PS7431-1A-E4 [NEC]

Transistor Output SSR, 1-Channel, 3000V Isolation, SOP-4;
PS7431-1A-E4
型号: PS7431-1A-E4
厂家: NEC    NEC
描述:

Transistor Output SSR, 1-Channel, 3000V Isolation, SOP-4

输出元件 光电
文件: 总12页 (文件大小:74K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
DATA SHEET  
Solid State Relay  
OCMOS FET  
PS7431-1A  
4-PIN SOP HIGH ISOLATION VOLTAGE 3 000 Vr.m.s  
1-ch Optical Coupled MOS FET  
DESCRIPTION  
The PS7431-1A is a solid state relay containing GaAs a LED on the light emitting side (input side) and normally  
open (N.O.) contact MOS FETs on the output side.  
It is suitable for analog signal control because of its low offset and high linearity.  
FEATURES  
High isolation voltage (BV = 3 000 Vr.m.s)  
Small and thin package (4-pin SOP, Height = 2.1 mm)  
1 channel type (1 a output)  
Low LED operating current (IF = 2 mA)  
Designed for AC/DC switching line changer  
Low offset voltage  
Ordering number of taping product: PS7431-1A-E3, E4, F3, F4  
UL approved: File No. E72422  
BSI approved: No. 8767/8768  
CSA approved: No. CA 101391  
APPLICATIONS  
Laptop PC, PDA  
Modem card  
Telephone, FAX  
Measurement equipment  
The information in this document is subject to change without notice. Before using this document, please confirm that  
this is the latest version.  
Not all devices/types available in every country. Please check with local NEC Compound Semiconductor Devices  
representative for availability and additional information.  
Document No. PN10458EJ01V0DS (1st edition)  
Date Published January 2004 CP(K)  
Printed in Japan  
NEC Compound Semiconductor Devices 2004  
PS7431-1A  
PACKAGE DIMENSIONS (UNIT: mm)  
4.0±0.5  
TOP VIEW  
4
1
3
1. LED Anode  
2. LED Cathode  
3. MOS FET  
4. MOS FET  
2
7.0±0.3  
4.4  
0.5±0.3  
2.54  
+0.10  
–0.05  
0.25 M  
0.40  
2
Data Sheet PN10458EJ01V0DS  
PS7431-1A  
ORDERING INFORMATION  
Application Part Number*1  
PS7431-1A  
Part Number  
PS7431-1A  
Package  
Packing Style  
Magazine case 100 pcs  
4-pin SOP  
PS7431-1A-E3  
PS7431-1A-E4  
PS7431-1A-F3  
PS7431-1A-F4  
Embossed Tape 900 pcs/reel  
Embossed Tape 3 500 pcs/reel  
*1 For the application of the Safety Standard, following part number should be used.  
ABSOLUTE MAXIMUM RATINGS (TA = 25°C, unless otherwise specified)  
Parameter  
Symbol  
IF  
Ratings  
50  
Unit  
mA  
V
Diode  
Forward Current (DC)  
Reverse Voltage  
Power Dissipation  
Peak Forward Current*1  
VR  
5.0  
PD  
50  
mW  
A
IFP  
1
MOS FET Break Down Voltage  
Continuous Load Current  
VL  
350  
120  
240  
V
IL  
mA  
mA  
Pulse Load Current*2  
(AC/DC Connection)  
ILP  
Power Dissipation  
Isolation Voltage*3  
PD  
BV  
PT  
310  
3 000  
mW  
Vr.m.s.  
mW  
°C  
Total Power Dissipation  
Operating Ambient Temperature  
Storage Temperature  
360  
TA  
40 to +85  
40 to +100  
Tstg  
°C  
*1 PW = 100 µs, Duty Cycle = 1%  
*2 PW = 100 ms, 1 shot  
*3 AC voltage for 1 minute at TA = 25°C, RH = 60% between input and output  
3
Data Sheet PN10458EJ01V0DS  
PS7431-1A  
RECOMMENDED OPERATING CONDITIONS (TA = 25°C)  
Parameter  
LED Operating Current  
LED Off Voltage  
Symbol  
MIN.  
TYP.  
10  
MAX.  
20  
Unit  
mA  
V
IF  
2
0
VF  
0.5  
ELECTRICAL CHARACTERISTICS (TA = 25°C)  
Parameter  
Symbol  
VF  
Conditions  
MIN.  
TYP.  
1.2  
MAX.  
Unit  
V
Diode  
Forward Voltage  
Reverse Current  
IF = 10 mA  
VR = 5 V  
1.4  
5.0  
1.0  
IR  
µA  
µA  
MOS FET Off-state Leakage  
Current  
ILoff  
VD = 350 V  
0.03  
35  
Output Capacitance  
Cout  
IFon  
Ron1  
Ron2  
ton  
VD = 0 V, f = 1 MHz  
IL = 120 mA  
pF  
mA  
Coupled  
LED On-state Current  
On-state Resistance  
2.0  
33  
IF = 10 mA, IL = 10 mA  
26  
20  
IF = 10 mA, IL = 120 mA, t 10 ms  
IF = 10 mA, VO = 5 V, RL = 500 ,  
PW 10 ms  
26  
Turn-on Time*1  
0.3  
0.07  
2.0  
0.2  
ms  
Turn-off Time*1  
toff  
Isolation Resistance  
Isolation Capacitance  
RI-O  
CI-O  
VI-O = 1.0 kVDC  
109  
V = 0 V, f = 1 MHz  
0.5  
pF  
*1 Test Circuit for Switching Time  
I
F
50%  
Input  
Pulse Input  
V
V
L
0
V
O
= 5 V  
90%  
Input monitor  
O
monitor  
Output  
Rin  
RL  
10%  
t
on  
t
off  
4
Data Sheet PN10458EJ01V0DS  
PS7431-1A  
TYPICAL CHARACTERISTICS (TA = 25°C, unless otherwise specified)  
MAXIMUM FORWARD CURRENT vs.  
AMBIENT TEMPERATURE  
MAXIMUM LOAD CURRENT vs.  
AMBIENT TEMPERATURE  
100  
80  
60  
40  
20  
0
300  
200  
100  
0
85  
85  
–25  
0
25  
50  
75  
100  
–25  
0
25  
50  
75  
100  
Ambient Temperature T  
A
(˚C)  
Ambient Temperature T  
A
(˚C)  
FORWARD VOLTAGE vs.  
AMBIENT TEMPERATURE  
OUTPUT CAPACITANCE vs.  
APPLIED VOLTAGE  
1.8  
1.6  
1.4  
1.2  
1.0  
0.8  
100  
90  
80  
70  
60  
50  
40  
30  
20  
10  
f = 1 MHz  
I
F
= 50 mA  
30 mA  
20 mA  
10 mA  
5 mA  
1 mA  
–25  
0
25  
50  
75  
100  
0
20  
40  
60  
80  
(V)  
100  
120  
Ambient Temperature T  
A
(˚C)  
Applied Voltage V  
D
OFF-STATE LEAKAGE CURRENT vs.  
APPLIED VOLTAGE  
LOAD CURRENT vs. LOAD VOLTAGE  
10–6  
10–7  
10–8  
10–9  
10–10  
10–11  
200  
IF = 10 mA  
TA = 85˚C  
100  
–4.0  
–2.0  
0
2.0  
4.0  
25˚C  
–100  
–200  
0
100  
200  
300  
(V)  
400  
Applied Voltage V  
D
Load Voltage V (V)  
L
Remark The graphs indicate nominal characteristics.  
5
Data Sheet PN10458EJ01V0DS  
PS7431-1A  
NORMALIZED ON-STATE RESISTANCE vs.  
AMBIENT TEMPERATURE  
ON-STATE RESISTANCE DISTRIBUTION  
3.0  
30  
25  
20  
15  
n = 50 pcs,  
Normalized to 1.0  
I
I
F
= 10 mA,  
= 10 mA  
at T = 25˚C,  
A
2.5  
2.0  
1.5  
1.0  
0.5  
0.0  
L
I
I
F
= 10 mA,  
= 10 mA  
L
10  
5
0
–40 –20  
0
20  
40  
60  
(˚C)  
80  
100  
25  
26  
27  
28  
29  
Ambient Temperature T  
A
On-state Resistance Ron1 ()  
ON-STATE RESISTANCE vs.  
LOAD CURRENT  
ON-STATE RESISTANCE DISTRIBUTION  
30  
35  
30  
25  
20  
15  
n = 50 pcs,  
I = 10 mA  
F
I
I
F
= 10 mA,  
= 120 mA  
25  
20  
15  
L
10  
5
0
19  
20  
21  
22  
23  
0
20  
40  
60  
80  
100 120 140  
(mA)  
On-state Resistance Ron2 ()  
Load Current I  
L
ON-STATE RESISTANCE vs.  
LOAD CURRENT  
TURN-ON TIME vs. FORWARD CURRENT  
6
35  
30  
25  
20  
15  
VO = 5 V  
5
4
3
2
1
I
L
= 10 mA  
120 mA  
0
2
4
6
8
10  
12  
0
5
10  
15  
(mA)  
20  
Forward Current I  
F
Forward Current I  
F
(mA)  
Remark The graphs indicate nominal characteristics.  
6
Data Sheet PN10458EJ01V0DS  
PS7431-1A  
TURN-OFF TIME vs. FORWARD CURRENT  
TURN-ON TIME DISTRIBUTION  
18  
16  
14  
12  
10  
8
0.30  
n = 50 pcs,  
= 10 mA,  
= 5 V  
VO = 5 V  
I
V
F
0.25  
0.20  
0.15  
0.10  
0.05  
O
6
4
2
0
0
5
10  
15  
(mA)  
20  
0.24  
0.28  
0.32  
0.36  
Forward Current I  
F
Turn-on Time ton (ms)  
NORMALIZED TURN-ON TIME vs.  
AMBIENT TEMPERATURE  
TURN-OFF TIME DISTRIBUTION  
30  
25  
20  
15  
10  
5
3.0  
2.5  
2.0  
1.5  
1.0  
0.5  
0.0  
n = 50 pcs,  
Normalized to 1.0  
I
V
F
= 10 mA,  
= 5 V  
at T  
= 10 mA,  
= 5 V  
A
= 25˚C,  
O
I
V
F
O
0
0.06  
0.07  
0.08  
0.09  
0.10  
–40 –20  
0
20  
40  
60  
(˚C)  
80  
100  
Turn-off Time toff (ms)  
Ambient Temperature T  
A
NORMALIZED TURN-OFF TIME vs.  
AMBIENT TEMPERATURE  
3.0  
2.5  
2.0  
1.5  
1.0  
0.5  
0.0  
Normalized to 1.0  
at T  
= 10 mA,  
= 5 V  
A
= 25˚C,  
I
V
F
O
–40 –20  
0
20  
40  
60  
(˚C)  
80  
100  
Ambient Temperature T  
A
Remark The graphs indicate nominal characteristics.  
7
Data Sheet PN10458EJ01V0DS  
PS7431-1A  
TAPING SPECIFICATIONS (in millimeters)  
Outline and Dimensions (Tape)  
2.0±0.05  
4.0±0.1  
+0.1  
–0  
2.9 MAX.  
1.5  
1.55±0.1  
2.4±0.1  
0.3  
4.6±0.1  
8.0±0.1  
Tape Direction  
PS7431-1A-E3  
PS7431-1A-E4  
Outline and Dimensions (Reel)  
2.0±0.5  
2.0±0.5  
13.0±0.2  
φ
φ
φ
R 1.0  
φ
21.0±0.8  
13.5±1.0  
17.5±1.0  
11.9 to 15.4  
Outer edge of  
flange  
Packing: 900 pcs/reel  
8
Data Sheet PN10458EJ01V0DS  
PS7431-1A  
Outline and Dimensions (Tape)  
2.0±0.05  
+0.1  
–0  
4.0±0.1  
2.9 MAX.  
1.5  
1.55±0.1  
2.4±0.1  
0.3  
4.6±0.1  
8.0±0.1  
Tape Direction  
PS7431-1A-F4  
PS7431-1A-F3  
Outline and Dimensions (Reel)  
2.0±0.5  
2.0±0.5  
13.0±0.2  
φ
φ
R 1.0  
φ
φ
φ
21.0±0.8  
13.5±1.0  
17.5±1.0  
11.9 to 15.4  
Outer edge of  
flange  
Packing: 3 500 pcs/reel  
9
Data Sheet PN10458EJ01V0DS  
PS7431-1A  
RECOMMENDED SOLDERING CONDITIONS  
(1) Infrared reflow soldering  
• Peak reflow temperature  
260°C or below (package surface temperature)  
10 seconds or less  
• Time of peak reflow temperature  
• Time of temperature higher than 220°C  
60 seconds or less  
• Time to preheat temperature from 120 to 180°C 120±30 s  
• Number of reflows  
• Flux  
Three  
Rosin flux containing small amount of chlorine (The flux with a  
maximum chlorine content of 0.2 Wt% is recommended.)  
Recommended Temperature Profile of Infrared Reflow  
(heating)  
to 10 s  
260˚C MAX.  
220˚C  
to 60 s  
180˚C  
120˚C  
120±30 s  
(preheating)  
Time (s)  
(2) Wave soldering  
• Temperature  
• Time  
260°C or below (molten solder temperature)  
10 seconds or less  
• Preheating conditions  
• Number of times  
• Flux  
120°C or below (package surface temperature)  
One  
Rosin flux containing small amount of chlorine (The flux with a maximum chlorine  
content of 0.2 Wt% is recommended.)  
(3) Cautions  
• Fluxes  
Avoid removing the residual flux with freon-based and chlorine-based cleaning solvent.  
10  
Data Sheet PN10458EJ01V0DS  
PS7431-1A  
The information in this document is current as of January, 2004. The information is subject to  
change without notice. For actual design-in, refer to the latest publications of NEC's data sheets or  
data books, etc., for the most up-to-date specifications of NEC semiconductor products. Not all  
products and/or types are available in every country. Please check with an NEC sales representative  
for availability and additional information.  
No part of this document may be copied or reproduced in any form or by any means without prior  
written consent of NEC. NEC assumes no responsibility for any errors that may appear in this document.  
NEC does not assume any liability for infringement of patents, copyrights or other intellectual property rights of  
third parties by or arising from the use of NEC semiconductor products listed in this document or any other  
liability arising from the use of such products. No license, express, implied or otherwise, is granted under any  
patents, copyrights or other intellectual property rights of NEC or others.  
Descriptions of circuits, software and other related information in this document are provided for illustrative  
purposes in semiconductor product operation and application examples. The incorporation of these  
circuits, software and information in the design of customer's equipment shall be done under the full  
responsibility of customer. NEC assumes no responsibility for any losses incurred by customers or third  
parties arising from the use of these circuits, software and information.  
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agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize  
risks of damage to property or injury (including death) to persons arising from defects in NEC  
semiconductor products, customers must incorporate sufficient safety measures in their design, such as  
redundancy, fire-containment, and anti-failure features.  
NEC semiconductor products are classified into the following three quality grades:  
"Standard", "Special" and "Specific". The "Specific" quality grade applies only to semiconductor products  
developed based on a customer-designated "quality assurance program" for a specific application. The  
recommended applications of a semiconductor product depend on its quality grade, as indicated below.  
Customers must check the quality grade of each semiconductor product before using it in a particular  
application.  
"Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio  
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and industrial robots  
"Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster  
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed  
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The quality grade of NEC semiconductor products is "Standard" unless otherwise expressly specified in NEC's  
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(Note)  
(1) "NEC" as used in this statement means NEC Corporation, NEC Compound Semiconductor Devices, Ltd.  
and also includes its majority-owned subsidiaries.  
(2) "NEC semiconductor products" means any semiconductor product developed or manufactured by or for  
NEC (as defined above).  
M8E 00. 4-0110  
11  
Data Sheet PN10458EJ01V0DS  
PS7431-1A  
This product uses gallium arsenide (GaAs).  
Caution GaAs Products  
GaAs vapor and powder are hazardous to human health if inhaled or ingested, so please observe  
the following points.  
• Follow related laws and ordinances when disposing of the product. If there are no applicable laws  
and/or ordinances, dispose of the product as recommended below.  
1. Commission a disposal company able to (with a license to) collect, transport and dispose of  
materials that contain arsenic and other such industrial waste materials.  
2. Exclude the product from general industrial waste and household garbage, and ensure that the  
product is controlled (as industrial waste subject to special control) up until final disposal.  
• Do not burn, destroy, cut, crush, or chemically dissolve the product.  
• Do not lick the product or in any way allow it to enter the mouth.  
For further information, please contact  
NEC Compound Semiconductor Devices, Ltd.  
http://www.ncsd.necel.com/  
E-mail: salesinfo@ml.ncsd.necel.com (sales and general)  
techinfo@ml.ncsd.necel.com (technical)  
5th Sales Group, Sales Division TEL: +81-44-435-1588 FAX: +81-44-435-1579  
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E-mail: ncsd-hk@elhk.nec.com.hk (sales, technical and general)  
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http://www.cel.com/  
0310  

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