NE687M33-T3FB [NEC]

RF Small Signal Bipolar Transistor, 0.03A I(C), 1-Element, L Band, Silicon, NPN, SUPER MINIMOLD PACKAGE-3;
NE687M33-T3FB
型号: NE687M33-T3FB
厂家: NEC    NEC
描述:

RF Small Signal Bipolar Transistor, 0.03A I(C), 1-Element, L Band, Silicon, NPN, SUPER MINIMOLD PACKAGE-3

光电二极管 晶体管
文件: 总7页 (文件大小:55K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
DATA SHEET  
NPN SILICON RF TRANSISTOR  
NE687M33  
NPN SILICON RF TRANSISTOR FOR  
HIGH-FREQUENCY LOW NOISE  
3-PIN SUPER LEAD-LESS MINIMOLD (M33)  
FEATURES  
Low noise  
NF = 1.5 dB TYP. @ VCE = 1 V, IC = 3 mA, f = 2 GHz  
3-pin super lead-less minimold (M33) package  
ORDERING INFORMATION  
Part Number  
Quantity  
Supplying Form  
NE687M33  
50 pcs (Non reel)  
10 kpcs/reel  
• 8 mm wide embossed taping  
• Pin 2 (Base) face the perforation side of the tape  
NE687M33-T3  
Remark To order evaluation samples, contact your nearby sales office.  
The unit sample quantity is 50 pcs.  
ABSOLUTE MAXIMUM RATINGS (TA = +25°C)  
Parameter  
Collector to Base Voltage  
Collector to Emitter Voltage  
Emitter to Base Voltage  
Collector Current  
Symbol  
VCBO  
VCEO  
VEBO  
IC  
Ratings  
Unit  
5.0  
V
V
3.0  
2.0  
30  
V
mA  
mW  
°C  
°C  
Note  
Total Power Dissipation  
Junction Temperature  
Storage Temperature  
Ptot  
90  
Tj  
150  
65 to +150  
Tstg  
Note Mounted on 1.08 cm2 × 1.0 mm (t) glass epoxy PCB  
Caution Observe precautions when handling because these devices are sensitive to electrostatic discharge.  
The information in this document is subject to change without notice. Before using this document, please confirm that  
this is the latest version.  
Not all devices/types available in every country. Please check with local NEC Compound Semiconductor Devices  
representative for availability and additional information.  
Document No. PU10342EJ02V0DS (2nd edition)  
Date Published August 2003 CP(K)  
The mark  shows major revised points.  
Printed in Japan  
© NEC Compound Semiconductor Devices 2003  
NE687M33  
ELECTRICAL CHARACTERISTICS (TA = +25°C)  
Parameter  
DC Characteristics  
Symbol  
Test Conditions  
MIN.  
TYP.  
MAX.  
Unit  
Collector Cut-off Current  
Emitter Cut-off Current  
DC Current Gain  
ICBO  
IEBO  
VCB = 5 V, IE = 0 mA  
100  
100  
140  
nA  
nA  
VEB = 1 V, IC = 0 mA  
VCE = 1 V, IC = 10 mA  
Note 1  
hFE  
70  
110  
RF Characteristics  
Gain Bandwidth Product  
Insertion Power Gain  
Noise Figure  
fT  
VCE = 1 V, IC = 10 mA, f = 2 GHz  
VCE = 1 V, IC = 10 mA, f = 2 GHz  
10  
7
12  
9
GHz  
dB  
S21e2  
VCE = 1 V, IC = 3 mA, f = 2 GHz,  
ZS = Zopt  
NF  
1.5  
2.0  
dB  
Note 2  
Reverse Transfer Capacitance  
Cre  
VCB = 0.5 V, IC = 0 mA, f = 1 MHz  
0.4  
0.7  
pF  
Notes 1. Pulse measurement: PW 350 µs, Duty Cycle 2%  
2. Collector to base capacitance when the emitter grounded  
hFE CLASSIFICATION  
Rank  
FB  
W2  
Marking  
hFE Value  
70 to 140  
2
Data Sheet PU10342EJ02V0DS  
NE687M33  
TYPICAL CHARACTERISTICS (TA = +25°C ,unless otherwise specified)  
REVERSE TRANSFER CAPACITANCE  
vs. COLLECTOR TO BASE VOLTAGE  
TOTAL POWER DISSIPATION  
vs. AMBIENT TEMPERATURE  
250  
200  
150  
0.6  
0.5  
0.4  
Mounted on Glass Epoxy PCB  
f = 1 MHz  
(1.08 cm2 × 1.0 mm (t) )  
0.3  
0.2  
0.1  
100  
90  
50  
0
25  
50  
75  
100  
125  
150  
0
1
2
3
4
5
Ambient Temperature TA (˚C)  
Collector to Base Voltage VCB (V)  
COLLECTOR CURRENT vs.  
BASE TO EMITTER VOLTAGE  
COLLECTOR CURRENT vs.  
BASE TO EMITTER VOLTAGE  
100  
10  
1
100  
10  
1
VCE = 1 V  
VCE = 2 V  
0.1  
0.1  
0.01  
0.001  
0.01  
0.001  
0.0001  
0.0001  
0.4  
0.5  
0.6  
0.7  
0.8  
0.9  
1.0  
0.4  
0.5  
0.6  
0.7  
0.8  
0.9  
1.0  
Base to Emitter Voltage VBE (V)  
Base to Emitter Voltage VBE (V)  
COLLECTOR CURRENT vs.  
COLLECTOR TO EMITTER VOLTAGE  
35  
500 A  
µ
400  
450 A  
µ
µ
A
350 A  
µ
30  
300  
250  
µ
A
A
25  
20  
µ
µ
µ
200  
150  
A
A
15  
10  
5
µ
µ
100  
A
A
IB = 50  
0
1
2
3
4
Collector to Emitter Voltage VCE (V)  
Remark The graphs indicate nominal characteristics.  
3
Data Sheet PU10342EJ02V0DS  
NE687M33  
DC CURRENT GAIN vs.  
COLLECTOR CURRENT  
DC CURRENT GAIN vs.  
COLLECTOR CURRENT  
1 000  
100  
10  
1 000  
100  
10  
V
CE = 1 V  
VCE = 2 V  
0.1  
1
10  
(mA)  
100  
0.1  
1
10  
(mA)  
100  
Collector Current I  
C
Collector Current I  
C
Remark The graphs indicate nominal characteristics.  
4
Data Sheet PU10342EJ02V0DS  
NE687M33  
PACKAGE DIMENSIONS  
3-PIN SUPER LEAD-LESS MINIMOLD (M33) (UNIT: mm)  
0.64 0.05  
0.44 0.05  
(Bottom View)  
2
3
1
0.15  
NE package code: M33  
SOT number: –  
PIN CONNECTIONS  
1. Emitter  
2. Base  
3. Collector  
5
Data Sheet PU10342EJ02V0DS  
NE687M33  
The information in this document is current as of August, 2003. The information is subject to  
change without notice. For actual design-in, refer to the latest publications of NEC's data sheets or  
data books, etc., for the most up-to-date specifications of NEC semiconductor products. Not all  
products and/or types are available in every country. Please check with an NEC sales representative  
for availability and additional information.  
No part of this document may be copied or reproduced in any form or by any means without prior  
written consent of NEC. NEC assumes no responsibility for any errors that may appear in this document.  
NEC does not assume any liability for infringement of patents, copyrights or other intellectual property rights of  
third parties by or arising from the use of NEC semiconductor products listed in this document or any other  
liability arising from the use of such products. No license, express, implied or otherwise, is granted under any  
patents, copyrights or other intellectual property rights of NEC or others.  
Descriptions of circuits, software and other related information in this document are provided for illustrative  
purposes in semiconductor product operation and application examples. The incorporation of these  
circuits, software and information in the design of customer's equipment shall be done under the full  
responsibility of customer. NEC assumes no responsibility for any losses incurred by customers or third  
parties arising from the use of these circuits, software and information.  
While NEC endeavours to enhance the quality, reliability and safety of NEC semiconductor products, customers  
agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize  
risks of damage to property or injury (including death) to persons arising from defects in NEC  
semiconductor products, customers must incorporate sufficient safety measures in their design, such as  
redundancy, fire-containment, and anti-failure features.  
NEC semiconductor products are classified into the following three quality grades:  
"Standard", "Special" and "Specific". The "Specific" quality grade applies only to semiconductor products  
developed based on a customer-designated "quality assurance program" for a specific application. The  
recommended applications of a semiconductor product depend on its quality grade, as indicated below.  
Customers must check the quality grade of each semiconductor product before using it in a particular  
application.  
"Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio  
and visual equipment, home electronic appliances, machine tools, personal electronic equipment  
and industrial robots  
"Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster  
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed  
for life support)  
"Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life  
support systems and medical equipment for life support, etc.  
The quality grade of NEC semiconductor products is "Standard" unless otherwise expressly specified in NEC's  
data sheets or data books, etc. If customers wish to use NEC semiconductor products in applications not  
intended by NEC, they must contact an NEC sales representative in advance to determine NEC's willingness  
to support a given application.  
(Note)  
(1) "NEC" as used in this statement means NEC Corporation, NEC Compound Semiconductor Devices, Ltd.  
and also includes its majority-owned subsidiaries.  
(2) "NEC semiconductor products" means any semiconductor product developed or manufactured by or for  
NEC (as defined above).  
M8E 00. 4-0110  
6
Data Sheet PU10342EJ02V0DS  
NE687M33  
For further information, please contact  
NEC Compound Semiconductor Devices, Ltd.  
E-mail: salesinfo@csd-nec.com (sales and general)  
techinfo@csd-nec.com (technical)  
http://www.ncsd.necel.com/  
5th Sales Group, Sales Division TEL: +81-44-435-1588 FAX: +81-44-435-1579  
NEC Compound Semiconductor Devices Hong Kong Limited  
E-mail: ncsd-hk@elhk.nec.com.hk (sales, technical and general)  
TEL: +852-3107-7303  
TEL: +886-2-8712-0478 FAX: +886-2-2545-3859  
TEL: +82-2-558-2120  
FAX: +82-2-558-5209  
FAX: +852-3107-7309  
Hong Kong Head Office  
Taipei Branch Office  
Korea Branch Office  
NEC Electronics (Europe) GmbH  
http://www.ee.nec.de/  
TEL: +49-211-6503-01 FAX: +49-211-6503-487  
California Eastern Laboratories, Inc.  
TEL: +1-408-988-3500 FAX: +1-408-988-0279  
http://www.cel.com/  
0307  

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