EVA86Q7UTF332KA01# [MURATA]
汽车[动力总成 / 安全设备],汽车[信息娱乐 / 舒适设备],民用设备,工业设备,移动设备,植入式以外的医疗器械设备 [GHTF A/B/C];型号: | EVA86Q7UTF332KA01# |
厂家: | muRata |
描述: | 汽车[动力总成 / 安全设备],汽车[信息娱乐 / 舒适设备],民用设备,工业设备,移动设备,植入式以外的医疗器械设备 [GHTF A/B/C] 医疗 医疗器械 |
文件: | 总24页 (文件大小:1087K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
Reference Specification
Safety Standard Certified Resin Molding SMD Type Multilayer Ceramic Capacitors for
Automotive (Powertrain/Safety)
Product specifications in this catalog are as of Apr. 2023, and are subject to change or
obsolescence without notice.
Please consult the approval sheet before ordering.Please read rating and Cautions first.
Reference only
Caution
■Storage and Operation Conditions
1. The molding resin of the molding type ceramic capacitor does not form a perfect seal, avoid corrosive gas
(e.g., hydrogen sulfide, sulfur dioxide, chlorine, ammonia gas etc.) and direct sunlight,
and use (storage) in the condition without moisture condensation.
When washing, bonding or molding this product, make sure that there is no effect on the quality in your product.
This one is MSL 3 product. So, in order to avoid the absorption of moisture, capacitors are packed in
moisture-proof package.
Under the following humidity and temperature conditions, the warranty period for unopened moisture-proof
package is 2 years after the moisture-proof package is enclosed.
Solder the enclosed capacitors within 168 h after opening the moisture-proof package.
Also, even after opening, store it in the packing condition at the time of delivery or in a similar state.
Temperature : 10 to 30 ℃
Humidityꢀ ꢀ: 60 % max.
If it has been more than 1 week since opening, or if the 10 % display of the HIC (humidity indicator card)
is pink, perform baking (60 °C, 168 h) before mounting.
In addition, if it exceeds 12 months, check the solderability before use.
■Rating
1. Temperature Dependent Characteristics
1. The electrical characteristics of a capacitor can change with temperature.
1-1. For capacitors having larger temperature dependency, the capacitance may change with temperature changes.
The following actions are recommended in order to ensure suitable capacitance values.
(1) Select a suitable capacitance for the operating temperature range.
(2) The capacitance may change within the rated temperature. When you use a high dielectric constant type
capacitor in a circuit that needs a tight (narrow) capacitance tolerance (e.g., a time-constant circuit),
please carefully consider the temperature characteristics, and carefully confirm the various characteristics
in actual use conditions and the actual system.
2. Measurement of Capacitance
1. Measure capacitance with the voltage and frequency specified in the product specifications.
1-1. The output voltage of the measuring equipment may decrease occasionally when capacitance is high.
Please confirm whether a prescribed measured voltage is impressed to the capacitor.
1-2. The capacitance values of high dielectric constant type capacitors change depending on the AC voltage applied.
Please consider the AC voltage characteristics when selecting a capacitor to be used in an AC circuit.
3. Applied Voltage
1. Do not apply a voltage to a safety standard certified product that exceeds the rated voltage as called out in the
specifications. Applied voltage between the terminals of a safety standard certified product shall be less than or equal
to the rated voltage (+10 %).ꢀWhen a safety standard certified product is used as a DC voltage product, the AC rated
voltage value becomes the DC rated voltage value.
(Example : AC250 V (r.m.s.) rated product can be used as DC250 V (+10 %) rated product.)
If both AC rated voltage and DC rated voltage are specified, apply the voltage lower than the respective rated voltage.
1-1. When a safety standard certified product is used in a circuit connected to a commercial power supply,
ensure that the applied commercial power supply voltage including fluctuation should be less than +10 % above
its rated voltage.
EGEVA01
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Reference only
Caution
1-2. When using a safety standard certified product as a DC rated product in circuits other than those connected to
a commercial power supply.
When AC voltage is superimposed on DC voltage, the zero-to-peak voltage shall not exceed the rated DC voltage.
When AC voltage or pulse voltage is applied, the peak-to-peak voltage shall not exceed the rated DC voltage.
Typical Voltage Applied to the DC Capacitor
DC Voltage
DC Voltage+AC
AC Voltage
Pulse Voltage
E
E
0
E
0
0
(E : Maximum possible applied voltage.)
2. Abnormal voltages (surge voltage, static electricity, pulse voltage, etc.) shall not exceed the rated DC voltage.
4. Type of Applied Voltage and Self-heating Temperature
1. Confirm the operating conditions to make sure that no large current is flowing into the capacitor due to the continuous
application of an AC voltage or pulse voltage. When a DC rated voltage product is used in an AC voltage circuit or a
pulse voltage circuit, the AC current or pulse current will flow into the capacitor; therefore check the self-heating condition.
Please confirm the surface temperature of the capacitor so that the temperature remains within the upper limits of the
operating temperature, including the rise in temperature due to self-heating. When the capacitor is used with a
high-frequency voltage or pulse voltage, heat may be generated by dielectric loss.
<Applicable to Temperature Characteristic X7R(R7)>
The load should be contained so that the self-heating of the capacitor body remains below 20 °C, when measuring
at an ambient temperature of 25 °C. In addition, use a K thermocouple of φ0.1 mm with less heat capacity when
measuring, and measure in a condition where there is no effect from the radiant heat of other components or air flow
caused by convection. Excessive generation of heat may cause deterioration of the characteristics and reliability of the
capacitor. (Absolutely do not perform measurements while the cooling fan is operating, as an accurate measurement
may not be performed.)
5. DC Voltage and AC Voltage Characteristics
1. The capacitance value of a high dielectric constant type capacitor changes depending on the DC voltage applied.
Please consider the DC voltage characteristics when a capacitor is selected for use in a DC circuit.
1-1. The capacitance of ceramic capacitors may change sharply depending on the applied voltage (see figure).
Please confirm the following in order to secure the capacitance.
(1) Determine whether the capacitance change caused by the applied voltage is within the allowed range.
(2) In the DC voltage characteristics, the rate of capacitance change becomes larger as voltage increases, even if the
applied voltage is below the rated voltage. When a high dielectric constant type capacitor is used in a circuit that
requires a tight (narrow) capacitance tolerance (e.g., a time constant circuit), please carefully consider the voltage
characteristics, and confirm the various characteristics in actual operating conditions in an actual system.
2. The capacitance values of high dielectric constant type capacitors changes depending on the AC voltage applied.
Please consider the AC voltage characteristics when selecting a capacitor to be used in an AC circuit.
6. Capacitance Aging
1. The high dielectric constant type capacitors have the characteristic in which the capacitance value decreases with the
passage of time. When you use high dielectric constant type capacitors in a circuit that needs a tight (narrow) capacitance
tolerance (e.g., a time-constant circuit), please carefully consider the characteristics of these capacitors, such as their
aging, voltage, and temperature characteristics. In addition, check capacitors using your actual appliances at the intended
environment and operating conditions.
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Reference only
Caution
7. Vibration and Shock
1. Please confirm the kind of vibration and/or shock, its condition, and any generation of resonance.
Please mount the capacitor so as not to generate resonance, and do not allow any impact on the terminals.
2. Mechanical shock due to being dropped may cause a bend of terminal, damage or a crack in the dielectric material of
the capacitor. Do not use a dropped capacitor because the quality and reliability may be deteriorated.
3. When printed circuit boards are piled up or handled, the corner of another printed circuit board should not be allowed
to hit the capacitor, in order to avoid a bend of terminal, a crack or other damage to the capacitor.
■Soldering and Mounting
1. Mounting Position
1. Confirm the best mounting position and direction that minimizes the stress imposed on the capacitor during flexing
or bending the printed circuit board.
1-1. Choose a mounting position that minimizes the stress imposed on the chip during flexing or bending of the board.
[Component Direction]
Locate chip horizontal to the direction in which stress acts.
[Chip Mounting Close to Board Separation Point]
It is effective to implement the following measures, to reduce stress in separating the board. It is best to implement all
of the following three measures; however, implement as many measures as possible to reduce stress.
Contents of Measures
(1) Turn the mounting direction of the component parallel
(1) to the board separation surface.
Stress Level
A>D
C
Perforation
B
(2) Add slits in the board separation part.
(3) Keep the mounting position of the component away
(3) from the board separation surface.
A>B
D
A
A>C
Slit
[Mounting Capacitors Near Screw Holes]
When a capacitor is mounted near a screw hole, it may be affected by the board deflection that occurs during the
tightening of the screw. Mount the capacitor in a position as far away from the screw holes as possible.
Recommended
Screw Hole
2. Information before Mounting
1. Do not re-use capacitors that were removed from the equipment.
2. Confirm capacitance characteristics under actual applied voltage.
3. Confirm the mechanical stress under actual process and equipment use.
4. Confirm the rated capacitance, rated voltage and other electrical characteristics before assembly.
5. Prior to use, confirm the solderability of capacitors that were in long-term storage.
6. Prior to measuring capacitance, carry out a heat treatment for capacitors that were in long-term storage.
7. The use of Sn-Zn based solder will deteriorate the reliability of the MLCC.
Please contact our sales representative or product engineers on the use of Sn-Zn based solder in advance.
EGEVA01
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Reference only
Caution
3. Maintenance of the Mounting (pick and place) Machine
1. Make sure that the following excessive forces are not applied to the capacitors.
1-1. In mounting the capacitors on the printed circuit board, any bending force against them shall be kept to a minimum
to prevent them from any bending damage or cracking. Please take into account the following precautions and
recommendations for use in your process.
(1) Adjust the lowest position of the pickup nozzle so as not to bend the printed circuit board.
(2) Adjust the nozzle pressure within a static load of 1 to 3 N during mounting.
2. Dirt particles and dust accumulated between the suction nozzle and the cylinder inner wall prevent the nozzle from moving
moving smoothly. This imposes greater force upon the chip during mounting, causing cracked chips. Also, the locating
claw, when worn out, imposes uneven forces on the chip when positioning, causing cracked chips.
The suction nozzle and the locating claw must be maintained, checked, and replaced periodically.
4-1. Reflow Soldering
[Standard Conditions for Reflow Soldering]
1. When sudden heat is applied to the components, the
mechanical strength of the components will decrease
because a sudden temperature change causes deformation
inside the components. In order to prevent mechanical damage
to the components, preheating is required for both the
components and the PCB. Preheating conditions are shown
in table 1. It is required to keep the temperature differential
between the solder and the components surface (ΔT) as small
as possible.
Reflow
Temperature (℃)
Soldering
Peak Temperature
Gradual
Cooling
220 ℃
ΔT
190 ℃
170 ℃
150 ℃
Preheating
2 When components are immersed in solvent after mounting,
be sure to maintain the temperature difference (ΔT) between
the component and the solvent within the range shown in table 1.
Time
60 to 120 sec.
30 to 60 sec.
Table 1
Temperature Differential
ΔT≦130°C
[Allowable Reflow Soldering Temperature and Time]
280
Recommended Conditions
Lead Free Solder
270
260
250
Peak Temperature
Atmosphere
240 to 260 °C
Air or N2
240
230
220
Lead Free Solder : Sn-3.0Ag-0.5Cu
3. When a capacitor is mounted at a temperature lower than
the peak reflow temperature recommended by
the solder manufacturer, the following quality problems can occur.
Consider factors such as the placement of peripheral components
and the reflow temperature setting to prevent the capacitor’s
reflow temperature from.
0
30
60
90
120
Soldering Time (sec.)
In the case of repeated soldering, the accumulated
soldering time must be within the range shown above.
Be sure to evaluate the mounting situation beforehand and verify
that none of the following problems occur.
・Drop in solder wettability
・Solder voids
・Possible occurrence of whiskering
・Drop in bonding strength
・Drop in self-alignment properties
・Possible occurrence of tombstones and/or shifting on the land
patterns of the circuit board
EGEVA01
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Reference only
Caution
4. Optimum Solder Amount for Reflow Soldering
4-1. If solder paste is excessive, solder between a chip and a
metal terminal melts. This causes the chip to move and
come off.
higher than 0.3 mm
and lower than 1.0 mm
4-2. If solder paste is too little, it causes a lack of adhesive
strength on the metal terminal and the capacitor comes off.
4-3. Please make sure that solder is smoothly applied higher
than 0.3 mm and lower than 1.0 mm.
Inverting the PCB
Make sure not to impose any abnormal mechanical shocks to the PCB.
4-2. Flow Soldering
1. Do not apply flow soldering.
4-3. Correction of Soldered Portion
1. Use a soldering iron with a tip radius of 3.0 mm or less.
2. Regarding the type of solder, use a wire diameter of
φ0.5 mm or less (rosin core wire solder).
Tip of Soldering Iron
Tip temperature : 350 ℃ or less / 5 s or less / 60 W or less
3. Do not touch the resin by tip of Soldering Iron
to avoid the degradation of resin.
4. The amount of solder for corrections by soldering iron,
should be higher than 0.3 mm and lower than 1.0 mm.
Apply the tip of the
Wire Solder
Copper Land
soldering iron only on the
terminal portion, without
touching the resin.
higher than 0.3 mm
and lower than 1.0 mm
5. Washing
Excessive ultrasonic oscillation during cleaning can cause the PCBs to resonate, resulting in cracked chips or broken
solder joints. Take note not to vibrate PCBs.
6. Electrical Test on Printed Circuit Board
1. Confirm position of the backup pin or specific jig, when inspecting the electrical performance of a capacitor after
mounting on the printed circuit board.
1-1. Avoid bending the printed circuit board by the pressure of a test-probe, etc. The thrusting force of the test probe can
flex the PCB, resulting in cracked chips or open solder joints. Provide backup pins on the back side of the PCB
to prevent warping or flexing. Install backup pins as close to the capacitor as possible.
1-2. Avoid vibration of the board by shock when a test-probe contacts a printed circuit board.
[Not Recommended]
[Recommended]
Backup Pin
Peeling
Test-probe
Test-probe
EGEVA01
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Reference only
Caution
7. Printed Circuit Board Cropping
1. After mounting a capacitor on a printed circuit board, do not apply any stress to the capacitor that causes bending
or twisting the board.
1-1. In cropping the board, the stress as shown at right may cause the capacitor to crack. Cracked capacitors may cause
deterioration of the insulation resistance, and result in a short. Avoid this type of stress to a capacitor.
[Bending]
[Twisting]
2. Check the cropping method for the printed circuit board in advance.
2-1. Printed circuit board cropping shall be carried out by using a jig or an apparatus (Disk separator, router type separator,
etc.) to prevent the mechanical stress that can occur to the board.
Board Separation Apparatus
Hand Separation
Nipper Separation
Board Separation Method
(1) Board Separation Jig
(2) Disk Separator
(3) Router Type Separator
Level of stress on board
Recommended
High
×
Medium
Medium
Low
△*
△*
○
· Board handling
Hand and nipper separation
apply a high level of stress.
Use another method.
· Board handling
· Board bending direction
· Layout of capacitors
· Layout of slits
Notes
· Design of V groove
· Arrangement of blades
· Controlling blade life
Board handling
* When a board separation jig or disk separator is used, if the following precautions are not observed,
a large board deflection stress will occur and the capacitors may crack. Use router type separator if at all possible.
(1) Example of a suitable jig
[In the case of Single-side Mounting]
An outline of the board separation jig is shown as follows. Recommended example: Stress on the component
mounting position can be minimized by holding the portion close to the jig, and bend in the direction towards
the side where the capacitors are mounted. Not recommended example : The risk of cracks occurring in the
capacitors increases due to large stress being applied to the component mounting position, if the portion away
from the jig is held and bent in the direction opposite the side where the capacitors are mounted.
Recommended
Not Recommended
[Outline of Jig]
[In the case of Double-sided Mounting]
Since components are mounted on both sides of the board, the risk of cracks occurring can not be avoided with the
above method. Therefore, implement the following measures to prevent stress from being applied to the components.
(Measures)
Consider introducing a router type separator. If it is difficult to introduce a router type separator, implement
the following measures. (Refer to item 1. Mounting Position)
①
Mount the components at a right angle to the board separation surface.
When mounting components near the board separation point, add slits in the separation position
near the component.
②
③
Keep the mounting position of the components away from the board separation point.
④
EGEVA01
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Reference only
Caution
(2) Example of a Disk Separator
An outline of a disk separator is shown as follows. As shown in the Principle of Operation, the top blade and bottom
blade are aligned with the V-grooves on the printed circuit board to separate the board. In the following case, board
deflection stress will be applied and cause cracks in the capacitors.
When the adjustment of the top and bottom blades are misaligned, such as deviating in the top-bottom, left-right
or front-rear directions
①
The angle of the V groove is too low, depth of the V groove is too shallow, or the V groove is misaligned
top-bottom IF V groove is too deep, it is possible to brake when you handle and carry it. Carefully design depth of
the V groove with consideration about strength of material of the printed circuit board.
②
[Outline of Machine]
[Principle of Operation]
[Cross-section Diagram]
Not Recommended
Left-right Misalignment
Recommended
Top-bottom Misalignment
Front-rear Misalignment
Top Bladeꢀ
Top Bladeꢀ
Top Bladeꢀ
Top Bladeꢀ
Bottom Blade
Bottom Blade
Bottom Blade
Bottom Blade
Not Recommended
Example of Recommended
V-groove Design
Left-right Misalignment
Low-Angle
Depth too Shallow
Depth too Deep
(3) Example of Router Type Separator
The router type separator performs cutting by a router rotating at a high speed. Since the board does not bend in the
cutting process, stress on the board can be suppressed during board separation. When attaching or removing
boards to/from the router type separator, carefully handle the boards to prevent bending.
[Outline Drawing]
Router
8. Assembly
1. Handling
If a board mounted with capacitors is held with one hand, the board may bend. Firmly hold the edges of the board with
both hands when handling. If a board mounted with capacitors is dropped, cracks may occur in the capacitors.
Do not use dropped boards, as there is a possibility that the quality of the capacitors may be impaired.
EGEVA01
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Reference only
Caution
2. Attachment of Other Components
2-1. Mounting of Other Components
Pay attention to the following items, when mounting other
components on the back side of the board after capacitors
have been mounted on the opposite side. When the bottom
dead point of the suction nozzle is set too low, board deflection
stress may be applied to the capacitors on the back side
(bottom side), and cracks may occur in the capacitors.
・ After the board is straightened, set the bottom dead point
of the nozzle on the upper surface of the board.
SuctionNozzle
・ Periodically check and adjust the bottom dead point.
2-2. Inserting Components with Leads into Boards
When inserting components (transformers, IC, etc.) into boards,
bending the board may cause cracks in the capacitors or
cracks in the solder. Pay attention to the following.
Increase the size of the holes to insert the leads, to reduce
the stress on the board during insertion.
Fix the board with backup pins or a dedicated jig before
insertion.
Support below the board so that the board does not bend.
When using multiple backup pins on the board, periodically
confirm that there is no difference in the height of each
backup pin.
・
・
・
Component with Leads
2-3. Attaching/Removing Sockets
When the board itself is a connector, the board may bend when
a socket is attached or removed. Plan the work so that the board
does not bend when a socket is attached or removed.
Socket
2-4. Tightening Screws
The board may be bent, when tightening screws, etc. during the
attachment of the board to a shield or chassis.
Pay attention to the following items before performing the work.
Plan the work to prevent the board from bending.
Use a torque screwdriver, to prevent over-tightening of the
screws.
・
・
Screwdriver
The board may bend after mounting by reflow soldering, etc.
Please note, as stress may be applied to the chips by forcibly
flattening the board when tightening the screws.
・
■Other
1. Under Operation of Equipment
1-1. Do not touch a capacitor directly with bare hands during operation in order to avoid the danger of an electric shock.
1-2. Do not allow the terminals of a capacitor to come in contact with any conductive objects (short-circuit). Do not
expose a capacitor to a conductive liquid, including any acid or alkali solutions.
1-3. Confirm the environment in which the equipment will operate is under the specified conditions. Do not use
the equipment under the following environments.
(1) Being spattered with water or oil.
(2) Being exposed to direct sunlight.
(3) Being exposed to ozone, ultraviolet rays, or radiation.
(4) Being exposed to toxic gas (e.g., hydrogen sulfide, sulfur dioxide, chlorine, ammonia gas, etc.)
(5) Any vibrations or mechanical shocks exceeding the specified limits.
(6) Moisture condensing environments.
1-4. Use damp proof countermeasures if using under any conditions that can cause condensation.
EGEVA01
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Reference only
Caution
2. Other
2-1. In an Emergency
(1) If the equipment should generate smoke, fire, or smell, immediately turn off or unplug the equipment. If the
equipment is not turned off or unplugged, the hazards may be worsened by supplying continuous power.
(2) In this type of situation, do not allow face and hands to come in contact with the capacitor or burns may be
caused by the capacitor's high temperature.
2-2. Disposal of Waste
When capacitors are disposed of, they must be burned or buried by an industrial waste vendor with the appropriate
licenses.
2-3. Circuit Design
(1) Addition of Fail Safe Function
Capacitors that are cracked by dropping or bending of the board may cause deterioration of the insulation
resistance, and result in a short. If the circuit being used may cause an electrical shock, smoke or fire when
a capacitor is shorted, be sure to install fail-safe functions, such as a fuse, to prevent secondary accidents.
(2) Capacitors used to prevent electromagnetic interference in the primary AC side circuit, or as a
connection/insulation, must be a safety standard certified product, or satisfy the contents stipulated
in the Electrical Appliance and Material Safety Law. Install a fuse for each line in case of a short.
2-4. Test Condition for AC Withstanding Voltage
(1) Test Equipment
Test for AC withstanding voltage should be made with equipment capable of creating a wave similar
to a 50/60 Hz sine wave.
(2) Voltage Applied Method
The capacitor's leads or terminals should be firmly connected to the output of the withstanding
voltage test equipment, and then the voltage should be raised from near zero to the test voltage.
If the test voltage is applied directly to the capacitor without raising it from near zero, it should be
applied with the zero cross. *At the end of the test time, the test voltage should be reduced to near
zero, and then the capacitor's leads or terminals should be taken off the output of the withstanding
voltage test equipment. If the test voltage is applied directly to the capacitor without raising it from
near zero, surge voltage may occur and cause a defect.
*ZERO CROSS is the point where voltage sine wave passes 0 V.
- See the figure at right -
2-5. Remarks
Failure to follow the cautions may result, worst case, in a short circuit and smoking when the product is used.
The above notices are for standard applications and conditions. Contact us when the products are used
in special mounting conditions. Select optimum conditions for operation as they determine the reliability of
the product after assembly. The data herein are given in typical values, not guaranteed ratings.
EGEVA01
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Reference only
Caution
3. Limitation of applications
The products listed in the specification(hereinafter the product(s) is called as the “Product(s)”) are designed and manufactured
for applications specified in the specification. (hereinafter called as the “Specific Application”)
We shall not warrant anythingꢀin connection with the Products including fitness, performance, adequateness, safety,
or quality, in the case of applications listed in from (1) to (11) written at the end of this precautions, which may generally
require high performance, function, quality, management of production or safety.
Therefore, the Product shall be applied in compliance with the specific application.
WE DISCLAIM ANY LOSS AND DAMAGES ARISING FROM OR IN CONNECTION WITH THE PRODUCTS
INCLUDING BUT NOT LIMITED TO THE CASE SUCH LOSS AND DAMAGES CAUSED BY THE
UNEXPECTED ACCIDENT, IN EVENT THAT (i) THE PRODUCT IS APPLIED FOR THE PURPOSE WHICH
IS NOT SPECIFIED AS THE SPECIFIC APPLICATION FOR THE PRODUCT, AND/OR (ii) THE PRODUCT
IS APPLIED FOR ANY FOLLOWING APPLICATION PURPOSES FROM (1) TO (11) (EXCEPT THAT SUCH
APPLICATION PURPOSE IS UNAMBIGUOUSLY SPECIFIED AS SPECIFIC APPLICATION FOR THE
PRODUCT IN OUR CATALOGꢀSPECIFICATION FORMS, DATASHEETS, OR OTHER DOCUMENTS
OFFICIALLY ISSUED BY US*)
1. Aircraft equipment
2. Aerospace equipment
3. Undersea equipment
4. Power plant control equipment
5. Medical equipment
6. Transportation equipment
7. Traffic control equipment
8. Disaster prevention/security equipment
9. Industrial data-processing equipment
10. Combustion/explosion control equipment
11. Equipment with complexity and/or required reliability equivalent to the applications listed in the above.
For exploring information of the Products which will be compatible with the particular purpose other than those specified
in the specification, please contact our sales offices, distribution agents, or trading companies with which you make a deal,
or via our web contact form.
Contact form: https://www.murata.com/contactform
*We may design and manufacture particular Products for applications listed in (1) to (11). Provided that,
in such case we shall unambiguously specify such Specific Application in the specification without any exception.
Therefore, any other documents and/or performances, whether exist or non-exist, shall not be deemed as
the evidence to imply that we accept the applications listed in (1) to (11).
Notice
■Rating
1. Operating Temperature
1. The operating temperature limit depends on the capacitor.
1-1. Do not apply temperatures exceeding the upper operating temperature. It is necessary to select a capacitor with
a suitable rated temperature that will cover the operating temperature range. It is also necessary to consider
the temperature distribution in equipment and the seasonal temperature variable factor.
1-2. Consider the self-heating factor of the capacitor. The surface temperature of the capacitor shall be the upper
operating temperature or less when including the self-heating factors.
2. Atmosphere Surroundings (gaseous and liquid)
1. Restriction on the operating environment of capacitors.
1-1. Capacitors, when used in the above, unsuitable, operating environments may deteriorate due to the corrosion
of the terminations and the penetration of moisture into the capacitor.
1-2. The same phenomenon as the above may occur when the electrodes or terminals of the capacitor are subject
to moisture condensation.
1-3. The deterioration of characteristics and insulation resistance due to the oxidization or corrosion of terminal
electrodes may result in breakdown when the capacitor is exposed to corrosive or volatile gases or solvents
for long periods of time.
3. Piezo-electric Phenomenon
1. When using high dielectric constant type capacitors in AC or pulse circuits, the capacitor itself vibrates at specific frequencies
and noise may be generated. Moreover, when the mechanical vibration or shock is added to the capacitor, noise may occur.
EGEVA01
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Reference only
Notice
■Soldering and Mounting
1. PCB Design
1. Notice for Pattern Forms
1-1. Unlike leaded components, chip components are susceptible to flexing stresses since they are mounted directly
on the substrate. They are also more sensitive to mechanical and thermal stresses than leaded components.
Excess solder fillet height can multiply these tresses and cause chip cracking. When designing substrates,
take land patterns and dimensions into consideration to eliminate the possibility of excess solder fillet height.
1-2. There is a possibility of chip cracking caused by PCB expansion/contraction with heat, because stress on a chip is
different depending on PCB material and structure. When the thermal expansion coefficient greatly differs between
the board used for mounting and the chip, it will cause cracking of the chip due to the thermal expansion and
contraction.
Pattern Forms
Prohibited
Correct
Chassis
Solder Resist
Solder(ground)
Placing Close to Chassis
in section
in section
Electrode Pattern
Solder Resist
Lead Wire
Placing
of Chip Components
and Leaded Components
in section
in section
Soldering Iron
Solder Resist
Lead Wire
Placing
of Leaded Components
after Chip Component
in section
in section
Land
The part that
tends to have
Solder Resist
Lateral Mounting *
excessive solder
*When the capacitors are mounted in parallel and share the land, separate the land by solder resist to avoid excessive solder.
2. Land Dimensions
2-1. Chip capacitors can be cracked due to the stress of PCB
bending, etc. if the land area is larger than needed and
has an excess amount of solder. Please refer to the land
dimensions in the following table for reflow soldering.
Please confirm the suitable land dimension by evaluating
of the actual SET / PCB.
Unit:mm
a
b
c
10.4
1.65
3.0
EGEVA01
11 / 23
Reference only
Notice
3. Board Design
When designing the board, keep in mind that the amount of strain which occurs will increase depending on the size
and material of the board.
Relationship with amount of strain to the board thickness, length, width, etc.]
3PL
Relationshipbetweenloadandstrain
ε=
2Ewh2
ε:Strain on center of board (μst)
L:Distance between supporting points (mm)
P
Y
w
h
E
Y
P
:Board width (mm)
:Board thickness (mm)
:Elastic modulus of board (N/m2=Pa)
:Deflection (mm)
h
:Load (N)
w
L
When the load is constant, the following relationship can be established.
· As the distance between the supporting points (L) increases,the amount of strain also increases.
→Reduce the distance between the supporting points.
· As the elastic modulus (E) decreases, the amount of strain increases.
→Increase the elastic modulus.
·
As the board width (w) decreases, the amount of strain increases.
→Increase the width of the board.
As the board thickness (h) decreases, the amount of strain increases.
·
→Increase the thickness of the board.
Since the board thickness is squared, the effect on the amount of strain becomes even greater.
4. Washing
1. Please evaluate the capacitor using actual cleaning equipment and conditions to confirm the quality, and select the
solvent for cleaning.
2. Unsuitable cleaning solvent may leave residual flux or other foreign substances, causing deterioration of electrical
characteristics and the reliability of the capacitors.
3. Select the proper cleaning conditions.
3-1. Improper cleaning conditions (excessive or insufficient) may result in deterioration of the performance of the capacitors.
5. Coating
1. A crack may be cause in the capacitor due to the stress of the thermal contraction of the resin during curing process. The
stress is affected by the amount of resin and curing contraction. Select a resin with low curing contraction. The difference
in the thermal expansion coefficient between a coating resin or a molding resin and the capacitor may cause the
destruction and deterioration of the capacitor such as a crack or peeling, and lead to the deterioration of insulation
resistance or dielectric breakdown. Select a resin for which the thermal expansion coefficient is as close to that of the
capacitor as possible. A silicone resin can be used as an under-coating to buffer against the stress.
2. Select a resin that is less hygroscopic. Using hygroscopic resins under high humidity conditions may cause
the deterioration of the insulation resistance of a capacitor. An epoxy resin can be used as a less hygroscopic resin.
■Other
1. Transportation
1. The performance of a capacitor may be affected by the conditions during transportation.
1-1. The capacitors shall be protected against excessive temperature, humidity, and mechanical force during
transportation.
・ Mechanical condition
Transportation shall be done in such a way that the boxes are not deformed and forced are not directly passed
on to the inner packaging.
1-2. Do not apply excessive vibration, shock, or pressure to the capacitor.
(1) When excessive mechanical shock or pressure is applied to a capacitor, chipping or cracking may occur
in the ceramic body of the capacitor.
(2) When the sharp edge of an air driver, a soldering iron, tweezers, a chassis, etc. impacts strongly on the surface
of the capacitor, the capacitor may crack and short-circuit.
1-3. Do not use a capacitor to which excessive shock was applied by dropping, etc. A capacitor dropped accidentally
during processing may be damaged.
EGEVA01
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Reference only
Notice
2. Characteristics Evaluation in the Actual System
1. Evaluate the capacitor in the actual system, to confirm that there is no problem with the performance and specification
values in a finished product before using.
2. Since a voltage dependency and temperature dependency exists in the capacitance of high dielectric type ceramic
capacitors, the capacitance may change depending on the operating conditions in the actual system. Therefore,
be sure to evaluate the various characteristics, such as the leakage current and noise absorptivity, which will affect
the capacitance value of the capacitor.
3. In addition, voltages exceeding the predetermined surge may be applied to the capacitor by the inductance in the actual
system. Evaluate the surge resistance in the actual system as required.
Note
1. Please make sure that your product has been evaluated in view of your specifications with our product being mounted
to your product.
2. You are requested not to use our product deviating from this specification.
EGEVA01
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Reference only
1. Application
This specification is applied to Safety Standard Certified Resin Molding SMD Type Multilayer Ceramic
Capacitors Type TF in accordance with AEC-Q200 requirements.
The safety standard certification is obtained by Class X1, Y2.
1-1.Specific applications:
・Automotive powertrain/safety equipment: Products that can be used for automotive equipment related
to running, turning, stopping, safety devices, etc., or equipment whose structure, equipment, and
performance are legally required to meet technical standards for safety assurance or environmental
protection.
・Automotive infotainment/comfort equipment: Products that can be used for automotive equipment such
as car navigation systems and car audio systems that do not directly relate to human life and whose
structure, equipment, and performance are not specifically required by law to meet technical standards
for safety assurance or environmental protection.
・Medical equipment [GHTF A/B/C] except for implant equipment
Products suitable for use in medical devices designated under the GHTF/IMDRF international
classifications as Class A or Class B (the functions of which are not directly involved in protection of
human life or property) or in medical devices other than implants designated under the GHTF/IMDRF
international classifications as Class C (the malfunctioning of which is considered to pose a
comparatively high risk to the human body).
・Consumer equipment: Products that can be used in consumer equipment such as home appliances,
audio/visual equipment, communication equipment, information equipment, office equipment, and
household robotics, and whose functions are not directly related to the protection of human life and
property.
・Industrial equipment: Products that can be used in industrial equipment such as base stations,
manufacturing equipment, industrial robotics equipment, and measurement equipment, and whose
functions do not directly relate to the protection of human life and property.
1-2.Unsuitable Application: Applications listed in “Limitation of applications” in this product specification.
Approval standard and certified number
Standard number
*Certified number
Rated voltage
UL60384-14/
E37921
UL/cUL
X1: AC305 V(r.m.s.) / DC1500 V
Y2: AC305 V(r.m.s.) / DC1500 V
CSA E60384-14
ENEC (VDE)
40056291
EN60384-14
*Above Certified number may be changed on account of the revision of standards and
the renewal of certification.
2. Rating
2-1. Operating temperature range
-55 to 125°C
2-2. Rated voltage
X1: AC305 V(r.m.s.) / DC1500 V
Y2: AC305 V(r.m.s.) / DC1500 V
2-3. Part name configuration
ex.) EVA
Series Body Dimension Temperature Certified Capacitance Capacitance Individual Package
Dimension (T) Characteristic Type Tolerance Specification
86
Q
7U
TF
472
K
A01
K
•Body Dimension
Code
86
Body Dimension (mm)
8.0 × 6.0
ETEVA8601
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Reference only
•Dimension(T)
Code
Q
Dimension (mm)
3.7
Please refer to [Part number list] on the dimensions of metal terminal product.
•Temperature Characteristic
Code
Public STD Code
U2J
(EIA)
7U
Please confirm detailed specification on [Specification and test methods].
• Certified Type
This denotes safety certified type name Type TF.
•Capacitance
The first two digits denote significant figures ; the last digit denotes the multiplier of 10 in pF.
ex.) In case 472.
47 × 102 = 4700 pF
•Capacitance Tolerance
Please refer to [Part number list].
• Individual Specification
Code
Individual Specification
A01
Terminal style : Outside bending
•Package
Code
K
Package
φ330 mm reel Plastic taping
2-4. Marking
Certified Type
Capacitance
: Code
: 3 digit system
Company name : Abbreviation
472
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Reference only
3. Part number list
Unit : mm
Dimension(mm)
W
Cap.
Cap.
Pack
qty.
(pcs)
T.C.
tol. Customer Part Number
Murata Part Number
(pF)
L
T
(%)
U2J 100 ±10
U2J 150 ±10
U2J 220 ±10
U2J 330 ±10
U2J 470 ±10
U2J 680 ±10
U2J 1000 ±10
U2J 1500 ±10
U2J 2200 ±10
U2J 3300 ±10
U2J 4700 ±10
EVA86Q7UTF101KA01K
EVA86Q7UTF151KA01K
EVA86Q7UTF221KA01K
EVA86Q7UTF331KA01K
EVA86Q7UTF471KA01K
EVA86Q7UTF681KA01K
EVA86Q7UTF102KA01K
EVA86Q7UTF152KA01K
EVA86Q7UTF222KA01K
EVA86Q7UTF332KA01K
EVA86Q7UTF472KA01K
12.7±0.5 6.0±0.5
12.7±0.5 6.0±0.5
12.7±0.5 6.0±0.5
12.7±0.5 6.0±0.5
12.7±0.5 6.0±0.5
12.7±0.5 6.0±0.5
12.7±0.5 6.0±0.5
12.7±0.5 6.0±0.5
12.7±0.5 6.0±0.5
12.7±0.5 6.0±0.5
12.7±0.5 6.0±0.5
3.7±0.5
3.7±0.5
3.7±0.5
3.7±0.5
3.7±0.5
3.7±0.5
3.7±0.5
3.7±0.5
3.7±0.5
3.7±0.5
3.7±0.5
1000
1000
1000
1000
1000
1000
1000
1000
1000
1000
1000
ETEVA8601
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4. Specification
No.
Test Item
Specification
Test Method
1
Pre-and Post-Stress Electrical Test
-
2
High Temperature Exposure
(Storage)
The measured and observed characteristics should
satisfy the specifications in the following table.
Set the capacitor for 1,000±12 h at 150±3 ℃.
Let sit for 24±2 h at *room condition, then measure.
Appearance
No marking defects
Capacitance
Change
Within ±5.0 % or ±0.5 pF
(Whichever is larger)
Q
500 or more
I.R.
More than 1,000 MΩ or 50 MΩ・μF
(Whichever is smaller)
3
Temperature Cycle
The measured and observed characteristics should
satisfy the specifications in the following table.
Fix the capacitor to the supporting jig in the same manner and under the same
conditions as (No.18). Perform the 1,000 cycles according to the four heat
treatments listed in the following table.
Let sit for 24±2 h at *room condition, then measure.
Appearance
No marking defects
Capacitance
Change
Within ±5.0 % or ±0.5 pF
(Whichever is larger)
Q
500 or more
I.R.
More than 1,000 MΩ or 50 MΩ・μF
(Whichever is smaller)
Dielectric Strength Per Item 16
4
Destructive
No defects or abnormalities
Per EIA-469
Physical Analysis
5-1 Humidity Loading (AC)
The measured and observed characteristics should
satisfy the specifications in the following table.
Apply the AC305 V(r.m.s.) for 1,000±12 h at 85±3 ℃ in 80 to 85 % relative
humidity.
Remove and let sit for 24±2 h at *room condition, then measure.
The change/discharge current is less than 50 mA.
Appearance
No marking defects
Capacitance
Change
Within ±6.0 % or ±0.6 pF
(Whichever is larger)
Q
200 or more
I.R.
More than 100 MΩ or 5 MΩ・μF
(Whichever is smaller)
5-2 Biased Humidity (Humidity Loading
(DC))
The measured and observed characteristics should
satisfy the specifications in the following table.
Apply the rated voltage (DC1500 V) and DC1.3+0.2/-0 V (add 100 kΩ resistor)
at 85±3 ℃ and 80 to 85 % humidity for 1,000±12 h.
Remove and let sit for 24±2 h at *room condition, then measure.
Appearance
No marking defects
The change/discharge current is less than 50 mA.
Capacitance
Change
Within ±6.0 % or ±0.6 pF
(Whichever is larger)
Q
200 or more
I.R.
More than 100 MΩ or 5 MΩ・μF
(Whichever is smaller)
*room condition : Temperature : 15 to 35 ℃, Relative humidity : 45 to 75 %, Atmosphere pressure : 86 to 106 kPa
ESEVA8601
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Reference only
Test Item
No.
6-1 Operating Life (AC)
Specification
Test Method
The measured and observed characteristics should
satisfy the specifications in the following table.
Impulse voltage
Each individual capacitor should be subjected to a 5 kV impulses for three
times or more. Then the capacitors are applied to life test.
Appearance
No marking defects
Capacitance
Change
Within ±6.0 % or ±0.6 pF
(Whichever is larger)
Front time (T1) = 1.7 μs = 1.67T
Time to half-value (T2) = 50 μs
Q
350 or more
I.R.
More than 100 MΩ or 5 MΩ・μF
(Whichever is smaller)
Dielectric Strength Per Item 16
The capacitors are placed in a circulating air oven for a period of 1,000 h.
The air in the oven is maintained at maximum operating temperature +2/-0 °C,
and relative humidity of 50 % max..
The charge/discharge current is less than 50 mA.
Throughout the test, the capacitors are subjected to AC519 V(r.m.s.) (170 % of
ac rated voltage) <50/60 Hz> alternating voltage of mains frequency, except
that once each hour the voltage is increased to AC1000 V(r.m.s.) for 0.1 s.
6-2 Operating Life (DC)
The measured and observed characteristics should
Impulse voltage
satisfy the specifications in the following table.
Each individual capacitor should be subjected to a 5 kV impulses for three
times or more. Then the capacitors are applied to life test.
Appearance
No marking defects
Capacitance
Change
Within ±6.0 % or ±0.6 pF
(Whichever is larger)
Front time (T1) = 1.7 μs = 1.67T
Time to half-value (T2) = 50 μs
Q
350 or more
I.R.
More than 100 MΩ or 5 MΩ・μF
(Whichever is smaller)
Dielectric Strength Per Item 16
Apply DC2550 V (170 % of dc rated voltage) for 1,000±12 h at maximum
operating temperature +2/-0 ℃, and relative humidity of 50 % max..
Remove and let sit for 24±2 h at *room condition, then measure. The
change/discharge current is less than 50 mA.
No defects or abnormalities
External Visual
Physical Dimension
Marking
7
8
9
Visual inspection
Within the specified dimensions
To be easily legible
Using calipers and micrometers.
The capacitor should be inspected by naked eyes.
10 Resistance to
Solvents
The measured and observed characteristics should
satisfy the specifications in the following table.
Per MIL-STD-202 Method 215.
Solvent 1 : 1 part (by volume) of isopropyl alcohol
3 parts (by volume) of mineral spirits
Solvent 3 : Terpene defluxer
Solvent 4 : 42 parts (by volume) of water
1 part (by volume) of propylene glycol
monomethyl ether
Appearance
No marking defects
Within the specified tolerance
500 or more
Capacitance
Q
1 part (by volume) of monoethanolomine
I.R.
More than 1,000 MΩ or 50 MΩ・μF
(Whichever is smaller)
11 Mechanical shock
The measured and observed characteristics should
satisfy the specifications in the following table.
Three shocks in each direction should be applied along 3 mutually
perpendicular axes of the test specimen (18 shocks).
The specified test pulse should be half sine and should have a duration : 0.5
ms, peak value : 1,500 g and velocity change : 4.7 m/s.
Appearance
Capacitance
Q
No marking defects
Within the specified tolerance
500 or more
12 Vibration
The measured and observed characteristics should
satisfy the specifications in the following table.
Solder the capacitor to the test jig (glass epoxy board) in the same manner and
under the same conditions as (No.18).
The capacitor should be subjected to a simple harmonic motion having a total
amplitude of 1.5 mm, the frequency being valid uniformly between the
approximate limits of 10 and 2,000 Hz.
The frequency range, from 10 to 2,000 Hz and return to 10 Hz, should be
traversed in approximately 20 min. This motion should be applied for 12 items
in each 3 mutually perpendicular directions (total of 36 times).
Appearance
Capacitance
Q
No marking defects
Within the specified tolerance
500 or more
*room condition : Temperature : 15 to 35 ℃, Relative humidity : 45 to 75 %, Atmosphere pressure : 86 to 106 kPa
ESEVA8601
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Test Item
No.
Specification
Test Method
Reflow Soldering : Peak 260+0/-5 ℃
The area of soldering 230 ℃ min.、20 to 40 s
13 Resistance to Soldering Heat
The measured and observed characteristics should
satisfy the specifications in the following table.
Let sit for 24±2 h at *room condition, then measure.
Appearance
No marking defects
Within the specified tolerance
500 or more
Capacitance
Q
300 ℃
260+0/-5 ℃
230℃ min
20 to 40 s
I.R.
More than 1,000 MΩ or 50 MΩ・μF
(Whichever is smaller)
200 ℃
180 ℃
Dielectric
Strength
Per Item 16
150 ℃
100 ℃
60 to 120 s
14 ESD
The measured and observed characteristics should
satisfy the specifications in the following table.
Per AEC-Q200-002
Appearance
No marking defects
Within the specified tolerance
500 or more
Capacitance
Q
I.R.
More than 1,000 MΩ or 50 MΩ・μF
(Whichever is smaller)
15 Solderability
The connection between the board and the metal
terminals is covered with solder without opening.
The solder should be at least 0.3 mm wet in height.
Preheat at 155 ℃ for 4 h.
After the preheating, following test is done.
Reflow Soldering : Peak 260+0/-5 ℃
The area of soldering 230 ℃ min., 20 to 40 s.
300 ℃
260+0/-5 ℃
230℃ min
20 to 40 s
200 ℃
180 ℃
150 ℃
60 to 120 s
16 Electrical
Characteriz-
ation
Appearance
Capacitance
No defects or abnormalities
Within the specified tolerance
Visual inspection
The capacitance/Q should be measured at 25 ℃ at the frequency and voltage
shown in the table.
Nominal
Capacitance
Measuring
frequency
Measuring
voltage
C<1000 pF
1±0.1 MHz
1±0.1 kHz
AC1.0±0.2 V(r.m.s.)
C≧1000 pF
Q
500 or more
I.R. 25℃
More than 10,000 MΩ or 100 MΩ・μF
(Whichever is smaller)
The insulation resistance should be measured with AC500±50 V at 25 ℃ and
125 ℃ within 2min. of charging.
I.R. 125℃
More than 1,000 MΩ or 100 MΩ・μF
(Whichever is smaller)
Dielectric Strength No failure
(Between
Terminals)
No failure should be observed when voltage in the table is applied between the
terminations for 60±1 s, provided the charge/discharge current is less than 50
mA.
Test voltage is AC2000 V(r.m.s.) and DC4000 V.
Dielectric Strength No failure
(Terminal To
External Resin)
No failure should be observed when voltage in the table is applied between the
terminations for 60±1 s, provided the charge/discharge current is less than 50
mA.
Test voltage is AC2110 V(r.m.s.) and DC4000 V.
*room condition : Temperature : 15 to 35 ℃, Relative humidity : 45 to 75 %, Atmosphere pressure : 86 to 106 kPa
ESEVA8601
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Reference only
Test Item
No.
Specification
Test Method
17 Board Flex
The measured and observed characteristics should
satisfy the specifications in the following table.
Solder the capacitor on the test jig (glass epoxy board) shown in Fig. 1 using
solder. Then apply a force in the direction shown in Fig. 2 for 60 s. Then
soldering should be done by the reflow method and should be conducted with
care so that the soldering is uniform and free of defects such as heat shock.
Appearance
No marking defects
Capacitance
Change
Within ±10.0 % or ±1.0 pF
(Whichever is larger)
Test jig
Dimension (mm)
material : glass epoxy board
Thickness : 1.6 mm
a
b
c
20 50
speed:1.0mm/s
Pressurize
10.4
13.7
3.0
Land dimension
R4
a
b
Flexure : 5 mm
Capacitance meter
45
45
Fig. 2
Fig. 1
18 Terminal Strength
The measured and observed characteristics should
satisfy the specifications in the following table.
Solder the capacitor to the test jig (glass epoxy board) shown in Fig. 3 using
solder. Then apply 18 N force in parallel with the test jig for 60 s.
The soldering should be done by the reflow method and should be conducted
with care so that the soldering is uniform and free of defects such as heat
shock.
Appearance
No marking defects
Within specified tolerance
500 or more
Capacitance
Q
Dimension (mm)
I.R.
More than 1,000 MΩ or 50 MΩ・μF
(Whichever is smaller)
a
b
c
Land dimension
10.4
13.7
3.0
a
b
Test jig
material : glass epoxy board
Thickness : 1.6 mm
Fig. 3
19 Beam Load Test
Destruction value should be exceed following one.
54.5 N
Please the capacitor in the beam load fixture as in Fig. 4
Apply a force.
Speed supplied the Stress Load : 2.5 mm/s
0.6L
Fig. 4
20 Capacitance
Temperature
Temp.
Coefficient
The capacitance change should be measured after 5 min. at each specified
temperature stage.
-750±120 ppm/℃
(Temp. Range : 25 to 125 ℃)
-750+120、-347 ppm/℃
Characteristics
The range of capacitance change compared with the above 25 ℃ value over
the temperature ranges shown in the table should be within the specified
ranges.
(Temp. Range : -55 to 25 ℃)
Capacitance
Drift
Within ±0.5 % or ±0.05 pF
(Whichever is larger)
Step
Temperature (℃)
25±2
1
2
3
4
5
-55±3
25±2
125±3
25±2
ESEVA8601
20 / 23
Reference only
Test Item
No.
21 Active Flammability
Specification
The cheese-cloth should not be on fire.
Test Method
The capacitors should be individually wrapped in at least one, but not more than
two, complete layers of cheese-cloth. The capacitor should be subjected to 20
discharges. The interval between successive discharges should be 5 s. The
UAc should be maintained for 2 min. after the last discharge.
C1,2 : 1 μF±10 %, C3 : 0.033 μF±5 % 10 kV
L1~4 : 1.5 mH±20 % 16 A Rod core choke
R
: 100 Ω±2 %, Ct : 3 μF±5 % 10 kV
UAc : UR±5 %, UR : Rated working voltage
Cx : Capacitor under test
F
: Fuse, Rated 10 A
Ut : Voltage applied to Ct
22 Passive Flammability
The burning time should not be exceeded the time 30 s. The capacitor under test should be held in the flame in the position which best
The tissue paper should not ignite.
promotes burning.
Time of exposure to flame is for 30 s.
Length of flame:12±1 mm
Gas burner
:Length 35 mm min.
Inside Dia. 0.5±0.1 mm
Outside Dia. 0.9 mm max.
Gas : Butane gas Purity 95 % min.
ESEVA8601
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5. Packing
(1) Appearance of taping
(a) Plastic Tape
Cover Tape (Thickness : Around 60 µm) is put on capacitor on Base Tape (Blister carrier Tape).
(b) The sprocket holes are to the right as the Tape is pulled toward the user.
(2) Packed capacitors
Capacitor
(3) Dimensions of Tape
2.0±0.1
φ1.5+0.1/-0
4.0±0.1
12.0±0.1
0.4±0.1
A
4.5 max.
A
B
C
6.6 (typ.)
8.4 (typ.)
4.9 (typ.)
(Unit : mm)
(4) Dimensions of Reel
29.4±1.0
2.0±0.5
φ21±0.8
330±2.0
φ13±0.2
(Unit : mm)
25.4±1.0
EKTK8601
22 / 23
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(5) Part of the leader and part of the empty tape should be attached to the end of the tape as follows.
210 min.
Vacant section : 160 min.
Capacitors mounting unit
Vacant section : 190 min.
Direction of feed
(Unit : mm)
(6) The top tape or cover tape and base tape are not attached at the end of the tape for a minimum of
5 pitches.
(7) Missing capacitors number within 0.1 % of the number per reel or 1 pc, whichever is greater, and not
continuous.
(8) The top tape or cover tape and bottom tape should not protrude beyond the edges of the tape and
should not cover sprocket holes.
(9) Cumulative tolerance of sprocket holes, 10 pitches : ±0.3 mm.
(10) Peeling off force : 0.1 to 0.6 N in the direction shown on the follows.
165 to 180°
Top Tape or Cover Tape
Base Tape
EKTK8601
23 / 23
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