LXDC2HL12G-302 [MURATA]
Low EMI noise and small footprint (5mm2) using inductor-embedded ferrite substrate;型号: | LXDC2HL12G-302 |
厂家: | muRata |
描述: | Low EMI noise and small footprint (5mm2) using inductor-embedded ferrite substrate |
文件: | 总24页 (文件大小:1151K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
LXDC2HL-G Series
Micro DC-DC converter
1. Features
Low EMI noise and small footprint (5mm2) using inductor-embedded ferrite substrate
PFM/PWM automatic mode switching function
Smooth mode transient between PFM mode and PWM mode with low-ripple-voltage
PFM mode
2% DC voltage accuracy over full load current range
Wide input voltage range : 2.3~5.5V
Fixed output voltage : 0.8V – 2. 5V (factory setting)
Internal soft start, overcurrent protection
2. Description
The LXDC2HL series is a low power step-down DCDC converter, which is suitable for a space-limited or a noise-
sensitive application. The device utilizes an inductor-embedded ferrite substrate, and the substrate eliminates
radiated EMI noise and conduction noise efficiently.
By just putting input/output capacitors, it can be used as a LDO replacement. Its low noise feature and easy to
assembly feature assures reliable power supply quality.
The device works in PFM mode at light load and it extends the battery life. At heavy load, its control mode
changes to PMW mode automatically and it keeps high efficiency using synchronous rectifying technology. The
device keeps good output voltage accuracy even in PFM mode. It keeps 2% DC voltage accuracy over full
current range, and shows very smooth mode transient between PFM mode and PWM mode.
3. Typical Application Circuit
LXDC2HL-G LXDC2HL
Enable
VBAT
EN
Vin
Vout
Vout
GND
10uF
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July. 2015
LXDC2HL-G Series
Micro DC-DC converter
4. Mechanical details
4-1 Outline
Top View
Bottom
View
Side View
Unit: mm
Mark
Dimension
L
2.5 +/- 0.2
2.0 +/- 0.2
1.0 MAX
W
T
a
0.85 +/- 0.1
0.60 +/- 0.1
0.15 +/- 0.15
b
c
4-2. Pin Function
Pin
Symbol
I/O
Description
Vin pin supplies current to the LXDC2HL internal regulator.
1
Vin
Input
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July. 2015
LXDC2HL-G Series
Micro DC-DC converter
This is the ON/OFF control pin of the device.
Connecting this pin to GND keeps the device in shutdown mode.
Pulling this pin to Vin enables the device with soft start.
This pin must not be left floating and must be terminated.
If this pin is left open, the device may be off around 100mA output.
EN=H: Device ON, EN=L: Device OFF
2
EN
Input
Regulated voltage output pin.
Apply output load between this pin and GND.
3
4
Vout
GND
Output
-
Ground pin
4-3. Functional Block Diagram
5. Ordering Information
Part number
LXDC2HL10G-301
LXDC2HL11G-306
LXDC2HL12G-302
LXDC2HL13G-441
LXDC2HL15G-303
LXDC2HL18G-304
LXDC2HL25G-341
Output Voltage
Device Specific Feature
Standard Type
Standard Type
Standard Type
Standard Type
Standard Type
Standard Type
Standard Type
MOQ
1.0V
1.1V
1.2V
1.3V
1.5V
1.8V
2.5V
T/R, 3000pcs/R
T/R, 3000pcs/R
T/R, 3000pcs/R
T/R, 3000pcs/R
T/R, 3000pcs/R
T/R, 3000pcs/R
T/R, 3000pcs/R
6. Electrical Specification
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July. 2015
LXDC2HL-G Series
Micro DC-DC converter
6-1 Absolute maximum ratings
Parameter
symbol
Vin, EN
Ta
rating
6.3
Unit
V
Input voltage
o
Operating ambient temperature
-40 to +85
C
o
Operating IC temperature
TIC
-40 to +125
-40 to +85
C
o
Storage temperature
TSTO
C
6-2 Electrical characteristics (Ta=25℃)
Parameter
Input voltage
UVLO voltage
Symbol
Vin
Condition
Min.
2.3
Typ.
Max.
5.5
Unit
3.7
1.4
V
V
UVLO
1.0
1.8
Input leak current
lin-off
Vout
Vin=3.7V, EN=0V
Vin-Vout>1V
0
2
uA
LXDC2HL10G-301
0.976
1.076
1.176
1.274
1.47
1.764
2.45
0
1.0
1.1
1.2
1.3
1.5
1.8
2.5
1.024
1.124
1.224
1.326
1.53
1.836
2.55
300
LXDC2HL11G-306
LXDC2HL12G-302
LXDC2HL13G-441
LXDC2HL15G-303
LXDC2HL18G-304
Output voltage
accuracy
V
Vin-Vout>0.7V LXDC2HL25G-341
LXDC2HL10G-301
LXDC2HL11G-306
0
250
LXDC2HL12G-302
0
250
LXDC2HL13G-441
0
250
Load current range
Iout
mA
LXDC2HL15G-303
0
200
LXDC2HL18G-304
0
200
LXDC2HL25G-341
0
200
LXDC2HL10G-301
LXDC2HL11G-306
15
15
15
15
15
15
Vin=3.7V,
LXDC2HL12G-302
LXDC2HL13G-441
LXDC2HL15G-303
LXDC2HL18G-304
Ripple voltage
Vrpl
Iout=50mA,
BW=100MHz
mVpp
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July. 2015
LXDC2HL-G Series
Micro DC-DC converter
LXDC2HL25G-341
LXDC2HL10G-301
15
80
LXDC2HL11G-306
LXDC2HL12G-302
LXDC2HL13G-441
LXDC2HL15G-303
LXDC2HL18G-304
LXDC2HL25G-341
81
82
Vin=3.7V,
Iout=100mA
83
85
86
90
Efficiency
EFF
%
VENH
VENL
Fosc
ON ; Enable
1.4
0
Vin
V
V
EN control voltage
SW Frequency
OFF ; Disable
0.25
1.2
MHz
LXDC2HL10G-301
LXDC2HL11G-306
LXDC2HL12G-302
LXDC2HL13G-441
LXDC2HL15G-303
LXDC2HL18G-304
LXDC2HL25G-341
350
300
300
300
250
250
250
700
700
700
700
700
700
700
1350
1350
1350
1350
1350
1350
1350
mA
OCP
Over current
protection
If the over current event continues less than Tlatch, auto-recovery.
If the over current event continues more than Tlatch, latch-up.
Restart by toggling EN voltage or Vin voltage
Latch-up mask time
20
Tlatch
Ton
usec
@Vout=0.8×Vnom
Start-up time
0.25
msec
(*1) External capacitors (Cout:10uF) shall be placed near the module in order to proper operation.
(*2)The above characteristics are tested using the test circuit on section 8.
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July. 2015
LXDC2HL-G Series
Micro DC-DC converter
6-3 Thermal and Current De-rating Information
The following figures show the power dissipation and temperature rise characteristics. These data are
measured on Murata’s evaluation board of this device at no air-flow condition.
Io -Loss Characteristics (Vin=3.7V)
Loss-ΔT Characteristics (Vin=3.7V)
80
70
60
50
40
30
20
10
0
6
5
4
3
2
1
0
0
20
40
60
80
0
50
100
150
200
Power Dissipation[mW]
Iout [mA]
The output current of the device may need to be de-rated if it is operated in a high ambient temperature or in a
continuous power delivering application. The amount of current de-rating is highly dependent on the
environmental thermal conditions, i.e. PCB design, nearby components or effective air flows. Care should
especially be taken in applications where the device temperature exceeds 85oC.
o
The IC temperature of the device must be kept lower than the maximum rating of 125 C. It is generally
recommended to take an appropriate de-rating to IC temperature for a reliable operation. A general de-rating for
the temperature of semiconductor is 80%.
MLCC capacitor’s reliability and the lifetime is also dependant on temperature and applied voltage stress. Higher
temperature and/or higher voltage cause shorter lifetime of MLCC, and the degradation can be described by the
Arrhenius model. The most critical parameter of the degradation is IR (Insulation Resistance). The below figure
shows MLCC’s B1 life based on a failure rate reaching 1%. It should be noted that wear-out mechanisms in
MLCC capacitor is not reversible but cumulative over time.
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July. 2015
LXDC2HL-G Series
Micro DC-DC converter
The following steps should be taken before the design fix of user’s set for reliable operation.
1. The ambient temperature of the device should be kept below 85 oC
2. The IC temperature should be measured on the worst condition of each application. The temperature must
be kept below 125 oC. An appropriate de-rating of temperature and/or output current should be taken.
3. The MLCC temperature should be measured on the worst condition of each application. Considering the
above figure, it should be checked if the expected B1 life of MLCC is acceptable or not.
7. Detailed Description
PFM/PWM Mode
If the load current decreases, the converter will enter PFM mode automatically. In PFM mode, the device
operates in discontinuous current mode with a sporadic one switching pulse to keep high efficiency at light load.
The device uses constant on time control in PFM operation, which produces a low ripple voltage and accurate
output voltage compared with other PFM architectures. Because of the architecture, DC output voltage can be
kept within +/-2% range of the nominal voltage and the output ripple voltage in PFM mode can be reduced by just
increasing output capacitor.
The transition between PFM and PWM is also seamless and smooth.
The transition current between PFM and PWM is depend on Vin, Vout and other factors, but the ballpark
threshold is about 100-200mA
PFM mode at light load
PWM mode at heavy load
Nominal output voltage
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July. 2015
LXDC2HL-G Series
Micro DC-DC converter
UVLO (Under Voltage Lock Out)
The input voltage (Vin) must reach or exceed the UVLO voltage (1.4Vtyp) before the device begins the start up
sequence even when EN pin kept high. UVLO function keeps away of an unstable operation at low Vin range
Soft Start
The device has an internal soft-start function that limits the inrush current during start-up. The soft-start system
progressively increases the switching on-time from a minimum pulse-width to that of normal operation. Because
of the function, the output voltage increases gradually from zero to nominal voltage at start-up event. The
nominal soft-start time is 0.25msec. If you prefer a faster soft-start time, please contact Murata representative.
Enable
The device starts operation when EN is set high and starts up with soft start. For proper operation, the EN pin must
be terminated to logic high and must not be left floating. If the pin is left open, the device may operate at light load
but will not work at heavy load.
Pulling the EN pin to logic low forces the device shutdown. The device does not have a discharge function when
it turns off. If you prefer a discharge function, please contact Murata representative.
100% Duty Cycle Operation
The device can operate 100% duty cycle mode, in which high-side switch is constantly turned ON, thereby
providing a low input-to-output voltage difference.
When Vin and Vout becomes close and the duty gets close to 100%, the switching pulse will skip the nominal
switching period and the output voltage ripple may be larger than other condition. It should be noted that this
condition does not mean a failure of the device.
Over Current Protection
When the output current reaches the OCP threshold, the device narrows the switching duty and decrease the
output voltage. If the OCP event is removed within the mask time (20usec typ), the output voltage recovers to the
nominal value automatically. If the OCP event continues over the mask time, the device will shutdown.
After it is shut down, it can be restarted by toggling the Vin or EN voltage.
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July. 2015
LXDC2HL-G Series
Micro DC-DC converter
8. Test Circuit
LXDC2HL-G
Cout : 10uF/6.3V (GRM155R60J106M)
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July. 2015
LXDC2HL-G Series
Micro DC-DC converter
9. Measurement Data
Micro DC-DC Converter evaluation board (P2LX0244)
Measurement setup
Enable SW
VIN_S
VIN
A
VOUT_S
VOUT
Load
A
GND
V
GND
V
GND_S
GND_S
The enable switch has three positions.
1. When it is toggled to “ON” side, the device starts operation.
2. When it is toggled to “OFF” side, the device stop operation and keep shut down status.
3. When it is set to middle of “ON” and “OFF”, the EN pin becomes floated and can be applied an external
voltage through the EN terminal pin on the EVB. If you don’t apply external voltage to EN pin, the enable
switch should not to be set to the middle position.
※The 47uF capacitor is for the evaluation kit only, and has been added to compensate for the long test cables.
Typical Measurement Data (reference purpose only) (Ta=25℃)
Efficiency
・Vin=3.7V,Vout=1.0V
・Vin=3.7V,Vout=1.2V
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July. 2015
LXDC2HL-G Series
Micro DC-DC converter
100
95
90
85
80
75
70
65
60
100
95
90
85
80
75
70
65
60
1
10
100
1000
1
10
100
1000
Iout [mA]
Iout [mA]
・Vin=3.7V,Vout=1.5V
・Vin=3.7V,Vout=1.8V
100
95
90
85
80
75
70
65
60
100
95
90
85
80
75
70
65
60
1
10
100
1000
1
10
100
1000
Iout [mA]
Iout [mA]
・Vin=3.7V,Vout=2.5V
100
95
90
85
80
75
70
65
60
1
10
100
1000
Iout [mA]
Load Regulation
・Vin=3.7V,Vout=1.0V
・Vin=3.7V,Vout=1.2V
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July. 2015
LXDC2HL-G Series
Micro DC-DC converter
1.02
1.01
1
1.224
1.212
1.2
0.99
0.98
1.188
1.176
0
50
100
150
200
250
300
0
50
100
150
200
250
Iout [mA]
Iout [mA]
・Vin=3.7V,Vout=1.5V
・Vin=3.7V,Vout=1.8V
1.836
1.53
1.515
1.5
1.818
1.8
1.485
1.47
1.782
1.764
0
50
100
150
200
0
50
100
150
200
Iout [mA]
Iout [mA]
・Vin=3.7V,Vout=2.5V
2.55
2.525
2.5
2.475
2.45
0
50
100
150
200
Iout [mA]
Ripple Voltage
・Vin=3.7V,Vout=1.0V
・Vin=3.7V,Vout=1.2V
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July. 2015
LXDC2HL-G Series
Micro DC-DC converter
3.7,Vout=1.1V
50
50
40
30
20
10
0
40
30
20
10
0
0
50
100
150
200
250
300
0
50
100
150
200
250
Iout [mA]
Iout [mA]
・Vin=3.7V,Vout=1.5V
・Vin=3.7V,Vout=1.8V
50
50
40
30
20
10
0
40
30
20
10
0
0
50
100
150
200
0
50
100
150
200
Iout [mA]
Iout [mA]
・Vin=3.7V,Vout=2.5V
50
40
30
20
10
0
0
50
100
150
200
Iout [mA]
Load Transient Response
・Vin=3.7V, Vout=1.8V
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July. 2015
LXDC2HL-G Series
Micro DC-DC converter
192mV
ΔIo=200mA
10.Reliability Tests
Result
QTY
No.
1
Items
Specifications
Test Methods
(NG)
Vibration
Resistance
Appearance :
No severe damag
Solder specimens on the testing jig
(glass fluorine boards) shown in
appended Fig.1 by a Pb free solder.
The soldering shall be done either by
iron or reflow and be conducted with
care so that the soldering is uniform
and free of defect such as by heat
shock.
G
18
(0)
Frequency : 10~2000 Hz
Acceleration : 196 m/s2
Direction : X,Y,Z 3 axis
Period : 2 h on each direction Total 6
h.
2
Deflection
Solder specimens on the testing jig
(glass epoxy boards) shown in
appended Fig.2 by a Pb free solder.
The soldering shall be done either by
iron or reflow and be conducted with
care so that the soldering is uniform
and free of defect such as by heat
shock.
G
18
(0)
Deflection : 1.6mm
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July. 2015
LXDC2HL-G Series
Micro DC-DC converter
3
Soldering strength (Push
Strength)
9.8 N Minimum
Solder specimens onto test jig shown
below. Apply pushing force at 0.5mm/s
until electrode pads are peeled off or
ceramics are broken. Pushing force is
applied to longitudinal direction.
G
Pushing Direction
18
(0)
Specimen
Jig
4
5
Solderability of
Termination
75%
of
the Immerse specimens first an ethanol
solution of rosin, then in a Pb free
solder solution for 3±0.5 sec. at
245±5 °C.
terminations is to be
soldered evenly and
continuously.
G
18
Preheat
: 150 °C, 60 sec.
(0)
Solder Paste : Sn-3.0Ag-0.5Cu
Flux : Solution of ethanol and rosin
(25 % rosin in weight proportion)
Resistance to
Soldering Heat
(Reflow)
Preheat Temperature : 150-180 °C
Preheat Period
Temperature
: 90+/-30 sec. High
: 220 °C High Temp.
Appearance
No severe damages
Period : 20sec.
Peak Temperature
Specimens are soldered twice with the
above condition, and then kept in
: 260+5/-0 °C
G
18
(0)
Satisfy
specifications listed
in paragraph 6-2.
Electrical
specifications
room condition for 24
measurements.
h before
Result
(NG)
No. Items
Specifications
Test Methods
QTY
18
6
High Temp.
Temperature:85±2 ℃
Period:1000+48/-0 h
Room Condition:2~24h
G
(0)
Exposure
7
Temperature
Cycle
Condition:100 cycles in the following
table
Step
1
Temp(°C)
Time(min)
30±3
G
(0)
Min.
Operating
Temp.+0/-3
18
Max.
2
Operating
Temp.+3/-0
30±3
8
Humidity
(Steady State)
Temperature:85±2 ℃
Humidity:80~90%RH
Period:1000+48/-0 h
G
(0)
18
Appearance
No severe damages
Room Condition:2~24h
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July. 2015
LXDC2HL-G Series
Micro DC-DC converter
9
Low Temp.
Exposure
Temperature:-40±2 ℃
Period:1000+48/-0 h
Room Condition:2~24h
Electrical
specifications
Satisfy
specifications listed
in paragraph 6-2.
G
18
(0)
10
11
C:200pF、R:0Ω
ESD(Machine
Model)
G
(0)
TEST Voltage :+/-100V
5
Number of electric discharges:1
C:100pF、R:1500Ω
ESD(Human
Body Model)
G
(0)
TEST Voltage :+/-1000V
Number of electric discharges:1
5
Fig.1
Land Pattern
Unit:mm
Symbol
Dimensions
0.85
a
b
c
d
0.60
0.5
・Reference
only.
purpose
0.2
Fig.2
Testing board
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July. 2015
LXDC2HL-G Series
Micro DC-DC converter
Unit:mm
■: Land pattern is same as
figure1
Glass-fluorine board t=
1.6mm
Copper thickness over 35
mm
Mounted situation
Unit:mm
Device
45
45
Test method
Unit:mm
11. Tape and Reel Packing
1) Dimensions of Tape (Plastic tape)
Unit: mm
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July. 2015
LXDC2HL-G Series
Micro DC-DC converter
2) Dimensions of Reel
Unit: mm
±
2 0.5
Φ180
Φ60
±
Φ13 0.2
(9.0)
±
13.0 1.4
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July. 2015
LXDC2HL-G Series
Micro DC-DC converter
3) Taping Diagrams
[1]Feeding Hole : As specified in (1)
[2]Hole for chip : As specified in (1)
: 50um in thickness
: As specified in (1)
[3]
[1]
[2]
[3]
[4]
Feeding Hole
Feeding Direction
Chip
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July. 2015
LXDC2HL-G Series
Micro DC-DC converter
Symbol
Items
No components at trailer
No components at leader
Whole leader
Ratings(mm)
A
B
C
min 160
min 100
min 400
5)The tape for chips are wound clockwise, the feeding holes to the right side as the tape is pulled
toward
the user.
6)Packaging unit: 3,000 pcs./ reel
7)Material: Base Tape
… Plastic
… Plastic
Reel
Antistatic coating for both base tape and reel
)
8 Peeling of force
0.1~1.0N
165 to 180 °
Cover Tape
BaseTape
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July. 2015
LXDC2HL-G Series
Micro DC-DC converter
NOTICE
1. Storage Conditions:
To avoid damaging the solderability of the external electrodes, be sure to observe the following points.
- Store products where the ambient temperature is 15 to 35 °C and humidity 45 to 75% RH.
(Packing materials, In particular, may be deformed at the temperature over 40 °C.).
- Store products in non corrosive gas (Cl2, NH3,SO2, Nox, etc.).
- Stored products should be used within 6 months of receipt. Solderability should be verified if this
period is exceeded
This product is applicable to MSL1 (Based on IPC/JEDEC J-STD-020)
2. Handling Conditions:
Be careful in handling or transporting the product. Excessive stress or mechanical shock may damage the
product because of the nature of ceramics structure.
Do not touch the product, especially the terminals, with bare hands. Doing so may result in poor
solderability.
3. Standard PCB Design (Land Pattern and Dimensions):
All the ground terminals should be connected to ground patterns. Furthermore, the ground pattern should
be provided between IN and OUT terminals. Please refer to the specifications for the standard land
dimensions.
The recommended land pattern and dimensions are shown for a reference purpose only.
Electrical, mechanical and thermal characteristics of the product shall depend on the pattern design and
material / thickness of the PCB. Therefore, be sure to check the product performance in the actual set.
When using underfill materials, be sure to check the mechanical characteristics in the actual set.
4. Soldering Conditions:
Soldering is allowed up through 2 times.
Carefully perform preheating :△T less than 130 °C.
When products are immersed in solvent after mounting, pay special attention to maintain the temperature
difference within 100 °C. Soldering must be carried out by the above mentioned conditions to prevent
products from damage. Contact Murata before use if concerning other soldering conditions.
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July. 2015
LXDC2HL-G Series
Micro DC-DC converter
Reflow soldering standard conditions (example)
Use rosin type flux or weakly active flux with a chlorine content of 0.2 wt % or less.
5. Cleaning Conditions:
The product is not designed to be cleaned after soldering.
6. Operational Environment Conditions:
Products are designed to work for electronic products under normal environmental conditions (ambient
temperature, humidity and pressure). Therefore, products have no problems to be used under the
similar conditions to the above-mentioned. However, if products are used under the following
circumstances, it may damage products and leakage of electricity and abnormal temperature may
occur.
- In an atmosphere containing corrosive gas ( Cl2, NH3, SOx, NOx etc.).
- In an atmosphere containing combustible and volatile gases.
- In a dusty environment. - Direct sunlight
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July. 2015
LXDC2HL-G Series
Micro DC-DC converter
- Water splashing place.
- Humid place where water condenses.
- In a freezing environment.
If there are possibilities for products to be used under the preceding clause, consult with Murata before
actual use.
If static electricity is added to this product, degradation and destruction may be produced.
Please use it after consideration enough so that neither static electricity nor excess voltage is added at
the time of an assembly and measurement.
If product malfunctions may result in serious damage, including that to human life, sufficient fail-safe
measures must be taken, including the following:
(1) Installation of protection circuits or other protective device to improve system safety
(2) Installation of redundant circuits in the case of single-circuit failure
7. Input Power Capacity:
Products shall be used in the input power capacity as specified in this specifications.
Inform Murata beforehand, in case that the components are used beyond such input power capacity
range .
8. Limitation of Applications:
The products are designed and produced for application in ordinary electronic equipment (AV
equipment, OA equipment, telecommunication, etc). If the products are to be used in devices
requiring extremely high reliability following the application listed below, you should consult with
the Murata staff in advance.
- Aircraft equipment. - Aerospace equipment - Undersea equipment.
- Power plant control equipment.
- Medical equipment.
- Transportation equipment (vehicles, trains, ships, etc.).
- Automobile equipment which includes the genuine brand of car manufacture, car factory-installed
option and dealer-installed option.
- Traffic signal equipment.
- Disaster prevention / crime prevention equipment.
- Data-procession equipment.
- Application which malfunction or operational error may endanger human life and property of assets.
- Application which related to occurrence the serious damage
- Application of similar complexity and/ or reliability requirements to the applications listed in the above.
23
July. 2015
LXDC2HL-G Series
Micro DC-DC converter
! Note:
Please make sure that your product has been evaluated and confirmed against your specifications
when our product is mounted to your product.
Product specifications are subject to change or our products in it may be discontinued without advance
notice.
This catalog is for reference only and not an official product specification document, therefore, please
review and approve our official product specification before ordering this product.
24
July. 2015
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