NMC-H0805NPO470C500TRPF [NICHICON]
Ceramic Capacitor, Multilayer, Ceramic, 500V, 0.53% +Tol, 0.53% -Tol, C0G, 30ppm/Cel TC, 0.000047uF, Surface Mount, 0805, CHIP, ROHS COMPLIANT;
| 型号： | NMC-H0805NPO470C500TRPF |
| 厂家： | 
NICHICON CORPORATION |
| 描述： | Ceramic Capacitor, Multilayer, Ceramic, 500V, 0.53% +Tol, 0.53% -Tol, C0G, 30ppm/Cel TC, 0.000047uF, Surface Mount, 0805, CHIP, ROHS COMPLIANT 电容器 |
| 文件： | 总6页 (文件大小：97K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Multilayer Ceramic Chip Capacitors
NMC-H Series
RoHS
Compliant
FEATURES
• HIGH VOLTAGE 200Vdc ~ 5KVdc
• NPO AND X7R DIELECTRICS
Includes all homogeneous materials
• CASE SIZES FROM 0603 ~ 2225
• NICKEL BARRIER TERMINATION AND EXCELLENT
MECHANICAL STRENGTH
*See Part Number System for Details
SPECIFICATIONS
Operating Temperature Range
Temperature Characteristic
Dissipation Factor
NPO
-55°C ~ +125°C
±30ppm
X7R
-55°C ~ +125°C
±15%
< 0.1%
< 2.5%
> 500MegΩ or 500MegΩ-μF whichever is less
Test Method: Voltage rating < 500V measured after 1 minute at rated voltage,
Voltage rating > 500V measured after 1 minute at 500V
Insulation Resistance
Capacitance Range
Capacitance Tolerance
Rated Voltage
2.0pF ~ 0.039μF
±0.1pF(B), ±0.25pF(C), ±0.5pF(D)
±1%(F), ±2%(G), ±5%(J), ±10%(K), ±20(M)
200Vdc ~ 5KVdc
150pF ~ 0.47μF
±5%(J), ±10%(K), ±20(M)
200Vdc ~ 3KVdc
Working Voltage 200 & 250Vdc x 1.5 + 100Vdc for 5 seconds
Working Voltage 500Vdc x 1.5 for 5 seconds
Working Voltage greater than 500Vdc x 1.2 for 5 seconds
Dielectric Withstanding Voltage
Test Conditions (C & DF)
C < 1000pF = 1MHz, 1Vrms @ 25°C
C < 1000pF = 1KHz, 1Vrms @ 25°C
1KHz, 1Vrms @ 25°C
PART NUMBER SYSTEM
NMC-H 1206 NPO 102 J 1KV TRP or TRPLP 2K F
RoHS compliant
Non-Std or Optional Reel Quantity
Tape & Reel (Embossed Plastic Carrier)
Tape & Reel (Punched carrier)
Voltage (Vdc)
Capacitance Tolerance Code (see chart)
Capacitance Code, expressed in pF, first 2 digits are
significant, 3rd digit is no. of zeros, “R” indicates
decimal for under 10pF
Temperature Characteristic
Size Code (see chart)
Series
CONSTRUCTION
W
T
P
P
L
100% Sn over Ni barrier
®
NIC COMPONENTS CORP. www.niccomp.com www.lowESR.com www.RFpassives.com www.SMTmagnetics.com
1
SPECIFICATIONS ARE SUBJECT TO CHANGE
Multilayer Ceramic Chip Capacitors
NMC-H NPO Series
NPO-HIGH VOLTAGE SIZE CHART (mm)
EIA Case Size
Length (L)
Width (W)
0603
0805
1206
3.2 ± 0.15
1.6 ± 0.20
1.80 max.
0.25 ~ 0.80
1210
1.6 ± 0.10
0.80 ± 0.10
0.90 max.
2.0 ± 0.15
1.25 ± 0.10
1.45 max.
0.25 ~ 0.75
3.2 ± 0.30
2.5 ± 0.20
2.60 max.
0.25 ~ 1.00
Thickness (T)
Termination Width (P) 0.25 ~ 0.65
Working Voltage (Vdc)
Capacitance
200
250
500
200
250
500
1K
2K
3K
200
250
500
2.0pF ~ 8.2pF
10
12
15
18
22
27
33
39
47
56
68
82
100
120
150
180
220
270
330
390
470
560
680
820
0.001μF
0.0012
0.0015
0.0018
0.0022
0.0027
0.0033
0.0039
0.0047
0.0068
0.0082
®
NIC COMPONENTS CORP. www.niccomp.com www.lowESR.com www.RFpassives.com www.SMTmagnetics.com
2
SPECIFICATIONS ARE SUBJECT TO CHANGE
Multilayer Ceramic Chip Capacitors
NMC-H NPO Series
NPO-HIGH VOLTAGE SIZE CHART (mm)
EIA Case Size
Length (L)
Width (W)
1808
1812
1825
2220
5.7 ±0.40
5.00 ± 0.40 6.35 ± 0.40
3.00 max. 3.00 max.
0.30 ~ 1.10 0.30 ~ 1.10
2225
5.70 ± 0,40
4.6 ± 0.40
2.0 ± 0.30
2.20 max.
0.25 ~ 0.75
4.6 ± 0.30
3.2 ± 0.30
3.00 max.
0.25 ~ 0.75
4.6 ± 0.30
6.35 ± 0.40
3.00 max.
0.3 ~ 1.05
Thickness (T)
Termination Width (P)
Working Voltage (Vdc)
1K 2K 3K 1K 2K 3K 250 500 1K
Capacitance
5K
250 500 1K
2.0pF ~ 8.2pF
10
12
15
18
22
27
33
39
47
56
68
82
100
120
150
180
220
270
330
390
470
560
680
820
0.001μF
0.0012
0.0015
0.0018
0.0022
0.0027
0.0033
0.0039
0.0047
0.0056
0.0068
0.0082
0.01μF
0.012
0.015
0.018
0.022
0.027
0.033
0.039
®
NIC COMPONENTS CORP. www.niccomp.com www.lowESR.com www.RFpassives.com www.SMTmagnetics.com
3
SPECIFICATIONS ARE SUBJECT TO CHANGE
Multilayer Ceramic Chip Capacitors
NMC-H X7R Series
X7R-HIGH VOLTAGE SIZE CHART (mm)
EIA Case Size
Length (L)
Width (W)
0805
1206
1210
2.0 ± 0.1
1.25 ± 0.1
1.45 max.
0.25 ~ 0.75
3.2 ± 0.15
1.6 ± 0.15
1.80 max.
0.25 ~ 0.75
3.2 ± 0.2
2.5 ± 0.2
2.20 max.
0.25 ~ 0.75
Thickness (T)
Termination Width (P)
Working Voltage (Vdc)
630 1K
Capacitance
200
250
500
630
250
500
2K
200
250
500
630
1K
150
180
220
270
330
390
470
560
680
820
0.001μF
0.0012
0.0015
0.0018
0.0022
0.0027
0.0033
0.0039
0.0047
0.0056
0.0068
0.0082
0.01μF
0.012
0.015
0.018
0.022
0.027
0.033
0.039
0.047
0.056
0.068
0.082
0.1μF
0.12
0.15
0.18
0.22
0.27
0.33
0.47
®
NIC COMPONENTS CORP. www.niccomp.com www.lowESR.com www.RFpassives.com www.SMTmagnetics.com
4
SPECIFICATIONS ARE SUBJECT TO CHANGE
Multilayer Ceramic Chip Capacitors
NMC-H X7R Series
X7R-HIGH VOLTAGE SIZE CHART (mm)
EIA Case Size
Length (L)
Width (W)
1808
1812
4.6 ± 0.4
3.2 ± 0.3
2.20 max.
2220
2225
4.6 ± 0.4
2.0 ± 0.3
2.20 max.
0.30 min.
5.7 ±0.40
5.00 ± 0.40
3.00 max.
0.30 ~ 1.10
5.70 ± 0,40
6.35 ± 0.40
3.00 max.
0.30 ~ 1.10
Thickness (T)
Termination Width (P)
0.30 min.
Working Voltage (Vdc)
Capacitance
500 1K 2K 3K 200 250 500 1K 2K 3K 250 500 1K 2K 250 500 1K
150
180
220
270
330
390
470
560
680
820
0.001μF
0.0012
0.0015
0.0018
0.0022
0.0027
0.0033
0.0039
0.0047
0.0056
0.0068
0.0082
0.01μF
0.012
0.015
0.018
0.022
0.027
0.033
0.039
0.047
0.056
0.068
0.082
0.1μF
0.12
0.15
0.18
0.22
0.27
0.33
0.39
0.47
0.56
0.68
0.82
1.0μF
1.5
2.2
®
NIC COMPONENTS CORP. www.niccomp.com www.lowESR.com www.RFpassives.com www.SMTmagnetics.com
5
SPECIFICATIONS ARE SUBJECT TO CHANGE
Multilayer Ceramic Chip Capacitors
Taping Specifications
REEL
REEL DIMENSIONS (mm)
Reel Diameter (A)
7” (178 ± 2.0)
B
C
D
T max.
B
50 min.
8.4 +1.0/-0
10” (250 ± 2.0)
13” (330 ± 2.0)
13 ± 0.5 100 ± 1.0 21 ± 1.0 (1812 case size
12.4 +2.0/-0)
100 ± 1.0
D
7 INCH REEL QUANTITIES*
01005
8mm
0201
8mm
0402
8mm
0603
8mm
0805
8mm
1206
8mm
1210
1808
1812
Size
C
8mm
12mm
12mm
Tape Size
Min. Qty
Per Reel
Max. Qty
Per Reel
20,000 20,000
20,000 20,000
10,000
10,000
4,000 4,000
4,000 5,000
4,000
5,000
2,000
1,000
3,000
1,000
2,000
5,000
*Quantity dependent on chip thickness. Contact NIC for reel
quantities on larger diameter reels.
CARRIER TAPE MATERIAL
Parts with a thickness of >1mm will be taped on embossed
plastic carrier. Parts with a thickness of less then 1mm
will be taped on paper carrier
T
A
EMBOSSED PLASTIC CARRIER TAPE DIMENSIONS (mm)
Tape Size
W
F
E
P0
P2
D
K max.
0.3
T max.
P
8mm
8.0 ± 0.2 3.5 ± 0.05
12 ± 0.2 5.5 ± 0.05
2.0
4.5
4.0 ± 0.1
8.0 ± 0.1
1.75 ± 0.10 4.0 ± 0.1 2.0 ± 0.5 1.5 +0.1
-0.0
12mm
Notes:
EMBOSSED PLASTIC CARRIER TAPE
1. Specifications are in compliance with EIA RS481-1-A
“Taping of surface Mount Components for Automatic Placement”
D
P
o
T
2. Dimensions A (max.) equals component width dimension plus 0.5mm
o
3. Dimension B (max.) equals component length dimension plus 0.5mm
o
E
P
2
F
W
B
o
A
o
P
K
See notes 2 & 3 regarding dimensions
A
and B
o
o
PUNCHED CARRIER TAPE DIMENSIONS (mm)
T1
T2
Mounting
Hole
Type
Ao
Bo
W
F
E
P1
P0
D0
max.
0.27
0.45
max.
0.36
0.80
01005 0.25 ± 0.04 0.45 ± 0.04
0201 0.37 ± 0.03 0.67 ± 0.05
0402 0.65 ± 0.05 1.15 ± 0.05
0603
0805 1.65 ± 0.2
1206 2.0 ± 0.2
2.0 ± 0.05
Angular
Punch
Hole
1.5
+0.1/-0.0
8.0 ± 0.3 3.5 ± 0.05 1.75 ± 0.1
4.0 ± 0.1
1.1 ± 0.2
1.9 ± 0.2
2.4 ± 0.2
3.6 ± 0.2
1.1
1.4
4.0 ± 0.10
PUNCHED CARRIER TAPE
D
P
o
t1
E
F
B
W
o
®
t2
A
o
P1
Component
Pitch
NIC COMPONENTS CORP. www.niccomp.com www.lowESR.com www.RFpassives.com www.SMTmagnetics.com
6
SPECIFICATIONS ARE SUBJECT TO CHANGE
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