LQM21NNR82K10# [MURATA]
;
| 型号： | LQM21NNR82K10# |
| 厂家： | 
muRata |
| 描述： | |
| 文件： | 总9页 (文件大小：157K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Reference Only
CHIP COIL (CHIP INDUCTORS) LQM21NN□□□□10□ REFERENCE SPECIFICATION
Spec No. JELF243B-0005R-01
P.1/9
1. Scope
This reference specification applies to LQM21NN_10 series, Chip coil (Chip Inductors).
2. Part Numbering
(ex)
LQ
M
21
N
N
R10
K
1
0
D
Product ID Structure Dimension Applications Category Inductance Tolerance Features Electrode Packaging
(L×W)
and
Characteristics
D: Taping
(Paper tape)
L: Taping
*B:Bulk packing also available
(Plastic tape)
*B: Bulk
3. Rating
・Operating Temperature Range
・Storage Temperature Range
– 40°C to + 85°C
– 55°C to +125°C
Self
DC
Resistance
(Ωmax.)
Inductance
Rated
Current
(mA)
Customer
Part Number
MURATA
Part Number
Q
(min.)
Resonant
Frequency
(MHz min.)
(μH)
Tolerance
LQM21NNR10K10D
LQM21NNR12K10D
LQM21NNR15K10D
LQM21NNR18K10D
LQM21NNR22K10D
LQM21NNR27K10D
LQM21NNR33K10D
LQM21NNR39K10D
LQM21NNR47K10D
LQM21NNR56K10D
LQM21NNR68K10D
LQM21NNR82K10D
LQM21NN1R0K10D
LQM21NN1R2K10D
LQM21NN1R5K10D
LQM21NN1R8K10D
LQM21NN2R2K10D
LQM21NN2R7K10L
LQM21NN3R3K10L
LQM21NN3R9K10L
LQM21NN4R7K10L
0.10
0.12
0.15
0.18
0.22
0.27
0.33
0.39
0.47
0.56
0.68
0.82
1.0
0.26
0.29
0.32
0.35
0.38
0.42
0.48
0.53
0.57
0.63
0.72
0.81
0.40
0.47
0.50
0.57
0.63
0.69
0.80
0.89
1.00
340
310
270
250
220
200
180
165
150
140
125
115
107
97
20
25
250
200
150
±10%
1.2
50
30
1.5
87
1.8
80
2.2
45
71
2.7
66
3.3
59
3.9
53
4.7
47
4. Testing Conditions
《Unless otherwise specified》
Temperature : Ordinary Temperature / 15°C to 35°C
Humidity : Ordinary Humidity / 25%(RH) to 85%(RH)
《In case of doubt》
Temperature : 20°C± 2°C
Humidity : 60%(RH) to 70%(RH)
Atmospheric Pressure : 86kPa to 106kPa
MURATA MFG.CO., LTD
Reference Only
Spec No. JELF243B-0005R-01
P.2/9
5. Appearance and Dimensions
0.5±0.3
Ferrite
Electrode
T
2.0±0.2
1.25±0.2
(in mm)
Inductance: 0.10H to 2.2H
Inductance: 2.7H to 4.7H
0.85mm±0.2mm
1.25mm±0.2mm
Dimension of T
Unit Mass
Inductance: 0.10H to 2.2H
Inductance: 2.7H to 4.7H
0.010g
0.014g
(Typical value)
6. Electrical Performance
No.
Item
Specification
Inductance shall meet item 3.
Test Method
Measuring Equipment:
6.1 Inductance
KEYSIGHT 4291A or equivalent (1mA)
Measuring Frequency:
6.2
Q
Q shall meet item 3.
25MHz/ 0.1μH to 0.82μH
10MHz/ 1.0μH to 4.7μH
6.3 DC
Resistance
6.4 Self Resonant
Frequency (S.R.F)
6.5 Rated Current
DC Resistance shall meet item 3.
S.R.F shall meet item 3.
Measuring Equipment: Digital multi meter
Measuring Equipment:
KEYSIGHT 4195A or equivalent (1mA)
The rated current is applied.
Self temperature rise shall be limited
to 25°C max.
Inductance Change: within ±05
%
7. Mechanical Performance
No.
Item
Specification
Test Method
7.1 Shear Test
Chip coil shall not be damaged
after tested as test method.
Applied Direction:
Solder
Substrate
Chip Coil
Ｆ
Force: 10N
Hold Duration: 5s ±1s
MURATA MFG.CO., LTD
Reference Only
Spec No. JELF243B-0005R-01
No. Item
P.3/9
Specification
Test Method
7.2 Bending Test
Chip coil shall not be damaged
after tested as test method.
Substrate: Glass-epoxy substrate
(100mm40mm1.6mm)
Pressure jig
R340
F
Deflection
(in mm)
45
45
Product
Speed of Applying Force:1mm/ s
Deflection: 2mm
Hold Duration: 30s
7.3 Vibration
Appearance: No damage
Oscillation Frequency: 10Hz to 55Hz to 10Hz for 1min
Inductance Change: within ±10% Total Amplitude: 1.5mm
Testing Time: A period of 2 h in each of 3 mutually
Perpendicular directions.
7.4 Solderability
The wetting area of the electrode Flux: Ethanol solution of rosin 25(wt)%
shall be at least 90% covered
with new solder coating.
(Immersed for 5s to 10s)
Solder: Sn-3.0Ag-0.5Cu
Pre-Heating: 150°C±10°C/60s to 90s
Solder Temperature: 240°C±5°C
Immersion Time: 3s ±1s
7.5 Resistance to
Appearance: No damage
Flux: Ethanol solution of rosin 25(wt)%
(Immersed for 5s to 10s)
Soldering Heat Inductance Change: within ±10%
Solder: Sn-3.0Ag-0.5Cu
Pre-Heating: 150°C±10°C/60s to 90s
Solder Temperature: 270°C±5°C
Immersion Time: 10s±1s
Then measured after exposure in the room
condition for 24h±2h.
8. Environmental Performance
It shall be soldered on the substrate.
No.
Item
Specification
Test Method
8.1 Heat
Appearance: No damage
Temperature: 85°C±2°C
Resistance
Inductance Change: within ±10% Time: 1000 h (+48h, -0h)
Q Change: within ±20% Then measured after exposure in the room condition
for 48h±2h.
8.2 Cold
Temperature: - 40°C±2°C
Time: 1000 h (+48h, -0h)
Resistance
Then measured after exposure in the room condition
for 48h±2h.
8.3 Humidity
Temperature: 40°C±2°C
Humidity: 90%(RH) to 95%(RH)
Time: 1000 h (+48h,-0h)
Then measured after exposure in the room condition
for 48h±2h.
8.4 Temperature
1 cycle:
Cycle
1 step: - 40°C±2°C/ 30 min±3 min
2 step: Ordinary temp./ 10 min to 15 min
3 step: 85°C±2°C/ 30 min± 3 min
4 step: Ordinary temp./ 10 min to 15 min
Total of 10 cycles
Then measured after exposure in the room condition
for 48h±2h.
MURATA MFG.CO., LTD
Reference Only
Spec No. JELF243B-0005R-01
P.4/9
9. Specification of Packaging
9.1 Appearance and Dimensions of paper tape,plastic tape (8mm-wide)
P/N
Type
Dimensions (in mm)
2.0±0.05
4.0±0.1 4.0±0.1
0.1
0
φ1.5±
1.75±0.1
LQM21NN
R10K10D
to
8mm-wide
Paper tape
2R2K10D
1.45±0.1
Direction of feed
max
1.1
2.0±0.05
1.3±0.1
0.2±0.1
0.1
φ1.5±
0
LQM21NN
2R7K10L
3R3K10L
3R9K10L
4R7K10L
4.0±0.1
4.0±0.1
1.75±0.1
8mm-wide
Plastic tape
1.45±0.1
Direction of feed
・Dimension of the Cavity is measured at the bottom side.
9.2 Specification of Taping
(1) Packing quantity (standard quantity)
･Inductance : 0.10H to 2.2H (Paper tape)
･Inductance : 2.7H to 4.7 H (Plastic tape) 3,000 pcs./ reel
(2) Packing Method
4,000 pcs./ reel
(Paper tape)
Products shall be packed in the cavity of the base tape and sealed by top tape and bottom tape.
(Plastic tape)
Products shall be packed in the each embossed cavity of plastic tape and sealed by cover tape.
(3) Sprocket hole
The sprocket holes are to the right as the tape is pulled toward the user.
(4) Spliced point
(Paper tape)
Base tape and Top tape has no spliced point.
(Plastic tape)
Plastic tape and Cover tape has no spliced point.
(5) Missing components number
Missing components number within 0.1% of the number per reel or 1 pc., whichever is greater,
and are not continuous. The Specified quantity per reel is kept.
9.3 Pull Strength
【Case of Paper tape】
【Case of Plastic tape】
Top tape
Plastic tape
Cover tape
10N min.
5N min.
5N min.
Bottom tape
MURATA MFG.CO., LTD
Reference Only
Spec No. JELF243B-0005R-01
P.5/9
9.4 Peeling off force
【Case of Paper tape】
【Case of Plastic tape】
Top tape
165 to 180 degree
165 to 180 degree
F
F
Cover tape
Bottom tape
Base tape
Plastic tape
Speed of Peeling off
Peeling off force
300mm/ min
Paper tape: 0.1N to 0.6N
Plastic tape: 0.2N to 0.7N
(minimum value is typical)
9.5 Dimensions of Leader-tape, Trailer and Reel
There shall be leader-tape (top tape/cover tape and empty tape) and trailer-tape (empty tape) as follows.
Trailer
160 min.
Leader
2.0±0.5
Label
190 min.
210 min.
Empty tape
13.0±0.2
Top tape:Paper tape
60+1
-
0
Cover tape:Plastic tape
Direction of feed
21.0±0.8
+1
-0
9.0
13.0±1.4
+0
180
-3
(in mm)
9.6 Marking for reel
Customer part number, MURATA part number, Inspection number (1), RoHS Marking (2),
Quantity etc ･･･
1) <Expression of Inspection No.>
□□ OOOO
(1)
(2)
(3)
(1) Factory Code
(2) Date
First digit
: Year/ Last digit of year
Second digit
Third, Fourth digit : Day
: Month/ Jan. to Sep. 1 to 9, Oct. to Dec. O, N, D
(3) Serial No.
2) <Expression of RoHS Marking >
ROHS – Y (△)
(1) (2)
(1) RoHS regulation conformity parts.
(2) MURATA classification number
9.7 Marking for Outside package (corrugated paper box)
Customer name, Purchasing order number, Customer part number, MURATA part number,
RoHS Marking (2), Quantity, etc ･･･
9.8. Specification of Outer Case
Outer Case Dimensions
Standard Reel Quantity
in Outer Case (Reel)
(mm)
D
Label
W
H
H
186
186
93
5
D
Above Outer Case size is typical. It depends on a quantity of an order.
W
MURATA MFG.CO., LTD
Reference Only
Spec No. JELF243B-0005R-01
10. ！ Caution
P.6/9
Limitation of Applications
Please contact us before using our products for the applications listed below which require
especially high reliability for the prevention of defects which might directly cause damage to the
third party's life, body or property.
(1) Aircraft equipment
(2) Aerospace equipment
(3) Undersea equipment
(6) Transportation equipment (vehicles, trains, ships, etc.)
(7) Traffic signal equipment
(8) Disaster prevention / crime prevention equipment
(4) Power plant control equipment (9) Data-processing equipment
(5) Medical equipment
(10) Applications of similar complexity and /or reliability
requirements to the applications listed in the above
11. Notice
This product is designed for solder mounting.
Please consult us in advance for applying other mounting method such as conductive adhesive.
11.1 Land pattern designing
Chip coil
c
a
b
c
1.2
3.0 to 4.0
1.0
a
b
Solder Resist
Land
(in mm)
11.2 Flux, Solder
･ Use rosin-based flux.
Don’t use highly acidic flux with halide content exceeding 0.2(wt) % (chlorine conversion value).
Don’t use water-soluble flux.
･ Use Sn-3.0Ag-0.5Cu solder.
･ Standard thickness of solder paste: 100m to 150m.
11.3 Flow soldering/ Reflow soldering conditions
･ Pre-heating should be in such a way that the temperature difference between solder and product
surface is limited to 150°C max. Cooling into solvent after soldering also should be in such a way
that the temperature difference is limited to 100°C max.
Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of products
quality.
･Standard soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and/or resultingin the
deterioration of product quality.
Soldering profile
(1) Flow soldering profile
Temp.
(℃)
265℃±3℃
250℃
Limit Profile
150
Heating Time
Standard Profile
60s min.
Time.(s)
Standard Profile
Limit Profile
Pre-heating
Heating
150℃, 60s min.
250℃, 4s～6s
265℃±3℃, 5s
Cycle of flow
2 times
2 times
MURATA MFG.CO., LTD
Reference Only
Spec No. JELF243B-0005R-01
(2) Reflow soldering profile
P.7/9
Temp.
(℃)
260℃
245℃±3℃
230℃
220℃
Limit Profile
180
150
Standard Profile
30s～60s
60s max.
90s±30s
Time.(s)
Standard Profile
Limit Profile
Pre-heating
150°C～180°C, 90s±30s
Heating
Peak temperature
Cycle of reflow
above 220°C, 30s～60s
245°C±3°C
above 230°C, 60s max.
260°C, 10s
2 times
2 times
11.4 Reworking with soldering iron.
The following conditions must be strictly followed when using a soldering iron.
Pre-heating
150°C, 1 min
350°C max.
80W max.
φ3mm max.
3(+1,-0)s
Tip temperature
Soldering iron output
Tip diameter
Soldering time
Time
2 times
Note : Do not directly touch the products with the tip of the soldering iron in order to prevent the
crack on the products due to the thermal shock.
11.5 Solder Volume
･ Solder shall be used not to be exceeded the upper limits as shown below.
･ Accordingly increasing the solder volume, the mechanical stress to Chip is also increased.
Exceeding solder volume may cause the failure of mechanical or electrical performance.
Upper Limit
Recommendable
1/3T≦t≦T
t
T： thickness of product
11.6 Product’s location
The following shall be considered when designing and laying out P.C.B.'s.
(1) P.C.B. shall be designed so that products are not subject to the mechanical stress due to
warping the board.
［Products direction］
a
b
Products shall be located in the
sideways direction (Length: ab) to
the mechanical stress.
Poor example
〈
〉
Good example
〈
〉
(2)Components location on P.C.B. separation.
It is effective to implement the following measures, to reduce stress in separating the board.
It is best to implement all of the following three measures; however, implement as many measures
as possible to reduce stress.
Contents of Measures
Stress Level
D *1
(1) Turn the mounting direction of the component parallel to the board separation surface.
(2) Add slits in the board separation part.
A
>
A
>
>
B
C
(3) Keep the mounting position of the component away from the board separation
surface.
A
MURATA MFG.CO., LTD
Reference Only
C
Spec No. JELF243B-0005R-01
P.8/9
Perforation
B
D
A
Slit
*1 A > D is valid when stress is added vertically to the perforation as with Hand Separation.
If a Cutting Disc is used, stress will be diagonal to the PCB, therefore A > D is invalid.
(3) Mounting Components Near Screw Holes
When a component is mounted near a screw hole, it may be affected by the board deflection that occurs
during the tightening of the screw. Mount the component in a position as far away from the screw holes
as possible.
Recommended
Screw Hole
11.7 Cleaning Conditions
Products shall be cleaned on the following conditions.
(1) Cleaning temperature shall be limited to 60°C max. (40°C max for IPA.)
(2) Ultrasonic cleaning shall comply with the following conditions with avoiding the resonance
phenomenon at the mounted products and P.C.B.
Power : 20 W/ l max.
(3) Cleaner
Frequency : 28kHz to 40kHz
Time : 5 min max.
1. Alcohol type cleaner
Isopropyl alcohol (IPA)
2. Aqueous agent
PINE ALPHA ST-100S
(4) There shall be no residual flux and residual cleaner after cleaning. In the case of using aqueous agent,
products shall be dried completely after rinse with de-ionized water in order to remove the cleaner.
(5) Other cleaning Please contact us.
11.8 Resin coating
The inductance value may change and/or it may affect on the product's performance due to high
cure-stress of resin to be used for coating / molding products. So please pay your careful attention when
you select resin.
In prior to use, please make the reliability evaluation with the product mounted in your application set.
11.9 Caution for use
There is possibility that the inductance value change due to magnetism. Don‘t use a magnet or a pair of
tweezers with magnetism when chip coil are handled. (The tip of the tweezers should be molded with resin or
pottery.)
11.10 Magnetic Saturation
When the excessive current over rated current is applied, the inductance value may change due to
magnetism.
MURATA MFG.CO., LTD
Reference Only
Spec No. JELF243B-0005R-01
P.9/9
11.11 Handling of a substrate
After mounting products on a substrate, do not apply any stress to the product caused by bending or
twisting to the substrate when cropping the substrate, inserting and removing a connector from the
substrate or tightening screw to the substrate.
Excessive mechanical stress may cause cracking in the product.
Bending
Twisting
11.12 Storage and Handing Requirements
(1) Storage period
Use the products within 6 months after delivered.
Solderability should be checked if this period is exceeded.
(2) Storage conditions
・Products should be stored in the warehouse on the following conditions.
Temperature ： -10°C to 40°C
Humidity
： 15% to 85% relative humidity No rapid change on temperature and humidity
Don't keep products in corrosive gases such as sulfur, chlorine gas or acid, or it may cause oxidization
of electrode, resulting in poor solderability.
・ Products should be stored on the palette for the prevention of the influence from humidity, dust and so
on.
・Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on.
・Products should be stored under the airtight packaged condition.
(3) Handling Condition
Care should be taken when transporting or handling product to avoid excessive vibration or mechanical
shock.
12． ! Note
(1) Please make sure that your product has been evaluated in view of your specifications with our
product being mounted to your product.
(2) You are requested not to use our product deviating from the reference specifications.
(3) The contents of this reference specification are subject to change without advance notice.
Please approve our product specifications or transact the approval sheet for product specifications
before ordering.
MURATA MFG.CO., LTD
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