PS2715-1-F4 [NEC]
HIGH CTR, AC INPUT 4-PIN SOP PHOTOCOUPLER; 很高的点击率，交流输入4 -PIN SOP光耦合器
| 型号： | PS2715-1-F4 |
| 厂家： | 
NEC |
| 描述： | HIGH CTR, AC INPUT 4-PIN SOP PHOTOCOUPLER |
| 文件： | 总12页 (文件大小：93K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
DATA SHEET
PHOTOCOUPLER
PS2715-1
HIGH CTR, AC INPUT
4-PIN SOP PHOTOCOUPLER
−NEPOCTM Series−
DESCRIPTION
The PS2715-1 is an optically coupled isolator containing GaAs light emitting diodes and an NPN silicon
phototransistor in a plastic SOP for high density applications.
The package is an SOP (Small Outline Package) type for high density mounting applications.
FEATURES
•
•
•
•
•
•
AC input response
High current transfer ratio (CTR = 200 % TYP. @ I
High isolation voltage (BV = 3 750 Vr.m.s.)
Small and thin package (4-pin SOP)
F
= ±1 mA)
Ordering number of tape product: PS2715-1-F3, F4
UL approved: File No. E72422 (S)
APPLICATIONS
•
•
Programmable logic controllers
Modem/FAX
The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
Not all devices/types available in every country. Please check with local NEC representative for
availability and additional information.
Document No. P14946EJ1V0DS00 (1st edition)
Date Published July 2000 NS CP(K)
Printed in Japan
2000
©
PS2715-1
PACKAGE DIMENSIONS
in millimeters
4±0.5
TOP VIEW
4
3
1. Anode, Cathode
2. Cathode, Anode
3. Emitter
4. Collector
1
2
7.0±0.3
4.4
2.54
0.5±0.3
+0.10
0.4
0.25 M
–0.05
MARKING
Trade Mark
No. 1 pin Mark
2715
N003
Type Number
Assembly Lot
N
0 03
Week Assembled
Year Assembled
(Last 1 Digit)
CTR Rank Name
2
Data Sheet P14946EJ1V0DS00
PS2715-1
ORDERING INFORMATION
Safety Standards
Approval
Application Part
Number*1
Part Number
PS2715-1
Package
Packing Style
4-pin SOP
50 pcs (Tape 50 pcs cut)
UL approved
PS2715-1
PS2715-1-F3
PS2715-1-F4
Embossed Tape 3 500 pcs/reel
*1 For the application of the Safety Standard, following part number should be used.
ABSOLUTE MAXIMUM RATINGS (TA = 25 °C, unless otherwise specified)
Parameter
Symbol
IF
Ratings
Unit
mA
Diode
Forward Current (DC)
Power Dissipation Derating
Power Dissipation
±50
∆PD/°C
PD
0.8
mW/°C
mW
A
80
Peak Forward Current*1
IFP
±0.5
Transistor Collector to Emitter Voltage
Emitter to Collector Voltage
Collector Current
VCEO
VECO
IC
40
V
5
40
V
mA
Power Dissipation Derating
Power Dissipation
∆PC/°C
PC
1.5
mW/°C
mW
Vr.m.s.
°C
150
Isolation Voltage*2
BV
3 750
Operating Ambient Temperature
Storage Temperature
TA
–55 to +100
–55 to +150
Tstg
°C
*1 PW = 100 µs, Duty Cycle = 1 %
*2 AC voltage for 1 minute at TA = 25 °C, RH = 60 % between input and output
3
Data Sheet P14946EJ1V0DS00
PS2715-1
ELECTRICAL CHARACTERISTICS (TA = 25 °C)
Parameter
Symbol
VF
Conditions
MIN.
TYP.
1.15
60
MAX.
1.4
Unit
V
Diode
Forward Voltage
Terminal Capacitance
IF = ±5 mA
Ct
V = 0 V, f = 1 MHz
pF
nA
Transistor Collector to Emitter Dark
Current
ICEO
IF = 0 mA, VCE = 40 V
100
400
0.3
Coupled
Current Transfer Ratio
(IC/IF)
CTR
IF = ±1 mA, VCE = 5 V
100
1011
200
%
Collector Saturation Voltage
Isolation Resistance
Isolation Capacitance
Rise Time*1
VCE (sat)
RI-O
CI-O
tr
IF = ±1 mA, IC = 0.2 mA
VI-O = 1 kVDC
V
Ω
V = 0 V, f = 1 MHz
0.4
4
pF
µs
VCC = 5 V, IC = 2 mA, RL = 100 Ω
Fall Time*1
tf
5
*1 Test circuit for switching time
Pulse Input
V
V
CC
PW = 100 µs
Duty cycle = 1/10
I
F
In monitor
OUT
50 Ω
RL = 100 Ω
4
Data Sheet P14946EJ1V0DS00
PS2715-1
TYPICAL CHARACTERISTICS (TA = 25 °C, unless otherwise specified)
DIODE POWER DISSIPATION vs.
AMBIENT TEMPERATURE
TRANSISTOR POWER DISSIPATION
vs. AMBIENT TEMPERATURE
200
150
100
50
100
80
60
40
20
25
Ambient Temperature T
50
75
100
0
25
Ambient Temperature T
50
75
100
0
A
(˚C)
A
(˚C)
FORWARD CURRENT vs.
FORWARD VOLTAGE
COLLECTOR TO EMITTER DARK
CURRENT vs. AMBIENT TEMPERATURE
10 000
100
10
1
1 000
100
TA
= +100 ˚C
+60 ˚C
V
CE = 40 V
20 V
+25 ˚C
10 V
0 ˚C
–25 ˚C
–50 ˚C
10
1
0.1
0.01
0.0
0.5
1.0
1.5
(V)
2.0
–25
0
25
50
75
100
Forward Voltage V
F
Ambient Temperature T
A
(˚C)
COLLECTOR CURRENT vs.
COLLECTOR TO EMITTER VOLTAGE
COLLECTOR CURRENT vs.
COLLECTOR SATURATION VOLTAGE
25
20
15
10
5
100
10 mA
5 mA
2 mA
IF = 10 mA
5 mA
10
1 mA
1
I
F
= 0.5mA
2 mA
1 mA
0.5 mA
0.1
0.0
0
2
4
6
8
10
0.2
0.4
0.6
0.8
1.0
Collector to Emitter Voltage VCE (V)
Collector Saturation Voltage VCE(sat) (V)
5
Data Sheet P14946EJ1V0DS00
PS2715-1
CURRENT TRANSFER RATIO vs.
FORWARD CURRENT
NORMALIZED CURRENT TRANSFER
RATIO vs. AMBIENT TEMPERATURE
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
500
400
300
200
V
n = 3
CE = 5 V,
100
0
Normalized to 1.0
at T
A
= 25 ˚C,
I
F
= 1 mA, VCE = 5 V
0.1
1
10
(mA)
100
–50
–25
0
25
50
75
(˚C)
100
0.01
Ambient Temperature T
A
Forward Current I
F
SWITCHING TIME vs.
LOAD RESISTANCE
SWITCHING TIME vs.
LOAD RESISTANCE
100
10
1 000
I
V
C
= 2 mA,
CC = 5 V,
CTR = 200 %
t
f
I
V
F
= 1 mA,
CC = 5 V,
CTR = 200 %
100
µ
ts
µ
t
f
t
r
tr
10
td
td
1
1
ts
0.1
100
0.1
10
10 k
1k
10 k
(kΩ)
100 k
100
Load Resistance R
1 k
L
(kΩ)
Load Resistance R
L
FREQUENCY RESPONSE
LONG TERM CTR DEGRADATION
1.2
1.0
0.8
0.6
0.4
0.2
I = 1 mA
F
0
–5
100 Ω
300 Ω
T
A
= 25 ˚C
= 60 ˚C
R = 1 kΩ
L
–10
–15
–20
–25
TA
0
102
103
104
105
106
0.1
1
10
100
1 000
10
Frequency f (kHz)
Time (Hr)
Remark The graphs indicate nominal characteristics.
6
Data Sheet P14946EJ1V0DS00
PS2715-1
TAPING SPECIFICATIONS (in millimeters)
Outline and Dimensions (Tape)
2.0±0.1
4.0±0.1
2.4±0.1
1.55±0.1
0.3
1.55±0.1
4.6±0.1
8.0±0.1
Tape Direction
PS2715-1-F4
PS2715-1-F3
Outline and Dimensions (Reel)
1.5
φ
2.0±0.5
1.5±0.5
φ
φ
φ
6.0±1
+2.0
–0.0
12.4
Packing: 3 500 pcs/reel
7
Data Sheet P14946EJ1V0DS00
PS2715-1
NOTES ON HANDLING
1. Recommended soldering conditions
(1) Infrared reflow soldering
• Peak reflow temperature
• Time of temperature higher than 210 °C
• Number of reflows
235 °C or below (package surface temperature)
30 seconds or less
Three
• Flux
Rosin flux containing small amount of chlorine (The flux with a
maximum chlorine content of 0.2 Wt % is recommended.)
Recommended Temperature Profile of Infrared Reflow
(heating)
to 10 s
235 ˚C (peak temperature)
210 ˚C
to 30 s
100 to 160 ˚C
60 to 120 s
(preheating)
Time (s)
(2) Dip soldering
• Temperature
• Time
260 °C or below (molten solder temperature)
10 seconds or less
• Number of times
• Flux
One (Allowed to be dipped in solder including plastic mold portion.)
Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of
0.2 Wt % is recommended.)
(3) Cautions
• Fluxes
Avoid removing the residual flux with freon-based and chlorine-based cleaning solvent.
2. Cautions regarding noise
Be aware that when voltage is applied suddenly between the photocoupler’s input and output or between
corrector-emitters at startup, the output side may enter the on state, even if the voltage is within the absolute
maximum ratings.
8
Data Sheet P14946EJ1V0DS00
PS2715-1
[MEMO]
9
Data Sheet P14946EJ1V0DS00
PS2715-1
[MEMO]
10
Data Sheet P14946EJ1V0DS00
PS2715-1
[MEMO]
11
Data Sheet P14946EJ1V0DS00
PS2715-1
CAUTION
Within this device there exists GaAs (Gallium Arsenide) material which is a
harmful substance if ingested. Please do not under any circumstances break the
hermetic seal.
NEPOC is a trademark of NEC Corporation.
•
The information in this document is current as of July, 2000. The information is subject to change
without notice. For actual design-in, refer to the latest publications of NEC's data sheets or data
books, etc., for the most up-to-date specifications of NEC semiconductor products. Not all products
and/or types are available in every country. Please check with an NEC sales representative for
availability and additional information.
•
•
No part of this document may be copied or reproduced in any form or by any means without prior
written consent of NEC. NEC assumes no responsibility for any errors that may appear in this document.
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third parties by or arising from the use of NEC semiconductor products listed in this document or any other
liability arising from the use of such products. No license, express, implied or otherwise, is granted under any
patents, copyrights or other intellectual property rights of NEC or others.
•
•
•
Descriptions of circuits, software and other related information in this document are provided for illustrative
purposes in semiconductor product operation and application examples. The incorporation of these
circuits, software and information in the design of customer's equipment shall be done under the full
responsibility of customer. NEC assumes no responsibility for any losses incurred by customers or third
parties arising from the use of these circuits, software and information.
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agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize
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redundancy, fire-containment, and anti-failure features.
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"Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
support systems and medical equipment for life support, etc.
The quality grade of NEC semiconductor products is "Standard" unless otherwise expressly specified in NEC's
data sheets or data books, etc. If customers wish to use NEC semiconductor products in applications not
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(Note)
(1) "NEC" as used in this statement means NEC Corporation and also includes its majority-owned subsidiaries.
(2) "NEC semiconductor products" means any semiconductor product developed or manufactured by or for
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M8E 00. 4
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