NFM55PC155F1H4D [MURATA]
Feed Through Capacitor, 1 Function(s), 50V, 6A, EIA STD PACKAGE SIZE 2200;
| 型号： | NFM55PC155F1H4D |
| 厂家： | 
muRata |
| 描述： | Feed Through Capacitor, 1 Function(s), 50V, 6A, EIA STD PACKAGE SIZE 2200 |
| 文件： | 总10页 (文件大小：183K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
This is the PDF file of catalog No.C31E-6
C31E6.pdf 01.5.29
On-Board Type (DC) EMI Suppression Filters(EMIFILr)
Chip EMIFILr for Large Current NFM21P/NFM3DP/NFM41P/NFM55P Series
NFM21P Series
NFM21P is 3 terminal structure component. This product
can be applied to large current DC power lines.
NFM21P is suitable for noise suppression of DC power
lines where relatively operates large current.
1.25±0.1
0.3±0.2
■ Features
1. The rated current of 4A is suitable for IC's
individual power line.
2. Small dimension enables higher density packaging.
NFM21P is much smaller size.(2.0x1.25x0.85mm)
3. Murata's original internal electrode structure design
which realizes excellent EMI suppression effect from
low frequency to high frequency.
NFM21P
0.6±0.2
2.0±0.2
(in mm)
11
Capacitance
(pF)
Rated Voltage
Rated Current
(A)
Insulation Resistance
Operating Temperature Range
Part Number
(Vdc)
(M ohm)
(°C)
NFM21PC104R1E3
NFM21PC224R1C3
NFM21PC474R1C3
NFM21PC105B1A3
NFM21PC105F1C3
100000 +20% ,-20%
220000 +20% ,-20%
470000 +20% ,-20%
1000000 +20% ,-20%
1000000 +80% ,-20%
25
16
16
10
16
2
2
2
4
2
1000 min.
1000 min.
1000 min.
500 min.
500 min.
-55 to 125
-55 to 125
-55 to 125
-40 to 85
-40 to 85
■ Equivalent Cirucit
■ Insertion Loss Characteristics
NFM21P
0
20
40
0.1µF(104R)
0.22µF(224R)
Input
Output
60
no polarity.
*
0.47µF(474R)
GND
80
1µ
F(105F)
F(105B)
1
µ
100
1
10
100
Frequency (MHz)
1000 2000
87
This is the PDF file of catalog No.C31E-6
C31E6.pdf 01.5.29
NFM3DP Series
The chip solid "EMIFIL" NFM3DP is a chip type 3-terminal
capacitor with high rated current of 2A. This series is
suited for noise suppression in DC power supply lines of
digital instruments.
1.1±0.3
1.1±0.3
3.2±0.2
1.25±0.2
■ Features
(2)
1. Large rated current (2A) and low voltage drop due to
a small DC resistance (0.05ohm) are suitable for the
application in DC power line.
(1)
(3)
in mm
NFM3DP
(2)
2. High electrostatic capacitance and remarkable high
frequency performance are effective for the immunity
against the surge noise and the pulse noise.
■ Applications
• Personal computers, Word processors and Peripherals
• Telephones, PPCs, Communication equipments, etc.
• Digital TVs, VCRs
• Telecommunication equipment
Capacitance
(pF)
Rated Voltage
(Vdc)
Rated Current
(A)
Insulation Resistance
(M ohm)
Operating Temperature Range
Part Number
11
(°C)
NFM3DPC223R1H2
22000 +20% ,-20%
50
2
1000 min.
-55 to 85
■ Equivalent Cirucit
■ Insertion Loss Characteristics
NFM3DP
0
20
40
Input
Output
60
80
no polarity.
*
GND
100
0.1
0.5
1
5
10
50 100
500 1000
Frequency (MHz)
88
This is the PDF file of catalog No.C31E-6
C31E6.pdf 01.5.29
NFM41P Series
Chip solid "EMIFIL" NFM41P are 3 terminal structure SMT
components. These components are able to be applied to
large current DC power lines. NFM41P are suitable in
noise suppression DC lines where relatively large
currents operate.
1.5±0.3
4.5±0.3
r
1.6±0.3
Using base metal to the electrode.
q
e
■ Features
w
1. Large rated current (2A) and low voltage drop due to
a small DC resistance (0.04ohm) are suitable for the
application in DC power line.
NFM41P
0.4±0.3
(in mm)
2. High electrostatic capacitance and remarkable high
frequency performance are effective for the immunity
against the surge noise and the pulse noise.
■ Applications
• Personal computers, Word processors and Peripherals
• Telephones, PPCs, Communication equipments, etc.
• Digital TVs, VCRs
• Telecommunication equipment
11
Capacitance
(pF)
Rated Voltage
(Vdc)
Rated Current
(A)
Insulation Resistance
(M ohm)
Operating Temperature Range
Part Number
(°C)
NFM41PC204F1H3
200000 +80% ,-20%
50
2
1000 min.
-55 to 85
■ Equivalent Cirucit
■ Insertion Loss Characteristics
NFM41P
0
20
40
Input
Output
60
no polarity.
*
GND
80
100
1
5
10
50
100
500 1000
Frequency (MHz)
89
This is the PDF file of catalog No.C31E-6
C31E6.pdf 01.5.29
NFM55P Series
The chip solid "EMIFIL" NFM55P is a chip type 3-terminal
capacitor with high rated current of 6A. This series is
suited for noise suppression in DC power lines where
high rated current and large capacitance is required.
+0.3
+0.5
1.7-0.2
4.2 -0.3
5.7±0.3
5.0±0.3
(2)
■ Features
1. Large rated current (6A) and low voltage drop due to
a small DC resistance (0.01ohm) are suitable for the
application in DC power line.
(1)
(3)
NFM55P
(2)
in mm
2. High electrostatic capacitance and remarkable high
frequency performance are effective for the immunity
against the surge noise and the pulse noise.
3. Only reflow soldering should be applied.
■ Applications
• Personal computers, Word processors and Peripherals
• Telephones, PPCs, Communication equipments, etc.
• Digital TVs, VCRs
• Telecommunication equipment
11
Capacitance
(pF)
Rated Voltage
(Vdc)
Rated Current
(A)
Insulation Resistance
(M ohm)
Operating Temperature Range
Part Number
(°C)
NFM55PC155F1H4
1500000 +80% ,-20%
50
6
100 min.
-55 to 85
■ Equivalent Cirucit
■ Insertion Loss Characteristics
NFM55P
0
20
40
60
Input
Output
no polarity.
*
GND
80
100
0.1
0.5
1
5
10
50
100
500 1000
Frequency (MHz)
90
This is the PDF file of catalog No.C31E-6
C31E6.pdf 01.5.29
NFM/NFR/NFL Series Notice (Soldering and Mounting)
1. Standard Land Pattern Dimensions
Land
Solder Resist
For Reflow Soldering
The capacitor type chip EMI suppression filters (NFp
series) suppress noise by conducting the high-frequency
noise element to ground. Therefore, to obtain maximum
performance from these filters, the ground pattern should
be made as large as possible during the PCB design
stage. As shown in the right, one side of the PCB is used
for chip mounting, and the other is used for grounding.
Small diameter feedthrough holes are then used to
connect the grounds on each side of the PCB. This
reduces the high-frequency impedance of the grounding
and maximizes the filter's performance. Please contact us
if using thinner land pad than 18µm for NFM55P.
Chip mounting side
Back side
Ground pattern
Small diameter thru hole φ0.4-φ0.6
a
b
c
Connect to ground pattern
of mounting side
Size (mm)
Part Number
a
b
c
d
NFM21C/NFM21P
NFR21G/NFL21S
NFM3DC
0.8
1.4
2.6
0.6
1.4
2.0
2.5
3.5
4.4
6.0
1.0
1.2
NFM3DP
NFM41C
NFM41P
11
NFM55P
Small diameter thru hole φ1.0-φ2.0
2.0
4.7
6.7
(in mm)
• NFM21C/21P, NFR21G, NFL21S and NFM55P are specially
adapted for reflow soldering.
For Flow Soldering
Chip mounting side
Back side
Small diameter thru hole φ0.4-φ0.6
Ground pattern
a
b
Connect to ground pattern
of mounting side
c
d
Size (mm)
Part Number
a
b
c
d
e
f
g
NFM3DC
NFM3DP
NFM41C
NFM41P
1.0 1.4 2.5 4.4 1.0 2.0 2.4
1.5 2.0 3.5 6.0 1.2 2.6 3.0
Continued on the following page.
91
This is the PDF file of catalog No.C31E-6
C31E6.pdf 01.5.29
NFM/NFR/NFL Series Notice (Soldering and Mounting)
Continued from the preceding page.
2. Solder Paste Printing and Adhesive Application
When reflow soldering the chip EMI suppression filters,
the printing must be conducted in accordance with the
following cream solder paste printing conditions. If too
much solder is applied, the chip will prone to be damaged
by mechanical and thermal stress from the PCB and may
crack. In contrast, if too little solder is applied, there is the
potential that the termination strength will be insufficient,
creating the potential for detachment. Standard land
dimensions should be used for resist and copper foil
patterns.
When flow soldering the EMI suppression filter, apply the
adhesive in accordance with the following conditions. If
too much adhesive is applied, then it may overflow into
the land or termination areas and yield poor solderability.
In contrast, if insufficient adhesive is applied, or if the
adhesive is not sufficiently hardened, then the chip may
become detached during flow soldering process.
(1) Solder Paste Printing
11
q Coat the solder paste a thickness
NFM21C/21P
NFR21G/NFL21S
NFM3DC/3DP
100µm to 150µm : NFM21C/21P/3DC/3DP
NFR21G
NFL21S
100µm to 200µm : NFM41C/41P
1.0
2.5
3.9
0.6
150µm to 200µm : NFM55P
1.4
2.6
w Use H60A solder for pattern printing.
NFM41C/41P
NFM55P
1.5
3.5
5.5
1.5
4.7
6.7
(in mm)
(2) Adhesive Application
o Apply 0.1mg for NFM41C/41P and 0.06mg for
NFM3DC/3DP of bonding agent at each chip, and
ensure not to cover electrodes.
Bonding agent
Coating position of
bonding agent
Continued on the following page.
92
This is the PDF file of catalog No.C31E-6
C31E6.pdf 01.5.29
NFM/NFR/NFL Series Notice (Soldering and Mounting)
Continued from the preceding page.
3. Standard Soldering Conditions
(1) SOLDERING METHODS
Allowable Flow Soldering Temperature and Time
Use flow and reflow soldering methods only.
Use standard soldering conditions when soldering chip
EMI suppression filters.
280
270
260
250
240
230
In cases where several different parts are soldered, each
having different soldering conditions, use those
conditions requiring the least heat and minimum time.
(2) SOLDERING TEMPERATURE AND TIME
NFM3DC/3DP
NFM41C/41P
To prevent external electrode solder leaching and
performance deterioration, solder within the temperature
and time combinations illustrated by the slanted lines in
the following graphs. If soldering is repeated, please note
that the allowed time is the accumulated time.
0
5
10
15
20
25
30
Time [s]
Allowable Reflow Soldering Temperature and Time
Solder : H60A H63A solder(JIS Z 3238)
Flux :
280
270
260
o Use Rosin-based fulx(when using RA type solder, clean
products sufficiently to avoid residual fulx.
o Do not use strong acidic fulx(with chlorine content
exceeding 0.20wt%)
11
250
o Do not use water-soluble fulx.
NFM21C/21P
NFM3DC/3DP
NFM41C/41P
NFM55P
240
NFR21G
NFL21S
230
0
20
30
40
50
60
70
80
90
Time [s]
(3) SOLDERING CONDITIONS
Flow Solder
Gradual cooling
Soldering
(in air)
Pre-heating
300
250
200
150
100
50
Max. Temp. 250°C
0
60s Min.
5s Max.
Reflow Solder
Gradual cooling
Pre-heating
Soldering
(in air)
300
250
Max. Temp. 230°C
230°C
183°C
200
150
100
50
0
10s Max.
60s Max.
60s Min.
Continued on the following page.
93
This is the PDF file of catalog No.C31E-6
C31E6.pdf 01.5.29
NFM/NFR/NFL Series Notice (Soldering and Mounting)
Continued from the preceding page.
(4) REWORKING WITH SOLDER IRON
The following conditions must be strictly followed when
using a soldering iron.
Pre-heating
: 150°C 60 second Min.
Soldering iron power output
: 30W Max.
Temperature of soldering iron tip : 280°C Max.
Soldering time : 10 second Max.
Do not allow the tip of the soldering iron directly to
contact the chip.
For additional methods of reworking with soldering iron,
please contact Murata engineering.
4. Cleaning
Following conditions should be observed when cleaning
chip EMI filter.
b) Aqueous cleaning agent
Surface active agent (Clean Thru 750H)
Hydrocarbon (Techno Cleaner 335)
(1) Cleaning Temperature : 60degree C max. (40degree C
max. for CFC alternatives and alcohol cleaning agents)
(2) Ultrasonic
High grade alcohol (Pine Alpha ST-100S)
Alkaline saponifier ( Aqua Cleaner 240 -cleaner should
be diluted within 20% using deionized water.)
(4) Ensure that flux residue is completely removed.
Component should be thoroughly dried after aqueous
agent has been removed with deionized water.
(5) Some products may become slightly whitened.
However, product performance or usage is not affected.
For additional cleaning methods, please contact Murata
engineering.
11
Output
: 20W/liter max.
Duration : 5 minutes max.
Frequency : 28kHz to 40kHz
(3) Cleaning agent
The following list of cleaning agents have been tested on
the individual components. Evaluation of final assembly
should be completed prior to production.
a) CFC alternatives and alcohol cleaning agents
Isopropyl alcohol (IPA)
HCFC-225
94
This is the PDF file of catalog No.C31E-6
C31E6.pdf 01.5.29
Outlines of EMI Suppression Filter (EMIFILr) for DC Line
oChip Solid EMIFILr
oT-type Chip EMIFILr
oDisk Type EMIFILr
Chip Solid EMIFILr ............P.69–74
T-type Chip EMIFILr ...........P.84–86
P.87–90
NFM21C
NFM3DC
NFM21P
NFAC1C
NFA6CC
NFE31P
NFE61P/H
NFA31C
Disk Type EMIFILr ...........P.132–137
DS-6
DS-9
DS-9H
"ꢀThis capacitor type EMI suppression filter has a large
noise suppression effect at frequencies ranging from a
few MHz to hundreds of MHz. This type of filter is used
widely as a universal, high performance EMI suppression
component.
[Comparison of Insertion Loss Characteristics]
0
C
2200PF
20
40
60
80
"ꢀThe chip solid EMIFILr incorporates a built-in three-
terminal capacitor, eliminating the lead wire and thereby
increasing the high-frequency performance characteristic.
"ꢀThe T-type chip EMIFILr is a chip EMI suppression filter
with a built-in feed-thru capacitor. The use of ferrite
beads on input and output terminals minimizes
resonance with surrounding circuits.
1
5
10
50 100
Frequency [MHz]
500 1000
"ꢀWhatever the situation, 3-terminal construction reduces
residual inductance, thereby substantially improving
noise suppression at frequencies over 10MHz.
A 3-terminal capacitor has a high self resonance frequency than
general 2-terminal type and exhibits effective noise suppression at
high frequency
18
This is the PDF file of catalog No.C31E-6
C31E6.pdf 01.5.29
Chip EMIFILr Capacitor Type
(Global Part Number)
1H
3
L
NF
M
3D CC 102
R
q
w
e
r
t
y
u i o
qProduct ID
yCapacitance Change
Product ID
Code
B
Capacitance Change
±10%
NF
Chip EMI Filters Capacitor Type
F
+30/-80%
wStructure
R
±15%
Code
Structure
U
-750 ±120ppm
+350 to -1000ppm
M
Capacitor Type
S
eDimension (LgW)
uRated Voltage
Code
21
Dimension (LgW)
2.00g1.25mm
3.20g1.25mm
3.20g1.60mm
4.50g1.60mm
5.70g5.00mm
EIA
0805
Code
1A
Rated Voltage
10V
3D
31
1206
1206
1806
2200
1C
16V
1E
25V
41
1H
50V
55
2A
100V
rFeatures
iElectrode/Others
Expressed by a figure.
Code
CC
Features
Ex.)
Capacitor Type for Signal Lines
Capacitor Type for Large Current
Code
Electrode
Sn Plating
Solder Coating
Others
PC
3
4
9
HC
Capacitor Type for Automotive Electronics
tCapacitance
Expressed by three figures. The unit is in pico-farad (pF). The first
and second figures are significant digits, and the third figure
expresses the number of zero which follow the two figures.
oPackaging
Code
Packaging
L
B
D
Plastic Taping (ø180mm Reel)
Bulk
Paper Taping (ø180mm Reel)
3
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