LQB15NNR22K10# [MURATA]

;


型号：	LQB15NNR22K10#
厂家：	muRata
描述：
文件：	总8页 (文件大小：236K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

Spec.No.JELF243B-0045C-01

P1/8

CHIP COIL (CHIP INDUCTORS) LQB15NN□□□□10D REFERENCESPECIFICATION

1. Scope

This reference specification applies to LQB15NN_10 series, Chip coil (Chip Inductors).

2. Part Numbering

(ex.)

R56

(6)

(7)

(10)

(1)

(2)

(3) (4) (5)

(8) (9)

(1)Product ID (2)Type (3)Dimension(L×Ｗ) (4)Category (5)Applications and Characteristics

(6)Inductance (7)Tolerance (8)Features (9)Electrode (10)Packaging (D:Taping / *B:Bulk)

*Bulk packing also available.

3.Rating

・Operating temperature：-55°C to +125°C

・Storage temperature：-55°C to +125°C

Self

Inductance

Tolerance

Resustance

(Ω max.)

Rating

Current

(mA)

Customer

Part Number

MURATA

Part Number

(min.)

Resonant

Frequency

(MHz min.)

(nH)

220

LQB15NNR22J10D

J：±5%

K：±10%

M：±20%

J：±5%

LQB15NNR22K10D

LQB15NNR22M10D

LQB15NNR27J10D

LQB15NNR27K10D

LQB15NNR27M10D

LQB15NNR33J10D

0.35 ±25%

0.41 ±25%

0.48 ±25%

0.54 ±25%

0.64 ±25%

0.73 ±25%

380

330

300

K：±10%

M：±20%

J：±5%

270

330

390

470

560

K：±10%

M：±20%

J：±5%

LQB15NNR33K10D

LQB15NNR33M10D

LQB15NNR39J10D

K：±10%

M：±20%

J：±5%

LQB15NNR39K10D

LQB15NNR39M10D

LQB15NNR47J10D

LQB15NNR47K10D

LQB15NNR47M10D

LQB15NNR56J10D

LQB15NNR56K10D

LQB15NNR56M10D

K：±10%

M：±20%

J：±5%

K：±10%

M：±20%

4. Testing Conditions

< Unless otherwise specified >

Temperature : Ordinary Temp. (15 °C to 35 °C )

< In case of doubt >

Temperature : 20°C±2 °C

Humidity : Ordinary Humidity (25%(RH) to 85%(RH))

Humidity : 60%(RH) to 70%(RH)

Atmospheric pressure : 86kPa to 106kPa

5.Appearance and Dimensions

1.0±0.05

0.5±0.05

※No marking.

0.25±0.1

■ Unit Mass(Typical value)

: Electrode

(in mm)

0.001g

MURATA MFG.CO.,LTD.

Spec.No.JELF243B-0045C-01

P2/8

6.Specifications

6-1.Electrical Performance

No.

6-1-1 Inductance

6-1-2

Item

Specification

Meet item 3.

Test Method

Measuring Frequency : 25MHz

Measuring Equipment : Agilent 4291A or the equivalent

Test Fixture : Agilent 16192A or the equivalent

6-1-3 SRF

6-1-4 DC

Meet item 3.

Measuring Equipment : Digital multi meter

Resistance

Rated

Current

Self temperature rise shall be

limited to 25°C max.

The rated current is applied.

6-1-5

6-2.Mechanical Performance

No. Item

Specification

Meet item 5.

Test Method

6-2-1 Appearance

And

Visual Inspection and measured with Slide Calipers.

Dimensions

6-2-2 Bonding

Strength

It shall be soldered on the substrate.

Applying Force(F) : 5N

Applying Time : 5s±1s

Chip coil shall not be damaged

after test as test method.

Applying Direction: Parallel to the substrate.

Side view

Ｆ

R0.5

Substrate

Appearance: No damage

6-2-3 Bending

Strength

It shall be soldered on the substrate.

Substrate: Glass-epoxy 100mm×40mm×0.8mm

Deflection : 2.0mm

Speed of Applying Force : 0.5mm/s

Pressure jig

Keeping Time : 30s

R340

Deflection

45mm

Product

6-2-4 Vibration

It shall be soldered on the substrate.

Oscillation Frequency : 10Hz to 55Hz to 10Hz for 1 min

Total Amplitude : 1.5mm

Testing Time : A period of 2 hours in each of 3 mutually

perpendicular directions. (Total 6 h)

Pre-Heating : 150°C±10°C, 60s～90s

Solder : Sn-3.0Ag-0.5Cu

Solder Temperature : 270°C±5°C

Immersion Time : 10s±0.5s

6-2-5 Resistance

to Soldering

Heat

Immersion and emersion rates : 25mm/s

Then measured after exposure in the room conditionfor

48h±4h.

MURATA MFG.CO.,LTD.

Spec.No.JELF243B-0045C-01

P3/8

No.

Item

Specification

Test Method

6-2-6 Drop

Products shall be no failure

after test.

It shall be dropped on concrete or steel board.

Method : free fall

Height : 75cm

Attitude from which the product is dropped :

3 direction

The number of times : 3 times for each direction

(Total 9 times)

The wetting area of the electrode

shall be at least 90% covered

with new solder coating.

6ｰ2-7 Solderability

Flux : Ethanol solution of rosin,25(wt)%

Pre-Heating : 150°C±10°C, 60s～90s

Solder : Sn-3.0Ag-0.5Cu

Solder Temperature : 240°C±5°C

Immersion Time : 3s±1s

Immersion and emersion rates : 25mm/s

6-3.Environmental Performance

It shall be soldered on the substrate.

No.

Item

Specification

Test Method

6-3-1 Temperature

Cycle

1 cycle :

Appearance: No damage

Inductance Change: within ±50%

1 step : -55 °C(+0 °C,-3 °C) / 30min±3min

2 step : Ordinary temp. / 10min to 15min

3 step : +125 °C(+3 °C,-0 °C) / 30min±3min

4 step : Ordinary temp. / 10min to 15min

Total of 100 cycles

Then measured after exposure in the room condition

for 48h±4h.

6-3-2 Humidity

Temperature : 40°C±2°C

Appearance: No damage

Humidity : 90%RH to 95%RH

Time : 1000h(+48h,-0h)

Inductance Change: within ±30%

Then measured after exposure in the room condition

for 48h±4h.

6-3-3 Heat Resistance

6-3-4 Cold Resistance

Temperature : 125°C±3°C

Applying Current : Rated Current

Time : 1000h(+48h,-0h)

Then measured after exposure in the room condition

for 48h±4h.

Temperature : -55±2°C

Time : 1000h(+48h,-0h)

Then measured after exposure in the room condition

for 48h±4h.

MURATA MFG.CO.,LTD.

Spec.No.JELF243B-0045C-01

P4/8

7.Specification of Packaging

7-1.Appearance and Dimensions (8mm-wide paper tape)

2.0±0.05

4.0±0.1

2.0±0.05

1.5^+0.1

-0

0.8max.

0.65(Typ.)

(0.65)

(in mm)

Direction of Feed

(1) Taping

Products shall be packaged in the cavity of the base tape of 8mm-wide, 2mm-pitch continuously and sealed

by top tape and bottom tape.

(2) Sprocket hole:Sprocket hole shall be located on the right hand side toward the direction of feed.

(3) Spliced point:The base tape and top tape have no spliced point

(4) Cavity:There shall not be burr in the cavity.

(5) Missing components number

Missing components number within 0.1% of the number per reel or 1 pc., whichever is greater, and are not

continuous. The specified quantity per reel is kept.

7-2.Tape Strength

(1)Pull Strength

Top tape

5N min.

Top tape

Bottom tape

(2)Peeling off force of Cover tape

165 to 180 degree

0.1N to 0.6N (Minimum value is typical.)

Bottom tape

*Speed of Peeling off:300mm/min

Base tape

7-3.Taping Condition

(1)Standard quantity per reel

Quantity per 180mm reel

10000 pcs. / reel

(2)There shall be leader-tape(top tape and empty tape) and trailer- tape(empty tape) as follows.

(3)On paper tape, the top tape and the base tape shall not be adhered at the tip of the empty leader tape

for more than 5 pitch.

(4)Marking for reel

The following items shall be marked on a label and the label is stuck on the reel.

(Customer part number, MURATA part number, Inspection number(∗1) , RoHS marking(∗2) , Quantity, etc)

∗1) « Expression of Inspection No. »

□□ OOOO ×××

(1) (2) (3)

(1) Factory Code

(2) Date

First digit

: Year / Last digit of year

Second digit

: Month / Jan. to Sep. → 1 to 9, Oct. to Dec. → O,N,D

Third, Fourth digit : Day

(3) Serial No.

∗2) « Expression of RoHS marking »

ROHS – Y (△)

(1) (2)

(1) RoHS regulation conformity parts.

(2) MURATA classification number

(5)Outside package

These reels shall be packed in the corrugated cardboard package and the following items shall be marked

on a label and the label is sticked on the box.

(Customer name, Purchasing order number, Customer part number, MURATA part number,

RoHS marking(∗2) ,Quantity, etc)

MURATA MFG.CO.,LTD.

Spec.No.JELF243B-0045C-01

P5/8

(6)Dimensions of reel and taping(leader-tape, trailer-tape)

Trailer

Leader

160 min.

2.0±0.5

Label

190 min.

Empty tape

210 min.

Top tape

13.0±0.2

60⁺¹

Direction of feed

21.0±0.8

-0

9.0

13.0±1.4

180 ⁺⁰

-3

(in mm)

7-4. Specification of Outer Case

Outer Case Dimensions

(mm)

Standard Reel Quantity in Outer Case

(Reel)

Label

186

∗ Above Outer Case size is typical. It depends on a quantity of an

order.

8. ！ Caution

8-1. Surge current

Excessive surge current ( pulse current or rush current) than specified rated current applied to the product may cause

a critical failure, such as an open circuit, burnout caused by excessive temperature rise.

Please contact us in advance in case of applying the surge current.

8-2.Limitation of Applications

Please contact us before using our products for the applications listed below which require especially high

reliability for the prevention of defects which might directly cause damage to the third party's life, body or property.

(1)Aircraft equipment

(6)Disaster prevention / crime prevention equipment

(7)Traffic signal equipment

(8)Transportation equipment (vehicles,trains,ships,etc.)

(9)Applications of similar complexity and /or reliability requirements

to the applications listed in the above

(2)Aerospace equipment

(3)Undersea equipment

(4)Power plant control equipment

(5)Medical equipment

9.Notice

This product is designed for solder mounting.

Please consult us in advance for applying other mounting method such as conductive adhesive.

9-1.Land pattern designing

• Standard land dimensions (Reflow soldering)

Chip Ferrite Bead

0.5

Solder Resist

0.4

Pattern

1.2～1.4

(in mm)

MURATA MFG.CO.,LTD.

Spec.No.JELF243B-0045C-01

P6/8

9-2.Soldering Conditions

Products can be applied to reflow soldering.

(1) Flux,Solder

Flux

Use rosin-based flux, but not highly acidic flux (with chlorine content exceeding 0.2(wt)%. )

Do not use water-soluble flux.

Solder

Use Sn-3.0Ag-0.5Cu solder

Standard thickness of solder paste : 100 µm to 200 μm

(2) Soldering conditions

• Pre-heating should be in such a way that the temperature difference between solder and ferrite surface is limited

to 150℃ max. Also cooling into solvent after soldering should be in such a way that the temperature difference

is limited to 100℃ max.

Insufficient pre-heating may cause cracks on the ferrite, resulting in the deterioration of product quality.

• Standard soldering profile and the limit soldering profile is as follows.

The excessive limit soldering conditions may cause leaching of the electrode and / or resulting

in the deterioration of product quality.

(3) Soldering profile

Temp.

(℃)

260℃

230℃

Limit Profile

245℃±3℃

220℃

180

150

Standard Profile

30s～60s

60s max.

90s±30s

Time.(s)

Standard Profile

150～180°C 、90s±30s

above 220°C、30s～60s

245±3°C

Limit Profile

Pre-heating

Heating

above 230°C、60s max.

260°C,10s

Peak temperature

Cycle of reflow

2 times

9-3. Reworking with soldering iron

• Pre-heating: 150°C, 1 min

• Soldering iron output: 80W max.

• Tip diameter:φ3mm max.

• Times : 2times max.

• Tip temperature: 350°C max.

• Soldering time : 3(+1,-0) seconds.

Note :Do not directly touch the products with the tip of the soldering iron in order to prevent the crack

on the ferrite material due to the thermal shock.

9-4.Solder Volume

Solder shall be used not to be exceed as shown below.

Upper Limit

Recommendable

1/3T≦t≦T

(T:Chip thickness)

Accordingly increasing the solder volume, the mechanical stress to product is also increased.

Exceeding solder volume may cause the failure of mechanical or electrical performance.

MURATA MFG.CO.,LTD.

Spec.No.JELF243B-0045C-01

P7/8

9-5.Attention regarding P.C.B. bending

The following shall be considered when designing and laying out P.C.B.'s.

(1) P.C.B. shall be designed so that products are not subject to the mechanical stress for board warpage.

Products shall be located in the sideways

direction (Length:a<b) to the mechanical

stress.

Poor example

〈

〉

Good example

〈

〉

(2)Products location on P.C.B. separation.

Products (A,B,C,D) shall be located carefully

so that products are not subject to the

Seam

mechanical stress due to warping the board.

Because they may be subjected the mechanical

stress in order of A>C>B ≅ D.

Slit

Length:a b

9-6.Mounting density

Add special attention to radiating heat of products when mounting the inductor near the products with heating.

The excessive heat by other products may cause deterioration at joint of this product with substrate.

9-7.Operating Environment

Do not use this product under the following environmental conditions, on deterioration of the Insulation

Resistance of the Ferrite material and/or corrosion of Inner Electrode may result from the use.

(1) in the corrodible atmosphere (acidic gases, alkaline gases, chlorine, sulfur gases, organic gases and etc.)

(2) in the atmosphere where liquid such as organic solvent, may splash on the products.

(3) in the atmosphere where the temperature / humidity changes rapidly and it is easy to dew.

9-8.Resin coating

The impedance value may change and/or it may affect on the product's performance due to high cure-stress of

resin to be used for coating / molding products. So please pay your careful attention when you select resin. In prior

to use, please make the reliability evaluation with the product mounted in your application set.

9-9.Cleaning Conditions

Products shall be cleaned on the following conditions.

(1)Cleaning temperature shall be limited to 60°C max. (40°C max. for IPA.)

(2)Ultrasonic cleaning shall comply with the following conditions, avoiding the resonance phenomenon

at the mounted products and P.C.B.

Power:20W/ max. Frequency:28kHz to 40kHz Time:5 min max.

(3)Cleaner

1.Alternative cleaner

•Isopropyl alcohol (IPA)

2.Aqueous agent

•PINE ALPHA ST-100S

(4)There shall be no residual flux and residual cleaner after cleaning.

In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized water

in order to remove the cleaner.

(5)Other cleaning

Please contact us.

9-10. Handling of a substrate

After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the

substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to

the substrate.

Excessive mechanical stress may cause cracking in the product.

Bending

Twisting

MURATA MFG.CO.,LTD.

Spec.No.JELF243B-0045C-01

P8/8

9-11.Storage Conditions

(1)Storage period

Use the products within 6 months after delivered.

Solderability should be checked if this period is exceeded.

(2)Storage conditions

• Products should be stored in the warehouse on the following conditions.

Temperature : -10°C to 40°C

Humidity

: 15% to 85% relative humidity

No rapid change on temperature and humidity

• Don't keep products in corrosive gases such as sulfur, chlorine gas or acid, or it may cause oxidization

of electrode, resulting in poor solderability.

• Products should be stored on the palette for the prevention of the influence from humidity, dust and so on.

• Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on.

• Products should be stored under the airtight packaged condition.

(3)Delivery

Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock.

10. △Notes

(1)Please make sure that your product has been evaluated in view of your specifications with our product being

mounted to your product.

(2)You are requested not to use our product deviating from the reference specifications.

(3)The contents of this reference specification are subject to change without advance notice.

Please approve our product specifications or transact the approval sheet for product specifications

before ordering.

MURATA MFG.CO.,LTD.

LQB15NNR22K10# [MURATA]

相关型号：

SI9130DB

SI9135LG-T1

SI9135LG-T1-E3

SI9135_11

SI9136_11

SI9130CG-T1-E3

SI9130LG-T1-E3

SI9130_11

SI9137

SI9137DB

SI9137LG

SI9122E