NFE31PT470C1E9L [MURATA]
Data Line Filter, 1 Function(s), 25V, 6A, EIA STD PACKAGE SIZE 1206, 3 PIN;
| 型号： | NFE31PT470C1E9L |
| 厂家： | 
muRata |
| 描述： | Data Line Filter, 1 Function(s), 25V, 6A, EIA STD PACKAGE SIZE 1206, 3 PIN LTE |
| 文件： | 总8页 (文件大小：197K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Reference Only
Chip EMIFIL ® LC Combined Type for Large Current
NFE31PT□□□□1E9□ Reference Specification
Spec. No. JENF243E-0002Q-01
P1 / 8
1. Scope
This reference specification applies to Chip EMIFIL ® LC Combined Type for Large Current NFE31P Series.
2. Part Numbering
NF
Product ID Structure Dimension Features Capacitance Characteristics Rated
(L × W) Voltage
E
31
PT
220
R
1E
9
L
Electrode Packaging
Code
(L: Taping / B: Bulk)
3. Rating
Customer
Part Number
Murata
Part Number
Rated
Voltage
Withstanding
Voltage
Rated
Current Resistance
Insulation
Capacitance
NFE31PT220R1E9L
NFE31PT220R1E9B
NFE31PT470C1E9L
NFE31PT470C1E9B
NFE31PT101C1E9L
NFE31PT101C1E9B
NFE31PT221D1E9L
NFE31PT221D1E9B
NFE31PT471F1E9L
NFE31PT471F1E9B
NFE31PT152Z1E9L
NFE31PT152Z1E9B
NFE31PT222Z1E9L
NFE31PT222Z1E9B
22pF ± 30%
５０
47pF ±
100pF ±
220pF ±
470pF ±
1500pF ±
%
２０
８０
２０
%
%
%
25 V
(DC)
62.5 V
(DC)
6 A
(DC)
1000 MΩ
min.
５０
２０
５０
２０
５０
%
２０
2200pF ± 50%
• Operating Temperature: - 40 °C to + 85 °C
• Storage Temperature: - 55 °C to + 125 °C
4. Standard Testing Condition
<Unless otherwise specified>
<In case of doubt>
Temperature: Ordinary Temp. 15 °C to 35 °C
Humidity: Ordinary Humidity 25 %(RH) to 85 %(RH)
Temperature: 20 °C ± 2 °C
Humidity: 60 %(RH) to 70 %(RH)
Atmospheric pressure: 86kPa to 106kPa
5. Style and Dimensions
0.7±0.2 1.0±0.2
0.7±0.2
(3)
■ Equivalent Circuit
(1)
(2)
Output
(3)
Input
(1)
GND
(2)
3.2±0.35
1.6±0.15
(in mm)
∗
(1),(3):No Polarity
■ Unit Mass (Typical value)
0.034g
Note : Gap and bend between ceramic capacitor(∗1) and ferrite bead(∗2) may come out as illustrated below,
however, these are not affect the performance, mounting and reliability of the products.
0.3 max.
∗
2
2
∗
∗
1
1
∗
(in mm)
0.1max.
MURATA MFG. CO., LTD.
Reference Only
Spec. No. JENF243E-0002Q-01
P2 / 8
■
Insertion Loss Characteristics (I.L.) (Typ.)
6. Marking
No marking
7. Electrical Performance
No. Item
Specification
Test Method
Table 1
Capacitance
7.1 Capacitance
Meet item 3.
Voltage
Frequency
22 (pF)
1 to 5 V(rms)
1MHz ± 10%
47,100,220,470
1500 (pF)
2200 (pF)
1±0.2 V(rms)
1kHz ± 10%
0.1 V(rms) max. 1kHz ± 10%
7.2 Insulation
Resistance(I.R.)
7.3 Withstanding
Voltage
Voltage : 25 V(DC)
Time : 60±5 seconds
Products shall not be damaged.
Test Voltage : 62.5 V(DC)
Testing Time : 1 to 5 seconds
Limit the charging current: 10mA max.
8. Mechanical Performance
No. Item
Specification
Test Method
8.1 Appearance and Meet item 5.
Dimensions
Visual Inspection and measured with Slide
Calipers
Flux : Ethanol solution of rosin, 25(wt)%
Pre-heat : 150 ± 10 °C, 60 ~ 90 s
Solder : Sn-3.0Ag-0.5Cu
8.2 Solderability
The electrodes shall be at least 75%
covered with new solder coating.
Solder Temperature : 240 ± 3 °C
Immersion Time : 3 ± 1 s
Immersion and emersion rates : 25mm / s
Flux : Ethanol solution of rosin, 25(wt)%
Pre-heat : 150 ± 10 °C, 60 ~ 90 s
Solder : Sn-3.0Ag-0.5Cu
8.3 Resistance to
soldering heat
Meet Table 2.
Table 2
Appearance
No damaged
Solder Temperature : 270 ± 5 °C
(for NFE31PT152Z1E9□ : 250±5°C)
Immersion Time : 10 ± 1 s
Immersion and emersion rates : 25mm / s
Then measured after exposure the room
condition for 4 to 48 hours.
22,47,100
within
±15%
within
±30%
220 (pF)
470,1500
2200 (pF)
Cap. Change
I.R.
meet item 3
Withstanding
Voltage
No damaged
MURATA MFG. CO., LTD.
Reference Only
Test Method
Spec. No. JENF243E-0002Q-01
No. Item
P3 / 8
Specification
8.4 Bending
Strength
Meet Table 3.
Table 3
It shall be soldered on the paper-phenol
substrate. (t=1.6mm)
Pressure jig
Appearance
No damaged
22,47,100
within
±15%
within
±30%
R340
F
220 (pF)
470,1500
2200 (pF)
Cap. Change
Deflection
Product
45
45
(in mm)
Deflection : 3 mm
Keeping Time : 30 seconds
9. Environment Performance (It shall be soldered on the substrate.)
No. Item Specification
9.1 Humidity
Test Method
Meet Table 4.
Table 4
Temperature : 40 ± 2 °C
Humidity : 90 to 95 %(RH)
Time : 500 h (+ 24h , - 0h)
Appearance
No damaged
Then measured after exposure in the room
condition for 4 to 48 hours.
22,47,100
220 (pF)
within
±15%
within
±30%
Cap. Change
9.2 Heat Life
470,1500
2200 (pF)
Temperature : 85 ± 2 °C
Test Voltage :
22,47,100,220(pF) : Rated Voltage × 200 %
470,1500,2200(pF) : Rated Voltage × 150 %
Time : 1000 h (+ 48h , - 0h)
I.R.
100 MΩ min.
Withstanding
Voltage
No damaged
Then measured after exposure in the room
condition for 4 to 48 hours.
9.3 Temperature Meet Table 2.
Cycling
1 Cycle
1 step: -55 °C (+ 0°C , - 3°C) / 30 ± 3 min
2 step: Room Temperature / within 5 min
3 step: +125 °C (+ 3°C , - 0°C) / 30 ± 3 min
4 step: Room Temperature / within 5 min
Total of 10 cycles
Then measured after exposure in the room
condition for 4 to 48 hours.
10. Specification of Packaging
10.1. Appearance and Dimensions (8mm-wide plastic tape)
0.1
0
Sprocket Hole
φ
1.5±
Embossed Cavity
0.2±0.1
Dimension of the Cavity is
measured at the bottom side.
4.0±0.1
4.0±0.1
1.85±0.1
2.0±0.05
1.8±0.1
Direction of feed
(in mm)
MURATA MFG. CO., LTD.
Reference Only
Spec. No. JENF243E-0002Q-01
P4 / 8
10.2. Specification of Taping
(1) Packing quantity (standard quantity)
2000 pcs. / reel
(2) Packing Method
Products shall be packaged in the cavity of the plastic tape and sealed with cover tape.
(3) Sprocket Hole
The sprocket holes are to the right as the tape is pulled toward the user.
(4) Spliced point
The cover tape have no spliced point.
(5) Missing components number
Missing components number within 0.1% of the number per reel or 1 pc., whichever is greater,
and are not continuous. The specified quantity per reel is kept.
10.3. Pull Strength of Plastic Tape and Cover Tape
Plastic tape 5N min.
10N min.
Cover tape
165 to 180 degree
F
Cover tape
Plastic tape
10.4. Peeling off force of cover tape
0.2N to 0.7N (minimum value is typical)
∗ Speed of Peeling off : 300 mm / min
10.5. Dimensions of Leader-tape, Trailer and Reel
There shall be leader-tape (cover tape only and empty tape) and trailer-tape (empty tape) as follows.
Leader
Trailer
160 min.
2.0±0.5
190 min.
210 min.
Label
Empty tape Cover tape
13.0±0.2
φ
60± 1
φ
0
21.0±0.8
φ
Direction of feed
9± 10
13±1.4
180±0
φ
3
(in: mm)
10.6. Marking for reel
Customer part number , MURATA part number , Inspection number(∗1) , RoHS marking(∗2) , Quantity , etc
∗1) « Expression of Inspection No. »
□□ OOOO ×××
(1)
(2)
(3)
(1) Factory Code
(2) Date
First digit
: Year / Last digit of year
Second digit
: Month / Jan. to Sep. → 1 to 9, Oct. to Dec. → O, N, D
Third, Fourth digit : Day
(3) Serial No.
∗2) « Expression of RoHS marking »
ROHS – Y (△)
(1) (2)
(1) RoHS regulation conformity parts.
(2) MURATA classification number
10.7. Marking for Outside package (corrugated paper box)
Customer name , Purchasing Order Number , Customer Part Number , MURATA part number ,
RoHS marking (∗2) , Quantity , etc
MURATA MFG. CO., LTD.
Reference Only
Spec. No. JENF243E-0002Q-01
10.8. Specification of Outer Case
P5 / 8
Outer Case Dimensions
Label
Standard Reel Quantity in Outer Case
(Reel)
(mm)
D
H
W
H
186
186
93
5
D
∗ Above Outer Case size is typical. It depends on a quantity of an order.
W
11. Standard Land Dimensions
The chip EMI filter suppresses noise by conducting the high-frequency noise element to ground.
Therefore, to get enough noise reduction, feed through holes which is connected to ground-plane should be
arranged according to figure to reinforce the ground-pattern.
(Standard land dimensions for reflow)
･Side on which chips are mounted
Small diamenter thru hole
φ
0.4)
(
Resist
0.6
1.2
2.2
4.2
Copper foil pattern
No pattern
(in mm)
12.
!
Caution
Limitation of Applications
Please contact us before using our products for the applications listed below which require especially high
reliability for the prevention of defects which might directly cause damage to the third party’s life, body or property.
(1)Aircraft equipment
(2)Aerospace equipment (3)Undersea equipment (4)Power plant control equipment
(5)Medical equipment (6)Transportation equipment(automobiles, trains, ships, etc.) (7)Traffic signal equipment
(8)Disaster prevention / crime prevention equipment (9)Data-processing equipment
(10)Applications of similar complexity or with reliability requirements comparable to the applications listed in the above
13. Notice
Products can only be soldered with reflow.
If it were soldered with flow, cracks might be caused in the ceramic body.
This product is designed for solder mounting.
Please consult us in advance for applying other mounting method such as conductive adhesive.
13.1. Flux and Solder
Flux
Use rosin-based flux, Do not use highly acidic flux (with chlorine content
exceeding 0.2(wt)%).
Do not use water-soluble flux.
Use Sn-3.0Ag-0.5Cu solder
Solder
13.2. Note for Assembling
< Thermal Shock >
Pre-heating should be in such a way that the temperature difference between solder and products
surface is limited to 100 °C max. Also cooling into solvent after soldering should be in such a way that the
temperature difference is limited to 100°C max.
MURATA MFG. CO., LTD.
Reference Only
Spec. No. JENF243E-0002Q-01
P6 / 8
13.3. Attention Regarding P.C.B. Bending
The following shall be considered when designing P.C.B.'s and laying out products.
(1) P.C.B. shall be designed so that products are not subject to the mechanical stress for board warpage.
〔Products direction〕
a
Products shall be located in the sideways
b
direction (Length:a<b) to the mechanical stress.
Poor example
〈
〉
Good example
〈
〉
(2) Products location on P.C.B. near seam for separation.
Products (A,B,C,D) shall be located carefully so that
products are not subject to the mechanical stress due
to warping the board.
C
Seam
B
Because they may be subjected the mechanical
stress in order of A>C>B ≅ D.
D
A
a
b
Slit
Lengh:a<b
13.4. Reflow Soldering
• Standard printing pattern of solder paste.
1) Solder paste printing for reflow
· Standard thickness of the solder paste should be 150µm to 200μm.
· Use the solder cream printing pattern of the right pattern.
· For the resist and copper foil pattern, use standard land dimensions.
0.6
2.2
4.2
(in mm)
2) Soldering Conditions
Standard soldering profile and the limit soldering profile is as follows.
The excessive soldering conditions may cause leaching of the electrode and/or resulting in the deterioration of
product quality.
Temp.
(°C)
260°C
245°C±3°C
230°C
220°C
Limit Profile
180
150
30s 60s
～
Standard Profile
60s max.
90s±30s
Time.(s)
Standard Profile
Limit Profile
Pre-heating
Heating
Peak temperature
Cycle of reflow
150°C ~ 180°C , 90s ± 30s
above 220°C , 30s ~ 60s
245°C ± 3°C
above 230°C , 60s max.
260°C , 10s
2 times
2 times
MURATA MFG. CO., LTD.
Reference Only
Spec. No. JENF243E-0002Q-01
P7 / 8
13.5. Reworking with Soldering iron
The following conditions shall be strictly followed when using a soldering iron.
• Pre-heating: 150°C, 1 min
• Soldering iron output: 30W max.
• Tip temperature/ Soldering time: 350°C max. / 3(+1,-0) s (NFE31PT152Z1E9: 280 °C max. / 10 s max. )
• Tip diameter: φ3mm max. • Times: 2times max.
Note: Do not directly touch the products with the tip of the soldering iron in order to prevent the crack on
the ceramic material due to the thermal shock.
13.6. Cleaning Conditions
Products shall be cleaned on the following conditions.
(1) Cleaning temperature shall be limited to 60 °C max. (40° C max. for IPA.)
(2) Ultrasonic cleaning shall comply with the following conditions, with avoiding the resonance phenomenon at the
mounted products and P.C.B.
Power: 20W / l max.
Frequency: 28kHz to 40kHz
Time: 5 minutes max.
(3) Cleaner
1. Cleaner
· Isopropyl alcohol (IPA)
2. Aqueous agent
· PINE ALPHA ST-100S
(4) There shall be no residual flux and residual cleaner after cleaning.
In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized water in
order to remove the cleaner.
(5) Other cleaning
Please contact us.
13.7. Operating Environment
Do not use this product under the following environmental conditions, on deterioration of the performance,
such as insulation resistance may result from the use.
(1) in the corrodible atmosphere (acidic gases, alkaline gases, chlorine, sulfur gases, organic gases and etc.)
(2) in the atmosphere where liquid such as organic solvent, may splash on the products.
13.8. Resin coating
It may affect on the product's performance when using resin for coating / molding products. So please pay your
careful attention in selecting resin. In prior to use, please make the reliability evaluation with the product
mounted in your application set.
13.9. Handling of a substrate
After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to
the substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening
screw to the substrate.
Excessive mechanical stress may cause cracking in the product.
Bending
Twisting
MURATA MFG. CO., LTD.
Reference Only
Spec. No. JENF243E-0002Q-01
P8 / 8
13.10. Storage condition
(1) Storage period
Use the products within 12 months after delivered.
Solderability should be checked if this period is exceeded.
(2) Storage environment condition
· Products should be storage in the warehouse on the following conditions.
Temperature
Humidity
:
-10 °C to +40 °C
:
15% to 85% relative humidity No rapid change on temperature and humidity
· Don't keep products in corrosive gases such as sulfur, chlorine gas or acid, or it may cause oxidization of
electrode, resulting in poor solderability.
· Products should be stored on the palette for the prevention of the influence from humidity, dust and so on.
· Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on.
· Products should be stored under the airtight packaged condition.
(3) Delivery
Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock.
14.
! Notes
(1) Please make sure that your product has been evaluated in view of your specifications with our product
being mounted to your product.
(2) You are requested not to use our product deviating from the reference specifications.
(3) The contents of this reference specification are subject to change without advance notice. Please approve our
product specifications or transact the approval sheet for product specifications before ordering.
MURATA MFG. CO., LTD.
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