PS7801E-1A-F4-A [NEC]

Transistor Output SSR, 1-Channel, 500V Isolation, 4.20 X 2.50 MM, 1.85 MM HEIGHT, LEAD FREE, ULTRA SMALL, FLAT PACKAGE-4;
PS7801E-1A-F4-A
型号: PS7801E-1A-F4-A
厂家: NEC    NEC
描述:

Transistor Output SSR, 1-Channel, 500V Isolation, 4.20 X 2.50 MM, 1.85 MM HEIGHT, LEAD FREE, ULTRA SMALL, FLAT PACKAGE-4

输出元件 光电
文件: 总7页 (文件大小:64K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
PRELIMINARY DATA SHEET  
Solid State Relay  
OCMOS FET  
PS7801E-1A  
4-PIN ULTRA SMALL FLAT-LEAD,  
LOW C × R, 1-ch Optical Coupled MOS FET  
DESCRIPTION  
The PS7801E-1A is a low output capacitance solid state relay containing a GaAs LED on the light emitting side  
(input side) and MOS FETs on the output side.  
An ultra small flat-lead package has been provided which realizes a reduction in mounting area of about 50%  
compared with the PS72xx series.  
It is suitable for high-frequency signal control, due to its low C × R, low output capacitance, and low off-state  
leakage current.  
FEATURES  
PIN CONNECTION  
Ultra small flat-lead package (4.2 (L) × 2.5 (W) × 1.85 (H) mm)  
Low C × R (C × R = 9 pF • )  
(Top View)  
4
3
Low output capacitance (Cout = 5 pF TYP.)  
1 channel type (1 a output)  
1. LED Anode  
Designed for AC/DC switching line changer  
Low offset voltage  
2. LED Cathode  
3. MOS FET  
4. MOS FET  
Ordering number of taping product: PS7801E-1A-F3, F4 (3 500 pcs/reel)  
1
2
APPLICATIONS  
Measurement equipment  
The information in this document is subject to change without notice. Before using this document, please confirm that  
this is the latest version.  
Not all devices/types available in every country. Please check with local NEC Compound Semiconductor Devices  
representative for availability and additional information.  
Document No. PN10569EJ01V0DS (1st edition)  
Date Published June 2005 CP(K)  
Printed in Japan  
NEC Compound Semiconductor Devices, Ltd. 2005  
PS7801E-1A  
PACKAGE DIMENSIONS (UNIT: mm)  
2.5 0.3  
0.2 MAX.  
4
3
N
1
2
3.0 MAX.  
4.6 0.2  
0.4 0.1  
0.2 0.1  
1.27  
MARKING EXAMPLE  
Last number of  
type No. : 1E*1  
*2  
1E  
N
An initial of "NEC"  
Assembly lot  
503  
No.1 pin  
mark  
(Nicked  
corner)  
5 03 (Marking details)  
Week assembled  
Year assembled  
*1 The marking corresponds to the last two digits  
of the part number below.  
PS7801E-1A  
*2 Bar : Pb-Free  
2
Preliminary Data Sheet PN10569EJ01V0DS  
PS7801E-1A  
ORDERING INFORMATION  
Part Number  
Order Number  
Solder Plating  
Specification  
Packing Style  
PS7801E-1A-F3  
PS7801E-1A-F4  
PS7801E-1A-F3-A  
PS7801E-1A-F4-A  
Pb-Free  
Embossed Tape 3 500 pcs/reel  
ABSOLUTE MAXIMUM RATINGS (TA = 25°C, unless otherwise specified)  
Parameter  
Symbol  
IF  
Ratings  
50  
Unit  
mA  
V
Diode  
Forward Current (DC)  
Reverse Voltage  
Power Dissipation  
Peak Forward Current*1  
VR  
5.0  
50  
PD  
mW  
A
IFP  
1
MOS FET Break Down Voltage  
Continuous Load Current  
VL  
40  
V
IL  
150  
300  
mA  
mA  
Pulse Load Current*2  
(AC/DC Connection)  
ILP  
Power Dissipation  
Isolation Voltage*3  
PD  
BV  
PT  
250  
500  
mW  
Vr.m.s.  
mW  
°C  
Total Power Dissipation  
Operating Ambient Temperature  
Storage Temperature  
300  
TA  
40 to +85  
40 to +100  
Tstg  
°C  
*1 PW = 100 µs, Duty Cycle = 1%  
*2 PW = 100 ms, 1 shot  
*3 AC voltage for 1 minute at TA = 25°C, RH = 60% between input and output.  
Pins 1-2 shorted together, 3-4 shorted together.  
RECOMMENDED OPERATING CONDITIONS (TA = 25°C)  
Parameter  
LED Operating Current  
LED Off Voltage  
Symbol  
MIN.  
TYP.  
5
MAX.  
20  
Unit  
mA  
V
IF  
2
0
VF  
0.5  
3
Preliminary Data Sheet PN10569EJ01V0DS  
PS7801E-1A  
ELECTRICAL CHARACTERISTICS (TA = 25°C)  
Parameter  
Symbol  
VF  
Conditions  
MIN.  
TYP.  
1.1  
MAX.  
1.4  
Unit  
V
Diode  
Forward Voltage  
Reverse Current  
IF = 5 mA  
VR = 5 V  
VD = 40 V  
IR  
5.0  
µA  
nA  
MOS FET Off-state Leakage  
Current  
ILoff  
0.05  
5
1.0  
Output Capacitance  
Cout  
IFon  
Ron  
ton  
VD = 0 V, f = 1 MHz  
IL = 150 mA  
7
pF  
mA  
Coupled  
LED On-state Current  
On-state Resistance  
Turn-on Time*1, 2  
2.0  
2.5  
1.0  
0.5  
IF = 5 mA, IL = 150 mA  
IF = 5 mA, VL = 5 V, RL = 500 ,  
PW 10 ms  
1.8  
0.15  
0.05  
ms  
Turn-off Time*1, 2  
toff  
Isolation Resistance  
Isolation Capacitance  
RI-O  
CI-O  
VI-O = 0.5 kVDC  
109  
V = 0 V, f = 1 MHz  
0.3  
pF  
*1 Test Circuit for Switching Time  
I
F
Input  
50%  
0
Pulse Input  
V
V
L
V
O
= 5 V  
90%  
10%  
Input monitor  
O
monitor  
Output  
R
in  
R
L
t
on  
t
off  
*2 The turn-on time and turn-off time are specified as input-pulse width 10 ms.  
Be aware that when the device operates with an input-pulse width less than 10 ms, the turn-on time and turn-off  
time will increase.  
4
Preliminary Data Sheet PN10569EJ01V0DS  
PS7801E-1A  
NOTES ON HANDLING  
Recommended soldering conditions  
(1) Infrared reflow soldering  
• Peak reflow temperature  
260°C or below (package surface temperature)  
10 seconds or less  
• Time of peak reflow temperature  
• Time of temperature higher than 220°C  
60 seconds or less  
• Time to preheat temperature from 120 to 180°C 120 30 s  
• Number of reflows  
• Flux  
Three  
Rosin flux containing small amount of chlorine (The flux with a  
maximum chlorine content of 0.2 Wt% is recommended.)  
Recommended Temperature Profile of Infrared Reflow  
(heating)  
to 10 s  
260˚C MAX.  
220˚C  
to 60 s  
180˚C  
120˚C  
120 30 s  
(preheating)  
Time (s)  
(2) Wave soldering  
• Temperature  
• Time  
260°C or below (molten solder temperature)  
10 seconds or less  
• Preheating conditions  
• Number of times  
• Flux  
120°C or below (package surface temperature)  
One  
Rosin flux containing small amount of chlorine (The flux with a maximum chlorine  
content of 0.2 Wt% is recommended.)  
(3) Cautions  
• Fluxes  
Avoid removing the residual flux with freon-based and chlorine-based cleaning solvent.  
5
Preliminary Data Sheet PN10569EJ01V0DS  
PS7801E-1A  
When the product(s) listed in this document is subject to any applicable import or export control laws and regulation of the authority  
having competent jurisdiction, such product(s) shall not be imported or exported without obtaining the import or export license.  
The information in this document is current as of June, 2005. The information is subject to change  
without notice. For actual design-in, refer to the latest publications of NEC's data sheets or data  
books, etc., for the most up-to-date specifications of NEC semiconductor products. Not all products  
and/or types are available in every country. Please check with an NEC sales representative for  
availability and additional information.  
No part of this document may be copied or reproduced in any form or by any means without prior  
written consent of NEC. NEC assumes no responsibility for any errors that may appear in this document.  
NEC does not assume any liability for infringement of patents, copyrights or other intellectual property rights of  
third parties by or arising from the use of NEC semiconductor products listed in this document or any other  
liability arising from the use of such products. No license, express, implied or otherwise, is granted under any  
patents, copyrights or other intellectual property rights of NEC or others.  
Descriptions of circuits, software and other related information in this document are provided for illustrative  
purposes in semiconductor product operation and application examples. The incorporation of these  
circuits, software and information in the design of customer's equipment shall be done under the full  
responsibility of customer. NEC assumes no responsibility for any losses incurred by customers or third  
parties arising from the use of these circuits, software and information.  
While NEC endeavours to enhance the quality, reliability and safety of NEC semiconductor products, customers  
agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize  
risks of damage to property or injury (including death) to persons arising from defects in NEC  
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redundancy, fire-containment, and anti-failure features.  
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"Standard", "Special" and "Specific". The "Specific" quality grade applies only to semiconductor products  
developed based on a customer-designated "quality assurance program" for a specific application. The  
recommended applications of a semiconductor product depend on its quality grade, as indicated below.  
Customers must check the quality grade of each semiconductor product before using it in a particular  
application.  
"Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio  
and visual equipment, home electronic appliances, machine tools, personal electronic equipment  
and industrial robots  
"Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster  
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed  
for life support)  
"Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life  
support systems and medical equipment for life support, etc.  
The quality grade of NEC semiconductor products is "Standard" unless otherwise expressly specified in NEC's  
data sheets or data books, etc. If customers wish to use NEC semiconductor products in applications not  
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to support a given application.  
(Note)  
(1) "NEC" as used in this statement means NEC Corporation, NEC Compound Semiconductor Devices, Ltd.  
and also includes its majority-owned subsidiaries.  
(2) "NEC semiconductor products" means any semiconductor product developed or manufactured by or for  
NEC (as defined above).  
M8E 00. 4-0110  
6
Preliminary Data Sheet PN10569EJ01V0DS  
PS7801E-1A  
This product uses gallium arsenide (GaAs).  
GaAs vapor and powder are hazardous to human health if inhaled or ingested, so please observe  
the following points.  
Caution GaAs Products  
• Follow related laws and ordinances when disposing of the product. If there are no applicable laws  
and/or ordinances, dispose of the product as recommended below.  
1. Commission a disposal company able to (with a license to) collect, transport and dispose of  
materials that contain arsenic and other such industrial waste materials.  
2. Exclude the product from general industrial waste and household garbage, and ensure that the  
product is controlled (as industrial waste subject to special control) up until final disposal.  
• Do not burn, destroy, cut, crush, or chemically dissolve the product.  
• Do not lick the product or in any way allow it to enter the mouth.  
For further information, please contact  
NEC Compound Semiconductor Devices, Ltd.  
http://www.ncsd.necel.com/  
E-mail: salesinfo@ml.ncsd.necel.com (sales and general)  
techinfo@ml.ncsd.necel.com (technical)  
Sales Division TEL: +81-44-435-1573 FAX: +81-44-435-1579  
NEC Compound Semiconductor Devices Hong Kong Limited  
E-mail: ncsd-hk@elhk.nec.com.hk (sales, technical and general)  
TEL: +852-3107-7303  
TEL: +886-2-8712-0478 FAX: +886-2-2545-3859  
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FAX: +82-2-558-5209  
FAX: +852-3107-7309  
Hong Kong Head Office  
Taipei Branch Office  
Korea Branch Office  
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http://www.ee.nec.de/  
TEL: +49-211-6503-0 FAX: +49-211-6503-1327  
California Eastern Laboratories, Inc.  
TEL: +1-408-988-3500 FAX: +1-408-988-0279  
http://www.cel.com/  
0504  

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