AQV1 [NAIS]
PhotoMOS RELAYS; 工艺，PhotoMos继电器
| 型号： | AQV1 |
| 厂家： | 
NAIS(MATSUSHITA ELECTRIC WORKS) |
| 描述： | PhotoMOS RELAYS |
| 文件： | 总6页 (文件大小：139K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
VDE
AQV112KL
GU (General Use) Type DIP
6-Pin Series 1-Channel
(Form A) with Short Circuit
Protection (Non Latch Type)
PhotoMOS
RELAYS
FEATURES
1. Protects Circuit from excess current
The short circuit protection function
prevents the continued flow of short
TYPICAL APPLICATIONS
• Industrial equipment
• Traffic signal control
• Security equipment
6.4
8.8
6.4
8.8
.346
.252
.346
.252
3.9
.154
3.6
.142
current. After short current is detected,
load current is monitored, and if the load
returns to normal, the relay returns to
normal operation.
mm inch
2. No need for fuses, polyswitches, or
other protectors
The built-in short circuit protection
function eliminates the need for
overcurrent protectors, reducing
mounting costs and space requirements.
1
2
3
6
5
4
3. High capacity
Can control up to 0.5A (60 VDC) load
current.
TYPES
Part No.
Output rating*
Packing quantity
Through hole
terminal
Surface-mount terminal
Tape and reel packing style
Picked from the Picked from the
I/O isolation
Type
voltage
Load
Load
Tube packing style
Tube
Tape and reel
1,000 pcs.
voltage current
1/2/3-pin side
4/5/6-pin side
1 tube contains
50 pcs.
DC
1,500 V
type
60 V
500 mA
AQV112KL
AQV112KLA
AQV112KLAX
AQV112KLAZ
1 batch contains
500 pcs.
*Indicate the DC values.
Note: For space reasons, the package type indicator “X” and “Z” are omitted from the seal.
RATING
1. Absolute maximum ratings (Ambient temperature: 25°C 77°F)
Item
Symbol
IF
AQV112KL
LED forward current
LED reverse voltage
Peak forward current
Power dissipation
50 mA
VR
5 V
Input
IFP
1 A
Pin
75 mW
Load voltage (peak AC)
Continuous load current (peak AC)
Power dissipation
VL
7 to 60V
0.5 A
Output
IL
Pout
PT
500 mW
Total power dissipation
I/O isolatiom voltage
550 mW
Viso
Topr
Tstg
1,500 V AC
Operating
Storage
–40°C to +85°C –40°F to +185°F
–40°C to +100°C –40°F to +212°F
Temperature limits
8
AQV112KL
2. Electrical characteristics (Ambient temperature: 25°C 77°F)
Item
Symbol
IFon
AQV112KL
0.8 mA
10 mA
0.3 mA
0.7 mA
1.17 V
1.5 V
Condition
Typical
LED operate current
IL = 100mA
Maximum
Minimum
Input
LED turn off current
LED dropout voltage
On resistance
IFoff
VF
IL = 100mA
IF = 10 mA
Typical
Typical
Maximum
Typical
0.55 Ω
2.0 Ω
IF = 10 mA
IL = Max.
Ron
Maximum
Typical
5 V
Output
Load short circuit detection voltage
Off state leakage current
VLSHT
ILeak
IF = 10 mA
Maximum
7 V
IF = 0 mA
VL = Max.
Maximum
1µA
IF = 10 mA
IL = 100 mA
VL = 10 V
Typical
2.0 ms
5.0 ms
0.1 ms
1.0 ms
Turn on time*
Turn off time*
Ton
Toff
Maximum
Typical
IF = 10 mA
IL = 100 mA
VL = 10 V
Transfer
characteristics
Maximum
Typical
0.8 pF
1.5 pF
f = 1 MHz
VB = 0
I/O capacitance
Ciso
Riso
Maximum
Minimum
Initial I/O isolation resistance
1,000 MΩ
500 V DC
Note: Recommendable LED forward current IF = 10 mA.
*Turn on/Turn off time
For type of connection, see Page 11.
Input
90%
10%
Output
Ton
Toff
REFERENCE DATA
1. Load current vs. ambient temperature
characteristics
2. On resistance vs. ambient temperature
characteristics
3. Turn on time vs. ambient temperature
characteristics
Allowable ambient temperature: –40°C to +85°C
–40°F to +185°F
Measured portion: between terminals 4 and 6;
LED current: 10 mA; Load current: Max.(DC)
Measured portion: between terminals 4 and 6;
LED current: 10 mA; Load voltage: 10V (DC);
Load current: 100 mA
600
500
400
300
200
100
0
2
1.5
1
5
4
3
2
1
0
0.5
0
–40 –20
0
20
40
60 8085 100
–40 –20
0
20
40
60 8085
–40 –20
0
20
40
60 8085
Ambient temperature, °C
Ambient temperature, °C
Ambient temperature, °C
9
AQV112KL
4. Turn off time vs. ambient temperature
characteristics
5. LED operate current vs. ambient
temperature characteristics
6. LED turn off current vs. ambient temperature
characteristics
Measured portion: between terminals 4 and 6;
LED current: 10 mA; Load voltage: 10 V (DC);
Load current: 100 mA (DC)
Measured portion: between terminals 4 and 6;
Load current: 100 mA
Measured portion: between terminals 4 and 6;
Load current: 100 mA
0.3
3
2.5
2
3
2.5
2
0.25
0.2
0.15
0.1
0.05
0
1.5
1
1.5
1
0.5
0
0.5
0
–40 –20
0
20
40
60 8085
–40 –20
0
20
40
60 8085
–40 –20
0
20
40
60 8085
Ambient temperature, °C
Ambient temperature, °C
Ambient temperature, °C
7. Off state leakage current
Measured portion: between terminals 4 and 6;
Ambient temperature: 25°C 77°F
8. Voltage vs. current characteristics of output
at MOS portion
Measured portion: between terminals 4 and 6;
9. LED dropout voltage vs. ambient
temperature characteristics
Measured portion: between terminals 1 and 2;
LED current: 10 to 50 mA
Ambient temperature: 25°C 77°F
10-6
10-7
10-8
10-9
10-10
10-11
10-12
1.5
1.4
1.3
1.2
1.1
1
0.6
0.4
0.2
0
50mA
–0.2
–0.4
–0.6
30mA
20mA
10mA
–1
–0.5
0
0.5
1
0
10
20
30
40
50
60
–40 –20
0
20
40
60 8085
Load voltage, V
Voltage, V
Ambient temperature, °C
10. LED forward current vs. turn on time
characteristics
11. LED forward current vs. turn off time
characteristics
12. Applied voltage vs. output capacitance
characteristics
Measured portion: between terminals 4 and 6;
Measured portion: between terminals 4 and 6;
Measured portion: between terminals 4 and 6;
Load voltage: 10 V (DC); Load current: 100 mA (DC);
Load voltage: 10 V (DC); Load current: 100 mA (DC);
Frequency: 1 MHz; Ambient temperature: 25°C 77°F
Ambient temperature: 25°C 77°F
Ambient temperature: 25°C 77°F
5
0.2
500
400
300
200
100
0
4
3
0.15
0.1
0.05
0
2
1
0
–1
0
10
20
30
40
50
0
10
20
30
40
50
0
10
20
30
40
50
60
LED forward current, mA
LED forward current, mA
Applied voltage, V
13. Short circuit peak current vs. time
characteristics
14. Short current monitoring interval vs. time
characteristics
Measured portion: between terminals 4 and 6;
LED current: 10 mA; Load resistance: 0;
Ambient temperature: 25°C 77°F
4
Measured portion: between terminals 4 and 6;
LED current: 10 mA; Load resistance: 0;
Ambient temperature: 25°C 77°F
30
3.5
3
25
20
VL=60V
2.5
2
15
10
5
VL=24V
VL=12V
VL=12V
1.5
1
VL=24V
VL=60V
0
0
10
20
30
40
50
60
0
10
20
30
40
50
60
Time, S
Time, S
10
AQV112KL
What is short circuit protection Non-latch type?
If the load current reaches a
Operation chart (Non-latch type)
predetermined overcurrent level, the
output-side short circuit protection
function cuts off the load current. It then
monitors the load current, and if it returns
to normal, automatically recovers to
normal relay operation.
Input Current
1 Load short detected
3 Load turn off
In order to operate the short circuit
protection function, ensure that the input
current is at least IF = 10 mA.
Output Current
2 Function operation
mm inch
DIMENSIONS
PC board pattern (BOTTOM VIEW)
5.08
.200
6-0.8 dia.
6-.031 dia.
Max. 10°
Max. 10°
6.4±0.05
.252±.002
2.54
.100
7.62±0.05
.300±.002
7.62
.300
2.54
.100
6.4
.252
8.8±0.05
.346±.002
3.4
.134
3.9±0.2
.154±.008
3
.118
0.47
.019
0.47
.019
0.47
.019
1.25
.049
1.25
.049
1.25
.049
2.54
.100
2.54
.100
Terminal thickness = 0.25 .010
General tolerance: ±0.1 ±.004
Tolerance: ±0.1 ±.004
SCHEMATIC AND WIRING DIAGRAMS
E1: Power source at input side; IF: LED forward current; VL: Load voltage; IL: Load current
Output
configuration
Schematic
Load
Wiring diagram
Load
IL
1
2
3
6
5
4
6
4
–
–
IF
E1
1
2
3
6
5
4
IL
Load
VL (DC)
+
VL (DC)
+
1a
DC
*Can be also connected as 2 Form A type. (However, the sum of the continuous load
current should not exceed the absolute maximum rating.)
11
AQY2/AQV1
CAUTIONS FOR USE
1. Surge voltages at the input
2) If spike voltages generated at the load
are limited with a clamp diode and the
circuit wires are long, spike voltages will
occur by inductance. Keep wires as short
as possible to minimize inductance.
11. Soldering
If reverse surge voltages are present at
the input terminals, connect a diode in
reverse parallel across the input terminals
and keep the reverse voltages below the
reverse breakdown voltage.
1) When soldering PC board terminals,
keep soldering time to within 10 s at
260°C 500°F .
2) When soldering surface-mount
terminals, the following conditions are
recommended.
7. Ripple in the input power supply
If ripple is present in the input power
supply, observe the following:
2) Keep the LED operate current at Emin,
maintain min. 5 mA (Latch type), 10 mA
(Non-latch type).
(1) IR (Infrared reflow) soldering method
1
2
4
3
T3
T2
T1
1) For LED operate current 50 mA or less
at Emax.
2. Unused terminals
The No. 3 and 5 terminal is used with the
circuit inside the relay. Therefore, do not
connect it to the external circuitry with
either connection method A, B or C. (Non-
latch type)
t1
t2
T1 = 155 to 165°C 311 to 329°F
T2 = 180°C 200°C 356 to 392°F
T3 = 245°C 473°F or less
t1 = 120 s or less
Emin.
Emax.
t2 = 30 s or less
3. It is possible that in-rush current will
be detected as short current, and
oscillation will be initiated. Please
confirm before use.
8. When soldering terminals, keep
soldering time to within 10 s at 260°C
500°F.
(2) Vapor phase soldering method
T2
T1
9. Cleaning solvents compatibility
The PhotoMOS relay forms an optical
path by coupling a light-emitting diode
(LED) and photodiode via transparent
silicon resin. For this reason, unlike other
directory element molded resin products
(e.g., MOS transistors and bipolar
transistors), avoid ultrasonic cleansing if
at all possible. We recommend cleaning
with an organic solvent. If you cannot
avoid using ultrasonic cleansing, please
ensure that the following conditions are
met, and check beforehand for defects.
• Frequency: 27 to 29 kHz
• Ultrasonic output:
No greater than 0.25W/cm2
• Cleaning time:
No longer than 30 s
• Cleanser used: Asahiklin AK-225
• Other:
Submerge in solvent in order to prevent
the PCB and elements from being
contacted directly by the ultrasonic
vibrations.
4. Please avoid exposing the unit to
short status for longer than 24 hours.
Long periods of exposure to short
status could damage the internal IC
(non-latch type only).
t1
t2
T1 = 180 to 200°C 366 to 392°F
T2 = 215°C 419°F or less
t1 = 40 s
5. Short across terminals
Do not short circuit between terminals
when relay is energized. There is
possibility of breaking the internal IC.
t2 = 90 s or less
(3) Double wave soldering method
T2
6. Output spike voltages
1) If an inductive load generates spike
voltages which exceed the absolute
maximum rating, the spike voltage must
be limited. Typical circuits are shown
below.
T1
t1
t2
t3
Latch type
T1 = 155 to 165°C 311 to 329°F
T2 = 260°C 500°F or less
t1 = 60 s or less
1
4
t2+t3 = 5 s or less
(4) Soldering iron method
Tip temperature: 280 to 300°C 536 to
572°F
Wattage: 30 to 60 W
Soldering time: within 5 s
Load
2
1
3
4
Add a clamp diode
to the load
Note: Applies to unit area ultrasonic output for
ultrasonic baths.
(5) Others
Check mounting conditions before using
other soldering methods (hot-air, hot
plate, pulse heater, etc.)
• The temperature profile indicates the
temperature of the soldered terminal on
the surface of the PC board.The ambient
temperature may increase excessively.
Check the temperature under mounting
conditions.
10.Transportation and storage
1) Extreme vibration during transport will
warp the lead or damage the relay.
Handle the outer and inner boxes with
care.
2) Storage under extreme conditions will
cause soldering degradation, external
appearance defects, and deterioration of
the characteristics. The following storage
conditions are recommended:
Load
2
3
Add a CR snubber
circuit to the load
Non-latch type
1
2
3
6
5
• The conditions for the infrared reflow
soldering apply when preheating using
the VPS method.
Load
4
• Temperature: 0 to 45°C 32 to 113°F
• Humidity: Less than 70% R.H.
• Atomosphere: No harmful gasses such
as sulfurous acid gas, minimal dust.
Add a clamp diode
to the load
12
AQY2/AQV1
12.The following shows the packaging format
mm inch
1) Tape and reel (AQY210KS)
Type
Tape dimensions
Dimensions of paper tape reel
21±0.8
.827±.031
Direction of picking
80±1 dia.
3.150±.039 dia.
Tractor feed holes
1.75±0.1
7.2±0.1
.284±.004
1.55±0.05 dia.
.061±.002 dia.
.069±.004
0.3±0.05
.012±.002
2±0.5
.079±.020
5.5
.217
0.1
±
0.1
.004
±
250±2 dia.
4.7
±
9.843±.079 dia.
80±1 dia.
3.150±.039 dia.
12±0.1
.185
±
.004
SO package
4-pin type
Device mounted
on tape
.472±.004
1.55±0.1 dia.
.061±.004 dia.
2.8±0.3
.110±.012
4±0.1
.157±.004
2±0.1
.079±.004
12±0.3
.472±.012
(1) When picked from 1/2-pin side: Part No. AQY❍❍❍SX (Shown adove)
(2) When picked from 3/4-pin side: Part No. AQY❍❍❍SZ
13±0.5 dia.
.512±.020 dia.
.551±.059
14±1.5
2±0.5
.079±.020
2) Tube
• If the devices are to be left in storage for
13. Applying stress that exceeds the
absolute maximum rating
(1) Devices are packaged in a tube so pin
No. 1 is on the stopper B side. Observe
correct orientation when mounting them
on PC boards.
a considerable period after the moisture-
proof package has been unsealed, it is
recommended to keep them in another
moisture-proof bag containing silica gel
(within 3 months at the most).
If the voltage or current value for any of
the terminals exceeds the absolute
maximum rating, internal elements will
deteriorate because of the excessive
voltage or current. In extreme cases,
wiring may melt, or silicon P/N junctions
may be destroyed.
As a result, the design should ensure that
the absolute maximum ratings will never
be exceeded, even momentarily.
(SOP type)
13.Transportation and storage
1) Extreme vibration during transport will
warp the lead or damage the relay.
Handle the outer and inner boxes with
care.
2) Storage under extreme conditions will
cause soldering degradation, external
appearance defects, and deterioration of
the characteristics. The following storage
conditions are recommended:
StopperB (green)
StopperA (gray)
2) Storage
PhotoMOS relays implemented in SO
packages are sensitive to moisture and
come in sealed moisture-proof packages.
Observe the following cautions on
storage.
• After the moisture-proof package is
unsealed, take the devices out of storage
as soon as possible (within 1 month at the
most).
• Temperature: 0 to 45°C 32 to 113°F
• Humidity: Less than 70% R.H.
• Atomosphere: No harmful gasses such as
sulfurous acid gas, minimal dust.
mm inch
1) Tape and reel (AQV112KL)
Type
Tape dimensions
Dimensions of paper tape reel
21±0.8
.827±.031
80±1 dia.
3.150±.039 dia.
Direction of picking
Tractor feed holes
1.75±0.1
.069±.004
+0.1
1.5–0 dia.
10.1±0.1
.398±.004
+.004
.059–0 dia.
0.3±0.05
.012±.002
2±0.5
.079±.020
7.5±0.1
300±2 dia.
.295±.004
16±0.3
.630±.012
11.811±.079 dia.
9.2±0.1
.362±.004
6-pin DIP
type
Device mounted
on tape
80±1 dia.
3.150±.039 dia.
1.6±0.1 dia.
.063±.004 dia.
12±0.1
4.5±0.3
.472±.004
4±0.1
.079±.004
.177±.012
2±0.1
.079±.004
(1) When picked from 1/2/3-pin side: Part No. AQV❍❍❍AX (Shown above)
(2) When picked from 4/5/6-pin side: Part No. AQV❍❍❍AZ
13±0.5 dia.
17.5±1.5
2±0.2
.079±.008
.512±.020 dia. .689±.059
2) Tube
(DIP type)
(1) Devices are packaged in a tube so pin
No. 1 is on the stopper B side. Observe
correct orientation when mounting them
on PC boards.
(DIP, SMD type)
StopperB
StopperA
13
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