LQP03TQ1N6C02# [MURATA]
;型号: | LQP03TQ1N6C02# |
厂家: | muRata |
描述: | |
文件: | 总12页 (文件大小:249K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
Reference Only
Spec No. JELF243C-0024B-01
P.1/12
CHIP COIL (CHIP INDUCTORS) LQP03TQ□□□□02D Reference Specification
1.Scope
This reference specification applies to LQP03TQ series, Chip coil (Chip Inductors).
2.Part Numbering
(ex)
LQ
P
03
T
Q
0N6
W
0
2
D
Product ID Structure Dimension Applications Category Inductance Tolerance Features
Electrode Packaging
D:Taping
(L×W)
and
Characteristics
*B:Bulk
*Bulk packing also available. (A product is put in the plastic bag under the taping conditions.)
3.Rating
・Operating Temperature.
・Storage Temperature.
–55°C to +125°C
–55°C to +125°C
Self Resonant
Frequency
DC
Resistance
(Ω max)
Rated
Current
(mA)
Customer
MURATA
Inductance
Q
(min)
(MHz)
Part Number
Part Number
(nH)
0.6
Tolerance
Min.
*Typ.
LQP03TQ0N6W02D
LQP03TQ0N6B02D
LQP03TQ0N6C02D
LQP03TQ0N7W02D
LQP03TQ0N7B02D
LQP03TQ0N7C02D
LQP03TQ0N8W02D
LQP03TQ0N8B02D
LQP03TQ0N8C02D
LQP03TQ0N9W02D
LQP03TQ0N9B02D
LQP03TQ0N9C02D
LQP03TQ1N0W02D
LQP03TQ1N0B02D
LQP03TQ1N0C02D
LQP03TQ1N1W02D
LQP03TQ1N1B02D
LQP03TQ1N1C02D
LQP03TQ1N2W02D
LQP03TQ1N2B02D
LQP03TQ1N2C02D
LQP03TQ1N3W02D
LQP03TQ1N3B02D
LQP03TQ1N3C02D
LQP03TQ1N4W02D
LQP03TQ1N4B02D
LQP03TQ1N4C02D
LQP03TQ1N5W02D
LQP03TQ1N5B02D
LQP03TQ1N5C02D
LQP03TQ1N6B02D
LQP03TQ1N6C02D
LQP03TQ1N7B02D
LQP03TQ1N7C02D
LQP03TQ1N8B02D
LQP03TQ1N8C02D
LQP03TQ1N9B02D
LQP03TQ1N9C02D
LQP03TQ2N0B02D
LQP03TQ2N0C02D
LQP03TQ2N1B02D
LQP03TQ2N1C02D
LQP03TQ2N2B02D
LQP03TQ2N2C02D
20000
18000
0.7
0.8
0.9
1.0
1.1
1.2
1.3
1.4
1.5
0.05
1000
>20000
W:±0.05nH
B:±0.1nH
C:±0.2nH
0.08
800
17000
17
700
16000
15000
19700
0.10
1.6
1.7
1.8
1.9
2.0
2.1
2.2
19000
17200
16900
16100
16300
14300
13000
650
B:±0.1nH
C:±0.2nH
12500
11000
0.12
MURATA MFG.CO.,LTD
Reference Only
DC
Spec No. JELF243C-0024B-01
P.2/12
Rated
Current
(mA)
Self Resonant
Customer
MURATA
Frequency
(MHz)
Inductance
Q
Resistance
(Ω max)
Part Number
Part Number
(min)
(nH)
Tolerance
Min.
*Typ.
LQP03TQ2N3B02D
LQP03TQ2N3C02D
LQP03TQ2N4B02D
LQP03TQ2N4C02D
LQP03TQ2N5B02D
LQP03TQ2N5C02D
LQP03TQ2N6B02D
LQP03TQ2N6C02D
LQP03TQ2N7B02D
LQP03TQ2N7C02D
LQP03TQ2N8B02D
LQP03TQ2N8C02D
LQP03TQ2N9B02D
LQP03TQ2N9C02D
LQP03TQ3N0B02D
LQP03TQ3N0C02D
LQP03TQ3N1B02D
LQP03TQ3N1C02D
LQP03TQ3N2B02D
LQP03TQ3N2C02D
LQP03TQ3N3B02D
LQP03TQ3N3C02D
LQP03TQ3N4B02D
LQP03TQ3N4C02D
LQP03TQ3N5B02D
LQP03TQ3N5C02D
LQP03TQ3N6B02D
LQP03TQ3N6C02D
LQP03TQ3N7B02D
LQP03TQ3N7C02D
LQP03TQ3N8B02D
LQP03TQ3N8C02D
LQP03TQ3N9B02D
LQP03TQ3N9C02D
LQP03TQ4N0B02D
LQP03TQ4N0C02D
LQP03TQ4N1B02D
LQP03TQ4N1C02D
LQP03TQ4N2B02D
LQP03TQ4N2C02D
LQP03TQ4N3H02D
LQP03TQ4N3J02D
LQP03TQ4N7H02D
LQP03TQ4N7J02D
LQP03TQ5N1H02D
LQP03TQ5N1J02D
LQP03TQ5N6H02D
LQP03TQ5N6J02D
LQP03TQ6N2H02D
LQP03TQ6N2J02D
LQP03TQ6N8H02D
LQP03TQ6N8J02D
LQP03TQ7N5H02D
LQP03TQ7N5J02D
LQP03TQ8N2H02D
LQP03TQ8N2J02D
LQP03TQ9N1H02D
LQP03TQ9N1J02D
LQP03TQ10NH02D
LQP03TQ10NJ02D
2.3
2.4
2.5
2.6
2.7
2.8
2.9
3.0
3.1
3.2
3.3
3.4
3.5
3.6
3.7
3.8
3.9
4.0
4.1
4.2
4.3
4.7
5.1
5.6
6.2
6.8
7.5
8.2
9.1
10
11000
12600
0.15
550
500
450
12300
12100
12800
12300
12400
12100
11800
11400
11200
10000
0.20
0.24
9500
8000
B:±0.1nH
C:±0.2nH
10100
9900
9800
9700
0.25
17
400
10500
6500
10100
10000
9900
8800
8400
8800
8300
7900
7600
7100
6600
6300
360
0.35
350
300
250
0.39
0.55
6000
5400
4800
H:±3%
J:±5%
0.65
0.69
4500
MURATA MFG.CO.,LTD
Reference Only
Spec No. JELF243C-0024B-01
P.3/12
Rated
Current
(mA)
Self Resonant
Frequency
(MHz)
DC
Resistance
(Ω max)
Customer
MURATA
Inductance
Q
Part Number
Part Number
(min)
(nH)
Tolerance
Min.
*Typ.
LQP03TQ11NH02D
LQP03TQ11NJ02D
LQP03TQ12NH02D
LQP03TQ12NJ02D
LQP03TQ13NH02D
LQP03TQ13NJ02D
LQP03TQ15NH02D
LQP03TQ15NJ02D
LQP03TQ16NH02D
LQP03TQ16NJ02D
LQP03TQ18NH02D
LQP03TQ18NJ02D
LQP03TQ20NH02D
LQP03TQ20NJ02D
LQP03TQ22NH02D
LQP03TQ22NJ02D
LQP03TQ24NH02D
LQP03TQ24NJ02D
LQP03TQ27NH02D
LQP03TQ27NJ02D
LQP03TQ30NH02D
LQP03TQ30NJ02D
LQP03TQ33NH02D
LQP03TQ33NJ02D
LQP03TQ36NH02D
LQP03TQ36NJ02D
LQP03TQ39NH02D
LQP03TQ39NJ02D
LQP03TQ43NH02D
LQP03TQ43NJ02D
LQP03TQ47NH02D
LQP03TQ47NJ02D
LQP03TQ51NH02D
LQP03TQ51NJ02D
LQP03TQ56NH02D
LQP03TQ56NJ02D
LQP03TQ62NH02D
LQP03TQ62NJ02D
LQP03TQ68NH02D
LQP03TQ68NJ02D
LQP03TQ75NH02D
LQP03TQ75NJ02D
LQP03TQ82NH02D
LQP03TQ82NJ02D
LQP03TQ91NH02D
LQP03TQ91NJ02D
LQP03TQR10H02D
LQP03TQR10J02D
LQP03TQR11H02D
LQP03TQR11J02D
11
12
13
15
16
18
20
22
24
27
30
33
36
39
43
47
51
56
62
68
75
82
91
100
110
5600
4900
4800
17
0.69
3700
250
0.8
1.1
1.2
5100
3500
4800
4500
4100
14
200
150
3000
2000
1700
1500
1300
1200
1.6
2.0
2.5
4.0
6.0
3800
3400
3200
3000
2900
2800
2700
2600
2500
2300
2100
H:±3%
J:±5%
11
130
100
80
1100
7.0
2000
9
1000
900
8.0
9.0
1800
1700
1600
70
*Typical value is actual performance.
4. Testing Conditions
《Unless otherwise specified》
《In case of doubt》
Temperature : 20°C ± 2°C
Humidity : 60%(RH) to 70 %(RH)
Atmospheric Pressure : 86kPa to 106 kPa
Temperature : Ordinary Temperature / 15°C to 35°C
Humidity: Ordinary Humidity / 25%(RH) to 85 %(RH)
MURATA MFG.CO.,LTD
Reference Only
Spec No. JELF243C-0024B-01
P.4/12
5. Appearance and Dimensions
0.6±0.03mm
Top view
0.3±0.03mm
End view
Side view
■ Unit Mass (Typical value)
0.20mg
0.3±0.02mm
0.2±0.03mm
Bottom view
0.15±0.03mm
6. Marking
Side surface identification marking :Blue
Both side surface
Blue
7.Electrical Performance
No. Item
7.1 Inductance
Specification
Inductance shall meet item 3.
Test Method
Measuring Equipment:
KEYSIGHT E4991A or equivalent
Measuring Frequency: (0.6~30nH)500MHz
(33~110nH) 300MHz
Measuring Condition:
Test signal level / about 0dBm
Electrical length / 10mm
Weight / about 1N~5N
Measuring Fixture: KEYSIGHT 16197A
Position coil under test as shown in below
and contact coil with each terminal by
adding weight. Bottom side should be
a bottom, and should be in the direction of
the fixture for position of chip coil.
7.2
Q
Q shall meet item 3.
TOP
BOTTOM
Measuring Method:See the endnote.
<Electrical Performance:Measuring
Method of Inductance/Q>
MURATA MFG.CO.,LTD
Reference Only
Spec No. JELF243C-0024B-01
P.5/12
No. Item
Specification
Test Method
7.3 DC Resistance
7.4 Self Resonant
Frequency(S.R.F)
7.5 Rated
DC Resistance shall meet item 3.
S.R.F shall meet item 3.
Measuring Equipment:Digital multi meter
Measuring Equipment:
KEYSIGHT N5230A or equivalent
The rated current is applied.
Self temperature rise shall be
limited to 25°C max.
Current
8.Mechanical Performance
No.
Item
Specification
Test Method
8.1 Shear Test
Chip coil shall not be damaged
after tested as test method.
Substrate:Glass-epoxy substrate
Land
0.24
0.3
0.9
(in mm)
Force:2N
Hold Duration:5 s±1 s
Applied Direction: Parallel to PCB
Chip coil
F
Substrate
8.2 Bending Test
Substrate:Glass-epoxy substrate
(100mm×40mm×0.8mm)
Speed of Applying Force:1mm /s
Deflection:1mm
Hold Duration:30 s
Pressure jig
R340
F
Deflection
Product
45
45
(in mm)
8.3 Vibration
Appearance:No damage
Inductance Change: within ±10%
Substrate: Glass-epoxy substrate
Oscillation Frequency:
10Hz to 2000Hz to 10Hz for 20 min
Total amplitude 1.5 mm or Acceleration
amplitude 196 m/s2 whichever is smaller.
Testing Time:A period of 2h in each of
3 mutually perpendicular directions.
8.4 Solderability
The electrode shall be at least 90% Flux: Ethanol solution of rosin 25(wt)%
covered with new solder coating.
(Immersed for 5s to 10s)
Solder:Sn-3.0Ag-0.5Cu
Pre-Heating:150°C±10°C / 60s to 90s
Solder Temperature:240°C±5°C
Immersion Time:3s±1s
8.5 Resistance to
Soldering Heat
Appearance:No damage
Inductance Change: within ±10%
Flux: Ethanol solution of rosin 25(wt)%
(Immersed for 5s to 10s)
Solder:Sn-3.0Ag-0.5Cu
Pre-Heating:150°C±10°C / 60s to 90s
Solder Temperature:260°C±5°C
Immersion Time:5s±1s
Then measured after exposure in the room
condition for 24h±2h.
MURATA MFG.CO.,LTD
Reference Only
Spec No. JELF243C-0024B-01
P.6/12
9.Environmental Performance
It shall be soldered on the substrate.
No.
Item
Specification
Appearance:No damage
Inductance Change: within ±10%
Test Method
Substrate: Glass-epoxy substrate
Temperature:125°C±2°C
9.1 Heat Resistance
9.2 Cold Resistance
9.3 Humidity
Time:1000h (+48h,-0h)
Then measured after exposure in the
room condition for 24h±2h.
Substrate: Glass-epoxy substrate
Temperature:-55°C±3°C
Time:1000 h (+48h,-0h)
Then measured after exposure in the
room condition for 24h±2h.
Substrate: Glass-epoxy substrate
Temperature:40°C±2°C
Humidity:90%(RH) to 95%(RH)
Time:1000 h(+48h,-0h)
Then measured after exposure in the
room condition for 24h±2h.
Substrate: Glass-epoxy substrate
1 cycle:
9.4 Temperature
Cycle
1 step:-55°C±2°C / 30min±3 min
2 step:Ordinary temp. / 10~15 min
3 step:125°C±2°C / 30±3 min
4 step: Ordinary temp. / 10~15 min
Total of 10 cycles
Then measured after exposure in the
room condition for 24h±2h.
10.Specification of Packaging
10.1 Appearance and Dimensions of paper tape (8mm-wide)
+0.1
-0
2.0±0.05
φ1.5
2.0±0.05
4.0±0.1
1.75±0.1
(0.35)
0.55 max.
(in mm)
Direction of feed
10.2 Specification of Taping
(1) Packing quantity (standard quantity)
15,000 pcs. / reel
(2) Packing Method
Products shall be packed in the cavity of the base tape and sealed by cover tape.
(3) Sprocket hole
The sprocket holes are to the right as the tape is pulled toward the user.
(4) Spliced point
Base tape and Cover tape has no spliced point.
MURATA MFG.CO.,LTD
Reference Only
Spec No. JELF243C-0024B-01
P.7/12
(5) Missing components number
Missing components number within 0.1 % of the number per reel or 1 pc. , whichever is greater,
and are not continuous. The Specified quantity per reel is kept.
10.3 Pull Strength
Cover tape
5N min
10.4 Peeling off force of cover tape
Cover tape
F
Speed of Peeling off
300mm/min
165 to 180
°
゜
0.1N to 0.6N
(minimum value is typical)
Peeling off force
Base tape
10.5 Dimensions of Leader-tape, Trailer and Reel
There shall be leader-tape ( top tape and empty tape) and trailer-tape (empty tape) as follows.
Trailer
160 min.
Leader
2.0±0.5
Label
190 min.
Empty tape Cover tape
210 min.
φ
13.0±0.2
φ
60+1
-
0
Direction of feed
φ
21.0±0.8
+1
-0
9.0
13.0±1.4
(in mm)
+0
φ
180
-3
10.6 Marking for reel
Customer part number, MURATA part number, Inspection number(∗1), RoHS Marking(∗2),
Quantity etc ・・・
∗1) <Expression of Inspection No.>
□□ OOOO ×××
(1)
(2)
(3)
(1) Factory Code
(2) Date
First digit : Year / Last digit of year
Second digit : Month / Jan. to Sep. → 1 to 9, Oct. to Dec. → O,N,D
Third, Fourth digit : Day
(3) Serial No.
∗2) <Expression of RoHS Marking >
ROHS – Y (△)
(1) (2)
(1) RoHS regulation conformity parts.
(2) MURATA classification number
10.7 Marking for Outside package (corrugated paper box)
Customer name, Purchasing order number, Customer part number, MURATA part number,
RoHS Marking (∗2), Quantity, etc ・・・
10.8 Specification of Outer Case
Outer Case Dimensions
(mm)
Standard Reel Quantity
in Outer Case (Reel)
Label
H
W
D
H
186
186
93
5
D
W
∗ Above Outer Case size is typical. It depends on a quantity of an order.
MURATA MFG.CO.,LTD
Reference Only
Spec No. JELF243C-0024B-01
P.8/12
11. ! Caution
Limitation of Applications
Please contact us before using our products for the applications listed below which require especially
high reliability for the prevention of defects which might directly cause damage to the third party's life,
body or property.
(1) Aircraft equipment
(2) Aerospace equipment
(3) Undersea equipment
(6) Transportation equipment (vehicles, trains, ships, etc.)
(7) Traffic signal equipment
(8) Disaster prevention / crime prevention equipment
(4) Power plant control equipment (9) Data-processing equipment
(5) Medical equipment
(10) Applications of similar complexity and /or reliability
requirements to the applications listed in the above
12. Notice
Products can only be soldered with reflow.
This product is designed for solder mounting.
Please consult us in advance for applying other mounting method such as conductive adhesive.
12.1 Land pattern designing
Chip Coil Land
a
b
c
0.3
c
0.9
Solder resist
0.24
(in mm)
a
b
12.2 Flux, Solder
・ Use rosin-based flux.
Don’t use highly acidic flux with halide content exceeding 0.2(wt)% (chlorine conversion value).
Don’t use water-soluble flux.
・ Use Sn-3.0Ag-0.5Cu solder.
・ Standard thickness of solder paste : 100μm.
12.3 Reflow soldering conditions
・ Pre-heating should be in such a way that the temperature difference between solder and
product surface is limited to 150°C max. Cooling into solvent after soldering also should be
in such a way that the temperature difference is limited to 100°C max.
Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of
products quality.
・ Standard soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and / or resulting
in the deterioration of product quality.
MURATA MFG.CO.,LTD
Reference Only
Spec No. JELF243C-0024B-01
P.9/12
・Reflow soldering profile
Temp.
260℃
230℃
(℃)
245℃±3℃
220℃
Limit Profile
180
150
Standard Profile
30s~60s
60s max.
90s±30s
Time.(s)
Standard Profile
Limit Profile
Pre-heating
150°C~180°C 、90s±30s
Heating
Peak temperature
Cycle of reflow
above 220°C、30s~60s
above 230°C、60s max.
260°C,10s
245°C±3°C
2 times
2 times
12.4 Reworking with soldering iron
The following conditions must be strictly followed when using a soldering iron.
Pre-heating
150°C,1 min
350°C max.
80W max.
φ3mm max.
3(+1,-0)s
Tip temperature
Soldering iron output
Tip diameter
Soldering time
Time
2 times
Note : Do not directly touch the products with the tip of the soldering iron in order to prevent the
crack on the products due to the thermal shock.
12.5 Solder Volume
・ Solder shall be used not to be exceeded the upper limits as shown below.
1/3T≦t≦2T
Upper Limit
T : thickness of product
Recommendable
Accordingly increasing the solder volume, the mechanical stress to Chip is also increased.
Exceeding solder volume may cause the failure of mechanical or electrical performance and become easy to tilt.
12.6 Attention regarding P.C.B. bending
The following shall be considered when designing and laying out P.C.B.'s.
(1) P.C.B. shall be designed so that products are not subject to the mechanical stress due to
warping the board.
[Products direction]
Products shall be located in the sideways
direction (Length:a<b) to the mechanical
stress.
a
b
Poor example
〈
〉
Good example
〈
〉
MURATA MFG.CO.,LTD
Reference Only
Spec No. JELF243C-0024B-01
P.10/12
(2) Components location on P.C.B. separation.
It is effective to implement the following measures, to reduce stress in separating the board.
It is best to implement all of the following three measures; however, implement as many measures as possible
to reduce stress.
Contents of Measures
Stress Level
(1) Turn the mounting direction of the component parallel to the board separation surface.
(2) Add slits in the board separation part.
A
>
D *1
B
A
>
>
(3) Keep the mounting position of the component away from the board separation surface.
A
C
C
B
Seam
D
A
a
b
Slit
Length:a b
<
*1 A > D is valid when stress is added vertically to the perforation as with Hand Separation.
If a Cutting Disc is used, stress will be diagonal to the PCB, therefore A > D is invalid.
(3) Mounting Components Near Screw Holes
When a component is mounted near a screw hole, it may be affected by the board deflection that occurs during
the tightening of the screw. Mount the capacitor in a position as far away from the screw holes as possible.
12.7 Cleaning Conditions
Products shall be cleaned on the following conditions.
(1) Cleaning temperature shall be limited to 60°C max.(40°C max for IPA)
(2) Ultrasonic cleaning shall comply with the following conditions with avoiding the resonance
phenomenon at the mounted products and P.C.B.
Power : 20 W / l max.
(3) Cleaner
Frequency : 28kHz to 40kHz
Time : 5 min max.
1. Alcohol type cleaner
Isopropyl alcohol (IPA)
2. Aqueous agent
PINE ALPHA ST-100S
(4) There shall be no residual flux and residual cleaner after cleaning.
In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized
water in order to remove the cleaner.
(5) Other cleaning
Please contact us.
12.8 Resin coating
When products are coated with resin, please contact us in advance.
12.9 Handling of a substrate
(1)There is a possibility of chip cracking caused by PCBexpansion/contraction with heat, because stress
on a chip is different depending on PCB material and structure.
When the thermal expansion coefficient greatly differs between the board used for mounting and the chip,
it will cause cracking of the chip due to the thermal expansion and contraction.
The chip is assumed to be mounted on the PCB of glass-epoxy material, and we don't test with other
PCB material which has different thermal expansion coefficient from Glass-epoxy.
When other PCB materials are considered, please be sure to evaluate by yourself.
MURATA MFG.CO.,LTD
Reference Only
Spec No. JELF243C-0024B-01
P.11/12
(2)After mounting products on a substrate, do not apply any stress to the product caused by bending or
twisting to the substrate when cropping the substrate, inserting and removing a connector from the
substrate or tightening screw to the substrate.
Excessive mechanical stress may cause cracking in the product.
In case of the mounting on flexible PCB, there is a possibility of chip cracking caused by mechanical stress
even from small bending or twisting.
When the flexible PCB is considered, please be sure to evaluate by yourself.
Bending
Twisting
12.10 Storage and Handing Requirements
(1) Storage period
Use the products within 12 months after deliverd.
Solderability should be checked if this period is exceeded.
(2) Storage conditions
・Products should be stored in the warehouse on the following conditions.
Temperature : -10°C ~ 40°C
Humidity
: 30% to 70% relative humidity No rapid change on temperature and humidity.
・Products should not be stored on bulk packaging condition to prevent the chipping of the
core and the breaking of winding wire caused by the collision between the products.
・Products should be stored on the palette for the prevention of the influence from humidity,
dust and so on.
・Products should be stored in the warehouse without heat shock, vibration, direct sunlight and
so on.
(3) Handling Condition
Care should be taken when transporting or handling product to avoid excessive vibration or
mechanical shock.
13.
! Note
(1)Please make sure that your product has been evaluated in view of your specifications with our product being
mounted to your product.
(2)You are requested not to use our product deviating from the reference specifications.
(3)The contents of this reference specification are subject to change without advance notice.
Please approve our product specifications or transact the approval sheet for product specifications
before ordering.
MURATA MFG.CO.,LTD
Reference Only
Spec No. JELF243C-0024B-01
P.12/12
<Electrical Performance:Measuring Method of Inductance/Q>
(1) Residual elements and stray elements of test fixture can be described by F-parameter shown in following.
2
1
I
I
A
C
B
D
Zx
Zm
V
2
V
1
V1
I1
A
C
B
D
V2
I 2
=
Test Head
Test fixture
Product
(2) The impedance of chip coil Zx and measured value Zm can be described by input/output current/voltage.
V1
I 1
V2
I 2
Zm=
Zx=
,
(3) Thus,the relation between Zx and Zm is following;
Zm-β
1-ZmΓ
where, α= D / A =1
Zx= α
β= B / D =Zsm-(1-Yom Zsm)Zss
Γ= C / A =Yom
Zsm:measured impedance of short chip
Zss:residual impedance of short chip (0.480nH)
Yom:measured admittance when opening the fixture
(4) Lx and Qx shall be calculated with the following equation.
Im(Zx)
2πf
Im(Zx)
Re(Zx)
Lx :Inductance of chip coil
Qx:Q of chip coil
Qx=
Lx=
,
f
:Measuring frequency
MURATA MFG.CO.,LTD
相关型号:
©2020 ICPDF网 联系我们和版权申明