LQG15HN5N6C02# [MURATA]
;Spec No.: JELF243B_0009U-01
P1/12
CHIP COILS (CHIP INDUCTORS) LQG15HN□□□□02□ REFERENCE SPECIFICATION
1. Scope
This reference specification applies to chip coils (chip inductors) LQG15HN_02 series for general electronic equipment.
2. Part Numbering
(Ex.)
LQ
G
15
H
N
1N0
S
0
2
D
Product Structure Dimension Application Category Inductance Tolerance Performance Electrode
Packaging
D: taping
*B: bulk
ID
(L × W)
and
specification
characteristic
*B: Bulk packing is also available.
3. Part Number and Rating
Operating temperature range
Storage temperature range
-55°C to +125°C
-55°C to +125°C
Inductance
DC
resistance
(Ω max.)
Self-resonant
frequency
(MHz min.)
Customer
Murata
Q
(Min.)
Rated current
Nominal
value
Part number
Part number
(mA)
Tolerance
(nH)
LQG15HN1N0B02D
LQG15HN1N0C02D
LQG15HN1N0S02D
LQG15HN1N1B02D
LQG15HN1N1C02D
LQG15HN1N1S02D
LQG15HN1N2B02D
LQG15HN1N2C02D
LQG15HN1N2S02D
LQG15HN1N3B02D
LQG15HN1N3C02D
LQG15HN1N3S02D
LQG15HN1N5B02D
LQG15HN1N5C02D
LQG15HN1N5S02D
LQG15HN1N6B02D
LQG15HN1N6C02D
LQG15HN1N6S02D
LQG15HN1N8B02D
LQG15HN1N8C02D
LQG15HN1N8S02D
LQG15HN2N0B02D
LQG15HN2N0C02D
LQG15HN2N0S02D
LQG15HN2N2B02D
LQG15HN2N2C02D
LQG15HN2N2S02D
LQG15HN2N4B02D
LQG15HN2N4C02D
LQG15HN2N4S02D
1.0
1.0
1.0
1.1
1.1
1.1
1.2
1.2
1.2
1.3
1.3
1.3
1.5
1.5
1.5
1.6
1.6
1.6
1.8
1.8
1.8
2.0
2.0
2.0
2.2
2.2
2.2
2.4
2.4
2.4
±0.1 nH
±0.2 nH
±0.3 nH
±0.1 nH
±0.2 nH
±0.3 nH
±0.1 nH
±0.2 nH
±0.3 nH
±0.1 nH
±0.2 nH
±0.3 nH
±0.1 nH
±0.2 nH
±0.3 nH
±0.1 nH
±0.2 nH
±0.3 nH
±0.1 nH
±0.2 nH
±0.3 nH
±0.1 nH
±0.2 nH
±0.3 nH
±0.1 nH
±0.2 nH
±0.3 nH
±0.1 nH
±0.2 nH
±0.3 nH
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
0.07
0.07
0.07
0.08
0.08
0.08
0.08
0.08
0.08
0.08
0.08
0.08
0.08
0.08
0.08
0.08
0.08
0.08
0.08
0.08
0.08
0.09
0.09
0.09
0.09
0.09
0.09
0.10
0.10
0.10
6000
6000
6000
6000
6000
6000
6000
6000
6000
6000
6000
6000
6000
6000
6000
6000
6000
6000
6000
6000
6000
6000
6000
6000
6000
6000
6000
6000
6000
6000
1000
1000
1000
1000
1000
1000
1000
1000
1000
1000
1000
1000
1000
1000
1000
1000
1000
1000
900
900
900
900
900
900
900
900
900
800
800
800
MURATA MFG CO., LTD
Spec No.: JELF243B_0009U-01
P2/12
Inductance
Nominal
DC
resistance
(Ω max.)
Self-resonant
frequency
(MHz min.)
Customer
Part number
Murata
Part number
Q
(Min.)
Rated current
(mA)
value
(nH)
Tolerance
LQG15HN2N7B02D
LQG15HN2N7C02D
LQG15HN2N7S02D
LQG15HN3N0B02D
LQG15HN3N0C02D
LQG15HN3N0S02D
LQG15HN3N3B02D
LQG15HN3N3C02D
LQG15HN3N3S02D
LQG15HN3N6B02D
LQG15HN3N6C02D
LQG15HN3N6S02D
LQG15HN3N9B02D
LQG15HN3N9C02D
LQG15HN3N9S02D
LQG15HN4N3B02D
LQG15HN4N3C02D
LQG15HN4N3S02D
LQG15HN4N7B02D
LQG15HN4N7C02D
LQG15HN4N7S02D
LQG15HN5N1B02D
LQG15HN5N1C02D
LQG15HN5N1S02D
LQG15HN5N6B02D
LQG15HN5N6C02D
LQG15HN5N6S02D
LQG15HN6N2B02D
LQG15HN6N2C02D
LQG15HN6N2S02D
LQG15HN6N8G02D
LQG15HN6N8H02D
LQG15HN6N8J02D
LQG15HN7N5G02D
LQG15HN7N5H02D
LQG15HN7N5J02D
LQG15HN8N2G02D
LQG15HN8N2H02D
LQG15HN8N2J02D
LQG15HN9N1G02D
LQG15HN9N1H02D
LQG15HN9N1J02D
LQG15HN10NG02D
LQG15HN10NH02D
LQG15HN10NJ02D
2.7
2.7
2.7
3.0
3.0
3.0
3.3
3.3
3.3
3.6
3.6
3.6
3.9
3.9
3.9
4.3
4.3
4.3
4.7
4.7
4.7
5.1
5.1
5.1
5.6
5.6
5.6
6.2
6.2
6.2
6.8
6.8
6.8
7.5
7.5
7.5
8.2
8.2
8.2
9.1
9.1
9.1
10
±0.1 nH
±0.2 nH
±0.3 nH
±0.1 nH
±0.2 nH
±0.3 nH
±0.1 nH
±0.2 nH
±0.3 nH
±0.1 nH
±0.2 nH
±0.3 nH
±0.1 nH
±0.2 nH
±0.3 nH
±0.1 nH
±0.2 nH
±0.3 nH
±0.1 nH
±0.2 nH
±0.3 nH
±0.1 nH
±0.2 nH
±0.3 nH
±0.1 nH
±0.2 nH
±0.3 nH
±0.1 nH
±0.2 nH
±0.3 nH
±2%
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
0.10
0.10
0.10
0.11
0.11
0.11
0.12
0.12
0.12
0.13
0.13
0.13
0.13
0.13
0.13
0.15
0.15
0.15
0.16
0.16
0.16
0.16
0.16
0.16
0.18
0.18
0.18
0.19
0.19
0.19
0.21
0.21
0.21
0.24
0.24
0.24
0.25
0.25
0.25
0.27
0.27
0.27
0.29
0.29
0.29
6000
6000
6000
6000
6000
6000
6000
6000
6000
6000
6000
6000
6000
6000
6000
6000
6000
6000
6000
6000
6000
6000
6000
6000
5300
5300
5300
4300
4300
4300
4200
4200
4200
3900
3900
3900
3600
3600
3600
3400
3400
3400
3200
3200
3200
800
800
800
800
800
800
800
800
800
700
700
700
700
700
700
700
700
700
700
700
700
600
600
600
600
600
600
600
600
600
600
600
600
500
500
500
500
500
500
500
500
500
500
500
500
±3%
±5%
±2%
±3%
±5%
±2%
±3%
±5%
±2%
±3%
±5%
±2%
10
±3%
10
±5%
MURATA MFG CO., LTD
Spec No.: JELF243B_0009U-01
P3/12
Inductance
Nominal
DC
resistance
(Ω max.)
Self-resonant
frequency
(MHz min.)
Customer
Part number
Murata
Part number
Q
(Min.)
Rated current
(mA)
value
(nH)
Tolerance
LQG15HN12NG02D
LQG15HN12NH02D
LQG15HN12NJ02D
LQG15HN15NG02D
LQG15HN15NH02D
LQG15HN15NJ02D
LQG15HN18NG02D
LQG15HN18NH02D
LQG15HN18NJ02D
LQG15HN22NG02D
LQG15HN22NH02D
LQG15HN22NJ02D
LQG15HN27NG02D
LQG15HN27NH02D
LQG15HN27NJ02D
LQG15HN33NG02D
LQG15HN33NH02D
LQG15HN33NJ02D
LQG15HN39NG02D
LQG15HN39NH02D
LQG15HN39NJ02D
LQG15HN47NG02D
LQG15HN47NH02D
LQG15HN47NJ02D
LQG15HN56NG02D
LQG15HN56NH02D
LQG15HN56NJ02D
LQG15HN68NG02D
LQG15HN68NH02D
LQG15HN68NJ02D
LQG15HN82NG02D
LQG15HN82NH02D
LQG15HN82NJ02D
LQG15HNR10G02D
LQG15HNR10H02D
LQG15HNR10J02D
LQG15HNR12G02D
LQG15HNR12H02D
LQG15HNR12J02D
12
12
12
15
15
15
18
18
18
22
22
22
27
27
27
33
33
33
39
39
39
47
47
47
56
56
56
68
68
68
82
82
82
100
100
100
120
120
120
±2%
±3%
±5%
±2%
±3%
±5%
±2%
±3%
±5%
±2%
±3%
±5%
±2%
±3%
±5%
±2%
±3%
±5%
±2%
±3%
±5%
±2%
±3%
±5%
±2%
±3%
±5%
±2%
±3%
±5%
±2%
±3%
±5%
±2%
±3%
±5%
±2%
±3%
±5%
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
0.40
0.40
0.40
0.45
0.45
0.45
0.51
0.51
0.51
0.58
0.58
0.58
0.67
0.67
0.67
0.67
0.67
0.67
1.06
1.06
1.06
1.15
1.15
1.15
1.20
1.20
1.20
1.25
1.25
1.25
1.60
1.60
1.60
1.60
1.60
1.60
1.60
1.60
1.60
2800
2800
2800
2300
2300
2300
2100
2100
2100
1800
1800
1800
1600
1600
1600
1500
1500
1500
1200
1200
1200
1000
1000
1000
800
400
400
400
400
400
400
350
350
350
350
350
350
300
300
300
300
300
300
250
250
250
250
250
250
200
200
200
200
200
200
200
200
200
200
200
200
150
150
150
800
800
800
800
800
600
600
600
600
600
600
600
600
600
4. Testing Conditions
Unless otherwise specified
Temperature: ordinary temperature (15°C to 35°C)
Humidity: ordinary humidity [25% to 85% (RH)]
In case of doubt
Temperature: 20°C±2°C
Humidity: 60% to 70% (RH)
Atmospheric pressure: 86 kPa to 106 kPa
MURATA MFG CO., LTD
Spec No.: JELF243B_0009U-01
P4/12
5. Appearance and Dimensions
Unit mass (typical value): 0.001 g
6. Marking
7. Electrical Performance
No.
Item
Specification
Meet chapter 3 ratings.
Meet chapter 3 ratings.
Test method
Measuring equipment: Keysight E4991A or the
equivalent
7.1 Inductance
7.2 Q
Measuring frequency: 100 MHz
Measuring conditions:
Measurement signal level: Approx. 0 dBm
Measurement terminal distance: 0.5 mm
Electrical length: 10 mm
Weight: Approx. 1 N to 5 N
Measuring fixture: Keysight 16197A
Position the chip coil under test as shown in the
measuring example below and connect it to the
electrode by applying weight.
Measurement example:
Measuring method: see "Electrical performance:
Measuring method for inductance/Q" in the Appendix.
Measuring equipment: digital multimeter
Measuring equipment: Keysight 8753C or the
equivalent
7.3 DC resistance
7.4 Self-resonant
frequency
Meet chapter 3 ratings.
Meet chapter 3 ratings.
7.5 Rated current
Product temperature rise: 25°C max.
Apply the rated current specified in chapter 3.
MURATA MFG CO., LTD
Spec No.: JELF243B_0009U-01
P5/12
8. Mechanical Performance
No.
Item
Specification
Test method
8.1 Shear test
No significant mechanical damage or no Test substrate: glass-epoxy substrate
sign of electrode peeling off shall be
observed.
Applying force: 5 N
Holding time: 5 s±1 s
Force application direction:
8.2 Bending test
No significant mechanical damage or no Test substrate: glass-epoxy substrate (100 mm × 40
sign of electrode peeling off shall be
observed.
mm × 0.8 mm)
Pressurizing speed: 1 mm/s
Pressure jig: R340
Deflection: 2 mm
Holding time: 30 s
8.3 Vibration
Appearance shall have no significant
mechanical damage.
Oscillation frequency: 10 Hz to 55 Hz to 10 Hz, for
approx. 1 min
Inductance change rate: within ±10%
Total amplitude: 1.5 mm
Test time: 3 directions perpendicular to each other, 2
h for each direction (6 h in total)
8.4 Solderability
90% or more of the outer electrode shall Flux: immersed in ethanol solution with a rosin
be covered with new solder seamlessly. content of 25(wt)% for 5 s to 10 s
Solder: Sn-3.0Ag-0.5Cu solder
Pre-heating: 150°C±10°C/60 s to 90 s
Solder temperature: 240°C±5°C
Immersion time: 3 s±1 s
8.5 Resistance to
soldering heat
Appearance: No significant mechanical Flux: immersed in ethanol solution with a rosin
damage shall be observed.
content of 25(wt)% for 5 s to 10 s
Solder: Sn-3.0Ag-0.5Cu solder
Inductance change rate: within ±10%
Pre-heating: 150°C±10°C/1 min to 2 min
Solder temperature: 270°C±5°C
Immersion time: 10 s±1 s
Post-treatment: left at a room condition for 24 h±2 h
9. Environmental Performance
The product is soldered on a glass-epoxy substrate for test.
No.
Item
Specification
Test method
9.1 Humidity
Appearance: No significant mechanical Temperature: 40°C±2°C
damage shall be observed.
Humidity: 90% (RH) to 95% (RH)
Inductance change rate: within ±10%
Test time: 1000 h (+48 h, -0 h)
Post-treatment: left at a room condition for 24 h±2 h
9.2 Heat life
Appearance: No significant mechanical Temperature: 125°C±2°C
damage shall be observed.
Applied current: Rated current specified in chapter 3
Inductance change rate: within ±10%
Test time: 1000 h (+48 h, -0 h)
Post-treatment: left at a room condition for 24 h±2 h
9.3 Humidity load
Appearance: No significant mechanical Temperature: 40°C±2°C
damage shall be observed.
Humidity: 90% (RH) to 95% (RH)
Inductance change rate: within ±10%
Applied current: Rated current specified in chapter 3
Test time: 1000 h (+48 h, -0 h)
Post-treatment: left at a room condition for 24 h±2 h
MURATA MFG CO., LTD
Spec No.: JELF243B_0009U-01
No. Item
P6/12
Specification
Test method
9.4 Temperature cycle
Appearance: No significant mechanical Single cycle conditions:
damage shall be observed.
Step 1: -55°C (+0°C, -3°C)/30 min±3 min
Inductance change rate: within ±10%
Step 2: ordinary temperature/2 min to 3 min
Step 3: +125°C (+3°C, -0°C)/30 min±3 min
Step 4: ordinary temperature/2 min to 3 min
Number of testing: 10 cycles
Post-treatment: left at a room condition for 24 h±2 h
10. Specification of Packaging
10.1 Appearance and dimensions of tape (8 mm width/paper tape)
A
B
t
0.62±0.04
1.12±0.04
0.8 max.
(in mm)
10.2 Taping specifications
Packing quantity
10000 pcs/reel
(Standard quantity)
Packing method
Feed hole position
Joint
The products are placed in cavities of a carrier tape and sealed by a cover tape (top tape and bottom
tape when the cavities of the carrier tape are punched type).
The feed holes on the carrier tape are on the right side when the cover tape (top tape when the
cavities of the carrier tape are punched type) is pulled toward the user.
The carrier tape and cover tape (top tape when the cavities of the carrier tape are punched type) are
seamless.
Number of missing
products
Number of missing products within 0.025% of the number per reel or 1 pc., whichever is greater, and
are not continuous. The specified quantity per reel is kept.
10.3 Break down force of tape
Cover tape (or top tape)
5 N min.
5 N min.
Bottom tape (only when the cavities of the carrier tape are punched
type)
MURATA MFG CO., LTD
Spec No.: JELF243B_0009U-01
P7/12
10.4 Peeling off force of tape
Speed of peeling off
300 mm/min
0.1 N to 0.6 N (The lower limit is for typical value.)
Peeling off force
10.5 Dimensions of leader section, trailer section and reel
A vacant section is provided in the leader (start) section and trailer (end) section of the tape for the product. The leader
section is further provided with an area consisting only of the cover tape (or top tape). (See the diagram below.)
10.6 Marking for reel
Customer part number, Murata part number, inspection number (*1), RoHS marking (*2), quantity, etc.
*1 Expression of inspection No.: (1) Factory code
□□
(1)
○○○○
(2)
(2) Date
First digit: year/last digit of year
(3)
Second digit: month/Jan. to Sep.→1 to 9, Oct. to Dec.→O, N, D
Third, Fourth digit: day
(3) Serial No.
*2 Expression of RoHS marking: (1) RoHS regulation conformity
ROHS-
Y
()
(2) Murata classification number
(1)
(2)
10.7 Marking on outer box (corrugated box)
Customer name, purchasing order number, customer part number, Murata part number, RoHS marking (*2), quantity, etc.
10.8 Specification of outer box
Dimensions of outer box
Standard reel quantity
(mm)
Label
in outer box (reel)
W
D
H
H
186
186
93
5
D
* Above outer box size is typical. It depends on a
quantity of an order.
W
MURATA MFG CO., LTD
Spec No.: JELF243B_0009U-01
P8/12
11.
Caution
11.1 Restricted applications
Please contact us before using our products for the applications listed below which require especially high reliability for the
prevention of defects which might directly cause damage to the third party's life, body or property.
(1) Aircraft equipment
(2) Aerospace equipment
(3) Undersea
equipment
(4) Power plant
control equipment
(5) Medical equipment
(6) Transportation equipment (vehicles, (7) Traffic signal
trains, ships, etc.) equipment
(8) Disaster/crime
prevention
equipment
(9) Data-processing
equipment
(10) Applications of similar complexity and/or reliability
requirements to the applications listed in the above
11.2 Precautions on rating
Avoid using in exceeded the rated temperature range, rated voltage, or rated current.
Usage when the ratings are exceeded could lead to wire breakage, burning, or other serious fault.
11.3 Inrush current
If an inrush current (or pulse current or rush current) that significantly exceeds the rated current is applied to the product,
overheating could occur, resulting in wire breakage, burning, or other serious fault.
12. Precautions for Use
This product is for use only with reflow soldering. It is designed to be mounted by soldering. If you want to use other
mounting method, for example, using a conductive adhesive, please consult us beforehand.
Also, if repeatedly subjected to temperature cycles or other thermal stress, due to the difference in the coefficient of thermal
expansion with the mounting substrate, the solder (solder fillet part) in the mounting part may crack.
The occurrence of cracks due to thermal stress is affected by the size of the land where mounted, the solder volume, and
the heat dissipation of the mounting substrate. Carefully design it when a large change in ambient temperature is assumed.
12.1. Land dimensions
The following diagram shows the recommended land dimensions for reflow soldering:
a
b
c
0.4
1.2
0.5
(in mm)
12.2 Flux and solder used
Flux
• Use a rosin-based flux.
• Do not use a highly acidic flux with a halide content exceeding 0.2(wt)% (chlorine conversion value).
• Do not use a water-soluble flux.
Solder
• Use Sn-3.0Ag-0.5Cu solder.
• Standard thickness of solder paste: 100 μm to 150 μm
If you want to use a flux other than the above, please consult our technical department.
MURATA MFG CO., LTD
Spec No.: JELF243B_0009U-01
P9/12
12.3 Soldering conditions (reflow)
• Pre-heating should be in such a way that the temperature difference between solder and product surface is limited to
150°C max.
Cooling into solvent after soldering also should be in such a way that the temperature difference is limited to 100°C max.
Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of product quality.
• Standard soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and/or resulting in the deterioration of
product quality.
Temp.
(℃)
260℃
230℃
Limit Profile
245℃±3℃
220℃
180
150
Standard Profile
30s~60s
60s max.
90s±30s
Time.(s)
Standard profile
Limit profile
Pre-heating
150°C to 180°C/90 s±30 s
Above 220°C/30 s to 60 s
245°C±3°C
150°C to 180°C/90 s±30 s
Above 230°C/60 s max.
260°C/10 s
Heating
Peak temperature
Number of reflow cycles
2 times
2 times
12.4 Reworking with soldering iron
The following requirements must be met to rework a soldered product using a soldering iron.
Item
Requirement
150°C/approx. 1 min
350°C max.
Pre-heating
Tip temperature of soldering iron
Power consumption of soldering iron
Tip diameter of soldering iron
Soldering time
80 W max.
ø3 mm max.
3 s (+1 s, -0 s)
2 times max.
Number of reworking operations
* Avoid a direct contact of the tip of the soldering iron with the product. Such a
direction contact may cause cracks in the ceramic body due to thermal
shock.
12.5 Solder volume
Solder shall be used not to be exceeded the upper limits as shown below.
An increased solder volume increases mechanical stress on the product. Exceeding solder volume may cause the failure of
mechanical or electrical performance.
MURATA MFG CO., LTD
Spec No.: JELF243B_0009U-01
P10/12
12.6 Product's location
The following shall be considered when designing and laying out PCBs.
(1) PCB shall be designed so that products are not subject to mechanical stress due to warping the board.
[Products direction]
Products shall be located in the sideways direction (length: a < b) to the mechanical stress.
a
b
Poor example
〈
〉
Good example
〈
〉
(2) Components location on PCB separation
It is effective to implement the following measures, to reduce stress in separating the board.
It is best to implement all of the following three measures; however, implement as many measures as possible to reduce
stress.
Contents of measures
Stress level
A > D*1
A > B
(1) Turn the mounting direction of the component parallel to the
board separation surface.
(2) Add slits in the board separation part.
(3) Keep the mounting position of the component away from the
board separation surface.
A > C
*1 A > D is valid when stress is added vertically to the perforation as with hand separation.
If a cutting disc is used, stress will be diagonal to the PCB, therefore A > D is invalid.
(3) Mounting components near screw holes
When a component is mounted near a screw hole, it may be affected by the board deflection that occurs during the
tightening of the screw.
Mount the component in a position as far away from the screw holes as possible.
12.7 Handling of substrate
After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the substrate
when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to the substrate.
Excessive mechanical stress may cause cracking in the product.
Bending
Twisting
MURATA MFG CO., LTD
Spec No.: JELF243B_0009U-01
P11/12
12.8 Cleaning
The product shall be cleaned under the following conditions.
(1) The cleaning temperature shall be 60°C max. If isopropyl alcohol (IPA) is used, the cleaning temperature shall be 40°C
max.
(2) Perform ultrasonic cleaning under the following conditions. Exercise caution to prevent resonance phenomenon in
mounted products and the PCB.
Item
Power
Requirement
20 W/L max.
Time
5 min max.
Frequency
(3) Cleaner
28 kHz to 40 kHz
Alcohol-based cleaner: IPA
Aqueous agent: PINE ALPHA ST-100S
(4) There shall be no residual flux or residual cleaner. When using aqueous agent, rinse the product with deionized water
adequately and completely dry it so that no cleaner is left.
* For other cleaning, consult our technical department.
12.9 Storage and transportation
Storage period
Use the product within 6 months after delivery.
If you do not use the product for more than 6 months, check solderability before using it.
Storage conditions • The products shall be stored in a room not subject to rapid changes in temperature and
humidity. The recommended temperature range is -10°C to +40°C. The recommended relative
humidity range is 15% to 85%.
Keeping the product in corrosive gases, such as sulfur, chlorine gas or acid may cause the
poor solderability.
• Do not place the products directly on the floor; they should be placed on a palette so that they
are not affected by humidity or dust.
• Avoid keeping the products in a place exposed to direct sunlight, heat or vibration.
• Do not keep products in bulk packaging. Bulk storage could result in collisions between the
products or between the products and other parts, resulting in chipping or wire breakage.
• Avoid storing the product by itself bare (i.e. exposed directly to air).
Transportation
Excessive vibration and impact reduces the reliability of the products. Exercise caution when
handling the products.
12.10 Resin coating (including moisture-proof coating)
When the product is coated/molded with resin, its electrical characteristics may change.
A wire breakage issue may occur by mechanical stress caused by the resin, amount/cured shape of resin, or operating
condition etc.
Some resins contain impurities or hydrolyzable chlorine, which could result in corrosion of the conducting materials, leading
to wire breakage.
So, please pay your careful attention when you select resin in case of coating/molding the products with the resin.
Prior to use the coating resin, please make sure no reliability issue is observed by evaluating products mounted on your
board.
12.11 Mounting conditions
Check the mounting condition before using.
Using mounting conditions (nozzles, equipment conditions, etc.) that are not suitable for products may lead to pick up errors,
misalignment, or damage to the product.
12.12 Operating environment
Do not use this product under the following environmental conditions as it may cause deterioration of product quality.
(1) In the corrodible atmosphere such as acidic gases, alkaline gases, chlorine, sulfur gases, organic gases and etc.
(the sea breeze, Cl2, H2S, NH3, SO2, NO2, etc)
(2) In the atmosphere where liquid such as organic solvent, may splash on the products.
(3) In the atmosphere where the temperature/humidity changes rapidly and it is easy to dew.
12.13 Mounting density
If this product is placed near heat-generating products, be sure to implement sufficient heat-dissipating measures.
If this product is subjected to a significant amount of heat from other products, this could adversely affect product quality,
resulting in a circuit malfunction or failure of the mounted section. Also, be sure that the product is used in a manner so that
the heat that the product is subjected to from other products does not exceed the upper limit of the rated operating
temperature for the product.
MURATA MFG CO., LTD
Spec No.: JELF243B_0009U-01
P12/12
13.
Note
(1) Please make sure that your product has been evaluated in view of your specifications with our product being
mounted to your product.
(2) You are requested not to use our product deviating from the reference specifications.
(3) The contents of this reference specification are subject to change without advance notice.
Please approve our product specifications or transact the approval sheet for product specifications
before ordering.
Appendix
Electrical performance: Measuring method for inductance/Q (Q measurement is applicable only when the Q value is
included in the rating table.)
Perform measurement using the method described below. (Perform correction for the error deriving from the measuring
terminal.)
(1) Residual elements and stray elements of the measuring terminal can be expressed by the F parameter for the 2-pole
terminal as shown in the figure below.
(2) The product's impedance value (Zx) and measured impedance value (Zm) can be expressed as shown below, by using
the respective current and voltage for input/output.
V1
I1
V2
I2
Zm=
Zx=
(3) Thus, the relationship between the product's impedance value (Zx) and measured impedance value (Zm) is as follows.
Here,
α = D/A = 1
β = B/D = Zsm - (1 - Yom Zsm) Zss
Γ = C/A = Yom
Zm-β
Zx=α
1-ZmΓ
Zsm: measured impedance of short chip
Zss: residual impedance of short chip (0.556 nH)
Yom: measured admittance when measuring
terminal is open
(4) Calculate inductance Lx and Qx using the equations shown below.
Im(Zx)
Lx: inductance of chip coil
Qx: Q of chip coil
Lx=
2πf
Im(Zx)
Qx=
f: measuring frequency
Re(Zx)
MURATA MFG CO., LTD
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