LQH43CN4R7M03# [MURATA]
;型号: | LQH43CN4R7M03# |
厂家: | muRata |
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文件: | 总9页 (文件大小:253K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
SpecNo.JELF243A-0042R-01
P1/8
CHIP COIL(CHIP INDUCTORS)LQH43CN□□□□03L REFERENCE SPECIFICATION
1.Scope
This reference specification applies to Chip coil (Chip Inductors) LQH43CN_03 Series.
2.Part Numbering
(ex)
LQ
Product ID Structure Dimension Applications
(L×W) and Characteristics
H
43
C
N
1R0
Category Inductance Tolerance Features Electrode Packaging
L:Taping
M
0
3
L
3.Rating
Operating Temperature Range
Storage Temperature Range
-40 to +85°C
-40 to +85°C
Inductance
Self
DC
Resistance
( max.)
Customer
MURATA
Part Number
*Rated
Current
(mA)
Resonant
Frequency
(MHz min.)
Tolerance
(%)
Part Number
(H)
LQH43CN1R0M03L
LQH43CN1R5M03L
LQH43CN2R2M03L
LQH43CN3R3M03L
LQH43CN4R7M03L
LQH43CN6R8M03L
LQH43CN100K03L
LQH43CN150K03L
LQH43CN220K03L
LQH43CN330K03L
LQH43CN470K03L
LQH43CN680K03L
LQH43CN101K03L
LQH43CN151K03L
LQH43CN221K03L
LQH43CN331K03L
LQH43CN471K03L
1.0
1.5
2.2
3.3
4.7
6.8
10
0.08
0.09
0.11
0.13
0.15
0.20
0.24
0.32
0.60
1.0
100
85
1080
1000
900
800
750
720
650
570
420
310
280
220
190
130
110
100
90
60
M:±20
47
35
30
23
15
20
22
15
33
12
47
1.1
10
68
K:±10
1.7
8.4
6.8
5.5
4.5
3.6
3.0
100
150
220
330
470
2.2
3.5
4.0
6.8
8.5
*When applied Rated current to the Products, Inductance will be within ±10% of initial Inductance value.
When applied Rated current to the Products, temperature rise caused by self-generated heat shall be limited to 20°C max.
4. Testing Conditions
<Unless otherwise specified>
<In case of doubt>
Temperature : 20 ± 2°C
Humidity : 60 to 70 %(RH)
Atmospheric Pressure : 86 to 106 kPa
Temperature : Ordinary Temperature (15 to 35°C)
Humidity
: Ordinary Humidity
(25 to 85 %(RH))
MURATA MFG.CO., LTD
SpecNo.JELF243A-0042R-01
P2/9
5.Appearance and Dimensions
3.2±0.2
3.6±0.2
■Unit Mass (Typical value)
0.13g
3.2±0.2
4.5±0.3
(in mm)
No marking.
※
1.0 min.
1.0 min.
1.0 min.
6.Electrical Performance
No. Item
Specification
Inductance shall meet item 3.
Test Method
Measuring Equipment:
KEYSIGHT 4192A or equivalent
Measuring Frequency:
6.1 Inductance
1MHz/1.0 to 330H
1kHz/470H
6.2 DC Resistance
6.3 Self Resonant
Frequency(S.R.F)
DC Resistance shall meet item 3.
S.R.F shall meet item 3.
Measuring Equipment:Digital multi meter
Measuring Equipment:
KEYSIGHT E4991A or equivalent
7.Mechanical Performance
No.
Item
Specification
Test Method
7.1 Shear Test
Chip coil shall not be damaged.
Substrate: Glass-epoxy substrate
Chip Coil
Applied Direction :
F
Force: 20N
Hold Duration: 5±1 s
Substrate
7.2 Bending Test
Substrate: Glass-epoxy substrate
(100 40 1.6mm)
Speed of Applying Force: 1mm / s
Deflection: 2mm
Hold Duration: 30 s
Pressure jig
R340
F
Deflection
45
45
Product
(in mm)
7.3 Vibration
Oscillation Frequency:
10 to 55 to 10Hz for 1 minute
Total Amplitude: 1.5mm
Testing Time:
A period of 2 hours in each of 3 mutually
perpendicular directions.
(Total 6 hours)
7.4 Solderability
The wetting area of the electrode
shall be at least 90% covered with
new solder coating.
Flux: Ethanol solution of rosin, 25(wt)%
(Immersed for 5s to 10s)
Solder: Sn-3.0Ag-0.5Cu
Pre-Heating: 150±10°C / 60 to 90seconds
Solder Temperature: 240±5°C
Immersion Time: 3±1 s
MURATA MFG.CO., LTD
SpecNo.JELF243A-0042R-01
No. Item
P3/9
Specification
Appearance:No damage
Inductance Change : within ± 5%
Test Method
Flux: Ethanol solution of rosin, 25(wt)%
(Immersed for 5s to 10s)
7.5 Resistance to
Soldering Heat
Solder: Sn-3.0Ag-0.5Cu
Pre-Heating: 150±10°C / 60 to 90seconds
Solder Temperature: 270±5°C
Immersion Time: 10±1 s
Then measured after exposure in the room
condition for 24±2 hours.
8.Environmental Performance (It shall be soldered on the substrate.)
No.
Item
Specification
Test Method
8.1 Heat Resistance
8.2 Cold Resistance
8.3 Humidity
Appearance:No damage
Inductance Change : within ±5%
Temperature: 85±2°C
48
0
Time: 1000±
hours
Then measured after exposure in the room
condition for 24±2 hours.
Temperature: -40±2°C
48
0
Time: 1000±
hours
Then measured after exposure in the room
condition for 24±2 hours.
Temperature: 40±2°C
Humidity: 90 to 95%(RH)
48
Time: 1000±
hours
Then measure0 d after exposure in the room
condition for 24±2 hours.
8.4 Temperature
1 cycle:
Cycle
step 1 : -40±2°C / 30±3 min
step 2 : Ordinary temp. / 10 to 15 min
step 3 : +85±2°C / 30±3 min
step 4 : Ordinary temp. / 10 to 15 min
Total of 10 cycles
Then measured after exposure in the room
condition for 24±2 hours.
9. Specification of Packaging
9.1 Appearance and Dimensions of plastic tape
Dimension of the Cavity is measured at the bottom side.
9.2 Specification of Taping
(1) Packing quantity (standard quantity)
500 pcs / reel
(2) Packing Method
Products shall be packed in the each embossed cavity of plastic tape and sealed by cover tape.
(3) Sprocket hole
The sprocket holes are to the right as the tape is pulled toward the user.
(4) Spliced point
Plastic tape and Cover tape has no spliced point.
(5) Missing components number
Missing components number within 0.025% of the number per reel or 1 pc., whichever is greater,
and are not continuous. The specified quantity per reel is kept.
MURATA MFG.CO., LTD
SpecNo.JELF243A-0042R-01
P4/9
9.3 Pull Strength
Embossed carrier tape
Cover tape
10N min.
5N min.
9.4 Peeling off force of cover tape
165 to 180 degree
F
Cover tape
Plastic tape
Speed of Peeling off
300mm/min
0.2 to 0.7N
(minimum value is typical)
Peeling off force
9.5 Dimensions of Leader-tape, Trailer and Reel
There shall be leader-tape (cover tape) and trailer-tape (empty tape) as follows.
Trailer : 160 min.
Leader
190 min
Empty tape Cover tape
2.0±0.5
210 min
Label
13.0±0.2
60±1
0
21.0±0.8
13.0±10
17.0±1.4
Direction of feed
180± 0
(in mm)
3
9.6 Marking for reel
Customer part number, MURATA part number, Inspection number(1), RoHS marking(2), Quantity etc ・・・
1) <Expression of Inspection No.>
□□ OOOO
(1)
(2)
(3)
(1) Factory Code
(2) Date
First digit
: Year / Last digit of year
Second digit
Third, Fourth digit : Day
: Month / Jan. to Sep. 1 to 9, Oct. to Dec. O, N, D
(3) Serial No.
2) « Expression of RoHS marking » ROHS – Y (△)
(1) (2)
(1) RoHS regulation conformity parts.
(2) MURATA classification number
9.7 Marking for Outside package (corrugated paper box)
Customer name, Purchasing order number, Customer part number, MURATA part number,
RoHS marking (2) ,Quantity, etc ・・・
9.8. Specification of Outer Case
Outer Case Dimensions
(mm)
Standard Reel Quantity in Outer Case
(Reel)
Label
W
186
D
186
H
93
H
4
D
Above Outer Case size is typical. It depends on a quantity of an order
W
MURATA MFG.CO., LTD
SpecNo.JELF243A-0042R-01
P5/9
10.
Caution
10.1 Limitation of Applications
Please contact us before using our products for the applications listed below which require especially high reliability
for the prevention of defects which might directly cause damage to the third party's life, body or property.
(1) Aircraft equipment
(2) Aerospace equipment
(3)Undersea equipment
(7) Traffic signal equipment
(8) Disaster prevention / crime prevention equipment
(9) Data-processing equipment
(4)Power plant control equipment (10) Applications of similar complexity and /or reliability requirements
(5) Medical equipment to the applications listed in the above
(6) Transportation equipment (vehicles, trains, ships, etc.)
10.2 Corrosive gas
Please refrain from use since contact with environments with corrosive gases (sulfur gas [hydrogen sulfide, sulfur
dioxide, etc.], chlorine, ammonia, etc.) or oils (cutting oil, silicone oil, etc.) that have come into contact with the previously
stated corrosive gas environment will result in deterioration of product quality or an open from deterioration due to
corrosion of product electrode, etc. We will not bear any responsibility for use under these environments.
11. Notice
This product is designed for solder mounting.
Please consult us in advance for applying other mounting method such as conductive adhesive.
11.1 Land pattern designing
Recommended land patterns for flow and reflow soldering are as follows:
These have been designed for Electric characteristics and solderability.
Please follow the recommended patterns. Otherwise, their performance which includes electrical performance or
solderability may be affected, or result to "position shift" in soldering process.
Flow Soldering
Reflow Soldering *
7.5
7.5
Chip Coil
Land
Solder Resist
1.5 1.5 1.5
1.5
(in mm)
* Applicable to flow soldering.
11.2 Flux, Solder
・Use rosin-based flux.
・Don’t use highly acidic flux with halide content exceeding 0.2(wt)% (chlorine conversion
Flux
value).
・ Don’t use water-soluble flux.
・Use Sn-3.0Ag-0.5Cu solder
・Standard thickness of solder paste : 200μm to 300μm
Solder
Other flux (except above) Please contact us for details, then use.
MURATA MFG.CO., LTD
SpecNo.JELF243A-0042R-01
P6/9
11.3 Flow soldering conditions / Reflow soldering conditions
Pre-heating should be in such a way that the temperature difference between solder and product surface
is limited to 150°C max. Cooling into solvent after soldering also should be in such a way that the
temperature difference is limited to 100°C max.
Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of product quality.
Standard soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and / or resultingin the
deterioration of product quality.
soldering profile
(1)Flow soldering profile
Temp.
(℃)
265℃±3℃
250℃
Limit Profile
150
Heating Time
Standard Profile
60s min.
Time.(s)
Standard Profile
Limit Profile
Pre-heating
150°C、60s min.
250°C、4s~6s
2 times
265°C±3°C、5s
Heating
Cycle of flow
1 time
(2)Reflow soldering profile
Temp.
(℃)
260℃
230℃
245℃±3℃
220℃
Limit Profile
180
150
Standard Profile
30s~60s
60s max.
90s±30s
Time.(s)
Standard Profile
Limit Profile
Pre-heating
150~180°C 、90s±30s
above 220°C、30s~60s above 230°C、60s max.
Heating
Peak temperature
Cycle of reflow
245±3°C
260°C,10s
1 time
2 times
MURATA MFG.CO., LTD
SpecNo.JELF243A-0042R-01
P7/9
11.4 Reworking with soldering iron.
The following conditions must be strictly followed when using a soldering iron.
Pre-heating
150°C,1 min
350°C max.
80W max.
3mm max.
3(+1,-0)s
Tip temperature
Soldering iron output
Tip diameter
Soldering time
Times
2 times
Note : Do not directly touch the products with the tip of the soldering iron in order to prevent the crack
on the products due to the thermal shock.
11.5 Solder Volume
Solder shall be used not to be exceeded the upper limits as shown below.
Accordingly increasing the solder volume, the mechanical stress to Chip is also increased.
Exceeding solder volume may cause the failure of mechanical or electrical performance.
Upper Limit
Recommendable
T
t
1/3T≦t≦T
(T: Lower flange thickness)
11.6 Product's location
The following shall be considered when designing and laying out P.C.B.'s.
(1) P.C.B. shall be designed so that products are not subject to the mechanical stress due to warping the board.
[Products direction]
Electrode
Products shall be locatedin the sideways
direction (Length:a b) to the mechanical stress.
(Good example)
Poor example)
Electrode
(2) Components location on P.C.B. separation.
It is effective to implement the following measures, to reduce stress in separating the board.
It is best to implement all of the following three measures; however, implement as many measures
as possible to reduce stress.
Contents of Measures
Stress Level
(1) Turn the mounting direction of the component parallel to
the board separation surface.
A
A
A
>
>
>
D 1
B
(2) Add slits in the board separation part.
(3) Keep the mounting position of the component away from
the board separation surface.
C
C
Seam
1 A > D is valid when stress is added vertically to
the perforation as with Hand Separation.
If a Cutting Disc is used, stress will be diagonal to
the PCB, therefore A > D is invalid.
B
Electrode
Electrode
D
A
Slit
(3) Mounting Components Near Screw Holes
When a component is mounted near a screw hole,
it may be affected by the board deflection that occurs
during the tightening of the screw. Mount the component
in a position as far away from the screw holes as possible.
Recommended
Screw Hole
MURATA MFG.CO., LTD
SpecNo.JELF243A-0042R-01
P8/9
11.7 Cleaning Conditions
Products shall be cleaned on the following conditions.
(1) Cleaning temperature shall be limited to 60°C max.(40°C max for IPA.)
(2) Ultrasonic cleaning shall comply with the following conditions with avoiding the resonance phenomenon at
the mounted products and P.C.B.
Power : 20 W /l max.
(3) Cleaner
Frequency : 28kHz to 40kHz
Time : 5 minutes max.
1. Alternative cleaner
・Isopropyl alcohol (IPA)
2. Aqueous agent
・PINE ALPHA ST-100S
(4) There shall be no residual flux and residual cleaner after cleaning.
In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized water in
order to remove the cleaner.
(5) Other cleaning
Please contact us.
11.8 Resin coating
The inductance value may change due to high cure-stress of resin to be used for coating/molding products.
An open circuit issue may occur by mechanical stress caused by the resin, amount/cured shape of resin, or
operating condition etc. Some resin contains some impurities or chloride possible to generate chlorine by
hydrolysis under some operating condition may cause corrosion of wire of coil, leading to open circuit. So,
please pay your careful attention when you select resin in case of coating/molding the products with the resin.
Prior to use the coating resin, please make sure no reliability issue is observed by evaluating products
mounted on your board.
11.9 Caution for use
・Sharp material such as a pair of tweezers or other material such as bristles of cleaning brush, shall not be touched to
the winding portion to prevent the breaking of wire.
・Mechanical shock should not be applied to the products mounted on the board to prevent the breaking of the core.
11.10 Handling of a substrate
After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to
the substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening
screw to the substrate.
Excessive mechanical stress may cause cracking in the product.
Bending
Twisting
11.11 Storage and Handling Requirements
(1) Storage period
Use the products within 12 months after delivered.
Solderability should be checked if this period is exceeded.
(2) Storage conditions
Products should be stored in the warehouse on the following conditions.
Temperature : -10 ~ 40°C
Humidity
: 15 to 85% relative humidity No rapid change on temperature and humidity
The electrode of the products is coated with solder. Don't keep products in corrosive gases such as sulfur,
chlorine gas or acid, or it may cause oxidization of electrode, resulting in poor solderability.
Products should not be stored on bulk packaging condition to prevent the chipping of the core and the
breaking of winding wire caused by the collision between the products.
Products should be stored on the palette for the prevention of the influence from humidity, dust and so on.
Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on.
(3) Handling Condition
Care should be taken when transporting or handling product to avoid excessive vibration or mechanical
shock.
MURATA MFG.CO., LTD
SpecNo.JELF243A-0042R-01
P9/9
12. Note
(1) Please make sure that your product has been evaluated in view of your specifications with our product being mounted
to your product.
(2) You are requested not to use our product deviating from the reference specifications.
(3) The contents of this reference specification are subject to change without advance notice. Please approve our
product specifications or transact the approval sheet for product specifications before ordering.
MURATA MFG.CO., LTD
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