PS2561L1-1 [NEC]

HIGH ISOLATION VOLTAGE SINGLE TRANSISTOR TYPE MULTI PHOTOCOUPLER SERIES; 高隔离电压单晶体管型多光耦合器系列
PS2561L1-1
型号: PS2561L1-1
厂家: NEC    NEC
描述:

HIGH ISOLATION VOLTAGE SINGLE TRANSISTOR TYPE MULTI PHOTOCOUPLER SERIES
高隔离电压单晶体管型多光耦合器系列

晶体 光电 晶体管 输出元件 分离技术 隔离技术
文件: 总12页 (文件大小:101K)
中文:  中文翻译
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DATA SHEET  
PHOTOCOUPLER  
PS2561-1,-2, PS2561L-1,-2  
HIGH ISOLATION VOLTAGE  
SINGLE TRANSISTOR TYPE  
MULTI PHOTOCOUPLER SERIES  
DESCRIPTION  
The PS2561-1, -2 and PS2561L-1, -2 are optically coupled isolators containing a GaAs light emitting diode and an  
NPN silicon phototransistor.  
PS2561-1, -2 are in a plastic DIP (Dual In-line Package) and PS2561L-1, -2 are lead bending type (Gull-wing) for  
surface mount.  
FEATURES  
High isolation voltage  
BV = 5 000 Vr.m.s.: standard products  
BV = 3 750 Vr.m.s.: VDE0884 approved products (Option)  
High collector to emitter voltage (VCEO = 80 V)  
High current transfer ratio (CTR = 200 % TYP.)  
High-speed switching (tr = 3 µs TYP., tf = 5 µs TYP.)  
UL approved (File No. E72422 (S) )  
CSA approved (No. CA 101391)  
BSI approved (BS415, BS7002) No. 7112  
SEMKO approved (SS4410165) No. 9317144  
NEMKO approved (NEK-HD 195S6) No. A21409  
DEMKO approved (Section 101, 137) No. 300535  
FIMKO approved (E69-89) No. 167265-08  
VDE0884 approved (Option)  
APPLICATIONS  
Power supply  
Telephone/FAX.  
FA/OA equipment  
Programmable logic controller  
The information in this document is subject to change without notice.  
Document No. P12989EJ4V0DS00 (4th edition)  
(Previous No. LC-2225)  
The mark shows major revised points.  
1992  
©
Date Published August 1997 NS  
Printed in Japan  
PS2561-1,-2,PS2561L-1,-2  
PACKAGE DIMENSIONS (in millimeters)  
DIP Type  
PS2561-1  
PS2561-1 (New Package)  
3
2
4
1
3
4
5.1 MAX.  
4.6 ± 0.35  
1 2  
1. Anode  
1. Anode  
2. Cathode  
3. Emitter  
4. Collector  
2. Cathode  
3. Emitter  
4. Collector  
7.62  
7.62  
1.25±0.15  
1.25±0.15  
0.50 ± 0.10  
0.25  
0 to 15˚  
0 to 15˚  
0.50 ± 0.10  
M
M
0.25  
2.54  
2.54  
PS2561L1-1  
PS2561-2  
3
2
4
1
8 7 6 5  
5.1 MAX.  
10.2 MAX.  
1 2 3 4  
1. Anode  
1, 3. Anode  
2. Cathode  
3. Emitter  
4. Collector  
2, 4. Cathode  
5, 7. Emitter  
6, 8. Collector  
10.16  
7.62  
7.62  
0.50 ± 0.10  
1.25±0.15  
0 to 15˚  
1.25±0.15  
M
0.25  
0 to 15˚  
0.50 ± 0.10  
M
0.25  
2.54  
2.54  
Caution New package 1ch only  
2
PS2561-1,-2,PS2561L-1,-2  
Lead Bending Type  
PS2561L-1 (New Package)  
PS2561L-1  
3
2
4
1
3
4
4.6 ± 0.35  
5.1 MAX.  
1 2  
1. Anode  
1. Anode  
2. Cathode  
3. Emitter  
4. Collector  
2. Cathode  
3. Emitter  
4. Collector  
7.62  
7.62  
0.90 ± 0.25  
9.60 ± 0.4  
0.90 ± 0.25  
9.60 ± 0.4  
1.25±0.15  
0.25  
1.25±0.15  
M
M
0.25  
2.54  
2.54  
PS2561L-2  
PS2561L2-1  
3
2
4
1
8 7 6 5  
5.1 MAX.  
10.2 MAX.  
1 2 3 4  
1. Anode  
1, 3. Anode  
2. Cathode  
3. Emitter  
4. Collector  
2, 4. Cathode  
5, 7. Emitter  
6, 8. Collector  
7.62  
7.62  
0.9 ± 0.25  
10.16  
0.90 ± 0.25  
9.60 ± 0.4  
1.25±0.15  
1.25±0.15  
M
0.25  
M
0.25  
12.0 MAX.  
2.54  
2.54  
Caution New package 1ch only  
3
PS2561-1,-2,PS2561L-1,-2  
ORDERING INFORMATION  
Part Number  
Package  
Safety Standard Approval  
Application part  
number*1  
PS2561-1  
4-pin DIP  
Standard products  
• UL approved  
PS2561-1  
• CSA approved  
PS2561L-1  
PS2561L1-1  
PS2561L2-1  
4-pin DIP (lead bending surface mount)  
4-pin DIP (for long distance)  
4-pin DIP (for long distance surface  
mount)  
• BSI approved  
• NEMKO approved  
• DEMKO approved • SEMKO approved  
• FIMKO approved  
PS2561-2  
8-pin DIP  
PS2561-2  
PS2561-1  
PS2561L-2  
8-pin DIP (lead bending surface mount)  
PS2561-1-V  
4-pin DIP  
VDE0884 approved products (Option)  
PS2561L-1-V  
PS2561L1-1-V  
PS2561L2-1-V  
4-pin DIP (lead bending surface mount)  
4-pin DIP (for long distance)  
4-pin DIP (for long distance surface  
mount)  
PS2561-2-V  
8-pin DIP  
PS2561-2  
PS2561L-2-V  
8-pin DIP (lead bending surface mount)  
*1 As applying to Safety Standard, following part number should be used.  
ABSOLUTE MAXIMUM RATINGS (TA = 25 °C, unless otherwise specified)  
Parameter  
Symbol  
Ratings  
PS2561-1,  
Unit  
PS2561-2,  
PS2561L-2  
PS2561L-1  
Diode  
Reverse Voltage  
VR  
IF  
6
V
Forward Current (DC)  
Power Dissipation Derating  
Power Dissipation  
80  
mA  
PD/°C  
PD  
1.5  
1.2  
mW/°C  
mW/ch  
A
150  
120  
Peak Forward Current*1  
IFP  
1
80  
7
Transistor Collector to Emitter Voltage  
Emitter to Collector Voltage  
Collector Current  
VCEO  
VECO  
IC  
V
V
50  
mA/ch  
mW/°C  
mW/ch  
Vr.m.s.  
Power Dissipation Derating  
PC/°C  
PC  
1.5  
1.2  
Power Dissipation  
150  
120  
Isolation Voltage*2  
BV  
5 000  
3 750*3  
Operating Ambient Temperature  
Storage Temperature  
TA  
–55 to +100  
–55 to +150  
°C  
°C  
Tstg  
*1 PW = 100 µs, Duty Cycle = 1 %  
*2 AC voltage for 1 minute at TA = 25 °C, RH = 60 % between input and output  
*3 VDE0884 approved products (Option)  
4
PS2561-1,-2,PS2561L-1,-2  
ELECTRICAL CHARACTERISTICS (TA = 25 °C)  
Parameter  
Symbol  
VF  
Conditions  
MIN.  
TYP.  
1.17  
MAX.  
1.4  
5
Unit  
V
Diode  
Forward Voltage  
Reverse Current  
Terminal Capacitance  
IF = 10 mA  
VR = 5 V  
IR  
µA  
pF  
nA  
Ct  
V = 0 V, f = 1.0 MHz  
VCE = 80 V, IF = 0 mA  
50  
Transistor Collector to Emitter Dark  
Current  
ICEO  
100  
Current Transfer Ratio*1  
Coupled  
CTR  
IF = 5 mA, VCE = 5 V  
IF = 10 mA, IC = 2 mA  
80  
200  
400  
0.3  
%
V
Collector Saturation  
Voltage  
VCE (sat)  
Isolation Resistance  
Isolation Capacitance  
Rise Time *2  
RI-O  
CI-O  
tr  
VI-O = 1.0 kV  
1011  
V = 0 V, f = 1.0 MHz  
VCC = 10 V, IC = 2 mA, RL = 100 Ω  
0.5  
3
pF  
µs  
Fall Time *2  
tf  
5
*1 CTR rank (only PS2561-1, PS2561L-1)  
: 200 to 400 (%)  
*2 Test circuit for switching time  
Pulse Input  
VCC  
L
µ
PW = 100  
s
M : 80 to 240 (%)  
D : 100 to 300 (%)  
H : 80 to 160 (%)  
W : 130 to 260 (%)  
Duty Cycle = 1/10  
IF  
V
OUT  
50  
RL = 100 Ω  
5
PS2561-1,-2,PS2561L-1,-2  
TYPICAL CHARACTERISTICS (TA = 25 °C, unless otherwise specified)  
DIODE POWER DISSIPATION vs.  
AMBIENT TEMPERATURE  
TRANSISTOR POWER DISSIPATION  
vs. AMBIENT TEMPERATURE  
150  
100  
150  
100  
50  
PS2561-1  
PS2561-1  
PS2561L-1  
PS2561L-1  
PS2561-2  
PS2561-2  
1.5 mW/˚C  
PS2561L-2  
1.5 mW/˚C  
PS2561L-2  
50  
0
1.2 mW/˚C  
1.2 mW/˚C  
100  
Ambient Temperature T  
25  
50  
75  
125  
(˚C)  
150  
0
25  
50  
75  
100  
125  
(˚C)  
150  
A
Ambient Temperature T  
A
FORWARD CURRENT vs.  
FORWARD VOLTAGE  
COLLECTOR CURRENT vs.  
COLLECTOR TO EMITTER VOLTAGE  
100  
50  
70  
TA  
= +100 ˚C  
+60 ˚C  
60  
50  
40  
30  
20  
10  
+25 ˚C  
10  
5
0 ˚C  
–25 ˚C  
–55 ˚C  
1
0.5  
IF = 5 mA  
0.1  
0
4
8
10  
0.7 0.8 0.9 1.0 1.1 1.2 1.3 1.4 1.5  
Forward Voltage V (V)  
2
6
F
Collector to Emitter Voltage VCE (V)  
COLLECTOR TO EMITTER DARK  
CURRENT vs. AMBIENT TEMPERATURE  
COLLECTOR CURRENT vs.  
COLLECTOR SATURATION VOLTAGE  
40  
10 000  
1 000  
100  
10  
V
CE = 80 V  
40 V  
10  
5
24 V  
10 V  
5 V  
IF  
= 1 mA  
1
0.5  
1
0.1  
50  
–25  
0
25  
50  
75  
100  
1.0  
0
0.2  
0.4  
0.6  
0.8  
Ambient Temperature T (˚C)  
A
Collector Saturation Voltage VCE(sat) (V)  
6
PS2561-1,-2,PS2561L-1,-2  
NORMALIZED CURRENT TRANSFER  
RATIO vs. AMBIENT TEMPERATURE  
CURRENT TRANSFER RATIO vs.  
FORWARD CURRENT  
1.2  
1.0  
0.8  
0.6  
0.4  
0.2  
0
450  
400  
350  
300  
250  
200  
150  
100  
Normalized to 1.0  
at TA = 25 ˚C,  
IF = 5 mA, VCE = 5 V  
50  
0
–50  
0.05 0.1  
0.5  
Forward Current IF (mA)  
–25  
0
25  
50  
75  
100  
1
5
10  
50  
Ambient Temperature TA (˚C)  
SWITCHING TIME vs.  
LOAD RESISTANCE  
SWITCHING TIME vs.  
LOAD RESISTANCE  
50  
10  
1 000  
100  
10  
t
f
IF = 5 mA,  
VCC = 5 V,  
CTR = 290 %  
IC = 2 mA,  
VCC = 10 V,  
CTR = 290 %  
tf  
tr  
µ
µ
ts  
td  
ts  
1
tr  
t
d
0.1  
10  
1
100  
10 k  
5 k  
50 100  
500  
1 k  
500 1 k  
5 k 10 k  
50 k 100 k  
Load Resistance RL ()  
Load Resistance RL ()  
FREQUENCY RESPONSE  
LONG TIME CTR DEGRADATION  
1.2  
1.0  
0.8  
0.6  
0.4  
0.2  
IF = 5 mA,  
VCE = 5 V  
TYP.  
0
–5  
IF = 5 mA  
TA = 25 ˚C  
–10  
–15  
–20  
100 Ω  
IF = 5 mA  
TA = 60 ˚C  
RL = 1 kΩ  
300 Ω  
0
102  
104  
105  
0.5  
1
2
5
10 20 50 100200 500  
103  
Frequency f (kHz)  
Time (Hr)  
7
PS2561-1,-2,PS2561L-1,-2  
TAPING SPECIFICATIONS (in millimeters)  
Outline and Dimensions (Tape)  
2.0±0.1  
4.0±0.1  
4.3±0.2  
1.55±0.1  
0.3  
1.55±0.1  
5.6±0.1  
8.0±0.1  
Taping Direction  
PS2561L-1-E3  
PS2561L-1-F3  
PS2561L-1-E4  
PS2561L-1-F4  
Outline and Dimensions (Reel)  
2.0±0.5  
13.0±0.5  
φ
φ
φ
R 1.0  
φ
φ
21.0±0.8  
+2.0  
16.4  
–0.0  
Packing: PS2561L-1-E3, E4 1 000 pcs/reel  
PS2561L-1-F3, F4 2 000 pcs/reel  
8
PS2561-1,-2,PS2561L-1,-2  
Outline and Dimensions (Tape)  
2.0±0.1  
4.0±0.1  
1.55±0.1  
4.3±0.2  
0.3  
10.4±0.1  
1.55±0.1  
12.0±0.1  
Taping Direction  
PS2561L-2-E3  
PS2561L-2-E4  
Outline and Dimensions (Reel)  
2.0±0.5  
φ13.0±0.5  
φ
R 1.0  
φ
φ21.0±0.8  
+2.0  
16.4  
–0.0  
Packing: 1 000 pcs/reel  
9
PS2561-1,-2,PS2561L-1,-2  
RECOMMENDED SOLDERING CONDITIONS  
(1) Infrared reflow soldering  
• Peak reflow temperature  
• Time of temperature higher than 210 °C  
• Number of reflows  
235 °C (package surface temperature)  
30 seconds or less  
Three  
• Flux  
Rosin flux containing small amount of chlorine (The flux with a  
maximum chlorine content of 0.2 Wt % is recommended.)  
Recommended Temperature Profile of Infrared Reflow  
(heating)  
to 10 s  
235 ˚C (peak temperature)  
210 ˚C  
to 30 s  
120 to 160 ˚C  
60 to 90 s  
(preheating)  
Time (s)  
Caution Please avoid to removed the residual flux by water after the first reflow processes.  
Peak temperature 235 ˚C or below  
(2) Dip soldering  
• Temperature  
260 °C or below (molten solder temperature)  
• Time  
10 seconds or less  
• Number of times  
• Flux  
One  
Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of  
0.2 Wt % is recommended.)  
10  
PS2561-1,-2,PS2561L-1,-2  
SPECIFICATION OF VDE MARKS LICENSE DOCUMENT (VDE0884)  
Parameter  
Application classification (DIN VDE 0109)  
Symbol  
Speck  
Unit  
for rated line voltages 300 Vr.m.s.  
for rated line voltages 600 Vr.m.s.  
IV  
III  
Climatic test class (DIN IEC 68 Teil 1/09.80)  
55/100/21  
Dielectric strength maximum operating isolation voltage  
Test voltage (partial discharge test procedure a for type test and random test)  
Upr = 1.2 × UIORM, Pd < 5 pC  
UIORM  
Upr  
890  
Vpeak  
Vpeak  
1 068  
Test voltage (partial discharge test procedure b for random test)  
Upr = 1.6 × UIORM, Pd < 5 pC  
Upr  
1 424  
Vpeak  
Highest permissible overvoltage  
Degree of pollution (DIN VDE 0109)  
Clearance distance  
UTR  
6 000  
2
Vpeak  
> 7.0  
mm  
mm  
Creepage distance  
> 7.0  
Comparative tracking index (DIN IEC 112/VDE 0303 part 1)  
Material group (DIN VDE 0109)  
Storage temperature range  
CTI  
175  
III a  
Tstg  
TA  
–55 to +150  
–55 to +100  
°C  
°C  
Operating temperature range  
Isolation resistance, minimum value  
VIO = 500 V dc at TA = 25 °C  
Ris MIN.  
Ris MIN.  
1012  
1011  
VIO = 500 V dc at TA MAX. at least 100 °C  
Safety maximum ratings (maximum permissible in case of fault, see thermal  
derating curve)  
Package temperature  
Tsi  
Isi  
175  
400  
700  
°C  
mA  
mW  
Current (input current IF, Psi = 0)  
Power (output or total power dissipation)  
Isolation resistance  
Psi  
VIO = 500 V dc at TA = 175 °C (Tsi)  
Ris MIN.  
109  
11  
PS2561-1,-2,PS2561L-1,-2  
CAUTION  
Within this device there exists GaAs (Gallium Arsenide) material which is a  
harmful substance if ingested. Please do not under any circumstances break the  
hermetic seal.  
No part of this document may be copied or reproduced in any form or by any means without the prior written  
consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this  
document.  
NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual  
property rights of third parties by or arising from use of a device described herein or any other liability arising  
from use of such device. No license, either express, implied or otherwise, is granted under any patents,  
copyrights or other intellectual property rights of NEC Corporation or others.  
While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices,  
the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or  
property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety  
measures in its design, such as redundancy, fire-containment, and anti-failure features.  
NEC devices are classified into the following three quality grades:  
"Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on  
a customer designated "quality assurance program" for a specific application. The recommended applications  
of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each  
device before using it in a particular application.  
Standard: Computers, office equipment, communications equipment, test and measurement equipment,  
audio and visual equipment, home electronic appliances, machine tools, personal electronic  
equipment and industrial robots  
Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster  
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed  
for life support)  
Specific: Aircrafts, aerospace equipment, submersible repeaters, nuclear reactor control systems, life  
support systems or medical equipment for life support, etc.  
The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books.  
If customers intend to use NEC devices for applications other than those specified for Standard quality grade,  
they should contact an NEC sales representative in advance.  
Anti-radioactive design is not implemented in this product.  
M4 96. 5  

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