LQG15HN22NJ02#_技术文档

Spec No.: JELF243B_0009U-01

P1/12

CHIP COILS (CHIP INDUCTORS) LQG15HN□□□□02□ REFERENCE SPECIFICATION

1. Scope

This reference specification applies to chip coils (chip inductors) LQG15HN_02 series for general electronic equipment.

2. Part Numbering

(Ex.)

LQ

G

15

H

N

1N0

S

0

2

D

Product Structure Dimension Application Category Inductance Tolerance Performance Electrode

Packaging

D: taping

*B: bulk

ID

(L × W)

and

specification

characteristic

*B: Bulk packing is also available.

3. Part Number and Rating

Operating temperature range

Storage temperature range

-55°C to +125°C

Inductance

DC

resistance

(Ω max.)

Self-resonant

frequency

(MHz min.)

Customer

Murata

Q

(Min.)

Rated current

Nominal

value

Part number

(mA)

Tolerance

(nH)

LQG15HN1N0B02D

LQG15HN1N0C02D

LQG15HN1N0S02D

LQG15HN1N1B02D

LQG15HN1N1C02D

LQG15HN1N1S02D

LQG15HN1N2B02D

LQG15HN1N2C02D

LQG15HN1N2S02D

LQG15HN1N3B02D

LQG15HN1N3C02D

LQG15HN1N3S02D

LQG15HN1N5B02D

LQG15HN1N5C02D

LQG15HN1N5S02D

LQG15HN1N6B02D

LQG15HN1N6C02D

LQG15HN1N6S02D

LQG15HN1N8B02D

LQG15HN1N8C02D

LQG15HN1N8S02D

LQG15HN2N0B02D

LQG15HN2N0C02D

LQG15HN2N0S02D

LQG15HN2N2B02D

LQG15HN2N2C02D

LQG15HN2N2S02D

LQG15HN2N4B02D

LQG15HN2N4C02D

LQG15HN2N4S02D

1.0

1.1

1.2

1.3

1.5

1.6

1.8

2.0

2.2

2.4

±0.1 nH

±0.2 nH

±0.3 nH

±0.1 nH

±0.2 nH

±0.3 nH

±0.1 nH

±0.2 nH

±0.3 nH

±0.1 nH

±0.2 nH

±0.3 nH

±0.1 nH

±0.2 nH

±0.3 nH

±0.1 nH

±0.2 nH

±0.3 nH

±0.1 nH

±0.2 nH

±0.3 nH

±0.1 nH

±0.2 nH

±0.3 nH

±0.1 nH

±0.2 nH

±0.3 nH

±0.1 nH

±0.2 nH

±0.3 nH

8

0.07

0.08

0.09

0.10

6000

1000

900

800

MURATA MFG CO., LTD

Spec No.: JELF243B_0009U-01

P2/12

Inductance

Nominal

DC

resistance

(Ω max.)

Self-resonant

frequency

(MHz min.)

Customer

Part number

Murata

Part number

Q

(Min.)

Rated current

(mA)

value

(nH)

Tolerance

LQG15HN2N7B02D

LQG15HN2N7C02D

LQG15HN2N7S02D

LQG15HN3N0B02D

LQG15HN3N0C02D

LQG15HN3N0S02D

LQG15HN3N3B02D

LQG15HN3N3C02D

LQG15HN3N3S02D

LQG15HN3N6B02D

LQG15HN3N6C02D

LQG15HN3N6S02D

LQG15HN3N9B02D

LQG15HN3N9C02D

LQG15HN3N9S02D

LQG15HN4N3B02D

LQG15HN4N3C02D

LQG15HN4N3S02D

LQG15HN4N7B02D

LQG15HN4N7C02D

LQG15HN4N7S02D

LQG15HN5N1B02D

LQG15HN5N1C02D

LQG15HN5N1S02D

LQG15HN5N6B02D

LQG15HN5N6C02D

LQG15HN5N6S02D

LQG15HN6N2B02D

LQG15HN6N2C02D

LQG15HN6N2S02D

LQG15HN6N8G02D

LQG15HN6N8H02D

LQG15HN6N8J02D

LQG15HN7N5G02D

LQG15HN7N5H02D

LQG15HN7N5J02D

LQG15HN8N2G02D

LQG15HN8N2H02D

LQG15HN8N2J02D

LQG15HN9N1G02D

LQG15HN9N1H02D

LQG15HN9N1J02D

LQG15HN10NG02D

LQG15HN10NH02D

LQG15HN10NJ02D

2.7

3.0

3.3

3.6

3.9

4.3

4.7

5.1

5.6

6.2

6.8

7.5

8.2

9.1

10

±0.1 nH

±0.2 nH

±0.3 nH

±0.1 nH

±0.2 nH

±0.3 nH

±0.1 nH

±0.2 nH

±0.3 nH

±0.1 nH

±0.2 nH

±0.3 nH

±0.1 nH

±0.2 nH

±0.3 nH

±0.1 nH

±0.2 nH

±0.3 nH

±0.1 nH

±0.2 nH

±0.3 nH

±0.1 nH

±0.2 nH

±0.3 nH

±0.1 nH

±0.2 nH

±0.3 nH

±0.1 nH

±0.2 nH

±0.3 nH

±2%

8

0.10

0.11

0.12

0.13

0.15

0.16

0.18

0.19

0.21

0.24

0.25

0.27

0.29

6000

5300

4300

4200

3900

3600

3400

3200

800

700

600

500

±3%

±5%

±2%

±3%

±5%

±2%

±3%

±5%

±2%

±3%

±5%

±2%

10

±3%

10

±5%

MURATA MFG CO., LTD

Spec No.: JELF243B_0009U-01

P3/12

Inductance

Nominal

DC

resistance

(Ω max.)

Self-resonant

frequency

(MHz min.)

Customer

Part number

Murata

Part number

Q

(Min.)

Rated current

(mA)

value

(nH)

Tolerance

LQG15HN12NG02D

LQG15HN12NH02D

LQG15HN12NJ02D

LQG15HN15NG02D

LQG15HN15NH02D

LQG15HN15NJ02D

LQG15HN18NG02D

LQG15HN18NH02D

LQG15HN18NJ02D

LQG15HN22NG02D

LQG15HN22NH02D

LQG15HN22NJ02D

LQG15HN27NG02D

LQG15HN27NH02D

LQG15HN27NJ02D

LQG15HN33NG02D

LQG15HN33NH02D

LQG15HN33NJ02D

LQG15HN39NG02D

LQG15HN39NH02D

LQG15HN39NJ02D

LQG15HN47NG02D

LQG15HN47NH02D

LQG15HN47NJ02D

LQG15HN56NG02D

LQG15HN56NH02D

LQG15HN56NJ02D

LQG15HN68NG02D

LQG15HN68NH02D

LQG15HN68NJ02D

LQG15HN82NG02D

LQG15HN82NH02D

LQG15HN82NJ02D

LQG15HNR10G02D

LQG15HNR10H02D

LQG15HNR10J02D

LQG15HNR12G02D

LQG15HNR12H02D

LQG15HNR12J02D

12

15

18

22

27

33

39

47

56

68

82

100

120

±2%

±3%

±5%

±2%

±3%

±5%

±2%

±3%

±5%

±2%

±3%

±5%

±2%

±3%

±5%

±2%

±3%

±5%

±2%

±3%

±5%

±2%

±3%

±5%

±2%

±3%

±5%

±2%

±3%

±5%

±2%

±3%

±5%

±2%

±3%

±5%

±2%

±3%

±5%

8

0.40

0.45

0.51

0.58

0.67

1.06

1.15

1.20

1.25

1.60

2800

2300

2100

1800

1600

1500

1200

1000

800

400

350

300

250

200

150

800

600

4. Testing Conditions

Unless otherwise specified

Temperature: ordinary temperature (15°C to 35°C)

Humidity: ordinary humidity [25% to 85% (RH)]

In case of doubt

Temperature: 20°C±2°C

Humidity: 60% to 70% (RH)

Atmospheric pressure: 86 kPa to 106 kPa

MURATA MFG CO., LTD

Spec No.: JELF243B_0009U-01

P4/12

5. Appearance and Dimensions

Unit mass (typical value): 0.001 g

6. Marking

7. Electrical Performance

No.

Item

Specification

Meet chapter 3 ratings.

Test method

Measuring equipment: Keysight E4991A or the

equivalent

7.1 Inductance

7.2 Q

Measuring frequency: 100 MHz

Measuring conditions:

Measurement signal level: Approx. 0 dBm

Measurement terminal distance: 0.5 mm

Electrical length: 10 mm

Weight: Approx. 1 N to 5 N

Measuring fixture: Keysight 16197A

Position the chip coil under test as shown in the

measuring example below and connect it to the

electrode by applying weight.

Measurement example:

Measuring method: see "Electrical performance:

Measuring method for inductance/Q" in the Appendix.

Measuring equipment: digital multimeter

Measuring equipment: Keysight 8753C or the

equivalent

7.3 DC resistance

7.4 Self-resonant

frequency

Meet chapter 3 ratings.

7.5 Rated current

Product temperature rise: 25°C max.

Apply the rated current specified in chapter 3.

MURATA MFG CO., LTD

Spec No.: JELF243B_0009U-01

P5/12

8. Mechanical Performance

No.

Item

Specification

Test method

8.1 Shear test

No significant mechanical damage or no Test substrate: glass-epoxy substrate

sign of electrode peeling off shall be

observed.

Applying force: 5 N

Holding time: 5 s±1 s

Force application direction:

8.2 Bending test

No significant mechanical damage or no Test substrate: glass-epoxy substrate (100 mm × 40

sign of electrode peeling off shall be

observed.

mm × 0.8 mm)

Pressurizing speed: 1 mm/s

Pressure jig: R340

Deflection: 2 mm

Holding time: 30 s

8.3 Vibration

Appearance shall have no significant

mechanical damage.

Oscillation frequency: 10 Hz to 55 Hz to 10 Hz, for

approx. 1 min

Inductance change rate: within ±10%

Total amplitude: 1.5 mm

Test time: 3 directions perpendicular to each other, 2

h for each direction (6 h in total)

8.4 Solderability

90% or more of the outer electrode shall Flux: immersed in ethanol solution with a rosin

be covered with new solder seamlessly. content of 25(wt)% for 5 s to 10 s

Solder: Sn-3.0Ag-0.5Cu solder

Pre-heating: 150°C±10°C/60 s to 90 s

Solder temperature: 240°C±5°C

Immersion time: 3 s±1 s

8.5 Resistance to

soldering heat

Appearance: No significant mechanical Flux: immersed in ethanol solution with a rosin

damage shall be observed.

content of 25(wt)% for 5 s to 10 s

Solder: Sn-3.0Ag-0.5Cu solder

Inductance change rate: within ±10%

Pre-heating: 150°C±10°C/1 min to 2 min

Solder temperature: 270°C±5°C

Immersion time: 10 s±1 s

Post-treatment: left at a room condition for 24 h±2 h

9. Environmental Performance

The product is soldered on a glass-epoxy substrate for test.

No.

Item

Specification

Test method

9.1 Humidity

Appearance: No significant mechanical Temperature: 40°C±2°C

damage shall be observed.

Humidity: 90% (RH) to 95% (RH)

Inductance change rate: within ±10%

Test time: 1000 h (+48 h, -0 h)

Post-treatment: left at a room condition for 24 h±2 h

9.2 Heat life

Appearance: No significant mechanical Temperature: 125°C±2°C

damage shall be observed.

Applied current: Rated current specified in chapter 3

Inductance change rate: within ±10%

Test time: 1000 h (+48 h, -0 h)

Post-treatment: left at a room condition for 24 h±2 h

9.3 Humidity load

Appearance: No significant mechanical Temperature: 40°C±2°C

damage shall be observed.

Humidity: 90% (RH) to 95% (RH)

Inductance change rate: within ±10%

Applied current: Rated current specified in chapter 3

Test time: 1000 h (+48 h, -0 h)

Post-treatment: left at a room condition for 24 h±2 h

MURATA MFG CO., LTD

Spec No.: JELF243B_0009U-01

No. Item

P6/12

Specification

Test method

9.4 Temperature cycle

Appearance: No significant mechanical Single cycle conditions:

damage shall be observed.

Step 1: -55°C (+0°C, -3°C)/30 min±3 min

Inductance change rate: within ±10%

Step 2: ordinary temperature/2 min to 3 min

Step 3: +125°C (+3°C, -0°C)/30 min±3 min

Step 4: ordinary temperature/2 min to 3 min

Number of testing: 10 cycles

Post-treatment: left at a room condition for 24 h±2 h

10. Specification of Packaging

10.1 Appearance and dimensions of tape (8 mm width/paper tape)

A

B

t

0.62±0.04

1.12±0.04

0.8 max.

(in mm)

10.2 Taping specifications

Packing quantity

10000 pcs/reel

(Standard quantity)

Packing method

Feed hole position

Joint

The products are placed in cavities of a carrier tape and sealed by a cover tape (top tape and bottom

tape when the cavities of the carrier tape are punched type).

The feed holes on the carrier tape are on the right side when the cover tape (top tape when the

cavities of the carrier tape are punched type) is pulled toward the user.

The carrier tape and cover tape (top tape when the cavities of the carrier tape are punched type) are

seamless.

Number of missing

products

Number of missing products within 0.025% of the number per reel or 1 pc., whichever is greater, and

are not continuous. The specified quantity per reel is kept.

10.3 Break down force of tape

Cover tape (or top tape)

5 N min.

Bottom tape (only when the cavities of the carrier tape are punched

type)

MURATA MFG CO., LTD

Spec No.: JELF243B_0009U-01

P7/12

10.4 Peeling off force of tape

Speed of peeling off

300 mm/min

0.1 N to 0.6 N (The lower limit is for typical value.)

Peeling off force

10.5 Dimensions of leader section, trailer section and reel

A vacant section is provided in the leader (start) section and trailer (end) section of the tape for the product. The leader

section is further provided with an area consisting only of the cover tape (or top tape). (See the diagram below.)

10.6 Marking for reel

Customer part number, Murata part number, inspection number (*1), RoHS marking (*2), quantity, etc.

*1 Expression of inspection No.: (1) Factory code



□□

(1)

○○○○

(2)

(2) Date

First digit: year/last digit of year

(3)

Second digit: month/Jan. to Sep.→1 to 9, Oct. to Dec.→O, N, D

Third, Fourth digit: day

(3) Serial No.

*2 Expression of RoHS marking: (1) RoHS regulation conformity

ROHS-

Y

()

(2) Murata classification number

(1)

(2)

10.7 Marking on outer box (corrugated box)

Customer name, purchasing order number, customer part number, Murata part number, RoHS marking (*2), quantity, etc.

10.8 Specification of outer box

Dimensions of outer box

Standard reel quantity

(mm)

Label

in outer box (reel)

W

D

H

186

93

5

D

* Above outer box size is typical. It depends on a

quantity of an order.

W

MURATA MFG CO., LTD

Spec No.: JELF243B_0009U-01

P8/12

11.

Caution

11.1 Restricted applications

Please contact us before using our products for the applications listed below which require especially high reliability for the

prevention of defects which might directly cause damage to the third party's life, body or property.

(1) Aircraft equipment

(2) Aerospace equipment

(3) Undersea

equipment

(4) Power plant

control equipment

(5) Medical equipment

(6) Transportation equipment (vehicles, (7) Traffic signal

trains, ships, etc.) equipment

(8) Disaster/crime

prevention

equipment

(9) Data-processing

equipment

(10) Applications of similar complexity and/or reliability

requirements to the applications listed in the above

11.2 Precautions on rating

Avoid using in exceeded the rated temperature range, rated voltage, or rated current.

Usage when the ratings are exceeded could lead to wire breakage, burning, or other serious fault.

11.3 Inrush current

If an inrush current (or pulse current or rush current) that significantly exceeds the rated current is applied to the product,

overheating could occur, resulting in wire breakage, burning, or other serious fault.

12. Precautions for Use

This product is for use only with reflow soldering. It is designed to be mounted by soldering. If you want to use other

mounting method, for example, using a conductive adhesive, please consult us beforehand.

Also, if repeatedly subjected to temperature cycles or other thermal stress, due to the difference in the coefficient of thermal

expansion with the mounting substrate, the solder (solder fillet part) in the mounting part may crack.

The occurrence of cracks due to thermal stress is affected by the size of the land where mounted, the solder volume, and

the heat dissipation of the mounting substrate. Carefully design it when a large change in ambient temperature is assumed.

12.1. Land dimensions

The following diagram shows the recommended land dimensions for reflow soldering:

a

b

c

0.4

1.2

0.5

(in mm)

12.2 Flux and solder used

Flux

• Use a rosin-based flux.

• Do not use a highly acidic flux with a halide content exceeding 0.2(wt)% (chlorine conversion value).

• Do not use a water-soluble flux.

Solder

• Use Sn-3.0Ag-0.5Cu solder.

• Standard thickness of solder paste: 100 μm to 150 μm

If you want to use a flux other than the above, please consult our technical department.

MURATA MFG CO., LTD

Spec No.: JELF243B_0009U-01

P9/12

12.3 Soldering conditions (reflow)

• Pre-heating should be in such a way that the temperature difference between solder and product surface is limited to

150°C max.

Cooling into solvent after soldering also should be in such a way that the temperature difference is limited to 100°C max.

Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of product quality.

• Standard soldering profile and the limit soldering profile is as follows.

The excessive limit soldering conditions may cause leaching of the electrode and/or resulting in the deterioration of

product quality.

Temp.

(℃)

260℃

230℃

Limit Profile

245℃±3℃

220℃

180

150

Standard Profile

30s～60s

60s max.

90s±30s

Time.(s)

Standard profile

Limit profile

Pre-heating

150°C to 180°C/90 s±30 s

Above 220°C/30 s to 60 s

245°C±3°C

150°C to 180°C/90 s±30 s

Above 230°C/60 s max.

260°C/10 s

Heating

Peak temperature

Number of reflow cycles

2 times

12.4 Reworking with soldering iron

The following requirements must be met to rework a soldered product using a soldering iron.

Item

Requirement

150°C/approx. 1 min

350°C max.

Pre-heating

Tip temperature of soldering iron

Power consumption of soldering iron

Tip diameter of soldering iron

Soldering time

80 W max.

ø3 mm max.

3 s (+1 s, -0 s)

2 times max.

Number of reworking operations

* Avoid a direct contact of the tip of the soldering iron with the product. Such a

direction contact may cause cracks in the ceramic body due to thermal

shock.

12.5 Solder volume

Solder shall be used not to be exceeded the upper limits as shown below.

An increased solder volume increases mechanical stress on the product. Exceeding solder volume may cause the failure of

mechanical or electrical performance.

MURATA MFG CO., LTD

Spec No.: JELF243B_0009U-01

P10/12

12.6 Product's location

The following shall be considered when designing and laying out PCBs.

(1) PCB shall be designed so that products are not subject to mechanical stress due to warping the board.

[Products direction]

Products shall be located in the sideways direction (length: a < b) to the mechanical stress.

a

b

Poor example

〈

〉

Good example

〈

〉

(2) Components location on PCB separation

It is effective to implement the following measures, to reduce stress in separating the board.

It is best to implement all of the following three measures; however, implement as many measures as possible to reduce

stress.

Contents of measures

Stress level

A > D^*1

A > B

(1) Turn the mounting direction of the component parallel to the

board separation surface.

(2) Add slits in the board separation part.

(3) Keep the mounting position of the component away from the

board separation surface.

A > C

*1 A > D is valid when stress is added vertically to the perforation as with hand separation.

If a cutting disc is used, stress will be diagonal to the PCB, therefore A > D is invalid.

(3) Mounting components near screw holes

When a component is mounted near a screw hole, it may be affected by the board deflection that occurs during the

tightening of the screw.

Mount the component in a position as far away from the screw holes as possible.

12.7 Handling of substrate

After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the substrate

when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to the substrate.

Excessive mechanical stress may cause cracking in the product.

Bending

Twisting

MURATA MFG CO., LTD

Spec No.: JELF243B_0009U-01

P11/12

12.8 Cleaning

The product shall be cleaned under the following conditions.

(1) The cleaning temperature shall be 60°C max. If isopropyl alcohol (IPA) is used, the cleaning temperature shall be 40°C

max.

(2) Perform ultrasonic cleaning under the following conditions. Exercise caution to prevent resonance phenomenon in

mounted products and the PCB.

Item

Power

Requirement

20 W/L max.

Time

5 min max.

Frequency

(3) Cleaner

28 kHz to 40 kHz

Alcohol-based cleaner: IPA

Aqueous agent: PINE ALPHA ST-100S

(4) There shall be no residual flux or residual cleaner. When using aqueous agent, rinse the product with deionized water

adequately and completely dry it so that no cleaner is left.

* For other cleaning, consult our technical department.

12.9 Storage and transportation

Storage period

Use the product within 6 months after delivery.

If you do not use the product for more than 6 months, check solderability before using it.

Storage conditions • The products shall be stored in a room not subject to rapid changes in temperature and

humidity. The recommended temperature range is -10°C to +40°C. The recommended relative

humidity range is 15% to 85%.

Keeping the product in corrosive gases, such as sulfur, chlorine gas or acid may cause the

poor solderability.

• Do not place the products directly on the floor; they should be placed on a palette so that they

are not affected by humidity or dust.

• Avoid keeping the products in a place exposed to direct sunlight, heat or vibration.

• Do not keep products in bulk packaging. Bulk storage could result in collisions between the

products or between the products and other parts, resulting in chipping or wire breakage.

• Avoid storing the product by itself bare (i.e. exposed directly to air).

Transportation

Excessive vibration and impact reduces the reliability of the products. Exercise caution when

handling the products.

12.10 Resin coating (including moisture-proof coating)

When the product is coated/molded with resin, its electrical characteristics may change.

A wire breakage issue may occur by mechanical stress caused by the resin, amount/cured shape of resin, or operating

condition etc.

Some resins contain impurities or hydrolyzable chlorine, which could result in corrosion of the conducting materials, leading

to wire breakage.

So, please pay your careful attention when you select resin in case of coating/molding the products with the resin.

Prior to use the coating resin, please make sure no reliability issue is observed by evaluating products mounted on your

board.

12.11 Mounting conditions

Check the mounting condition before using.

Using mounting conditions (nozzles, equipment conditions, etc.) that are not suitable for products may lead to pick up errors,

misalignment, or damage to the product.

12.12 Operating environment

Do not use this product under the following environmental conditions as it may cause deterioration of product quality.

(1) In the corrodible atmosphere such as acidic gases, alkaline gases, chlorine, sulfur gases, organic gases and etc.

(the sea breeze, Cl2, H2S, NH3, SO2, NO2, etc)

(2) In the atmosphere where liquid such as organic solvent, may splash on the products.

(3) In the atmosphere where the temperature/humidity changes rapidly and it is easy to dew.

12.13 Mounting density

If this product is placed near heat-generating products, be sure to implement sufficient heat-dissipating measures.

If this product is subjected to a significant amount of heat from other products, this could adversely affect product quality,

resulting in a circuit malfunction or failure of the mounted section. Also, be sure that the product is used in a manner so that

the heat that the product is subjected to from other products does not exceed the upper limit of the rated operating

temperature for the product.

MURATA MFG CO., LTD

Spec No.: JELF243B_0009U-01

P12/12

13.

Note

(1) Please make sure that your product has been evaluated in view of your specifications with our product being

mounted to your product.

(2) You are requested not to use our product deviating from the reference specifications.

(3) The contents of this reference specification are subject to change without advance notice.

Please approve our product specifications or transact the approval sheet for product specifications

before ordering.

Appendix

Electrical performance: Measuring method for inductance/Q (Q measurement is applicable only when the Q value is

included in the rating table.)

Perform measurement using the method described below. (Perform correction for the error deriving from the measuring

terminal.)

(1) Residual elements and stray elements of the measuring terminal can be expressed by the F parameter for the 2-pole

terminal as shown in the figure below.

(2) The product's impedance value (Zx) and measured impedance value (Zm) can be expressed as shown below, by using

the respective current and voltage for input/output.

V₁

I₁

V₂

I₂

Zm=

Zx=

(3) Thus, the relationship between the product's impedance value (Zx) and measured impedance value (Zm) is as follows.

Here,

α = D/A = 1

β = B/D = Zsm - (1 - Yom Zsm) Zss

Γ = C/A = Yom

Zm-β

Zx=α

1-ZmΓ

Zsm: measured impedance of short chip

Zss: residual impedance of short chip (0.556 nH)

Yom: measured admittance when measuring

terminal is open

(4) Calculate inductance Lx and Qx using the equations shown below.

Im(Zx)

Lx: inductance of chip coil

Qx: Q of chip coil

Lx=

2πf

Im(Zx)

Qx=

f: measuring frequency

Re(Zx)

MURATA MFG CO., LTD


型号：	LQG15HN22NJ02#
厂家：	muRata
描述：
文件：	总12页 (文件大小：361K)
中文：	中文翻译
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LQG15HN22NJ02# [MURATA]

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