NMC-P1210X7R105K25TRPF [NIC]

Multilayer Ceramic Chip Capacitors; 多层陶瓷芯片电容器
NMC-P1210X7R105K25TRPF
型号: NMC-P1210X7R105K25TRPF
厂家: NIC-COMPONENTS CORP.    NIC-COMPONENTS CORP.
描述:

Multilayer Ceramic Chip Capacitors
多层陶瓷芯片电容器

电容器
文件: 总5页 (文件大小:84K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
Multilayer Ceramic Chip Capacitors  
NMC-P Series  
FEATURES  
• CRACK RESISTANT TERMINATION  
• SOFT TERMINATION, OPEN MODE FAILURE  
• WIDE VOLTAGE RANGE (16V TO 5KV)  
• HIGH CAPACITANCE (UP TO 10µF)  
• RoHS COMPLIANT  
RoHS  
Compliant  
includes all homogeneous materials  
*See Part Number System for Details  
• SAC SOLDER COMPATIBLE**  
Temperature Coefficient  
Capacitance Range  
NPO  
2.2pF ~ 0.22µF  
X7R  
180pF ~ 10µF  
For 2.2pF ~ 10pF: ±0.1pF (B), ±0.25pF (C), ±0.5pF (D), ±1pF (F)  
Above 10pF: ±1% (F), ±2% (G), ±5% (J), ±10% (K)  
-55°C ~ +125°C  
Capacitance Tolerance  
±10% (K) & ±20% (M)  
Operating Temperature Range  
Temperature Characteristics  
Rated Voltages  
±30ppm/°C  
±15% Cap.  
16Vdc, 25Vdc, 50Vdc, 100Vdc, 200Vdc, 250Vdc, 500Vdc, 630Vdc, 1KVdc, 2Kvdc, 3Kvdc & 5Kvdc  
Q = > 1000 (more then 30pF)*  
2.5% max. @ 1KHz, 1.0V ± 0.2Vrms  
Q = > 400 + 20 x C in pF (30pF and below)*  
Q or Dissipation Factor  
insulation Resistance  
10,000Megohm or 500Megohm/µF whichever is less @ +25°C  
200% of rated voltage for 5 seconds, 50mA max. (16V ~ 250V)  
150% of rated voltage for 5 seconds, 50mA max. (500V ~ 630V)  
120% of rated voltage for 5 seconds, 50mA max. (1KV ~ 5KV)  
Dielectric Withstanding Voltage  
*Test Frequency & Voltage: Up to 100pF 1MHz/1.0Vrms, Above 100pF 1KHz/1.0Vrms  
**Reflow soldering is recommended. Contact NIC regarding the use of other soldering methods.  
PART NUMBER SYSTEM  
NMC-P 1206 X7R 105 K 50 TRP or TRPLP F  
RoHS Compliant  
Tape & Reel (Plastic Carrier)  
Tape & Reel (Paper Carrier)  
Voltage (Vdc)  
Capacitance Tolerance Code (see chart)  
Capacitance Code, expressed in pF, first 2 digits are  
significant, 3rd digit is no. of zeros  
Temperature Characteristic (NPO or X7R)  
Size Code (see chart)  
Series  
CONSTRUCTION  
Base layer (Cu 50V ~ 250V)  
(Ag 500V ~ up)  
Flexible layer (Polymer)  
Barrier layer (Ni)  
Finish layer (Sn)  
OPEN MODE FAILURE AS A RESULT OF BENDING STRESS  
Termination Separation  
(Open Failure Mode)  
®
NIC COMPONENTS CORP. www.niccomp.com www.lowESR.com www.RFpassives.com www.SMTmagnetics.com  
NMC-P rev. 1 05302007  
15  
Multilayer Ceramic Chip Capacitors  
NMC-P Series  
NPO VALUES AND SIZES (mm)  
EIA Case Size  
Length (L)  
0603  
0805  
1206  
3.20 ± 0.3  
1.60 ± 0.2  
1.80 max.  
0.30 min.  
1210  
1.60 ± 0.1  
0.80 ± 0.1  
2.00 ± 0.2  
1.25 ± 0.25  
1.45 max.  
0.20 min.  
3.20 ± 0.30  
2.50 ± 0.20  
2.60 max.  
0.30 min.  
Width (W)  
Thickness max. (T) 0.90 max.  
Termination Width (P) 0.15 min.  
Working Voltage (Vdc)  
Capacitance  
200V  
16 25 50 200 250 500 16 25 50 200 250 500 1KV 2KV 3KV 16 25 50 200 250 500  
2.0pF  
3.3  
3.9  
5.0  
8.2  
10  
12  
15  
18  
22  
27  
33  
39  
47  
56  
68  
82  
100  
120  
150  
180  
220  
270  
330  
390  
470  
560  
680  
820  
0.001µF  
0.0012  
0.0015  
0.0018  
0.0022  
0.0027  
0.0033  
0.0039  
0.0047  
0.0056  
0.0068  
0.0082  
0.01µF  
0.012  
0.015  
0.018  
0.022  
0.027  
0.033  
0.039  
0.047  
0.056  
0.068  
0.1  
®
NIC COMPONENTS CORP. www.niccomp.com www.lowESR.com www.RFpassives.com www.SMTmagnetics.com  
16  
Multilayer Ceramic Chip Capacitors  
NMC-P Series  
NPO VALUES AND SIZES (mm)  
EIA Case Size  
Length (L)  
1808  
1812  
1825  
2220  
2225  
4.60 ± 0.3  
2.00 ±0.2  
2.20 max.  
0.30 min.  
4.60 ± 0.3  
3.20 ±0.3  
3.00 max.  
0.30 min.  
4.60 ± 0.3  
6.35 ±0.4  
2.60 max.  
0.30 min.  
5.70 ± 0.4  
5.00 ±0.4  
3.00 max.  
0.30 min.  
5.70 ± 0.4  
6.35 ± 0.4  
3.00 max.  
0.30 min.  
Width (W)  
Thickness max. (T)  
Termination Width (P)  
Working Voltage (Vdc)  
1KV 2KV 3KV 5KV 16 25 50 1KV 2KV 3KV 250 500 1KV 1KV  
Capacitance  
5KV 250 500 1KV  
2.0pF  
3.3  
3.9  
5.0  
8.2  
10  
12  
15  
18  
22  
27  
33  
39  
47  
56  
68  
82  
100  
120  
150  
180  
220  
270  
330  
390  
470  
560  
680  
820  
0.001µF  
0.0012  
0.0015  
0.0018  
0.0022  
0.0027  
0.0033  
0.0039  
0.0047  
0.0056  
0.0068  
0.0082  
0.01µF  
0.012  
0.015  
0.018  
0.022  
0.027  
0.033  
0.039  
0.047  
0.056  
0.068  
0.1  
0.12  
0.15  
0.22  
®
NIC COMPONENTS CORP. www.niccomp.com www.lowESR.com www.RFpassives.com www.SMTmagnetics.com  
17  
Multilayer Ceramic Chip Capacitors  
NMC-P Series  
X7R LOW VOLTAGE VALUES AND SIZES (mm)  
EIA Case Size  
Length (L)  
0805  
1206  
1210  
1812  
4.60 ± 0.3  
3.20 ± 0.3  
3.00 max.  
0.30 min.  
1825  
2220  
2225  
2.00 ± 0.2  
1.25 ± 0.25  
1.45 max.  
0.20 min.  
3.20 ± 0.3  
1.60 ± 0.2  
1.80 max.  
0.30 min.  
3.20 ± 0.3  
2.50 ± 0.2  
2.60 max.  
0.30 min.  
4.60 ± 0.3  
6.35 ± 0.4  
2.60 max.  
0.30 min.  
5.70 ± 0.4  
5.00 ± 0.4  
3.00 max.  
0.30 min.  
5.70 ± 0.4  
6.35 ± 0.4  
3.00 max.  
0.30 min  
Width (W)  
Thickness max. (T)  
Termination Width (P)  
Working Voltage (Vdc)  
Capacitance  
50  
100  
50  
100  
50  
100  
50  
100  
50  
100  
50  
100  
50  
100  
0.1µF  
0.15  
0.22  
0.33  
0.47  
0.68  
1.0  
1.5  
2.2  
3.3  
4.7  
6.8  
10  
X7R HIGH V0LTAGE VALUES AND SIZES (mm)  
EIA Case Size  
Length (L)  
0805  
1206  
1210  
2.00 ± 0.2  
1.25 ± 0.25  
1.45 max.  
0.20 min.  
3.20 ± 0.3  
1.60 ± 0.2  
1.80 max.  
0.30 min.  
3.20 ± 0.3  
2.50 ± 0.2  
2.60 max.  
0.30 min.  
Width (W)  
Thickness max. (T)  
Termination Width (P)  
Working Voltage (Vdc)  
500 630  
Capacitance  
200  
250  
500  
200  
250  
1K  
200  
250  
500  
1K  
180pF  
220  
270  
330  
390  
470  
560  
680  
0.001µF  
0.0015µF  
0.0022µF  
0.0027µF  
0.0033µF  
0.0039µF  
0.0047µF  
0.0056µF  
0.0068µF  
0.01µF  
0.012µF  
0.015µF  
0.018µF  
0.022µF  
0.027µF  
0.033µF  
0.039µF  
0.047µF  
0.056µF  
0.068µF  
0.1µF  
0.12µF  
0.15µF  
0.18µF  
0.22µF  
®
NIC COMPONENTS CORP. www.niccomp.com www.lowESR.com www.RFpassives.com www.SMTmagnetics.com  
18  
Multilayer Ceramic Chip Capacitors  
NMC-P Series  
X7R HIGH V0LTAGE VALUES AND SIZES (mm)  
EIA Case Size  
Length (L)  
1808  
1812  
1825  
2220  
2225  
4.60 ± 0.3  
2.0 ± 0.2  
2.20 max.  
0.30 min.  
4.60 ± 0.3  
3.2 ± 0.3  
3.00 max.  
0.30 min.  
4.60 ± 0.3  
6.35 ± 0.4  
2.60 max.  
0.30 min.  
5.70 ± 0.4  
5.00 ± 0.4  
3.00 max.  
0.30 min.  
5.70 ± 0.4  
6.35 ± 0.4  
3.00 max.  
0.30 min.  
Width (W)  
Thickness max. (T)  
Termination Width (P)  
Working Voltage (Vdc)  
2K 3K 250 500 1K 250 500 1K  
Capacitance  
500 1K  
2K  
3K 200 250 500 1K  
2K 250 500 1K  
150pF  
180  
220  
270  
330  
390  
470  
560  
680  
0.001µF  
0.0015  
0.0018  
0.0022  
0.0027  
0.0033  
0.0039  
0.0047  
0.0056  
0.0068  
0.01  
0.012  
0.015  
0.018  
0.022  
0.027  
0.033  
0.039  
0.047  
0.056  
0.068  
0.1  
0.12  
0.15  
0.18  
0.22  
0.27  
0.33  
0.39  
0.47  
0.56  
0.68  
1.0  
1.5  
2.2  
W
H
P
P
L
®
100% Sn over Ni barrier  
NIC COMPONENTS CORP. www.niccomp.com www.lowESR.com www.RFpassives.com www.SMTmagnetics.com  
19  

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