GQM2195C1H330GB01_技术文档

RF HIGH FREQUENCY CHIP MONOLITHIC CERAMIC CAPACITOR

GQM2195C1H330GB01_ (0805, C0G, 33pF, 50Vdc)

_: packaging code

Reference Sheet

1.Scope

This product specification is applied to RF High Frequency Chip Monolithic Ceramic Capacitor used for RF High frequency

Electronic equipment.

ꢀꢀ

2.MURATA Part NO. System

(Ex.)

GQM

21

9

5C

1H

330

G

B01

D

(8)Packaging

Code

(2)T

Dimensions

(3)Temperature

Characteristics

(4)DC Rated

Voltage

(5)Nominal (6)Capacitance

(7)Murata’s

Control Code

(1)L/W

Dimensions

Tolerance

Capacitance

3. Type & Dimensions

L

W

T

e

g

e

(Unit:mm)

(1)-1 L

(1)-2 W

(2) T

0.85±0.1

e

g

2.0±0.1

1.25±0.1

0.2 to 0.7

0.7 min.

4.Rated value

(3) Temperature Characteristics

(Public STD Code):C0G(EIA)

Specifications and Test

Methods

(4)

DC Rated

Voltage

(6)

(5) Nominal

Capacitance

Tolerance

(Operationg

Temp. Range)

Temp. coeff

orꢀCap. Change

Temp. Range

(Ref.Temp.)

25 to 125 °C

(25 °C)

50 Vdc

33 pF

±2 %

0±30 ppm/°C

-55 to 125 °C

5.Package

mark

(8) Packaging

Packaging Unit

f180mm Reel

PAPER W8P4

f330mm Reel

PAPER W8P4

D

4000 pcs./Reel

10000 pcs./Reel

J

Product specifications in this catalog are as of Jan.25,2013,and are subject to change or obsolescence without notice.

Please consult the approval sheet before ordering.

Please read rating and !Cautions first.

GQM2195C1H330GB01-01

1

■SPECIFICATIONS AND TEST METHODS

No

1

Item

Specification

Test Method

Operating Temperature

5C : -55℃ to 125℃

Rated Voltage

The rated voltage is defined as the maximum voltage which may be

applied continuously to the capacitor.

2

See the previous pages.

When AC voltage is superimposed on DC voltage, V^P-Por V^O-P

whichever is larger, should be maintained within the rated

voltage range.

,

Appearance

Dimension

Visual inspection.

Using calipers.

3

4

No defects or abnormalities.

Within the specified dimensions.

No defects or abnormalities.

Dielectric Strength

No failure should be observed when 300% of the rated

voltage is applied between the terminations for 1 to 5

seconds, provided the charge/discharge current is less

than 50mA.

5

Insulation

More than 10,000MΩ or 500Ω ・F .

(Ｗhichever is smaller)

The insulation resistance should be measured with a DC

voltage not exceeding the rated voltage at 25℃

and 75%RH max. and within 2 minutes of charging.

6

Resistance

Capacitance

Q

The capacitance/Q should be measured at 25℃

at the frequency and voltage shown in the table.

7

8

Within the specified tolerance.

30pFmin. : Q≧1400

Char.

5C

30pFmax.: Q≧800+20C

Item

(1000pF and below)

C:NominalCapacitance (pF)

Frequency

Voltage

10.1MHz

0.5 to 5Vrms

Capacitance

Temperature

Characteristics

The temperature coefficient is determind using the

capacitance measured in step 3 as a reference.

When cycling the temperature sequentially from step 1

through 5 the capacitance should be within the specified

tolerance for the temperature coefficient and capacitance

change as Table A-1.

9

Capacitance Within the specified tolerance.(Table A-1)

Change

Temperature Within the specified tolerance.(Table A-1)

Coefficent

The capacitance drift is caluculated by dividing the

differences betweeen the maximum and minimum measured

values in the step 1,3 and 5 by the cap. value in step 3.

Step

Temperature(C)

252

Capacitance

Drift

Within ±0.2% or ±0.05pF

(Whichever is larger.)

1

2

3

4

5

-553

252

1253

252

Adhesive Strength of

Termination

Solder the capacitor on the test jig (glass epoxy

board)shown in Fig.3 using an eutectic solder. Then apply

10N* force in parallel with the test jig for 10+/-1sec.

10

No removal of the terminations or other defect should occur.

The soldering should be done either with an iron or using the

reflow method and should be conducted with care so that the

soldering is uniform and free of defects such as heat shock.

*5N（GQM188)

Solder the capacitor on the test jig (glass epoxy board) in the

same manner and under the same conditions as (10).

11 Vibration

Resistance

Appearance No defects or abnormalities.

Capacitance Within the specified tolerance.

The capacitor should be subjected to a simple harmonic

motion having a total amplitude of 1.5mm, the frequency

being varied uniformly between the approximate limits of 10

30pFmin. : Q≧1400

Q

30pFmax.: Q≧800+20C

and 55Hz. The frequency range, from 10 to 55Hz and return

to 10Hz, should be traversed in approximately 1 minute. This

motion should be applied for a period of 2 hours in each 3

mutually perpendicular directions(total of 6 hours).

Solder the capacitor on the test jig (glass epoxy board)

shown in Fig.1 using an eutectic solder. Then apply a force

in the direction shown in Fig 2. The soldering

should be done by the reflow method and should be

conducted with care so that the soldering is uniform and free

of defects such as heat shock.

C:NominalCapacitance (pF)

12 Deflection

Appearance No marking defects.

Within ±5％ or ±0.5pF

(Whichever is larger)

Capacitance

Change

75% of the terminations is to be soldered evenly

and continuously.

Immerse the capacitor in a solution of ethanol (JIS-K-8101)

and rosin (JIS-K-5902) (25% rosin in weight propotion) .

Preheat at 80 to 120℃ for 10 to 30 seconds.

13 Solderability

of Termination

After preheating, immerse in an eutectic solder solution for

2+/-0.5 seconds at 230+/-5℃ or Sn-3.0Ag-0.5Cu solder

solution for 2+/-0.5 seconds at 245+/-5℃

JEMCNS-0003Ｆ

2

■SPECIFICATIONS AND TEST METHODS

No

14

Item

Resistance to

Specification

Test Method

The measured and observed characteristics shall satisfyPreheat the capacitor at 120 to 150℃ for 1 minute.

Soldering Heat

Immerse the capacitor in an eutectic solder solution or

Sn-3.0Ag-0.5Cu solder solution at 270+/-5℃ for

10+/-0.5 seconds. Let sit at room temperature for 24+/-2

hours.

the specifications in the following table.

Appearance No defects or abnormalities.

Capacitance Within ±2.5% or ±0.25 pF

Change

(Whichever is larger)

Q

30pFmin.:Q≧1400

30pFmax.:Q≧800+20C

C:NominalCapacitance (pF)

More than 10,000MΩ or 500Ω •F

I.R.

(Whichever is smaller)

No defects.

Dielectric

Strength

Temperature

Cycle

The measured and observed characteristics shall satisfyFix the capacitor to the supporting jig in the same

15

manner and under the same conditions as (10).

Perform the five cycles according to the four heat

treatments listed in the following table.

the specifications in the following table.

Appearance No defects or abnormalities.

Let sit for 24+/-2 hours at room temperature, then measure.

Capacitance Within ±2.5% or ±0.25pF

Change

(Whichever is larger)

Temp.( C)

1

2

3

30±3

2 to 3

30±3

Operating Temp.+0/-3

Room Temp

Q

30pFmin. : Q≧1400

30pFmax.: Q≧800+20C

C:NominalCapacitance (pF)

More than 10,000MΩ or 500Ω •F

(Whichever is smaller)

Max.

Operating Temp.+3/-0

I.R.

Room Temp

Dielectric

Strength

No defects.

Humidity

Steady State

The measured and observed characteristics shall satisfySit the capacitor at 40±2℃ and 90 to 95% humiduty for

16

17

18

500±12 hours.

the specifications in the following table.

Remove and let sit for 24±2 hours (temperature compensating type)

at room temperature, then measure.

Appearance No defects or abnormalities.

Capacitance Within ±5％ or ±0.5pF

Change

(Whichever is larger)

30pF and over : Q≧350

10pF and over, 30pF and below : Q≧275+5C/2

10pF and below : Q≧200+10C

C:Nominal Capacitance(pF)

Q

I.R.

More than 1,000MΩ or 50Ω •F (Whichever is smaller)

The measured and observed characteristics shall satisfyApply the rated voltage at 40±2℃ and 90 to 95% humidity

Humidity Load

for 500±12 hours.

the specifications in the following table.

Remove and let sit for 24±2 hours at room temprature then

muasure. The charge/discharge current is less than 50mA.

Appearance No defects or abnormalities.

Capacitance Within ±7.5% or ±0.75pF

Change

(Whichever is larger)

Q

30pF and over : Q≧200

30pF and below : Q≧100+10C/3

C:Nominal Capacitance(pF)

I.R.

More than 500MΩ or 25Ω •F (Whichever is smaller)

The measured and observed characteristics shall satisfyApply 200% of the rated voltage for 1000±12 hours at the

High Temperature

Load

maximun operating temperature±3℃.

the specifications in the following table.

Let sit for 24±2 hours (temperature compensating type) aｔ

room temperature, then measure.

Appearance No defects or abnormalities.

The charge/discharge current is less than 50mA

Capacitance Within ±3% or ±0.3pF

Change

Q

(Whichever is larger)

30pF and over : Q≧350

10pF and over, 30pF and below : Q≧275+5C/2

10pF and below : Q≧200+10C

C:Nominal Capacitance(pF)

I.R.

More than 1,000MΩ or 50Ω •F (Whichever is smaller)

ꢀꢀTable A-1

Capacitance Change from 25C (%)

-30

Nominal Values

(ppm/C) Note 1

-55

-10

Char.

5C

Max.

Min.

Max.

Min.

Max.

0.25

Min.

030

0.58

-0.24

0.40

-0.17

-0.11

ꢀꢀꢀNote１：Nominal values denote the temperature coefficient within a range of 25℃ to 125℃ (for 5C)

JEMCNS-0003Ｆ

3

■SPECIFICATIONS AND TEST METHODS

Test method : Deflection

・Test substrate

Material

: Copper-clad laminated sheets for PCBs

(Glass fabric base, epoxy resin)

ꢀꢀꢀꢀꢀꢀ ꢀꢀ (Glass fabric base, epoxy resin)

Thickness : 1.6mm(GQM18/21: t:0.8mm)

Copper foil thickness : 0.035mm

Gray colored part of Fig.1: Solder resist

Thickness : 1.6mm(GQM18/21: t:0.8mm)

Copper foil thickness : 0.035mm

c

（Coat with heat resistant resin for solder）

b

Land

f4.5

Solder resist

a

Baked electrode or

copper foil

Glass epoxy board

100

Fig.1

(in:mm)

Fig.3

(in:mm)

Type

a

b

c

Type

a

b

c

GQM18

GQM21

1.0

1.2

3.0

4.0

1.2

GQM18

GQM21

1.0

1.2

3.0

4.0

1.2

1.65

Pressurizing

speed

1.0mm/sec.

50

20

Pressurize

R230

Flexure:≦1

Capacitance meter

45 45

Fig.2

(in:mm)

JEMCNS-0003Ｆ

4

PACKAGING

GQM Type

1.Tape Carrier Packaging(Packaging Code:D/E/L/J/F/K)

1.1 Minimum Quantity(pcs./reel)

φ180mm reel

φ330mm reel

Type

GQM18

Paper Tape

Code:D/E

4000

Plastic Tape

Code:L

Paper Tape

Code:J/ F

10000

Plastic Tape

Code:K

4000

10000

GQM2

1000

4000

1.2 Dimensions of Tape

ꢀ(1)GQM18/21

(in mm)

4.0±0.1

2.0±0.05

+0.1

-0

φ1.5

Ａ

1.1 max.

Code

A

B

GQM18

1.05±0.1

1.85±0.1

GQM21

1.55±0.15

2.3±0.15

ꢀ(2)GQM22

4.0±0.1

2.0±0.1

0.25±0.1

+0.1

φ1.5

-0

Ａ

2.5 max.

Code

A

B

GQM22

2.8*

3.5*

*Nominal Value

JEMCNP-01900

5

PACKAGING

GQM Type

(in mm)

Fig.1 Package Chips

Chip

Fig.2 Dimensions of Reel

2.0±0.5

φ21±0.8

10±1.5

16.5 max.

Fig.3 Taping Diagram

Top Tape : Thickness 0.06

Feeding Hole :As specified in 1.2.

Hole for Chip : As specified in 1.2.

Bottom Tape :Thickness 0.05

(Only a bottom tape existence )

Base Tape : As specified in 1.2.

JEMCNP-01900

6

PACKAGING

GQM Type

1.3 Tapes for capacitors are wound clockwise shown in Fig.3.

(The sprocket holes are to the right as the tape is pulled toward the user.)

1.4 Part of the leader and part of the vacant section are attached as follows.

(in mm)

Tail vacant Section

Chip-mounting Unit Leader vacant Section

Leader Unit

(Top Tape only)

Direction

of Feed

160 min.

190 min.

210 min.

1.5 Accumulate pitch : 10 of sprocket holes pitch = 40±0.3mm

1.6 Chip in the tape is enclosed by top tape and bottom tape as shown in Fig.1.

1.7 The top tape and base tape are not attached at the end of the tape for a minimum of 5 pitches.

1.8 There are no jointing for top tape and bottom tape.

1.9 There are no fuzz in the cavity.

1.10 Break down force of top tape : 5N min.

Break down force of bottom tape : 5N min. (Only a bottom tape existence )

1.11 Reel is made by resin and appeaser and dimension is shown in Fig 1.

There are possibly to change the material and dimension due to some impairment.

1.12 Peeling off force : 0.1N to 0.6N in the direction as shown below.

Top tape

165～180°

1.13 Label that show the customer part number, our part number, our company name, inspection

number and quantity, will be put in outside of reel.

JEMCNP-01900

7

Caution

!

■Limitation of use

Please contact our sales representatives or product engineers before using our products for the applications

listed below which require of our products for other applications than specified in this product.

ꢀ ①Aircraft equipment ②Aerospace equipment ③Undersea equipment ④Power plant control equipment

ꢀ ⑤Medical equipment ⑥Transportation equipment(vehicles,trains,ships,etc.) ⑦Traffic signal equipment

ꢀ ⑧Disaster prevention / crime prevention equipment

⑨Data-processing equipment

ꢀ⑩Application of similar complexity and/or requirements to the applications listed in the above

■Storage and Operation condition

1. The performance of chip monolithic ceramic capacitors may be affected by the storage conditions.

1-1. Store capacitors in the following conditions: Temperature of +5℃to +40℃and a Relative Humidity

of 20% to 70%.

(1) Sunlight, dust, rapid temperature changes, corrosive gas atmosphere or high temperature and humidity

conditions during storage may affect the solderability and the packaging performance

Please use product within six months of receipt.

(2) Please confirm solderability before using after six months.

Store the capacitors without opening the original bag.

Even if the storage period is short, do not exceed the specified atmospheric conditions.

1-2. Corrosive gas can react with the termination (external) electrodes or lead wires of capacitors, and result

in poor solderability. Do not store the capacitors in an atmosphere consisting of corrosive gas (e.g.,

hydrogen sulfide, sulfur dioxide, chlorine, ammonia gas etc.).

1-3. Due to moisture condensation caused by rapid humidity changes, or the photochemical change caused

by direct sunlight on the terminal electrodes and/or the resin/epoxy coatings, the solderability and

electrical performance may deteriorate. Do not store capacitors under direct sunlight or in high huimidity

conditions

JEMCNC-0012L

8

Caution

!

■Rating

1.Temperature Dependent Characteristics

1. The electrical characteristics of the capacitor can change with temperature.

1-1. For capacitors having larger temperature dependency, the capacitance may change with temperature chan

The following actions are recommended in order to insure suitable capacitance values.

(1) Select a suitable capacitance for the operating temperature range.

(2) The capacitance may change within the rated temperature.

When you use a high dielectric constant type capacitors in a circuit that needs a tight (narrow) capacitance

tolerance.

Example: a time constant circuit., please carefully consider the characteristics of these capacitors,

such as their aging, voltage, and temperature characteristics.

And check capacitors using your actual appliances at the intended environment and operating conditions.

□Typical temperature characteristics Char.R6 (X5R) □Typical temperature characteristics Char.R7 (X7R)

20

15

10

5

20

15

10

5

0

-5

-10

-15

-20

-10

-15

-20

-75

-50

-25

0

25

50

75

100

-75

-50

-25

0

25

50

75

100

125

150

Temperature (℃)

□Typical temperature characteristics Char.F5 (Y5V)

40

20

0

-20

-40

-60

-80

-100

-50

-25

0

25

50

75

100

Temperature (℃)

2.Measurement of Capacitance

1. Measure capacitance with the voltage and the frequency specified in the product specifications.

1-1. The output voltage of the measuring equipment may decrease when capacitance is high occasionally.

Please confirm whether a prescribed measured voltage is impressed to the capacitor.

1-2. The capacitance values of high dielectric constant type capacitors change depending on the AC voltage

applied.

Please consider the AC voltage characteristics when selecting a capacitor to be used in a AC circuit.

JEMCNC-0012L

9

Caution

!

3.Applied Voltage

1. Do not apply a voltage to the capacitor that exceeds the rated voltage as called-out in the specifications.

1-1. Applied voltage between the terminals of a capacitor shall be less than or equal to the rated voltage.

(1) When AC voltage is superimposed on DC voltage, the zero-to-peak voltage shall not exceed the

rated DC voltage.

When AC voltage or pulse voltage is applied, the peak-to-peak voltage shall not exceed the

rated DC voltage.

(2) Abnormal voltages (surge voltage, static electricity, pulse voltage, etc.) shall not exceed the

rated DC voltage.

Typical voltage applied to the DC capacitor

DC voltage

DC voltage+AC

AC voltage

Pulse voltage

0

E

0

（E：Maximum possible applied voltage.）

1-2. Influence of overvoltage

Overvoltage that is applied to the capacitor may result in an electrical short circuit caused by the

breakdown of the internal dielectric layers .

The time duration until breakdown depends on the applied voltage and the ambient temperature.

4. Applied Voltage and Self-heating Temperature

1. When the capacitor is used in a high-frequency voltage, pulse voltage, application,

be sure to take into account self-heating may be caused by resistant factors of the capacitor.

1-1. The load should be contained to the level such that when measuring at atomospheric temperature of 25℃,

ꢀꢀꢀ the product's self-heating remains below 20℃ and surface temperature of the capacitor in the actual circuit

remains wiyhin the maximum operating temperature.

JEMCNC-0012L

10

Caution

!

5. DC Voltage and AC Voltage Characteristic

1. The capacitance value of a high dielectric constant type capacitor changes depending on the DC

voltage applied.

Please consider the DC voltage characteristics when a capacitor is selected for use in a DC circuit.

1-1. The capacitance of ceramic capacitors may change sharply depending on the applied voltage. (See figure)

Please confirm the following in order to secure the capacitance.

(1) Whether the capacitance change caused by the

applied voltage is within the range allowed or not.

□DC voltage characteristics

20

(2) In the DC voltage characteristics, the rate of capacitance

change becomes larger as voltage increases.

0

-20

Even if the applied voltage is below the rated voltage.

When a high dielectric constant type capacitorꢀis in a

circuit that needs a tight (narrow) capacitance tolerance.

Example: a time constant circuit., please carefully

consider the characteristics of these capacitors, such as

their aging, voltage, and temperature characteristics.

And check capacitors using your actual appliances at the

intended environment and operating conditions.

-40

-60

-80

-100

0

2

4

6

8

DC Voltage (VDC)

2. The capacitance values of high dielectric constant type capacitors change depending on the AC voltage applied.

Please consider the AC voltage characteristics when selecting a capacitor to be used in a AC circuit.

□AC voltage characteristics

30

20

10

0

-10

-20

-30

-40

-50

-60

0.0

0.5

1.0

1.5

2.0

2.5

AC Voltage (Vr.ms.)

6. Capacitance Aging

1. The high dielectric constant type capacitors have the characteristic

in which the capacitance value decreases with passage of time.

When you use a high dielectric constant type capacitors in a circuit that needs a tight (narrow) capacitance

tolerance. Example: a time constant circuit., please carefully consider the characteristics of these capacitors,

such as their aging, voltage, and temperature characteristics.

And check capacitors using your actual appliances at the intended environment and operating conditions.

20

10

0

-10

-20

5

-30

-40

C

10.0

100.0

1000.0

Time (Hr)

10000.0

JEMCNC-0012L

11

Caution

!

7.Vibration and Shock

1. Please confirm the kind of vibration and/or shock, its condition, and any generation of resonance.

Please mount the capacitor so as not to generate resonance, and do not allow any impact on the terminals.

2. Mechanical shock due to falling may cause damage or a crack in the dielectric material of the capacitor.

Do not use a fallen capacitor because the quality and reliability may be deteriorated.

Crack

Floor

3. When printed circuit boards are piled up or handled, the corners of another printed circuit board

should not be allowed to hit the capacitor in order to avoid a crack or other damage to the capacitor.

Mounting printed circuit board

Crack

■Soldering and Mounting

1.Mounting Position

1. Confirm the best mounting position and direction that minimizes the stress imposed on the capacitor

during flexing or bending the printed circuit board.

1-1.Choose a mounting position that minimizes the stress imposed on the chip during flexing or bending

of the board.

ꢀ[Component Direction]

Locate chip

horizontal to the

direction in

which stress

acts

ꢀ[Chip Mounting Close to Board Separation Point]

C

Perforation

B

Chip arrangement

Worst A-C-(B~D) Best

D

A

Slit

ꢀ

JEMCNC-0012L

12

Caution

!

2.Information before mounting

1. Do Not re-use capacitors that were removed from the equipment.

2. Confirm capacitance characteristics under actual applied voltage.

3. Confirm the mechanical stress under actual process and equipment use.

4. Confirm the rated capacitance, rated voltage and other electrical characteristics before assembly.

5. Prior to use, confirm the Solderability for the capacitors that were in long-term storage.

6. Prior to measuring capacitance, carry out a heat treatment for capacitors that were in long-term storage.

7.The use of Sn-Zn based solder will deteriorate the reliability of the MLCC.

Please contact our sales representative or product engineers on the use of Sn-Zn based solder in advanc

3.Maintenance of the Mounting (pick and place) Machine

1. Make sure that the following excessive forces are not applied to the capacitors.

1-1. In mounting the capacitors on the printed circuit board, any bending force against them shall be kept

to a minimum to prevent them from any bending damage or cracking. Please take into account the

following precautions and recommendations for use in your process.

(1) Adjust the lowest position of the pickup nozzle so as not to bend the printed circuit board.

(2) Adjust the nozzle pressure within a static load of 1N to 3N during mounting.

ꢀ[Incorrect]

Suction Nozzle

Board

Deflection

Board Guide

ꢀ[Correct]

Support Pin

2.Dirt particles and dust accumulated between the suction nozzle and the cylinder inner wall prevent

the nozzle from moving smoothly. This imposes greater force upon the chip during mounting,

causing cracked chips. Also the locating claw, when worn out, imposes uneven forces on the chip

when positioning, causing cracked chips. The suction nozzle and the locating claw must be maintained,

checked and replaced periodically.

JEMCNC-0012L

13

Caution

!

4-1.Reflow Soldering

1. When sudden heat is applied to the components, the

mechanical strength of the components will decrease

because a sudden temperature change causes

[Standard Conditions for Reflow Soldering]

Infrared Reflow

deformation inside the components. In order to prevent

mechanical damage to the components, preheating is

required for both the components and the PCB board.

Preheating conditions are shown in table 1. It is required to

keep the temperature differential between the solder and

the components surface (ΔT) as small as possible.

Temperature(℃)

Soldering

Peak Temperature

Gradual

Cooling

200℃

170℃

150℃

130℃

Preheating

2. Solderability of Tin plating termination chips might be

deteriorated when a low temperature soldering profile where

the peak solder temperature is below the melting point of

Tin is used. Please confirm the Solderability of Tin plated

termination chips before use.

Time

30-60 seconds

60-120 seconds

Vapor Reflow

Temperature(℃)

3. When components are immersed in solvent after mounting,

be sure to maintain the temperature difference (ΔT)

between the component and the solvent within the range

shown in the table 1.

Soldering

Gradual

Peak Temperature

Cooling

170℃

150℃

130℃

Preheating

Table 1

Part Number

Temperature Differential

Time

60-120 seconds

20 seconds

GQM18/21

ΔT≦190℃

GQM22

ΔT≦130℃

[Allowable Soldering Temperature and Time]

280

270

Recommended Conditions

Pb-Sn Solder

260

250

240

230

220

Lead Free Solder

Infrared Reflow

Vapor Reflow

230～240℃

Air

Peak Temperature

Atmosphere

230～250℃

240～260℃

Air

Air or N2

0

30

90

Soldering Time(sec.)

60

120

Pb-Sn Solder: Sn-37Pb

Lead Free Solder: Sn-3.0Ag-0.5Cu

In case of repeated soldering, the accumulated

soldering time must be within the range shown above.

4. Optimum Solder Amount for Reflow Soldering

0.2mm min.

in section

4-1. Overly thick application of solder paste results in

a excessive solder fillet height.

This makes the chip more susceptible to mechanical

and thermal stress on the board and may cause

the chips to crack.

4-2. Too little solder paste results in a lack of adhesive

strength on the outer electrode, which may result in

chips breaking loose from the PCB.

4-3. Make sure the solder has been applied smoothly to the end surface to a height of 0.2mm min.

Inverting the PCB

Make sure not to impose any abnormal mechanical shocks to the PCB.

JEMCNC-0012L

14

Caution

!

4-2.Flow Soldering

1. When sudden heat is applied to the components, the

mechanical strength of the components will decrease

because a sudden temperature change causes

[Standard Conditions for Flow Soldering]

deformation inside the components. In order to prevent

mechanical damage in the components, preheating should

be required for both of the components and the PCB board.

Preheating conditions are shown in table 2. It is required to

keep temperature differential between the solder and

the components surface (ΔT) as small as possible.

Temperature(℃)

Soldering

Soldering Peak

Gradual

Cooling

△Ｔ

Preheating Peak

Preheating

2. Excessively long soldering time or high soldering

temperature can result in leaching of the outer electrodes,

causing poor adhesion or a reduction in capacitance value

due to loss of contact between electrodes and end termination.

Time

5 seconds max.

30-90 seconds

[Allowable Soldering Temperature and Time]

3. When components are immersed in solvent after mounting,

be sure to maintain the temperature difference (ΔT)

between the component and solvent within the range

shown in the table 2.

280

270

260

250

240

4. Do not apply flow soldering to GQM22 Series.

Table 2

230

220

0

30

60

90

120

Part Number

Temperature Differential

Soldering Time(sec.)

GQM18/21/31

ΔT≦150℃

In case of repeated soldering, the accumulated

soldering time must be within the range shown above.

Recommended Conditions

Pb-Sn Solder Lead Free Solder

Preheating Peak Temperature

Soldering Peak Temperature

Atmosphere

90～110℃

240～250℃

Air

100～120℃

250～260℃

N2

Pb-Sn Solder: Sn-37Pb

Lead Free Solder: Sn-3.0Ag-0.5Cu

Up to Chip Thickness

5. Optimum Solder Amount for Flow Soldering

5-1. The top of the solder fillet should be lower than the

thickness of components. If the solder amount is

excessive, the risk of cracking is higher during

board bending or any other stressful condition.

in section

Adhesive

JEMCNC-0012L

15

Caution

!

4-3.Correction with a Soldering Iron

1. When sudden heat is applied to the components when using a soldering iron, the mechanical strength of

the components will decrease because the extreme temperature change can cause deformations inside the

components. In order to prevent mechanical damage to the components, preheating is required for both

the components and the PCB board. Preheating conditions, (The "Temperature of the Soldering Iron tip",

"Preheating Temperature", "Temperature Differential" between the iron tip and the components and the

PCB), should be within the conditions of table 3. It is required to keep the temperature differential

between the soldering Iron and the component surfaces (ΔT) as small as possible.

2. After soldering, do not allow the component/PCB to rapidly cool down.

3. The operating time for the re-working should be as short as possible. When re-working time is

too long, it may cause solder leaching, and that will cause a reduction in the adhesive

strength of the terminations.

Table 3

Temperature

of Soldering

Iron tip

Temperature

Differential

(ΔT)

Preheating

Temperature

Part Number

Atmosphere

GQM18/21

GQM22

350℃max.

280℃max.

150℃min.

ΔT≦190℃

ΔT≦130℃

Air

*Applicable for both Pb-Sn and Lead Free Solder.

Pb-Sn Solder: Sn-37Pb

Lead Free Solder: Sn-3.0Ag-0.5Cu

4. Optimum Solder amount when re-working with a Soldering lron

Solder Amount

in section

4-1. In case of sizes smaller than 0603, (GQM18), the top of

the solder fillet should be lower than 2/3's of the thickness

of the component or 0.5mm whichever is smaller.

In case of 0805 and larger sizes, (GQM21/22), the top of

the solder fillet should be lower than 2/3's of the thickness

of the component. If the solder amount is excessive, the

risk of cracking is higher during board bending or under

any other stressful condition.

4-2. A Soldering iron with a tip of ø3mm or smaller should be used. It is also necessary to keep

the soldering iron from touching the components during the re-work.

4-3. Solder wire with ø0.5mm or smaller is required for soldering.

4-4.Leaded Component Insertion

1. If the PCB is flexed when leaded components (such as transformers and ICs) are being mounted,

chips may crack and solder joints may break.

Before mounting leaded components, support the PCB using backup pins or special jigs to prevent warping.

JEMCNC-0012L

16

Caution

!

5.Washing

Excessive ultrasonic oscillation during cleaning can cause the PCBs to resonate,

resulting in cracked chips or broken solder joints. Take note not to vibrate PCBs.

6.Electrical Test on Printed Circuit Board

1. Confirm position of the support pin or specific jig, when inspecting the electrical performance of a

capacitor after mounting on the printed circuit board.

1-1. Avoid bending printed circuit board by the pressure of a test pin, etc.

The thrusting force of the test probe can flex the PCB, resulting in cracked chips or open solder joints.

Provide support pins on the back side of the PCB to prevent warping or flexing.

1-2. Avoid vibration of the board by shock when a test pin contacts a printed circuit board.

□Not recommended

□Recommended

←Support pin

←Peeling

←Test-pin

JEMCNC-0012L

17

Caution

!

7.Printed Circuit Board Cropping

1. After mounting a capacitor on a printed circuit board, do not apply any stress to the capacitor that is

caused by bending or twisting the board.

1-1. In cropping the board, the stress as shown right may cause the capacitor to crack.

Try not to apply this type of stress to a capacitor.

Bending

Twisting

2. Check of the cropping method for the printed circuit board in advance.

2-1. Printed circuit board cropping shall be carried out by using a jig or an apparatus to prevent the

mechanical stress which can occur to the board.

(1) Example of a suitable jig

Recommended example: the board should be pushed as close to the near the cropping jig as possible

and from the back side of board in order to minimize the compressive stress applied to capacitor.

Not recommended example* when the board is pushed at a point far from the cropping jig and from

the front side of board as below, the capacitor may form a crack caused by the tensile stress applied

to capacitor.

Recommended

Not recommended

Direction of

load

Outline of jig

Direction of

load

Printed circuit

board

Load point

V-groove

Components

Printed circuit

board

Printed circuit

board

Load point

Components

Board cropping jig

(2) Example of a suitable machine

An outline of a printed circuit board cropping machine is shown as follows. Along the lines with the

V-grooves on printed circuit board, the top and bottom blades are aligned to one another when

cropping the board.

The misalignment of the position between top and bottom blades may cause the capacitor to crack.

Outline of machine

Top blade

Principle of operation

Top blade

Cross-section diagram

Printed circuit board

Bottom blade

Printed circuit board

V-groove

Not recommended

Top-bottom misalignment Left-right misalignment Front-rear misalignment

Recommended

Top blade

Bottom blade

JEMCNC-0012L

18

!

Caution

■Others

1. Under Operation of Equipment

1-1. Do not touch a capacitor directly with bare hands during operation in order to avoid the danger of

a electric shock.

1-2. Do not allow the terminals of a capacitor to come in contact with any conductive objects (short-circuit).

Do not expose a capacitor to a conductive liquid, inducing any acid or alkali solutions.

1-3. Confirm the environment in which the equipment will operation is under the specified conditions.

Do not use the equipment under the following environment.

(1) Being spattered with water or oil.

(2) Being exposed to direct sunlight.

(3) Being exposed to Ozone, ultraviolet rays or radiation.

(4) Being exposed to toxic gas (e.g., hydrogen sulfide, sulfur dioxide, chlorine, ammonia gas etc.)

(5) Any vibrations or mechanical shocks exceeding the specified limits.

(6) Moisture condensing environments.

1-4. Use damp proof countermeasures if using under any conditions that can cause condensation.

2. Others

2-1. In an Emergency

(1) If the equipment should generate smoke, fire or smell, immediately turn off or unplug the equipment.

If the equipment is not turned off or unplugged, the hazards may be worsened by supplying

continuous power.

(2) In this type of situation, do not allow face and hands to come in contact with the capacitor or burns

may be caused by the capacitors high temperature.

2-2. Disposal of waste

When capacitors are disposed, they must be burned or buried by the industrial waste vender with

the appropriate licenses.

2-3. Circuit Design

GQM Series capacitors in this specification are not safety recognized products.

And do not use for general power supplies and lighting.

2-4. Remarks

Failure to follow the cautions may result, worst case, in a short circuit and smoking when the product

is used.

The above notices are for standard applications and conditions. Contact us when the products are

used in special mounting conditions.

Select optimum conditions for operation as they determine the reliability of the product after assembly.

The data herein are given in typical values, not guaranteed ratings.

JEMCNC-0012L

19

Notice

■ Rating

1.Operating Temperature

1. The operating temperature limit depends on the capacitor.

1-1.Do not apply temperatures exceeding the upper operating temperature.

It is necessary to select a capacitor with a suitable rated temperature which will cover the operating

temperature range.

Also it is necessary to consider the temperature distribution in equipment and the seasonal temperature

variable factor.

1-2.Consider the self-heating of the capacitor

The surface temperature of the capacitor shall be the upper operating temperature or less when

including the self-heating factors.

2.Atmosphere surroundings (gaseous and liquid)

1. Restriction on the operating environment of capacitors.

1-1. The capacitor, when used in the above, unsuitable, operating environments may deteriorate

ꢀdue to the corrosion of the terminations and the penetration of moisture into the capacitor.

1-2. The same phenomenon as the above may occur when the electrodes or terminals of the capacitor are

subject to moisture condensation.

1-3. The deterioration of characteristics and insulation resistance due to the oxidization or corrosion of

terminal electrodes may result in breakdown when the capacitor is exposed to corrosive or

volatile gases or solvents for long periods of time.

3.Piezo-electric Phenomenon

1. When using high dielectric constant type capacitors in AC or pulse circuits, the capacitor itself vibrates

at specific frequencies and noise may be generated.

Moreover, when the mechanical vibration or shock is added to capacitor, noise may occur.

JEMCNC-0012L

20

Notice

■Soldering and Mounting

1.PCB Design

1. Notice for Pattern Forms

1-1. Unlike leaded components, chip components are susceptible to flexing stresses since they are mounted

directly on the substrate.

They are also more sensitive to mechanical and thermal stresses than leaded components.

Excess solder fillet height can multiply these stresses and cause chip cracking. When designing substrates,

take land patterns and dimensions into consideration to eliminate the possibility of excess solder fillet

height.

1-2.There is a possibility of chip crack caused by PCB expansion/contraction with heat.

Because stress for chip is different depend on PCB material and structure.Especially metal PCB

such as alumina has a greater risk of chip crack because of large difference of thermal expansion coefficient.

In case of chip below 0402 size, there is also the same possibility of crack with a single-layered glass epoxy

board.

Pattern Forms

Prohibited

Correct

Chassis

Solder (ground)

Solder Resist

Placing Close to Chassis

Electrode Pattern

Lead Wire

Solder Resist

Placing of Chip

Components

and Leaded Components

Soldering Iron

Lead Wire

Solder Resist

Placing of Leaded

Components

after Chip Component

Solder Resist

Lateral Mounting

JEMCNC-0012L

21

Notice

2. Land Dimensions

Chip Capacitor Lan

d

C

2-1. Chip capacitor can be cracked due to the stress of PCB

bending / etc if the land area is larger than needed and

has an excess amount of solder.

Please refer to the land dimensions in table 1 for flow

soldering, table 2 for reflow soldering.

a

b

Solder Resist

Please confirm the suitable land dimension by evaluating of the actual SET / PCB.

Table 1 Flow Soldering Method

Dimensions

Chip（L×W）

a

b

c

Part Number

GQM18

1.6×0.8

0.6～1.0

1.0～1.2

0.8～0.9

0.9～1.0

0.6～0.8

0.8～1.1

GQM21

2.0×1.25

(in mm)

Table 2 Reflow Soldering Method

Dimensions

Chip（L×W）

Part Number

a

b

c

GQM18

GQM21

GQM22

1.6×0.8

2.0×1.25

2.8×2.8

0.6～0.8

1.0～1.2

2.2～2.5

0.6～0.7

0.8～1.0

0.6～0.8

0.8～1.1

1.9～2.3

(in mm)

JEMCNC-0012L

22

Notice

2.Adhesive Application

1. Thin or insufficient adhesive can cause the chips to loosen or become disconnected during flow soldering.

The amount of adhesive must be more than dimension c, shown in the drawing at right, to obtain

the correct bonding strength.

The chip's electrode thickness and land thickness must also be taken into consideration.

Chip Capacitor

ꢀꢀꢀꢀa=20～70μm

a

ꢀꢀꢀꢀb=30～35μm

ꢀꢀꢀꢀc=50～105μm

c

b

Adhesive

Land

Board

2. Low viscosity adhesive can cause chips to slip after mounting. The adhesive must have a viscosity of

5000Pa • s (500ps) min. (at 25℃)

3. Adhesive Coverage

Part Number

GQM18

Adhesive Coverage*

0.05mg min.

GQM21

0.1mg min.

*Nominal Value

4. Do not apply flow soldering to GQM22 Series.

3.Adhesive Curing

1. Insufficient curing of the adhesive can cause chips to disconnect during flow soldering and causes

deterioration in the insulation resistance between the outer electrodes due to moisture absorption.

Control curing temperature and time in order to prevent insufficient hardening.

4.Flux Application

1. An excessive amount of flux generates a large quantity of flux gas, which can cause a deterioration

of Solderability.

So apply flux thinly and evenly throughout. (A foaming system is generally used for flow soldering).

2. Flux containing too a high percentage of halide may cause corrosion of the outer electrodes unless

there is sufficient cleaning. Use flux with a halide content of 0.2% max.

3. Do not use strong acidic flux.

4. Do not use water-soluble flux.

［As a Single Chip］

(*Water-soluble flux can be defined as non roｓin type flux

A

including wash-type flux and non-wash-type flux.)

B

D

Outer Electrode

5.Flow Soldering

C

［As Mounted on Substrate］

Set temperature and time to ensure that leaching of the

outer electrode does not exceed 25% of the chip end

area as a single chip (full length of the edge A-B-C-D

shown right) and 25% of the length A-B shown below as

mounted on substrate.

B

A

JEMCNC-0012L

23

Notice

6.Washing

1. Please evaluate a capacitor by actual cleaning equipment and condition surely for confirming the quality

and select the applicable solvent.

2. Unsuitable cleaning solvent may leave residual flux, other foreign substances, causing deterioration of

electrical characteristics and the reliability of the capacitors.

3. Select the proper cleaning conditions.

3-1. Improper cleaning conditions (excessive or insufficient) may result in the deterioration of the

performance of the capacitors.

7.Coating

1. A crack may be caused in the capacitor due to the stress of the thermal contraction of the resin during

ꢀcuring process.

The stress is affected by the amount of resin and curing contraction.

Select a resin with small curing contraction.

The difference in the thermal expansion coefficient between a coating resin or a molding resin and

capacitor may cause the destruction and deterioration of the capacitor such as a crack or peeling,

and lead to the deterioration of insulation resistance or dielectric breakdown.

Select a resin for which the thermal expansion coefficient is as close to that of capacitor as possible.

A silicone resin can be used as an under-coating to buffer against the stress.

2. Select a resin that is less hygroscopic.

Using hygroscopic resins under high humidity conditions may cause the deterioration of the

insulation resistance of a capacitor.

An epoxy resin can be used as a less hygroscopic resin.

■Others

1.Transportation

1. The performance of a capacitor may be affected by the conditions during transportation.

1-1. The capacitors shall be protected against excessive temperature, humidity and mechanical force

during transportation.

(1) Climatic condition

－low air temperature：－40℃

－change of temperature air/air：－25℃/＋25℃

－low air pressure：30 kPa

－change of air pressure：6 kPa/min

(2) Mechanical condition

Transportation shall be done in such a way that the boxes are not deformed and forces are not

directly passed on to the inner packaging.

1-2. Do not apply excessive vibration, shock, and pressure to the capacitor.

(1) When excessive mechanical shock or pressure is applied to a capacitor, chipping or cracking may

occur in the ceramic body of the capacitor.

(2) When a sharp edge of an air driver, a soldering iron, tweezers, a chassis, etc. impacts strongly

on the surface of capacitor, the capacitor may crack and short-circuit.

1-3. Do not use a capacitor to which excessive shock was applied by dropping etc.

The capacitor dropped accidentally during processing may be damaged.

JEMCNC-0012L

24

NOTE

!

1.Please make sure that your product has been evaluated in view of your specifications with our

product being mounted to your product.

2.Your are requested not to use our product deviating from this product specification.

3.We consider it not appropriate to include any terms and conditions with regard to the business

transaction in the product specifications, drawings or other technical documents. Therefore,

if your technical documents as above include such terms and conditions such as warranty clause,

product liability clause, or intellectual property infringement liability clause, they will be deemed to

be invalid.

JEMCNC-0012L

25


型号：	GQM2195C1H330GB01
厂家：	muRata
描述：	RF HIGH FREQUENCY CHIP MONOLITHIC CERAMIC CAPACITOR
文件：	总25页 (文件大小：564K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

GQM2195C1H330GB01 [MURATA]

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