LQH66SNR27M03# [MURATA]

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型号：	LQH66SNR27M03#
厂家：	muRata
描述：
文件：	总8页 (文件大小：247K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

SpecNo.JELF243A-0047W-01

P1/8

Reference Onl

CHIP COIL（CHIP INDUCTORS）LQH66SN□□□□03L SPECIFICATION

1.Scope

This reference specification applies to LQH66SN_03L Series, Chip coil (Chip Inductors).

2.Part Numbering

(ex) LQ

Product ID Structure Dimension Applications Category Inductance Tolerance Features Electrode Packaging

(L×W)

R27

and

L: Taping

Characteristics

3.Rating

-40 to +80°C

-40 to +85°C

・Operating Temperature Range.

・Storage Temperature Range.

Self

Inductance

Tolerance

Resistance

Rated

Current

(A)

Customer

MURATA

Resonant

Frequency

(MHz min)

Part Number

(µH)

(Ω)

(%)

LQH66SNR27M03L

LQH66SNR68M03L

LQH66SN1R0M03L

LQH66SN1R5M03L

LQH66SN2R2M03L

LQH66SN3R3M03L

LQH66SN4R7M03L

LQH66SN6R8M03L

LQH66SN100M03L

LQH66SN150M03L

LQH66SN220M03L

LQH66SN330M03L

LQH66SN470M03L

LQH66SN680M03L

LQH66SN101M03L

LQH66SN151M03L

LQH66SN221M03L

LQH66SN331M03L

LQH66SN471M03L

LQH66SN681M03L

LQH66SN102M03L

LQH66SN222M03L

LQH66SN472M03L

LQH66SN103M03L

0.27

0.68

1.0

0.007 ± 40%

0.010 ± 40%

0.013 ± 40%

0.016 ± 40%

0.019 ± 40%

0.022 ± 40%

0.025 ± 40%

0.029 ± 40%

0.036 ± 40%

0.069 ± 40%

0.087 ± 40%

0.14 ± 40%

0.17 ± 40%

0.29 ± 40%

0.36 ± 40%

0.63 ± 40%

0.79 ± 40%

1.8 ± 40%

300

180

150

110

6.0

5.3

4.7

1.5

3.8

2.2

3.3

2.6

4.7

2.2

6.8

1.8

1.6

1.3

1.1

0.86

0.76

0.60

0.52

0.42

0.35

0.28

0.24

0.20

0.16

0.10

0.07

0.05

±20

7.6

6.5

5.0

4.0

3.2

2.5

2.0

1.7

1.2

0.8

0.5

100

150

220

330

470

680

1000

2200

4700

10000

2.2 ± 40%

3.9 ± 40%

4.9 ± 40%

9.4 ± 40%

19.5 ± 40%

39.7 ± 40%



When applied Rated current to the Products, Inductance will be within ±10% of initial Inductance value.

When applied Rated current to the Products ,temperature rise caused by self-generated heat shall be limited

to 40°C max.

4. Testing Conditions

《Unless otherwise specified》

Temperature : Ordinary Temperature (15 to 35°C)

Humidity : Ordinary Humidity (25 to 85 %(RH))

《In case of doubt》

Temperature

Humidity

: 20 ± 2°C

: 60 to 70 %(RH)

Atmospheric Pressure : 86 to 106 kPa

MURATA MFG.CO., LTD

SpecNo.JELF243A-0047W-01

P2/8

Reference Onl

5.Appearance and Dimensions

6.3 ± 0.3

■Unit Mass (Typical value)

0.71g

6.3 ± 0.3

( in mm )

No Marking.

※

1.3 min. 1.7 min. 1.3 min.

6.Electrical Performance

No.

Item

Specification

Test Method

6.1 Inductance

Inductance shall meet item 3.

Measuring Equipment：KEYSIGHT 4194A or equivalent

Measuring Frequency：1 MHz / 0.12 to 68 μH

100 kHz / 100 to 680 μH

10 kHz / 1000 to 10000 μH

6.2 DC Resistance

DC Resistance shall meet item 3.

S.R.F shall meet item 3.

Measuring Equipment：Digital multi meter

6.3 Self Resonant

Frequency(S.R.F)

Measuring Equipment：

f  1 MHz：KEYSIGHT 4194A or equivalent

f  1 MHz：KEYSIGHT E4991A or equivalent

7.Mechanical Performance

No.

Item

Specification

Test Method

7.1 Shear Test

Chip coil shall not be damaged.

Substrate：Glass-epoxy substrate

Applied Direction：

Chip Coil

Substrate

Force：10N

Hold Duration：5±1 s

7.2 Bending Test

Substrate：Glass-epoxy substrate

(100  40  1.6mm)

Speed of Applying Force：1mm / s

Deflection：2mm

Hold Duration：30 s

Pressure jig

R230

Deflection

Product

(in mm)

MURATA MFG.CO., LTD

SpecNo.JELF243A-0047W-01

No. Item

P3/8

Reference Onl

Specification

Test Method

7.3 Vibration

Oscillation Frequency：10 to 55 to 10Hz for 1 minute

Total Amplitude：1.5mm

Chip coil shall not be damaged.

Testing Time：A period of 2 hours in each of 3 mutually

perpendicular directions. (Total 6 hours)

7.4 Solderability

The wetting area of the electrode

shall be at least 90% covered with

new solder coating.

Flux：Ethanol solution of rosin, 25(wt)%

(Immersed for 5s to 10s)

Solder：Sn-3.0Ag-0.5Cu

Pre-Heating：150±10°C / 60 to 90seconds

Solder Temperature：240±5°C

Immersion Time：3±1 s

7.5 Resistance to

Soldering Heat

Appearance：No damage

Inductance Change：within ±5%

Flux：Ethanol solution of rosin, 25(wt)%

(Immersed for 5s to 10s)

Solder：Sn-3.0Ag-0.5Cu

Pre-Heating：150±10°C / 60 to 90seconds

Solder Temperature：270±5°C

Immersion Time：10±1 s

Then measured after exposure in the room condition for

24±2 hours.

8.Environmental Performance (It shall be soldered on the substrate.)

No.

Item

Specification

Test Method

8.1 Heat Resistance

8.2 Cold Resistance

8.3 Humidity

Appearance：No damage

Inductance Change：within ± 5%

DC Resistance Change：within ± 5%

Temperature：85±2°C

Time：1000h (+48h , -0h)

Then measured after exposure in the room condition for

24±2 hours.

Temperature：-40±2°C

Time：1000h (+48h , -0h)

Then measured after exposure in the room condition for

24±2 hours.

Temperature：40±2°C

Humidity：90 to 95%(RH)

Time：1000h (+48h , -0h)

Then measured after exposure in the room condition for

24±2 hours.

8.4 Temperature

Cycle

1 cycle：

1 step：-40±2°C / 30±3 minutes

2 step：Ordinary temp. / 10 to 15 minutes

3 step：+85±2°C / 30±3 min

4 step：Ordinary temp. / 10 to 15 minutes

Total of 10 cycles

Then measured after exposure in the room condition for

24±2 hours.

MURATA MFG.CO., LTD

SpecNo.JELF243A-0047W-01

P4/8

Reference Onl

9. Specification of Packaging

9.1 Appearance and Dimensions of plastic tape

+0.1

2.0±0.05

4.0±0.1



1.5

-0

(0.4)

0.4±0.1

6.7±0.1

8.0±0.1

(in mm)

Direction of feed

5.6±0.2

Dimension of the Cavity is measured at the bottom side.

9.2 Specification of Taping

(1) Packing quantity (standard quantity)

350 pcs / reel

(2) Packing Method

Products shall be packed in the each embossed cavity of plastic tape and sealed by cover tape.

(3) Sprocket hole

The sprocket holes are to the right as the tape is pulled toward the user.

(4) Spliced point

Plastic tape and Cover tape has no spliced point.

(5) Missing components number

Missing components number within 0.025 % of the number per reel or 1 pc., whichever is greater, and are

not continuous. The specified quantity per reel is kept.

9.3 Pull Strength

Embossed carrier tape

10N min.

5N min.

Cover tape

9.4 Peeling off force of cover tape

165 to 180 degree

Cover tape

Plastic tape

Speed of Peeling off

300 mm / min

0.1 to 0.5N

(minimum value is typical)

Peeling off force

9.5 Dimensions of Leader-tape, Trailer and Reel

There shall be leader-tape (cover tape) and trailer-tape (empty tape) as follows.

Trailer : 160 min.

2.0±0.5

Leader

190 min

Empty tape Cover tape

Label

210 min

13.0±0.2



60±¹₀

13.0±¹₀

17.0±1.4



21.0±0.8

Direction of feed

(in mm)



180± ⁰₃

MURATA MFG.CO., LTD

SpecNo.JELF243A-0047W-01

P5/8

Reference Onl

9.6 Marking for reel

Customer part number, MURATA part number, Inspection number(1), RoHS marking(2), Quantity etc ･･･

1) <Expression of Inspection No.>

□□OOOO 

(1) (2) (3)

(1) Factory Code

(2) Date

First digit

Second digit

: Year / Last digit of year

: Month / Jan. to Sep.  1 to 9, Oct. to Dec.  O, N, D

Third, Fourth digit : Day

(3) Serial No.

2) « Expression of RoHS marking »

ROHS – Y (△)

(1) (2)

(1) RoHS regulation conformity

(2) MURATA classification number

9.7 Marking for Outside package (corrugated paper box)

Customer name, Purchasing order number, Customer part number, MURATA part number, RoHS Marking (2) ,

Quantity, etc ･･･

9.8. Specification of Outer Case

Outer Case Dimensions (mm)

Standard Reel Quantity

in Outer Case (Reel)

Label

186

Above Outer Case size is typical. It depends on a quantity of an order

10.

Caution

10.1 Limitation of Applications

Please contact us before using our products for the applications listed below which require especially high reliability for

the prevention of defects which might directly cause damage to the third party's life, body or property.

(1) Aircraft equipment

(6) Transportation equipment (vehicles, trains, ships, etc.)

(7) Traffic signal equipment

(8) Disaster prevention / crime prevention equipment

(9) Data-processing equipment

(10) Applications of similar complexity and /or reliability requirements

to the applications listed in the above

(2) Aerospace equipment

(3) Undersea equipment

(4) Power plant control equipment

(5) Medical equipment

10.2 Corrosive gas

Please refrain from use since contact with environments with corrosive gases (sulfur gas [hydrogen sulfide, sulfur

dioxide, etc.], chlorine, ammonia, etc.) or oils (cutting oil, silicone oil, etc.) that have come into contact with the previously

stated corrosive gas environment will result in deterioration of product quality or an open from deterioration due to

corrosion of product electrode, etc. We will not bear any responsibility for use under these environments.

11. Notice

This product is designed for solder mounting.

Please consult us in advance for applying other mounting method such as conductive adhesive.

11.1 Land pattern designing (Reflow Soldering)

Recommended land pattern for reflow soldering is as follows:

It has been designed for Electric characteristics and solderability.

Please follow the recommended patterns. Otherwise, their performance which includes electrical performance or

solderability may be affected, or result to "position shift" in soldering process.

8.0

3.0

2.0

3.0

in mm

MURATA MFG.CO., LTD

SpecNo.JELF243A-0047W-01

P6/8

Reference Onl

11.2 Flux, Solder

・Use rosin-based flux.

Flux

・Don’t use highly acidic flux with halide content exceeding 0.2(wt)% (chlorine conversion value).

・Don’t use water-soluble flux.

・Use Sn-3.0Ag-0.5Cu solder

・Standard thickness of solder paste : 200μm to 300μm

Solder

Other flux (except above) Please contact us for details, then use.

11.3 soldering conditions (Reflow)

・Pre-heating should be in such a way that the temperature difference between solder and product surface is limited

to 150°C max. Cooling into solvent after soldering also should be in such a way that the temperature difference is

limited to 100°C max.

Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of product quality.

・Standard soldering profile and the limit soldering profile is as follows.

The excessive limit soldering conditions may cause leaching of the electrode and / or resulting

in the deterioration of product quality.

Temp.

(℃)

260℃

230℃

Limit Profile

245℃±3℃

220℃

180

150

Standard Profile

30s～60s

60s max.

90s±30s

Time.(s)

Standard Profile

Limit Profile

Pre-heating

150～180°C 、90s±30s

Heating

above 220°C、30s～60s

245±3°C

above 230°C、60s max.

260°C, 10s

Peak temperature

Cycle of reflow

2 times

1 time

11.4 Reworking with soldering iron.

The following conditions must be strictly followed when using a soldering iron.

Pre-heating

150°C,1 min

350°C max.

80W max.

φ3mm max.

3(+1,-0)s

Tip temperature

Soldering iron output

Tip diameter

Soldering time

Times

2 times

Note : Do not directly touch the products with the tip of the soldering iron in order to prevent the crack on the products

due to the thermal shock.

11.5 Solder Volume

・Solder shall be used not to be exceeded the upper limits as shown below.

・Accordingly increasing the solder volume, the mechanical stress to Chip is also increased.

Exceeding solder volume may cause the failure of mechanical or electrical performance.

Upper Limit

Recommendable

1/3T≦t≦T

(T: Lower flange thickness)

T t

MURATA MFG.CO., LTD

SpecNo.JELF243A-0047W-01

P7/8

Reference Onl

11.6 Product's location

The following shall be considered when designing and laying out P.C.B.’s.

(1) P.C.B. shall be designed so that products are not subject to the mechanical stress due to warping the board.

［Products direction］

Products shall be located in the sideways

direction (Length:a

stress.

<b) to the mechanical

Poor example

〈

〉

Good example

〈

〉

(2) Components location on P.C.B. separation.

It is effective to implement the following measures, to reduce stress in separating the board.

It is best to implement all of the following three measures; however, implement as many measures as possible

to reduce stress.

Contents of Measures

Stress Level

(1) Turn the mounting direction of the component parallel to

the board separation surface.

D 1

(2) Add slits in the board separation part.

(3) Keep the mounting position of the component away from

the board separation surface.

Seam

1 A > D is valid when stress is added vertically to

the perforation as with Hand Separation.

If a Cutting Disc is used, stress will be diagonal to

the PCB, therefore A > D is invalid.

Slit



Length:a b

(3) Mounting Components Near Screw Holes

When a component is mounted near a screw hole,

it may be affected by the board deflection that occurs

during the tightening of the screw. Mount the component

in a position as far away from the screw holes as possible.

Recommended

Screw Hole

11.7 Cleaning Conditions

Products shall be cleaned on the following conditions.

(1) Cleaning temperature shall be limited to 40°C max.

(2) Ultrasonic cleaning shall comply with the following conditions with avoiding the resonance phenomenon at

the mounted products and P.C.B..

Power : 20 W / l max.

(3) Cleaner

Frequency : 28kHz to 40kHz

Time : 5 minutes max.

1. Alternative cleaner

・Isopropyl alcohol (IPA)

2. Aqueous agent

Aqueous agent should not be used because it may cause quality deterioration.

(4) Other cleaning

Please contact us.

11.8 Resin coating

The inductance value may change due to high cure-stress of resin to be used for coating/molding products. An open

circuit issue may occur by mechanical stress caused by the resin, amount/cured shape of resin, or operating condition

etc. Some resin contains some impurities or chloride possible to generate chlorine by hydrolysis under some operating

condition may cause corrosion of wire of coil, leading to open circuit. So, please pay your careful attention when you

select resin in case of coating/molding the products with the resin. Prior to use the coating resin, please make sure no

reliability issue is observed by evaluating products mounted on your board.

11.9 Caution for use

Sharp material such as a pair of tweezers or other material such as bristles of cleaning brush, shall not be touched to the

winding portion to prevent the breaking of wire.

MURATA MFG.CO., LTD

SpecNo.JELF243A-0047W-01

P8/8

Reference Onl

11.10 Handling of a substrate

After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the

substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to

the substrate.

Excessive mechanical stress may cause cracking in the product.

Bending

Twisting

11.11 Storage and Handling Requirements

(1) Storage period

Use the products within 12 months after delivered.

Solderability should be checked if this period is exceeded.

(2) Storage conditions

・Products should be stored in the warehouse on the following conditions.

Temperature : -10 ~ 40°C

Humidity

: 15 to 85% relative humidity No rapid change on temperature and humidity

・The electrode of the products is coated with solder. Don't keep products in corrosive gases such as

sulfur,chlorine gas or acid, or it may cause oxidization of electrode, resulting in poor solderability.

・Products should not be stored on bulk packaging condition to prevent the chipping of the core and the

breaking of winding wire caused by the collision between the products.

・Products should be stored on the palette for the prevention of the influence from humidity, dust and so on.

・Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on.

(3) Handling Condition

Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock.

12.

Note

(1) Please make sure that your product has been evaluated in view of your specifications with our product being

mounted to your product.

(2) You are requested not to use our product deviating from the reference specifications.

(3) The contents of this reference specification are subject to change without advance notice.

Please approve our product specifications or transact the approval sheet for product specifications before ordering.

MURATA MFG.CO., LTD

LQH66SNR27M03# [MURATA]

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