54F648SDMSAMQB [NSC]
Octal Transceiver/Register with TRI-STATE Outputs; 八路收发器/寄存器具有三态输出
| 型号： | 54F648SDMSAMQB |
| 厂家： | 
National Semiconductor |
| 描述： | Octal Transceiver/Register with TRI-STATE Outputs |
| 文件： | 总12页 (文件大小：207K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
December 1994
54F/74F646 74F646B 54F/74F648
#
#
Octal Transceiver/Register with TRI-STATE Outputs
É
General Description
Features
Y
Independent registers for A and B buses
These devices consist of bus transceiver circuits with TRI-
STATE, D-type flip-flops, and control circuitry arranged for
multiplexed transmission of data directly from the input bus
or from the internal registers. Data on the A or B bus will be
clocked into the registers as the appropriate clock pin goes
to a high logic level. Control G and direction pins are provid-
ed to control the transceiver function. In the transceiver
mode, data present at the high impedance port may be
stored in either the A or the B register or in both. The select
controls can multiplex stored and real-time (transparent
mode) data. The direction control determines which bus will
receive data when the enable control G is Active LOW. In
the isolation mode (control G HIGH), A data may be stored
in the B register and/or B data may be stored in the A regis-
ter.
Y
Multiplexed real-time and stored data
Y
’F648 has inverting data paths
Y
’F646/’F646B have non-inverting data paths
Y
’F646B is a faster version of the ’F646
Y
TRI-STATE outputs
Y
300 mil slim DIP
Y
Guaranteed 4000V minimum ESD protection
Package
Number
Commercial
74F646SPC
Military
Package Description
N24C
J24F
24-Lead (0.300 Wide) Molded Dual-In-Line
×
54F646DM (Note 2)
24-Lead (0.300 Wide) Ceramic Dual-In-Line
×
74F646SC (Note 1)
74F646MSA (Note 1)
M24B
MSA24
W24C
E28A
N24C
M24B
N24C
J24F
24-Lead (0.300 Wide) Molded Small Outline, JEDEC
×
24-Lead Molded Shrink Small Outline, EIAJ, Type II
54F646FM (Note 2)
54F646LM (Note 2)
24-Lead Cerpack
28-Lead Ceramic Leadless Chip Carrier, Type C
74F646BSPC
24-Lead (0.300 Wide) Molded Dual-In-Line
×
74F646BSC (Note 1)
74F648SPC
24-Lead (0.300 Wide) Molded Small Outline, JEDEC
×
24-Lead (0.300 Wide) Molded Dual-In-Line
×
54F648SDM (Note 2)
24-Lead (0.300 Wide) Ceramic Dual-In-Line
×
74F648SC (Note 1)
M24B
W24C
E28A
24-Lead (0.300 Wide) Molded Small Outline, JEDEC
×
54F648FM (Note 2)
54F648LM (Note 2)
24-Lead Cerpack
24-Lead Ceramic Leadless Chip Carrier, Type C
e
Note 1: Devices also available in 13 reel. Use suffix
SCX.
×
Note 2: Military grade device with environmental and burn-in processing. Use suffix
e
DMQB, FMQB and LMQB.
Logic Symbols
’F646/’F646B
’F648
TL/F/9580–1
TL/F/9580–7
TRI-STATEÉ is a registered trademark of National Semiconductor Corporation.
C
1995 National Semiconductor Corporation
TL/F/9580
RRD-B30M75/Printed in U. S. A.
Logic Symbols (Continued)
IEEE/IEC
’F646/’F646B
IEEE/IEC
’F648
TL/F/9580–9
TL/F/9580–4
Connection Diagrams
Pin Assignment
for DIP, SOIC and Flatpak
’F646/’F646B
Pin Assignment
for DIP, SOIC and Flatpak
’F648
TL/F/9580–2
TL/F/9580–8
Pin Assignment
for LCC
’F646/’F646B
Pin Assignment
for LCC
’F648
TL/F/9580–3
TL/F/9580–10
2
Unit Loading/Fan Out
54F/74F
Pin Names
Description
U.L.
Input I /I
IH IL
Output I /I
HIGH/LOW
OH OL
b
A –A
0
Data Register A Inputs/
TRI-STATE Outputs
Data Register B Inputs/
TRI-STATE Outputs
3.5/1.083
600/106.6 (80)
3.5/1.083
600/106.6 (80)
1.0/1.0
70 mA/ 650 mA
7
b
b
12 mA/64 mA (48 mA)
b
B –B
0
70 mA/ 650 mA
7
12 mA/64 mA (48 mA)
b
20 mA/ 0.6 mA
CPAB, CPBA Clock Pulse Inputs
b
20 mA/ 0.6 mA
SAB, SBA
Select Inputs
1.0/1.0
b
20 mA/ 0.6 mA
b
20 mA/ 0.6 mA
G
Output Enable Input
Direction Control Input
1.0/1.0
DIR
1.0/1.0
Function Table
Inputs
Data I/O*
Function
G
DIR
CPAB
CPBA
SAB
SBA
A –A
0
B –B
0 7
7
H
H
H
X
X
X
H or L
L
X
H or L
X
X
X
X
X
X
X
Isolation
Input
Input
Input
Clock A Data into A Register
n
L
Clock B Data into B Register
n
L
L
L
L
H
H
H
H
X
X
X
X
X
L
L
X
X
X
X
A to B ÐReal Time (Transparent Mode)
n n
L
H or L
Clock A Data into A Register
n
Output
H
H
A Register to B (Stored Mode)
n
L
Clock A Data into A Register and Output to B
n
n
L
L
L
L
L
L
L
L
X
X
X
X
X
X
X
X
X
L
L
B to A ÐReal Time (Transparent Mode)
n n
L
H or L
Clock B Data into B Register
n
Output
Input
H
H
B Register to A (Stored Mode)
n
L
Clock B Data into B Register and Output to A
n
n
*The data output functions may be enabled or disabled by various signals at the G and DIR Inputs. Data input functions are always enabled; i.e., data at the bus
pins will be stored on every LOW-to-HIGH transition of the clock inputs.
e
e
e
H
L
HIGH Voltage Level
LOW Voltage Level
Irrelevant
X
e
L
LOW-to-HIGH Transition
3
Logic Diagrams (Continued)
’F646/’F646B
TL/F/9580–5
Please note that this diagram is provided only for the understanding of logic operations and should not be used to estimate propagation delays.
4
Logic Diagrams (Continued)
’F648
TL/F/9580–6
Please note that this diagram is provided only for the understanding of logic operations and should not be used to estimate propagation delays.
5
Absolute Maximum Ratings (Note 1)
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales
Office/Distributors for availability and specifications.
Recommended Operating
Conditions
Free Air Ambient Temperature
Military
Commercial
b
a
55 C to 125 C
§
0 C to 70 C
§
§
b
b
a
65 C to 150 C
Storage Temperature
§
§
§
§
§
a
§
a
55 C to 125 C
Ambient Temperature under Bias
§
Supply Voltage
Military
Commercial
b
b
a
a a
4.5V to 5.5V
a a
4.5V to 5.5V
Junction Temperature under Bias
Plastic
55 C to 175 C
§
§
a
55 C to 150 C
V
Pin Potential to
CC
Ground Pin
b
a
0.5V to 7.0V
b
a
0.5V to 7.0V
Input Voltage (Note 2)
Input Current (Note 2)
Voltage Applied to Output
b
a
30 mA to 5.0 mA
e
in HIGH State (with V
Standard Output
TRI-STATE Output
0V)
CC
b
0.5V to 5.5V
0.5V to V
CC
b
a
Current Applied to Output
in LOW State (Max)
twice the rated I (mA)
OL
ESD Last Passing Voltage (Min)
4000V
Note 1: Absolute maximum ratings are values beyond which the device may
be damaged or have its useful life impaired. Functional operation under
these conditions is not implied.
Note 2: Either voltage limit or current limit is sufficient to protect inputs.
DC Electrical Characteristics
54F/74F
Typ
Symbol
Parameter
Units
V
CC
Conditions
Min
Max
V
Input HIGH Voltage
2.0
V
V
V
Recognized as a HIGH Signal
Recognized as a LOW Signal
IH
V
V
V
Input LOW Voltage
0.8
IL
b
e b
18 mA (Non I/O Pins)
Input Clamp Diode Voltage
1.2
Min
Min
I
IN
CD
OH
e b
e b
Output HIGH
Voltage
54F 10% V
2.0
2.0
I
I
12 mA (A , B )
n n
CC
OH
OH
V
V
74F 10% V
15 mA (A , B )
n n
CC
e
e
V
Output LOW
Voltage
54F 10% V
74F 10% V
0.55
0.55
I
I
48 mA (A , B )
n n
64 mA (A , B )
OL
CC
OL
Min
Max
Max
Max
Max
0.0
CC
OL
n
n
e
e
e
I
I
I
I
Input HIGH
Current
54F
74F
20.0
5.0
V
V
V
V
2.7V (Non I/O Pins)
7.0V (Non I/O Pins)
IH
IN
IN
IN
mA
mA
mA
mA
V
Input HIGH Current
Breakdown Test
54F
74F
100
7.0
BVI
Input HIGH Current
Breakdown (I/O)
54F
74F
1.0
0.5
5.5V (A , B )
n n
BVIT
CEX
e
V
CC
Output HIGH
54F
74F
250
50
OUT
Leakage Current
e
All Other Pins Grounded
V
Input Leakage
Test
I
ID
1.9 mA
ID
OD
IL
74F
74F
4.75
e
All Other Pins Grounded
I
Output Leakage
Circuit Current
V
IOD
150 mV
3.75
mA
0.0
b
e
0.5V (Non I/O Pins)
I
I
I
I
I
I
I
I
Input LOW Current
0.6
mA
mA
mA
mA
mA
mA
mA
mA
Max
Max
Max
Max
0.0V
Max
Max
Max
V
V
V
V
V
V
V
V
IN
a
e
2.7V (A , B )
I
Output Leakage Current
Output Leakage Current
Output Short-Circuit Current
Bus Drainage Test
70
IH
IL
OZH
OUT
OUT
OUT
OUT
n
n
a
b
b
e
e
e
I
650
225
0.5V (A , B )
n n
OZL
b
100
0V
OS
500
5.25V
ZZ
e
Power Supply Current
Power Supply Current
Power Supply Current
135
150
150
HIGH
LOW
CCH
CCL
CCZ
O
e
O
e
HIGH Z
O
6
’F646/’F648
AC Electrical Characteristics
74F
54F
74F
e a
T
25 C
§
5.0V
A
e
50 pF
e
T
, V
CC
e
Mil
T
, V
Com
e
50 pF
A
A CC
e a
Symbol
Parameter
V
Units
CC
C
C
L
L
e
C
Min
90
50 pF
L
Max
Min
Max
Min
Max
f
Maximum Clock Frequency
75
90
MHz
ns
max
t
t
Propagation Delay
Clock to Bus
2.0
2.0
7.0
8.0
2.0
2.0
8.5
9.5
2.0
2.0
8.0
9.0
PLH
PHL
t
t
Propagation Delay
Bus to Bus (’F646)
1.0
1.0
7.0
6.5
1.0
1.0
8.0
8.0
1.0
1.0
7.5
7.0
PLH
ns
ns
ns
ns
ns
ns
ns
PHL
t
t
Propagation Delay
Bus to Bus (’F648)
2.0
1.0
8.5
7.5
1.0
1.0
10.0
9.0
2.0
1.0
9.0
8.0
PLH
PHL
t
t
Propagation Delay
2.0
2.0
8.5
8.0
2.0
2.0
11.0
10.0
2.0
2.0
9.5
9.0
PLH
SBA or SAB to A or B
PHL
t
t
Enable Time
OE to A or B
2.0
2.0
8.5
2.0
2.0
10.0
13.5
2.0
2.0
9.0
PZH
12.0
12.5
PZL
t
t
Disable Time
OE to A or B
1.0
2.0
7.5
9.0
1.0
2.0
9.0
1.0
2.0
8.5
9.5
PHZ
11.0
PLZ
t
t
Enable Time
DIR to A or B
2.0
2.0
14.0
13.0
2.0
2.0
16.0
15.0
2.0
2.0
15.0
14.0
PZH
PZL
t
t
Disable Time
DIR to A or B
1.0
2.0
9.0
1.0
2.0
10.0
12.0
1.0
2.0
9.5
PHZ
11.0
11.5
PLZ
’F646/’F648
AC Operating Requirements
74F
54F
74F
e a
e a
T
25 C
§
5.0V
A
e
e
Symbol
Parameter
T
, V
CC
Mil
T
, V
A CC
Com
Max
Units
A
V
CC
Min
Max
Min
Max
Min
t (H)
s
Setup Time, HIGH or LOW
Bus to Clock
5.0
5.0
5.0
5.0
5.0
5.0
ns
ns
ns
t (L)
s
t (H)
h
Hold Time, HIGH or LOW
Bus to Clock
2.0
2.0
2.5
2.5
2.0
2.0
t (L)
h
t
t
(H)
(L)
Clock Pulse Width
HIGH or LOW
5.0
5.0
5.0
5.0
5.0
5.0
w
w
7
’F646B
AC Electrical Characteristics
74F
54F
74F
e a
T
25 C
§
A
e
50 pF
e
T
, V
CC
e
Mil
T
, V
Com
e
50 pF
A
A CC
e a
5.0V
50 pF
Symbol
Parameter
V
Units
CC
C
C
L
L
e
C
Min
165
L
Max
Min
Max
Min
Max
f
Maximum Clock Frequency
150
MHz
ns
max
t
t
Propagation Delay
Clock to Bus
2.5
3.0
7.0
7.5
2.5
3.0
8.0
8.0
PLH
PHL
t
t
Propagation Delay
Bus to Bus
2.0
2.0
6.0
6.0
2.0
2.0
7.0
7.0
PLH
ns
ns
ns
ns
ns
ns
PHL
t
t
Propagation Delay
2.5
2.5
7.5
7.5
2.5
2.5
8.5
8.5
PLH
SBA or SAB to A or B
PHL
t
t
Enable Time
OE to A or B
2.5
2.5
6.5
9.0
2.5
2.5
8.0
PZH
10.0
PZL
t
t
Disable Time
OE to A or B
1.5
2.0
6.5
7.0
1.5
2.0
7.5
8.5
PHZ
PLZ
t
t
Enable Time
DIR to A or B
2.0
3.0
7.0
9.5
2.0
3.0
8.5
PZH
10.0
PZL
t
t
Disable Time
DIR to A or B
1.5
2.5
7.5
8.5
1.5
2.5
8.5
9.5
PHZ
PLZ
’F646B
AC Operating Requirements
74F
54F
74F
e a
e a
T
25 C
§
5.0V
A
e
e
Symbol
Parameter
T
, V
CC
Mil
Max
T
, V
A CC
Com
Max
Units
A
V
CC
Min
Max
Min
Min
t (H)
s
Setup Time, HIGH or LOW
Bus to Clock
5.0
5.0
4.0
4.0
ns
ns
ns
t (L)
s
t (H)
h
Hold Time, HIGH or LOW
Bus to Clock
1.5
1.5
1.5
1.5
t (L)
h
t
t
(H)
(L)
Clock Pulse Width
HIGH or LOW
5.0
5.0
5.0
5.0
w
w
Ordering Information
The device number is used to form part of a simplified purchasing code where the package type and temperature range are
defined as follows:
74F 646/646B/648
S
C
X
Temperature Range Family
Special Variations
e
e
e
74F
54F
Commercial
Military
QB
Military grade device with
environmental and burn-in
processing
Device Type
e
X
Devices shipped in 13 reel
×
Package Code
Temperature Range
e
e
e
e
e
e
e
SP
SD
S
MSA
L
Slim Plastic DIP
C
Commercial
Slim Ceramic DIP
Small Outline (SOIC)
Shrink Small Outline SOIC EIAJ Type II (M646 only)
Leadless Chip Carrier
Flatpak
a
(0 C to 70 C)
§
Military
§
e
M
b
a
55 C to 125 C)
§
(
§
F
8
Physical Dimensions inches (millimeters)
28-Lead Ceramic Leadless Chip Carrier, Type C
NS Package Number E28A
24-Lead (0.300 Wide) Ceramic Dual-In-Line Package (SD)
×
NS Package Number J24F
9
Physical Dimensions inches (millimeters) (Continued)
24-Lead (0.300 Wide) Molded Small Outline Package, JEDEC (S)
×
NS Package Number M24B
10
Physical Dimensions inches (millimeters) (Continued)
24-Lead Molded Shrink Small Outline Package, EIAJ, Type II
NS Package Number MSA24
24-Lead (0.300 Wide) Molded Dual-In-Line Package (SP)
×
NS Package Number N24C
11
Physical Dimensions inches (millimeters) (Continued)
24-Lead Cerpack
NS Package Number W24C
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DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL
SEMICONDUCTOR CORPORATION. As used herein:
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systems which, (a) are intended for surgical implant
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failure to perform, when properly used in accordance
with instructions for use provided in the labeling, can
be reasonably expected to result in a significant injury
to the user.
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support device or system whose failure to perform can
be reasonably expected to cause the failure of the life
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effectiveness.
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