LQH31CN220K03# [MURATA]

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型号：	LQH31CN220K03#
厂家：	muRata
描述：
文件：	总8页 (文件大小：319K)
中文：	中文翻译
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Reference Only

CHIP COIL（CHIP INDUCTORS）LQH31CN□□□□03L REFERENCE SPECIFICATION

Spec No. JELF243A-0031T-01

P.1/8

1.Scope

This reference specification applies to LQH31CN series, Chip coil (Chip Inductors).

2.Part Numbering

(ex) LQ

Product ID Structure Dimension Applications Category Inductance Tolerance Features Electrode Packaging

(L×W)

R12

and

L:Taping

Characteristics

3.Rating

・Operating Temperature Range

・Storage Temperature Range.

-40 to +85°C

Resistance

(Ω)

Self Resonant

Frequency

(MHz min.)

Rated

Current

(mA)

Inductance

Customer

Part Number

MURATA

Part Number

(μH)

0.12

0.22

0.47

1.0

Tolerance

LQH31CNR12M03L

LQH31CNR22M03L

LQH31CNR47M03L

LQH31CN1R0M03L

LQH31CN2R2M03L

LQH31CN4R7M03L

LQH31CN100K03L

LQH31CN220K03L

LQH31CN470K03L

LQH31CN101K03L

0.08±40%

0.10±40%

0.15±40%

0.28±30%

0.41±30%

0.65±30%

1.3±30%

3.0±30%

8.0±30%

12.0±30%

970

850

700

510

430

340

230

160

100

250

180

100

±20%

2.2

4.7

±10%

100

When applied Rated current to the Products, Inductance will be within ±10% of initial Inductance value.

When applied Rated current to the Products, temperature rise caused by self-generated heat shall be limited to

35℃max.

4. Testing Conditions

Temperature : Ordinary Temperature (15 to 35°C)

Humidity : Ordinary Humidity (25 to 85 %(RH))

Temperature

Humidity

: 20 ± 2°C

: 60 to 70 %(RH)

Atmospheric Pressure : 86 to 106 kPa

5. Appearance and Dimensions

1.6±0.2

2.3±0.2

■Unit Mass(Typical value)

0.029g

3.2±0.3

No polarity.

(in mm)



0.7

min. min.

0.7

min.

MURATA MFG.CO., LTD

Reference Only

Spec No. JELF243A-0031T-01

P.2/8

6.Electrical Performance

No.

Item

Specification

Test Method

Measuring Equipment :

KEYSIGHT 4192A or equivalent

6.1 Inductance

Inductance shall meet item 3.

Measuring Frequency : 1MHz

Measuring Fixture :

Measuring

Fixture

Fig.1

6.2 DC

DC Resistance shall meet item 3.

S.R.F shall meet item 3.

Measuring Equipment:Digital multi meter

Resistance

6.3 Self Resonant

Frequency(S.R.F)

Measuring Equipment:

KEYSIGHT E4991A or equivalent

7.Mechanical Performance

No.

Item

Specification

Test Method

7.1 Shear Test

Chip coil shall not be damaged after Substrate: Glass-epoxy substrate

tested as test method.

Chip Ciol

4.5

Pattern

Solder resist

Substrate

1.5

(in mm)

Chip Coil

Applied Direction :

Substrate

Force: 10N

Hold Duration: 5s ± 1s

7.2 Bending Test

Substrate: Glass-epoxy substrate

(100mm×40mm×1.6mm)

Speed of Applying Force: 1mm / s

Deflection: 2mm

Hold Duration: 30s

Pressure jig

R340

Deflection

(in mm)

Product

7.3 Vibration

Oscillation Frequency: 10Hz to 55Hz to 10Hz

for 1 min

Total Amplitude: 1.5 mm

Testing Time: A period of 2 hours in each of 3

mutually perpendicular directions.

(Total 6 hours)

MURATA MFG.CO., LTD

Reference Only

Specification

Spec No. JELF243A-0031T-01

No. Item

P.3/8

Test Method

7.4 Solderability

The wetting area of the electrode shall Flux: Ethanol solution of rosin,25(wt)%

be at least 90% covered with new

solder coating.

(Immersed for 5s to 10s)

Solder: Sn-3.0Ag-0.5Cu

Pre-Heating: 150±10°C / 60 to 90seconds

Solder Temperature: 240±5°C

Immersion Time: 3±1 s

7.5 Resistance to

Soldering Heat

Appearance : No damage

Inductance Change : within ± 5 %

Flux: Ethanol solution of rosin,25(wt)%

(Immersed for 5s to 10s)

Solder: Sn-3.0Ag-0.5Cu

Pre-Heating: 150±10°C / 60 to 90seconds

Solder Temperature: 270±5°C

Immersion Time: 10±1 s

Then measured after exposure in the room

condition for 24±2 hours.

8.Environmental Performance (It shall be soldered on the substrate.)

No.

Item

Specification

Test Method

8.1 Heat

Appearance: No damage

Inductance Change: within ± 5 %

DC Resistance Change: within ± 5 %

Temperature: 85 °C ± 2 °C

Time: 1000h (+ 48h , - 0h)

Then measured after exposure in the room

condition for 24±2 hours.

Resistance

8.2 Cold

Temperature: - 40 °C ± 2 °C

Resistance

Time: 1000h (+ 48h , - 0h)

Then measured after exposure in the room

condition for 24±2 hours.

8.3 Humidity

Temperature: 40 °C ± 2 °C

Humidity: 90 %(RH) to 95 %(RH)

Time: 1000h (+ 48h , - 0h)

Then measured after exposure in the room

condition for 24±2 hours.

8.4 Temperature

Cycle

1 cycle :

1 step : - 40 °C ± 2 °C / 30 min ± 3 min

2 step : Ordinary temp. / 10 min to 15 min

3 step : + 85 °C ± 2 °C / 30 min ± 3 min

4 step : Ordinary temp. / 10 min to 15 min

Total of 10 cycles

Then measured after exposure in the room

condition for 24±2 hours.

9. Specification of Packaging

9.1 Appearance and Dimensions of plastic tape

+0.1

-0

_※Lead-in / out wire

1.5



(

)

0.2

The packing directions of the chip coil

※

in taping are unified with the in/out

positions of the lead wire.

Dimension of the Cavity is

measured at the bottom side.

4.0±0.1

2.0±0.05

4.0±0.1

2.0±0.1

1.9±0.1

(in mm)

Direction of feed

MURATA MFG.CO., LTD

Reference Only

Spec No. JELF243A-0031T-01

P.4/8

9.2 Specification of Taping

(1) Packing quantity (standard quantity)

2,000 pcs / reel

(2) Packing Method

Products shall be packed in the each embossed cavity of plastic tape and sealed by cover tape.

(3) Sprocket hole

The sprocket holes are to the right as the tape is pulled toward the user.

(4) Spliced point

Plastic tape and Cover tape has no spliced point.

(5) Missing components number

Missing components number within 0.025% of the number per reel or 1 pc., whichever is greater, and

are not continuous. The specified quantity per reel is kept.

9.3 Pull Strength

Plastic tape

Cover tape

10N min.

9.4 Peeling off force of cover tape

165 to 180 degree

Speed of Peeling off

300mm / min

Cover tape

Plastic tape

0.2N to 0.7N

(minimum value is typical)

Peeling off force

9.5 Dimensions of Leader-tape, Trailer and Reel

There shall be leader-tape (cover tape) and trailer-tape (empty tape) as follows.

9.6 Marking for reel

Customer part number, MURATA part number, Inspection number(1), RoHS marking(2), Quantity etc ･･･

1) <Expression of Inspection No.>

□□OOOO 

(1) (2) (3

)

(1) Factory Code

(2) Date

First digit

: Year / Last digit of year

Second digit

: Month / Jan. to Sep.  1 to 9, Oct. to Dec.  O, N, D

Third, Fourth digit : Day

(3) Serial No.

2) « Expression of RoHS marking »

ROHS – Y (△)

(1) (2)

(1) RoHS regulation conformity

(2) MURATA classification number

9.7 Marking for Outside package (corrugated paper box)

Customer name, Purchasing order number, Customer part number, MURATA part number,

RoHS marking (2) ,Quantity, etc ･･･

MURATA MFG.CO., LTD

Reference Only

Spec No. JELF243A-0031T-01

P.5/8

9.8. Specification of Outer Case

Outer Case Dimensions (mm)

Standard Reel Quantity

in Outer Case (Reel)

Label

186

Above Outer Case size is typical. It depends on a quantity

of an order

10. Caution

10.1 Limitation of Applications

Please contact us before using our products for the applications listed below which require especially high reliability for

the prevention of defects which might directly cause damage to the third party's life, body or property.

(1) Aircraft equipment

(6) Transportation equipment (vehicles, trains, ships, etc.)

(7) Traffic signal equipment

(8) Disaster prevention / crime prevention equipment

(9) Data-processing equipment

(10) Applications of similar complexity and /or reliability requirements

to the applications listed in the above

(2) Aerospace equipment

(3) Undersea equipment

(4) Power plant control equipment

(5) Medical equipment

10.2 Corrosive gas

Please refrain from use since contact with environments with corrosive gases (sulfur gas [hydrogen sulfide, sulfur

dioxide, etc.], chlorine, ammonia, etc.) or oils (cutting oil, silicone oil, etc.) that have come into contact with the

previously stated corrosive gas environment will result in deterioration of product quality or an open from deterioration

due to corrosion of product electrode, etc. We will not bear any responsibility for use under these environments.

11. Notice

This product is designed for solder mounting.

Please consult us in advance for applying other mounting method such as conductive adhesive.

11.1 Land pattern designing

Recommended land pattern for flow and reflow soldering is as follows:

It has been designed for Electric characteristics and solderability.

Please follow the recommended patterns. Otherwise, their performance which includes electrical performance or

solderability may be affected, or result to "position shift" in soldering process.

Chip Coil

Land

Solder resist

1.0

4.5

1.5

(in mm)

11.2 Flux, Solder

・Use rosin-based flux.

Flux

・Don’t use highly acidic flux with halide content exceeding 0.2(wt)% (chlorine conversion value).

・Don’t use water-soluble flux.

・Use Sn-3.0Ag-0.5Cu solder

・Standard thickness of solder paste : 200μm to 300μm

Solder

Other flux (except above) Please contact us for details, then use.

MURATA MFG.CO., LTD

Reference Only

Spec No. JELF243A-0031T-01

P.6/8

11.3 Flow soldering / Reflow soldering conditions

・Pre-heating should be in such a way that the temperature difference between solder and product surface is limited to

150°C max. Cooling into solvent after soldering also should be in such a way that the temperature difference is

limited to 100°C max.

Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of products quality.

・Standard soldering profile and the limit soldering profile is as follows.

The excessive limit soldering conditions may cause leaching of the electrode and / or resulting in the deterioration of

product quality.

Soldering profile

(1)Flow soldering profile

Temp.

(℃)

265℃±3℃

250℃

Limit Profile

150

Heating Time

Standard Profile

60s min.

Time.(s)

Standard Profile

Limit Profile

Pre-heating

Heating

150°C、60s min.

250°C、4s～6s

265°C±3°C、5s

Cycle of flow

2 times

(2)Reflow soldering profile

Temp.

(℃)

260℃

230℃

245℃±3℃

220℃

Limit Profile

180

150

Standard Profile

30s～60s

60s max.

90s±30s

Time.(s)

Standard Profile

150～180°C 、90s±30s

above 220°C、30s～60s above 230°C、60s max.

Limit Profile

Pre-heating

Heating

Peak temperature

Cycle of reflow

245±3°C

2 times

260°C,10s

2 times

MURATA MFG.CO., LTD

Reference Only

Spec No. JELF243A-0031T-01

P.7/8

11.4 Reworking with soldering iron.

The following conditions must be strictly followed when using a soldering iron.

Pre-heating

150°C,1 min

350°C max.

80W max.

φ3mm max.

3(+1,-0)s

Tip temperature

Soldering iron output

Tip diameter

Soldering time

Times

2 times

Note : Do not directly touch the products with the tip of the soldering iron in order to prevent the crack on the

products due to the thermal shock.

11.5 Solder Volume

・Solder shall be used not to be exceeded the upper limits as shown below.

・accordingly increasing the solder volume, the mechanical stress to Chip is also increased.

Exceeding solder volume may cause the failure of mechanical or electrical performance.

Upper Limit

1/3T≦t≦T

T: thickness of product

Recommendable

11.6 Product’s location

The following shall be considered when designing and laying out P.C.B.'s.

(1) P.C.B. shall be designed so that products are not subject to the mechanical stress due to warping the board.

［Products direction］

Products shall be located in the sideways

direction (Length:a<b) to the mechanical

stress.

Poor example

〈

〉

Good example

〈

〉

(2) Components location on P.C.B. separation.

It is effective to implement the following measures, to reduce stress in separating the board.

It is best to implement all of the following three measures; however, implement as many measures

as possible to reduce stress.

Contents of Measures

Stress Level

(1) Turn the mounting direction of the component parallel to

the board separation surface.

D 1

(2) Add slits in the board separation part.

(3) Keep the mounting position of the component away from

the board separation surface.

Seam

1 A > D is valid when stress is added vertically to

the perforation as with Hand Separation.

If a Cutting Disc is used, stress will be diagonal to

the PCB, therefore A > D is invalid.

Slit



Length:a b

(3) Mounting Components Near Screw Holes

When a component is mounted near a screw hole,

it may be affected by the board deflection that occurs

during the tightening of the screw. Mount the component

in a position as far away from the screw holes as possible.

Recommended

Screw Hole

MURATA MFG.CO., LTD

Reference Only

Spec No. JELF243A-0031T-01

P.8/8

11.7 Cleaning Conditions

Products shall be cleaned on the following conditions.

(1) Cleaning temperature shall be limited to 60°C max.(40°C max for IPA.)

(2) Ultrasonic cleaning shall comply with the following conditions with avoiding the resonance

phenomenon at the mounted products and P.C.B.

Power : 20 W / l max.

(3) Cleaner

Frequency : 28kHz to 40kHz

Time : 5 min max.

1. Alcohol type cleaner

･Isopropyl alcohol (IPA)

2. Aqueous agent

･PINE ALPHA ST-100S

(4) There shall be no residual flux and residual cleaner after cleaning.

In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized water in

order to remove the cleaner.

(5) Other cleaning

Please contact us.

11.8 Resin coating

The inductance value may change due to high cure-stress of resin to be used for coating/molding products.

An open circuit issue may occur by mechanical stress caused by the resin, amount/cured shape of resin, or

operating condition etc. Some resin contains some impurities or chloride possible to generate chlorine by hydrolysis

under some operating condition may cause corrosion of wire of coil, leading to open circuit.

So, please pay your careful attention when you select resin in case of coating/molding the products with the resin.

Prior to use the coating resin, please make sure no reliability issue is observed by evaluating products mounted on

your board.

11.9 Caution for use

・Sharp material such as a pair of tweezers or other material such as bristles of cleaning brush, shall not be touched

to the winding portion to prevent the breaking of wire.

・Mechanical shock should not be applied to the products mounted on the board to prevent the breaking of the core

11.10 Handling of a substrate

After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the

substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to

the substrate.

Excessive mechanical stress may cause cracking in the product.

Bending

Twisting

11.11 Storage and Handing Requirements

(1) Storage period

Use the products within 12 months after delivered.

Solderability should be checked if this period is exceeded.

(2) Storage conditions

・Products should be stored in the warehouse on the following conditions.

Temperature

-10 °C to 40 °C

Humidity : 15 % to 85 % relative humidity No rapid change on temperature and humidity

The electrode of the products is coated with solder. Don't keep products in corrosive gases such as

sulfur,chlorine gas or acid, or it may cause oxidization of electrode, resulting in poor solderability.

・Products should not be stored on bulk packaging condition to prevent the chipping of the core and the breaking

of winding wire caused by the collision between the products.

・Products should be stored on the palette for the prevention of the influence from humidity, dust and so on.

・Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on.

(3) Handling Condition

Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock.

12.

Note

(1) Please make sure that your product has been evaluated in view of your specifications with our product being

mounted to your product.

(2) You are requested not to use our product deviating from the reference specifications.

(3) The contents of this reference specification are subject to change without advance notice.

Please approve our product specifications or transact the approval sheet for product specifications before ordering.

MURATA MFG.CO., LTD

LQH31CN220K03# [MURATA]

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