GA243DR7E2472MW01_技术文档

Based on the Electrical Appliance and Material Safety Law of Japan Chip Multilayer Ceramic Capacitors for General

GA243DR7E2472MW01_ (1812, X7R:EIA, 4700pF, AC250V)

_: packaging code

Reference Sheet

1.Scope

This specification is applied to Chip Multilayer Ceramic Capacitors based on the Electrical Appliance and Material Safety Law of Japan.

For connecting lines to earth : 470 to 4700pF

For connecting lines : 0.01 to 0.1uF

GA2 series obtains no safefy approval. This Series is based on the standards of the Electrical Appliance and Material Safety Law of Janan, separated table 4.

Do not use these products in any automotive power train or safety equipment including battery chargers for electric vehicles and plugin hybrids.

ꢀꢀ

2.MURATA Part NO. System

(Ex.)

GA2

43

D

R7

E2

472

M

W01

L

(2)T

Dimensions

(1)L/W

Dimensions

(4)Rated

Voltage

(3)Temperature

Characteristics

(6)Capacitance

Tolerance

(7)Murata’s Control

(5)Nominal

Capacitance

(8)Packaging Code

Code

3. Type & Dimensions

(Unit:mm)

(1)-1 L

4.5±0.4

(1)-2 W

3.2±0.3

(2) T

2.0+0/-0.3

e

g

0.3 min.

2.5 min.

4.Rated value

(3) Temperature Characteristics

(Public STD Code):X7R(EIA)

Specifications and Test

Methods

(4)

Rated

Voltage

(6)

(5) Nominal

Capacitance

Tolerance

(Operating

Temp. Range)

Temp. coeff

orꢀCap. Change

Temp. Range

(Ref.Temp.)

-55 to 125 °C

(25 °C)

AC 250 V

4700 pF

±20 %

-15 to 15 %

-55 to 125 °C

・Soldering Method

Reflow

5.Package

mark

(8) Packaging

Packaging Unit

f180mm Reel

EMBOSSED W12P8

f330mm Reel

L

1000 pcs./Reel

4000 pcs./Reel

K

EMBOSSED W12P8

Product specifications in this catalog are as of Jun.14,2018,and are subject to change or obsolescence without notice.

Please consult the approval sheet before ordering.

Please read rating and !Cautions first.

GA243DR7E2472MW01-01

1

■ Specifications and Test Methods

Test Method

(Ref. Standard:JIS C 5101, IEC60384）

Item

Specification

No

1

Appearance

Dimension

No defects or abnormalities.

Visual inspection.

Using calipers and micrometers.

2

3

Within the specified dimensions.

No defects or abnormalities.

Voltage proof

Measurement Pointꢀꢀ

:

Between the terminations

：AC575V(r.m.s.)

Test Voltage ꢀꢀꢀꢀ ꢀꢀ : 10000pF min.

less than 10000pF ：AC1500V(r.m.s.)

Applied Time

:

60+/-1s

Charge/discharge current : 50mA max.

4

Insulation Resistance(I.R.)

2000 MΩ or more

Measurement Point ꢀꢀ :

Between the terminations

Measurement Voltage :

DC500+/-50V

60+/-5s

Charging Time

:

Measurement Temperature: Room Temperature

5

6

7

Capacitance

Shown in Rated value.

0.025 max.

Measurement Temperature: Room Temperature

Measurement Frequency :1.0+/-0.1kHz

Dissipation Factor (D.F.)

Measurement Voltage

AC1.0+/-0.2V(r.m.s.)

Temperature

R7 : Within +/-15%

(-55°C to +125°C)

The capacitance change should be measured after 5 min.

at each specified temp. stage.

Characteristics

of Capacitance

Capacitance value as a reference is the value in step 3.

Step

Temperature(C)

Reference Temp.+/-2

Min.Operating Temp. +/-3

Reference Temp. +/-2

Max.Operating Temp. +/-3

Reference Temp. +/-2

1

2

3

4

5

･Pretreatment

Perform a heat treatment at 150+0/-10°C for 1h+/-5min and then

let sit for 24+/-2h at room condition(*1).

8

Discharge Test

No defects or abnormalities.

As in below figure , discharge is made 50 times at 5s intervals from

the capacitor (Cd) charged at DC voltage of specified.

(Application : C < 10000pF)

C : Nominal Capacitance

Ｒ１

Ｒ３

Ｖ

Ｒ２

１０ｋＶ

Ｃｔ

Ｃｄ

Ct : Capacitor under test , Cd : 0.001µF

R1 : 1000Ω , R2 : 100 MΩ , R3 : Surge resistance

9

Vibration

Appearance No defects or abnormalities.

Capacitance Within the specified initial value.

Solder the capacitor on the test substrate A shown in "Complement of Test

method”.

Kind of Vibration

:

A simple harmonic motion

10Hz to 55Hz to 10Hz (1min)

1.5mm

Total amplitude

:

D.F.

Within the specified initial value.

This motion should be applied for a period of 2h in each 3 mutually

perpendicular directions(total of 6h).

10 Solderability

Test Method

:

Solder bath method

Solution of rosin ethanol 25(wt)%

80℃ to 120℃ for 10s to 30s

Sn-3.0Ag-0.5Cu (Lead Free Solder)

245+/-5℃

95% of the terminations is to be soldered evenly and

continuously.

Fluxꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀ:

Preheat

:

Solder

:

Solder Temp.

Immersion time

:

2+/-0.5s

Immersing in speedꢀꢀ :

25+/-2.5mm/s.

11 Resistance

Appearance No defects or abnormalities.

Test Method

Solder

:

Solder bath method

to

:

Sn-3.0Ag-0.5Cu (Lead Free Solder)

260+/-5℃

Soldering

Heat

Capacitance Within +/-10%

Change

Solder Temp.

Immersion time

:

10+/-1s

Immersing in speedꢀꢀ :

25+/-2.5mm/s.

D.F.

I.R.

Within the specified initial value.

Exposure Time

Preheat

:

24+/-2h at room condition(*1).

GA242 size min. : 100℃ to 120℃ for 1 min

and 170℃ to 200℃ for 1 min

:

ꢀꢀꢀꢀ

･Pretreatment

Perform a heat treatment at 150+0/-10°C for 1h+/-5min and then

let sit for 24+/-2h at room condition(*1).

Voltage proof No defects.

*1 Room Condition : Temperature:15 to 35°C, Relative humidity:45 to 75%, Atmosphere pressure:86 to 106kPa

2

JEMCGS-03009A

Test Method

(Ref. Standard:JIS C 5101, IEC60384）

Item

Specification

No

12 Adhesive Strength

of Termination

No removal of the terminations or other defect

should occur.

Solder the capacitor on the test substrate A shown in "Complement of Test

method”.

10N, 10+/-1s

Applied Direction : In parallel with the test substrate and vertical with the

capacitor side.

13 Substrate

Bending test

No defects or abnormalities.

Solder the capacitor on the test substrate B shown in "Complement of Test

method”.

Then apply the force in the direction shown in “Test Method of Substrate

Bending test” of “Complement of Test method”.

Flexureꢀ

ꢀꢀꢀ:

1mm

Holding Time ꢀ

Soldering Method

:

5+/-1s

:

Reflow soldering

14

Appearance No defects or abnormalities.

Fix the capacitor to the supporting Test substrate A (glass epoxy board)

shown in “Complement of Test method”.

Temperature

Sudden Change

Perform the 5 cycles according to the four heat treatments

shown in the following table.

Capacitance Within +/-15%

Change

Time

(min)

Step

Temp.(C)

1

2

3

4

30+/-3

Min.Operating Temp.+0/-3

Room Temp

D.F.

I.R.

0.05 max.

2 to 3

30+/-3

2 to 3

Max.Operating Temp.+3/-0

Room Temp

Within the specified initial value.

Exposure Time

:

24+/-2h at room condition(*1).

Voltage proof No defects.

･Pretreatment

Perform a heat treatment at 150+0/-10°C for 1h+/-5min and then

let sit for 24+/-2h at room condition(*1).

15 Humidity

Insulation

Appearance No defects or abnormalities.

The capacitor shall be subjected to 40+/-2°C , relative humidity of 90 to 95%

for 8h, and then removed in room condition(*1) for 16h until 5 cycles.

Capacitance Within +/-15%

Change

D.F.

I.R.

0.05 max.

1000 MΩ or more

Voltage proof No defects.

High

16

Appearance No defects or abnormalities.

Fix the capacitor to the supporting Test substrate A (glass epoxy board)

Temperature

High

shown in “Complement of Test method”.

Capacitance Within +/-15%

Change

Test Temperature

Test Humidity

Test Time

:

40+/-2℃

Humidity

(Steady)

:

90% to 95%RH

500+24/-0h

:

Applied Voltage

Exposure Time

:

Rated voltage

D.F.

I.R.

0.05 max.

:

24+/-2h at room condition(*1).

1000 MΩ or more

･Pretreatment

Apply test voltage for 1h+/-5min at test temperature.

Remove and let sit for 24+/-2h at room condition(*1).

Voltage proof No defects.

17 Durability

Appearance No defects or abnormalities.

Fix the capacitor to the supporting Test substrate A (glass epoxy board)

shown in “Complement of Test method”.

Test Temperature

:

Max. Operating Temp. +/-3℃

Capacitance Within +/-20%

Change

Charge/discharge current : 50mA max.

Nominal Capacitance

C ≥10000pF

Test Time

Test Voltage

AC300V(r.m.s.)

AC500V(r.m.s.)

1000+48/-0h

C < 10000pF

1500+48/-0h (*2)

D.F.

I.R.

0.05 max.

*2 Except that once each hour the voltage is increased to AC1000V(r.m.s.)

for 0.1s.

1000 MΩ or more

Exposure Time

:

24+/-2h at room condition(*1).

･Pretreatment

Apply test voltage for 1h+/-5min at test temperature.

Remove and let sit for 24+/-2h at room condition(*1).

Voltage proof No defects.

*Room Condition : Temperature:15 to 35°C, Relative humidity:45 to 75%, Atmosphere pressure:86 to 106kPa

JEMCGS-03009A

3

Complement of Test Method

1.Test substrate

The test substrate should be Substrate A or Substrate B as described in “Specifications and Test methods”.

The specimen should be soldered by the conditions as described below.

Soldering Method : Reflow soldering

Solder : Sn-3.0Ag-0.5Cu

(1) Test Substrate A

･Land Dimensions

Chip Capacitor

Land

Dimension (mm)

Type

a

b

c

GRM42

GRM43

GRM52

GRM55

3.5

4.5

7.0

8.0

2.4

3.7

3.2

5.6

a

Solder Resist

b

･Material : Glass Epoxy Board

･Thickness : 1.6mm

･Thickness of copper foil : 0.035mm

(1) Test Substrate B

a

Dimension of pettern (mm)

Type

a

b

c

d

GRM42

GRM43

GRM52

GRM55

3.5

4.5

7.0

8.0

2.4

3.7

3.2

5.6

1.0

(f4.5)

b

1.6

100

Copper foil

Solder resist

(unit : mm)

･Material : Glass Epoxy Board

･Thickness of copper foil : 0.035mm

2. Test Method of Substrate Bending test

a) Support state

(b) Test state

Test Substrate B

a

20

Capacitor

Support stand(f5)

45+/-2

Pressure stick

Test stand

Support stand

(unit : mm)

a:+/-2 gap between support stand center and test stand

·Material of Test stand and pressure stick

ꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀb:+/-5 gap between support stand center and test stand center

ꢀꢀꢀꢀꢀThe material shoud be a metal where a remarkable transformation and the distortion are not caused even if it is pressurized.

·Pressurizing speed

ꢀꢀꢀꢀꢀThe pressurizing speed is pressurized at the speed of about 1mm/s until the flexure reaches a regulated value.

ꢀꢀꢀꢀꢀ

Pressure stick

F

R5

L

Support

stand

JEMCGS-03009A

4

Package

(1) Appearance of taping

(a) Paper Tape

Bottom Tape (Thickness: Around 50m) is attached below Base Tape with sprocket and put Top Tape

(Thickness: Around 50m) on capacitor.

(b) Plastic Tape

Cover Tape (Thickness: Around 60m) is put on capacitor on Base Tape (Blister carrier Tape).

(c) The sprocket holes are to the right as the Tape is pulled toward the user.

(2) Packed chips

Capacitor

(3) Dimensions of Tape

(a) Type A (Dimensions of chip : Apply to 4.5x2.0)

f1.5+0.1/-0

4.0±0.1

0.3±0.1

4.0±0.1

2.0±0.05

3.7max.

A

(Unit : mm)

Dimensions of chip

[L×W]

A*

B*

Dimensions of A,B : Nominal value

4.5×2.0

2.5

5.1

(b) Type B (Dimensions of chip : Apply to 4.5x3.2 to 5.7x5.0)

2.0±0.05

0.3±0.1

f1.5+0.1/-0

4.0±0.1

8.0±0.1

3.7max.

(Unit : mm)

A

Dimensions of chip

[L×W]

A*

B*

4.5×3.2

3.6

3.2

5.4

4.9

6.1

Dimensions of A,B : Nominal value

5.7×2.8

5.7×5.0

JEMCGP-03075

5

Package

(4) Dimensions of Reel

13.0±1.0 : Tape width 8mm

17.0±1.0 : Tape width 12mm

2.0±0.5

f21±0.8

f13±0.2

9.0+1.0/-0 : Tape width 8mm

13.0+1.0/-0 : Tape width 12mm

(Unit : mm)

(5) Part of the leader and part of the empty tape shall be attached to the end of the tape as follows.

Vacant section : 160 min. Chip-mounting unit Vacant section : 190 min.

210 min.

(Unit : mm)

Direction of feed

(6) The top tape or cover tape and base tape are not attached at the end of the tape for a minimum of 5 pitches.

(7) Missing capacitors number within 0.1% of the number per reel or 1pc, whichever is greater, and not continuous.

(8) The top tape or cover tape and bottom tape shall not protrude beyond the edges of the tape and shall not

cover sprocket holes.

(9) Cumulative tolerance of sprocket holes, 10 pitches : ±0.3mm.

(10) Peeling off force : 0.1 to 0.6N in the direction shown on the follows.

165 to 180°

Top Tape or Cover Tape

Base Tape

JEMCGP-03075

6

!

Caution

■Limitation of Applications

Please contact us before using our products for the applications listed below which require especially high reliability

ꢀ for the prevention of defects which might directly cause damage to the third party's life, body or property.

ꢀꢀꢀ①Aircraft equipment ②Aerospace equipment ③Undersea equipment ④Power plant control equipment

ꢀꢀꢀ⑤Medical equipment ⑥Transportation equipment(vehicles,trains,ships,etc.) ⑦Traffic signal equipment

ꢀꢀꢀ⑧Disaster prevention / crime prevention equipment

⑨Data-processing equipment

ꢀꢀꢀ⑩Application of similar complexity and/or reliability requirements to the applications listed in the above.

■Storage and Operation condition

1. The performance of chip multilayer ceramic capacitors (henceforth just "capacitors") may be affected by the

storage conditions. Please use them promptly after delivery.

1-1. Maintain appropriate storage for the capacitors using the following conditions:

Room Temperature of +5℃ to +40℃ and a Relative Humidity of 20% to 70%.

High temperature and humidity conditions and/or prolonged storage may cause deterioration of the packaging

materials. If more than six months have elapsed since delivery, check packaging, mounting, etc. before use.

In addition, this may cause oxidation of the electrodes. If more than one year has elapsed since delivery,

also check the solderability before use.

ꢀ

1-2. Corrosive gas can react with the termination (external) electrodes or lead wires of capacitors, and result

in poor solderability. Do not store the capacitors in an atmosphere consisting of corrosive gas (e.g.,hydrogen

sulfide, sulfur dioxide, chlorine, ammonia gas etc.).

1-3. Due to moisture condensation caused by rapid humidity changes, or the photochemical change caused

by direct sunlight on the terminal electrodes and/or the resin/epoxy coatings, the solderability and

electrical performance may deteriorate. Do not store capacitors under direct sunlight or in high huimidity

conditions

JEMCGC-02981E

7

!

Caution

■Rating

1.Temperature Dependent Characteristics

1. The electrical characteristics of the capacitor can change with temperature.

1-1. For capacitors having larger temperature dependency, the capacitance may change with temperature

changes. The following actions are recommended in order to ensure suitable capacitance values.

(1) Select a suitable capacitance for the operating temperature range.

(2) The capacitance may change within the rated temperature.

When you use a high dielectric constant type capacitor in a circuit that needs a tight (narrow) capacitance

tolerance (e.g., a time-constant circuit), please carefully consider the temperature characteristics, and

carefully confirm the various characteristics in actual use conditions and the actual system.

2.Measurement of Capacitance

1. Measure capacitance with the voltage and frequency specified in the product specifications.

1-1. The output voltage of the measuring equipment may decrease occasionally when capacitance is high.

Please confirm whether a prescribed measured voltage is impressed to the capacitor.

1-2. The capacitance values of high dielectric constant type capacitors change depending on the AC voltage applied.

Please consider the AC voltage characteristics when selecting a capacitor to be used in a AC circuit.

3.Applied Voltage

1. Do not apply a voltage to the capacitor that exceeds the rated voltage as called out in the specifications.

1-1. Applied voltage between the terminals of a capacitor shall be less than or equal to the rated voltage.

(1) When AC voltage is superimposed on DC voltage, the zero-to-peak voltage shall not exceed the rated DC voltage.

When AC voltage or pulse voltage is applied, the peak-to-peak voltage shall not exceed the rated DC voltage.

(2) Abnormal voltages (surge voltage, static electricity, pulse voltage, etc.) shall not exceed the rated DC voltage.

Typical Voltage Applied to the DC capacitor

DC Voltage

DC Voltage+AC

AC Voltage

Pulse Voltage

0

E

0

(E：Maximum possible applied voltage.)

1-2. Influence of over voltage

Over voltage that is applied to the capacitor may result in an electrical short circuit caused by the breakdown

of the internal dielectric layers .

The time duration until breakdown depends on the applied voltage and the ambient temperature.

2. Use a safety standard certified capacitor in a power supply input circuit (AC filter), as it is also necessary to

consider the withstand voltage and impulse withstand voltage defined for each device.

JEMCGC-02981E

8

^!Caution

4.Type of Applied Voltage and Self-heating Temperature

1.Confirm the operating conditions to make sure that no large current is flowing into the capacitor due to the

continuous application of an AC voltage or pulse voltage.

When a DC rated voltage product is used in an AC voltage circuit or a pulse voltage circuit, the AC current

or pulse current will flow into the capacitor; therefore check the self-heating condition.

Please confirm the surface temperature of the capacitor so that the temperature remains within the upper limits

of the operating temperature, including the rise in temperature due to self-heating. When the capacitor is

used with a high-frequency voltage or pulse voltage, heat may be generated by dielectric loss.

1-1. The load should be contained so that the self-heating of the capacitor body remains below 20°C,

when measuring at an ambient temperature of 25°C. In addition, use a K thermocouple of ø0.1mm with less

heat capacity when measuring, and measure in a condition where there is no effect from the radiant

heat of other components or air flow caused by convection. Excessive generation of heat may cause

deterioration of the characteristics and reliability of the capacitor. (Absolutely do not perform

measurements while the cooling fan is operating, as an accurate measurement may not be performed.)

5. DC Voltage and AC Voltage Characteristic

1. The capacitance value of a high dielectric constant type capacitor changes depending on the DC voltage applied.

Please consider the DC voltage characteristics when a capacitor is selected for use in a DC circuit.

1-1. The capacitance of ceramic capacitors may change sharply depending on the applied voltage. (See figure)

Please confirm the following in order to secure the capacitance.

(1) Determine whether the capacitance change caused by the applied voltage is within the allowed range .

(2) In the DC voltage characteristics, the rate of capacitance change becomes larger as voltageincreases,

even if the applied voltage is below the rated voltage. When a high dielectric constant type capacitor is used in

a circuit that requires a tight (narrow) capacitance tolerance (e.g., a time constant circuit), please carefully consider

the voltage characteristics, and confirm the various characteristics in the actual operating conditions of the system.

2. The capacitance values of high dielectric constant type capacitors changes depending on the AC voltage applied.

Please consider the AC voltage characteristics when selecting a capacitor to be used in an AC circuit.

6. Capacitance Aging

1. The high dielectric constant type capacitors have an Aging characteristic in which the capacitance value decreases

with the passage of time.

When you use a high dielectric constant type capacitors in a circuit that needs a tight (narrow) capacitance tolerance

(e.g., a time-constant circuit), please carefully consider the characteristics of these capacitors, such as their aging, voltage,

and temperature characteristics. In addition, check capacitors using your actual appliances at the intended environment

and operating conditions.

7.Vibration and Shock

1. Please confirm the kind of vibration and/or shock, its condition, and any generation of resonance.

Please mount the capacitor so as not to generate resonance, and do not allow any impact on the terminals.

2. Mechanical shock due to being dropped may cause damage or

a crack in the dielectric material of the capacitor.

Do not use a dropped capacitor because the quality and reliability

may be deteriorated.

Crack

Floor

3. When printed circuit boards are piled up or handled, the corner

ꢀof another printed circuit board

Mounting printed circuit board

should not be allowed to hit the capacitor in order to avoid

a crack or other damage to the capacitor.

Crack

JEMCGC-02981E

9

!

Caution

■Soldering and Mounting

1.Mounting Position

1. Confirm the best mounting position and direction that minimizes the stress imposed on the capacitor during flexing

or bending the printed circuit board.

1-1.Choose a mounting position that minimizes the stress imposed on the chip during flexing or bending of the board.

ꢀ [Component Direction]

Locate chip horizontal to the

direction in which stress acts.

(Bad Example)

(Good Example)

[Chip Mounting Close to Board Separation Point]

It is effective to implement the following measures, to reduce stress in separating the board.

It is best to implement all of the following three measures; however, implement as many measures as possible

to reduce stress.

Contents of Measures

Stress Level

Aꢀ>ꢀD *1

Aꢀ>ꢀB

(1) Turn the mounting direction of the component parallel to the board separation surface.

(2) Add slits in the board separation part.

(3) Keep the mounting position of the component away from the board separation surface.

Aꢀ>ꢀC

C

Perforation

B

D

A

Slit

*1 A > D is valid when stress is added vertically to the perforation as with Hand Separation.

If a Cutting Disc is used, stress will be diagonal to the PCB, therefore A > D is invalid.

[Mounting Capacitors Near Screw Holes]

When a capacitor is mounted near a screw hole, it may be affected by the board deflection that occurs during

the tightening of the screw. Mount the capacitor in a position as far away from the screw holes as possible.

ꢀ

Recommended

Screw Hole

2.Information before Mounting

1. Do not re-use capacitors that were removed from the equipment.

2. Confirm capacitance characteristics under actual applied voltage.

3. Confirm the mechanical stress under actual process and equipment use.

4. Confirm the rated capacitance, rated voltage and other electrical characteristics before assembly.

5. Prior to use, confirm the solderability of capacitors that were in long-term storage.

6. Prior to measuring capacitance, carry out a heat treatment for capacitors that were in long-term storage.

7.The use of Sn-Zn based solder will deteriorate the reliability of the MLCC.

Please contact our sales representative or product engineers on the use of Sn-Zn based solder in advance.

JEMCGC-02981E

10

!

Caution

3.Maintenance of the Mounting (pick and place) Machine

1. Make sure that the following excessive forces are not applied to the capacitors.

Check the mounting in the actual device under actual use conditions ahead of time.

1-1. In mounting the capacitors on the printed circuit board, any bending force against them shall be kept

to a minimum to prevent them from any damage or cracking. Please take into account the following precautions

and recommendations for use in your process.

(1) Adjust the lowest position of the pickup nozzle so as not to bend the printed circuit board.

ꢀ [Incorrect]

ꢀ [Correct]

Suction Nozzle

Deflection

Board

Board Guide

Support Pin

2.Dirt particles and dust accumulated in the suction nozzle and suction mechanism prevent the nozzle from

moving smoothly. This creates excessive force on the capacitor during mounting, causing cracked chips.

Also, the locating claw, when worn out, imposes uneven forces on the chip when positioning, causing cracked chips.

The suction nozzle and the locating claw must be maintained, checked and replaced periodically.

JEMCGC-02981E

11

^!Caution

4-1.Reflow Soldering

1. When sudden heat is applied to the components, the

mechanical strength of the components will decrease

because a sudden temperature change causes

deformation inside the components. In order to prevent

mechanical damage to the components, preheating is

required for both the components and the PCB.

[Standard Conditions for Reflow Soldering]

Temperature(℃)

Soldering

Peak Temperature

Gradual

Cooling

220℃

ΔT

190℃

170℃

150℃

Preheating conditions are shown in table 1. It is required to

keep the temperature differential between the solder and

the components surface (ΔT) as small as possible.

Preheating

2. When components are immersed in solvent after mounting,

be sure to maintain the temperature difference (ΔT)

between the component and the solvent within the range

shown in the table 1.

Time

60-120 seconds 30-60 seconds

Table 1

[Allowable Reflow Soldering Temperature and Time]

Temperature

Differential

280

270

260

Series

ChipꢀDimension(L/W)ꢀCode

GA□

42/43/52/55

ΔT≦130℃

250

240

230

220

Recommended Conditions

Peak Temperature

Lead Free Solder

0

30

60

90

120

Soldering Time(s)

240 to 260℃

ꢀꢀꢀꢀꢀꢀꢀꢀIn the case of repeated soldering, the accumulated

ꢀꢀꢀꢀꢀꢀꢀꢀsoldering time must be within the range shown above.

Air or N₂

Atmosphere

Lead Free Solder : Sn-3.0Ag-0.5Cu

3. When a capacitor is mounted at a temperature lower than the peak reflow temperature recommended by the

solder manufacturer, the following quality problems can occur. Consider factors such as the placement of

peripheral components and the reflow temperature setting to prevent the capacitor’s reflow temperature from

dropping below the peak temperature specified. Be sure to evaluate the mounting situation beforehand and

verify that none of the following problems occur.

･Drop in solder wettability

･Solder voids

･Possible occurrence of whiskering

･Drop in bonding strength

･Drop in self-alignment properties

･Possible occurrence of tombstones and/or shifting on the land patterns of the circuit board

4. Optimum Solder Amount for Reflow Soldering

4-1. Overly thick application of solder paste results in a excessive solder fillet height.

This makes the chip more susceptible to mechanical and thermal stress on the board and may cause the chips to crack.

4-2. Too little solder paste results in a lack of adhesive strength on the termination, which may result in chips breaking loose

from the PCB.

4-3. Please confirm that solder has been applied smoothly to the termination.

Inverting the PCB

Make sure not to impose any abnormal mechanical shocks to the PCB.

JEMCGC-02981E

12

^!Caution

4-2.Flow Soldering

1. This product is not apply flow soldering.

4-3.Correction of Soldered Portion

When sudden heat is applied to the capacitor, distortion caused by the large temperature difference occurs internally,

and can be the cause of cracks. Capacitors also tend to be affected by mechanical and thermal stress depending

on the board preheating temperature or the soldering fillet shape, and can be the cause of cracks.

Please refer to "1. PCB Design" or "3. Optimum solder amount" for the solder amount and the fillet shapes.

1. Correction with a Soldering Iron

1-1. In order to reduce damage to the capacitor, be sure to preheat the capacitor and the mounting board.

Preheat to the temperature range shown in Table 3. A hot plate, hot air type preheater, etc. can be used for preheating.

1-2. After soldering, do not allow the component/PCB to cool down rapidly.

1-3. Perform the corrections with a soldering iron as quickly as possible. If the soldering iron is applied too long,

there is a possibility of causing solder leaching on the terminal electrodes, which will cause deterioration of the

adhesive strength and other problems.

Table 3

ChipꢀDimension

(L/W)ꢀCode

Temperature of

Soldering Iron Tip

Preheating

Temperature

Differential(ΔT)

Series

Atmosphere

Air

GA□

42/43/52/55

280℃ max.

150℃ min.

ΔT≦130℃

*Lead Free Solder : Sn-3.0Ag-0.5Cu

*Please manage Δ T in the temperature of soldering iron and the preheating temperature.

2. Correction with Spot Heater

Compared to local heating with a soldering iron, hot air heating by a spot heater heats the overall component

and board, therefore, it tends to lessen the thermal shock. In the case of a high density mounted board,

a spot heater can also prevent concerns of the soldering iron making direct contact with the component.

2-1. If the distance from the hot air outlet of the spot heater to the component is too close, cracks may occur due to

thermal shock. To prevent this problem, follow the conditions shown in Table 4.

2-2. In order to create an appropriate solder fillet shape, it is recommended that hot air be applied at the angle shown

in Figure 1.

Table 4

Distance

Hot Air Application angle

5mm or more

45° *Figure 1

Hot Air Temperature Nozzle Outlet 400°C max.

Application Time

Less than 30 seconds

[Figure 1]

One-hole Nozzle

an Angle of 45°

3. Optimum solder amount when re-working with a soldering iron

3-1. If the solder amount is excessive, the risk of cracking is higher

ꢀꢀꢀ during board bending or any other stressful condition.

Too little solder amount results in a lack of adhesive strength

on the termination, which may result in chips breaking

loose from the PCB.

SolderAmount

in section

Please confirm that solder has been applied smoothly is

and rising to the end surface of the chip.

3-2. A soldering iron with a tip of ø3mm or smaller should be used.

It is also necessary to keep the soldering iron from touching

the components during the re-work.

3-3. Solder wire with ø0.5mm or smaller is required for soldering.

JEMCGC-02981E

13

!

Caution

5.Washing

Excessive ultrasonic oscillation during cleaning can cause the PCBs to resonate, resulting in cracked chips

or broken solder joints. Before starting your production process, test your cleaning equipment / process to insure

it does not degrade the capacitors.

6.Electrical Test on Printed Circuit Board

1. Confirm position of the support pin or specific jig, when inspecting the electrical performance of a

capacitor after mounting on the printed circuit board.

1-1. Avoid bending the printed circuit board by the pressure of a test-probe, etc.

The thrusting force of the test probe can flex the PCB, resulting in cracked chips or open solder

joints. Provide support pins on the back side of the PCB to prevent warping or flexing.

Install support pins as close to the test-probe as possible.

1-2. Avoid vibration of the board by shock when a test -probe contacts a printed circuit board.

[Not Recommended]

[Recommended]

Support Pin

Peeling

Test-probe

7.Printed Circuit Board Cropping

1. After mounting a capacitor on a printed circuit board, do not apply any stress to the capacitor that

caused bending or twisting the board.

1-1. In cropping the board, the stress as shown may cause the capacitor to crack.

Cracked capacitors may cause deterioration of the insulation resistance, and result in a short.

Avoid this type of stress to a capacitor.

[Bending]

[Twisting]

2. Check the cropping method for the printed circuit board in advance.

2-1. Printed circuit board cropping shall be carried out by using a jig or an apparatus (Disc separator, router

type separator, etc.) to prevent the mechanical stress that can occur to the board.

Board Separation Apparatus

Hand Separation

Nipper Separation

Board Separation Method

(1) Board Separation Jig

2) Disc Separator

3) Router Type Separator

Level of stress on board

Recommended

High

×

Medium

△*

Medium

△*

Low

◯

· Board handling

· Layout of slits

· Board bending direction · Design of V groove

Hand and nipper

separation apply a high

level of stress.

· Board handling

Notes

Board handling

· Layout of capacitors

· Arrangement of blades

· Controlling blade life

Use another method.

* When a board separation jig or disc separator is used, if the following precautions are not observed,

a large board deflection stress will occur and the capacitors may crack.

Use router type separator if at all possible.

JEMCGC-02981E

14

!

Caution

(1) Example of a suitable jig

[In the case of Single-side Mounting]

An outline of the board separation jig is shown as follows.

Recommended example: Stress on the component mounting position can be minimized by holding the

portion close to the jig, and bend in the direction towards the side where the capacitors are mounted.

Not recommended example: The risk of cracks occurring in the capacitors increases due to large stress

being applied to the component mounting position, if the portion away from the jig is held and bent in the

direction opposite the side where the capacitors are mounted.

[Outline of jig]

[Hand Separation]

Recommended

Not recommended

Direction of

load

Direction of load

Load point

Printed Circuit Board

Printed circuit

board

V-groove

Component

Components

Printed circuit

board

Load point

Board Cropping Jig

[In the case of Double-sided Mounting]

Since components are mounted on both sides of the board, the risk of cracks occurring can not be avoided with the

above method. Therefore, implement the following measures to prevent stress from being applied to the components.

ꢀ (Measures)

(1) Consider introducing a router type separator.

ꢀ

ꢀIf it is difficult to introduce a router type separator, implement the following measures.

(Refer to item 1. Mounting Position)

(2) Mount the components parallel to the board separation surface.

(3) When mounting components near the board separation point, add slits in the separation position

near the component.

(4) Keep the mounting position of the components away from the board separation point.

(2) Example of a Disc Separator

An outline of a disc separator is shown as follows. As shown in the Principle of Operation, the top

blade and bottom blade are aligned with the V-grooves on the printed circuit board to separate the board.

In the following case, board deflection stress will be applied and cause cracks in the capacitors.

(1) When the adjustment of the top and bottom blades are misaligned, such as deviating in the top-bottom,

left-right or front-rear directions

(2) The angle of the V groove is too low, depth of the V groove is too shallow, or the V groove is misaligned

top-bottom

IF V groove is too deep, it is possible to brake when you handle and carry it. Carefully design depth of the

V groove with consideration about strength of material of the printed circuit board.

[ Outline of Machine ]

Top Blade

[ Principle of Operation ]

Top Blade

[ Cross-section Diagram ]

Printed Circuit Board

V-groove

Bottom Blade

Printed Circuit Board

[Disc Separator]

Recommended

Top Blade

V-groove

Not recommended

Top-bottom Misalignment Left-right Misalignment

Front-rear Misalignment

Top Blade

Bottom Blade

[V-groove Design]

Example of Recommended

Not Recommended

Low-Angle

Depth too Shallow

V-groove Design

Left-right Misalignment

Depth too Deep

JEMCGC-02981E

15

!

Caution

(3) Example of Router Type Separator

[ Outline Drawing ]

Router

The router type separator performs cutting by a router

rotating at a high speed. Since the board does not

bend in the cutting process, stress on the board can

be suppressed during board separation.

When attaching or removing boards to/from the router type

separator, carefully handle the boards to prevent bending.

8. Assembly

1. Handling

If a board mounted with capacitors is held with one hand, the board may bend.

Firmly hold the edges of the board with both hands when handling.

If a board mounted with capacitors is dropped, cracks may occur in the capacitors.

Do not use dropped boards, as there is a possibility that the quality of the capacitors may be impaired.

2. Attachment of Other Components

2-1. Mounting of Other Components

Pay attention to the following items, when mounting other components on the back side of the board after

capacitors have been mounted on the opposite side.

When the bottom dead point of the suction nozzle is set too low, board deflection stress may be applied

to the capacitors on the back side (bottom side), and cracks may occur in the capacitors.

· After the board is straightened, set the bottom dead point of the nozzle on the upper surface of the board.

· Periodically check and adjust the bottom dead point.

Suction Nozzle

2-2. Inserting Components with Leads into Boards

When inserting components (transformers, IC, etc.) into boards, bending the board may cause cracks in the

capacitors or cracks in the solder. Pay attention to the following.

· Increase the size of the holes to insert the leads, to reduce the stress on the board during insertion.

· Fix the board with support pins or a dedicated jig before insertion.

· Support below the board so that the board does not bend. When using support pins on the board,

periodically confirm that there is no difference in the height of each support pin.

Component with Leads

2-3. Attaching/Removing Sockets and/or Connectors

Insertion and removal of sockets and connectors, etc., might cause the board to bend.

Please insure that the board does not warp during insertion and removal of sockets and connectors, etc.,

ꢀꢀ ꢀor the bending may damage mounted components on the board.

Socket

2-4. Tightening Screws

The board may be bent, when tightening screws, etc. during the attachment of the board to a shield or

chassis. Pay attention to the following items before performing the work.

· Plan the work to prevent the board from bending.

· Use a torque screwdriver, to prevent over-tightening of the screws.

· The board may bend after mounting by reflow soldering, etc. Please note, as stress may be applied

to the chips by forcibly flattening the board when tightening the screws.

Screwdriver

JEMCGC-02981E

16

^!Caution

■ Others

1. Under Operation of Equipment

1-1. Do not touch a capacitor directly with bare hands during operation in order to avoid the danger of an electric shock.

1-2. Do not allow the terminals of a capacitor to come in contact with any conductive objects (short-circuit).

Do not expose a capacitor to a conductive liquid, inducing any acid or alkali solutions.

1-3. Confirm the environment in which the equipment will operate is under the specified conditions.

Do not use the equipment under the following environments.

(1) Being spattered with water or oil.

(2) Being exposed to direct sunlight.

(3) Being exposed to ozone, ultraviolet rays, or radiation.

(4) Being exposed to toxic gas (e.g., hydrogen sulfide, sulfur dioxide, chlorine, ammonia gas etc.)

(5) Any vibrations or mechanical shocks exceeding the specified limits.

(6) Moisture condensing environments.

1-4. Use damp proof countermeasures if using under any conditions that can cause condensation.

2. Others

2-1. In an Emergency

(1) If the equipment should generate smoke, fire, or smell, immediately turn off or unplug the equipment.

If the equipment is not turned off or unplugged, the hazards may be worsened by supplying continuous power.

(2) In this type of situation, do not allow face and hands to come in contact with the capacitor or burns may be caused

by the capacitor's high temperature.

2-2. Disposal of waste

When capacitors are disposed of, they must be burned or buried by an industrial waste vendor with the appropriate

licenses.

2-3. Circuit Design

(1) Addition of Fail Safe Function

Capacitors that are cracked by dropping or bending of the board may cause deterioration of the

insulation resistance, and result in a short. If the circuit being used may cause an electrical shock,

smoke or fire when a capacitor is shorted, be sure to install fail-safe functions, such as a fuse,

to prevent secondary accidents.

(2) Capacitors used to prevent electromagnetic interference in the primary AC side circuit, or as a

connection/insulation, must be a safety standard certified product, or satisfy the contents

stipulated in the Electrical Appliance and Material Safety Law. Install a fuse for each line in case of a short.

2-4. Test Condition for AC Withstanding Voltage

(1) Test Equipment

Test for AC withstanding voltage should be made with equipment capable of creating a wave similar

to a 50/60 Hz sine wave.

(2) Voltage Applied Method

The capacitor's leads or terminals should be firmly connected to the output of the withstanding voltage test equipment ,

and then the voltage should be raised from near zero to the test voltage.

If the test voltage is applied directly to the capacitor without raising it from near zero, it should be applied

with the zero cross. *At the end of the test time, the test voltage should be reduced to near zero, and then the capacitor's

leads or terminals should be taken off the output of the withstanding voltage test equipment.

If the test voltage is applied directly to the capacitor without raising it from near zero, surge voltage may occur

and cause a defect.

*ZERO CROSS is the point where voltage sine wave passes 0V.

- See the figure at right -

2-5. Remarks

Failure to follow the cautions may result, worst case, in a short circuit and smoking when the product is used.

The above notices are for standard applications and conditions. Contact us when the products are used in special

mounting conditions.

Select optimum conditions for operation as they determine the reliability of the product after assembly.

The data herein are given in typical values, not guaranteed ratings.

JEMCGC-02981E

17

Notice

■ Rating

1.Operating Temperature

1. The operating temperature limit depends on the capacitor.

1-1. Do not apply temperatures exceeding the maximum operating temperature.

It is necessary to select a capacitor with a suitable rated temperature that will cover the operating temperature range.

It is also necessary to consider the temperature distribution in equipment and the seasonal temperature variable

factor.

1-2. Consider the self-heating factor of the capacitor

The surface temperature of the capacitor shall not exceed the maximum operating temperature including self-heating.

2.Atmosphere Surroundings (gaseous and liquid)

1. Restriction on the operating environment of capacitors.

1-1. Capacitors, when used in the above, unsuitable, operating environments may deteriorate due to the corrosion

of the terminations and the penetration of moisture into the capacitor.

1-2. The same phenomenon as the above may occur when the electrodes or terminals of the capacitor are subject

to moisture condensation.

1-3. The deterioration of characteristics and insulation resistance due to the oxidization or corrosion of terminal

ꢀꢀelectrodes may result in breakdown when the capacitor is exposed to corrosive or volatile gases or solvents

for long periods of time.

3.Piezo-electric Phenomenon

1. When using high dielectric constant type capacitors in AC or pulse circuits, the capacitor itself vibrates

at specific frequencies and noise may be generated.

Moreover, when the mechanical vibration or shock is added to capacitor, noise may occur.

JEMCGC-02981E

18

Notice

■Soldering and Mounting

1.PCB Design

1. Notice for Pattern Forms

1-1. Unlike leaded components, chip components are susceptible to flexing stresses since they are mounted

directly on the substrate.

They are also more sensitive to mechanical and thermal stresses than leaded components.

Excess solder fillet height can multiply these stresses and cause chip cracking.

When designing substrates, take land patterns and dimensions into consideration to eliminate the possibility

of excess solder fillet height.

1-2. There is a possibility of chip cracking caused by PCB expansion/contraction with heat, because stress

on a chip is different depending on PCB material and structure.When the thermal expansion coefficient

greatly differs between the board used for mounting and the chip,it will cause cracking of the chip due to

the thermal expansion and contraction. When capacitors are mounted on a fluorine resin printed circuit

board or on a single-layered glass epoxy board, it may also cause cracking of the chip for the same reason.

Pattern Forms

Prohibited

Correct

Chassis

Solder Resist

Solder (ground)

Placing Close to Chassis

Electrode Pattern

Lead Wire

in section

Solder Resist

Placing of Chip

Components

and Leaded

Components

in section

Soldering Iron

Lead Wire

Placing of Leaded

Components

after Chip Component

Solder Resist

in section

Solder Resist

Lateral Mounting

JEMCGC-02981E

19

Notice

2. Land Dimensions

Chip Capacitor

ꢀPlease confirm the suitable land dimension by

Land

evaluating of the actual SET / PCB.

b

a

Solder Resist

Table 1 Reflow Soldering Method

ChipꢀDimension

(L/W)ꢀCode

Series

Chip(L×W)

4.5×2.0

4.5×3.2

5.7×2.8

5.7×5.0

a

b

c

GA□

42

43

52

55

2.8 to 3.4

3.0 to 3.5

4.0 to 4.6

1.2 to 1.4

1.4 to 1.6

1.4 to 1.8

2.3 to 3.0

2.1 to 2.6

3.5 to 4.8

(in mm)

2-2. Dimensions of Slit (Example)

Sli

t

Chip

Capacitor

Solder

Resist

Preparing the slit helps flux cleaning and resin coating

on the back of the capacitor.

L

d

However, the length of the slit design should be

as short as possible to prevent mechanical damage

in the capacitor.

Lan

d

L×W

A longer slit design might receive more severe

mechanical stress from the PCB.

Recommended slit design is shown in the Table.

e

4.5×2.0

4.5×3.2

5.7×2.8

5.7×5.0

1.0～2.8

1.0～4.0

3.6～4.1

4.8～5.3

4.4～4.9

6.6～7.1

3. Board Design

When designing the board, keep in mind that the amount of strain which occurs will increase depending on the size

and material of the board.

Relationship with amount of strain to the board thickness, length, width, etc.]

3PL

2Ewh²

Relationshipbetweenloadandstrain

ε=

ε：Strain on center of board (μst)

L：Distance between supporting points (mm)

w ：Board width (mm)

P

Y

h ：Board thickness (mm)

E ：Elastic modulus of board (N/m²=Pa)

Y ：Deflection (mm)

P ：Load (N)

h

w

L

When the load is constant, the following relationship can be established.

· As the distance between the supporting points (L) increases,the amount of strain also increases.

→Reduce the distance between the supporting points.

· As the elastic modulus (E) decreases, the amount of strain increases.

→Increase the elastic modulus.

· As the board width (w) decreases, the amount of strain increases.

→Increase the width of the board.

· As the board thickness (h) decreases, the amount of strain increases.

→Increase the thickness of the board.

Since the board thickness is squared, the effect on the amount of strain becomes even greater.

JEMCGC-02981E

20

Notice

2.Reflow soldering

The flux in the solder paste contains halogen-based substances and organic acids as activators.

ꢀ Strong acidic flux can corrode the capacitor and degrade its performance.

Please check the quality of capacitor after mounting.

3.Washing

1. Please evaluate the capacitor using actual cleaning equipment and conditions to confirm the quality,

and select the solvent for cleaning.

2. Unsuitable cleaning may leave residual flux or other foreign substances, causing deterioration of

electrical characteristics and the reliability of the capacitors.

4.Coating

1. A crack may be caused in the capacitor due to the stress of the thermal contraction of the resin during curing process.

The stress is affected by the amount of resin and curing contraction. Select a resin with low curing contraction.

The difference in the thermal expansion coefficient between a coating resin or a molding resin and the capacitor

may cause the destruction and deterioration of the capacitor such as a crack or peeling, and lead to the deterioration

of insulation resistance or dielectric breakdown.

Select a resin for which the thermal expansion coefficient is as close to that of the capacitor as possible.

A silicone resin can be used as an under-coating to buffer against the stress.

2. Select a resin that is less hygroscopic.

Using hygroscopic resins under high humidity conditions may cause the deterioration of the insulation resistance

of a capacitor. An epoxy resin can be used as a less hygroscopic resin.

3．The halogen system substance and organic acid are included in coating material, and a chip corrodes

ꢀꢀby the kind of Coating material. Do not use strong acid type.

JEMCGC-02981E

21

Notice

■ Others

1.Transportation

1. The performance of a capacitor may be affected by the conditions during transportation.

1-1. The capacitors shall be protected against excessive temperature, humidity and mechanical force during transportation.

(1) Climatic condition

ꢀ･ low air temperature : -40℃

･ change of temperature air/air : -25℃/+25℃

･ low air pressure : 30 kPa

･ change of air pressure : 6 kPa/min.

(2) Mechanical condition

Transportation shall be done in such a way that the boxes are not deformed and forces are not directly passed

on to the inner packaging.

1-2. Do not apply excessive vibration, shock, or pressure to the capacitor.

(1) When excessive mechanical shock or pressure is applied to a capacitor, chipping or cracking may occur

in the ceramic body of the capacitor.

(2) When the sharp edge of an air driver, a soldering iron, tweezers, a chassis, etc. impacts strongly on the surface

of the capacitor, the capacitor may crack and short-circuit.

1-3. Do not use a capacitor to which excessive shock was applied by dropping etc.

A capacitor dropped accidentally during processing may be damaged.

2.Characteristics Evaluation in the Actual System

1. Evaluate the capacitor in the actual system,to confirm that there is no problem with the performance and specification

values in a finished product before using.

2. Since a voltage dependency and temperature dependency exists in the capacitance of high dielectric type ceramic

capacitors, the capacitance may change depending on the operating conditions in the actual system.

Therefore,be sure to evaluate the various characteristics, such as the leakage current and noise absorptivity,

which will affect the capacitance value of the capacitor.

3. In addition,voltages exceeding the predetermined surge may be applied to the capacitor by the inductance in

the actual system. Evaluate the surge resistance in the actual system as required.

JEMCGC-02981E

22

NOTE

!

1.Please make sure that your product has been evaluated in view of your specifications with our

product being mounted to your product.

2.Your are requested not to use our product deviating from this product specification.

3.We consider it not appropriate to include any terms and conditions with regard to the business

transaction in the product specifications, drawings or other technical documents. Therefore,

if your technical documents as above include such terms and conditions such as warranty clause,

product liability clause, or intellectual property infringement liability clause, they will be deemed to

be invalid.

JEMCGC-02981E

23


型号：	GA243DR7E2472MW01
厂家：	muRata
描述：	Based on the Electrical Appliance and Material Safety Law of Japan Chip Multilayer Ceramic Capacitors for General
文件：	总23页 (文件大小：675K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

GA243DR7E2472MW01 [MURATA]

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