LQW18AN3N9B8Z# 概述
LQW18AN3N9B8Z# 数据手册
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PDF下载Spec No.: JELF243A_9133F-01
P1/13
CHIP COILS (CHIP INDUCTORS) LQW18AN□□□□8Z□
Murata Standard Standard Specification [AEC-Q200]
1. Scope
This reference specification applies to chip coils (chip inductors) LQW18AN_8Z series for automotive electronics based on
AEC-Q200 except for power trains and safeties.
2. Part Numbering
(Ex.)
LQ
W
18
A
N
2N2
C
8
Z
D
Product Structure Dimension Application Category Inductance Tolerance Performance
Category
Packaging
ID
(L × W)
and
characteristic
Z: Automotive D: taping
*B: bulk
*B: Bulk packing is also available (taping condition: however, products without reels are put in plastic bags).
3. Part Number and Rating
Operating temperature range
Storage temperature range
-55°C to +125°C
-55°C to +125°C
Inductance
DC
resistance
(Ω max.)
Self-resonant Rated
ESD
Rank
Customer
Murata
Q
(Min.)
Nominal
value
frequency
current
Part number
Part number
Tolerance
(MHz min.)
(mA)*1 6: 25 kV
(nH)
LQW18AN2N2C8ZD
LQW18AN2N4C8ZD
LQW18AN3N0C8ZD
LQW18AN3N9B8ZD
LQW18AN3N9C8ZD
LQW18AN3N9G8ZD
LQW18AN4N1B8ZD
LQW18AN4N1C8ZD
LQW18AN4N1G8ZD
LQW18AN4N2B8ZD
LQW18AN4N2C8ZD
LQW18AN4N2G8ZD
LQW18AN4N3B8ZD
LQW18AN4N3C8ZD
LQW18AN4N3G8ZD
LQW18AN4N7B8ZD
LQW18AN4N7C8ZD
LQW18AN4N7G8ZD
LQW18AN4N9B8ZD
LQW18AN4N9C8ZD
LQW18AN4N9G8ZD
LQW18AN5N6C8ZD
LQW18AN5N6G8ZD
LQW18AN6N0C8ZD
LQW18AN6N0G8ZD
LQW18AN6N2C8ZD
LQW18AN6N2G8ZD
LQW18AN6N5C8ZD
2.2
2.4
3.0
3.9
3.9
3.9
4.1
4.1
4.1
4.2
4.2
4.2
4.3
4.3
4.3
4.7
4.7
4.7
4.9
4.9
4.9
5.6
5.6
6
C: ±0.2 nH
C: ±0.2 nH
C: ±0.2 nH
B: ±0.1 nH
C: ±0.2 nH
G: ±2%
24
18
13
30
30
30
30
30
30
30
30
30
35
35
35
25
25
25
23
23
23
38
38
40
40
40
40
40
0.018
0.026
0.17
15000
15000
15000
10000
10000
10000
10000
10000
10000
10000
10000
10000
11600
11600
11600
10400
10400
10400
7300
3200
2400
670
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
0.028
0.028
0.028
0.028
0.028
0.028
0.028
0.028
0.028
0.036
0.036
0.036
0.054
0.054
0.054
0.081
0.081
0.081
0.040
0.040
0.040
0.040
0.040
0.040
0.040
2200
2200
2200
2200
2200
2200
2200
2200
2200
2100
2100
2100
1500
1500
1500
1200
1200
1200
1900
1900
1900
1900
1900
1900
1900
B: ±0.1 nH
C: ±0.2 nH
G: ±2%
B: ±0.1 nH
C: ±0.2 nH
G: ±2%
B: ±0.1 nH
C: ±0.2 nH
G: ±2%
B: ±0.1 nH
C: ±0.2 nH
G: ±2%
B: ±0.1 nH
C: ±0.2 nH
G: ±2%
7300
7300
C: ±0.2 nH
G: ±2%
6650
6650
C: ±0.2 nH
G: ±2%
6650
6
6650
6.2
6.2
6.5
C: ±0.2 nH
G: ±2%
6650
6650
C: ±0.2 nH
6650
MURATA MFG CO., LTD
Spec No.: JELF243A_9133F-01
Customer
P2/13
Inductance
Nominal
DC
resistance
(Ω max.)
Self-resonant Rated
ESD
Rank
(mA)*1 6: 25 kV
Murata
Q
(Min.)
frequency
current
Part number
Part number
value
(nH)
Tolerance
(MHz min.)
LQW18AN6N5G8ZD
LQW18AN6N8C8ZD
LQW18AN6N8G8ZD
LQW18AN7N2C8ZD
LQW18AN7N2G8ZD
LQW18AN7N5C8ZD
LQW18AN7N5G8ZD
LQW18AN8N2C8ZD
LQW18AN8N2G8ZD
LQW18AN8N4C8ZD
LQW18AN8N4G8ZD
LQW18AN8N7C8ZD
LQW18AN8N7G8ZD
LQW18AN9N1C8ZD
LQW18AN9N1G8ZD
LQW18AN9N5C8ZD
LQW18AN9N5G8ZD
LQW18AN9N9C8ZD
LQW18AN9N9G8ZD
LQW18AN10NG8ZD
LQW18AN10NJ8ZD
LQW18AN11NG8ZD
LQW18AN11NJ8ZD
LQW18AN12NG8ZD
LQW18AN12NJ8ZD
LQW18AN13NG8ZD
LQW18AN13NJ8ZD
LQW18AN15NG8ZD
LQW18AN15NJ8ZD
LQW18AN16NG8ZD
LQW18AN16NJ8ZD
LQW18AN17NG8ZD
LQW18AN17NJ8ZD
LQW18AN18NG8ZD
LQW18AN18NJ8ZD
LQW18AN19NG8ZD
LQW18AN19NJ8ZD
LQW18AN22NG8ZD
LQW18AN22NJ8ZD
LQW18AN23NG8ZD
LQW18AN23NJ8ZD
LQW18AN24NG8ZD
LQW18AN24NJ8ZD
LQW18AN25NG8ZD
LQW18AN25NJ8ZD
LQW18AN27NG8ZD
6.5
6.8
6.8
7.2
7.2
7.5
7.5
8.2
8.2
8.4
8.4
8.7
8.7
9.1
9.1
9.5
9.5
9.9
9.9
10
G: ±2%
C: ±0.2 nH
G: ±2%
C: ±0.2 nH
G: ±2%
C: ±0.2 nH
G: ±2%
C: ±0.2 nH
G: ±2%
C: ±0.2 nH
G: ±2%
C: ±0.2 nH
G: ±2%
C: ±0.2 nH
G: ±2%
C: ±0.2 nH
G: ±2%
C: ±0.2 nH
G: ±2%
G: ±2%
J: ±5%
40
40
40
38
38
35
35
38
38
38
38
38
38
38
38
38
38
38
38
38
38
40
40
37
37
37
37
38
38
40
40
40
40
40
40
40
40
40
40
40
40
40
40
40
40
40
0.040
0.040
0.040
0.040
0.040
0.048
0.048
0.052
0.052
0.052
0.052
0.052
0.052
0.052
0.052
0.052
0.052
0.052
0.052
0.052
0.052
0.052
0.052
0.064
0.064
0.064
0.064
0.075
0.075
0.075
0.075
0.075
0.075
0.075
0.075
0.075
0.075
0.086
0.086
0.086
0.086
0.086
0.086
0.098
0.098
0.098
6650
6650
6650
6650
6650
7000
7000
4750
4750
4750
4750
4750
4750
4750
4750
4750
4750
4750
4750
4750
4750
4750
4750
5000
5000
5000
5000
4600
4600
4600
4600
4600
4600
4600
4600
4600
4600
3450
3450
3450
3450
3450
3450
3600
3600
3600
1900
1900
1900
1900
1900
1500
1500
1600
1600
1600
1600
1600
1600
1600
1600
1600
1600
1600
1600
1600
1600
1600
1600
1500
1500
1500
1500
1400
1400
1400
1400
1400
1400
1400
1400
1400
1400
1300
1300
1300
1300
1300
1300
1200
1200
1200
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
10
11
G: ±2%
J: ±5%
11
12
G: ±2%
J: ±5%
12
13
G: ±2%
J: ±5%
13
15
G: ±2%
J: ±5%
15
16
G: ±2%
J: ±5%
16
17
G: ±2%
J: ±5%
17
18
G: ±2%
J: ±5%
18
19
G: ±2%
J: ±5%
19
22
G: ±2%
J: ±5%
22
23
G: ±2%
J: ±5%
23
24
G: ±2%
J: ±5%
24
25
G: ±2%
J: ±5%
25
27
G: ±2%
MURATA MFG CO., LTD
Spec No.: JELF243A_9133F-01
Customer
P3/13
Inductance
Nominal
DC
resistance
(Ω max.)
Self-resonant Rated
ESD
Rank
(mA)*1 6: 25 kV
Murata
Q
(Min.)
frequency
current
Part number
Part number
value
(nH)
Tolerance
(MHz min.)
LQW18AN27NJ8ZD
LQW18AN28NG8ZD
LQW18AN28NJ8ZD
LQW18AN30NG8ZD
LQW18AN30NJ8ZD
LQW18AN31NG8ZD
LQW18AN31NJ8ZD
LQW18AN33NG8ZD
LQW18AN33NJ8ZD
LQW18AN34NG8ZD
LQW18AN34NJ8ZD
LQW18AN36NG8ZD
LQW18AN36NJ8ZD
LQW18AN37NG8ZD
LQW18AN37NJ8ZD
LQW18AN39NG8ZD
LQW18AN39NJ8ZD
LQW18AN41NG8ZD
LQW18AN41NJ8ZD
LQW18AN43NG8ZD
LQW18AN43NJ8ZD
LQW18AN44NG8ZD
LQW18AN44NJ8ZD
LQW18AN47NG8ZD
LQW18AN47NJ8ZD
LQW18AN48NG8ZD
LQW18AN48NJ8ZD
LQW18AN51NG8ZD
LQW18AN51NJ8ZD
LQW18AN52NG8ZD
LQW18AN52NJ8ZD
LQW18AN56NG8ZD
LQW18AN56NJ8ZD
LQW18AN58NG8ZD
LQW18AN58NJ8ZD
LQW18AN68NG8ZD
LQW18AN68NJ8ZD
LQW18AN69NG8ZD
LQW18AN69NJ8ZD
LQW18AN72NG8ZD
LQW18AN72NJ8ZD
LQW18AN73NG8ZD
LQW18AN73NJ8ZD
LQW18AN75NG8ZD
LQW18AN75NJ8ZD
LQW18AN78NG8ZD
27
28
28
30
30
31
31
33
33
34
34
36
36
37
37
39
39
41
41
43
43
44
44
47
47
48
48
51
51
52
52
56
56
58
58
68
68
69
69
72
72
73
73
75
75
78
J: ±5%
G: ±2%
J: ±5%
G: ±2%
J: ±5%
G: ±2%
J: ±5%
G: ±2%
J: ±5%
G: ±2%
J: ±5%
G: ±2%
J: ±5%
G: ±2%
J: ±5%
G: ±2%
J: ±5%
G: ±2%
J: ±5%
G: ±2%
J: ±5%
G: ±2%
J: ±5%
G: ±2%
J: ±5%
G: ±2%
J: ±5%
G: ±2%
J: ±5%
G: ±2%
J: ±5%
G: ±2%
J: ±5%
G: ±2%
J: ±5%
G: ±2%
J: ±5%
G: ±2%
J: ±5%
G: ±2%
J: ±5%
G: ±2%
J: ±5%
G: ±2%
J: ±5%
G: ±2%
40
40
40
40
40
40
40
40
40
40
40
37
37
37
37
40
40
40
40
40
40
40
40
32
32
32
32
32
32
35
35
38
38
35
35
37
37
37
37
34
34
28
28
28
28
28
0.098
0.098
0.098
0.12
0.12
0.11
0.11
0.11
0.11
0.15
0.15
0.20
0.20
0.20
0.20
0.16
0.16
0.16
0.16
0.21
0.21
0.21
0.21
0.23
0.23
0.23
0.23
0.23
0.23
0.27
0.27
0.26
0.26
0.30
0.30
0.38
0.38
0.38
0.38
0.47
0.47
0.41
0.41
0.41
0.41
0.41
3600
3600
3600
2880
2880
3150
3150
3150
3150
3000
3000
3000
3000
3000
3000
3280
3280
3280
3280
2780
2780
2780
2780
2700
2700
2700
2700
2700
2700
2750
2750
2600
2600
2400
2400
2380
2380
2380
2380
2330
2330
2280
2280
2280
2280
2280
1200
1200
1200
1100
1100
1100
1100
1100
1100
1050
1050
910
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
910
910
910
1000
1000
1000
1000
840
840
840
840
830
830
830
830
830
830
750
750
770
770
700
700
630
630
630
630
560
560
590
590
590
590
590
MURATA MFG CO., LTD
Spec No.: JELF243A_9133F-01
Customer
P4/13
Inductance
Nominal
DC
resistance
(Ω max.)
Self-resonant Rated
ESD
Rank
(mA)*1 6: 25 kV
Murata
Q
(Min.)
frequency
current
Part number
Part number
value
(nH)
Tolerance
(MHz min.)
LQW18AN78NJ8ZD
LQW18AN82NG8ZD
LQW18AN82NJ8ZD
LQW18AN83NG8ZD
LQW18AN83NJ8ZD
LQW18AN91NG8ZD
LQW18AN91NJ8ZD
LQW18AN94NG8ZD
LQW18AN94NJ8ZD
LQW18ANR10G8ZD
LQW18ANR10J8ZD
LQW18ANR11G8ZD
LQW18ANR11J8ZD
LQW18ANR12G8ZD
LQW18ANR12J8ZD
LQW18ANR15G8ZD
LQW18ANR15J8ZD
LQW18ANR18G8ZD
LQW18ANR18J8ZD
LQW18ANR20G8ZD
LQW18ANR20J8ZD
LQW18ANR21G8ZD
LQW18ANR21J8ZD
LQW18ANR22G8ZD
LQW18ANR22J8ZD
LQW18ANR25G8ZD
LQW18ANR25J8ZD
LQW18ANR27G8ZD
LQW18ANR27J8ZD
LQW18ANR30G8ZD
LQW18ANR30J8ZD
LQW18ANR33G8ZD
LQW18ANR33J8ZD
LQW18ANR36G8ZD
LQW18ANR36J8ZD
LQW18ANR39G8ZD
LQW18ANR39J8ZD
78
J: ±5%
G: ±2%
J: ±5%
G: ±2%
J: ±5%
G: ±2%
J: ±5%
G: ±2%
J: ±5%
G: ±2%
J: ±5%
G: ±2%
J: ±5%
G: ±2%
J: ±5%
G: ±2%
J: ±5%
G: ±2%
J: ±5%
G: ±2%
J: ±5%
G: ±2%
J: ±5%
G: ±2%
J: ±5%
G: ±2%
J: ±5%
G: ±2%
J: ±5%
G: ±2%
J: ±5%
G: ±2%
J: ±5%
G: ±2%
J: ±5%
G: ±2%
J: ±5%
28
34
34
34
34
33
33
34
34
34
34
32
32
32
32
28
28
25
25
25
25
27
27
25
25
24
24
24
24
25
25
25
25
25
25
25
25
0.41
0.5
2280
2230
2230
2230
2230
1900
1900
1750
1750
1750
1750
1730
1730
1650
1650
1580
1580
1380
1380
1350
1350
1330
1330
1330
1330
1330
1330
1250
1250
1200
1200
1100
1100
1050
1050
1100
1100
590
550
550
550
550
520
520
490
490
490
490
450
450
450
450
420
420
310
310
290
290
280
280
280
280
250
250
260
260
220
220
190
190
190
190
190
190
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
82
82
0.5
83
0.5
83
0.5
91
0.54
0.54
0.63
0.63
0.63
0.63
0.7
91
94
94
100
100
110
110
120
120
150
150
180
180
200
200
210
210
220
220
250
250
270
270
300
300
330
330
360
360
390
390
0.7
0.72
0.72
0.87
0.87
1.65
1.65
1.74
1.74
1.98
1.98
2.08
2.08
2.28
2.28
2.42
2.42
3.12
3.12
3.84
3.84
3.98
3.98
4.23
4.23
*1 As shown in the diagram below, derating is applied to the rated current based on the operating temperature.
MURATA MFG CO., LTD
Spec No.: JELF243A_9133F-01
P5/13
4. Testing Conditions
Unless otherwise specified
Temperature: ordinary temperature (15°C to 35°C)
Humidity: ordinary humidity [25% to 85% (RH)]
In case of doubt
Temperature: 20°C±2°C
Humidity: 60% to 70% (RH)
Atmospheric pressure: 86 kPa to 106 kPa
5. Appearance and Dimensions
Unit mass (typical value): 0.0034 g
6. Marking
No marking.
MURATA MFG CO., LTD
Spec No.: JELF243A_9133F-01
P6/13
7. Electrical Performance
No.
Item
Specification
Meet chapter 3 ratings.
Test method
7.1 Inductance
Measuring equipment: Keysight E4991A or the
equivalent
Measuring frequency:
Inductance
Q
100 MHz
250 MHz 2.2 nH to 44 nH
200 MHz 47 nH to 69 nH
150 MHz 72 nH to 150 nH
100 MHz 180 nH to 390 nH
Measuring conditions:
Measurement signal level: Approx. 0 dBm
Measurement terminal distance: 1.0 mm
Electrical length: 10.0 mm
Measuring fixture: Keysight 16197A
Position the chip coil under test as shown in the
measuring example below and connect it to the
electrode by applying weight.
Measurement example:
7.2
Q
Meet chapter 3 ratings.
Measuring method: see "Electrical performance:
Measuring method for inductance/Q" in the chapter
"15. Appendix".
7.3 DC resistance
Meet chapter 3 ratings.
Meet chapter 3 ratings.
Measuring equipment: digital multimeter
7.4 Self-resonant
frequency
Measuring equipment: Keysight N5230A or the
equivalent
7.5 Rated current
Product temperature rise: 40°C max.
Apply the rated current specified in chapter 3.
8. AEC-Q200 Requirement
8.1 Performance [based on table 5 for magnetics (inductors/transformer) AEC-Q200 Rev. D issued June 1,
2010]
AEC-Q200
Murata specification/deviation
No.
3
Stress
Test method
1000 h at 125°C
Set for 24 h at room condition, then
measured.
High
Meet table A after testing.
Table A
temperature
exposure
Appearance
No damage
Inductance change rate (at 100 MHz) Within ±5%
4
Temperature
cycling
1000 cycles
-40°C to +125°C
Meet table A after testing.
Set for 24 h at room condition, then
measured.
7
8
Biased humidity 1000 h at 85°C, 85% (RH). Unpowered. Meet table A after testing.
Set for 24 h at room condition, then
measured.
Operational life Apply rated current 125°C 1000 h
Set for 24 h at room condition, then
measured.
Meet table A after testing.
MURATA MFG CO., LTD
Spec No.: JELF243A_9133F-01
P7/13
AEC-Q200
Test method
External visual Visual inspection
Murata specification/deviation
No abnormalities
No.
9
Stress
10 Physical
dimension
Meet chapter 5, "Appearance and
Dimensions".
No defects
12 Resistance to
solvents
Per MIL-STD-202
Method 215
Not applicable
13 Mechanical
shock
Per MIL-STD-202
Method 213
Meet table A after testing.
Condition C:
100 g’s (0.98 N), 6 ms, half sine, 12.3 ft/s
14 Vibration
5 g's (0.049 N) for 20 min, 12 cycles each Meet table A after testing.
of 3 orientations
Test from 10 Hz to 2000 Hz
15 Resistance to
No-heating
Pre-heating: 150°C±10°C, 60 s to 90 s
soldering heat Solder temperature
260°C±5°C
Meet table A after testing.
Immersion time 10 s
17 ESD
Per AEC-Q200-002
Per J-STD-002
ESD rank: Refer to chapter 3 ratings.
Meet table A after testing.
18 Solderbility
Method b: not applicable
95% of the terminations is to be soldered (except exposed
wire).
19 Electrical
Measured: inductance
Per UL-94
No defects
characterization
20 Flammability
21 Board flex
Not applicable
Epoxy-PCB (1.6 mm)
Deflection 2 mm (min.)
Holding time 60 s
Meet table B after testing.
Table B
Appearance
No damage
Within ±10%
DC resistance change rate
22 Terminal
Strength
Per AEC-Q200-006
A force of 17.7 N for 60 s
Murata deviation request: 10 N for 5 s
No defect
9. Specification of Packaging
9.1 Appearance and dimensions of tape (8 mm width/paper tape)
A
B
t
1.15±0.05
1.9±0.05
1.1 max.
(in mm)
9.2 Taping specifications
Packing quantity
4000 pcs/reel
(Standard quantity)
Packing method
The products are placed in embossed cavities of a base tape and sealed by a top tape and a bottom
tape.
Feed hole position
Joint
The feed holes on the base tape are on the right side when the top tape is pulled toward the user.
The base tape and the top tape are seamless.
Number of missing
products
Number of missing products within 0.025% of the number per reel or 1 pc., whichever is greater, and
are not continuous. The specified quantity per reel is kept.
MURATA MFG CO., LTD
Spec No.: JELF243A_9133F-01
P8/13
9.3 Break down force of tape
Break down force of top tape
5 N min.
5 N min.
Break down force of bottom tape
9.4 Peeling off force of top tape
Speed of peeling off
300 mm/min
Peeling off force
0.1 N to 0.6 N (The lower limit is for typical value.)
Top tape
F
165 to 180 degree
Bottom tape
Base tape
9.5 Dimensions of leader section, trailer section and reel
A vacant section is provided in the leader (start) section and trailer (end) section of the tape for the product. The leader
section is further provided with an area consisting only of the cover tape (or top tape). (See the diagram below.)
9.6 Marking for reel
Customer part number, Murata part number, inspection number (*1), RoHS marking (*2), quantity, etc.
*1 Expression of inspection No.: (1) Factory code
□□
(1)
○○○○
(2)
(2) Date
First digit: year/last digit of year
(3)
Second digit: month/Jan. to Sep.→1 to 9, Oct. to Dec.→O, N, D
Third, Fourth digit: day
(3) Serial No.
*2 Expression of RoHS marking: (1) RoHS regulation conformity
ROHS-
Y
()
(2) Murata classification number
(1)
(2)
9.7 Marking on outer box (corrugated box)
Customer name, purchasing order number, customer part number, Murata part number, RoHS marking (*2), quantity, etc.
9.8 Specification of outer box
Dimensions of outer box
Standard reel quantity
(mm)
Label
in outer box (reel)
W
D
H
H
186
186
93
5
D
* Above outer box size is typical. It depends on a
quantity of an order.
W
MURATA MFG CO., LTD
Spec No.: JELF243A_9133F-01
P9/13
10.
Caution
10.1 Restricted applications
Please contact us before using our products for the applications listed below which require especially high reliability for the
prevention of defects which might directly cause damage to the third party's life, body or property.
(1) Aircraft equipment
(6) Disaster/crime prevention equipment
(7) Traffic signal equipment
(2) Aerospace equipment
(3) Undersea equipment
(4) Power plant control equipment
(5) Medical equipment
(8) Transportation equipment (trains, ships, etc.)
(9) Data-processing equipment
(10) Applications of similar complexity and/or reliability requirements
to the applications listed in the above
10.2 Precautions on rating
Do not use the products in excess of their rated current. Doing so may cause the product to generate heat, resulting in short
circuit between wires, wire breakage, or melted solder, which may cause dropping of parts.
10.3 Fail-safe
Be sure to provide an appropriate fail-safe function on your product to prevent a second damage that may be caused by the
abnormal function or the failure of our product.
10.4 Corrosive gas
Please refrain from use since contact with environments with corrosive gases (sulfur gas [hydrogen sulfide, sulfur dioxide,
etc.], chlorine, ammonia, etc.) or oils (cutting oil, silicone oil, etc.) that have come into contact with the previously stated
corrosive gas environment will result in deterioration of product quality or an open from deterioration due to corrosion of
product electrode, etc. We will not bear any responsibility for use under these environments.
11. Precautions for Use
This product is for use only with reflow soldering. It is designed to be mounted by soldering. If you want to use other
mounting method, for example, using a conductive adhesive, please consult us beforehand.
Also, if repeatedly subjected to temperature cycles or other thermal stress, due to the difference in the coefficient of thermal
expansion with the mounting substrate, the solder (solder fillet part) in the mounting part may crack.
The occurrence of cracks due to thermal stress is affected by the size of the land where mounted, the solder volume, and
the heat dissipation of the mounting substrate. Carefully design it when a large change in ambient temperature is assumed.
11.1 Land dimensions
The following diagram shows the recommended land dimensions for reflow soldering.
The land dimensions are designed in consideration of electrical characteristics and mountability. Use of other land
dimensions may preclude achievement of performance. In some cases, it may result in poor solderability, including positional
shift. If you use other land pattern, consider it adequately.
a
b
c
0.86
2.00
1.15
(in mm)
11.2 Flux and solder used
Flux
• Use a rosin-based flux that includes an activator with a chlorine conversion value of 0.06(wt)% to 0.1(wt)%.
• Do not use a highly acidic flux with a halide content exceeding 0.2(wt)% (chlorine conversion value).
• Do not use a water-soluble flux.
Solder
• Use Sn-3.0Ag-0.5Cu solder.
• Standard thickness of solder paste: 100 μm to 150 μm
If you want to use a flux other than the above, please consult our technical department.
MURATA MFG CO., LTD
Spec No.: JELF243A_9133F-01
P10/13
11.3 Soldering conditions (reflow)
• Pre-heating should be in such a way that the temperature difference between solder and product surface is limited to
150°C max.
Cooling into solvent after soldering also should be in such a way that the temperature difference is limited to 100°C max.
Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of product quality.
• Standard soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and/or resulting in the deterioration of product
quality.
Temp.
(℃)
260℃
230℃
Limit Profile
245℃±3℃
220℃
180
150
Standard Profile
30s~60s
60s max.
90s±30s
Time.(s)
Standard profile
Limit profile
Pre-heating
150°C to 180°C/90 s±30 s
Above 220°C/30 s to 60 s
245°C±3°C
150°C to 180°C/90 s±30 s
Above 230°C/60 s max.
260°C/10 s
Heating
Peak temperature
Number of reflow cycles
2 times
2 times
11.4 Reworking with soldering iron
The following requirements must be met to rework a soldered product using a soldering iron.
Item
Requirement
150°C/approx. 1 min
350°C max.
Pre-heating
Tip temperature of soldering iron
Power consumption of soldering iron
Tip diameter of soldering iron
Soldering time
80 W max.
ø3 mm max.
3 s (+1 s, -0 s)
2 times max.
Number of reworking operations
* Avoid a direct contact of the tip of the soldering iron with the product. Such a
direction contact may cause cracks in the ceramic body due to thermal shock.
11.5 Solder volume
Solder shall be used not to increase the volume too much.
An increased solder volume increases mechanical stress on the product. Exceeding solder volume may cause the failure of
mechanical or electrical performance.
MURATA MFG CO., LTD
Spec No.: JELF243A_9133F-01
P11/13
11.6 Product's location
The following shall be considered when designing and laying out PCBs.
(1) PCB shall be designed so that products are not subject to mechanical stress due to warping the board.
[Products direction]
Products shall be located in the sideways direction (length: a < b) to the mechanical stress.
a
b
Poor example
〈
〉
Good example
〈
〉
(2) Components location on PCB separation
It is effective to implement the following measures, to reduce stress in separating the board.
It is best to implement all of the following three measures; however, implement as many measures as possible to reduce
stress.
Contents of measures
Stress level
A > D*1
A > B
(1) Turn the mounting direction of the component parallel to the
board separation surface.
(2) Add slits in the board separation part.
(3) Keep the mounting position of the component away from the
board separation surface.
A > C
*1 A > D is valid when stress is added vertically to the perforation as with hand separation.
If a cutting disc is used, stress will be diagonal to the PCB, therefore A > D is invalid.
(3) Mounting components near screw holes
When a component is mounted near a screw hole, it may be affected by the board deflection that occurs during the
tightening of the screw.
Mount the component in a position as far away from the screw holes as possible.
11.7 Handling of substrate
After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the substrate
when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to the substrate.
Excessive mechanical stress may cause cracking in the product.
Bending
Twisting
MURATA MFG CO., LTD
Spec No.: JELF243A_9133F-01
P12/13
11.8 Cleaning
The product shall be cleaned under the following conditions.
(1) The cleaning temperature shall be 60°C max. If isopropyl alcohol (IPA) is used, the cleaning temperature shall be 40°C
max.
(2) Perform ultrasonic cleaning under the following conditions. Exercise caution to prevent resonance phenomenon in
mounted products and the PCB.
Item
Power
Requirement
20 W/L max.
Time
5 min max.
Frequency
(3) Cleaner
28 kHz to 40 kHz
Alcohol-based cleaner: IPA
Aqueous agent: PINE ALPHA ST-100S
(4) There shall be no residual flux or residual cleaner. When using aqueous agent, rinse the product with deionized water
adequately and completely dry it so that no cleaner is left.
* For other cleaning, consult our technical department.
11.9 Storage and transportation
Storage period
Use the product within 12 months after delivery.
If you do not use the product for more than 12 months, check solderability before using it.
Storage conditions • The products shall be stored in a room not subject to rapid changes in temperature and humidity.
The recommended temperature range is -10°C to +40°C. The recommended relative humidity
range is 15% to 85%.
Keeping the product in corrosive gases, such as sulfur, chlorine gas or acid, oxidizes the
electrode, resulting in poor solderability or corrosion of the coil wire of the product.
• Do not keep products in bulk packaging. Doing so may cause collision between the products or
between the products and other products, resulting in core chipping or wire breakage.
• Do not place the products directly on the floor; they should be placed on a palette so that they are
not affected by humidity or dust.
• Avoid keeping the products in a place exposed to direct sunlight, heat or vibration.
Transportation
Excessive vibration and impact reduces the reliability of the products. Exercise caution when
handling the products.
11.10 Resin coating
The inductance value may change due to high cure-stress of resin to be used for coating/molding products.
A wire breakage issue may occur by mechanical stress caused by the resin, amount/cured shape of resin, or operating
condition etc. Some resin contains some impurities or chloride possible to generate chlorine by hydrolysis under some
operating condition may cause corrosion of wire of coil, leading to wire breakage.
So, please pay your careful attention when you select resin in case of coating/molding the products with the resin.
Prior to use the coating resin, please make sure no reliability issue is observed by evaluating products mounted on your
board.
11.11 Handling of product
• Sharp material such as a pair of tweezers or other material such as bristles of cleaning brush, shall not be touched to the
winding portion to prevent the breaking of wire.
• Mechanical shock should not be applied to the products mounted on the board to prevent the breaking of the core.
11.12 Handling with mounting equipment
• With some types of mounting equipment, a support pin pushes up the product from the bottom of the base (paper) tape
when the product is sucked with the pick-up nozzle.
When using this type of equipment, detach the support pin to prevent the breaking of wire on the product.
• In some cases, the laser recognition function of the mounting equipment may not recognize this product correctly.
Please contact us when using laser recognition. (There is no problem with the permeation and reflection type.)
12.
Note
(1) Please make sure that your product has been evaluated in view of your specifications with our product being mounted to
your product.
(2) You are requested not to use our product deviating from the reference specifications.
(3) The contents of this reference specification are subject to change without advance notice. Please approve our product
specifications or transact the approval sheet for product specifications before ordering.
MURATA MFG CO., LTD
Spec No.: JELF243A_9133F-01
P13/13
13. Appendix
Electrical performance: Measuring method for inductance/Q (Q measurement is applicable only when the Q value is
included in the rating table.)
Perform measurement using the method described below. (Perform correction for the error deriving from the measuring
terminal.)
(1) Residual elements and stray elements of the measuring terminal can be expressed by the F parameter for the 2-pole
terminal as shown in the figure below.
(2) The product's impedance value (Zx) and measured impedance value (Zm) can be expressed as shown below, by using
the respective current and voltage for input/output.
V1
I1
V2
I2
Zm=
Zx=
(3) Thus, the relationship between the product's impedance value (Zx) and measured impedance value (Zm) is as follows.
Here,
α = D/A = 1
β = B/D = Zsm - (1 - Yom Zsm) Zss
Zm-β
Γ = C/A = Yom
Zx=α
1-ZmΓ
Zsm: measured impedance of short chip
Zss: residual impedance of short chip (0.771 nH)
Yom: measured admittance when measuring terminal is open
(4) Calculate inductance Lx and Qx using the equations shown below.
Im (Zx)
Lx: inductance of chip coil
Qx: Q of chip coil
Lx=
2πf
Im (Zx)
Re (Zx)
Qx=
f: measuring frequency
MURATA MFG CO., LTD
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