LQH2MCN390K02# [MURATA]
;Reference Onl
SpecNo.JELF243A-0053U-01
P1/8
CHIP COIL(CHIP INDUCTORS)LQH2MCN□□□□02L REFERENCE SPECIFICATION
1.Scope
This reference specification applies to LQH2MCN_02 Series, Chip coil (Chip Inductors).
2.Part Numbering
(ex)
LQ
H
2M
C
N
100
K
0
2
L
Product ID Structure Dimension Applications Category Inductance Tolerance Features Electrode Packaging
(L×W)
and
L: Taping
Characteristics
3.Rating
-40 to +85°C
-40 to +85°C
・Operating Temperature Range.
・Storage Temperature Range.
Self
Inductance
DC
Resistance
(Ω)
Rated
Current
(mA)
Customer
MURATA
Resonant
Frequency
(MHz min)
Part Number
Part Number
(µH)
Tolerance
LQH2MCN1R0M02L
LQH2MCN1R5M02L
LQH2MCN2R2M02L
LQH2MCN3R3M02L
LQH2MCN4R7M02L
LQH2MCN5R6M02L
LQH2MCN6R8M02L
LQH2MCN8R2M02L
LQH2MCN100K02L
LQH2MCN120K02L
LQH2MCN150K02L
LQH2MCN180K02L
LQH2MCN220K02L
LQH2MCN270K02L
LQH2MCN330K02L
LQH2MCN390K02L
LQH2MCN470K02L
LQH2MCN560K02L
LQH2MCN680K02L
LQH2MCN820K02L
1.0
1.5
2.2
3.3
4.7
5.6
6.8
8.2
10
12
15
18
22
27
33
39
47
56
68
82
0.30 ±30%
0.40 ±30%
0.48 ±30%
0.60 ±30%
0.8 ±30%
0.9 ±30%
1.0 ±30%
1.1 ±30%
1.2 ±30%
1.4 ±30%
1.6 ±30%
1.8 ±30%
2.1 ±30%
2.5 ±30%
2.8 ±30%
4.4 ±30%
5.1 ±30%
5.7 ±30%
6.6 ±30%
7.5 ±30%
100
95
70
65
60
60
55
50
48
44
40
35
30
30
28
24
18
17
14
14
485
445
425
375
300
280
255
235
225
210
200
190
185
180
160
125
120
110
100
90
M:±20%
K:±10%
When applied Rated current to the Products, Inductance will be within ±10% of initial Inductance value.
When applied Rated current to the Products ,temperature rise caused by self-generated heat shall be limited
to 40℃max.
4. Testing Conditions
《Unless otherwise specified》
Temperature : Ordinary Temperature (15 to 35°C)
Humidity : Ordinary Humidity (25 to 85 %(RH))
《In case of doubt》
Temperature
Humidity
: 20 ± 2°C
: 60 to 70 %(RH)
Atmospheric Pressure : 86 to 106 kPa
MURATA MFG.CO., LTD
Reference Onl
SpecNo.JELF243A-0053U-01
P2/8
5.Appearance and Dimensions
2.0±0.2
1.6±0.2
■Unit Mass (Typical value)
0.010g
No marking.
( in mm )
0.6±0.2
0.8±0.2
0.6±0.2
6.Electrical Performance
No. Item
Specification
Test Method
6.1 Inductance
Inductance shall meet item 3.
Measuring Equipment: KEYSIGHT 4192A or equivalent
Measuring Frequency: 1MHz
6.2 DC Resistance
DC Resistance shall meet item 3.
S.R.F shall meet item 3.
Measuring Equipment: Digital multi meter
6.3 Self Resonant
Frequency(S.R.F)
Measuring Equipment: KEYSIGHT E4991A or equivalent
7.Mechanical Performance
No.
Item
Specification
Test Method
7.1 Shear Test
Chip coil shall not be damaged.
Substrate: Glass-epoxy substrate
Force: 5N
Hold Duration: 5±1s
Chip coil
F
Substrate
7.2 Bending Test
Substrate: Glass-epoxy substrate
(100×40×0.8mm)
Speed of Applying Force: 0.5mm / s
Deflection: 2mm
Hold Duration: 5seconds.
Pressure jig
R230
F
Deflection
Product
45
45
(in mm)
7.3 Vibration
Oscillation Frequency: 10~55~10Hz for 1 minute
Total Amplitude: 1.5mm
Testing Time: A period of 2 hours in each of 3 mutually
perpendicular directions.
(Total 6 hours)
MURATA MFG.CO., LTD
Reference Onl
Specification
SpecNo.JELF243A-0053U-01
No. Item
P3/8
Test Method
7.4 Solderability
The wetting area of the electrode
shall be at least 90% covered with
new solder coating.
Flux: Ethanol solution of rosin,25(wt)%
(Immersed for 5s to 10s)
Solder: Sn-3.0Ag-0.5Cu
Pre-Heating: 80 to 120°C / 10 to 30seconds.
Solder Temperature: 245±3°C
Immersion Time: 3±1 s
7.5 Resistance to
Soldering Heat
Appearance: No damage
Inductance Change: within ±5%
Flux: Ethanol solution of rosin,25(wt)%
(Immersed for 5s to 10s)
Solder: Sn-3.0Ag-0.5Cu
Pre-Heating: 150±10°C / 1 to 2 minutes
Solder Temperature: 270±5°C
Immersion Time: 10±1 s
Then measured after exposure in the room condition for
24±2 hours.
8.Environmental Performance (It shall be soldered on the substrate.)
No.
Item
Specification
Test Method
8.1 Heat Resistance
8.2 Cold Resistance
8.3 Humidity
Appearance:No damage
Inductance Change: within ± 5%
DC Resistance Change:
within ± 5%
Temperature: 85±2°C
Time: 1000h (+48h , -0h)
Then measured after exposure in the room condition for
24±2 hours.
Temperature: -40±2°C
Time: 1000h (+48h , -0h)
Then measured after exposure in the room condition for
24±2 hours.
Temperature: 40±2°C
Humidity: 90~95%(RH)
Time: 1000h (+48h , -0h)
Then measured after exposure in the room condition for
24±2 hours.
8.4 Temperature
Cycle
1 cycle:
1 step: -40±2°C / 30±3 minutes
2 step:Ordinary temp. / 10 to 15 minutes
3 step:+85±2°C / 30±3 min
4 step: Ordinary temp. / 10 to 15 minutes
Total of 10 cycles
Then measured after exposure in the room condition for
24±2 hours.
9. Specification of Packaging
9.1 Appearance and Dimensions of plastic tape
+0.1
1.5
-0
Lead-in/out wire
※
1.75±0.1
(
)
0.25
The packing directions of the chip coil
in taping are unified with the in/out
positions of the lead wire.
※
4.0±0.1
4.0±0.1
1.9±0.1
2.0±0.05
(in mm)
1.05±0.1
Direction of feed
Dimension of the Cavity is measured at the bottom side.
MURATA MFG.CO., LTD
Reference Only
SpecNo.JELF243A-0053U-01
P4/8
9.2 Specification of Taping
(1) Packing quantity (standard quantity)
3,000 pcs / reel
(2) Packing Method
Products shall be packed in the each embossed cavity of plastic tape and sealed by cover tape.
(3) Sprocket hole
The sprocket holes are to the right as the tape is pulled toward the user.
(4) Spliced point
Plastic tape and Cover tape has no spliced point.
(5) Missing components number
Missing components number within 0.025% of the number per reel or 1 pc., whichever is greater, and
are not continuous. The specified quantity per reel is kept.
9.3 Pull Strength
Embossed carrier tape
10N min.
10N min.
Cover tape
9.4 Peeling off force of cover tape
165 to 180 degree
F
Cover tape
Plastic tape
Speed of Peeling off
300mm/min
0.2 to 0.7N
(minimum value is typical)
Peeling off force
9.5 Dimensions of Leader-tape, Trailer and Reel
There shall be leader-tape (cover tape) and trailer-tape (empty tape) as follows.
9.6 Marking for reel
Customer part number, MURATA part number, Inspection number(1), RoHS marking(2), Quantity etc ・・・
1) <Expression of Inspection No.>
□□OOOO
(1) (2) (3
)
(1) Factory Code
(2) Date
First digit
: Year / Last digit of year
Second digit
: Month / Jan. to Sep. 1 to 9, Oct. to Dec. O, N, D
Third, Fourth digit : Day
(3) Serial No.
2) « Expression of RoHS marking »
ROHS – Y (△)
(1) (2)
(1) RoHS regulation conformity
(2) MURATA classification number
9.7 Marking for Outside package (corrugated paper box)
Customer name, Purchasing order number, Customer part number, MURATA part number,
RoHS Marking (2) ,Quantity, etc ・・・
MURATA MFG.CO., LTD
Reference Onl
SpecNo.JELF243A-0053U-01
P5/8
9.8. Specification of Outer Case
Outer Case Dimensions (mm)
Standard Reel Quantity
in Outer Case (Reel)
W
D
H
Label
186
186
93
5
H
Above Outer Case size is typical. It depends on a quantity of an order
D
W
10.
Caution
10.1 Limitation of Applications
Please contact us before using our products for the applications listed below which require especially high reliability for
the prevention of defects which might directly cause damage to the third party's life, body or property.
(1) Aircraft equipment
(6) Transportation equipment (vehicles, trains, ships, etc.)
(7) Traffic signal equipment
(8) Disaster prevention / crime prevention equipment
(9) Data-processing equipment
(10) Applications of similar complexity and /or reliability requirements
to the applications listed in the above
(2) Aerospace equipment
(3) Undersea equipment
(4) Power plant control equipment
(5) Medical equipment
10.2 Corrosive gas
Please refrain from use since contact with environments with corrosive gases (sulfur gas [hydrogen sulfide, sulfur
dioxide, etc.], chlorine, ammonia, etc.) or oils (cutting oil, silicone oil, etc.) that have come into contact with the
previously stated corrosive gas environment will result in deterioration of product quality or an open from deterioration
due to corrosion of product electrode, etc. We will not bear any responsibility for use under these environments.
11. Notice
This product is designed for solder mounting. (Reflow soldering only)
Please consult us in advance for applying other mounting method such as conductive adhesive.
11.1 Land pattern designing (Reflow Soldering)
Recommended land pattern for reflow soldering is as follows:
It has been designed for Electric characteristics and solderability.
Please follow the recommended patterns. Otherwise, their performance which includes electrical performance or
solderability may be affected, or result to "position shift" in soldering process.
2.6
Chip Coil
Land
Solder Resist
(in mm)
0.8
11.2 Flux, Solder
・Use rosin-based flux.
Flux
・Don’t use highly acidic flux with halide content exceeding 0.2(wt)% (chlorine conversion value).
・Don’t use water-soluble flux.
・Use Sn-3.0Ag-0.5Cu solder
・Standard thickness of solder paste : 100μm to 150μm
Solder
Other flux (except above) Please contact us for details, then use.
MURATA MFG.CO., LTD
Reference Onl
SpecNo.JELF243A-0053U-01
P6/8
11.3 soldering conditions (Reflow)
・Pre-heating should be in such a way that the temperature difference between solder and product surface is limited to
100°C max. Cooling into solvent after soldering also should be in such a way that the temperature difference is
limited to 100°C max.
Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of product quality.
・Standard soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and / or resulting in the
deterioration of product quality.
Temp.
(℃)
260℃
230℃
245℃±3℃
220℃
Limit Profile
180
150
Standard Profile
30s~60s
60s max
90s±30s
Standard Profile
Time(s)
Limit Profile
Pre-heating
150~180°C 、90s±30s
Heating
above 220°C、30s~60s
245±3°C
above 230°C、60s max.
Peak temperature
Cycle of reflow
260°C,10s
2 times
2 times
11.4 Reworking with soldering iron.
The following conditions must be strictly followed when using a soldering iron.
Pre-heating
150°C,1 min
350°C max.
80W max.
φ3mm max.
3 s max.
Tip temperature
Soldering iron output
Tip diameter
Soldering time
Times
1 time
Reworking should be limited to only once.
Note :Do not directly touch the products with the tip of the soldering iron in order to prevent the crack on the products
due to the thermal shock.
11.5 Solder Volume
・Solder shall be used not to be exceeded the upper limits as shown below.
・Accordingly increasing the solder volume, the mechanical stress to Chip is also increased.
Exceeding solder volume may cause the failure of mechanical or electrical performance.
Upper Limit
Recommendable
1/3T≦t≦T
T
t
(T: Lower flange thickness)
MURATA MFG.CO., LTD
Reference Onl
SpecNo.JELF243A-0053U-01
P7/8
11.6 Product's location
The following shall be considered when designing and laying out P.C.B.’s.
(1) P.C.B. shall be designed so that products are not subject to the mechanical stress due to warping the board.
[Products direction]
a
Products shall be located in the sideways
direction (Length:a<b) to the mechanical
stress.
b
Poor example
〈
〉
Good example
〈
〉
(2) Components location on P.C.B. separation.
It is effective to implement the following measures, to reduce stress in separating the board.
It is best to implement all of the following three measures; however, implement as many measures as possible
to reduce stress.
Contents of Measures
Stress Level
(1) Turn the mounting direction of the component parallel to
the board separation surface.
A
A
A
>
>
>
D 1
B
(2) Add slits in the board separation part.
(3) Keep the mounting position of the component away from
the board separation surface.
C
C
B
Seam
1 A > D is valid when stress is added vertically to
the perforation as with Hand Separation.
If a Cutting Disc is used, stress will be diagonal to
the PCB, therefore A > D is invalid.
D
A
a
b
Slit
Length:a b
(3) Mounting Components Near Screw Holes
When a component is mounted near a screw hole,
it may be affected by the board deflection that occurs
during the tightening of the screw. Mount the component
in a position as far away from the screw holes as possible.
Recommended
Screw Hole
11.7 Cleaning Conditions
Products shall be cleaned on the following conditions. But, Products can be used without cleaning,too.
(1) Cleaning temperature shall be limited to 60°C max.(40°C max for IPA.)
(2) Ultrasonic cleaning shall comply with the following conditions with avoiding the resonance phenomenon
at the mounted products and P.C.B.
Power : 20 W / l max.
(3) Cleaner
Frequency : 28kHz to 40kHz
Time : 5 minutes max.
1. Alternative cleaner
・sopropyl alcohol (IPA)
2. Aqueous agent
・PINE ALPHA ST-100S
(4) There shall be no residual flux and residual cleaner after cleaning.
In the case of using aqueous agent, products shall be dried completely after rinse with de-ionizedwater in
order to remove the cleaner.
(5) Other cleaning
Please contact us.
11.8 Resin coating
The inductance value may change due to high cure-stress of resin to be used for coating/molding products. An open
circuit issue may occur by mechanical stress caused by the resin, amount/cured shape of resin, or operating
condition etc. Some resin contains some impurities or chloride possible to generate chlorine by hydrolysis under
some operating condition may cause corrosion of wire of coil, leading to open circuit. So, please pay your careful
attention when you select resin in case of coating/molding the products with the resin.Prior to use the coating resin,
please make sure no reliability issue is observed by evaluating products mounted on your board.
11.9 Temperature rating of the circuit board and components located around
Temperature may rise up to max. 40 °C when applying the rated current to the Products.
Be careful of the temperature rating of the circuit board and components located around.
MURATA MFG.CO., LTD
Reference Only
SpecNo.JELF243A-0053U-01
P8/8
11.10 Caution for use
・Sharp material such as a pair of tweezers or other material such as bristles of cleaning brush, shall not be touched
to the winding portion to prevent the breaking of wire.
・Mechanical shock should not be applied to the products mounted on the board to prevent the breaking of the core
11.11 Handling of a substrate
After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the
substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to
the substrate.
Excessive mechanical stress may cause cracking in the product.
Bending
Twisting
11.12 Storage and Handling Requirements
(1) Storage period
Use the products within 12 months after delivered.
Solderability should be checked if this period is exceeded.
(2) Storage conditions
・Products should be stored in the warehouse on the following conditions.
Temperature : -10 ~ 40°C
Humidity
: 15 to 85% relative humidity No rapid change on temperature and humidity
The electrode of the products is coated with solder. Don't keep products in corrosive gases such as sulfur,
chlorine gas or acid, or it may cause oxidization of electrode, resulting in poor solderability.
・Products should not be stored on bulk packaging condition to prevent the chipping of the core and the breaking
of winding wire caused by the collision between the products.
・Products should be stored on the palette for the prevention of the influence from humidity, dust and so on.
・Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on.
(3) Handling Condition
Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock.
12.
Note
(1) Please make sure that your product has been evaluated in view of your specifications with our product being mounted
to your product.
(2) You are requested not to use our product deviating from the reference specifications.
(3) The contents of this reference specification are subject to change without advance notice. Please approve our
product specifications or transact the approval sheet for product specifications before ordering
MURATA MFG.CO., LTD
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