LQW2BAS56NJ0C# [MURATA]
;Spec No.:JELF243A-0181-01
P1/13
Chip Coil (Chip Inductors) LQW2BAS□□□□0C□ REFERENCE SPECIFICATION
1. Scope
This reference specification applies to chip coils (chip inductors) LQW2BAS□□□□0C□ series for general electronic
equipment.
2. Part Numbering
(Ex.)
LQ
W
2B
AS
2N7
J
0C
L
Product ID
Type
Dimension Application and Inductance Tolerance Category
(L × W) characteristic
Packaging
L: taping
*B: bulk
*B: Bulk packing is also available.(The product sealed on the carrier tape is stored in a plastic bag.)
3. Part Number and Rating
Operating temperature range
Storage temperature range
-40°C to +85°C
-40°C to +85°C
Inductance
DC
resistance
(Ω max.)
Self-resonant
frequency
(MHz min.)
Rated
current
(mA)
Customer
Murata
Q
(Min.)
Nominal
value
Part number
Part number
Tolerance
(nH)
LQW2BAS2N7J0CL
LQW2BAS2N8J0CL
LQW2BAS3N0J0CL
LQW2BAS5N6J0CL
LQW2BAS6N0J0CL
LQW2BAS6N8J0CL
LQW2BAS7N5J0CL
LQW2BAS8N2G0CL
LQW2BAS8N2J0CL
LQW2BAS10NG0CL
LQW2BAS10NJ0CL
LQW2BAS12NG0CL
LQW2BAS12NJ0CL
LQW2BAS15NG0CL
LQW2BAS15NJ0CL
LQW2BAS18NG0CL
LQW2BAS18NJ0CL
LQW2BAS22NG0CL
LQW2BAS22NJ0CL
LQW2BAS24NG0CL
LQW2BAS24NJ0CL
LQW2BAS27NG0CL
LQW2BAS27NJ0CL
LQW2BAS33NG0CL
LQW2BAS33NJ0CL
LQW2BAS36NG0CL
LQW2BAS36NJ0CL
LQW2BAS39NG0CL
LQW2BAS39NJ0CL
2.7
2.8
3.0
5.6
6.0
6.8
7.5
8.2
8.2
10
10
12
12
15
15
18
18
22
22
24
24
27
27
33
33
36
36
39
39
±5%
±5%
±5%
±5%
±5%
±5%
±5%
±2%
±5%
±2%
±5%
±2%
±5%
±2%
±5%
±2%
±5%
±2%
±5%
±2%
±5%
±2%
±5%
±2%
±5%
±2%
±5%
±2%
±5%
80
80
65
65
70
50
50
50
50
60
60
50
50
50
50
50
50
55
55
50
50
55
55
60
60
55
55
60
60
0.03
0.06
0.06
0.08
0.03
0.11
0.14
0.12
0.12
0.10
0.10
0.15
0.15
0.17
0.17
0.20
0.20
0.22
0.22
0.22
0.22
0.25
0.25
0.27
0.27
0.27
0.27
0.29
0.29
15000
12200
12200
5900
4500
5600
4800
4400
4400
4300
4300
4000
4000
3200
3200
3100
3100
2600
2600
2400
2400
2580
2580
2150
2150
1900
1900
2000
2000
910
800
800
600
600
600
600
600
600
600
600
600
600
600
600
600
600
500
500
500
500
500
500
500
500
500
500
500
500
MURATA MFG CO., LTD
Spec No.:JELF243A-0181-01
P2/13
Rated
current
(mA)
Inductance
Nominal
DC
resistance
(Ω max.)
Self-resonant
frequency
(MHz min.)
Customer
Part number
Murata
Part number
Q
(Min.)
value
(nH)
Tolerance
LQW2BAS43NG0CL
LQW2BAS43NJ0CL
LQW2BAS47NG0CL
LQW2BAS47NJ0CL
LQW2BAS56NG0CL
LQW2BAS56NJ0CL
LQW2BAS68NG0CL
LQW2BAS68NJ0CL
LQW2BAS82NG0CL
LQW2BAS82NJ0CL
LQW2BAS91NG0CL
LQW2BAS91NJ0CL
LQW2BASR10G0CL
LQW2BASR10J0CL
LQW2BASR11G0CL
LQW2BASR11J0CL
LQW2BASR12G0CL
LQW2BASR12J0CL
LQW2BASR15G0CL
LQW2BASR15J0CL
LQW2BASR18G0CL
LQW2BASR18J0CL
LQW2BASR22G0CL
LQW2BASR22J0CL
LQW2BASR24G0CL
LQW2BASR24J0CL
LQW2BASR27G0CL
LQW2BASR27J0CL
LQW2BASR33G0CL
LQW2BASR33J0CL
LQW2BASR39J0CL
LQW2BASR47J0CL
LQW2BASR50J0CL
LQW2BASR56J0CL
LQW2BASR68J0CL
LQW2BASR82J0CL
LQW2BAS1R0J0CL
43
43
±2%
±5%
±2%
±5%
±2%
±5%
±2%
±5%
±2%
±5%
±2%
±5%
±2%
±5%
±2%
±5%
±2%
±5%
±2%
±5%
±2%
±5%
±2%
±5%
±2%
±5%
±2%
±5%
±2%
±5%
±5%
±5%
±5%
±5%
±5%
±5%
±5%
60
60
60
60
60
60
60
60
65
65
65
65
65
65
50
50
50
50
50
50
50
50
50
50
44
44
48
48
48
48
48
33
33
23
23
23
23
0.34
0.34
0.31
0.31
0.34
0.34
0.38
0.38
0.42
0.42
0.48
0.48
0.46
0.46
0.48
0.48
0.51
0.51
0.56
0.56
0.64
0.64
0.70
0.70
1.00
1.00
1.00
1.00
1.40
1.40
1.50
1.76
3.20
1.90
2.20
2.35
2.40
1800
1800
1700
1700
1600
1600
1500
1500
1330
1330
1330
1330
1250
1250
1100
1100
1100
1100
920
500
500
500
500
500
500
500
500
400
400
400
400
400
400
400
400
400
400
400
400
400
400
400
400
350
350
350
350
310
310
290
250
200
230
190
180
170
47
47
56
56
68
68
82
82
91
91
100
100
110
110
120
120
150
150
180
180
220
220
240
240
270
270
330
330
390
470
500
560
680
820
1000
920
920
920
820
820
770
770
730
730
650
650
600
300
585
270
250
230
200
MURATA MFG CO., LTD
Spec No.:JELF243A-0181-01
P3/13
4. Testing Conditions
Unless otherwise specified
Temperature: ordinary temperature (15°C to 35°C)
Humidity: ordinary humidity [25% to 85% (RH)]
In case of doubt
Temperature: 20°C±2°C
Humidity: 60% to 70% (RH)
Atmospheric pressure: 86 kPa to 106 kPa
5. Appearance and Dimensions
■ Equivalent Circuit
■ Unit mass (typical value): 0.014 g
6. Marking
No marking.
MURATA MFG CO., LTD
Spec No.:JELF243A-0181-01
P4/13
7. Electrical Performance
No.
Item
Specification
Meet chapter 3 ratings.
Test method
7.1 Inductance / Q
Measuring equipment: Keysight E4991A or the
equivalent
Measuring frequency:
250 MHz 2.7 nH to
39 nH
68 nH
82 nH to 120 nH
200 MHz
150 MHz
43 nH to
Inductance
100 MHz 150 nH to 390 nH
50 MHz 470 nH to 500 nH
25 MHz 560 nH to 1000 nH
1500 MHz 2.7 nH to
1000 MHz 5.6 nH to
3.0 nH
8.2 nH
500 MHz
10 nH to 100 nH
Q
250 MHz 110 nH to 390 nH
100 MHz 470 nH to
50 MHz 500 nH to 1000 nH
Measuring Condition:
Measurement signal level: Approx. 0dBm
Measurement terminal distance:1.5 mm
Electrical length: 10.0 mm
Measuring Fixture: KEYSIGHT 16197A
Position the chip coil under test as shown in the
measuring example below and connect it to the
electrode by applying weight.
Measurement example:
Measuring method: see "Electrical performance:
Measuring method for inductance/Q" in the chapter
"Appendix".
7.2 DC resistance
Meet chapter 3 ratings.
Meet chapter 3 ratings.
Measuring equipment: digital multimeter.
7.3 Self-resonant
frequency
Measuring equipment: Keysight N5230A or the
equivalent
7.4 Rated current
Temperature rise caused by self-
generated heat shall be limited to 40°C
max.
Apply the rated current specified in chapter 3.
MURATA MFG CO., LTD
Spec No.:JELF243A-0181-01
P5/13
8. Mechanical Performance
The product is soldered on a substrate for test.(Except Solderability)
(Test shall be done using Flux, Solder and Soldering condition which are specified in chapter 12 except the case of being
specified special condition.)
No.
Item
Specification
Test method
8.1 Shear test
No significant mechanical damage or no Applying force: 10 N
sign of electrode peeling off shall be
observed.
Holding time: 5 s
Force application direction:
8.2 Bending test
No significant mechanical damage or no Test substrate: glass-epoxy substrate (100 mm × 40
sign of electrode peeling off shall be
observed.
mm × 1.6 mm)
Pressurizing speed: 1.0 mm/s
Pressure jig: R230
Amount of bending: 2 mm
Holding time: 20 s
8.3 Vibration
Appearance shall have no significant
mechanical damage.
Oscillation frequency: 10 Hz to 2000 Hz to 10 Hz/20
min
Amplitude: total amplitude of 3.0 mm or acceleration
amplitude of 196 m/s2, whichever is smaller
Test time: 3 directions perpendicular to each other, 2
h for each direction (6 h in total)
8.4 Solderability
90% or more of the outer electrode shall Flux: Ethanol solution of rosin, 25(wt)%
be covered with new solder seamlessly. Pre-heating: 150°C/60 s
(except exposed wire)
Solder: Sn-3.0Ag-0.5Cu solder
Solder temperature: 245°C±3°C
Immersion time: 3 s
MURATA MFG CO., LTD
Spec No.:JELF243A-0181-01
P6/13
9. Environmental Performance
The product is soldered on a substrate for test.
(Test shall be done using Flux, Solder and Soldering condition which are specified in chapter 12 except the case of being
specified special condition.)
No.
Item
Specification
Test method
9.1 Heat life
Appearance: No significant mechanical Temperature: 85°C±2°C
damage shall be observed.
Applying Current: Rated Current
Inductance change rate: within ±10%
Test time: 1000 h (+48 h, -0 h)
Post-treatment: left for 4 hours to 48 hours at room
temperature.
9.2 Cold resistance
9.3 Humidity
Appearance: No significant mechanical Temperature: -40°C±2°C
damage shall be observed.
Inductance change rate: within ±10%
Test time: 1000 h (+48 h, -0 h)
Post-treatment: left for 4 hours to 48 hours at room
temperature.
Appearance: No significant mechanical Temperature: 40°C±2°C
damage shall be observed.
Inductance change rate: within ±10%
Humidity: 90% to 95% (RH)
Test time: 1000 h (+48 h, -0 h)
Post-treatment: left for 4 hours to 48 hours at room
temperature.
9.4 Temperature cycle Appearance: No significant mechanical Single cycle conditions:
damage shall be observed.
Step 1: -40°C (+0°C, -3°C), 30 min (+3 min, -0 min)
Inductance change rate: within ±10%
Step 2: ordinary temperature, 3 min max.
Step 3: +85°C (+3°C, -0°C), 30 min (+3 min, -0 min)
Step 4: ordinary temperature, 3 min max.
Number of testing: 100 cycles
Post-treatment: left for 4 hours to 48 hours at room
temperature.
10. Specification of Packaging
10.1 Appearance and dimensions of tape (8 mm width/plastic tape)
A
B
t
1.8±0.1
2.3±0.1
1.65±0.1
(0.25)
t'
(in mm)
* The dimensions of the cavity are measured at its bottom.
10.2 Taping specifications
Packing quantity
2000 pcs/reel
(Standard quantity)
Packing method
Feed hole position
Joint
The products are placed in cavities of a carrier tape and sealed by a cover tape (top tape and
bottom tape when the cavities of the carrier tape are punched type).
The feed holes on the carrier tape are on the right side when the cover tape (top tape when the
cavities of the carrier tape are punched type) is pulled toward the user.
The carrier tape and cover tape (top tape when the cavities of the carrier tape are punched type)
are seamless.
Number of missing
products
Number of missing products within 0.025% of the number per reel or 1 pc., whichever is greater,
and are not continuous. The specified quantity per reel is kept.
10.3 Break down force of tape
Cover tape (or top tape)
5 N min.
5 N min.
Bottom tape (only when the cavities of the carrier tape are punched type)
MURATA MFG CO., LTD
Spec No.:JELF243A-0181-01
P7/13
10.4 Peeling off force of tape
Speed of peeling off
300 mm/min
0.1 N to 0.7 N (The lower limit is for typical value.)
Peeling off force
10.5 Dimensions of leader section, trailer section and reel
A vacant section is provided in the leader (start) section and trailer (end) section of the tape for the product. The leader
section is further provided with an area consisting only of the cover tape (or top tape). (See the diagram below.)
10.6 Marking for reel
Customer part number, Murata part number, inspection number (*1), RoHS marking (*2), quantity, etc.
*1 Expression of inspection No.: (1) Factory code
□□
(1)
○○○○
(2)
(2) Date
First digit: year/last digit of year
(3)
Second digit: month/Jan. to Sep.→1 to 9, Oct. to Dec.→O, N, D
Third, Fourth digit: day
(3) Serial No.
*2 Expression of RoHS marking: (1) RoHS regulation conformity
ROHS-
Y
()
(2) Murata classification number
(1)
(2)
10.7 Marking on outer box (corrugated box)
Customer name, purchasing order number, customer part number, Murata part number, RoHS marking (*2), quantity, etc.
10.8 Specification of outer box
Dimensions of outer box
Standard reel quantity
(mm)
Label
in outer box (reel)
W
D
H
H
186
186
93
5
D
* Above outer box size is typical. It depends on a
quantity of an order.
W
MURATA MFG CO., LTD
Spec No.:JELF243A-0181-01
P8/13
11.
Caution
11.1 Restricted applications
Please contact us before using our products for the applications listed below which require especially high reliability for the
prevention of defects which might directly cause damage to the third party's life, body or property.
(1) Aircraft equipment
(6) Transportation equipment (vehicles, trains, ships, etc.)
(7) Traffic signal equipment
(2) Aerospace equipment
(3) Undersea equipment
(4) Power plant control equipment
(5) Medical equipment
(8) Disaster/crime prevention equipment
(9) Data-processing equipment
(10) Applications of similar complexity and/or reliability requirements
to the applications listed in the above
11.2 Precautions on rating
Avoid using in exceeded the rated temperature range, rated voltage, or rated current.
Usage when the ratings are exceeded could lead to wire breakage, burning, or other serious fault.
11.3 Inrush current
If an inrush current (or pulse current or rush current) that significantly exceeds the rated current is applied to the product,
overheating could occur, resulting in wire breakage, burning, or other serious fault.
12. Precautions for Use
This product is for use only with reflow soldering. It is designed to be mounted by soldering. If you want to use other
mounting method, for example, using a conductive adhesive, please consult us beforehand.
Also, if repeatedly subjected to temperature cycles or other thermal stress, due to the difference in the coefficient of thermal
expansion with the mounting substrate, the solder (solder fillet part) in the mounting part may crack.
The occurrence of cracks due to thermal stress is affected by the size of the land where mounted, the solder volume, and
the heat dissipation of the mounting substrate. Carefully design it when a large change in ambient temperature is assumed.
12.1 Land dimensions
The following diagram shows the recommended land dimensions for reflow soldering.
a
b
c
0.76
2.8
1.78
(in mm)
land pattern
solder resist
a
b
12.2 Flux and solder used
Flux
• Use a rosin-based flux.
• Do not use a highly acidic flux with a halide content exceeding 0.2(wt)% (chlorine conversion value).
• Do not use a water-soluble flux.
Solder
• Use Sn-3.0Ag-0.5Cu solder.
• Standard thickness of solder paste: 100 μm to 150 μm
If you want to use a flux other than the above, please consult our technical department.
MURATA MFG CO., LTD
Spec No.:JELF243A-0181-01
P9/13
12.3 Soldering conditions (reflow)
• Pre-heating should be in such a way that the temperature difference between solder and product surface is limited to
100°C max.
Cooling into solvent after soldering also should be in such a way that the temperature difference is limited to 100°C max.
Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of product quality.
• Standard soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and/or resulting in the deterioration of product
quality.
Temp.
(℃)
260℃
230℃
Limit Profile
245℃±3℃
220℃
180
150
Standard Profile
30s~60s
60s max.
90s±30s
Time.(s)
Standard profile
Limit profile
Pre-heating
150°C to 180°C/90 s±30 s
Above 220°C/30 s to 60 s
245°C±3°C
150°C to 180°C/90 s±30 s
Above 230°C/60 s max.
260°C/10 s
Heating
Peak temperature
Number of reflow cycles
2 times
2 times
12.4 Reworking with soldering iron
The following requirements must be met to rework a soldered product using a soldering iron.
Item
Requirement
150°C/approx. 1 min
350°C max.
Pre-heating
Tip temperature of soldering iron
Power consumption of soldering iron
Tip diameter of soldering iron
Soldering time
80 W max.
ø3 mm max.
3 s (+1 s, -0 s)
2 times max.
Number of reworking operations
* Avoid a direct contact of the tip of the soldering iron with the product. Such a
direction contact may cause cracks in the ceramic body due to thermal shock.
12.5 Solder volume
Solder shall be used not to increase the volume too much.
An increased solder volume increases mechanical stress on the product. Exceeding solder volume may cause the failure of
mechanical or electrical performance.
12.6 Product's location
The following shall be considered when designing and laying out PCBs.
(1) PCB shall be designed so that products are not subject to mechanical stress due to warping the board.
[Products direction]
Products shall be located in the sideways direction (length: a < b) to the mechanical stress.
a
b
Poor example
〈
〉
Good example
〈
〉
MURATA MFG CO., LTD
Spec No.:JELF243A-0181-01
P10/13
(2) Components location on PCB separation
It is effective to implement the following measures, to reduce stress in separating the board.
It is best to implement all of the following three measures; however, implement as many measures as possible to reduce
stress.
Contents of measures
Stress level
A > D*1
A > B
(1) Turn the mounting direction of the component parallel to the
board separation surface.
(2) Add slits in the board separation part.
(3) Keep the mounting position of the component away from the
board separation surface.
A > C
*1 A > D is valid when stress is added vertically to the perforation as with hand separation.
If a cutting disc is used, stress will be diagonal to the PCB, therefore A > D is invalid.
(3) Mounting components near screw holes
When a component is mounted near a screw hole, it may be affected by the board deflection that occurs during the
tightening of the screw.
Mount the component in a position as far away from the screw holes as possible.
12.7 Handling of substrate
After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the substrate
when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to the substrate.
Excessive mechanical stress may cause cracking in the product.
Bending
Twisting
12.8 Cleaning
Excessive ultrasonic oscillation during cleaning can cause the PCBs to resonate, resulting in cracked chips or broken solder
joints. Before starting your production process, test your cleaning equipment / process to insure it does not degrade this
product.
MURATA MFG CO., LTD
Spec No.:JELF243A-0181-01
P11/13
12.9 Storage and transportation
Storage period
Use the product within 12 months after delivery.
If you do not use the product for more than 12 months, check solderability before using it.
Storage conditions • The products shall be stored in a room not subject to rapid changes in temperature and
humidity. The recommended temperature range is -10°C to +40°C. The recommended relative
humidity range is 15% to 85%.
Keeping the product in corrosive gases, such as sulfur, chlorine gas or acid may cause the
poor solderability.
• Do not place the products directly on the floor; they should be placed on a palette so that they
are not affected by humidity or dust.
• Avoid keeping the products in a place exposed to direct sunlight, heat or vibration.
• Do not keep products in bulk packaging. Bulk storage could result in collisions between the
products or between the products and other parts, resulting in chipping or wire breakage.
• Avoid storing the product by itself bare (i.e. exposed directly to air).
Transportation
Excessive vibration and impact reduces the reliability of the products. Exercise caution when
handling the products.
12.10 Resin coating (including moisture-proof coating)
When the product is coated/molded with resin, its electrical characteristics may change.
A wire breakage issue may occur by mechanical stress caused by the resin, amount/cured shape of resin, or operating
condition etc.
Some resins contain impurities or hydrolyzable chlorine, which could result in corrosion of the conducting materials, leading
to wire breakage.
So, please pay your careful attention when you select resin in case of coating/molding the products with the resin.
Prior to use the coating resin, please make sure no reliability issue is observed by evaluating products mounted on your
board.
12.11 Mounting conditions
Check the mounting condition before using.
Using mounting conditions (nozzles, equipment conditions, etc.) that are not suitable for products may lead to pick up errors,
misalignment, or damage to the product.
12.12 Operating environment
Do not use this product under the following environmental conditions as it may cause deterioration of product quality.
(1) In the corrodible atmosphere such as acidic gases, alkaline gases, chlorine, sulfur gases, organic gases and etc.
(the sea breeze, Cl2, H2S, NH3, SO2, NO2, etc)
(2) In the atmosphere where liquid such as organic solvent, may splash on the products.
(3) In the atmosphere where the temperature/humidity changes rapidly and it is easy to dew.
12.13 Mounting density
If this product is placed near heat-generating products, be sure to implement sufficient heat-dissipating measures.
If this product is subjected to a significant amount of heat from other products, this could adversely affect product quality,
resulting in a circuit malfunction or failure of the mounted section. Also, be sure that the product is used in a manner so that
the heat that the product is subjected to from other products does not exceed the upper limit of the rated operating
temperature for the product.
12.14 Handling of product
・Sharp material such as a pair of tweezers or other material such as bristles of cleaning brush , shall not be touched to the
winding portion and electrode to prevent the breaking of wire.
・Mechanical shock should not be applied to the products mounted on the board to prevent the breaking of the core.
13.
Note
(1) Please make sure that your product has been evaluated in view of your specifications with our product being mounted to
your product.
(2) You are requested not to use our product deviating from the reference specifications.
(3) The contents of this reference specification are subject to change without advance notice. Please approve our product
specifications or transact the approval sheet for product specifications before ordering.
MURATA MFG CO., LTD
Spec No.:JELF243A-0181-01
P12/13
Appendix
Electrical performance: Measuring method for inductance/Q (Q measurement is applicable only when the Q value is
included in the rating table.)
Perform measurement using the method described below. (Perform correction to ensure that the inductance value is compatible
with inductors of other manufacturers.)
(1) Residual elements and stray elements of the measuring terminal can be expressed by the F parameter for the 2-pole
terminal as shown in the figure below.
(2) The product's impedance value (Zx) and measured impedance value (Zm) can be expressed as shown below, by using
the respective current and voltage for input/output.
V1
I1
V2
I2
Zm=
Zx=
(3) Thus, the relationship between the product's impedance value (Zx) and measured impedance value (Zm) is as follows.
Here,
α = D/A = 1
β = B/D = Zsm - (1 - Yom Zsm) Zss
Zm-β
1-ZmΓ
Γ = C/A = Yom
Zx=α
Zsm: measured impedance when measuring terminal is shorted
Zss: residual impedance of short chip (= Equivalent series inductance X)
Yom: measured admittance when measuring terminal is open
Important
In consideration of compatibility with other venders' products, Zss is defined as the correction value to fit
nominal inductance of other venders' products.
When calibrating the measurement, please input X value instead of the equivalent series inductance (ShortL)
for each L value.
Perform measurement of Q using the residual impedance 0.771 nH obtained through our conventional standard
measurement method.
(4) Calculate inductance Lx and Qx using the equations shown below.
Im (Zx)
Lx: inductance of chip coil
Qx: Q of chip coil
Lx=
2πf
Im (Zx)
Qx=
f: measuring frequency
Re (Zx)
MURATA MFG CO., LTD
Spec No.:JELF243A-0181-01
P13/13
Table: Equivalent series inductance to fit nominal inductance of other venders' products
Inductance
X (nH)
Equivalent series
Inductance
Part number
Measuring frequency
(MHz)
LQW2BAS2N7_0C
LQW2BAS2N8_0C
LQW2BAS3N0_0C
LQW2BAS5N6_0C
LQW2BAS6N0_0C
LQW2BAS6N8_0C
LQW2BAS7N5_0C
LQW2BAS8N2_0C
LQW2BAS10N_0C
LQW2BAS12N_0C
LQW2BAS15N_0C
LQW2BAS18N_0C
LQW2BAS22N_0C
LQW2BAS24N_0C
LQW2BAS27N_0C
LQW2BAS33N_0C
LQW2BAS36N_0C
LQW2BAS39N_0C
LQW2BAS43N_0C
LQW2BAS47N_0C
LQW2BAS56N_0C
LQW2BAS68N_0C
LQW2BAS82N_0C
LQW2BAS91N_0C
LQW2BASR10_0C
LQW2BASR11_0C
LQW2BASR12_0C
LQW2BASR15_0C
LQW2BASR18_0C
LQW2BASR22_0C
LQW2BASR24_0C
LQW2BASR27_0C
LQW2BASR33_0C
LQW2BASR39_0C
LQW2BASR47_0C
LQW2BASR50_0C
LQW2BASR56_0C
LQW2BASR68_0C
LQW2BASR82_0C
LQW2BAS1R0_0C
0.121
0.171
0.131
-0.009
0.031
0.301
-0.299
0.271
-0.229
0.371
0.051
-0.029
0.491
-0.389
0.931
0.481
0.531
0.771
-0.689
1.091
0.331
0.811
-0.839
-1.339
0.171
1.371
-1.629
-0.029
4.071
0.771
3.071
-1.429
4.071
0.971
-8.829
-2.529
-8.229
-2.229
-8.029
-6.329
250
250
250
250
250
250
250
250
250
250
250
250
250
250
250
250
250
250
200
200
200
200
150
150
150
150
150
100
100
100
100
100
100
100
50
50
25
25
25
25
MURATA MFG CO., LTD
相关型号:
©2020 ICPDF网 联系我们和版权申明