LQH43NH122J03# [MURATA]
;Spec No. JELF243A-9150B-01
P.1/9
CHIP COIL(CHIP INDUCTORS)LQH43NH□□□□03L
Murata Standard Reference Specification【AEC-Q200】
1.Scope
This reference specification applies to LQH43NH series, Chip coil (Chip Inductors) for automotive Electronics based on
AEC-Q200 .
2.Part Numbering
(ex)
LQ
H
43
N
H
1R0
M
0
3
L
Product ID Structure Dimension Applications
Category Inductance Tolerance Features Electrode Packaging
(L×W)
and
L:Taping
Characteristics
3.Rating
・Operating Temperature Range.
–40 °C to +125 °C
・Storage Temperature Range.
–40 °C to +125 °C
Self
Inductance
Q
DC Resistance
ESD
5A:
8kV
1:Rated
Current
(mA)
Customer’s
MURATA
Resonant
Frequency
(MHz min)
Tolerance
Tolerance
(%)
Part Number
Part Number
(min.)
(H)
()
(%)
LQH43NH1R0M03L
LQH43NH1R2K03L
LQH43NH1R5J03L
LQH43NH1R8J03L
LQH43NH2R2J03L
LQH43NH2R7J03L
LQH43NH3R3J03L
LQH43NH3R9J03L
LQH43NH4R7J03L
LQH43NH5R6J03L
LQH43NH6R8J03L
LQH43NH8R2J03L
LQH43NH100J03L
LQH43NH120J03L
LQH43NH150J03L
LQH43NH180J03L
LQH43NH220J03L
LQH43NH270J03L
LQH43NH330J03L
LQH43NH390J03L
LQH43NH470J03L
LQH43NH560J03L
LQH43NH680J03L
LQH43NH820J03L
LQH43NH101J03L
LQH43NH121J03L
LQH43NH151J03L
1.0
1.2
1.5
1.8
2.2
2.7
3.3
3.9
4.7
5.6
6.8
8.2
10
M: ±20
K: ±10
0.033
0.043
0.049
0.043
0.049
0.053
0.077
0.12
0.090
0.11
0.18
0.18
0.20
0.25
0.30
0.35
0.47
0.60
0.70
0.80
0.87
1.34
1.52
1.70
2.00
2.60
3.00
120
100
85
75
62
53
47
41
38
33
31
27
23
21
19
17
15
14
12
11
10
9.3
8.4
7.5
6.8
6.2
5.5
1300
1100
1000
1050
1000
950
800
650
750
650
530
530
480
420
390
365
300
280
250
230
210
180
170
165
150
130
120
20
25
30
12
±20
5A
15
J: ±5
18
22
27
35
33
39
47
56
68
82
100
120
150
40
MURATA MFG.CO., LTD
Spec No. JELF243A-9150B-01
Customer’s
P.2/9
Self
Inductance
Tolerance
DC Resistance
ESD
1:Rated
Current
(mA)
MURATA
Q
(min.)
Resonant
Frequency
(MHz min)
5A:
Tolerance
Part Number
Part Number
(H)
()
8kV
(%)
(%)
LQH43NH181J03L
LQH43NH221J03L
LQH43NH271J03L
LQH43NH331J03L
LQH43NH391J03L
LQH43NH471J03L
LQH43NH561J03L
LQH43NH681J03L
LQH43NH821J03L
180
220
270
330
390
470
560
680
820
3.40
3.80
5.50
6.20
6.90
7.80
11.3
12.9
14.5
15.5
20.3
23.7
26.7
30.6
5.0
4.5
4.0
3.6
3.3
3.0
2.7
2.5
2.2
2.0
1.8
1.6
1.5
1.3
110
100
90
85
80
75
60
55
50
45
40
35
35
30
J: ±5
40
±20
5A
LQH43NH102J03L 1000
LQH43NH122J03L 1200
LQH43NH152J03L 1500
LQH43NH182J03L 1800
LQH43NH222J03L 2200
*1:When applied Rated current to the Products, self temperature rise shall be limited to 20°C max and Inductance will be within
±10% of nominal value.
4. Testing Conditions
《Unless otherwise specified》
《In case of doubt》
Temperature
Humidity
Temperature : Ordinary Temperature / 15°C to 35°C
Humidity
: 20 ± 2°C
: 60%(RH) to 70%(RH)
: Ordinary Humidity / 25%(RH) to 85%(RH)
Atmospheric Pressure : 86kPa to 106 kPa
5.Appearance and Dimensions (No marking)
3.6±0.2
3.2±0.2
A
3.2±0.2
4.5±0.3
A: 3.5max.
■
Unit Mass (Typical value)
0.13g
No Marking.
(in mm)
1.0 min. 1.0 min. 1.0 min.
MURATA MFG.CO., LTD
Spec No. JELF243A-9150B-01
P.3/9
6. Electrical Performance
No.
Item
Specification
Test Method
Measuring Equipment:
KEYSIGHT 4192A or equivalent
Measuring Frequency:
6.1 Inductance
Inductance shall meet item 3.
1MHz / 1.0 to 390μH
1kHz / 470 to 2200μH
6.2
Q
Q shall meet item 3.
Measuring Equipment:
KEYSIGHT 4192A or equivalent
Measuring Frequency:
1MHz / 1.0 to 82μH
796kHz / 100 to 820μH
252kHz / 1000 to 2200μH
6.3 DC Resistance
6.4 Self Resonant
Frequency(S.R.F)
DC Resistance shall meet item 3.
S.R.F shall meet item 3.
Measuring Equipment:Digital multi meter
Measuring Equipment:
KEYSIGHT E4991A or equivalent
7. AEC-Q200 Requirement
7.1 Performance (based on Table 5 for Magnetics(Inductors / Transformer)
AEC-Q200 Rev.D issued June. 1 2010
AEC-Q200
Murata Specification / Deviation
Meet Table A after testing.
No
Stress
Test Method
3
High
1000hours at 125 deg C
Set for 24hours at room
temperature, then measured.
Temperature
Exposure
Table A
Appearance
No damage
Within ±10%
Inductance change
4
Temperature
Cycling
1000cycles
Meet Table A after testing.
-40 deg C to + 125 deg C
Set for 24hours at room
temperature,then measured.
7
8
Biased Humidity
Operational Life
1000hours at 85 deg C, 85%RH Meet Table A after testing.
unpowered.
Apply 125 deg C 1000 hours
Set for 24hours at room
Meet Table A after testing.
temperature, then measured
9
External Visual
Visual inspection
No abnormalities
No defects
10 Physical Dimension Meet ITEM 5
(Appearance and Dimensions)
12 Resistance
to Solvents
Per
MIL-STD-202
Method 215
Not Applicable
13 Mechanical Shock Per MIL-STD-202
Method 213
Meet Table A after testing.
100g’s/6ms/Half sine
14 Vibration
5g's for 20 minutes,
12cycles eah of 3 orientations
Test from 10-2000Hz.
Meet Table A after testing.
Meet Table A after testing.
12cycles each of 3 orientations
15 Resistance
No-heating
to Soldering Heat
Solder temperature
260C+/-5 deg C
Immersion time 10s
17 ESD
Per AEC-Q200-002
Meet Item 3 (Rating)
No defects
18 Solderbility
Per J-STD-002
Method B : Not Applicable
95% of the terminations is to be soldered.
(Except exposed wire)
19 Electrical
Measured : Inductance
No defects
Characterization
MURATA MFG.CO., LTD
Spec No. JELF243A-9150B-01
P.4/9
AEC-Q200
Murata Specification / Deviation
Not Applicable
No
Stress
Test Method
20 Flammability
Per UL-94
21 Board Flex
Epoxy-PCB(1.6mm)
Deflection 2mm(min)
60s minimum holding time
Murata deviation request: 5s
Meet Table B after testing.
Table B
Appearance
No damage
Within ±10%
DC resistance change
22 Terminal Strength Per AEC-Q200-006
A force of 17.7N for 60s
No defects
8. Specification of Packaging
8.1 Appearance and Dimensions of plastic tape
1.5+0.1
Lead-in/out wire
※
-0
(0.3)
0305
The packing directions of the chip coil
※
in taping are unified with the in/out
positions of the lead wire.
4.0±0.1
8.0±0.1
2.7±0.2
3.6
3.6±0.1
2.0±0.05
Direction of feed
Dimension of the Cavity is measured at the bottom side.
8.2 Specification of Taping
(1) Packing quantity (standard quantity)
500 pcs / reel
(2) Packing Method
Products shall be packed in the each embossed cavity of plastic tape and sealed by cover tape.
(3) Sprocket hole
The sprocket holes are to the right as the tape is pulled toward the user.
(4) Spliced point
Plastic tape and Cover tape has no spliced point.
(5) Missing components number
Missing components number within 0.025 % of the number per reel or 1 pc., whichever is greater, and are
not continuous. The specified quantity per reel is kept.
8.3 Pull Strength
Plastic tape
Cover tape
10N min.
5N min.
8.4 Peeling off force of cover tape
165 to 180 degree
F
Cover tape
Plastic tape
Speed of Peeling off
300mm / min
0.2N to 0.7N
(minimum value is typical)
Peeling off force
MURATA MFG.CO., LTD
Spec No. JELF243A-9150B-01
P.5/9
8.5 Dimensions of Leader-tape, Trailer and Reel
There shall be leader-tape (cover tape) and trailer-tape (empty tape) as follows.
Trailer : 160 min.
Leader
190 min
Empty tape Cover tape
2.0±0.5
210 min
Label
13.0±0.2
60±1
0
21.0±0.8
13.0±10
17.0±1.4
Direction of feed
180± 0
(in mm)
3
8.6 Marking for reel
Customer part number, MURATA part number, Inspection number(1), RoHS marking(2), Quantity etc ・・・
1) <Expression of Inspection No.>
□□OOOO
(1) (2) (3
)
(1) Factory Code
(2) Date
First digit
Second digit
: Year / Last digit of year
: Month / Jan. to Sep. 1 to 9, Oct. to Dec. O, N, D
Third, Fourth digit : Day
(3) Serial No.
2) « Expression of RoHS marking »
ROHS – Y (△)
(1) (2)
(1) RoHS regulation conformity
(2) MURATA classification number
8.7 Marking for Outside package (corrugated paper box)
Customer name, Purchasing order number, Customer part number, MURATA part number,
RoHS marking (2) ,Quantity, etc ・・・
8.8. Specification of Outer Case
Outer Case Dimensions (mm)
Standard Reel Quantity
in Outer Case (Reel)
Label
W
D
H
H
186
186
93
5
Above Outer Case size is typical. It depends on a quantity
of an order
D
W
MURATA MFG.CO., LTD
Spec No. JELF243A-9150B-01
P.6/9
9.
Caution
9.1 Limitation of Applications
Please contact us before using our products for the applications listed below which require especially high
reliability for the prevention of defects which might directly cause damage to the third party's life, body or property.
(1) Aircraft equipment
(6) Disaster prevention / crime prevention equipment
(7) Traffic signal equipment
(8) Transportation equipment (trains, ships, etc.)
(9) Applications of similar complexity and /or reliability
requirements to the applications listed in the above
(2) Aerospace equipment
(3) Undersea equipment
(4) Power plant control equipment
(5) Medical equipment
9.2 Caution(Rating)
Do not exceed maximum rated current of the product. Thermal stress may be transmitted to the product and
short/open circuit of the product or falling off the product may be occurred.
9.3 Fail-safe
Be sure to provide an appropriate fail-safe function on your product to prevent a second
damage that may be caused by the abnormal function or the failure of our product.
9.4 Corrosive gas
Please refrain from use since contact with environments with corrosive gases (sulfur gas [hydrogen sulfide, sulfur
dioxide, etc.], chlorine, ammonia, etc.) or oils (cutting oil, silicone oil, etc.) that have come into contact with the
previously stated corrosive gas environment will result in deterioration of product quality or an open from deterioration
due to corrosion of product electrode, etc. We will not bear any responsibility for use under these environments.
10. Notice
This product is designed for solder mounting.
Please consult us in advance for applying other mounting method such as conductive adhesive.
10.1 Land pattern designing
Recommended land patterns for reflow soldering are as follows:
It has been designed for Electric characteristics and solderability.
Please follow the recommended pattern. Otherwise, their performance which includes electrical performance or
solderability may be affected, or result to "position shift" in soldering process.
Reflow Soldering
4.5
0.3
1.2
(in mm)
1.5
1.5
7.5
1.5
10.2 Flux, Solder
・Use rosin-based flux.
・Don’t use highly acidic flux with halide content exceeding 0.2(wt)% (chlorine conversion
Flux
value).
・Don’t use water-soluble flux.
・Use Sn-3.0Ag-0.5Cu solder
・Standard thickness of solder paste : 200μm to 300μm
Solder
Other flux (except above) Please contact us for details, then use.
MURATA MFG.CO., LTD
Spec No. JELF243A-9150B-01
P.7/9
10.3 Reflow soldering conditions
・Pre-heating should be in such a way that the temperature difference between solder and product surface is limited
to 150°C max. Cooling into solvent after soldering also should be in such a way that the temperature difference is
limited to 100°C max.
Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of products quality.
・Standard soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and / or resulting in the deterioration of
product quality.
・Reflow soldering profile
Temp.
(℃)
260℃
230℃
Limit Profile
245℃±3℃
220℃
180
150
Standard Profile
30s~60s
60s max.
90s±30s
Time.(s)
Standard Profile
Limit Profile
Pre-heating
150~180°C 、90s±30s
above 220°C、30s~60s above 230°C、60s max.
Heating
Peak temperature
Cycle of reflow
245±3°C
2 times
260°C,10s
2time
10.4 Reworking with soldering iron.
The following conditions must be strictly followed when using a soldering iron.
Pre-heating
150°C,1 min
350°C max.
80W max.
φ3mm max.
3(+1,-0)s
Tip temperature
Soldering iron output
Tip diameter
Soldering time
Times
2 times
Note : Do not directly touch the products with the tip of the soldering iron in order to prevent the crack on the
products due to the thermal shock.
10.5 Solder Volume
・Solder shall be used not to be exceeded the upper limits as shown below.
・Accordingly increasing the solder volume, the mechanical stress to Chip is also increased.
Exceeding solder volume may cause the failure of mechanical or electrical performance.
Upper Limit
1/3T≦t≦T
T: Lower flange thickness
Recommendable
T
t
MURATA MFG.CO., LTD
Spec No. JELF243A-9150B-01
P.8/9
10.6 Product’s location
The following shall be considered when designing and laying out P.C.B.'s.
(1) P.C.B. shall be designed so that products are not subject to the mechanical stress due to warping the board.
[Products direction]
Electrode
The electorode part of the products should be
located like the picture to the mechanical stress.
(Good example)
(Poor example)
Electrode
(2) Components location on P.C.B. separation.
It is effective to implement the following measures, to reduce stress in separating the board.
It is best to implement all of the following three measures; however, implement as many measures
as possible to reduce stress.
Contents of Measures
Stress Level
(1) Turn the mounting direction of the component parallel to
the board separation surface.
A
A
A
>
>
>
D 1
B
(2) Add slits in the board separation part.
(3) Keep the mounting position of the component away from
the board separation surface.
C
C
Seam
A
B
1 A > D is valid when stress is added vertically to
the perforation as with Hand Separation.
If a Cutting Disc is used, stress will be diagonal to
the PCB, therefore A > D is invalid.
Electrode
Electrode
D
Slit
(3) Mounting Components Near Screw Holes
When a component is mounted near a screw hole,
it may be affected by the board deflection that occurs
during the tightening of the screw. Mount the component
in a position as far away from the screw holes as possible.
Recommended
Screw Hole
10.7 Cleaning Conditions
Products shall be cleaned on the following conditions.
(1) Cleaning temperature shall be limited to 60°C max.(40°C max for alcohol type cleaner.)
(2) Ultrasonic cleaning shall comply with the following conditions with avoiding the resonance phenomenon at
the mounted products and P.C.B.
Power : 20 W / l max.
(3) Cleaner
Frequency : 28kHz to 40kHz
Time : 5 min max.
1. Alternative cleaner
・Isopropyl alcohol (IPA)
2. Aqueous agent
・PINE ALPHA ST-100S
(4) There shall be no residual flux and residual cleaner after cleaning.
In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized water in
order to remove the cleaner.
(5) Other cleaning
Please contact us.
MURATA MFG.CO., LTD
Spec No. JELF243A-9150B-01
P.9/9
10.8 Resin coating (moistureproof coating)
Do not make any resin coating.
The inductance value may change due to high cure-stress of resin to be used for coating/molding products. An open
circuit issue may occur by mechanical stress caused by the resin, amount/cured shape of resin, or operating condition
etc. Some resin contains some impurities or chloride possible to generate chlorine by hydrolysis under some operating
condition may cause corrosion of wire of coil, leading to open circuit.
10.9 Caution for use
・Sharp material such as a pair of tweezers or other material such as bristles of cleaning brush, shall not be touched to the
winding portion to prevent the breaking of wire.
・Mechanical shock should not be applied to the products mounted on the board to prevent the breaking of the core
10.10 Handling of a substrate
After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the
substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to
the substrate.
Excessive mechanical stress may cause cracking in the product.
Bending
Twisting
10.11 Storage and Handing Requirements
(1) Storage period
Use the products within 12 months after delivered.
Solderability should be checked if this period is exceeded.
(2) Storage conditions
・Products should be stored in the warehouse on the following conditions.
Temperature
Humidity
:
-10 °C to 40 °C
:
15 % to 85 % relative humidity No rapid change on temperature and humidity
The electrode of the products is coated with solder. Don't keep products in corrosive gases
such as sulfur,chlorine gas or acid, or it may cause oxidization of electrode, resulting in
poor solderability.
・Products should not be stored on bulk packaging condition to prevent the chipping of the core and the breaking
of winding wire caused by the collision between the products.
・Products should be stored on the palette for the prevention of the influence from humidity, dust and so on.
・Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on.
(3) Handling Condition
Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock.
11.
Note
(1) Please make sure that your product has been evaluated in view of your specifications with our product being mounted to
your product.
(2) You are requested not to use our product deviating from the agreed specifications.
(3) The contents of this reference specification are subject to change without advance notice. Please approve our
product specifications or transact the approval sheet for product specifications before ordering.
MURATA MFG.CO., LTD
相关型号:
LQH43NH1R2K03L
General Purpose Inductor, 1.2uH, 10%, 1 Element, Ferrite-Core, SMD, CHIP, 1812
MURATA
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