16T06A-B [NELLSEMI]

TRIACs, 16A Snubberless, Logic Level and Standard; 三端双向可控硅, 16A无缓冲器,逻辑层次和水平
16T06A-B
型号: 16T06A-B
厂家: NELL SEMICONDUCTOR CO., LTD    NELL SEMICONDUCTOR CO., LTD
描述:

TRIACs, 16A Snubberless, Logic Level and Standard
三端双向可控硅, 16A无缓冲器,逻辑层次和水平

可控硅 三端双向交流开关
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RoHS  
RoHS  
16T Series  
SEMICONDUCTOR  
TRIACs, 16A  
Snubberless, Logic Level and Standard  
Features  
Medium current Triac  
Low thermal resistance with clip bonding  
Low thermal resistance insulation ceramic  
for insulated 16T  
TO-263 (D²PAK)  
High commutation (4Q) or very high  
commutation (3Q) capability  
(16Txx H)  
RoHS compliant, UL certified (File NO:E320098)  
Insulated tab (16TxxAI series, rated at 2500 VRMS)  
A2  
Applications  
Snubberless versions (With Suffix W)  
especially recommended for use on  
inductive loads, because of their high  
commutation performances  
A1  
A2  
1
2
3
G
TO-220AB (non-Insulated)  
TO-220AB (lnsulated)  
(16Txx A)  
(16Txx AI)  
On/off or phase angle function in applications  
such as static relays, light dimmers and  
appliance motor speed controllers  
Description  
Available either in through-hole or surface-mount  
packages, the 16TxxA and 16TxxAl triacs series are  
suitable for general purpose mains power AC switcging  
SYMBOL  
VALUE  
UNIT  
A
IT(RMS)  
16  
VDRM/VRRM  
IGT(Q1)  
to  
V
5 to 50  
mA  
Device summary  
16TxxA  
PARAMETER  
16TxxAI(1)  
SYMBOL  
IT(RMS)  
On-state RMS current  
16  
16  
Repetitive peak off-state voltage  
Triggering gate current  
600/800/1000  
35/50  
600/800/1000  
35/50  
VDRM VRRM  
/
IGT(Snubberless)  
IGT(logic level)  
Triggering gate current  
Triggering gate current  
10  
10  
IGT(standard)  
25/50  
25/50  
Note 1: Insulated  
www.nellsemi.com  
Page 1 of 7  
RoHS  
RoHS  
16T Series  
SEMICONDUCTOR  
ABSOLUTE MAXIMUM RATINGS  
PARAMETER  
SYMBOL  
TEST CONDITIONS  
VALUE  
UNIT  
Tc = 110ºC  
Tc = 86ºC  
TO-220/TO-263  
IT(RMS)  
RMS on-state current (full sine wave)  
A
16  
TO-220insulate  
F =50 Hz  
t = 20 ms  
160  
168  
128  
Non repetitive surge peak on-state  
ITSM  
A
current (full cycle, T initial = 25°C)  
j
t = 16.7 ms  
F =60 Hz  
I2t Value for fusing  
I2t  
A2s  
t
= 10 ms  
p
Critical rate of rise of on-state current  
IG = 2xlGT, tr≤100ns  
A/µs  
dI/dt  
50  
F =100 Hz  
Tp =20 µs  
Tj =125ºC  
Tj =125ºC  
Peak gate current  
IGM  
4
1
A
PG(AV)  
Tj =125ºC  
Average gate power dissipation  
Storage temperature range  
Operating junction temperature range  
W
Tstg  
Tj  
- 40 to + 150  
- 40 to + 125  
ºC  
ELECTRICAL CHARACTERISTICS (TJ= 25 ºC unless otherwise specified)  
SNUBBERLESS and Logic level (3 quadrants)  
16Txxxx  
QUADRANT  
SYMBOL  
TEST CONDITIONS  
Unit  
SW  
CW  
35  
BW  
(1)  
IGT  
I - II - III  
I - II - III  
MAX.  
MAX.  
10  
50  
mA  
V
VD = 12 V, RL = 33Ω  
VGT  
1.3  
VD = VDRM, RL = 3.3KΩ  
Tj = 125°C  
VGD  
MIN.  
MAX.  
MAX.  
MIN.  
I - II - III  
0.2  
40  
V
(2)  
IT = 500 mA  
IH  
mA  
15  
25  
30  
55  
I - III  
50  
60  
70  
80  
IG = 1.2 IGT  
IL  
mA  
II  
dV/dt(2)  
VD = 67% VDRM gate open ,Tj = 125°C  
,
V/µs  
40  
500  
1000  
(dV/dt)c = 0.1 V/µs  
(dV/dt)c = 10 V/µs  
-
-
-
-
Tj = 125°C  
Tj = 125°C  
Tj = 125°C  
8.5  
3
(dI/dt)c(2)  
MIN.  
A/ms  
-
Without snubber  
8.5  
14  
Note 1: Minimum lGT is guaranted at 5% of lGT max.  
Note 2: For both polarities of A2 referenced to A1.  
www.nellsemi.com  
Page 2 of 7  
RoHS  
RoHS  
16T Series  
SEMICONDUCTOR  
ELECTRICAL CHARACTERISTICS (TJ= 25 ºC unless otherwise specified)  
Standard (4 quadrants)  
16Txxxx  
TEST CONDITIONS  
SYMBOL  
UNIT  
QUADRANT  
C
B
25  
50  
50  
I - II - III  
(1)  
IGT  
MAX.  
mA  
VD = 12 V, RL = 33Ω  
IV  
100  
VGT  
VGD  
1.3  
0.2  
V
V
ALL  
ALL  
VD = VDRM, RL = 3.3KΩ, Tj = 125°C  
IT = 500 mA  
(2)  
mA  
IH  
MAX.  
MAX.  
25  
50  
I - III - IV  
40  
60  
IL  
IG = 1.2 IGT  
mA  
80  
120  
II  
dV/dt(2)  
VD = 67% VDRM, gate open, Tj = 125°C  
(dI/dt)c = 7 A/ms, Tj = 125°C  
V/µs  
V/µs  
MIN.  
MIN.  
200  
5
400  
10  
(dV/dt)c(2)  
STATIC CHARACTERISTICS  
SYMBOL  
TEST CONDITIONS  
UNIT  
V
VALUE  
1.55  
0.85  
25  
(2)  
ITM = 22.5 A, tP = 380 µs  
Threshold voltage  
Tj = 25°C  
VTM  
MAX.  
MAX.  
MAX.  
(2)  
Tj = 125°C  
Vt0  
V
(2)  
Dynamic resistance  
Rd  
Tj = 125°C  
Tj = 25°C  
mΩ  
µA  
5
IDRM  
IRRM  
VD = VDRM  
VR = VRRM  
MAX.  
Tj = 125°C  
1
mA  
Note 1: Minimum lGT is guaranted at 5% of lGT max.  
Note 2: For both polarities of A2 referenced to A1.  
THERMAL RESISTANCE  
UNIT  
SYMBOL  
VALUE  
TO-220AB, D²PAK  
TO-220AB Insulated  
D²PAK  
1.2  
2.1  
45  
60  
Rth(j-c)  
Rth(j-a)  
Junction to case (AC)  
°C/W  
S(1)=1cm²  
Junction to ambient  
°C/W  
TO-220AB Insulated, TO-220AB  
Note 1: S=Copper surface under tab  
PRODUCT SELECTOR  
VOLTAGE (xx)  
PART NUMBER  
SENSITIVITY  
TYPE  
PACKAGE  
1000 V  
600 V  
800 V  
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
50 mA  
50 mA  
25 mA  
35 mA  
10 mA  
10 mA  
35 mA  
Standard  
TO-220AB  
TO-220AB  
TO-220AB  
TO-220AB  
TO-220AB  
D²PAK  
16TxxA-B/16TxxAl-B  
16TxxA-BW/16TxxAl-BW  
16TxxA-C/16TxxAl-C  
Snubberless  
Standard  
Snubberless  
Logic level  
Logic level  
16TxxA-CW/16TxxAl-CW  
16TxxA-SW/16TxxAl-SW  
16TxxH-SW  
16TxxH-CW  
Snubberless  
D²PAK  
www.nellsemi.com  
Page 3 of 7  
RoHS  
RoHS  
16T Series  
SEMICONDUCTOR  
ORDERING INFORMATION  
,
WEIGHT  
2.0g  
PACKAGE  
DELIVERY MODE  
ORDERING TYPE  
MARKING  
BASE Q TY  
16TxxA-yy  
16TxxA-yy  
16TxxAI-yy  
16TxxH-yy  
TO-220AB  
50  
50  
50  
Tube  
Tube  
Tube  
16TxxAI-yy  
TO-220AB (insulated)  
2.3g  
TO-236(D2PAK)  
16TxxH-yy  
2.0g  
Note: xx = voltage, yy = sensitivity  
ORDERING INFORMATION SCHEME  
-
16  
T 06  
A
BW  
Current  
16 = 16A  
Triac series  
Voltage  
06 = 600V  
08 = 800V  
10 = 1000V  
Package type  
A = TO-220AB (non-insulated)  
AI = TO-220AB ( insulated)  
H = TO-263 (D²PAK)  
I
Sensitivity  
GT  
B = 50mA Standard  
C = 25mA Standard  
SW = 10mA Logic Level  
BW = 50mA Snubberless  
CW = 35mA Snubberless  
www.nellsemi.com  
Page 4 of 7  
RoHS  
RoHS  
16T Series  
SEMICONDUCTOR  
Fig.1 Maximum power dissipation versus  
on-state rms current (full cycle)  
Fig.2 On-state rms current versus case  
temperature (full cycle)  
I
18  
16  
(A)  
T(RMS)  
P(W)  
20  
18  
TO-263AB  
16  
14  
12  
10  
8
14  
12  
10  
TO-220AB  
insulated  
8
6
6
4
2
0
4
2
0
IT(RMS)(A)  
TC(°C)  
0
2
4
6
8
12  
14  
16  
10  
0
50  
100  
25  
75  
125  
Fig.3 On-state current versus ambient  
temperature (full cycle)  
Fig.4 Relative variation of thermal impedance  
versus pulse duration  
K=[Z /R  
]
th th  
IT(RMS)(A)  
4.0  
3.5  
1E+0  
printed circuit board Fr4, copper thickness:35 µm  
D²PAK  
(S=1cm²)  
Zth(j-c)  
3.0  
2.5  
Zth(j-a)  
1E-1  
2.0  
1.5  
1.0  
0.5  
0.0  
Tc(°c)  
tp(s)  
1E+0  
1E-2  
0
25  
50  
75  
100  
125  
1E-3  
1E-2  
1E-1  
1E+1  
1E+2  
5E+2  
Fig.6 surge peak on- state current versus  
number of cycles  
Fig.5 On-state characteristics (maximum values)  
I
(A)  
ITSM(A)  
TM  
180  
160  
140  
120  
100  
80  
200  
100  
Tj max.  
Vto=0.85V  
Rd=25mΩ  
t=20ms  
One cycle  
Non repetitive  
Tjinitial=25°C  
Tj=Tjmax.  
Tj=25°c  
Repetitive  
Tc=85°C  
10  
60  
40  
20  
0
VTM (V)  
Number of cycles  
1
0.5  
1.0  
1.5  
2.0  
2.5  
3.0  
3.5  
4.0  
4.5  
5.0  
1
10  
1000  
100  
www.nellsemi.com  
Page 5 of 7  
RoHS  
RoHS  
16T Series  
SEMICONDUCTOR  
Fig7. Non-repetitive surge peak on-state  
current for a sinusoidal  
Fig.8 Relative variation of gate trigger current  
ITSM(A), I²t(A²S)  
IGT,IH,IL[Tj] / IGT,IH,IL[Tj = 25°C]  
3000  
2.5  
2.0  
Tj initial=25°C  
holding current and latching current versus junction  
dl/dt limitation:  
50A/µs  
temperature (typical values)  
IGT  
1000  
lTSM  
1.5  
1.0  
IH&IL  
0.5  
0.0  
pulse with width tp<10ms and  
corresponding value of l²t  
l²t  
Tj(°C)  
100  
0.01  
0.10  
1.00  
10.00  
-40  
-20  
0
20  
40  
60  
80  
100  
120 140  
tp(ms)  
Fig.9 Relative variation of critical rate of  
decrease of main current versus  
(dV/dt)c (typical values)  
Fig.10 Relative variation of critical rate of  
decrease of main current versus  
(dV/dt)c (typical values)  
(dI/dt)c [(dV/dt)c] / Specified (dI/dt)c  
(dI/dt)c [T s  
(dI/dt)c [T ] /  
pecified]  
j
j
2.0  
1.8  
1.6  
1.4  
1.2  
1.0  
6
5
4
3
2
1
0
snubberless and Logic level types  
standard types  
SW  
C
B
CW/BW  
0.8  
0.6  
Tj(°C)  
(dV/dt)c (V/µs)  
0.4  
1.0  
10.0  
100.0  
0
25  
50  
75  
100  
0.1  
125  
Fig.11 D²PAK thermal resistance junction to ambient versus  
copper surface under tab (printed circuit FR4, copper  
thickness: 35µm  
Rth(j-a)(°C/W)  
80  
70  
60  
50  
40  
D²PAK  
30  
20  
10  
0
S(cm²)  
0
4
8
12  
16  
20  
24  
28  
32  
36  
40  
www.nellsemi.com  
Page 6 of 7  
RoHS  
RoHS  
16T Series  
SEMICONDUCTOR  
Case Style  
TO-220AB  
10.54 (0.415) MAX.  
4.70 (0.185)  
9.40 (0.370)  
9.14 (0.360)  
3.91 (0.154)  
3.74 (0.148)  
4.44 (0.1754)  
1.39 (0.055)  
1.14 (0.045)  
2.87 (0.113)  
2.62 (0.103)  
3.68 (0.145)  
3.43 (0.135)  
15.32 (0.603)  
14.55 (0.573)  
16.13 (0.635)  
15.87 (0.625)  
PIN  
8.89 (0.350)  
8.38 (0.330)  
1
2
3
4.06 (0.160)  
3.56 (0.140)  
29.16 (1.148)  
28.40 (1.118)  
2.79 (0.110)  
2.54 (0.100)  
1.45 (0.057)  
1.14 (0.045)  
14.22 (0.560)  
13.46 (0.530)  
2.67 (0.105)  
2.41 (0.095)  
0.90 (0.035)  
0.70 (0.028)  
5.20 (0.205)  
4.95 (0.195)  
2.65 (0.104)  
2.45 (0.096)  
0.56 (0.022)  
0.36 (0.014)  
TO-263(D2PAK)  
10.45 (0.411)  
9.65 (0.380)  
4.83 (0.190)  
4.06 (0.160)  
1.40 (0.055)  
1.14 (0.045)  
6.22 (0.245)  
1.40 (0.055)  
1.19 (0.047)  
9.14 (0.360)  
8.13 (0.320)  
15.85 (0.624)  
15.00 (0.591)  
0 to 0.254 (0 to 0.01)  
2.79 (0.110)  
2.29 (0.090)  
0.940 (0.037)  
0.686 (0.027)  
0.53 (0.021)  
0.36 (0.014)  
2.67 (0.105)  
2.41 (0.095)  
3.56 (0.140)  
2.79 (0.110)  
5.20 (0.205)  
4.95 (0.195)  
www.nellsemi.com  
Page 7 of 7  

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