
L
Min  
Typ  
Max  
Min  
Max  
Min  
Max  
t
t
Propagation Delay  
1.9  
1.9  
2.7  
2.8  
4.5  
4.5  
1.0  
1.0  
6.8  
7.0  
1.9  
1.9  
4.5  
4.5  
PLH  
PHL  
ns  
ns  
ns  
ns  
D
n
to O  
n
t
t
Propagation Delay  
LE to O  
2.0  
2.0  
3.1  
3.0  
5.0  
5.0  
1.0  
1.5  
7.7  
7.7  
2.0  
2.0  
5.0  
5.0  
PLH  
PHL  
n
t
t
Output Enable Time  
1.5  
1.5  
3.1  
3.1  
5.3  
5.3  
1.0  
1.5  
6.7  
7.2  
1.5  
1.5  
5.3  
5.3  
PZH  
PZL  
t
t
Output Disable Time  
2.0  
2.0  
3.6  
3.4  
5.4  
5.4  
1.7  
1.0  
8.0  
7.0  
2.0  
2.0  
5.4  
5.4  
PHZ  
PLZ  
AC Operating Requirements  
74ABT  
54ABT  
74ABT  
e a  
e b  
a
55 C to 125 C  
4.5V to 5.5V  
e b a  
40 C to 85 C  
T
25 C  
T
T
A
§
5.0V  
§
§
§
4.5V to 5.5V  
§
A
A
e a  
e
e
Symbol  
Parameter  
Units  
V
V
V
CC  
CC  
CC  
e
e
e
C 50 pF  
L
C
50 pF  
C
L
50 pF  
L
Min  
Typ  
100  
Max  
Min  
Max  
Min  
Max  
f
Max Toggle  
100  
toggle  
MHz  
ns  
Frequency  
t (H)  
s
Setup Time, HIGH  
1.5  
1.5  
2.5  
2.5  
1.5  
1.5  
t (L)  
s
or LOW D to LE  
n
t (H)  
h
Hold Time, HIGH  
1.0  
1.0  
2.5  
2.5  
1.0  
1.0  
ns  
t (L)  
h
or LOW D to LE  
n
t (H)  
w
Pulse Width,  
LE HIGH  
3.0  
3.3  
3.0  
ns  
4
Extended AC Electrical Characteristics  
(SOIC package)  
74ABT  
74ABT  
74ABT  
e b  
a
40 C to 85 C  
e b a  
40 C to 85 C  
T
T
§
4.5V to 5.5V  
§
§
4.5V to 5.5V  
§
A
A
e b  
a
40 C to 85 C  
T
§
§
4.5V to 5.5V  
A
e
e
V
V
CC  
CC  
e
V
CC  
e
e
250 pF  
Symbol  
Parameter  
C
50 pF  
C
L
Units  
L
e
C
250 pF  
(Note 5)  
L
8 Outputs Switching  
(Note 4)  
8 Outputs Switching  
(Note 6)  
Min  
Max  
Min  
Max  
Min  
Max  
t
t
Propagation Delay  
1.5  
1.5  
5.2  
5.2  
2.0  
2.0  
6.8  
6.8  
2.0  
2.0  
9.0  
9.0  
PLH  
ns  
ns  
ns  
ns  
D
n
to O  
n
PHL  
t
t
Propagation Delay  
LE to O  
1.5  
1.5  
5.5  
5.5  
2.0  
2.0  
7.5  
7.5  
2.0  
2.0  
9.5  
9.5  
PLH  
PHL  
n
t
t
Output Enable Time  
1.5  
1.5  
6.2  
6.2  
2.0  
2.0  
8.0  
8.0  
2.0  
2.0  
10.5  
10.5  
PZH  
PZL  
t
t
Output Disable Time  
1.0  
1.0  
5.5  
5.5  
PHZ  
(Note 7)  
(Note 7)  
PZL  
Note 4: This specification is guaranteed but not tested. The limits apply to propagation delays for all paths described switching in phase (i.e., all LOW-to-HIGH,  
HIGH-to-LOW, etc.).  
Note 5: This specification is guaranteed but not tested. The limits represent propagation delay with 250 pF load capacitors in plce of the 50 pF load capacitors in  
the standard AC load. This specificaiton pertains to single output switching only.  
Note 6: This specification is guaranteed but not tested. The limits represent propagation delays for all paths described switching in phase (i.e., all LOW-to-HIGH,  
HIGH-to-LOW, etc.) with 250 pF load capacitors in place of the 50 pF load capacitors in the standard AC load.  
Note 7: The TRI-STATE delay times are dominated by the RC network (500X, 250 pF) on the output and has been excluded from the datasheet.  
Skew  
74ABT  
74ABT  
e b  
a
40 C to 85 C  
e b  
A
a
40 C to 85 C  
T
T
§
4.5V–5.5V  
§
§
4.5V–5.5V  
§
A
e
e
V
CC  
V
CC  
C
Symbol  
Parameter  
e
e
250 pF  
Units  
C
50 pF  
L
L
8 Outputs Switching  
(Note 3)  
8 Outputs Switching  
(Note 4)  
Max  
Max  
t
Pin to Pin Skew  
HL Transitions  
OSHL  
(Note 1)  
1.0  
1.5  
ns  
ns  
ns  
ns  
ns  
t
Pin to Pin Skew  
LH Transitions  
OSLH  
(Note 1)  
1.0  
1.4  
1.5  
2.0  
1.5  
3.5  
3.9  
4.0  
t
Duty Cycle  
PS  
(Note 5)  
LH–HL Skew  
t
Pin to Pin Skew  
OST  
(Note 1)  
LH/HL Transitions  
t
Device to Device Skew  
LH/HL Transitions  
PV  
(Note 2)  
Note 1: Skew is defined as the absolute value of the difference between the actual propagation delays for any two separate outputs of the same device. The  
specification applies to any outputs switching HIGH to LOW (t ), LOW to HIGH (t ), or any combination switching LOW to HIGH and/or HIGH to LOW  
OSHL OSLH  
(t  
OST  
). This specification is guaranteed but not tested.  
Note 2: Propagation delay variation for a given set of conditions (i.e., temperature and V ) from device to device. This specification is guaranteed but not tested.  
CC  
Note 3: This specification is guaranteed but not tested. The limits apply to propagation delays for all paths described switching in phase (i.e., all LOW-to-HIGH,  
HIGH-to-LOW, etc.).  
Note 4: This specification is guaranteed but not tested. The limits represent propagation delays with 250 pF load capacitors in place of the 50 pF load capacitors in  
the standard AC load.  
Note 5: This describes the difference between the delay of the LOW-to-HIGH and the HIGH-to-LOW transition on the same pin. It is measured across all the  
outputs (drivers) on the same chip, the worst (largest delta) number is the guaranteed specification. This specification is guaranteed but not tested.  
5
Capacitance  
Conditions  
Symbol  
Parameter  
Typ Units  
e
(T  
25 C)  
§
A
e
C
C
Input Capacitance  
5
9
pF  
pF  
V
CC  
V
CC  
0V  
IN  
e
(Note 1) Output Capacitance  
5.0V  
OUT  
e
1 MHz, per MIL-STD-883B, Method 3012.  
Note 1: C  
is measured at frequency f  
OUT  
t
vs Temperature (T  
)
t
vs Temperature (T )  
PHL A  
PLH  
A
50 pF, 1 Output Switching  
e
C
Data to Output  
e
C
Data to Output  
50 pF, 1 Output Switching  
L
L
TL/F/1154711  
TL/F/1154713  
TL/F/1154715  
TL/F/1154712  
TL/F/1154714  
TL/F/1154716  
t
vs Temperature (T  
)
t
vs Temperature (T )  
PZL A  
PZH  
A
50 pF, 1 Output Switching  
e
C
OE to Output  
e
C
OE to Output  
50 pF, 1 Output Switching  
L
L
t
vs Temperature (T  
A
50 pF, 1 Output Switching  
)
t
vs Temperature (T )  
PLZ A  
PHZ  
e
C
OE to Output  
e
C
OE to Output  
50 pF, 1 Output Switching  
L
L
Dashed lines represent design characteristics; for specified guarantees, refer to AC Characteristics Tables.  
6
t
LOW vs Temperature (T  
)
t
HIGH vs Temperature (T )  
SET  
A
50 pF, 1 Output Switching  
SET A  
e
C
Data to LE  
e
C
L
Data to LE  
50 pF, 1 Output Switching  
L
TL/F/1154717  
TL/F/1154719  
TL/F/1154721  
TL/F/1154723  
TL/F/1154718  
TL/F/1154720  
TL/F/1154722  
TL/F/1154724  
t
HIGH vs Temperature (T  
)
t
LOW vs Temperature (T )  
HOLD A  
e
50 pF, 1 Output Switching  
HOLD  
A
e
C
Data to LE  
50 pF, 1 Output Switching  
C
Data to LE  
L
L
t
vs Temperature (T  
)
t
vs Temperature (T )  
PHL A  
PLH  
A
50 pF, 8 Outputs Switching  
e
C
Data to Output  
e
C
Data to Output  
50 pF, 8 Outputs Switching  
L
L
t
vs Temperature (T  
)
t
vs Temperature (T )  
PZH  
A
50 pF, 8 Outputs Switching  
PZL A  
e
C
OE to Output  
e
C
L
OE to Output  
50 pF, 8 Outputs Switching  
L
Dashed lines represent design characteristics; for specified guarantees, refer to AC Characteristics Tables.  
7
t
vs Temperature (T  
)
t
vs Temperature (T )  
PLZ A  
PHZ  
A
50 pF, 8 Outputs Switching  
e
C
OE to Output  
e
C
OE to Output  
50 pF, 8 Outputs Switching  
L
L
TL/F/1154725  
TL/F/1154727  
TL/F/1154729  
TL/F/1154731  
TL/F/1154726  
TL/F/1154728  
TL/F/1154730  
TL/F/1154732  
t
vs Load Capacitance  
t
vs Load Capacitance  
PHL  
PLH  
e
T
Data to Output  
e
T
Data to Output  
25 C, 1 Output Switching  
§
25 C, 1 Output Switching  
§
A
A
t
vs Load Capacitance  
t
vs Load Capacitance  
PHL  
PLH  
e
T
Data to Output  
e
T
Data to Output  
25 C, 8 Outputs Switching  
§
25 C, 8 Outputs Switching  
§
A
A
t
vs Load Capacitance  
t
vs Load Capacitance  
PZL  
PZH  
e
T
OE to Output  
e
T
OE to Output  
25 C, 8 Outputs Switching  
§
25 C, 8 Outputs Switching  
§
A
A
Dashed lines represent design characteristics; for specified guarantees, refer to AC Characteristics Tables.  
8
t
vs Temperature (T  
)
t
vs Temperature (T )  
PHL A  
PLH  
A
50 pF, 1 Output Switching  
e
C
LE to Output  
e
C
LE to Output  
50 pF, 1 Output Switching  
L
L
TL/F/1154735  
TL/F/1154736  
t
vs Temperature (T  
)
t
vs Temperature (T )  
PHL A  
PLH  
A
50 pF, 8 Outputs Switching  
e
C
LE to Output  
e
C
LE to Output  
50 pF, 8 Outputs Switching  
L
L
TL/F/1154737  
TL/F/1154738  
Typical I vs Output Switching Frequency  
CC  
e
e
e
e
C
L
0 pF, V  
CC  
V
IH  
5.5V, LE GND,  
t
and t  
PHL  
vs Number Outputs Switching  
1 Output Switching at 50% Duty Cycle  
Data to Output, Transparent Mode with  
PLH  
e
e
e
C
Outputs In Phase Data to Output  
50 pF, T  
25 C, V  
5.0V,  
§
L
A
CC  
e
Unused Data Inputs  
V
IH  
TL/F/1154733  
Dashed lines represent design characteristics; for specified guarantees, refer to AC Characteristics Tables.  
TL/F/1154734  
9
AC Loading  
TL/F/11547–4  
*Includes jig and probe capacitance  
FIGURE 1. Standard AC Test Load  
TL/F/11547–5  
FIGURE 4. Propagation Delay,  
Pulse Width Waveforms  
TL/F/11547–6  
TL/F/11547–7  
FIGURE 2a. Test Input Signal Levels  
FIGURE 5. TRI-STATE Output HIGH  
and LOW Enable and Disable Times  
Amplitude  
Rep. Rate  
t
w
t
t
f
r
3.0V  
1 MHz  
500 ns  
2.5 ns  
2.5 ns  
FIGURE 2b. Test Input Signal Requirements  
TL/F/11547–9  
FIGURE 6. Setup Time, Hold Time  
and Recovery Time Waveforms  
TL/F/11547–8  
FIGURE 3. Propagation Delay Waveforms for  
Inverting and Non-Inverting Functions  
10  
Ordering Information  
The device number is used to form part of a simplified purchasing code where the package type and temperature range are  
defined as follows:  
TL/F/1154739  
11  
Physical Dimensions inches (millimeters)  
20-Terminal Ceramic Chip Carrier (L)  
NS Package Number E20A  
12  
Physical Dimensions inches (millimeters) (Continued)  
20-Lead Ceramic Dual-In-Line (D)  
NS Package Number J20A  
20-Lead Small Outline Integrated Circuit JEDEC (S)  
NS Package Number M20B  
13  
Physical Dimensions inches (millimeters) (Continued)  
20-Lead Small Outline Integrated Circuit EIAJ (SJ)  
NS Package Number M20D  
20-Lead Plastic EIAJ SSOP (MSA)  
NS Package Number MSA20  
14  
Physical Dimensions inches (millimeters) (Continued)  
All dimensions are in millimeters.  
20-Lead Molded Thin Shrink Small Outline Package JEDEC (MTC)  
NS Package Number MTC20  
20-Lead Plastic Dual-In-Line Package (P)  
NS Package Number N20B  
15  
Physical Dimensions inches (millimeters) (Continued)  
20-Lead Ceramic Flatpak (F)  
NS Package Number W20A  
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DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL  
SEMICONDUCTOR CORPORATION. As used herein:  
1. Life support devices or systems are devices or  
systems which, (a) are intended for surgical implant  
into the body, or (b) support or sustain life, and whose  
failure to perform, when properly used in accordance  
with instructions for use provided in the labeling, can  
be reasonably expected to result in a significant injury  
to the user.  
2. A critical component is any component of a life  
support device or system whose failure to perform can  
be reasonably expected to cause the failure of the life  
support device or system, or to affect its safety or  
effectiveness.  
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Corporation  
National Semiconductor  
Europe  
National Semiconductor  
Hong Kong Ltd.  
National Semiconductor  
Japan Ltd.  
a
1111 West Bardin Road  
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Tel: 1(800) 272-9959  
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Fax:  
(
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@
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(
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National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.  

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