UPD7720AC [NEC]
QUARTERLY MICROPROCESSOR/MICROCOMPUTER RELIABILITY REPORT; 季度微处理器/微机可靠性报告
| 型号： | UPD7720AC |
| 厂家： | 
NEC |
| 描述： | QUARTERLY MICROPROCESSOR/MICROCOMPUTER RELIABILITY REPORT |
| 文件： | 总12页 (文件大小：60K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
NEC ELECTRONICS INC.
MAY 1999
TRQ-99-05-323
QUARTERLY
MICROPROCESSOR/MICROCOMPUTER
RELIABILITY REPORT
This report contains reliability data on microprocessor
and microcomputer devices fabricated at NEC Roseville and
assembled at NEC Roseville or NEC Singapore.
(Signatures on file)
Prepared by
D. Yee
Approved by
M. Mahal
RQC Dept.
Roseville Mfg.
RQC Dept.
Roseville Mfg.
Please refer all inquiries to:
NEC Electronics Inc.
Attn: Reliability and Quality
Assurance Department
7501 Foothills Boulevard
Roseville, CA 95747
Tel. (916) 786-3900
The information in this document is subject to change without notice. No part of this document May be copied or reproduced in any form or by any means
without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which May appear in this document. NEC
Corporation does not assume any liability for infringement of patents, copyrights, or other intellectual property rights of third parties by or arising from use of a
device described herein or any other liability arising from use of such device. No license, either express, implied, or otherwise, is granted under any patents,
copyrights, or other intellectual property rights of NEC Corporation or others. While NEC Corporation has been making a continuous effort to enhance the
reliability, of its semiconductor devices, the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or property
arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety measures in its design, such as redundancy, fire-
containment, and anti-failure features. NEC devices are classified into the following three quality grades: "Standard," "Special," and "Specific." The Specific
quality grade applies only to devices developed based on a customer-designated "quality assurance program" for a specific application. The recommended
applications of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device before using it in a particular
application. Standard: Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home
electronic appliances, machine tools, personal electronic equipment, and industrial robots. Special: Transportation equipment (automobiles, trains, ships, etc.),
traffic control systems, anti-disaster systems, anti-crime systems, safety equipment, and medical equipment (not specifically designed for life support). Specific:
Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, and life-support systems or medical equipment for life support, etc. The
quality grade of NEC devices is Standard unless otherwise specified in NEC's data sheets or data books. If customers intend to use NEC devices for
applications other than those specified for Standard quality grade, they should contact an NEC sales representative in advance. Anti-radioactive design is not
implemented in this product.
NEC Electronics Inc. is dedicated to the QCD principle
of providing the highest Quality product at the lowest
possible Cost with on-time Delivery to our customers.
NEC Electronics Inc.
Roseville Manufacturing
Table of Contents
Page
Failure Rate Prediction..................................................................................................... 3
Table 1. Reliability Tests ................................................................................................. 4
Table 2. Reliability Test Results...................................................................................... 5
Table 3. HTB Life Test Summary and Failure Rate Predictions..................................... 6
Table 4. Other Life Test Summaries (HTSL, HHSL, T/H) ............................................. 8
Table 5. Environmental and Mechanical Test Summaries (TS, T/C, PCT) .................... 9
Table 6. Failure Summaries ............................................................................................. 10
Table 7. CMOS-4 Process Family, Quarterly Reliability Data (Jan-Mar 99) ................. 11
Table 8. CMOS-5 Process Family, Quarterly Reliability Data (Jan-Mar 99) ................. 11
2
NEC Electronics Inc.
Roseville Manufacturing
Failure Rate Prediction
This report contains reliability test results of all microprocessor
devices assembled in NEC Roseville that were subjected to
routine Monitor Reliability Testing (MRT). It also contains
failure rate predictions for these devices, calculated using the
Arrhenius method shown below.
2
5
(2)
L =
X 10
2T
Where:
L
≡
≡
Failure rate in %/1000 hours
This report will be updated in September 1998.
2
The tabular value of chi-squared distribution at
a given confidence level and calculated degrees
of freedom (2f + 2, where f = number of
failures)
X
When predicting the failure rate at a certain temperature from
accelerated life test data, various values of activation energy,
corresponding to failure mechanisms, should be considered.
This procedure is done whenever exact causes of failures are
known by performing failure analysis. In some cases, however,
an average activation energy is assumed in order to accomplish
a quick first-order approximation. NEC assumes an average
activation energy of 0.7 eV for CMOS-4 and lesser
technologies and 0.45 eV for CMOS-5 and greater
technologies for such approximations. These average values
have been assessed from extensive reliability test results and
yield a conservative failure rate.
T
T Number of equivalent device hours
(Number of devices) x
(number of test hours) x
(acceleration factor)
≡
=
Another method of expressing failures is as FIT (failures in
time). One FIT is equal to one failure in 109 hours. Since L is
already expressed as %/1000 hours (10−5 failure/hr), an easy
conversion from %/1000 hours to FIT would be to multiply the
value of L by 104.
Since life testing at NEC is performed under high-temperature
ambient conditions, the Arrhenius relationship is used to
normalize failure rate predictions at a system operation
temperature of 55°C. The Arrhenius model includes the effects
of temperature and activation energy of the failure mechanisms.
This model assumes that the degradation of a performance
parameter is linear with time. The temperature dependence is
taken to be an exponential function that defines the probability
of occurrence.
Example
A sample of 960 pieces was subjected to 1000 hours at 125°C
burn-in. One reject was observed. Given that the acceleration
factor was calculated to be 34.6 using equation (1), what is the
failure rate, normalized to 55°C, using a confidence level of
60%? Express the failure rate in FIT.
The Arrhenius equation is:
Solution
For n = 2f + 2 = 2(1) + 2 = 4,
A =
exp
−E (T −T
)
(1)
A
J1 J2
2
X = 4.046.
k(T )(T
)
J1 J2
X2 105
2T
Then L =
(%/1000H)
X2 105
Where:
A
≡ Acceleration factor
E
≡ Activation energy
=
A
2 (s.s.)(test hrs)(acc. factor)
T
at T = 55°C
A1
at T = 125°C
A2
≡ Junction temperature (in K)
≡ Junction temperature (in K)
J1
T
J2
(4.046) 105
2(960)(1000)(34.6)
=
=
k
−5
≡ Boltzmann's constant = 8.62 x 10 eV/K
Because temperature dependence on power dissipation of a
particular device type cannot be ignored, junction temperatures
(T and T ) are used instead of ambient temperatures (T
0.0061 %/1000H
Therefore, FIT = (0.0061)(10 ) = 61
4
J1 J2 A1
and T ) . Also, thermal resistance of a particular device
A2
cannot be ignored. These two factors cannot be accounted for
unless junction temperatures are used. We calculate junction
temperatures using the following formula:
T = T + (Thermal Resistance) x (Power Dissipation at T )
J
A
A
From the high-temperature operating life test results, the failure
rates can be predicted at a 60% confidence level using the
following equation:
3
NEC Electronics Inc.
Roseville Manufacturing
Table 1. Reliability Tests
The major reliability tests performed by NEC consist of high-temperature bias (HTB), 85°C/85% relative humidity (T/H),
high-temperature storage life (HTSL), and high-humidity storage life (HHSL) tests. Additionally, various environmental
and mechanical tests are performed. This table shows the conditions of the various life tests, environmental tests, and
mechanical tests.
Test Item
Symbol
MIL-STD 883C Method
Condition
= 125°C,
Remarks
Note 1
High-temperature bias
life
HTB
1005
T
A
V
= 5.5 V.
CC
Note 1
High-temperature storage
life
Temperature and
humidity life
HTSL
T/H
1008
T
= 150°C.
A
Notes 1, 2
T
= 85°C,
A
RH = 85%.
= 5.5 V, alternate
V
DD
pin bias.
T = 85°C,
A
Notes 1, 2
Notes 1, 2
High-humidity storage
life
HHSL
PCT
RH = 85%.
T = 125°C,
A
Pressure cooker
RH = 100%
P = 2.3 atm.
Note 1
Note 4
Temperature cycle
Lead fatigue
T/C
LI
1010
2004
−65° to 150°C, 1 hour/
cycle.
125g (DIP) 250g (QFP),
three bends, 90°, without
breaking.
Note 5
Solderability
SD
TS
2003
T = 230°C, 5 sec, rosin-
A
based flux.
Note 3
°
Soldering heat
260 C, 10 sec, rosin
DIP
based flux.
215°C VPS
PLCC
QFP
235°C, IR reflow
10 cycles, −65° to 150°C.
15 cycles, 0° to 100°C.
Temperature cycle
Thermal shock
1010
1011
Note 1
Notes:
1. Electrical test per data sheet is performed. Devices that exceed the data sheet limits are considered rejects.
2. Pretreatment as specified.
3. MIL-STD 750A, method 2031.
4. Broken lead is considered a reject.
5. Less than 95% coverage is considered a reject.
4
NEC Electronics Inc.
Roseville Manufacturing
Table 2. Reliability Test Results
The reliability test results given in this report are representative of the following products fabricated in Roseville and
assembled in Roseville or Singapore.
Fabricated in Roseville
Assembled in Roseville
NMOS-4
D7720A
D78H11
28-pin DIP
D7720AC
D77C20AC
D77C25C
CMOS-4 CX2
D17003AH
D6701
40-pin DIP
68-pin PLCC
84-pin PLC
D70108C
D70116C
D70108
D77C20A
D77C25
D7502A
D7503A
D75004
D75108A
D75304
D75306
D75308
D75312
D75316
D75328
D17010
D70208L
D70216L
D70320L
D70325L
D70335L
64-pin QFP
80-pin QFP
D7502AGF
D7503AGF
D75304GF
D75306GF
D75308GF
D75312GF
D75316GF
CMOS-5 CX3:
D70208
D70216
D70322
D70325
D70335
D78C10
D78C11A
D78C14
D78213
D78234
D78238
D78322
D937LH
Assembled in Singapore
80-pin QFP
75216AGF
75308GF
78C10AGF
64-pin LQFP
78352BG
5
NEC Electronics Inc.
Roseville Manufacturing
Table 3. HTB Life Test Summary and Failure Rate Predictions
This table summarizes the reliability test results of processes extensively used by most NEC microprocessor products. The
failure rate predictions are based on both 125°C and 150°C high-temperature bias life test results. Failure rate predictions
are shown for the current period of available data and for past periods of cumulative data.
µPD7720AC
(28-pin DIP)
Process Type
Jan 88–Dec 98
(cumulative)
Process Period
(125°C)
448
520,000
0
17.9
6
9.3 x 10
Ambient
Temp.
Number Accum,.
of
Devices
448
No. of
Failures
Accel.
Factor
(Note 1)
17.9
Equiv.
Device
Hours
Failure Rate, 55 C
°
Device
Hours
520,000
and 60% Confidence
Level (Note 2)
0.0098 %/1000
= 98.0 FIT
NMOS-4
Total
°
Jan 88– Mar 99
(cumulative)
Jul 90– Mar 99
(cumulative)
Jul 90– Mar 99
(cumulative)
Jan 90– Mar 99
(cumulative)
Jan 97– Mar 99
(cumulative)
Apr 92– Mar 99
(cumulative)
Apr 92– Mar 99
(cumulative)
Jan 90– Mar 99
(cumulative)
Jul 94– Mar 99
(cumulative)
Jul 94– Mar 99
(cumulative)
Oct 94– Mar 99
(cumulative)
Jan 92– Mar 99
(cumulative)
(125 C)
(125°C)
(125°C)
(125°C)
(125°C)
(125°C)
(125°C)
(125°C)
(125°C)
(125°C)
(125°C)
(125°C)
0
0
0
0
0
0
0
0
1
0
0
0
6
9.3 x 10
µPD77C20AC
(28-pin DIP)
µPD77C25C
(28-pin DIP)
µPD70108C
(40-pin DIP)
µPD7503A
(64-pin QFP)
µPD75304
(80-pin QFP)
µPD75306
(80-pin QFP)
µPD75308
(80-pin QFP)
µPD75312
(80-pin QFP)
µPD75316
(80-pin QFP)
µPD17010
(80-pin QFP)
µPD78C10
(80-pin QFP)
432
96
432,000
96,000
32.6
32.6
32.6
32.6
32.6
32.6
32.6
32.6
32.6
32.6
32.6
7
6
5
6
7
6
6
6
7
6
5
1.41 x 10
3.13 x 10
7.82 x 10
5.48 x 10
1.25 x 10
2.35 x 10
8.61 x 10
9.39 x 10
1.80 x 10
2.35 x 10
7.82 x 10
24
24,000
168
384
120
360
312
552
72
168,000
384,000
120,000
360,000
311,168
552,000
72,000
24
24,000
Singapore Assembly
µPD75216
(80-pin QFP)
Singapore Assembly
µPD75308
Jan 92– Mar 99
(cumulative)
(125°C)
(125°C)
144
120
144,000
120,000
0
0
32.6
32.6
6
6
4.69 x 10
3.91 x 10
Jan 92– Mar 99
(cumulative)
(80-pin QFP)
Singapore Assembly
CMOS-4
Total
µPD70208
(68-pin PLCC) (cumulative)
PD70216 Apr 93– Mar 99
(68-pin PLCC) (cumulative)
µPD70320
Jul 91– Mar 99
(84-pin PLCC) (cumulative)
µPD70325
Jan 92– Mar 99
(84-pin PLCC) (cumulative)
°
Jan 89– Mar 99
(cumulative)
Jan 92– Mar 99
(125 C)
(125°C)
(125°C)
(125°C)
(125°C)
2808
748
936
508
644
2,812,168
736,000
936,000
508,000
644,000
1
0
0
0
1
32.6
11.3
11.3
11.3
11.3
7
0.0022%/1000
= 22FIT
9.17 x10
805. x 10
1.06 x 10
3.30 x 10
5.65 x 10
6
7
6
6
6
NEC Electronics Inc.
Roseville Manufacturing
Table 3. HTB Life Test Summary and Failure Rate Predictions (continued)
Process Type
Process Period
Ambient
Temp.
Number Accum,.
No. of
Failures
Accel.
Factor
(Note 1)
11.3
Equiv.
Device
Hours
Failure Rate, 55 C
and 60% Confidence
Level (Note 2)
°
of
Devices
532
Device
Hours
532,000
µPD70335
(84-pin PLCC) (cumulative)
CMOS-5
Total
µPD78352
(64-pin LQFP) (cumulative)
CMOS-8
Total
Jan 94- Mar 99
(125°C)
0
1
0
0
6
7
6.01 x 10
Apr 88– Mar 99
(cumulative)
Oct 94– Mar 99
(125 C)
°
3368
192
3,356,000
192,000
192,000
11.3
_
0.0053%/1000H
= 53FIT
3.79 x 10
_
(125°C)
°
192
_
_
Note 3
Oct 94– Mar 99
(cumulative)
(125 C)
Notes
:
1. The acceleration factor was calculated using the Arrhenius mathematical model.
2. FIT was derived from HTB data for all available time periods.
3. Some of the above FIT rates were not calculated. Due to small sample sizes in these cases, the FIT rates would not be
meaningful. NEC expects a FIT rate of less than 100 for micro device types (target not to exceed 150).
7
NEC Electronics Inc.
Roseville Manufacturing
Table 4. Other Life Test Summaries (HTSL, HHSL, T/H)
This table summarizes the reliability test results of the different process types during 150°C/175°C/200°C storage and
85°C/85% RH storage and bias tests. The data is summarized for the current period of available data and for past periods
of cumulative data.
HTSL Failures
Hours
HHSL Failures
Hours
T/H Failures
Hours
Process
Process
Type
Period
Qty
168 500
1000
Qty
168
500
1000
Qty
168
500
1000
µPD7720AC
(28-pin DIP)
NMOS-4 Total
Jan 88– Mar 99
(cumulative)
Jan 88– Mar 99
(cumulative)
Jul 88– Mar 99
(cumulative)
Jul 90– Mar 99
(cumulative)
Jan 90– Mar 99
(cumulative)
Jul 88– Mar 99
(cumulative)
Jul 90– Mar 99
(cumulative)
Jan 90– Mar 99
(cumulative)
Jul 88– Mar 99
(cumulative)
Jul 90– Mar 99
(cumulative)
Jan 90– Mar 99
(cumulative)
Jul 88– Mar 99
(cumulative)
Jul 90– Mar 99
(cumulative)
Jan 90– Mar 99
(cumulative)
Jul 88– Mar 99
(cumulative)
Jul 90– Mar 99
(cumulative)
Jan 90– Mar 99
(cumulative)
Jul 88– Mar 99
(cumulative)
Jul 90– Mar 99
(cumulative)
Jan 90– Mar 99
(cumulative)
Jul 88– Mar 99
(cumulative)
Jul 90– Mar 99
(cumulative)
Jul 88– Mar 99
(cumulative)
Jul 90– Mar 99
(cumulative)
380
0
0
0
0
0
0
0
0
0
0
0
0
0
-
0
0
0
0
0
0
0
0
0
0
0
0
0
-
0
0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
448
0
0
0
0
0
0
0
0
0
2
0
0
1
0
0
0
0
0
4
0
0
0
0
0
0
0
380
360
80
0
0
0
0
0
0
0
0
0
0
1
0
-
0
0
0
0
0
0
0
0
0
1
0
0
0
0
0
0
0
0
0
0
0
0
0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
448
432
96
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
0
0
0
0
1
0
0
0
0
0
0
0
µPD77C20AC
(28-pin DIP)
µPD77C25C
(28-pin DIP)
µPD70108C
(40-pin DIP)
µPD70116C
(40-pin QFP)
µPD7503A
(64-pin QFP)
µPD75304
(80-pin QFP)
µPD75306
(80-pin QFP)
µPD75308
(80-pin QFP)
µPD75312
(80-pin QFP)
µPD75316
(80-pin QFP)
µPD17010
20
24
100
180
324
80
120
216
380
96
300
260
500
40
384
312
520
72
(80-pin QFP)
µPD78C10
(80-pin QFP)
µPD75216
(80-pin QFP)
µPD75308
(80-pin QFP)
CMOS-4 Total
0
204
260
220
3336
620
912
528
692
528
3280
192
0
-
-
-
0
-
-
-
2244
604
804
476
584
516
2984
0
0
0
0
0
0
0
0
-
0
0
0
0
0
0
0
-
1
0
0
0
0
0
0
-
µPD70208
(68-pin PLCC)
µPD70216
(68-pin PLCC)
µPD70320
(84-pin PLCC)
µPD70325
(84-pin PLCC)
µPD70335
(84-pin PLCC)
CMOS-5 Total
µPD78352
(64-pin LQFP)
8
NEC Electronics Inc.
Roseville Manufacturing
CMOS-8 Total
Jan 90– Mar 99
(cumulative)
0
-
-
-
0
-
-
-
192
0
0
0
9
NEC Electronics Inc.
Roseville Manufacturing
Table 5. Environmental and Mechanical Test Summaries (TS, T/C, PCT)
Process
Type
Process
Period
T/C Failures
100 Cycles 300 Cycles Qty
PCT Failures
96 Hours
0
Qty
TS Failures
Qty
102 Hours
µPD7720AC
(28-pin DIP)
NMOS-4
Jan 88– Mar 99
(cumulative)
Jan 88- Mar 99
(cumulative)
Jul 88– Mar 99
(cumulative)
Jul 90– Mar 99
(cumulative)
Jan 90– Mar 99
(cumulative)
Jul 88– Mar 99
(cumulative)
Jul 90– Mar 99
(cumulative)
Jan 90– Mar 99
(cumulative)
Jul 88– Mar 99
(cumulative)
Jul 90– Mar 99
(cumulative)
Jan 90– Mar 99
(cumulative)
Jul 88– Mar 99
(cumulative)
Jul 90– Mar 99
(cumulative)
Jan 90– Mar 99
(cumulative)
Jul 88– Mar 99
(cumulative)
Jul 90– Mar 99
(cumulative)
Jan 90– Mar 99
(cumulative)
Jul 88– Mar 99
261
0
380
0
0
0
0
0
0
0
0
0
0
0
0
0
-
0
0
0
0
0
0
0
0
0
0
1
0
1
-
380
380
360
100
20
0
261
342
72
0
0
0
0
0
0
0
2
0
0
0
0
-
460
450
100
24
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
0
0
0
0
0
0
0
0
0
0
0
0
1
0
0
0
0
0
0
0
0
Total
µPD77C20AC
(28-pin DIP)
µPD77C25C
(28-pin DIP)
µPD70108C
(40-pin DIP)
µPD70116C
(40-pin DIP)
µPD7503A
(64-pin QFP)
µPD75304
(80-pin QFP)
µPD75306
(80-pin QFP)
µPD75308
(80-pin QFP)
µPD75312
(80-pin QFP)
µPD75316
(80-pin QFP)
µPD17010
(80-pin QFP)
µPD78C10
(80-pin QFP)
µPD75216
(80-pin QFP)
µPD75308
(80-pin QFP)
CMOS-4
18
54
125
225
400
125
350
300
500
75
100
180
320
100
300
240
400
60
90
234
54
224
162
332
54
0
0
180
120
100
2580
600
820
419
580
460
2879
180
180
0
-
0
-
-
0
-
0
-
-
1636
324
468
180
144
306
1422
0
2
1
0
1
0
0
2
0
0
2674
800
975
525
675
600
3575
60
0
0
0
0
0
0
0
0
0
2
1
0
3
1
1
6
0
0
Total
µPD70208
(68-pin PLCC) (cumulative)
µPD70216 Jul 90– Mar 99
(68-pin PLCC) (cumulative)
µPD70320 Jan 90– Mar 99
(84-pin PLCC) (cumulative)
µPD70325 Jul 88– Mar 99
(84-pin PLCC) (cumulative)
µPD70335 Jul 90– Mar 99
(84-pin PLCC) (cumulative)
CMOS-5
Total
Jul 88– Mar 99
(cumulative)
Jul 90– Mar 99
µPD78352
(64-pin LQFP) (cumulative)
CMOS-8
Total
Jan 90– Mar 99
(cumulative)
0
60
10
NEC Electronics Inc.
Roseville Manufacturing
Table 6. Failure Summaries
CMOS-4
Test Item
T/C
T/C
PCT
HTB
T/H
T/H
T/H
HTSL
HHBT
TS
Duration
Period
Failure
300 cyc.
300 cyc.
192 hrs.
168 hrs.
1000 hrs.
1000 hrs.
1000 hrs.
1000 hrs.
1000 hrs.
-
Jul 94–Oct 94
Jan 95–Mar 95
Jan 92–Apr 92
Oct 95–Dec 95
Jan 96–Mar 96
Oct 95–Dec 95
Jan 92–Apr 92
Apr 96–Jun 96
Oct-Dec 96
1 PC DC Failure
1 PC DC Failure
1 PC DC Failure
1 PC FUN Failure
1 PC DC Failure
1 PC FUN Failure
1 PC FUN Failure
1 PC DC Failure
1 PC FUN Failure
2PC DC Failure
1 PC DC Failure
1 PC DC Failure
Jul-Sep 97
Apr-Jun 98
Sep-Dec 98
T/H
HTSL
168 hrs.
1000 hrs
CMOS-5
Test Item
HTB
T/C
Duration
1000 hrs.
300 cyc.
300 cyc.
15 cyc.
Period
Failure
Jul 92–Sep 92
Apr 92–Jun 92
Jul 95–Sep 95
Apr 96–Jun 96
Jan 97–Jun 97
Apr 97–Jun 97
Apr 97–Jun 97
Jul–Sep 97
1 PC DC Failure
1 PC DC Failure
1 PC FUN Failure
1 PC FUN Failure
1 PC DC Failure
1 PC DC Failure
1 PC DC Failure
1PC DC Failure
T/C
T/S
HTB
T/C
168 hrs.
300 cyc.
300 cyc.
300 cyc.
T/C
T/C
11
NEC Electronics Inc.
Roseville Manufacturing
Table 7. CMOS-4 Process Family, Quarterly Reliability Data (Jan-Mar 99)
Life Tests
HTB Failures
Hours
T/H Failures
Hours
HTSL Failures/
Hours
Assembly
Device Type Month
Qty 168
500
1000
Qty
168
500
1000
Qty
168
500
1000
µPD7503A
Jan- Mar 99
24
0
0
0
24
0
0
0
20
0
0
1
(80-pin QFP)
Environmental Tests
T/C Failures
Cycles
PCT Failures
Assembly
Device Type Month
Hours
192
0
TS
Qty Failures
18
Qty
100
300
Qty
96
288
µPD75312
Jan-Mar 99
25
0
0
20
0
0
-
(80-pin QFP)
Table 8. CMOS-5 Process Family, Quarterly Reliability Data (Jan-Mar 99)
Life Tests
HTB Failures
T/H Failures
HTSL Failures
Hours
Assembly
Month
Hours
Hours
Device Type
Qty 168
500
1000
Qty
168
500
1000
Qty
168
500
1000
µPD70216
Jan– Mar 99
24
0
0
0
24
0
0
0
20
0
0
0
(68-pin PLCC)
µPD70335
Jan– Mar 99
24
0
0
0
24
0
0
0
20
0
0
0
(84-pin PLCC)
Environmental Tests
T/C Failures
Cycles
PCT Failures
Hours
192
Assembly
Month
TS
Failures
Device Type
µPD70216
Qty
100
300
Qty
96
288
Qty
Jan– Mar 99
25
0
0
20
0
0
0
18
0
(68-pin PLCC)
µPD70335
Jan– Mar 99
25
0
0
20
0
0
0
18
0
(84-pin PLCC)
12
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