LLM215R71E103MA11# [MURATA]
民用设备,工业设备,移动设备,植入式以外的医疗器械设备 [GHTF A/B/C],汽车[信息娱乐 / 舒适设备];型号: | LLM215R71E103MA11# |
厂家: | muRata |
描述: | 民用设备,工业设备,移动设备,植入式以外的医疗器械设备 [GHTF A/B/C],汽车[信息娱乐 / 舒适设备] 医疗 医疗器械 |
文件: | 总21页 (文件大小:526K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
Only Reflow Soldering
LOW ESL CHIP MONOLITHIC CERAMIC CAPACITOR FOR GENERAL
LLM215R71E103MA11_ (0805, X7R, 10000pF, 25Vdc)
_: packaging code
Reference Sheet
1.Scope
This product specification is applied to Low ESL Chip Monolithic Ceramic Capacitor used for General Electronic equipment.
This product is applied for Only Reflow Soldering.
ꢀꢀ
2.MURATA Part NO. System
(Ex.)
LLM
21
5
R7
1E
103
M
A11
L
(8)Packaging
Code
(2)T
Dimensions
(3)Temperature
Characteristics
(4)DC Rated
Voltage
(5)Nominal (6)Capacitance
(7)Murata’s
Control Code
(1)L/W
Dimensions
Tolerance
Capacitance
3. Type & Dimensions
P
T
W
L
(Unit:mm)
(1)-1 L
(1)-2 W
(2) T
0.5+0.05/-0.1
p
2.0±0.1
1.25±0.1
0.5±0.05
4.Rated value
(3) Temperature Characteristics
(Public STD Code):X7R(EIA)
Specifications and Test
Methods
(4)
DC Rated
Voltage
(6)
(5) Nominal
Capacitance
Capacitance
Tolerance
(Operationg
Temp. Range)
Temp. coeff
orꢀCap. Change
Temp. Range
(Ref.Temp.)
-55 to 125 °C
(25 °C)
25 Vdc
10000 pF
±20 %
-15 to 15 %
-55 to 125 °C
5.Package
mark
(8) Packaging
Packaging Unit
f180mm Reel
EMBOSSED W8P4
f330mm Reel
L
4000 pcs./Reel
10000 pcs./Reel
K
EMBOSSED W8P4
Product specifications in this catalog are as of Jan.30,2013,and are subject to change or obsolescence without notice.
Please consult the approval sheet before ordering.
Please read rating and !Cautions first.
LLM215R71E103MA11-01
1
■SPECIFICATIONS AND TEST METHODS
Specification
R7 / C7:-55℃ to +125℃
No
1
Item
Test Method
Operating
Temperature Range
2
Rated Voltage
See the previous pages.
The rated voltage is defined as the maximum voltage which may be
applied continuously to the capacitor.
When AC voltage is superimposed on DC voltage, VP-P or VO-P
whichever is larger, should be maintained within the rated
voltage range.
,
3
4
5
Appearance
No defects or abnormalities.
Within the specified dimensions.
No defects or abnormalities.
Visual inspection.
Using calipers.
Dimension
Dielectric Strength
No failure shall be observed when 250% of the rated voltage is
applied between the terminations for 1 to 5 seconds, provided the
charge/discharge current is less than 50mA.
6
Insulation
More than 10,000MΩ or 500Ω・F.
The insulation resistance shall be measured with a DC voltage
not exceeding the rated voltage at 25℃ and 75%RH max. and
within 2 minutes of charging.
Resistance
(whichever is smaller)
7
8
Capacitance
Within the specified tolerance.
The capacitance/D.F. shall be measured at 25℃ at the
frequency and voltage shown in the table.
Dissipation Factor
(D.F.)
W.V.:25Vmin. ;0.025 max.
W.V.:16V/10V;0.035 max.
W.V.:6.3V/4V;0.05 max.
1±0.1kHz
*1 C≦10μF
1.0±0.2Vrms
*1 For LLA185 C7 0G 334/474, the capacitance should be measured
using a voltage of 0.5+/-0.1Vrms instead of 1.0+/-0.2Vrms.
The capacitance change shall be measured after 5 min. at
each specified temperature stage.
9
Capacitance
Temperature
Characteristics
Temp.Range Reference
Char.
Cap.Change
Step
1
Temperature(C)
25±2
℃
R7
C7
-55 to +125
25℃
Within ±15%
Within ±22%
-55±3
2
3
-55 to +125
25℃
25±2
125±3
25±2
4
5
The ranges of capacitance change compared with the 25℃ value
over the temperature ranges shown in the table shall be within
the specified ranges.
10 Adhesive Strength of
Termination
No removal of the terminations or other defect
should occur.
Solder the capacitor to the test jig (glass epoxy board) using a
eutectic solder. Then apply 5N force in parallel with the test
jig for 10±1 sec. The soldering shall be done either with an
iron or using the reflow method and shall be conducted with
care so that the soldering is uniform and free of defects such as
heat shock.
11 Vibration
Resistance
Appearance No defects or abnormalities.
Capacitance Within the specified tolerance.
Solder the capacitor to the test jig (glass epoxy board) in the same
manner and under the same conditions as (10). The capacitor shall
be subjected to a simple harmonic motion having a total amplitude
of 1.5mm, the frequency being varied uniformly between the approximate
limits of 10 and 55Hz. The frequency range, from 10 to 55Hz and return
to 10Hz, shall be traversed in approximately 1 minute.
D.F.
W.V.:25Vmin. ;0.025 max.
W.V.:16V/10V;0.035 max.
W.V.:6.3V/4V;0.05 max.
This motion shall be applied for a period of 2 hours in each 3 mutually
perpendicular directions (total of 6 hours).
12 Solderability
of Termination
75% of the terminations is to be soldered evenly Immerse the capacitor in a solution of ethanol (JIS-K-8101) and
and continuously.
rosin (JIS-K-5902) (25% rosin in weight proportion). Preheat at
80 to 120℃ for 10 to 30 seconds. After preheating, immerse in
eutectic solder solution for 2±0.5 seconds at 230±5℃,or
Sn-3.0Ag-0.5Cu solder solution for 2±0.5 seconds at 245±5℃.
JEMCAS-00670A
2
■SPECIFICATIONS AND TEST METHODS
Specification
Appearance No marking defects.
No
Item
Test Method
13 Temperature
Cycle
Fix the capacitor to the supporting jig in the same manner and under
the same conditions as (10). Perform the five cycles according to the
four heat treatments listed in the following table. Let sit for 24±2
hours at room temperature, then measure.
Capacitance Within ±7.5%
Change
Step
1
Min.
Operating
Temp.+0/-3
2
3
4
D.F.
W.V.:25Vmin. ;0.025 max.
Max.
Operating
Temp.+3/-0
Room
Temp.
Room
Temp.
W.V.:16V/10V;0.035 max.
W.V.:6.3V/4V;0.05 max.
Temp.(℃)
Time(min.)
30±3
2 to 3
30±3
2 to 3
I.R.
More than 10,000MΩ or 500Ω・F.
(whichever is smaller)
No failure
・Initial measurement
Dielectric
Strength
Perform a heat treatment at 150+0/-10°C for one houg and then let sit
for 24±2 hours at room temperature.
Perform the initial measurement.
14 Humidity
Appearance No marking defects.
Sit the capacitor at 40±2℃ and 90 to 95% humidity for 500±12
hours. Remove and let sit for 24±2 hours at room temperature,
then measure.
(Steady State)
Capacitance Within ±12.5%
Change
D.F.
I.R.
W.V.:10Vmin. ;0.05 max.
W.V.:6.3V/4V;0.075 max.
More than 1,000MΩ or 50Ω・F.
(whichever is smaller)
15 Humidity Load Appearance No marking defects.
Apply the rated voltage at 40±2℃ and 90 to 95% humidity
for 500±12 hours. Remove and let sit for 24±2 hours at room
temperature, then measure. The charge/discharge current
is less than 50mA.
Capacitance Within ±12.5%
Change
ꢀ
ꢀ
ꢀ
ꢀ
D.F.
I.R.
W.V.:10Vmin. ;0.05 max.
W.V.:6.3V/4V;0.075 max.
More than 500MΩ or 25Ω・F.
ꢀ
ꢀ
ꢀ
(whichever is smaller)
16 High
Temperature
Appearance No marking defects.
Apply 200% of the rated voltage for 1000±12 hours at the
maximum operating temperature ±3℃. Let sit for 24±2 hours at
room temperature,then measure.
Load
Capacitance Within ±12.5%
Change
The charge/discharge current is less than 50mA.
・Initial measurement
D.F.
I.R.
W.V.:10Vmin. ;0.05 max.
W.V.:6.3V/4V;0.075 max.
Apply 200% of the rated DC voltage for one hour at the
maximum operating temperature ±3℃. Remove and let
sit for 24±2 hours at room temperature. Perform initial
measurement.
More than 1,000MΩ or 50Ω・F.
(whichever is smaller)
JEMCAS-00670A
3
Package
LLM Type
1.Tape Carrier Packaging(Packaging Code:L/K)
1.1 Minimum Quantity(pcs./reel)
f180mm reel
f 330mm reel
Plastic Tape
Code : K
10000
Type
Plastic Tape
Code : L
4000
LLM21
LLM31
5
5
4000
10000
1.2 Dimensions of Tape
(in mm)
4.0±0.1
4.0±0.1
2.0±0.1
0.2±0.1
+0.1
φ1.5
-0
A
2.5max
Code
A
B
LLM21
1.45±0.2
2.25±0.2
LLM31
1.9±0.2
3.5±0.2
JEMCAP-01913
4
Package
LLM Type
Fig 1 Package Chip
(in mm)
Chip
Fig2 Dimension of Reel
2.0±0.5
φ21±0.8
10±1.5
16.5 max
Fig3 Taping Diagram
Top Tape : Thickness 0.05
Feeding Hole : As specified in 1.2
Hole for Chip : As specified in 1.2
Base Tape : As specified in 1.2
JEMCAP-01913
5
Package
LLM Type
1.3 Tapes for capacitors are wound clockwise shown in Fig.3.
(The sprocket holes are to the right as the tape is pulled toward the user.)
1.4 Part of the leader and part of the vacant section are attached as follows.
(in mm)
Tail vacant Section
Chip-mounting Unit Leader vacant Section
Leader Unit
(Top Tape only)
Direction
of Feed
160 min.
190 min.
210 min.
1.5 Accumulate pitch : 10 of sprocket holes pitch = 40±0.3mm
1.6 Chip in the tape is enclosed by top tape and bottom tape as shown in Fig.1.
1.7 The top tape and base tape are not attached at the end of the tape for a minimum of 5 pitches.
1.8 There are no jointing for top tape and bottom tape.
1.9 There are no fuzz in the cavity.
1.10 Break down force of top tape : 5N min.
1.11 Reel is made by resin and appeaser and dimension is shown in Fig 3.
There are possibly to change the material and dimension due to some impairment.
1.12 Peeling off force : 0.1N to 0.6N in the direction as shown below.
165 to 180°
Top Tape
1.13 Label that show the customer parts number, our parts number, our company name, inspection
number and quantity, will be put in outside of reel.
JEMCAP-01913
6
! Caution
■ Limitation of use
Please contact our sales representatives or product engineers before using our products for the applications
listed below which require of our products for other applications than specified in this product.
ꢀꢀꢀ①Aircraft equipment ②Aerospace equipment ③Undersea equipment ④Power plant control equipment
ꢀꢀꢀ⑤Medical equipment ⑥Transportation equipment(vehicles,trains,ships,etc.) ⑦Traffic signal equipment
ꢀꢀꢀ⑧Disaster prevention / crime prevention equipment
⑨Data-processing equipment
ꢀꢀꢀ⑩Application of similar complexity and/or requirements to the applications listed in the above
■
1. The performance of chip monolithic ceramic capacitors may be affected by the storage conditions.
1-1. Store capacitors in the following conditions: Temperature of +5℃to +40℃and a Relative Humidity
of 20% to 70%.
(1) Sunlight, dust, rapid temperature changes, corrosive gas atmosphere or high temperature and humidity
conditions during storage may affect the solderability and the packaging performance
Please use product within six months of receipt.
(2) Please confirm solderability before using after six months.
Store the capacitors without opening the original bag.
Even if the storage period is short, do not exceed the specified atmospheric conditions.
1-2. Corrosive gas can react with the termination (external) electrodes or lead wires of capacitors, and result
in poor solderability. Do not store the capacitors in an atmosphere consisting of corrosive gas (e.g.,
hydrogen sulfide, sulfur dioxide, chlorine, ammonia gas etc.).
1-3. Due to moisture condensation caused by rapid humidity changes, or the photochemical change caused
by direct sunlight on the terminal electrodes and/or the resin/epoxy coatings, the solderability and
electrical performance may deteriorate. Do not store capacitors under direct sunlight or in high huimidity
conditions
JEMCAC-00641A
7
!
Caution
■Rating
1.Temperature Dependent Characteristics
1. The electrical characteristics of the capacitor can change with temperature.
1-1. For capacitors having larger temperature dependency, the capacitance may change with temperature
changes.
The following actions are recommended in order to insure suitable capacitance values.
(1) Select a suitable capacitance for the operating temperature range.
(2) The capacitance may change within the rated temperature.
When you use a high dielectric constant type capacitors in a circuit that needs a tight (narrow) capacitance
tolerance.
Example: a time constant circuit., please carefully consider the characteristics of these capacitors,
such as their aging, voltage, and temperature characteristics.
And check capacitors using your actual appliances at the intended environment and operating conditions.
□Typical temperature characteristics Char.R6 (X5R) □Typical temperature characteristics Char.R7 (X7R)
20
15
10
5
0
-5
-10
-15
-20
-75
-50
-25
0
25
50
75
100
Temperature (℃)
□Typical temperature characteristics Char.F5 (Y5V)
40
20
0
-20
-40
-60
-80
-100
-50
-25
0
25
50
75
100
Temperature (℃)
2.Measurement of Capacitance
1. Measure capacitance with the voltage and the frequency specified in the product specifications.
1-1. The output voltage of the measuring equipment may decrease when capacitance is high occasionally.
Please confirm whether a prescribed measured voltage is impressed to the capacitor.
1-2. The capacitance values of high dielectric constant type capacitors change depending on the AC voltage
applied.
Please consider the AC voltage characteristics when selecting a capacitor to be used in a AC circuit.
JEMCAC-00641A
8
Caution
!
3.Applied Voltage
1. Do not apply a voltage to the capacitor that exceeds the rated voltage as called-out in the specifications.
1-1. Applied voltage between the terminals of a capacitor shall be less than or equal to the rated voltage.
(1) When AC voltage is superimposed on DC voltage, the zero-to-peak voltage shall not exceed the
rated DC voltage.
When AC voltage or pulse voltage is applied, the peak-to-peak voltage shall not exceed the
rated DC voltage.
(2) Abnormal voltages (surge voltage, static electricity, pulse voltage, etc.) shall not exceed the
rated DC voltage.
Typical voltage applied to the DC capacitor
DC voltage
DC voltage+AC
AC voltage
Pulse voltage
0
E
E
E
E
0
0
0
(E:Maximum possible applied voltage.)
1-2. Influence of overvoltage
Overvoltage that is applied to the capacitor may result in an electrical short circuit caused by the
breakdown of the internal dielectric layers .
The time duration until breakdown depends on the applied voltage and the ambient temperature.
4. Applied Voltage and Self-heating Temperature
1. When the capacitor is used in a high-frequency voltage, pulse voltage, application,
be sure to take into account self-heating may be caused by resistant factors of the capacitor.
1-1. The load should be contained to the level such that when measuring at atomospheric temperature
of 25℃,the product's self-heating remains below 20℃ and surface temperature of the capacitor in the
actual circuit remains wiyhin the maximum operating temperature.
JEMCAC-00641A
9
Caution
!
5. DC Voltage and AC Voltage Characteristic
1. The capacitance value of a high dielectric constant type capacitor changes depending on the DC
voltage applied.
Please consider the DC voltage characteristics when a capacitor is selected for use in a DC circuit.
1-1. The capacitance of ceramic capacitors may change sharply depending on the applied voltage. (See figure)
Please confirm the following in order to secure the capacitance.
(1) Whether the capacitance change caused by the
applied voltage is within the range allowed or not.
□DC voltage characteristics
20
(2) In the DC voltage characteristics, the rate of capacitance
change becomes larger as voltage increases.
0
-20
Even if the applied voltage is below the rated voltage.
When a high dielectric constant type capacitorꢀis in a
circuit that needs a tight (narrow) capacitance tolerance.
Example: a time constant circuit., please carefully
consider the characteristics of these capacitors, such as
their aging, voltage, and temperature characteristics.
And check capacitors using your actual appliances at the
intended environment and operating conditions.
-40
-60
-80
-100
0
2
4
6
8
DC Voltage (VDC)
2. The capacitance values of high dielectric constant type capacitors change depending on the AC voltage applied.
Please consider the AC voltage characteristics when selecting a capacitor to be used in a AC circuit.
□AC voltage characteristics
30
20
10
0
-10
-20
-30
-40
-50
-60
0.0
0.5
1.0
1.5
2.0
2.5
AC Voltage (Vr.ms.)
6. Capacitance Aging
1. The high dielectric constant type capacitors have the characteristic
in which the capacitance value decreases with passage of time.
When you use a high dielectric constant type capacitors in a circuit that needs a tight (narrow) capacitance
tolerance. Example: a time constant circuit., please carefully consider the characteristics of these capacitors,
such as their aging, voltage, and temperature characteristics.
And check capacitors using your actual appliances at the intended environment and operating conditions.
JEMCAC-00641A
10
Caution
!
7.Vibration and Shock
1. The capacitors mechanical actress (vibration and shock) shall be specified for the use environment.
Please confirm the kind of vibration and/or shock, its condition, and any generation of resonance.
Please mount the capacitor so as not to generate resonance, and do not allow any impact on the terminals.
2. Mechanical shock due to falling may cause damage or a crack in the dielectric material of the capacitor.
Do not use a fallen capacitor because the quality and reliability may be deteriorated.
Crack
Floor
3. When printed circuit boards are piled up or handled, the corners of another printed circuit board
should not be allowed to hit the capacitor in order to avoid a crack or other damage to the capacitor.
Mounting printed circuit board
Crack
■Soldering and Mounting
1.Mounting Position
1. Confirm the best mounting position and direction that minimizes the stress imposed on the capacitor during
flexing or bending the printed circuit board.
1-1.Choose a mounting position that minimizes the stress imposed on the chip during flexing
or bending of the board.
ꢀ[Component Direction]
Locate chip
horizontal to the
direction in
which stress
acts
ꢀ[Chip Mounting Close to Board Separation Point]
C
Perforation
B
Chip arrangement
Worst A-C-(B~D) Best
A
D
Slit
JEMCAC-00641A
11
Caution
!
2.Information before mounting
1. Do Not re-use capacitors that were removed from the equipment.
2. Confirm capacitance characteristics under actual applied voltage.
3. Confirm the mechanical stress under actual process and equipment use.
4. Confirm the rated capacitance, rated voltage and other electrical characteristics before assembly.
5. Prior to use, confirm the Solderability for the capacitors that were in long-term storage.
6. Prior to measuring capacitance, carry out a heat treatment for capacitors that were in long-term storage.
7.The use of Sn-Zn based solder will deteriorate the reliability of the MLCC.
Please contact our sales representative or product engineers on the use of Sn-Zn based solder in advance.
3.Maintenance of the Mounting (pick and place) Machine
1. Make sure that the following excessive forces are not applied to the capacitors.
1-1. In mounting the capacitors on the printed circuit board, any bending force against them shall be kept
to a minimum to prevent them from any bending damage or cracking. Please take into account the
following precautions and recommendations for use in your process.
(1) Adjust the lowest position of the pickup nozzle so as not to bend the printed circuit board.
(2) Adjust the nozzle pressure within a static load of 1N to 3N during mounting.
Suction Nozzle
ꢀ[Incorrect]
Deflection
Board
Board Guide
ꢀ[Correct]
Support Pin
2. Dirt particles and dust accumulated between the suction nozzle and the cylinder inner wall prevent
the nozzle from moving smoothly. This imposes greater force upon the chip during mounting,
causing cracked chips. Also the locating claw, when worn out, imposes uneven forces on the chip
when positioning, causing cracked chips. The suction nozzle and the locating claw must be maintained,
checked and replaced periodically.
JEMCAC-00641A
12
!
Caution
4-1.Reflow Soldering
1. When sudden heat is applied to the components, the
mechanical strength of the components will decrease
because a sudden temperature change causes
[Standard Conditions for Reflow Soldering]
Infrared Reflow
deformation inside the components. In order to prevent
mechanical damage to the components, preheating is
required for both the components and the PCB board.
Preheating conditions are shown in table 1. It is required to
keep the temperature differential between the solder and
the components surface (ΔT) as small as possible.
Temperature(℃)
Soldering
Peak Temperature
Gradual
Cooling
200℃
170℃
150℃
130℃
Preheating
2. Solderability of Tin plating termination chips might be
deteriorated when a low temperature soldering profile where
the peak solder temperature is below the melting point of
Tin is used. Please confirm the Solderability of Tin plated
termination chips before use.
Time
30-60 seconds
60-120 seconds
Vapor Reflow
Temperature(℃)
3. When components are immersed in solvent after mounting,
be sure to maintain the temperature difference (ΔT)
between the component and the solvent within the range
shown in the table 1.
Soldering
Gradual
Peak Temperature
Cooling
170℃
150℃
130℃
Preheating
Table 1
Part Number
Temperature Differential
Time
60-120 seconds
20 seconds
LLM21/LLM31
ΔT≦130℃
[Allowable Soldering Temperature and Time]
280
270
Recommended Conditions
Pb-Sn Solder
260
250
240
230
220
Lead Free Solder
Infrared Reflow
Vapor Reflow
230~240℃
Air
Peak Temperature
Atmosphere
230~250℃
240~260℃
Air
Air or N2
Pb-Sn Solder: Sn-37Pb
Lead Free Solder: Sn-3.0Ag-0.5Cu
0
30
90
Soldering Time(sec.)
60
120
4. Optimum Solder Amount for Reflow Soldering
4-1. Overly thick application of solder paste results in
a excessive solder fillet height.
In case of repeated soldering, the accumulated
soldering time must be within the range shown above.
This makes the chip more susceptible to mechanical
and thermal stress on the board and may cause
the chips to crack.
4-2. Too little solder paste results in a lack of adhesive
strength on the outer electrode, which may result in
chips breaking loose from the PCB.
0.2mm min.
4-3. Make sure the solder has been applied smoothly
to the end surface to a height of 0.2mm min.
in section
Inverting the PCB
Make sure not to impose any abnormal mechanical shocks to the PCB.
JEMCAC-00641A
13
Caution
!
4-4.Leaded Component Insertion
1. If the PCB is flexed when leaded components (such as transformers and ICs) are being mounted,
chips may crack and solder joints may break.
Before mounting leaded components, support the PCB using backup pins or special jigs to prevent warpi
5.Washing
Excessive ultrasonic oscillation during cleaning can cause the PCBs to resonate,
resulting in cracked chips or broken solder joints. Take note not to vibrate PCBs.
6.Electrical Test on Printed Circuit Board
1. Confirm position of the support pin or specific jig, when inspecting the electrical performance of a
capacitor after mounting on the printed circuit board.
1-1. Avoid bending printed circuit board by the pressure of a test pin, etc.
The thrusting force of the test probe can flex the PCB, resulting in cracked chips or open solder joints.
Provide support pins on the back side of the PCB to prevent warping or flexing.
1-2. Avoid vibration of the board by shock when a test pin contacts a printed circuit board.
□Not recommended
□Recommended
←Peeling
←Support pin
←Test-pin
←Test-pin
JEMCAC-00641A
14
!
Caution
7.Printed Circuit Board Cropping
1. After mounting a capacitor on a printed circuit board, do not apply any stress to the capacitor that is
caused by bending or twisting the board.
1-1. In cropping the board, the stress as shown right may cause the capacitor to crack.
Try not to apply this type of stress to a capacitor.
Bending
Twisting
2. Check of the cropping method for the printed circuit board in advance.
2-1. Printed circuit board cropping shall be carried out by using a jig or an apparatus to prevent the
mechanical stress which can occur to the board.
(1) Example of a suitable jig
Recommended example: the board should be pushed as close to the near the cropping jig as possible
and from the back side of board in order to minimize the compressive stress applied to capacitor.
Not recommended example* when the board is pushed at a point far from the cropping jig and from
the front side of board as below, the capacitor may form a crack caused by the tensile stress applied
to capacitor.
Recommended
Not recommended
Direction of
load
Outline of jig
Direction of
load
Printed circuit
board
Load point
V-groove
Components
Printed circuit
board
Printed circuit
board
Load point
Components
Board cropping jig
(2) Example of a suitable machine
An outline of a printed circuit board cropping machine is shown as follows. Along the lines with the
V-grooves on printed circuit board, the top and bottom blades are aligned to one another when
cropping the board.
The misalignment of the position between top and bottom blades may cause the capacitor to crack.
Outline of machine
Top blade
Principle of operation
Top blade
Cross-section diagram
Printed circuit board
Bottom blade
Printed circuit board
V-groove
V-groove
Not recommended
Top-bottom misalignment Left-right misalignment Front-rear misalignment
Recommended
Top blade
Top blade
Top blade
Top blade
Bottom blade
Bottom blade
Bottom blade
Bottom blade
JEMCAC-00641A
15
!
Caution
■Others
1. Under Operation of Equipment
1-1. Do not touch a capacitor directly with bare hands during operation in order to avoid the danger of
a electric shock.
1-2. Do not allow the terminals of a capacitor to come in contact with any conductive objects (short-circuit).
Do not expose a capacitor to a conductive liquid, inducing any acid or alkali solutions.
1-3. Confirm the environment in which the equipment will operation is under the specified conditions.
Do not use the equipment under the following environment.
(1) Being spattered with water or oil.
(2) Being exposed to direct sunlight.
(3) Being exposed to Ozone, ultraviolet rays or radiation.
(4) Being exposed to toxic gas (e.g., hydrogen sulfide, sulfur dioxide, chlorine, ammonia gas etc.)
(5) Any vibrations or mechanical shocks exceeding the specified limits.
(6) Moisture condensing environments.
1-4. Use damp proof countermeasures if using under any conditions that can cause condensation.
2. Others
2-1. In an Emergency
(1) If the equipment should generate smoke, fire or smell, immediately turn off or unplug the equipment.
If the equipment is not turned off or unplugged, the hazards may be worsened by supplying
continuous power.
(2) In this type of situation, do not allow face and hands to come in contact with the capacitor or burns may be
caused by the capacitors high temperature.
2-2. Disposal of waste
When capacitors are disposed, they must be burned or buried by the industrial waste vender with
the appropriate licenses.
2-3. Circuit Design
LLM Series capacitors in this specification are not safety recognized products.
2-4. Remarks
Failure to follow the cautions may result, worst case, in a short circuit and smoking when
the product is used.
The above notices are for standard applications and conditions. Contact us when the products are
used in special mounting conditions.
Select optimum conditions for operation as they determine the reliability of the product after assembly.
The data herein are given in typical values, not guaranteed ratings.
JEMCAC-00641A
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Notice
■Rating
1.Operating Temperature
1. The operating temperature limit depends on the capacitor.
1-1.Do not apply temperatures exceeding the upper operating temperature.
It is necessary to select a capacitor with a suitable rated temperature which will cover the operating
temperature range.
Also it is necessary to consider the temperature distribution in equipment and the seasonal temperature
variable factor.
1-2.Consider the self-heating of the capacitor
The surface temperature of the capacitor shall be the upper operating temperature or less when
including the self-heating factors.
2.Atmosphere surroundings (gaseous and liquid)
1. Restriction on the operating environment of capacitors.
1-1. The capacitor, when used in the above, unsuitable, operating environments may deteriorate
ꢀdue to the corrosion of the terminations and the penetration of moisture into the capacitor.
1-2. The same phenomenon as the above may occur when the electrodes or terminals of the capacitor are
subject to moisture condensation.
1-3. The deterioration of characteristics and insulation resistance due to the oxidization or corrosion of
ꢀꢀterminal electrodes may result in breakdown when the capacitor is exposed to corrosive or
volatile gases or solvents for long periods of time.
3.Piezo-electric Phenomenon
1. When using high dielectric constant type capacitors in AC or pulse circuits, the capacitor itself vibrates
at specific frequencies and noise may be generated.
Moreover, when the mechanical vibration or shock is added to capacitor, noise may occur.
JEMCAC-00641A
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Notice
■Soldering and Mounting
1.PCB Design
1. Notice for Pattern Forms
1-1. Unlike leaded components, chip components are susceptible to flexing stresses since they are mounted
directly on the substrate.
They are also more sensitive to mechanical and thermal stresses than leaded components.
Excess solder fillet height can multiply these stresses and cause chip cracking. When designing substrates,
take land patterns and dimensions into consideration to eliminate the possibility of excess solder fillet
height.
1-2. It is possible for the chip to crack by the expansion and shrinkage of a metal board. Please
contact us if you want to use our ceramic capacitors on a metal board such as Aluminum.
Pattern Forms
Prohibited
Correct
Chassis
Solder Resist
Solder (ground)
Placing Close to Chassis
Electrode Pattern
Lead Wire
Solder Resist
Placing of Chip
Components
and Leaded Components
Lead Wire
Soldering Iron
Solder Resist
Placing of Leaded
Components
after Chip Component
Solder Resist
Lateral Mounting
JEMCAC-00641A
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Notice
2. Land Dimensions
2-1. Chip capacitor can be cracked due to the stress of PCB
bending / etc if the land area is larger than needed and has
an excess amount of solder.
Chip Capacitor
Please refer to the land dimensions in table 1 for reflow
soldering.
Please confirm the suitable land dimension by evaluating of the actual SET / PCB.
Table 1 Reflow Soldering Method
Dimensions
a
b, b'
c, c'
0.3
d
e
f
p
Part Number
LLM21
0.6~0.8
1.0
(0.3~0.5)
2.0~2.6
3.2~3.6
1.3~1.8
1.6~2.0
1.4~1.6
2.6
0.5
LLM31
(0.3~0.5)
0.4
0.8
(in mm)
b=(c-e)/2, b'=(d-f)/2
JEMCAC-00641A
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Notice
2.Washing
1. Please evaluate a capacitor by actual cleaning equipment and condition surely
for confirming the quality and select the applicable solvent.
2. Unsuitable cleaning solvent may leave residual flux, other foreign substances, causing deterioration of
electrical characteristics and the reliability of the capacitors.
3. Select the proper cleaning conditions.
3-1. Improper cleaning conditions (excessive or insufficient) may result in the deterioration of the
performance of the capacitors.
3.Coating
1. A crack may be caused in the capacitor due to the stress of the thermal contraction of the resin during
ꢀcuring process.
The stress is affected by the amount of resin and curing contraction.
Select a resin with small curing contraction.
The difference in the thermal expansion coefficient between a coating resin or a molding resin and
capacitor may cause the destruction and deterioration of the capacitor such as a crack or peeling, and
lead to the deterioration of insulation resistance or dielectric breakdown.
Select a resin for which the thermal expansion coefficient is as close to that of capacitor as possible.
A silicone resin can be used as an under-coating to buffer against the stress.
2. Select a resin that is less hygroscopic.
Using hygroscopic resins under high humidity conditions may cause the deterioration of the
insulation resistance of a capacitor.
An epoxy resin can be used as a less hygroscopic resin.
■Others
1.Transportation
1. The performance of a capacitor may be affected by the conditions during transportation.
1-1. The capacitors shall be protected against excessive temperature, humidity and mechanical force
during transportation.
(1) Climatic condition
-low air temperature:-40℃
-change of temperature air/air:-25℃/+25℃
-low air pressure:30 kPa
-change of air pressure:6 kPa/min
(2) Mechanical condition
Transportation shall be done in such a way that the boxes are not deformed and forces are not directly
passed on to the inner packaging.
1-2. Do not apply excessive vibration, shock, and pressure to the capacitor.
(1) When excessive mechanical shock or pressure is applied to a capacitor, chipping or cracking may
occur in the ceramic body of the capacitor.
(2) When a sharp edge of an air driver, a soldering iron, tweezers, a chassis, etc. impacts strongly on the
surface of capacitor, the capacitor may crack and short-circuit.
1-3. Do not use a capacitor to which excessive shock was applied by dropping etc.
The capacitor dropped accidentally during processing may be damaged.
JEMCAC-00641A
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NOTE
!
1.Please make sure that your product has been evaluated in view of your specifications with our
product being mounted to your product.
2.Your are requested not to use our product deviating from this product specification.
3.We consider it not appropriate to include any terms and conditions with regard to the business
transaction in the product specifications, drawings or other technical documents. Therefore,
if your technical documents as above include such terms and conditions such as warranty clause,
product liability clause, or intellectual property infringement liability clause, they will be deemed to
be invalid.
JEMCAC-00641A
21
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