PS9687L1-A [NEC]
Logic IC Output Optocoupler, 1-Element, 5000V Isolation, 10MBps, LEAD FREE, PLASTIC, DIP-8;型号: | PS9687L1-A |
厂家: | NEC |
描述: | Logic IC Output Optocoupler, 1-Element, 5000V Isolation, 10MBps, LEAD FREE, PLASTIC, DIP-8 输出元件 光电 |
文件: | 总13页 (文件大小:116K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
DATA SHEET
PHOTOCOUPLER
PS9687L1,PS9687L2
HIGH CMR, 10 Mbps OPEN COLLECTOR OUTPUT TYPE
8-PIN DIP PHOTOCOUPLER
FOR CREEPAGE DISTANCE OF 8 mm
−NEPOC Series−
DESCRIPTION
The PS9687L1 and PS9687L2 are optically coupled isolators containing a GaAlAs LED on the input side and a
photo diode and a signal processing circuit on the output side on one chip.
The PS9687L1 and PS9687L2 are designed specifically for long creepage-distance as well as high common mode
transient immunity (CMR) and high speed digital output type. Consequently, they are suitable for high speed logic
interface that needs long creepage-distance (8 mm) on mounting.
The PS9687L1 is in a plastic DIP (Dual In-line Package) and the PS9687L2 is lead bending type (Gull-wing) for
surface mounting.
FEATURES
PIN CONNECTIONS
•
•
•
•
•
•
•
•
Long creepage distance (8 mm MIN.)
(Top View)
High common mode transient immunity (CMH, CML = 20 kV/µs TYP.)
High isolation voltage (BV = 5 000 Vr.m.s.)
High-speed response (10 Mbps)
1. NC
8
1
5
7
6
2. Anode
3. Cathode
4. NC
Pulse width distortion (tPHL − tPLH = 15 ns TYP.)
Open collector output
5. GND
6. VO
7. NC
8. VCC
Ordering number of tape product: PS9687L2-E3, E4: 1 000 pcs/reel
Safety standards
2
3
4
•
•
•
UL approved: File No. E72422
BSI approved: No. 8990/8991
DIN EN60747-5-2 (VDE0884 Part2) approved: No.40008906 (Option)
APPLICATIONS
•
•
•
FA Network
Measurement equipment
PDP
The information in this document is subject to change without notice. Before using this document, please confirm that
this is the latest version.
Not all devices/types available in every country. Please check with local NEC Compound Semiconductor Devices
representative for availability and additional information.
Document No. PN10573EJ01V0DS (1st edition)
Date Published July 2005 CP(K)
Printed in Japan
NEC Compound Semiconductor Devices, Ltd. 2005
PS9687L1,PS9687L2
PACKAGE DIMENSIONS (UNIT: mm)
DIP Type
PS9687L1
+0.5
9.25
–0.25
8
5
10.16
6.5 0.5
1
4
0.50 0.15
0.25 M
0 to 15˚
2.54
0.84 0.43
Lead Bending Type
PS9687L2
+0.5
9.25
–0.25
8
5
6.5 0.5
1
4
0.84 0.43
0.9 0.25
2.54
0.5 0.15
0.25 M
11.8 0.4
2
Data Sheet PN10573EJ01V0DS
PS9687L1,PS9687L2
FUNCTIONAL DIAGRAM
8
6
2
3
5
Shield
LED
ON
Output
L
OFF
H
MARKING EXAMPLE
JAPAN
Type Number
PS9687
NL503
Assembly Lot
N
N
No. 1 pin Mark
Initial of NEC
(Engraved mark)
L
5
03
Week Assembled
Year Assembled
(Last 1 Digit)
In-house Code (L: Pb-Free)
Rank Code
3
Data Sheet PN10573EJ01V0DS
PS9687L1,PS9687L2
ORDERING INFORMATION
Part Number
Order Number
Solder Plating
Specification
Packing Style
Safety Standard
Approval
Application Part
Number*1
PS9687L1
PS9687L1-A
Pb-Free
Magazine case 50 pcs
Standard products
PS9687L1
PS9687L2
PS9687L2-A
(UL, BSI approved) PS9687L2
PS9687L2-E3
PS9687L2-E4
PS9687L1-V
PS9687L2-V
PS9687L2-V-E3
PS9687L2-V-E4
PS9687L2-E3-A
PS9687L2-E4-A
PS9687L1-V-A
PS9687L2-V-A
PS9687L2-V-E3-A
PS9687L2-V-E4-A
Embossed Tape 1 000 pcs/reel
Magazine case 50 pcs
DIN EN60747-5-2
(VDE0884 Part2)
approved (Option)
PS9687L1
PS9687L2
Embossed Tape 1 000 pcs/reel
*1 For the application of the Safety Standard, following part number should be used.
ABSOLUTE MAXIMUM RATINGS (TA = 25°C, unless otherwise specified)
Parameter
Symbol
IF
Ratings
Unit
mA
V
Diode
Forward Current*1
Reverse Voltage
30
VR
5
Detector Supply Voltage
Output Voltage
VCC
VO
7
V
7
25
V
Output Current
IO
mA
mW
Vr.m.s.
°C
Power Dissipation*2
Isolation Voltage*3
PC
40
BV
TA
5 000
Operating Ambient Temperature
Storage Temperature
−40 to +85
−55 to +125
Tstg
°C
*1 Reduced to 0.3 mA/°C at TA = 25°C or more.
*2 Applies to output pin VO (Collector pin). Reduced to 1.5 mW/°C at TA = 65°C or more.
*3 AC voltage for 1 minute at TA = 25°C, RH = 60% between input and output.
Pins 1-4 shorted together, 5-8 shorted together.
RECOMMENDED OPERATING CONDITIONS (TA = 25°C)
Parameter
High Level Input Current
Low Level Input Voltage
Supply Voltage
Symbol
IFH
MIN.
6.3
0
TYP.
10
MAX.
12.0
0.8
5.5
5
Unit
mA
V
VFL
VCC
N
4.5
5.0
V
TTL (RL = 1 kΩ, loads)
Pull-up Resistance
RL
330
4 k
Ω
4
Data Sheet PN10573EJ01V0DS
PS9687L1,PS9687L2
ELECTRICAL CHARACTERISTICS (TA = −40 to +85°C, unless otherwise specified)
Parameter
Forward Voltage
Reverse Current
Terminal Capacitance
Symbol
VF
Conditions
IF = 10 mA, TA = 25°C
MIN. TYP.*1 MAX. Unit
Diode
1.4
1.65
1.8
10
V
µA
pF
µA
V
IR
VR = 3 V, TA = 25°C
Ct
VF = 0 V, f = 1 MHz, TA = 25°C
VCC = VO = 5.5 V, VF = 0.8 V
VCC = 5.5 V, IF = 5 mA, IOL = 13 mA
VCC = 5.5 V, IF = 0 mA, VO = Open
VCC = 5.5 V, IF = 10 mA, VO = Open
VCC = 5 V, VO = 0.8 V, RL = 350 Ω
VI-O = 1 kVDC, RH = 40 to 60%, TA = 25°C
V = 0 V, f = 1 MHz, TA = 25°C
VCC = 5 V, TA = 25°C
30
1
150
100
0.6
10
Detector High Level Output Current
Low Level Output Voltage*2
High Level Supply Current
Low Level Supply Current
Coupled Threshold Input Current (H → L)
Isolation Resistance
Isolation Capacitance
Propagation Delay Time
(H → L)*3
IOH
VOL
ICCH
ICCL
IFHL
RI-O
CI-O
tPHL
0.35
6
mA
mA
mA
Ω
11
2.5
13
5
1011
0.9
40
5
pF
ns
75
RL = 350 Ω, IF = 7.5 mA, CL = 15 pF
TA = 25 °C
100
75
Propagation Delay Time
(L → H)*3
tPLH
55
ns
100
Rise Time
tr
20
10
15
ns
ns
ns
Fall Time
tf
Pulse Width Distortion
(PWD)*3
tPHL-tPLH
50
60
Propagation Delay Skew
tPSK
ns
Common Mode
CMH
VCC = 5 V, TA = 25°C, IF = 0 mA,
VO (MIN.) = 2 V, VCM = 1 kV, RL = 350 Ω
10
10
20
20
kV/µs
Transient Immunity at High Level
Output*4
Common Mode
CML
VCC = 5 V, TA = 25°C, IF = 7.5 mA,
kV/µs
Transient Immunity at Low Level
Output*4
VO (MAX.) = 0.8 V, VCM = 1 kV, RL = 350 Ω
5
Data Sheet PN10573EJ01V0DS
PS9687L1,PS9687L2
*1 Typical values at TA = 25°C
*2 Because VOL of 2 V or more may be output when LED current is input and when output power supply is on and
off, confirm the characteristics (operation with the power supply on and off) during design, before using this
device.
*3 Test circuit for propagation delay time
V
CC = 5 V
(I = 7.5 mA)
F
Pulse input (I
F
)
Input
50%
(PW = 1 s,
µ
0.1
µ
F
0 V
5 V
R
L
= 350 Ω
(monitor)
Duty cycle = 1/10)
VOH
Input
(monitor)
V
O
Output
C = 15 pF
L
1.5 V
47 Ω
VOL
tPHL
tPLH
Remark C includes probe and stray wiring capacitance.
L
*4 Test circuit for common mode transient immunity
V
V
CC = 5 V
1 kV
0 V
90%
CM
V
SW I
F
10%
0.1 µF
R
L
= 350 Ω
t
r
t
f
O
(monitor)
V
O
V
OH
C
L
= 15 pF
(I
F
= 0 mA)
2 V
0.8 V
VCM
V
O
V
OL
(IF = 7.5 mA)
Remark C includes probe and stray wiring capacitance.
L
USAGE CAUTIONS
1. This product is weak for static electricity by designed with high-speed integrated circuit so protect against static
electricity when handling.
2. By-pass capacitor of more than 0.1 µF is used between VCC and GND near device. Also, ensure that the
distance between the leads of the photocoupler and capacitor is no more than 10 mm.
3. Avoid storage at a high temperature and high humidity.
6
Data Sheet PN10573EJ01V0DS
PS9687L1,PS9687L2
TYPICAL CHARACTERISTICS (TA = 25°C, unless otherwise specified)
MAXIMUM FORWARD CURRENT
vs. AMBIENT TEMPERATURE
DETECTOR POWER DISSIPATION
vs. AMBIENT TEMPERATURE
40
30
20
10
50
40
30
20
10
0
20
40
60
8085
(˚C)
100
2.4
5
0
20
40
60
8085
(˚C)
100
Ambient Temperature T
A
Ambient Temperature T
A
SUPPLY CURRENT vs.
AMBIENT TEMPERATURE
FORWARD CURRENT vs.
FORWARD VOLTAGE
14
12
10
8
100
10
Vcc = 5.5 V
I
CCL (I
F
= 10 mA)
T
A
= +85˚C
+50˚C
+25˚C
0˚C
1
0.1
6
–25˚C
4
I
CCH (I = 0 mA)
F
2
0
–50
0.01
1.0
1.2
1.4
1.6
1.8
2.0
(V)
2.2
–25
0
25
50
75
(˚C)
100
Forward Voltage V
F
Ambient Temperature T
A
OUTPUT VOLTAGE vs.
FORWARD CURRENT
LOW LEVEL OUTPUT VOLTAGE vs.
AMBIENT TEMPERATURE
6
5
4
3
2
1
0.6
0.5
0.4
0.3
0.2
0.1
0
I
F
= 5.0 mA,
CC = 5.5 V
V
CC = 5.0 V
V
I
OL = 16.0 mA
13.0 mA
10.0 mA
6.0 mA
RL
= 350 Ω
1.0 kΩ
4.0 kΩ
0
1
2
3
4
–50
–25
0
25
50
75
100
Ambient Temperature T (˚C)
A
Forward Current I (mA)
F
Remark The graphs indicate nominal characteristics.
7
Data Sheet PN10573EJ01V0DS
PS9687L1,PS9687L2
THRESHOLD INPUT CURRENT vs.
AMBIENT TEMPERATURE
PROPAGATION DELAY TIME vs.
AMBIENT TEMPERATURE
5
4
3
2
1
0
140
120
100
80
VCC = 5.0 V,
VO = 0.8 V
RL = 350 Ω
1.0 kΩ
4.0 kΩ
tPLH: RL = 4.0 kΩ
tPLH: RL = 1.0 kΩ
60
40
tPLH: RL = 350 Ω
20
0
IF = 7.5 mA,
VCC = 5.0 V
tPHL: RL = 350 Ω, 1.0 kΩ, 4.0 kΩ
–25 25 50
–50
–25
0
25
50
75
100
100
20
–50
0
75 100
Ambient Temperature TA (˚C)
Ambient Temperature TA (˚C)
PULSE WIDTH DISTORTION vs.
AMBIENT TEMPERATURE
SWITCHING TIME vs.
AMBIENT TEMPERATURE
100
250
200
150
100
50
IF = 7.5 mA,
VCC = 5.0 V
IF = 7.5 mA,
VCC = 5.0 V
80
60
40
20
0
tr:RL = 4.0 kΩ
RL = 4.0 kΩ
tr:RL = 1.0 kΩ
tr:RL = 350 Ω
RL = 1.0 kΩ
RL = 350 Ω
tf:RL = 350 Ω, 1.0 kΩ, 4.0 kΩ
0
–50
–25
0
25
50
75
100
–50
–25
0
25
50
75
Ambient Temperature TA (˚C)
Ambient Temperature TA (˚C)
PROPAGATION DELAY TIME vs.
FORWARD CURRENT
PULSE WIDTH DISTORTION vs.
FORWARD CURRENT
120
100
80
60
40
20
0
100
80
60
40
20
0
VCC = 5.0 V
tPLH: RL = 4.0 kΩ
tPLH: RL = 1.0 kΩ
RL = 4.0 kΩ
RL = 1.0 kΩ
tPLH: RL = 350 Ω
tPHL: RL = 350 Ω, 1.0 kΩ, 4.0 kΩ
VCC = 5.0 V
17.5 20
RL = 350 Ω
10 12.5
5
7.5
10
12.5
15
17.5
5
7.5
15
Forward Current IF (mA)
Forward Current IF (mA)
Remark The graphs indicate nominal characteristics.
8
Data Sheet PN10573EJ01V0DS
PS9687L1,PS9687L2
TAPING SPECIFICATIONS (UNIT: mm)
Outline and Dimensions (Tape)
2.0 0.1
4.0 0.1
+0.1
4.5 MAX.
1.5
–0
4.1 0.1
0.3 0.05
2.05 0.05
12.0 0.1
10.7 0.1
Tape Direction
PS9687L2-E4
PS9687L2-E3
Pull-out direction
Outline and Dimensions (Reel)
2.0 0.5
2.0 0.5
13.0 0.2
R 1.0
21.0 0.8
25.5 1.0
29.5 1.0
23.9 to 27.4
Outer edge of
flange
Packing: 1 000 pcs/reel
9
Data Sheet PN10573EJ01V0DS
PS9687L1,PS9687L2
NOTES ON HANDLING
1. Recommended soldering conditions
(1) Infrared reflow soldering
• Peak reflow temperature
260°C or below (package surface temperature)
• Time of peak reflow temperature
• Time of temperature higher than 220°C
10 seconds or less
60 seconds or less
• Time to preheat temperature from 120 to 180°C 120 30 s
• Number of reflows
• Flux
Three
Rosin flux containing small amount of chlorine (The flux with a
maximum chlorine content of 0.2 Wt% is recommended.)
Recommended Temperature Profile of Infrared Reflow
(heating)
to 10 s
260˚C MAX.
220˚C
to 60 s
180˚C
120˚C
120 30 s
(preheating)
Time (s)
(2) Wave soldering
• Temperature
• Time
260°C or below (molten solder temperature)
10 seconds or less
• Preheating conditions
• Number of times
• Flux
120°C or below (package surface temperature)
One (Allowed to be dipped in solder including plastic mold portion.)
Rosin flux containing small amount of chlorine (The flux with a maximum chlorine
content of 0.2 Wt% is recommended.)
(3) Soldering by Soldering Iron
• Peak Temperature (lead part temperature) 350°C or below
• Time (each pins)
• Flux
3 seconds or less
Rosin flux containing small amount of chlorine (The flux with a
maximum chlorine content of 0.2 Wt% is recommended.)
(a) Soldering of leads should be made at the point 1.5 to 2.0 mm from the root of the lead
(b) Please be sure that the temperature of the package would not be heated over 100°C
10
Data Sheet PN10573EJ01V0DS
PS9687L1,PS9687L2
(4) Cautions
• Fluxes
Avoid removing the residual flux with freon-based and chlorine-based cleaning solvent.
2. Cautions regarding noise
Be aware that when voltage is applied suddenly between the photocoupler’s input and output or between collector-
emitters at startup, the output transistor may enter the on state, even if the voltage is within the absolute maximum
ratings.
USAGE CAUTIONS
1. Protect against static electricity when handling.
2. Avoid storage at a high temperature and high humidity.
11
Data Sheet PN10573EJ01V0DS
PS9687L1,PS9687L2
When the product(s) listed in this document is subject to any applicable import or export control laws and regulation of the authority
having competent jurisdiction, such product(s) shall not be imported or exported without obtaining the import or export license.
•
The information in this document is current as of July, 2005. The information is subject to change
without notice. For actual design-in, refer to the latest publications of NEC's data sheets or data
books, etc., for the most up-to-date specifications of NEC semiconductor products. Not all products
and/or types are available in every country. Please check with an NEC sales representative for
availability and additional information.
•
•
No part of this document may be copied or reproduced in any form or by any means without prior
written consent of NEC. NEC assumes no responsibility for any errors that may appear in this document.
NEC does not assume any liability for infringement of patents, copyrights or other intellectual property rights of
third parties by or arising from the use of NEC semiconductor products listed in this document or any other
liability arising from the use of such products. No license, express, implied or otherwise, is granted under any
patents, copyrights or other intellectual property rights of NEC or others.
•
•
•
Descriptions of circuits, software and other related information in this document are provided for illustrative
purposes in semiconductor product operation and application examples. The incorporation of these
circuits, software and information in the design of customer's equipment shall be done under the full
responsibility of customer. NEC assumes no responsibility for any losses incurred by customers or third
parties arising from the use of these circuits, software and information.
While NEC endeavours to enhance the quality, reliability and safety of NEC semiconductor products, customers
agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize
risks of damage to property or injury (including death) to persons arising from defects in NEC
semiconductor products, customers must incorporate sufficient safety measures in their design, such as
redundancy, fire-containment, and anti-failure features.
NEC semiconductor products are classified into the following three quality grades:
"Standard", "Special" and "Specific". The "Specific" quality grade applies only to semiconductor products
developed based on a customer-designated "quality assurance program" for a specific application. The
recommended applications of a semiconductor product depend on its quality grade, as indicated below.
Customers must check the quality grade of each semiconductor product before using it in a particular
application.
"Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio
and visual equipment, home electronic appliances, machine tools, personal electronic equipment
and industrial robots
"Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed
for life support)
"Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
support systems and medical equipment for life support, etc.
The quality grade of NEC semiconductor products is "Standard" unless otherwise expressly specified in NEC's
data sheets or data books, etc. If customers wish to use NEC semiconductor products in applications not
intended by NEC, they must contact an NEC sales representative in advance to determine NEC's willingness
to support a given application.
(Note)
(1) "NEC" as used in this statement means NEC Corporation, NEC Compound Semiconductor Devices, Ltd.
and also includes its majority-owned subsidiaries.
(2) "NEC semiconductor products" means any semiconductor product developed or manufactured by or for
NEC (as defined above).
M8E 00. 4-0110
12
Data Sheet PN10573EJ01V0DS
PS9687L1,PS9687L2
This product uses gallium arsenide (GaAs).
GaAs vapor and powder are hazardous to human health if inhaled or ingested, so please observe
the following points.
Caution GaAs Products
• Follow related laws and ordinances when disposing of the product. If there are no applicable laws
and/or ordinances, dispose of the product as recommended below.
1. Commission a disposal company able to (with a license to) collect, transport and dispose of
materials that contain arsenic and other such industrial waste materials.
2. Exclude the product from general industrial waste and household garbage, and ensure that the
product is controlled (as industrial waste subject to special control) up until final disposal.
• Do not burn, destroy, cut, crush, or chemically dissolve the product.
• Do not lick the product or in any way allow it to enter the mouth.
For further information, please contact
NEC Compound Semiconductor Devices, Ltd.
http://www.ncsd.necel.com/
E-mail: salesinfo@ml.ncsd.necel.com (sales and general)
techinfo@ml.ncsd.necel.com (technical)
Sales Division TEL: +81-44-435-1573 FAX: +81-44-435-1579
NEC Compound Semiconductor Devices Hong Kong Limited
E-mail: ncsd-hk@elhk.nec.com.hk (sales, technical and general)
TEL: +852-3107-7303
TEL: +886-2-8712-0478 FAX: +886-2-2545-3859
TEL: +82-2-558-2120
FAX: +82-2-558-5209
FAX: +852-3107-7309
Hong Kong Head Office
Taipei Branch Office
Korea Branch Office
NEC Electronics (Europe) GmbH
http://www.ee.nec.de/
TEL: +49-211-6503-0 FAX: +49-211-6503-1327
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TEL: +1-408-988-3500 FAX: +1-408-988-0279
http://www.cel.com/
0504
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