LQW04AN2N0D00D [MURATA]
FIXED IND 2NH 1.1A 30 MOHM;
| 型号： | LQW04AN2N0D00D |
| 厂家： | 
muRata |
| 描述： | FIXED IND 2NH 1.1A 30 MOHM 测试 射频感应器 电感器 |
| 文件： | 总12页 (文件大小：293K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
SpecNo.JELF243A-0090H-01
P.1/12
Reference Only
CHIP COIL (CHIP INDUCTORS) LQW04AN□□□□00D REFERENCE SPECIFICATION
1. Scope
This reference specification applies to LQW04AN series, Chip coil (Chip Inductors).
2. Part Numbering
(ex)
LQ
W
04
A
N
1N1
D
0
0
D
Product ID Structure Dimension Applications Category Inductance Tolerance Features Electrode Packaging
(L×W)
and
D:Taping
Characteristics
∗B:Bulk
∗Bulk packing also available. (A product is put in the plastic bag under the taping conditions.)
3. Rating
・Operating Temperature Range
・Storage Temperature Range.
–55°C to +125°C
–55°C to +125°C
DC
Resistance
(Ω max.)
Self Resonant
Frequency
(MHz min.)
Rated
Current
(mA)
Inductance
Customer
Part Number
MURATA
Part Number
Q
(min.)
(nH)
Tolerance
LQW04AN0N8C00D
LQW04AN0N8D00D
LQW04AN1N1C00D
LQW04AN1N1D00D
LQW04AN1N3C00D
LQW04AN1N3D00D
LQW04AN1N4C00D
LQW04AN1N4D00D
LQW04AN1N5C00D
LQW04AN1N5D00D
LQW04AN1N6C00D
LQW04AN1N6D00D
LQW04AN1N7C00D
LQW04AN1N7D00D
LQW04AN1N8C00D
LQW04AN1N8D00D
LQW04AN1N9C00D
LQW04AN1N9D00D
LQW04AN2N0C00D
LQW04AN2N0D00D
LQW04AN2N1C00D
LQW04AN2N1D00D
LQW04AN2N2C00D
LQW04AN2N2D00D
LQW04AN2N3C00D
LQW04AN2N3D00D
LQW04AN2N4C00D
LQW04AN2N4D00D
LQW04AN2N5C00D
LQW04AN2N5D00D
LQW04AN2N6C00D
LQW04AN2N6D00D
LQW04AN2N7C00D
LQW04AN2N7D00D
LQW04AN2N8C00D
LQW04AN2N8D00D
LQW04AN2N9C00D
LQW04AN2N9D00D
LQW04AN3N0C00D
LQW04AN3N0D00D
LQW04AN3N1C00D
LQW04AN3N1D00D
0.8
23
15
18
15
0.02
0.03
0.05
0.06
1800
990
1.1
1.3
1.4
1.5
1.6
1.7
1.8
1.9
2.0
2.1
2.2
2.3
2.4
2.5
2.6
2.7
2.8
2.9
3.0
3.1
20.0
1500
1200
940
17.0
700
490
10
21
14
21
18
15
10
0.12
0.03
0.04
0.07
0.12
15.0
20.0
C:±0.2nH
D:±0.5nH
1100
12.0
20.0
15.0
10.0
780
570
490
620
570
620
490
620
490
15
0.07
15
10
15
10
0.12
0.07
0.12
13.0
10.0
MURATA MFG.CO., LTD
SpecNo.JELF243A-0090H-01
P.2/12
Rated
Current
(mA)
Reference Only
Q
DC
Resistance
(Ω max.)
Self Resonant
Frequency
Inductance
Tolerance
Customer
Part Number
MURATA
Part Number
(min.)
(nH)
3.2
(MHz min.)
LQW04AN3N2C00D
LQW04AN3N2D00D
LQW04AN3N3C00D
LQW04AN3N3D00D
LQW04AN3N4C00D
LQW04AN3N4D00D
LQW04AN3N6C00D
LQW04AN3N6D00D
LQW04AN3N7C00D
LQW04AN3N7D00D
LQW04AN3N8C00D
LQW04AN3N8D00D
LQW04AN3N9C00D
LQW04AN3N9D00D
LQW04AN4N0C00D
LQW04AN4N0D00D
LQW04AN4N1C00D
LQW04AN4N1D00D
LQW04AN4N2C00D
LQW04AN4N2D00D
LQW04AN4N3C00D
LQW04AN4N3D00D
LQW04AN4N4C00D
LQW04AN4N4D00D
LQW04AN4N5C00D
LQW04AN4N5D00D
LQW04AN4N6C00D
LQW04AN4N6D00D
LQW04AN4N7C00D
LQW04AN4N7D00D
LQW04AN4N8C00D
LQW04AN4N8D00D
LQW04AN4N9C00D
LQW04AN4N9D00D
LQW04AN5N0C00D
LQW04AN5N0D00D
LQW04AN5N1C00D
LQW04AN5N1D00D
LQW04AN5N2C00D
LQW04AN5N2D00D
LQW04AN5N3C00D
LQW04AN5N3D00D
LQW04AN5N4C00D
LQW04AN5N4D00D
LQW04AN5N5C00D
LQW04AN5N5D00D
LQW04AN5N6C00D
LQW04AN5N6D00D
LQW04AN5N7C00D
LQW04AN5N7D00D
LQW04AN5N8C00D
LQW04AN5N8D00D
LQW04AN5N9C00D
LQW04AN5N9D00D
LQW04AN6N0C00D
LQW04AN6N0D00D
0.17
0.14
0.27
0.10
0.14
9.0
10.0
8.0
400
440
310
530
440
3.3
3.4
3.6
3.7
3.8
3.9
4.0
4.1
4.2
4.3
4.4
4.5
4.6
4.7
4.8
4.9
5.0
5.1
5.2
5.3
5.4
5.5
5.6
5.7
5.8
5.9
6.0
10
15
20
13.0
10.0
11.0
12.0
15
0.10
530
11.0
20
15
0.14
10.0
440
C:±0.2nH
D:±0.5nH
0.23
0.12
0.19
9.0
350
470
390
10.0
20
0.12
0.19
470
390
9.0
MURATA MFG.CO., LTD
SpecNo.JELF243A-0090H-01
P.3/12
Rated
Current
(mA)
Reference Only
Q
DC
Resistance
(Ω max.)
Self Resonant
Frequency
Inductance
Tolerance
Customer
Part Number
MURATA
Part Number
(min.)
(nH)
6.1
(MHz min.)
LQW04AN6N1C00D
LQW04AN6N1D00D
LQW04AN6N2C00D
LQW04AN6N2D00D
LQW04AN6N3C00D
LQW04AN6N3D00D
LQW04AN6N4C00D
LQW04AN6N4D00D
LQW04AN6N5C00D
LQW04AN6N5D00D
LQW04AN6N6C00D
LQW04AN6N6D00D
LQW04AN6N7C00D
LQW04AN6N7D00D
LQW04AN6N8C00D
LQW04AN6N8D00D
LQW04AN6N9C00D
LQW04AN6N9D00D
LQW04AN7N0C00D
LQW04AN7N0D00D
LQW04AN7N1C00D
LQW04AN7N1D00D
LQW04AN7N2C00D
LQW04AN7N2D00D
LQW04AN7N3C00D
LQW04AN7N3D00D
LQW04AN7N4C00D
LQW04AN7N4D00D
LQW04AN7N5C00D
LQW04AN7N5D00D
LQW04AN7N6C00D
LQW04AN7N6D00D
LQW04AN7N7C00D
LQW04AN7N7D00D
LQW04AN7N8C00D
LQW04AN7N8D00D
LQW04AN7N9C00D
LQW04AN7N9D00D
LQW04AN8N0C00D
LQW04AN8N0D00D
LQW04AN8N1C00D
LQW04AN8N1D00D
LQW04AN8N2C00D
LQW04AN8N2D00D
LQW04AN8N3C00D
LQW04AN8N3D00D
LQW04AN8N4C00D
LQW04AN8N4D00D
LQW04AN8N5C00D
LQW04AN8N5D00D
LQW04AN8N6C00D
LQW04AN8N6D00D
LQW04AN8N7C00D
LQW04AN8N7D00D
LQW04AN8N8C00D
LQW04AN8N8D00D
6.2
6.3
6.4
6.5
6.6
6.7
6.8
6.9
7.0
7.1
7.2
7.3
7.4
7.5
7.6
7.7
7.8
7.9
8.0
8.1
8.2
8.3
8.4
8.5
8.6
8.7
8.8
0.19
390
9.0
0.14
440
20
C:±0.2nH
D:±0.5nH
8.0
0.23
350
15
0.33
7.0
290
MURATA MFG.CO., LTD
SpecNo.JELF243A-0090H-01
P.4/12
Rated
Current
(mA)
Reference Only
Q
DC
Resistance
(Ω max.)
Self Resonant
Frequency
Inductance
Tolerance
Customer
Part Number
MURATA
Part Number
(min.)
(nH)
8.9
(MHz min.)
LQW04AN8N9C00D
LQW04AN8N9D00D
LQW04AN9N0C00D
LQW04AN9N0D00D
LQW04AN9N1C00D
LQW04AN9N1D00D
LQW04AN9N2C00D
LQW04AN9N2D00D
LQW04AN9N3C00D
LQW04AN9N3D00D
LQW04AN9N4C00D
LQW04AN9N4D00D
LQW04AN9N5C00D
LQW04AN9N5D00D
LQW04AN9N6C00D
LQW04AN9N6D00D
LQW04AN9N7C00D
LQW04AN9N7D00D
LQW04AN9N8C00D
LQW04AN9N8D00D
LQW04AN9N9C00D
LQW04AN9N9D00D
LQW04AN10NH00D
LQW04AN10NJ00D
LQW04AN11NH00D
LQW04AN11NJ00D
LQW04AN12NH00D
LQW04AN12NJ00D
LQW04AN13NH00D
LQW04AN13NJ00D
LQW04AN14NH00D
LQW04AN14NJ00D
LQW04AN15NH00D
LQW04AN15NJ00D
LQW04AN16NH00D
LQW04AN16NJ00D
LQW04AN18NH00D
LQW04AN18NJ00D
LQW04AN19NH00D
LQW04AN19NJ00D
LQW04AN20NH00D
LQW04AN20NJ00D
LQW04AN22NH00D
LQW04AN22NJ00D
LQW04AN23NH00D
LQW04AN23NJ00D
LQW04AN24NH00D
LQW04AN24NJ00D
LQW04AN25NH00D
LQW04AN25NJ00D
LQW04AN27NH00D
LQW04AN27NJ00D
LQW04AN33NH00D
LQW04AN33NJ00D
0.26
0.16
330
400
9.0
9.1
9.2
9.3
9.4
9.5
9.6
9.7
9.8
9.9
10
11
12
13
14
15
16
18
19
20
22
23
24
25
27
33
C:±0.2nH
D:±0.5nH
20
0.26
330
7.0
0.26
330
0.28
0.34
310
280
6.0
0.48
0.38
0.54
0.73
0.56
0.63
5.5
5.5
240
270
220
160
210
200
H:±3%
J:±5%
15
5.0
0.95
1.11
160
140
4.0
MURATA MFG.CO., LTD
SpecNo.JELF243A-0090H-01
P.5/12
Reference Only
4. Testing Conditions
《Unless otherwise specified》
Temperature : Ordinary Temperature / 15°C to 35°C
Humidity : Ordinary Humidity / 25%(RH) to 85%(RH)
《In case of doubt》
Temperature
Humidity
: 20°C±2°C
: 60%(RH) to 70%(RH)
Atmospheric Pressure : 86kPa to 106 kPa
5. Appearance and Dimensions
■Unit Mass (Typical value)
0.0003g
(in mm)
6. Electrical Performance
No. Item
6.1 Inductance
Specification
Test Method
Inductance shall meet item 3.
Measuring Equipment：KEYSIGHT E4991A or equivalent
Measuring Frequency：<Inductance> 100MHz
<Q>
250MHz
Measuring Condition：Test signal level / about 0dBm
Electrical length/ 10mm
Measuring Fixture：KEYSIGHT 16197A
Position coil under test as shown in below and contact coil
with each terminal by adding weight.
6.2
Q
Q shall meet item 3.
0.3mm
Measuring Method：See the endnote.
<Electrical Performance：Measuring
Method of Inductance/Q>
6.3 DC Resistance
DC Resistance shall meet item 3.
S.R.F shall meet item 3.
Measuring Equipment：Digital multi meter
6.4 Self Resonant
Frequency(S.R.F)
Measuring Equipment：KEYSIGHT 8720C or equivalent
6.5 Rated Current
Self temperature rise shall be
limited to 20°C max.
The rated current is applied.
MURATA MFG.CO., LTD
SpecNo.JELF243A-0090H-01
P.6/12
Reference Only
7. Mechanical Performance
No.
7.1
Item
Specification
Test Method
Bending Test
Chip coil shall not be damaged
after tested as test method.
Substrate：Glass-epoxy substrate
(100mm×40mm×0.8mm)
Speed of Applying Force：1mm / s
Deflection：2mm
Hold Duration：5s
Pressure jig
F
R230
Deflection
(in mm)
45
45
Product
Vibration
7.2
7.3
Oscillation Frequency：10Hz~55Hz~10Hz for 1 min
Total Amplitude：1.5mm
Testing Time：A period of 2 hours in each of
3 mutually perpendicular directions.
(Total 6hours)
Solderability
The wetting area of the electrode
shall be at least 90% covered with
new solder coating.
Flux：Ethanol solution of rosin,25(wt)% Includes
activator equivalent to 0.06(wt)%
chlorine.(immersed for 5s to 10s)
Solder：Sn-3.0Ag-0.5Cu
Pre-Heating：150°C±10°C / 60s to 90s
Solder Temperature：240°C±5°C
Immersion Time：4s±1s
7.4
Resistance to
Soldering Heat
Appearance：No damage
Inductance Change：within ±5%
Flux：Ethanol solution of rosin,25(wt)% Includes
activator equivalent to 0.06(wt)%
Chlorine.(immersed for 5s to 10s)
Solder：Sn-3.0Ag-0.5Cu
Pre-Heating：150°C±10°C / 60s to 90s
Solder Temperature：270°C±5°C
Immersion Time：5s±1s
Then measured after exposure in the room condition
for 24h±2h.
MURATA MFG.CO., LTD
SpecNo.JELF243A-0090H-01
P.7/12
Reference Only
8. Environmental Performance
It shall be soldered on the substrate.
No.
8.1
Item
Heat Resistance
Specification
Appearance：No damage
Inductance Change：within ±5%
Q Change：within ±20%
Test Method
Temperature：125°C±2°C
Time：1000h (+48h,0h)
Then measured after exposure in the room condition
for 24h±2h.
Temperature：-55°C±2°C
Time：1000h (+48h,-0h)
Then measured after exposure in the room condition
for 24±2 h.
8.2 Cold Resistance
8.3 Humidity
Temperature：70°C±2°C
Humidity：90%(RH) to 95%(RH)
Time：1000h (+48h,-0h)
Then measured after exposure in the room condition
for 24h±2h.
Temperature
Cycle
1 cycle：
8.4
1 step：-55°C±2°C / 30min±3 min
2 step：Ordinary temp. / 10min to 15 min
3 step：+125°C±2°C / 30min±3 min
4 step：Ordinary temp. / 10min to15 min
Total of 10 cycles
Then measured after exposure in the room condition
for 24h±2h.
9. Specification of Packaging
9.1 Appearance and Dimensions of paper tape (8mm-wide)
0.1
0
2.0±0.05
φ1.5±
1.75±0.1
4.0±0.1
(in mm)
2.0±0.05
0.49(Typ.)
0.75 max.
Direction of feed
9.2 Specification of Taping
(1) Packing quantity (standard quantity)
10,000 pcs. / reel
(2) Packing Method
Products shall be packed in the cavity of the base tape and sealed by Cover tape.
(3) Sprocket hole
The sprocket holes are to the right as the tape is pulled toward the user.
(4) Spliced point
Base tape and Cover tape has no spliced point.
(5) Missing components number
Missing components number within 0.1% of the number per reel or 1 pc., whichever is greater, and are not
continuous. The Specified quantity per reel is kept.
9.3 Pull Strength
Cover tape
5N min.
MURATA MFG.CO., LTD
SpecNo.JELF243A-0090H-01
P.8/12
Cover tape
Reference Only
9.4 Peeling off force of cover tape
F
165 to 180
°
゜
Speed of Peeling off
Peeling off force
300mm/min
0.1N to 0.6N
(minimum value is typical)
Base tape
9.5 Dimensions of Leader-tape,Trailer and Reel
There shall be leader-tape ( cover tape and empty tape) and trailer-tape (empty tape) as follows.
Trailer
Leader
160 min.
2.0±0.5
Label
190 min.
Empty tape Cover tape
210 min.
φ
13.0±0.2
φ
60+1
-
0
Direction of feed
φ
21.0±0.8
+1
-0
9.0
13.0±1.4
(in mm)
+0
φ
180
-3
9.6 Marking for reel
Customer part number, MURATA part number, Inspection number(∗1), RoHS marking(∗2), Quantity etc ･･･
∗1) <Expression of Inspection No.>
□□OOOO ×××
(1) (2) (3)
(1) Factory Code
(2) Date
First digit
: Year / Last digit of year
Second digit
: Month / Jan. to Sep. → 1 to 9, Oct. to Dec. → O, N, D
Third, Fourth digit : Day
(3) Serial No.
∗2) « Expression of RoHS marking »
ROHS – Y (△)
(1) (2)
(1) RoHS regulation conformity
(2) MURATA classification number
9.7 Marking for Outside package (corrugated paper box)
Customer name, Purchasing order number, Customer part number, MURATA part number, RoHS Marking (∗2) ,
Quantity, etc ･･･
9.8. Specification of Outer Case
Outer Case Dimensions (mm)
Standard Reel Quantity
in Outer Case (Reel)
W
D
H
Label
186
186
93
5
H
∗ Above Outer Case size is typical. It depends on a quantity
of an order.
D
W
10.
Caution
Limitation of Applications
Please contact us before using our products for the applications listed below which require especially high reliability
for the prevention of defects which might directly cause damage to the third party's life, body or property.
(1) Aircraft equipment
(6) Transportation equipment (vehicles, trains, ships, etc.)
(7) Traffic signal equipment
(8) Disaster prevention / crime prevention equipment
(2) Aerospace equipment
(3) Undersea equipment
(4) Power plant control equipment
(5) Medical equipment
(9) Data-processing equipment
(10) Applications of similar complexity and /or reliability
requirements to the applications listed in the above
MURATA MFG.CO., LTD
SpecNo.JELF243A-0090H-01
P.9/12
Reference Only
11. Notice
Products can only be soldered with reflow.
This product is designed for solder mounting.
Please consult us in advance for applying other mounting method such as conductive adhesive.
11.1 Land pattern designing
Recommended land patterns for reflow soldering are as follows:
These have been designed for Electric characteristics and solderability.
Please follow the recommended patterns. Otherwise, their performance which includes electrical performance or
solderability may be affected, or result to "position shift" in soldering process.
Chip Coil
Land
c
a
b
c
0.4
1.0
0.4
Solder resist
(in mm)
a
b
11.2 Flux, Solder
・Use rosin-based flux.
Includes middle activator equivalent to 0.06(wt)% to 0.1(wt) % Chlorine.
Don’t use highly acidic flux with halide content exceeding 0.2(wt) % (chlorine conversion value).
Don’t use water-soluble flux.
・Use Sn-3.0Ag-0.5Cu solder.
・Standard thickness of solder paste : 80μm to 100μm.
11.3 Reflow soldering conditions
・Pre-heating should be in such a way that the temperature difference between solder and product surface is limited to
150°C max. Cooling into solvent after soldering also should be in such a way that the temperature difference is
limited to 100°C max.
Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of products quality.
・Standard soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and / or resulting in the deterioration of
product quality.
・Reflow soldering profile
Temp.
(℃)
260℃
230℃
Limit Profile
245℃±3℃
220℃
180
150
Standard Profile
30s～60s
60s max.
90s±30s
Time.(s)
Standard Profile
Limit Profile
Pre-heating
150°C～180°C 、90s±30s
Heating
above 220°C､30s～60s
245°C±3°C
above 230°C､60s max.
260°C,10s
Peak temperature
Cycle of reflow
2 times
2 times
MURATA MFG.CO., LTD
SpecNo.JELF243A-0090H-01
P.10/12
Reference Only
11.4 Solder Volume
・Solder shall be used not to be exceed the upper limits as shown below.
・Accordingly increasing the solder volume, the mechanical stress to Chip is also increased.
Exceeding solder volume may cause the failure of mechanical or electrical performance.
Upper Limit
Recommendable(t)
1/3T≦t≦T
T
T：thickness of electrode
11.5 Product’s location
The following shall be considered when designing and laying out P.C.B.'s.
(1) P.C.B. shall be designed so that products are not subject to the mechanical stress due to warping the board.
［Products direction］
a
Products shall be located in the sideways
direction (Length:a＜b) to the mechanical
b
stress.
Poor example
〈
〉
Good example
〈
〉
(2) Components location on P.C.B. separation.
It is effective to implement the following measures, to reduce stress in separating the board.
It is best to implement all of the following three measures; however, implement as many measures
as possible to reduce stress.
Contents of Measures
Stress Level
(1) Turn the mounting direction of the component parallel to
the board separation surface.
A
A
A
>
>
>
D ∗1
B
(2) Add slits in the board separation part.
(3) Keep the mounting position of the component away from
the board separation surface.
C
C
B
Seam
∗1 A > D is valid when stress is added vertically to
the perforation as with Hand Separation.
If a Cutting Disc is used, stress will be diagonal to
the PCB, therefore A > D is invalid.
D
A
a
b
Slit
<
Length:a b
(3) Mounting Components Near Screw Holes
When a component is mounted near a screw hole,
it may be affected by the board deflection that occurs
during the tightening of the screw. Mount the component
in a position as far away from the screw holes as possible.
Screw Hole
Recommended
11.6 Cleaning Conditions
Products shall be cleaned on the following conditions.
(1) Cleaning temperature shall be limited to 60°C max.(40°C max for IPA)
(2) Ultrasonic cleaning shall comply with the following conditions with avoiding the resonance phenomenon at
the mounted products and P.C.B.
Power : 20 W / l max.
(3) Cleaner
Frequency : 28kHz to 40kHz
Time : 5 min max.
1. Alcohol type cleaner
Isopropyl alcohol (IPA)
2. Aqueous agent
PINE ALPHA ST-100S
(4) There shall be no residual flux and residual cleaner after cleaning.
In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized water in
order to remove the cleaner.
(5) Other cleaning
Please contact us.
MURATA MFG.CO., LTD
SpecNo.JELF243A-0090H-01
P.11/12
Reference Only
11.7 Resin coating
The inductance value may change due to high cure-stress of resin to be used for coating/molding products.
An open circuit issue may occur by mechanical stress caused by the resin, amount/cured shape of resin, or operating
condition etc. Some resin contains some impurities or chloride possible to generate chlorine by hydrolysis under some
operating condition may cause corrosion of wire of coil, leading to open circuit.
So, please pay your careful attention when you select resin in case of coating/molding the products with the resin. Prior to
use the coating resin, please make sure no reliability issue is observed by evaluating products mounted on your board.
11.8 Caution for use
・Sharp material such as a pair of tweezers or other material such as bristles of cleaning brush , shall not be touched to
the winding portion to prevent the breaking of wire.
・Mechanical shock should not be applied to the products mounted on the board to prevent the breaking of the core.
11.9 Notice of product handling at mounting
In some mounting machines,when picking up components support pin pushes up the components from the bottom of base
tape. In this case, please remove the support pin. The support pin may damage the components and break wire. In rare
case ,the laser recognition can not recognize this component. Please contact us when you use laser recognition. (There is
no problem with the permeation and reflection type.)
11.10 Handling of a substrate
After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the
substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to
the substrate.
Excessive mechanical stress may cause cracking in the product.
Bending
Twisting
11.11 Storage and Handing Requirements
(1) Storage period
Use the products within 12 months after delivered.
Solderability should be checked if this period is exceeded.
(2) Storage conditions
・Products should be stored in the warehouse on the following conditions.
Temperature ： -10°C to 40°C
Humidity
： 15% to 85% relative humidity No rapid change on temperature and humidity
・Don't keep products in corrosive gases such as sulfur,chlorine gas or acid, or it may cause oxidization of
electrode, resulting in poor solderability.
・Products should not be stored on bulk packaging condition to prevent the chipping of the core and the breaking
of winding wire caused by the collision between the products.
・Products should be stored on the palette for the prevention of the influence from humidity, dust and so on.
・Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on.
(3) Handling Condition
Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock.
12.
Note
(1) Please make sure that your product has been evaluated in view of your specifications with our product being
mounted to your product.
(2) You are requested not to use our product deviating from the agreed specifications.
(3) The contents of this reference specification are subject to change without advance notice.
Please approve our product specifications or transact the approval sheet for product specifications before ordering.
MURATA MFG.CO., LTD
SpecNo.JELF243A-0090H-01
P.12/12
Reference Only
<Electrical Performance:Measuring Method of Inductance/Q>
(1) Residual elements and stray elements of test fixture can be described by F-parameter shown in following.
2
1
I
I
A
C
B
D
A
C
B
D
V1
I1
V2
I 2
Zx
Zm
=
V
2
V1
Test Head
Test fixture
Product
(2) The impedance of chip coil Zx and measured value Zm can be described by input/output current/voltage.
V1
I 1
V2
I 2
Zm=
，
Zx=
(3) Thus,the relation between Zx and Zm is following;
Zm-β
where, α= D / A =1
Zx= α
1-ZmΓ
β= B / D =Zsm-(1-Yom Zsm)Zss
Γ= C / A =Yom
Zsm : measured impedance of short chip
Zssa: residual impedance of short chip (0.464nH)
Yom: measured admittance when opening the fixture
(4) Lx and Qx shall be calculated with the following equation.
Im(Zx)
Im(Zx)
Re(Zx)
Lx : Inductance of chip coil
Qx : Q of chip coil
Lx=
,
Qx =
2πf
f
: Measuring frequency
MURATA MFG.CO., LTD
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