NJSB107T [NICHIA]
TYPE BLUE LED; 键入蓝色LED
| 型号： | NJSB107T |
| 厂家： | 
NICHIA CORPORATION |
| 描述： | TYPE BLUE LED |
| 文件： | 总17页 (文件大小：596K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Nichia STS-DA1-0053
<Cat.No.071228>
SPECIFICATIONS FOR NICHIA CHIP TYPE BLUE LED
MODEL : NJSB107T
NICHIA CORPORATION
Nichia STS-DA1-0053
<Cat.No.071228>
1.SPECIFICATIONS
(1) Absolute Maximum Ratings
Item
(Tc=25°C)
Symbol
IF
Absolute Maximum Rating
Unit
mA
Forward Current
500
800
Pulse Forward Current
Allowable Reverse Current
Power Dissipation
IFP
mA
IR
85
mA
PD
2.2
W
Operating Temperature
Storage Temperature
Dice Temperature
Topr
Tstg
Tj
-40 ~ + 85
-40 ~ +100
130
°C
°C
°C
Soldering Temperature
Tsld
Reflow Soldering : 260°C
for 10sec.
<
<
IFP Conditions
:
Pulse Width
10msec. and Duty
1/10
=
=
(2) Initial Electrical/Optical Characteristics
Item Symbol Condition
Forward Voltage
Luminous Flux
(Tc=25°C)
Typ.
Max.
Unit
V
VF
φv
-
IF=350[mA]
IF=350[mA]
(3.7)
(18)
4.4
-
-
-
lm
-
x
y
IF=350[mA] 0.133
IF=350[mA] 0.075
½
Chromaticity Coordinate
-
-
½ Please refer to CIE 1931 chromaticity diagram.
(3) Ranking
(Tc=25°C)
Unit
Item
Symbol
Condition
Min.
4.0
Max.
4.4
Rank H
Rank M
Rank L
Forward Voltage
VF
IF=350[mA]
V
3.6
4.0
3.2
3.6
Rank P9
Rank P8
Rank P7
Rank P6
Rank P5
21.4
18.0
15.1
12.7
10.7
25.5
21.4
18.0
15.1
12.7
Luminous Flux
φv
IF=350[mA]
lm
½ Forward Voltage Measurement allowance is ± 3%.
½ Luminous Flux Measurement allowance is ± 10%.
Color Rank
(IF=350mA,Tc=25°C)
Rank W
x
y
0.11
0.04
0.11
0.10
0.15
0.10
0.15
0.04
½ Color Coordinates Measurement allowance is ± 0.01.
½ Basically, a shipment shall consist of the LEDs of a combination of the above ranks.
The percentage of each rank in the shipment shall be determined by Nichia.
-1-
Nichia STS-DA1-0053
<Cat.No.071228>
2.INITIAL OPTICAL/ELECTRICAL CHARACTERISTICS
Please refer to “CHARACTERISTICS” on the following pages.
3.OUTLINE DIMENSIONS AND MATERIALS
Please refer to “OUTLINE DIMENSIONS” on the following page.
Package
Encapsulating Resin
Electrodes
:
:
:
:
Ceramics
Silicone Resin
Au Plating
Material as follows ;
Die Heat sink
Ag Plating Copper
4.PACKAGING
· The LEDs are packed in cardboard boxes after taping.
Please refer to “TAPING DIMENSIONS” and “PACKING” on the following pages.
The label on the minimum packing unit shows ; Part Number, Lot Number, Ranking, Quantity
· In order to protect the LEDs from mechanical shock, we pack them in cardboard boxes for transportation.
· The LEDs may be damaged if the boxes are dropped or receive a strong impact against them,
so precautions must be taken to prevent any damage.
· The boxes are not water resistant and therefore must be kept away from water and moisture.
· When the LEDs are transported, we recommend that you use the same packing method as Nichia.
5.LOT NUMBER
The first six digits number shows lot number.
The lot number is composed of the following characters;
ꢀꢁꢂꢂꢂꢂ- Uꢃꢄ
ꢀ - Year
( 7 for 2007, 8 for 2008 )
ꢁ - Month ( 1 for Jan., 9 for Sep., A for Oct., B for Nov. )
ꢂꢂꢂꢂ - Nichia's Product Number
U - Ranking by Color Coordinates
ꢃ - Ranking by Luminous Flux
ꢄ - Ranking by Forward Voltage
-2-
Nichia STS-DA1-0053
<Cat.No.071228>
6.RELIABILITY
(1) TEST ITEMS AND RESULTS
Standard
Test Method
JEITA ED-4701 Tsld=260°C, 10sec.
Number of
Test Item
Resistance to
Test Conditions
Note
Damaged
0/22
2 times
Soldering Heat
(Reflow Soldering)
Solderability
300 301
(Pre treatment 30°C,70%,168hrs.)
JEITA ED-4701 Tsld=215 ± 5°C, 3sec.
1 time
0/22
0/22
0/22
0/22
0/22
0/22
0/22
0/22
0/22
0/22
0/22
0/22
(Reflow Soldering)
300 303
JEITA ED-4701 0°C ~ 100°C
300 307 15sec. 15sec.
JEITA ED-4701 -40°C ~ 25°C ~ 100°C ~ 25°C
100 105 30min. 5min. 30min. 5min.
Moisture Resistance Cyclic JEITA ED-4701 25°C ~ 65°C ~ -10°C
200 203 90%RH 24hrs./1cycle
(Lead Solder)
over 95%
20 cycles
Thermal Shock
Temperature Cycle
100 cycles
10 cycles
1000 hrs.
1000 hrs.
1000 hrs.
1000 hrs.
1000 hrs.
500 hrs.
High Temperature Storage
JEITA ED-4701 Ta=100°C
200 201
Temperature Humidity
Storage
JEITA ED-4701 Ta=60°C, RH=90%
100 103
Low Temperature Storage
JEITA ED-4701 Ta=-40°C
200 202
Steady State Operating Life
Ta=25°C, IF=500mA
Tested with Nichia standard circuit board.ꢅ
Steady State Operating Life
of High Temperature
Ta=85°C, IF=220mA
Tested with Nichia standard circuit board.ꢅ
60°C, RH=90%, IF=350mA
Steady State Operating Life
of High Humidity Heat
Steady State Operating Life
of Low Temperature
Tested with Nichia standard circuit board.ꢅ
Ta=-40°C, IF=350mA
1000 hrs.
1 time
Tested with Nichia standard circuit board.ꢅ
JEITA ED-4701 Solvent : Isopropyl Alcohol
Permanence of Marking
500 501
Solvent Temperature : 20 ~ 25°C
Dipping Time : 5 min.
Vibration
JEITA ED-4701 100 ~ 2000 ~ 100Hz Sweep 4min.
48min.
0/22
0/22
400 403
200m/s2
3directions, 4cycles
Electrostatic Discharges
JEITA ED-4701 R=1.5kΩ, C=100pF
300 304 Test Voltage=2kV
3 times
Negative/Positive
ꢅThermal resistance of LED with Nichia standard circuit board : Rja ≒ 45°C/W
Nichia standard circuit board : FR4, t=1.6mm, Copper foil, t=0.07mm
(2) CRITERIA FOR JUDGING DAMAGE
Criteria for Judgement
Min.
Max.
Item
Symbol Test Conditions
Forward Voltage
Luminous Flux
VF
φv
IF=350mA
IF=350mA
-
Initial Level ꢂ1.1
Initial Level ꢂ0.7
-
ꢅThe test is performed after the board is cooled down to the room temperature.
-3-
Nichia STS-DA1-0053
<Cat.No.071228>
7.CAUTIONS
(1) Moisture Proof Package
· When moisture is absorbed into the SMT package it may vaporize and expand during soldering.
There is a possibility that this can cause exfoliation of the contacts and damage the optical
characteristics of the LEDs.
to a minimum in the package.
For this reason, the moisture proof package is used to keep moisture
· The moisture proof package is made of an aluminum moisture proof bag. A package of
a moisture absorbent material (silica gel) is inserted into the aluminium moisture proof bag.
The silica gel changes its color from blue to pink as it absorbs moisture.
(2) Storage
· Storage Conditions
Before opening the package :
The LEDs should be kept at 30°C or less and 90%RH or less. The LEDs should be used within
a year.
When storing the LEDs, moisture proof packaging with absorbent material (silica gel)
is recommended.
After opening the package :
The LEDs should be kept at 30°C or less and 70%RH or less. The LEDs should be soldered
within 168 hours (7days) after opening the package.
stored in the moisture proof packages, such as sealed containers with packages of moisture
absorbent material (silica gel). It is also recommended to return the LEDs to the original
If unused LEDs remain, they should be
moisture proof bag and to reseal the moisture proof bag again.
· If the moisture absorbent material (silica gel) has faded away or the LEDs have exceeded the storage
time, baking treatment should be performed using the following condition.
Baking treatment : more than 24 hours at 65 ± 5°C
· This product has silver plated metal parts that are inside and/or outside the package body. The silver
plating becomes tarnished when being exposed to an environment which contains corrosive gases.
Any LED with tarnished leads may lead to poor solderability and deterioration of optical characteristics.
Please do not expose the LEDs to corrosive atmosphere during storage.
· After assembly and during use, silver plating can be affected by the corrosive gases emitted by
components and materials in close proximity of the LEDs within an end product, and the gases entering
into the product from the external atmosphere. The above should be taken into consideration when
designing.
· Please avoid rapid transitions in ambient temperature, especially in high humidity environments where
condensation can occur.
-4-
Nichia STS-DA1-0053
<Cat.No.071228>
(3) Static Electricity
· Static electricity or surge voltage damages the LEDs.
It is recommended that a wrist band or an anti-electrostatic glove be used when handling the LEDs.
· All devices, equipment and machinery must be properly grounded. It is recommended that precautions
be taken against surge voltage to the equipment that mounts the LEDs.
· When inspecting the final products in which LEDs were assembled, it is recommended to check
whether the assembled LEDs are damaged by static electricity or not.
It is easy to find
static-damaged LEDs by a light-on test or a VF test at a lower current (below 1mA is recommended).
· Damaged LEDs will show some unusual characteristics such as the forward voltage becomes lower,
or the LEDs do not light at the low current.
Criteria : (VF > 2.0V at IF=0.5mA)
(4) Application Design Considerations
· In designing a circuit, the current through each LED must not exceed its absolute maximum rating.
It is recommended to use Circuit B which regulates the current flowing through each LED.
In the meanwhile, when driving LEDs with a constant voltage in Circuit A, the current through
the LEDs may vary due to the variation in forward voltage (VF) of the LEDs. In the worst case,
some LED may be subjected to stresses in excess of the absolute maximum rating.
(B)
(A)
· Thermal design of the end product is of paramount importance.
Please consider the heat generation
of the LED when making the system design. The coefficient of temperature increase per input
electric power is affected by the thermal resistance of the circuit board and density of LED placement
on the board, as well as other components. It is necessary to avoid intense heat generation and operate
within the maximum ratings given in this specification.
· Please determine the operating current with consideration of the ambient temperature local to the LED
and refer to the plot of Ambient temperature vs. Allowable Forward Current on CHARACTERISTICS
in this specifications. Please also take measures to remove heat from the area near the LED (heat sink)
to improve the operational characteristics of the LED.
· The equation 1indicates correlation between Tj and Ta, and the equation 2indicates correlation
between Tj and Tc.
Tj=Ta + RjaꢆW
1
Tj=Tc + RjcꢆW
2
ꢅTj = Dice Temperature : °C, Ta = Ambient Temperature : °C,
Tc = Die Heat sink Temperature : °C,
Rja = Heat resistance from Dice to Ambient temperature : °C /W,
Rjc = Heat resistance from Dice to Tc measuring point ≒ 10°C /W,
W = Inputting Power (IF ꢂVF) : W
-5-
Nichia STS-DA1-0053
<Cat.No.071228>
· Warpage of circuit board with soldered LEDs may result in damage or package breakage of the LEDs.
Please pay special attention to the orientation of the LEDs as to avoid LED failure caused by bow, twist
and warpage of the board.
【Non-preferable】
【Preferable】
Cathode mark
Cathode mark
Solder connections
Solder connections
When mechanical stress from the board affects the soldered LED, place the LED in the preferable
location and orientation as shown above.
· Depending on the position and direction of LED, the mechanical stress on the LED package can be
changed. Refer to the following figure.
E
D
C
Perforated line
A
B
Slit
Stress : A > B = C > D > E
· When separating the circuit boards with soldered LEDs, please use appropriate tools and equipment.
Hand brake without these tools and equipment may not be used.
· The use of aluminum substrate increases stress to solder joints due to thermal expansion of substrate and
subsequently may result in solder joint crack. Users may need to evaluate their specific application to
determine any impact due to the use of aluminum substrate.
-6-
Nichia STS-DA1-0053
<Cat.No.071228>
(5) Handling Precautions
· Bare Hand
When handling the product, touching encapsulant with bare hands will contaminate its surface that could
affects on optical characteristics. In the worst cases, excessive force to the encapsulant by hands might
result in catastrophic failure of the LEDs due to wire deformation and/or breakage.
· Tweezers
When handling it with tweezers, the product should only be held by the ceramic body, not by the
encapsulant. Failure to comply might result in chip-out and/or delamination of encapsulant, and in the
worst cases, catastrophic failure of the LEDs due to wire deformation and/or breakage.
Encapsulant
Ceramic body
· Pick and Place
Recommended conditions : Area of outer nozzle ≥ 2 mm2
(more than 30% of encapsulant top surface)**
Contact area of nozzle with encapsulant ≥ 0.9 mm2
(15 to 85% of encapsulant top surface)**
Placement pressure ≤ 3N/mm2 *max. force : 5N
Vacuum pressure ≤ 7.8N/ cm2 (≤ 0.8 kgf/cm2)
**For reference.
Failure to comply might result in damage to encapsulant and in the worst cases,
catastrophic failure of the LEDs due to wire deformation and/or breakage.
-7-
Nichia STS-DA1-0053
<Cat.No.071228>
· Printed Circuit Board Assembled (PCB with LEDs soldered)
Do not stack assembled PCBs together. Since silicone is a soft material, abrasion between two PCB
assembled with silicone encapsulated LED might cause catastrophic failure of the LEDs due to damage
to encapsulant (such as scratch, chip-out and delamination) and wire (such as deformation and breakage)
and LED detachment.
-8-
Nichia STS-DA1-0053
<Cat.No.071228>
(6) Soldering Conditions
· The LEDs can be soldered in place using the reflow soldering method.
Nichia cannot make a
guarantee on the LEDs after they have been assembled using the dip or hand soldering method.
· Recommended soldering conditions
Reflow Soldering
Lead Solder
120 ~ 150°C
Lead-free Solder
180 ~ 200°C
Pre-heat
Pre-heat time
Peak
120 sec. Max.
240°C Max.
120 sec. Max.
260°C Max.
temperature
Soldering time
Condition
10 sec. Max.
refer to
10 sec. Max.
refer to
Temperature - profile 1. Temperature - profile 2.
(N2 reflow is recommended.)
ꢀ Although the recommended soldering conditions are specified in the above table, reflow
soldering at the lowest possible temperature is desirable for the LEDs.
ꢀ A rapid-rate process is not recommended for cooling the LEDs down from the peak temperature.
[Temperature-profile (Surface of circuit board)]
Use the conditions shown to the under figure.
<1 : Lead Solder>
<2 : Lead-free Solder>
1 ~ 5°C / sec.
2.5 ~ 5°C / sec.
260°C Max.
240°C Max.
10sec. Max.
Pre-heating
10sec. Max.
Pre-heating
2.5 ~ 5°C / sec.
1 ~ 5°C / sec.
120 ~ 150°C
180 ~ 200°C
60sec.Max.
60sec.Max.
Above 220°C
Above 200°C
120sec.Max.
120sec.Max.
[Recommended soldering pad design]
Use the following conditions shown in the figure.
4.0
2.8
(Unit : mm)
1.8
4-R0.3
· Occasionally there is a brightness decrease caused by the influence of heat or ambient atmosphere
during air reflow. It is recommended that the User use the nitrogen reflow method.
· Repairing should not be done after the LEDs have been soldered. When repairing is unavoidable,
a hot plate should be used. It should be confirmed beforehand whether the characteristics of the LEDs
will or will not be damaged by repairing.
· Reflow soldering should not be done more than two times.
· Die Heat sink is to be soldered.
If not, please use the heat conductive adhesive.
· When soldering, do not put stress on the LEDs during heating.
· After soldering, do not warp the circuit board.
-9-
Nichia STS-DA1-0053
<Cat.No.071228>
(7) Cleaning
· It is recommended that isopropyl alcohol be used as a solvent for cleaning the LEDs.
other solvents, it should be confirmed beforehand whether the solvents will dissolve the package and the
resin or not. Freon solvents should not be used to clean the LEDs because of worldwide regulations.
· Do not clean the LEDs by the ultrasonic. When it is absolutely necessary, the influence of ultrasonic
When using
cleaning on the LEDs depends on factors such as ultrasonic power and the assembled condition.
Before cleaning, a pre-test should be done to confirm whether any damage to the LEDs will occur.
(8) Others
· NJSB107 complies with RoHS Directive.
· The LED light output is strong enough to injure human eyes. Precautions must be taken to prevent
looking directly at the LEDs with unaided eyes for more than a few seconds.
· Flashing lights have been known to cause discomfort in people; you can prevent this by taking
precautions during use. Also, people should be cautious when using equipment that has had LEDs
incorporated into it.
· The LEDs described in this brochure are intended to be used for ordinary electronic equipment (such
as office equipment, communications equipment, measurement instruments and household appliances).
Consult Nichia’s sales staff in advance for information on the applications in which exceptional quality
and reliability are required, particularly when the failure or malfunction of the LEDs may directly
jeopardize life or health (such as for airplanes, aerospace, submersible repeaters, nuclear reactor
control systems, automobiles, traffic control equipment, life support systems and safety devices).
· User shall not reverse engineer by disassembling or analysis of the LEDs without having prior written
consent from Nichia.
When defective LEDs are found, the User shall inform Nichia directly before
disassembling or analysis.
· The formal specifications must be exchanged and signed by both parties before large volume purchase begins.
· The appearance and specifications of the product may be modified for improvement without notice.
-10-
Nichia STS-DA1-0053
<Cat.No.071228>
ICI Chromaticity Diagram
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
520
530
540
510
550
560
570
500
580
590
600
610
620
630
490
480
W
470
460
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
x
½ Color Coordinates Measurement allowance is ± 0.01.
-11-
ꢀ Forward Voltage vs.
ꢀ Forward Current vs.
ꢀ Duty Ratio vs.
Allowable Forward Current
Forward Current
Relative Luminous Flux
1000
2.5
1000
800
800
Ta=25°C
Ta=25°C
2.0
350
500
Ta=25°C
1.5
1.0
0.5
0
100
50
200
100
10
0
200 400 600
Forward Current IFP (mA)
1000
1
5
10 20
50 100
800
2.5 3.0 3.5 4.0 4.5 5.0
Forward Voltage VF (V)
Duty Ratio (%)
ꢀ Ambient Temperature vs.
ꢀ Ambient Temperature vs.
ꢀ Ambient Temperature vs.
Forward Voltage
Relative Luminous Flux
Allowable Forward Current
5.0
2.0
600
Thermal resistance
Rja=45°C/W
IFP=350mA
4.5
IFP=350mA
500
1.0
0.5
400
4.0
3.5
3.0
300
227
100
0
0.2
2.5
-60 -40 -20 0 20 40 60 80 100
-60 -40 -20 0 20 40 60 80 100
Ambient Temperature Ta (°C)
0
20
40
60
80 100
Ambient Temperature Ta (°C)
Ambient Temperature Ta (°C)
Model
NJSB107
Title
No.
CHARACTERISTICS
071031703101
NICHIA CORPORATION
ꢀ Forward Current vs.
ꢀ Spectrum
Chromaticity Coordinate (λD)
0.11
1.2
1.0
0.8
0.6
0.4
0.2
Ta=25°C
0.10
Ta=25°C
IFP=350mA
20mA(473.3nm)
0.09
100mA(472.0nm)
0.08
350mA(470.7nm)
500mA(470.3nm)
800mA(469.9nm)
0.07
0.06
0
0.11 0.12 0.13 0.14 0.15 0.16
350
450
550
650
Wavelength λ (nm)
x
ꢀ Ambient Temperature vs.
ꢀ Forward Current vs.
ꢀ Directivity
Dominant Wavelength
Dominant Wavelength
0°
10°
476
1.0
20°
476
30°
Ta=25°C
IFP=350mA
474
40°
474
50°
472
470
468
466
472
470
468
60°
70°
80°
0.5
Ta=25°C
IFP=300mA
466
0
90°
1.0
90°
60°
30°
0°
0.5
10
100
1000
-60 -40 -20 0 20 40 60 80 100
Radiation Angle
Ambient Temperature Ta (°C)
Forward Current IFP (mA)
Model
NJSB107
Title
No.
CHARACTERISTICS
071031703111
NICHIA CORPORATION
3.5
2.8
1.5
0.8
Cathode mark
Die Heat sink
Cathode
2
4-R4
2.9 ± 0.1
3.3 ± 0.1
Anode
A
K
Protection device
ITEM
MATERIALS
Ceramics
PACKAGE
ENCAPSULATING RESIN
ELECTRODES
Silicone Resin
Au Plating
DIE HEAT SINK
Ag Plating Copper
Note 1) NJSB107 has a protection device built in as a protection
circuit against static electricity.
Note 2) The die heat sink is electrically neutral.
Unit
mm
Model
Title
NJSB107
8/1
Scale
Allow
±0.2
OUTLINE DIMENSIONS
071031703121
NICHIA CORPORATION
No.
+0
15.4±1
φ 180
-3
Taping part
Reel part
+1
13
-0
2±0.05 4±0.1
8±0.1
+0.1
0.2±0.05
φ 1.5
-0
Cathode mark
2±0.1
+0.2
φ 1.5
-0
Label
XXXX LED
3.85±0.1
TYPE NJSx107T
LOT xxxxxx-Uz
Reel End of tape
No LEDs
QTY
pcs
RoHS
LEDs mounting part
No LEDs
Pull direction
Top cover
tape
Embossed carrier tape
Reel Lead Min.100mm (No LEDs)
Reel Lead Min.400mm
Reel Lead Min.160mm (No LEDs)
1,200pcs/Reel
Unit
mm
NJSx107T
Model
Title
Taping is based on the JIS C 0806 : Packaging of Electronic
Components on Continuous Tapes.
TAPING DIMENSIONS
070711767921
NICHIA CORPORATION
Scale
Allow
No.
Nichia STS-DA1-0053
<Cat.No.071228>
The reel and moisture absorbent material are put in the moisture proof foil bag
and then heat sealed.
Reel
Label
NICHIA
Seal
XXXX LED
TYPE
LOT
QTY
NJSx107T
xxxxxx-Uz
PCS
RoHS
NICHIA CORPORATION
491 OKA, KAMINAKA, ANAN, TOKUSHIMA, JAPAN
Moisture proof foil bag
Moisture
absorbent material
The box is partitioned with the
cardboard.
Label
NICHIA
XXXX LED
NJSx107T
Uz
Nichia LED
TYPE
RANK
QTY
RoHS
PCS
NICHIA CORPORATION
491 OKA, KAMINAKA, ANAN, TOKUSHIMA, JAPAN
Packing unit
Reel/bag
1reel
Quantity/bag (pcs)
1,200 MAX.
Moisture proof foil bag
Cardboard box
Cardboard box S
Cardboard box M
Cardboard box L
Dimensions (mm)
291¯237¯120¯8t
259¯247¯243¯5t
444¯262¯259¯8t
Reel/box
Quantity/box (pcs)
6,000 MAX.
5reel MAX.
10reel MAX.
20reel MAX.
12,000 MAX.
24,000 MAX.
Model
Title
NJSx107T
PACKING
NICHIA CORPORATION
No.
070628767931
-16-
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