CSTCC2M00G53Z-R0 [MURATA]
Ceramic Resonator, 2MHz Nom, CERAMIC PACKAGE-3;
| 型号： | CSTCC2M00G53Z-R0 |
| 厂家： | 
muRata |
| 描述： | Ceramic Resonator, 2MHz Nom, CERAMIC PACKAGE-3 晶体 谐振器 |
| 文件： | 总46页 (文件大小：1176K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
!Note
P16E.pdf
Jan.15,2014
Ceramic Resonators
(CERALOCKr)
Cat.No.P16E-23
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
!Note
P16E.pdf
Jan.15,2014
EU RoHS Compliant
s
All the products in this catalog comply with EU RoHS.
s
EU RoHS is "the European Directive 2011/65/EU on the Restriction of the Use
of Certain Hazardous Substances in Electrical and Electronic Equipment."
For more details, please refer to our website 'Murata's Approach for EU RoHS'
s
(http://www.murata.com/info/rohs.html).
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
!Note
P16E.pdf
Jan.15,2014
1
CONTENTS
CERALOCKr, CERALOCK(R) and "CERALOCK" in this catalog are
the trademarks of Murata Manufacturing Co., Ltd.
Selection Guide
Part Numbering
2
3
2
3
4
5
1
MHz Chip Type -Tight Frequency Tolerance for Automotive-
Application Circuits Utilization
4
6
2
MHz Chip Type -Standard Frequency Tolerance for Automotive-
Application Circuits Utilization
7
11
12
17
19
22
23
28
30
32
Notice for Automotive
Packaging for Automotive
3
4
5
MHz Chip Type -Tight Frequency Tolerance for General Usage-
Application Circuits Utilization
MHz Chip Type -Standard Frequency Tolerance for General Usage-
Application Circuits Utilization
MHz Lead Type -Standard Frequency Tolerance for General Usage-
Application Circuits Utilization
Notice for General Usage
MHz Chip Type
33
38
MHz Lead Type
Packaging for General Usage
MHz Chip Type
39
42
MHz Lead Type
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
!Note
P16E.pdf
Jan.15,2014
Selection Guide
Applications
Automotive
Consumer
Tight Tolerance
Standard Tolerance
Tight Tolerance
Standard Tolerance
SMD
SMD
SMD
SMD
CSTCR_G15L
CSTCR_GH5L
4.00–7.99MHz
CSTCR_G15C
CSTCC_G
CSTCC_G_A
4.00–7.99MHz
2.00–3.99MHz
2.00–3.99MHz
CSTCE_G15L
CSTCE_GH5L
8.00–13.99MHz
CSTCR_G_B
CSTCR_G
CSTCE_G15C
4.00–7.99MHz
4.00–7.99MHz
8.00–13.99MHz
CSTCE_V13L
CSTCE_VH3L
14.00–20.00MHz
CSTCE_G_A
CSACN_G
CSTCE_V13C
8.00–13.99MHz
4.00/6.00MHz
14.00–20.00MHz
CSTCE_V_C
CSTCE_G
CSTCW_X11
14.00–20.00MHz
8.00–13.99MHz
20.01–48.00MHz
CSTCV_X_Q
CSACM_G
20.01–70.00MHz
8.00/10.00/12.00MHz
CSACV_X_Q
20.01–70.00MHz
(Two Terminals)
CSTCE_V
14.00–20.00MHz
CSTCW_X
20.01–70.00MHz
CSACW_X
20.01–70.00MHz
(Two Terminals)
CSTCG_V
20.00–33.86MHz
Super Small!
Leaded
CSTLS_G
3.40–10.00MHz
CSTLS_X
16.00–70.00MHz
Notice: "CERALOCKr for consumer" and "CERALOCKr for automotive" is different in the specification of Operating Temperature Range, Environmental Characteristics,
Physical Characteristics and so on. Please choose either "for consumer" or "for automotive" according to the required specification.
2
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
!Note
P16E.pdf
Jan.15,2014
o Part Numbering
CERALOCKr (MHz)
(Part Number)
CS
T
CE 16M0
V
5
3
***
-R0
q
w
e
r
t
y
u
i
o
qProduct ID
yInitial Frequency Tolerance
Product ID
Initial Frequency Tolerance
Code
CS
Ceramic Resonators
0.ꢀ5
0.35
0.ꢁ5
0.15
0.0ꢂ5
5
3
2
1
H
wFrequency/Capacitance
Code
Frequency/Capacitance
A
T
MHz with No Capacitance Built-in
MHz with Built-in Capacitance
uLoad Capacity
eStructure/Size
Load Capacity
ꢀ/6pF
Code
Code
Structure/Size
Round Lead Type
1
2
3
4
5
6
LS
10pF
CC
Cap Chip Type
1ꢀpF
CR/CE/CG/CN/CM
Small-cap Chip Type
Monolithic Chip Type
Small Monolithic Chip Type
ꢁꢁpF
CV
30/33/39pF
4ꢂpF
CW
rNominal Center Frequency
iIndividual Specification
Expressed by four-digit alphanumerics. The unit is in hertz (Hz).
Decimal point is expressed by capital letter "M."
Individual Specification
Code
Three-digit alphanumerics express
"Individual Specification."
***
tDesign
With standard products, "iIndividual Specification" and "oPackaging"
is omitted.
Code
Gpp
T/Vpp
Xpp
Design
Thickness Shear mode
oPackaging
Thickness Expander mode
Thickness Expander mode (3rd overtone)
Packaging
Bulk
Code
-B0
pp indicates initial frequency tolerance and load capacity.
Radial Taping H0=18mm
Plastic Taping ø=180mm
Plastic Taping ø=330mm
-A0
-R0/*R0
-R1
s 2ADIAL TAPING IS APPLIED TO LEAD TYPE AND PLASTIC TAPING TO CHIP TYPEꢀ
s )N CASE OF #3!#. AND #3!#- SERIESꢁ THE HYPHEN h-” is replaced to
A FIGURE WHICH MEANS FREQUENCY RANKꢀ 4HIS FIGURE ZERO h0” signifies
standard part number.
3
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
!Note
P16E.pdf
Jan.15,2ꢀ14
1
Ceramic Resonators (CERALOCKr)
MHz Chip Type -Tight Frequency Tolerance for Automotive-
4.5±±.ꢀ
Chip type CERALOCK(R) with built-in load capacitors
∗
provides high accuracy in an extremely small package.
MURATA's frequency adjustment and package technology
expertise has enabled the development of the chip
CERALOCK(R) with built-in load capacitors.
This diverse series owes its development to MURATA's
original mass production techniques and high reliability,
and has achieved importance in the worldwide automotive
market.
±.2±±.2
±.6±±.±5
4.ꢀ max.
±.4 (ref.)
±.4±±.ꢀ
±.4 (ref.)
±.4±±.ꢀ
±.4 (ref.)
(ꢀ)
±.4±±.ꢀ
(3)
(2)
: EIAJ Monthly
Code
∗
CSTCR_G15C
4.00-7.99MHz
±.75±±.ꢀ
ꢀ.5±±.ꢀ ꢀ.5±±.ꢀ
(in mm)
Features
c
1. The series are high accuracy resonators whose total
tolerance is available for less than ±±,ꢀꢀꢀppm.
2. The series has high reliability and is available
for a wide temperature range.
3.2±±.ꢀ5
∗
±.4±±.ꢀ
±.ꢀ±±.ꢀ
3.± max.
±. Oscillation circuits do not require external load
capacitors.
4. The series is available for a wide frequency range.
5. The resonators are extremely small and have a low
profile.
±.5± (ref.)
±.5± (ref.)
±.5± (ref.)
(ꢀ)
±.4±±.ꢀ ±.4±±.ꢀ ±.4±±.ꢀ
(3)
(2)
6. No adjustment is necessary for oscillation circuits.
: EIAJ Monthly
Code
∗
CSTCE_G15C
8.00-13.99MHz
Applications
c
(in mm)
±.4±±.ꢀ
ꢀ.2±±.ꢀ ꢀ.2±±.ꢀ
1. Cluster panel and Control panel
2. Safety control
3.2±±.ꢀ5
(Anti-lock Brake System, Electronic Stability
Control, Airbag, etc.)
∗
±. Engine ECU, Electronic Power Steering, Immobilizer,
etc.
±.4±±.ꢀ
±.ꢀ±±.ꢀ
3.± max.
4. Car Air conditioner, Power Window, Remote Keyless
Entry system, etc.
±.5 (ref.)
(2)
±.5 (ref.)
±.5 (ref.)
5. Intelligent Transportation System
(Lane Keeping System, Millimeter wave radar, etc.)
6. Battery control for hybrid cars
(3)
(ꢀ)
±.4±±.ꢀ ±.4±±.ꢀ ±.4±±.ꢀ
: EIAJ Monthly
Code
∗
CSTCE_V13C
14.00-20.00MHz
±.4±±.ꢀ
ꢀ.2±±.ꢀ ꢀ.2±±.ꢀ
(in mm)
Oscillating
Temperature
Range
Initial
Tolerance
Temperature Stability
(%)
Part Number
CSTCR_G15C
Frequency
(MHz)
(°C)
4.ꢀꢀ to 7.99
8.ꢀꢀ to 1±.99
14.ꢀꢀ to 2ꢀ.ꢀꢀ
±ꢀ.1ꢁ
±ꢀ.1ꢁ
±ꢀ.1ꢁ
±ꢀ.1±
±ꢀ.1±
±ꢀ.1±
-4ꢀ to 125
-4ꢀ to 125
-4ꢀ to 125
CSTCE_G15C
CSTCE_V13C
Irregular or stopped oscillation may occur under unmatched circuit conditions. Please check the actual conditions prior to use.
4
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
!Note
P16E.pdf
Jan.15,2014
Oscillation Frequency Measuring Circuit
c
1
VDD
5pF
To Frequency Counter
Rf
ꢀMΩ
Rd
(ꢀ)
(3)
Cꢀ
C2
(2)
Standard Land Pattern Dimensions
c
CSTCR_G15C
CSTCE_G15C
(* This Land Pattern is not common to CSTCR_G.)
±.4
±.4
ꢀ.ꢀ
ꢀ.ꢀ
±.4
±.4
±.8
±.4
±.8
±.4
ꢀ.2
ꢀ.2
Land Pattern
ꢀ.5
ꢀ.5
Land Pattern
(in mm)
(in mm)
Oscillation Frequency Temperature Stability
c
CSTCE_V13C
(* This Land Pattern is not common to CSTCE_V.)
CSTCR_G15C
+±.2
+±.ꢀ
±
±.4
±.8
±.4
±.8
±.4
-±.ꢀ
ꢀ.2
ꢀ.2
Land Pattern
-±.2
-6±
-4±
-2±
±
+2±
+4±
+6±
+8±
+ꢀ±±
+ꢀ2±
+ꢀ4±
Temperature (°C)
(in mm)
CSTCE_G15C
CSTCE_V13C
+±.2
+±.ꢀ
±
+±.2
+±.ꢀ
±
-±.ꢀ
-±.ꢀ
-±.2
-6±
-±.2
-6±
-4±
-2±
±
+2±
+4±
+6±
+8±
+ꢀ±±
+ꢀ2±
+ꢀ4±
-4±
-2±
±
+2±
+4±
+6±
+8±
+ꢀ±±
+ꢀ2±
+ꢀ4±
Temperature (°C)
Temperature (°C)
5
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
!Note
P16E.pdf
Jan.15,2014
Application Circuits Utilization
1
TMP92CD54IF (Toshiba)
MB90F387 (Fujitsu)
c
c
c
c
c
c
16-bit Microcomputer
16-bit Microcomputer
Vcc3=3.3V
Vcc5=5.0V
Vcc=5.0V
0.1μF
H1
H2
H
IC : TMP92CD54IF
IC : MB90F387
28
74
72
L
27
26
L
H1: 36, 68, 86
H2: 2, 4, 15, 40, 50, 61, 75
L: 1, 3, 13, 38, 51, 63, 73, 88
CERALOCKr
CERALOCKr
H: 1, 2, 21, 22, 24
L: 20, 23, 25, 48
0.1μF
V1
V2
V1
V2
C1
C1
C2
C2
CERALOCKr: CSTCE10M0G15Cpp-R0
C1=33pF (Typ.)
CERALOCKr: CSTCE8M00G15Cpp-R0
C1=33pF (Typ.)
C2=33pF (Typ.)
C2=33pF (Typ.)
MC68HC908AZ60AVFU (Freescale)
ST72F561 (HS) (ST Microelectronics)
8-bit Microcomputer
8-bit Microcomputer
Vdd=5.0V
Vdd=5.0V
H
60
EVALUATION BOARD
IC : MC68HC908AZ60AVFU
IC : ST72F561 (HS)
2
59
58
GND
1
L
1MΩ
CERALOCKr
CERALOCKr
H: 9, 25, 41, 57, 58
L: 8, 24, 40, 55, 56
V1
V2
V1
V2
C1
C2
CERALOCKr: CSTCE16M0V13Cpp-R0
C1=15pF (Typ.)
CERALOCKr: CSTCE8M00G15App-R0
C1=33pF (Typ.)
C1
C2
C2=15pF (Typ.)
C2=33pF (Typ.)
µPD70F3283YGC (Renesas)
M30842MCT-XXXGP (Renesas)
16-bit Microcomputer
Vcc=5.0V
32-bit Microcomputer
Vdd=3.3V
10kΩ
H
14
H
19
IC : μPD70F3283YGC
IC : M30842MCT-XXXGP (High*)
H: 23, 24, 37, 39, 59, 74, 91, 118, 122,
132, 142, 143
L: 15, 16, 21, 36, 41, 57, 76, 93,
110~113, 120, 121, 130, 140
12
13
10
4.7μF
L
22
20
L
CERALOCKr
CERALOCKr
H: 1, 5, 9, 34, 70
L: 2, 8, 11, 15, 33, 69
*High: XIN-XOUT Drive Capacity Select Bit
V1
V2
V1
V2
C1
C1
C2
C2
CERALOCKr: CSTCE10M0G15Cpp-R0
C1=33pF (Typ.)
CERALOCKr: CSTCE8M00G15Cpp-R0
C1=33pF (Typ.)
C2=33pF (Typ.)
C2=33pF (Typ.)
6
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
!Note
P16E.pdf
Jan.15,2014
Ceramic Resonators (CERALOCKr)
MHz Chip Type -Standard Frequency Tolerance for Automotive-
7.2 0.2
Chip type CERALOCK(R) with built-in load capacitors
2
∗
provides high accuracy in an extremely small package.
0.5 0.05
0.3 0.3
MURATA's frequency adjustment and package technology
6.6 max.
expertise has enabled the development of the chip
CERALOCK(R) with built-in load capacitors.
0.45
(Ref.)
0.45
(Ref.)
0.45
(Ref.)
This diverse series owes its development to MURATA's
original mass production techniques and high reliability,
and has achieved importance in the worldwide automotive
market.
(3)
(2)
(1)
t : 1.75 0.05
(2.00—2.99MHz)
t : 1.55 0.05
(3.00MHz—)
1.2 0.2 1.4 0.2 1.2 0.2
CSTCC_G_A
2.00-3.99MHz
∗: EIAJ code
(in mm)
2.5 0.1 2.5 0.1
1.1 0.1
Features
c
1. The series has high reliability and is available
4.5 0.1
for a wide temperature range.
2. Oscillation circuits do not require external load
capacitors.
∗
0.4 0.05
(3)
0.2 0.2
(2)
(1)
3. The series is available in a wide frequency range.
4. The resonators are extremely small and have a low
profile.
4.1 max.
∗ : EIAJ Monthly
Code
0.4 (ref.) 0.4 (ref.) 0.4 (ref.)
0.8 0.1 0.8 0.1 0.8 0.1
5. No adjustment is necessary for oscillation circuits.
Applications
1. Cluster panel and Control panel
2. Safety control
c
CSTCR_G_B
4.00-7.99MHz
0.4 0.1
0.75 0.1 1.5 0.1
0.4 0.1
1.5 0.1
0.4 0.1
(in mm)
(Anti-lock Brake System, Electronic Stability
Control, Airbag, etc.)
3.2 0.15
3. Engine ECU, Electronic Power Steering, Immobilizer,
etc.
∗
4. Car Air conditioner, Power Window, Remote Keyless
Entry system, etc.
0.4 0.1
0.1 0.1
3.0 max.
5. Electronic Toll Collection system, Car Navigation,
etc.
0.50 (ref.)
0.50 (ref.)
0.50 (ref.)
(3)
(2) (1)
0.4 0.1 0.4 0.1 0.4 0.1
CSTCE_G_A
8.00-13.99MHz
(in mm)
0.4 0.1
1.2 0.1 1.2 0.1
3.2 0.15
∗
0.4 0.1
0.1 0.1
3.0 max.
0.5 (ref.)
(2)
0.5 (ref.)
0.5 (ref.)
(3)
(1)
0.4 0.1 0.4 0.1 0.4 0.1
: EIAJ Monthly
Code
∗
CSTCE_V_C
14.00-20.00MHz
0.4 0.1
1.2 0.1 1.2 0.1
(in mm)
Continued on the following page.
7
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!Notc
P1ꢃE.adf
JCꢅ.1ꢀ,201ꢁ
Continued from the preceding page.
3.7 0.2
1.3 0.1
3.7 0.2
1.3 0.1
M
M
∗
∗
(0.5) (0.5) (0.5)
(3) (2) (1)
(0.7) (0.9) (0.7)
(3) (2) (1)
Terminals (1) and (3) are
interchangeable.
Terminal (2) should be soldered
only to fix the resonator onto PCB
Terminal (2) should be electrically
floating so it cannot be connected
anywhere.
0.4 0.2 0.5 0.2 0.4 0.2
0.5 0.3 0.5 0.3 0.5 0.3
0.4 0.2 0.5 0.2 0.4 0.2
0.5 0.3 0.5 0.3 0.5 0.3
2
Thickness varies
with frequency and
built-in capacitance.
∗: EIAJ code
Thickness varies
with frequency.
∗: EIAJ Monthly Code
CSACV_X_Q
CSTCV_X_Q
20.01-70.00MHz
20.01-70.00MHz
1.6 0.2 1.6 0.2
1.85 0.3
1.6 0.2 1.6 0.2
1.85 0.3
(in mm)
(in mm)
Oscillating
Frequency
(MHz)
Temperature
Range
Initial
Tolerance
Temperature Stability
(%)
Part Number
(°C)
CSTCC_G_A
CSTCR_G_B
CSTCE_G_A
CSTCE_V_C
CSACV_X_Q
CSTCV_X_Q
2.00 to 3.99
ꢁ.00 to 4.99
0.ꢀ5
0.ꢀ5
0.ꢀ5
0.ꢀ5
0.ꢀ5
0.ꢀ5
0.ꢁ ꢂ[0.ꢃ5 to ꢄ0.35%:Buit[uꢅ ꢆCaCꢇutCꢅꢇc ꢁ4ap tꢈac ꢉutꢊuꢅ pFce.2.00 to 3.ꢁ9ꢋMHz
[ꢁ0 to 12ꢀ
[ꢁ0 to 12ꢀ
[ꢁ0 to 12ꢀ
[ꢁ0 to 12ꢀ
[ꢁ0 to 12ꢀ
[ꢁ0 to 12ꢀ
0.1ꢀ
0.2
8.00 to 13.99
1ꢁ.00 to 20.00
20.01 to 40.00
20.01 to 40.00
0.1ꢀ
0.3
0.3
IFFcgBiCF oF stoaacd osꢇuiiCtuoꢅ mCꢈ oꢇꢇBF BꢅdcF BꢅmCtꢇꢊcd ꢇuFꢇBut ꢇoꢅdutuoꢅs. PicCsc ꢇꢊcꢇk tꢊc CꢇtBCi ꢇoꢅdutuoꢅs aFuoF to Bsc.
Oscillation Frequency Measuring Circuit
c
CSTCC_G_A
CSTCE_G_A/CSTCE_V_C/CSTCR_G_B/CSTCV_X_Q
VDD
VDD
5pF
To Frequency Counter
To Frequency Counter
Rf
Rf
1MΩ
Rd
(3)
Rd
(1)
(3)
(1)
C1
C2
(2)
C1
C2
(2)
CSACV_X_Q
22μF
VDD
+
0.01μF
To Frequency Counter
Rf
CL1
CL2
8
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
!Note
P16E.pdf
Jan.15,2014
Standard Land Pattern Dimensions
c
CSTCC_G_A
CSTCR_G_B
0.8
0.7 0.8 0.7
0.8
1.2 1.2
1.4
1.2 1.2
2
0.4
1.5
0.4
1.5
0.4
2.5
2.5
Land Pattern
(in mm)
Land Pattern
(in mm)
CSTCE_G_A
CSTCE_V_C
(* This Land Pattern is not common to CSTCE_V.)
0.4
0.8
0.4
0.8
0.4
0.4
0.8
0.4
0.8
0.4
1.2
1.2
1.2
1.2
Land Pattern
Land Pattern
(in mm)
(in mm)
CSTCV_X_Q
CSACV_X_Q
0.5 1.1 0.5 1.1 0.5
0.5 1.1 0.5 1.1 0.5
1.6
1.6
1.6
1.6
Land Pattern
(in mm)
Land Pattern
(in mm)
9
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
!Note
P16E.pdf
Jan.15,2014
Oscillation Frequency Temperature Stability
c
CSTCC_G_A
CSTCR_G_B
+0.2
+0.1
0
+0.2
+0.1
0
2
-0.1
-0.1
-0.2
-0.2
-60
-40
-40
-40
-20
-20
-20
0
0
0
+20
+40
+60
+80
+80
+80
+100
+100
+100
+120
+120
+120
+140
+140
+140
-60
-40
-40
-40
-20
-20
-20
0
0
0
+20
+40
+60
+80
+80
+80
+100
+100
+100
+120
+120
+120
+140
Temperature (°C)
Temperature (°C)
CSTCE_G_A
CSTCE_V_C
+0.2
+0.2
+0.1
0
+0.1
0
-0.1
-0.1
-0.2
-60
-0.2
-60
+20
+40
+60
+20
+40
+60
+140
Temperature (°C)
Temperature (°C)
CSTCV_X_Q
CSACV_X_Q
+0.2
+0.1
0
+0.2
+0.1
0
-0.1
-0.1
-0.2
-60
-0.2
-60
+20
+40
+60
+20
+40
+60
+140
Temperature (°C)
Temperature (°C)
10
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
!Note
P16E.pdf
Jan.15,2014
Application Circuits Utilization
µPD78F9222MC-5A4 (Renesas)
M30260F8AGP (Renesas)
c
c
c
c
c
c
8-bit Microcomputer
16-bit Microcomputer
Vdd=5.0V
V'dd=7.0V
Vcc=5.0V
10kΩ
2
H
6
H
7
IC : μPD78F9222MC-5A4
IC : M30260F8AGP (High*)
2
3
8
L
23
24
L
H: 11, 46, 47, 48
L: 4, 9, 44
CERALOCKr
CERALOCKr
H: 5, 20
L: 1
*High: XIN-XOUT Drive Capacity Select Bit
V1
V2
V1
V2
C1
C1
C2
C2
CERALOCKr: CSTCR6M00G55B-R0
C1=39pF (Typ.)
CERALOCKr: CSTCE10M0G55A-R0
C1=33pF (Typ.)
C2=39pF (Typ.)
C2=33pF (Typ.)
MB90F347D (Fujitsu)
MC68HC908AZ60AVFU (Freescale)
16-bit Microcomputer
8-bit Microcomputer
Vcc=5.0V
Vdd=5.0V
H
EVALUATION BOARD
IC : MC68HC908AZ60AVFU
IC : MB90F347D
93
92
L
59
58
GND
1MΩ
CERALOCKr
CERALOCKr
H: 15, 32, 65, 90
L: 16, 35, 44, 66, 91
V1
V2
V1
V2
C1
C2
CERALOCKr: CSTCE8M00G55A-R0
C1=33pF (Typ.)
CERALOCKr: CSTCE16M0V53C-R0
C1=15pF (Typ.)
C1
C2
C2=33pF (Typ.)
C2=15pF (Typ.)
ST72F324J6T3 (MS) (ST Microelectronics)
PIC12F675-I/P (HS) (Microchip)
8-bit Microcomputer
8-bit Microcomputer
Vdd=5.0V
Vdd=5.0V
H
H
IC : PIC12F675-I/P(HS)
IC : ST72F324J6T3 (MS)
42
41
L
2
3
L
1MΩ
CERALOCKr
CERALOCKr
H: 13, 21, 32, 43
L: 14, 22, 33, 39, 40
H: 1
L: 4, 8
V1
V2
V1
V2
C1
C2
CERALOCKr: CSTCR4M00G55B-R0
C1=39pF (Typ.)
CERALOCKr: CSTCE8M00G52A-R0
C1=10pF (Typ.)
C1
C2
C2=39pF (Typ.)
C2=10pF (Typ.)
11
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
!Note
P16E.pdf
Jan.15,2014
Notice for Automotive
Soldering and Mounting (CSTCC/CSTCR/CSTCE_V/CSTCE_G Series)
c
1. Soldering
(1) Reflow soldering
Please mount component on a circuit board by reflow
soldering. Flow soldering is not acceptable.
Recommendable Flux and Solder
Please use rosin based flux,
not water soluble flux.
Flux
Please use solder (Sn-3.0Ag-0.5Cu) under
the following conditions: Standard thickness
of soldering paste: 0.10 to 0.15mm.
Peak
260
245
220
Solder
Heating
(220°C min.)
180
150
Pre-heating
(150 to 180°C)
Recommendable Soldering Profile
Gradual
Cooling
150 to 180°C
60 to 120s
30 to 60s
1s max.
Pre-heating
220°C min.
Heating
upper limit: 260°C
lower limit: 245°C
Peak Temperature
5s max.
60 to 120s
30 to 60s
Temperature shall be measured on the surface of component.
(2) Soldering with Iron
If compelled to mount the component by using soldering
iron, please do not directly touch the component with the
soldering iron. The component terminals or electrical
characteristics may be damaged if excessive thermal
stress is applied.
Recommendable Soldering with Iron
Heating of the soldering iron
350°C max.
30W max.
Watt
Shape of the soldering iron
Soldering Time
Solder
ø3mm max.
5s max. at one terminal
Sn-3.0Ag-0.5Cu
(3) Solder Volume
Please make the solder volume less than the height of
the substrate to avoid damage to the seal between the
metal cap and the substrate.
(4) Other
Do not reuse components removed from a circuit board
after soldering.
(5) Conditions for Placement Machines
The component is recommended with placement
machines that employ optical placement capabilities. The
component may be damaged by excessive mechanical
force. Please make sure that you have evaluated by
using placement machines before going into mass
production. Do not use placement machines that utilize
mechanical positioning. Please contact Murata for details
beforehand.
Continued on the following page.
12
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
!Note
P16E.pdf
Jan.15,2014
Notice for Automotive
Continued from the preceding page.
2. Wash
(1) Cleaning Solvents
HCFC, Isopropanol, Tap water, Demineralized water,
Cleanthrough750H, Pine alpha 100S, Techno care FRW
(2) Temperature Difference : dT *1
dTV60°C (dT=Component-solvent)
*1 ex. If the component is immersed at +90°C into
cleaning solvent at +60°C, then dT=30°C.
(3) Conditions
(a) Ultrasonic Wash
(b) Immersion Wash
1 minute max. in above solvent at +60°C max.
(Frequency: 28kHz, Output: 20W/l)
5 minutes max. in above solvent at +60°C max.
(c) Shower or Rinse Wash
5 minutes max. in above solvent at +60°C max.
(4) Drying
5 minutes max. by air blow at +80°C max.
(5) Other
(a) Total washing time should be within 10 minutes.
(b) The component may be damaged if it is washed with
chlorine, petroleum, or alkali cleaning solvent.
3. Coating
Conformal coating of the component is acceptable.
However, the resin material, curing temperature, and
other process conditions should be evaluated to confirm
stable electrical characteristics are maintained.
13
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
!Note
P16E.pdf
Jan.15,2014
Notice for Automotive
Soldering and Mounting (CSTCV/CSACV Series)
c
1. Soldering
(1) Reflow soldering
Please mount component on a circuit board by reflow
soldering. Flow soldering is not acceptable.
Recommendable Flux and Solder
Please use rosin based flux,
not water soluble flux.
Flux
Please use solder (Sn-3.0Ag-0.5Cu) under
the following conditions: Standard thickness
of soldering paste: 0.10 to 0.15mm.
Peak
260
245
220
Solder
Heating
(220°C min.)
180
150
Pre-heating
(150 to 180°C)
Recommendable Soldering Profile
Gradual
Cooling
150 to 180°C
60 to 120s
30 to 60s
1s max.
Pre-heating
220°C min.
Heating
upper limit: 260°C
lower limit: 245°C
Peak Temperature
5s max.
60 to 120s
30 to 60s
Temperature shall be measured on the surface of component.
(2) Soldering with Iron
If compelled to mount the component by using soldering
iron, please do not directly touch the component with the
soldering iron. The component terminals or electrical
characteristics may be damaged if excessive thermal
stress is applied.
Recommendable Soldering with Iron
Heating of the soldering iron
350°C max.
30W max.
Watt
Shape of the soldering iron
Soldering Time
Solder
ø3mm max.
5s max. at one terminal
Sn-3.0Ag-0.5Cu
(3) Other
Do not reuse components removed from a circuit board
after soldering.
(4) Conditions for Placement Machines
The component is recommended with placement
machines that employ optical placement capabilities. The
component may be damaged by excessive mechanical
force. Please make sure that you have evaluated by
using placement machines before going into mass
production. Do not use placement machines that utilize
mechanical positioning. Please contact Murata for details
beforehand.
2. Wash
(1) Cleaning Solvents
HCFC, Isopropanol, Tap water, Demineralized water,
Cleanthrough750H, Pine alpha 100S, Techno care FRW
(2) Temperature Difference : dT *1
dTV60°C (dT=Component-solvent)
*1 ex. If the component is immersed at +90°C into
cleaning solvent at +60°C, then dT=30°C.
Continued on the following page.
14
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
!Note
P16E.pdf
Jan.15,2014
Notice for Automotive
Continued from the preceding page.
(3) Conditions
(a) Ultrasonic Wash
(b) Immersion Wash
1 minute max. in above solvent at +60°C max.
(Frequency: 28kHz, Output: 20W/l)
5 minutes max. in above solvent at +60°C max.
(c) Shower or Rinse Wash
5 minutes max. in above solvent at +60°C max.
(4) Drying
5 minutes max. by air blow at +80°C max.
(5) Other
(a) Total washing time should be within 10 minutes.
(b) The component may be damaged if it is washed with
chlorine, petroleum, or alkali cleaning solvent.
3. Coating
Conformal coating of the component is acceptable.
However, the resin material, curing temperature, and
other process conditions should be evaluated to confirm
stable electrical characteristics are maintained.
15
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
!Note
P16E.pdf
Jan.15,2014
Notice for Automotive
c Storage and Operating Conditions
1. Product Storage Conditions
(2) Please do not put the products directly on the
floor without anything under them to avoid damp
and/or dusty places.
Please store the products in a room where the
temperature/humidity is stable, and avoid such
places where there are large temperature changes.
Please store the products under the following
conditions:
(3) Please do not store the products in places
such as: in a damp heated place, in a place where
direct sunlight comes in, in a place applying
vibrations.
Temperature: -10 to +40°C
Humidity: 15 to 85% R.H.
(4) Please use the products immediately after the
package is opened, because the characteristics
may be reduced in quality, and/or be degraded in
the solderability due to storage under the poor
conditions.
2. Expiration Date on Storage
Expiration date (Shelf life) of the products is six
months after delivery under the conditions of a
sealed and unopened package. Please use the products
within six months after delivery. If you store the
products for a long time (more than six months),
use carefully because the products may be degraded
in solderability and/or rusty.
(5) Please do not drop the products to avoid cracking
of ceramic elements.
4. Other
Conformal coating of the component is acceptable.
However, the resin material, curing temperature, and
other process conditions should be evaluated to
confirm that stable electrical characteristics are
maintained.
Please confirm solderability and characteristics
for the products regularly.
3. Notice on Product Storage
(1) Please do not store the products in a chemical
atmosphere (Acids, Alkali, Bases, Organic gas,
Sulfides and so on), because the characteristics
may be reduced in quality, and/or be degraded in
the solderability due to the storage in a
chemical atmosphere.
Please be sure to consult with our sales representatives
or engineers whenever and prior to using the products.
c Rating
The component may be damaged if excessive mechanical
stress is applied.
c Handling
"CERALOCK" may stop oscillating or oscillate
irregularly under improper circuit conditions.
16
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
!Note
P16E.pdf
Jan.15,2014
Packaging for Automotive
Minimum Quantity
Part Number
c
Plastic Tape ø180mm
2,000
Plastic Tape ø330mm
6,000
Bulk
500
500
500
500
500
500
500
500
500
Dimensions
CSTCC_G_A
CSTCR_G_B
CSTCR_G15C
CSTCE_G_A
CSTCE_G15C
CSTCE_V_C
a
a
a
b
b
b
b
a
a
3,000
9,000
3,000
9,000
3,000
9,000
3,000
9,000
3,000
9,000
CSTCE_V13C
CSTCV_X_Q
3,000
9,000
2,000
6,000
CSACV_X_Q
2,000
6,000
(pcs.)
The order quantity should be an integral multiple of the "Minimum Quantity" shown above.
c Dimensions of Reel
a
b
Trailer
160-190
Leader
Cover Film
Leader
Cover Film
Trailer
160-190
Empty Components
Empty
160 min.
Empty Components
Empty
160 min.
400-560
400-560
ø13.0 0.2
ø13.0 0.2
2.0 0.5
2.0 0.5
+1.0
0
+1.0
0
13.0
9.0
17.0 1.0
13.0 1.0
(in mm)
Dimensions of Taping
c
CSTCR_G15C
CSTCE_G15C
4.0 0.1
+0.1
-0
+0.1
ø1.5
4.0 0.1
ø1.5
-0.0
2.0 0.05
2.0 0.05
+0.1
-0
4.0 0.1
+0.2
-0.0
ø1.0
ø1.5
4.0 0.1
+0.10
1.50
2.2 0.1
The cover film peel strength force 0.1 to 0.7N
The cover film peel speed 300mm/min.
-0.05
The cover film peel strength force 0.1 to 0.7N
The cover film peel speed 300mm/min.
(3˚)
(3°)
Cover Film
Cover Film
10°
10°
Direction of Feed
(in mm)
(in mm)
Direction of Feed
Continued on the following page.
17
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
!Note
P16E.pdf
Jan.15,2014
Packaging for Automotive
Continued from the preceding page.
Dimensions of Taping
c
CSTCE_V13C
CSTCC_G_A
4.0 0.ꢀ
Dimensions of Carrier Tape
2.0 0.0ꢁ
4.0 0.ꢀ
øꢀ.ꢁꢁ 0.0ꢁ
+0.ꢀ
øꢀ.ꢁ -0.0
2.0 0.0ꢁ
+0.3
-0.0
4.0 0.ꢀ
øꢀ.ꢁ
The cover film peel strength force 0.ꢀ to 0.7N
The cover film peel speed 300mm/min.
ꢀ0°
3.3 0.ꢀ
+0.ꢀ
øꢀ.0 -0.0
4.0 0.ꢀ
(3°)
Cover Film
+0.ꢀ0
ꢀ.ꢁ0 -0.0ꢁ
The cover film peel strength force 0.ꢀ to 0.7N
The cover film peel speed 300mm/min.
(3°)
Cover Film
ꢀ0°
Direction of Feed
∗ꢀ, ∗2: Dimensions vary with frequency range of CERALOCKr.
Frequency Range
2.00–2.99MHz
ꢀ.8ꢁ 0.0ꢁ
2.4ꢁ max.
3.00–3.99MHz
ꢀ.6ꢁ 0.0ꢁ
2.2ꢁ max.
tꢀ
t2
∗ꢀ
∗2
Direction of Feed
(in mm)
(in mm)
CSTCR_G_B
CSTCE_G_A
4.0 0.ꢀ
+0.ꢀ
-0
+0.ꢀ
øꢀ.ꢁ
4.0 0.ꢀ
øꢀ.ꢁ
-0.0
2.0 0.0ꢁ
2.0 0.0ꢁ
+0.ꢀ
-0
4.0 0.ꢀ
+0.2
-0.0
øꢀ.0
øꢀ.ꢁ
4.0 0.ꢀ
+0.ꢀ0
ꢀ.ꢁ0
2.2 0.ꢀ
The cover film peel strength force 0.ꢀ to 0.7N
The cover film peel speed 300mm/min.
-0.0ꢁ
The cover film peel strength force 0.ꢀ to 0.7N
The cover film peel speed 300mm/min.
(3˚)
(3°)
Cover Film
Cover Film
ꢀ0°
ꢀ0°
Direction of Feed
(in mm)
(in mm)
Direction of Feed
CSTCE_V_C
CSTCV_X_Q
Dimensions of Carrier Tape
4.0 0.ꢀ
4.0 0.ꢀ
+0.ꢀ
+0.ꢀ
øꢀ.ꢁ -0.0
øꢀ.ꢁ
2.0 0.ꢀ
–0.0
2.0 0.0ꢁ
4.0 0.ꢀ
+0.2
–0.0
The cover film peel strength force 0.ꢀ to 0.7N
The cover film peel speed 300mm/min.
øꢀ.ꢁ
+0.ꢀ
+0.ꢀ
øꢀ.0 -0.0
3.3ꢁ
–0.0ꢁ
4.0 0.ꢀ
+0.ꢀ0
ꢀ.ꢁ0 -0.0ꢁ
Cover Film
ꢀ0°
(3°)
The cover film peel strength force 0.ꢀ to 0.7N
The cover film peel speed 300mm/min.
(3°)
Cover Film
ꢀ0°
Direction of Feed
∗ꢀ, ∗2: Dimensions vary with product thickness of CERALOCKr.
Thickness of CERALOCKr
ꢀ.ꢁ0–ꢀ.40
ꢀ.6ꢁ 0.ꢀ
2.0 max.
ꢀ.30–ꢀ.20
ꢀ.4ꢁ 0.ꢀ
ꢀ.8 max.
ꢀ.ꢀ0–ꢀ.00
ꢀ.2 0.ꢀ
ꢀ.ꢁ max.
tꢀ
t2
∗ꢀ
∗2
(in mm)
Direction of Feed
(in mm)
CSACV_X_Q
4.0 0.ꢀ
+0.ꢀ
–0.0
øꢀ.ꢁ
2.0 0.ꢀ
4.0 0.ꢀ
+0.2
–0.0
The cover film peel strength force 0.ꢀ to 0.7N
The cover film peel speed 300mm/min.
øꢀ.ꢁ
+0.ꢀ
3.3ꢁ
–0.0ꢁ
Cover Film
ꢀ0°
(3°)
Direction of Feed
∗ꢀ, ∗2: Dimensions vary with product thickness of CERALOCKr.
Thickness of CERALOCKr
ꢀ.ꢁ0–ꢀ.40
ꢀ.6ꢁ 0.ꢀ
2.0 max.
ꢀ.30–ꢀ.20
ꢀ.4ꢁ 0.ꢀ
ꢀ.8 max.
ꢀ.ꢀ0–ꢀ.00
ꢀ.2 0.ꢀ
ꢀ.ꢁ max.
tꢀ
t2
∗ꢀ
∗2
(in mm)
18
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
!Note
P16E.pdf
Jan.15,2014
Ceramic Resonators (CERALOCKr)
MHz Chip Type -Tight Frequency Tolerance for General Usage-
4.5±±.ꢀ
Chip type CERALOCK(R) with built-in load capacitors
∗
provides high accuracy in an extremely small package.
±.2±±.2
±.6±±.±5
MURATA's frequency adjustment and packaging technology
4.ꢀ max.
expertise has enabled the development of the chip
CERALOCK(R) with built-in load capacitors.
±.4 (ref.)
±.4±±.ꢀ
±.4 (ref.)
±.4 (ref.)
(ꢀ)
±.4±±.ꢀ
High-density mounting is made possible by the small
package and the elimination of the need for an external
load capacitor.
(3)
(2)
±.4±±.ꢀ
3
: EIAJ Monthly
Code
∗
CSTCR_G15L/CSTCR_GH5L
4.00-7.99MHz
Features
c
±.75±±.ꢀ
ꢀ.5±±.ꢀ ꢀ.5±±.ꢀ
(in mm)
1. Oscillation circuits do not require external load
capacitors.
3.2±±.ꢀ5
2. Available in a wide frequency range.
3. Extremely small and have a low profile.
4. No adjustment is necessary for oscillation circuits.
∗
±.4±±.ꢀ
±.ꢀ±±.ꢀ
3.± max.
Applications
c
1. Clock oscillators for USB (Full-speed)
±.5± (ref.)
±.5± (ref.)
controller ICs
±.5± (ref.)
(ꢀ)
±.4±±.ꢀ ±.4±±.ꢀ ±.4±±.ꢀ
(3)
(2)
2. Audio equipment and musical instruments, etc.
3. Other applications for replacement of Crystal units/
Oscillators
: EIAJ Monthly
Code
∗
CSTCE_G15L/CSTCE_GH5L
8.00-13.99MHz
(in mm)
±.4±±.ꢀ
ꢀ.2±±.ꢀ ꢀ.2±±.ꢀ
3.2±±.ꢀ5
2.5±±.2
ꢀ.4 max.
∗
∗
±.4±±.ꢀ
±.ꢀ±±.ꢀ
3.± max.
(±.5) (±.5) (±.5)
(3)
(2)
(ꢀ)
±.±5+±.ꢀ±
±.±5+±.ꢀ±
-±.±5
-
±.±5
±.5 (ref.)
(2)
±.4 +±.3 ±.4 +±.3 ±.4 +±.3
±.5 (ref.)
±.5 (ref.)
-
±.2
-
±.2
-±.2
±.5±±.2 ±.5±±.2 ±.5±±.2
(3)
(ꢀ)
Thickness varies
with frequency and
±.4±±.ꢀ ±.4±±.ꢀ ±.4±±.ꢀ
built-in capacitance.
∗: EIAJ code
: EIAJ Monthly
Code
∗
CSTCE_V13L/CSTCE_VH3L
14.00-20.00MHz
CSTCW_X11
20.01-48.00MHz
ꢀ.±±±.2 ꢀ.±±±.2
ꢀ.25±±.2
±.4±±.ꢀ
(in mm)
ꢀ.2±±.ꢀ ꢀ.2±±.ꢀ
(in mm)
Oscillating
Frequency
(MHz)
Temperature
Range
Initial
Tolerance
Temperature Stability
(%)
Part Number
(°C)
CSTCR_G15L
CSTCR_GH5L
CSTCE_G15L
CSTCE_GH5L
CSTCE_V13L
CSTCE_VH3L
CSTCW_X11
4.00 to 7.99
4.00 to 7.99
0.1ꢀ
0.07ꢀ
0.1ꢀ
0.08
0.08
0.08
0.08
0.08
0.08
0.1
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
8.00 to 13.99
8.00 to 13.99
14.00 to 20.00
14.00 to 20.00
20.01 to 48.00
0.07ꢀ
0.1ꢀ
0.07ꢀ
0.1ꢀ
Irregular or stopped oscillation may occur under unmatched circuit conditions. Please check the actual conditions prior to use.
19
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
!Note
P16E.pdf
Jan.15,2014
Oscillation Frequency Measuring Circuit
c
CSTCR_G15L/CSTCR_GH5L/CSTCE_G15L/
CSTCW_X11
CSTCE_GH5L/CSTCE_V13L/CSTCE_VH3L
VDD
VDD
5pF
To Frequency Counter
To Frequency Counter
Rf
Rf
ꢀMΩ
Rd
Rd
(3)
(ꢀ)
(ꢀ)
(3)
Cꢀ
C2
(2)
Cꢀ
C2
(2)
3
Standard Land Pattern Dimensions
c
CSTCR_G15L/CSTCR_GH5L
CSTCE_G15L/CSTCE_GH5L
(* This Land Pattern is not common to CSTCR_G.)
±.4
±.4
ꢀ.ꢀ
ꢀ.ꢀ
±.4
±.4
±.8
±.4
±.8
±.4
ꢀ.2
ꢀ.2
Land Pattern
ꢀ.5
ꢀ.5
Land Pattern
(in mm)
(in mm)
CSTCE_V13L/CSTCE_VH3L
(* This Land Pattern is not common to CSTCE_V.)
CSTCW_X11
±.4
±.8
±.4
±.8
±.4
±.5 ±.5 ±.5 ±.5 ±.5
ꢀ.2
ꢀ.2
Land Pattern
ꢀ.±
ꢀ.±
Land Pattern
(in mm)
(in mm)
20
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
!Note
P16E.pdf
Jan.15,2014
Oscillation Frequency Temperature Stability
c
CSTCR_G15L/CSTCR_GH5L
CSTCE_G15L/CSTCE_GH5L
+0.2
+0.1
0
+0.2
+0.1
0
-0.1
-0.1
-0.2
-60
-0.2
-60
-40
-20
0
+20
+40
+60
+80
+100
+120
+140
-40
-20
0
+20
+40
+60
+80
+100
+120
+140
Temperature (°C)
Temperature (°C)
3
CSTCE_V13L/CSTCE_VH3L
CSTCW_X11
+0.2
+0.2
+0.1
0
+0.1
0
-0.1
-0.1
-0.2
-60
-0.2
-40
-40
-20
0
+20
+40
+60
+80
+100
+120
+140
-20
0
+20
+40
+60
+80
+100
Temperature (°C)
Temperature (°C)
21
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
!Note
P16E.pdf
Jan.15,2014
Application Circuits Utilization
M66291GP (Renesas)
MN102HF74GHL (Panasonic)
16-bit Microcontroller
Vdd=3.3V
c
c
c
c
USB Transceiver
Vset=3.3V
Fout
H
82
18
EVALUATION BOARD
IC : M66291GP
IC : MN102HF74GHL
24
14
13
GND
23
L
CERALOCKr
1MΩ
CERALOCKr
220Ω
H: 1~17, 22, 25, 26~42, 54, 58~60, 66~81, 83~91
3
L: 19, 20, 43~53, 55~57, 61~65, 82, 92~100
V1
V2
V1
V2
C1
C2
CERALOCKr: CSTCR6M00G15ppp-R0
C1=39pF (Typ.)
CERALOCKr: CSTCE12M0G15Lpp-R0
C1=33pF (Typ.)
C1
C2
C2=39pF (Typ.)
C2=33pF (Typ.)
LC87F1964A (Sanyo)
TUSB2046B (Texas Instruments)
c
8-bit Microcontroller
USB 4-port HUB
Vdd=5.0V
Vcc=3.3V
10kΩ
H
H
H1
IC : TUSB2046B
IC : LC87F1964A
6
7
L1
L
30
29
GND
H: 8, 19, 39
L: 5, 20, 40
H1: 31, 33
L1: 29, 30, 32, 34~36
10kΩ
470Ω
1MΩ
CERALOCKr
CERALOCKr
H: 3, 25
L: 7, 28
V1
V2
V1
V2
CERALOCKr: CSTCE12M0G15Lpp-R0
C1=33pF (Typ.)
CERALOCKr: CSTCR6M00G15ppp-R0
C1=39pF (Typ.)
C1
C2
C1
C2
C2=33pF (Typ.)
C2=39pF (Typ.)
ISP1181BDGG (Philips)
USB Controller
Vset=3.3V
H
EVALUATION BOARD
IC : ISP1181BDGG
48
47
GND
CERALOCKr
V1
V2
C1
C2
CERALOCKr: CSTCR6M00G15ppp-R0
C1=39pF (Typ.)
C2=39pF (Typ.)
22
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
!Note
P16E.pdf
Jan.15,2014
Ceramic Resonators (CERALOCKr)
MHz Chip Type -Standard Frequency Tolerance for General Usage-
7.2 0.2
Chip type CERALOCK(R) with built-in load capacitors
∗
provides an extremely small package.
0.5 0.05
0.3 0.3
MURATA's package technology expertise has enabled the
6.6 max.
development of the Chip CERALOCK(R) with built-in
load capacitors.
0.45
(Ref.)
0.45
(Ref.)
0.45
(Ref.)
High-density mounting can be realized because of the
small package and the elimination of the need for an
external load capacitor.
(3)
(2)
(1)
t : 1.75 0.05
(2.00—2.99MHz)
t : 1.55 0.05
(3.00MHz—)
1.2 0.2 1.4 0.2 1.2 0.2
CSTCC_G
2.00-3.99MHz
∗: EIAJ code
(in mm)
Features
c
2.5 0.1 2.5 0.1
1.1 0.1
1. Oscillation circuits do not require external load
capacitors.
4.5 0.1
2. Available in a wide frequency range.
3. Extremely small and have a low profile.
4. No adjustment is necessary for oscillation circuits.
4
∗
0.4 0.05
(3)
0.2 0.2
(2)
(1)
4.1 max.
Applications
c
∗ : EIAJ Monthly
Code
1. Clock oscillators for microprocessors
2. Small electronic equipment such as handheld phone,
digital video camcorder (DVC), digital still camera
(DSC), portable audio player, etc.
3. Storage media and memory
0.4 (ref.) 0.4 (ref.) 0.4 (ref.)
0.8 0.1 0.8 0.1 0.8 0.1
CSTCR_G
4.00-7.99MHz
0.4 0.1
0.75 0.1 1.5 0.1
0.4 0.1
1.5 0.1
0.4 0.1
(HDD, Optical storage device, FDD, Flash memory
card, etc.)
(in mm)
4. Office automation equipment
(Mobile PC, Mouse, Keyboard, etc.)
5. Audio-visual applications
3.3 0.1
(TV, DVD-HDD recorder, Audio equipment, Remote
control, etc.)
3.1
0.3
6. Home appliances
(Air conditioner, Microwave oven, Refrigerator,
Washing machine, etc.)
0.1
0.1
1.15 0.10
(1)
(2)
(1): Input/Output
(2): No connect
(3): Input/Output
CSACN_G
4.00/6.00MHz
(3)
0.15
0.30 0.1
1.95 0.10
(in mm)
3.2 0.15
2.0 0.1
∗
0.4 0.1
0.1 0.1
1.8
3.0 max.
0.3
0.1
0.1
0.50 (ref.)
0.50 (ref.)
0.50 (ref.)
(1)
0.4 0.1 0.4 0.1 0.4 0.1
0.5 0.1
(1)
(2)
(3)
(2)
(1): Input/Output
(2): No connect
(3): Input/Output
CSTCE_G/CSTCE_G_Z
8.00-13.99MHz
CSACM_G
8.00/10.00/12.00MHz
(3)
1.3 0.1
0.15
(in mm)
0.25 0.1
(in mm)
0.4 0.1
1.2 0.1 1.2 0.1
Continued on the following page.
23
• Puꢄꢃsꢄ ꢇꢄꢃd ꢇꢃtB-g ꢃ-d !nAUTION (foꢇ stoꢇꢃgꢄ, oCꢄꢇꢃtB-g, ꢇꢃtB-g, soudꢄꢇB-g, mo:-tB-g ꢃ-d iꢃ-duB-g) B- tiBs pꢃtꢃuog to Cꢇꢄvꢄ-t smokB-g ꢃ-d/oꢇ b:ꢇ-B-g, ꢄtp.
• TiBs pꢃtꢃuog iꢃs o-uꢆ tꢆCBpꢃu sCꢄpBfipꢃtBo-s. Tiꢄꢇꢄfoꢇꢄ, Cuꢄꢃsꢄ ꢃCCꢇovꢄ o:ꢇ Cꢇod:pt sCꢄpBfipꢃtBo-s oꢇ tꢇꢃ-sꢃpt tiꢄ ꢃCCꢇovꢃu siꢄꢄt foꢇ Cꢇod:pt sCꢄpBfipꢃtBo-s bꢄfoꢇꢄ oꢇdꢄꢇB-g.
!Notꢄ
P16E.Cdf
Jꢃ-.1ꢀ,201ꢂ
Continued from the preceding page.
3.2 0.15
2.0 0.15
0.4 0.1
0.4 0.1
0.075 0.075
1.85 max.
0.1 0.1
3.0 max.
0.62 (ref.)
0.62 (ref.)
0.45 (ref.)
(2)
0.52 (ref.)
0.5 0.1
0.41 (ref.)
0.52 (ref.)
0.5 0.1
(3)
(1)
(3) (2) (1)
0.6 0.10.4 0.1 0.6 0.1
0.3 0.1
CSTCE_V
14.00-20.00MHz
CSTCG_V
20.00-33.86MHz
(Ultra Small)
0.65 0.1 0.95 0.1 0.95 0.1
(in mm)
(in mm)
0.3 0.1
0.7 0.1
0.7 0.1
1.2 max.
2.5 0.2
1.4 max.
2.5 0.2
∗
∗
(0.5) (0.5) (0.5)
(3) (2) (1)
(0.5)
(0.5)
0.05+0.10
0.05+0.10
-0.05
0.05+0.10
0.05+0.10
-0.05
-
0.05
-
0.05
+0.3
+0.3
0.4
0.4
-0.2
-
0.2
0.4 +0.3 0.4 +0.3 0.4 +0.3
-
0.2
-
0.2
-0.2
0.5 0.2
0.5 0.2
0.5 0.2 0.5 0.2 0.5 0.2
ꢂ
Thickness varies
with frequency and
built-in capacitance.
∗: EIAJ code
Thickness varies
with frequency.
∗: EIAJ code
CSACW_X
20.01-70.00MHz
CSTCW_X
20.01-70.00MHz
1.0 0.2 1.0 0.2
1.25 0.2
1.0 0.2 1.0 0.2
1.25 0.2
(in mm)
(in mm)
Oscillating
Frequency
(MHz)
Temperature
Range
Initial
Tolerance
Temperature Stability
(%)
Part Number
(°C)
CSTCC_G
CSTCR_G
CSACN_G
CSTCE_G
CSTCE_G_Z
CSACM_G
CSTCE_V
CSTCG_V
CSACW_X
CSTCW_X
2.00 to 3.99
ꢂ.00 to ꢅ.99
ꢂ.00, 6.00
0.ꢀ5
0.ꢀ5
0.ꢀ5
0.ꢀ5
0.ꢀ5
0.ꢀ5
0.ꢀ5
0.ꢀ5
0.ꢀ5
0.ꢀ5
0.3 ꢁ 0.ꢂ54%:ButlB- nꢃCꢃpBtꢃ-pꢄ ꢂꢅC7 tꢆCꢄ eBtiB- 7ꢇꢄr.2.00 to 3.ꢂ9ꢈꢉMH
l20 to 80
l20 to 80
l20 to 8ꢀ
l20 to 80
lꢂ0 to 12ꢀ
l20 to 8ꢀ
l20 to 80
l20 to 80
l20 to 80
l20 to 80
0.2
l0.2ꢀ to +0.2
8.00 to 13.99
8.00 to 13.99
0.2
0.2
8.00, 10.00, 12.00
1ꢂ.00 to 20.00
20.00 to 33.86
20.01 to ꢅ0.00
20.01 to ꢅ0.00
l0.2ꢀ to +0.2
0.3
0.3
0.2
0.2
Iꢇꢇꢄg:uꢃꢇ oꢇ stoCCꢄd ospBuuꢃtBo- mꢃꢆ opp:ꢇ :-dꢄꢇ :-mꢃtpiꢄd pBꢇp:Bt po-dBtBo-s. Puꢄꢃsꢄ piꢄpk tiꢄ ꢃpt:ꢃu po-dBtBo-s CꢇBoꢇ to :sꢄ.
Oscillation Frequency Measuring Circuit
c
CSTCR_G/CSTCE_G/CSTCE_G_Z/CSTCE_V/CSTCG_V
CSTCC_G/CSTCW_X
VDD
VDD
5pF
To Frequency Counter
To Frequency Counter
Rf
Rf
1MΩ
Rd
Rd
(1)
(3)
(1)
(3)
C1
C2
(2)
C1
C2
(2)
Continued on the following page.
2ꢂ
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
!Note
P16E.pdf
Jan.15,2014
Continued from the preceding page.
Oscillation Frequency Measuring Circuit
c
CSACN_G/CSACM_G/CSACW_X
VDD
To Frequency counter
Rf
Rd
CL1
CL2
Standard Land Pattern Dimensions
c
CSTCC_G
CSTCR_G
(* This Land Pattern is not common to
CSTCR_G15C, CSTCR_G15L, CSTCR_GH5L.)
0.8
0.7 0.8 0.7
0.8
4
1.2 1.2
1.4
1.2 1.2
0.4
1.5
0.4
1.5
0.4
2.5
2.5
Land Pattern
(in mm)
Land Pattern
(in mm)
CSACN_G
CSTCE_G/CSTCE_G_Z
4.0
0.6
0.4
0.8
0.4
0.8
0.4
1.4
0.6
1.2
1.2
Land Pattern
(in mm)
(in mm)
CSACM_G
CSTCE_V
(* This Land Pattern is not common to
CSTCE_V13C, CSTCE_V_C, CSTCE_V13L, CSTCE_VH3L.)
2.71
0.3
0.65
0.3 0.65
0.3
0.75
0.60
0.61
0.95
0.95
Land Pattern
(in mm)
(in mm)
Continued on the following page.
25
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
!Note
P16E.pdf
Jan.15,2014
Continued from the preceding page.
Standard Land Pattern Dimensions
c
CSTCG_V
CSACW_X
0.3
0.5
0.3
0.5
0.3
0.5
0.5
0.8
0.8
2.0
Land Pattern
Land Pattern
(in mm)
(in mm)
CSTCW_X
0.5 0.5 0.5 0.5 0.5
4
1.0
1.0
Land Pattern
(in mm)
Oscillation Frequency Temperature Stability
c
CSTCC_G
CSTCR_G
+0.2
+0.1
0
+0.2
+0.1
0
-0.1
-0.1
-0.2
-40
-0.2
-60
-20
0
+20
+40
+60
+80
+100
-40
-20
0
+20
+40
+60
+80
+100
+120
+140
Temperature (°C)
Temperature (°C)
CSACN_G
CSTCE_G/CSTCE_G_Z
+0.2
+0.2
+0.1
0
+0.1
0
-0.1
-0.1
-0.2
-40
-0.2
-60
-20
0
+20
+40
+60
+80
+100
-40
-20
0
+20
+40
+60
+80
+100
+120
+140
Temperature (°C)
Temperature (°C)
Continued on the following page.
26
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
!Note
P16E.pdf
Jan.15,2014
Continued from the preceding page.
Oscillation Frequency Temperature Stability
c
CSACM_G
CSTCE_V
+0.2
+0.1
0
+0.2
+0.1
0
-0.1
-0.1
-0.2
-0.2
-40
-20
0
+20
+40
+60
+80
+100
+140
+100
-60
-40
-20
0
+20
+40
+60
+80
+100
+120
+140
Temperature (°C)
Temperature (°C)
CSTCG_V
CSACW_X
+0.2
+0.2
+0.1
0
+0.1
0
4
-0.1
-0.1
-0.2
-60
-0.2
-40
-40
-20
0
+20
+40
+60
+80
+100
+120
-20
0
+20
+40
+60
+80
+100
Temperature (°C)
Temperature (°C)
CSTCW_X
+0.2
+0.1
0
-0.1
-0.2
-40
-20
0
+20
+40
+60
+80
Temperature (°C)
27
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
!Note
P16E.pdf
Jan.15,2014
Application Circuits Utilization
µPD78F0533GB (Renesas)
TMP19A43FDXBG (Toshiba)
c
c
c
c
c
c
8-bit Microcomputer
32-bit Microcomputer
Vdd=5.0V
Vcc=1.5V
Vcc'=2.5V
Vcc''=3.3V
10kΩ
H
6
EVALUATION BOARD
IC : TMP19A43FDXBG
IC : μPD78F0533GB
11
10
12
0.1μF
L
A14
A15
GND
CERALOCKr
CERALOCKr
H: 15, 16, 47
L: 9, 13, 14, 48
Xin: A14
Xout: A15
V1
V2
V1
V2
C1
C1
C2
C2
CERALOCKr: CSTCR4M00G55-R0
C1=39pF (Typ.)
CERALOCKr: CSTCE10M0G52-R0
C1=10pF (Typ.)
C2=39pF (Typ.)
C2=10pF (Typ.)
MN103SFC2D (Panasonic)
MB95F128H (Fujitsu)
32-bit Microcomputer
8-bit Microcomputer
4
Vdd=5.0V
Vcc=5.0V
H
H
IC : MN103SFC2D
13
IC : MB95F128H
14
Vdd2
10μF
L
56
55
L
CERALOCKr
CERALOCKr
H: 9, 17, 34
L: 7, 15, 36
Vdd2: 16, 38
H: 3, 28, 51, 79
L: 4, 29, 54, 57
V1
V2
V1
V2
C1
C1
C2
C2
CERALOCKr: CSTCR5M00G55Z-R0
C1=39pF (Typ.)
CERALOCKr: CSTCE8M00G52-R0
C1=10pF (Typ.)
C2=39pF (Typ.)
C2=10pF (Typ.)
PIC16F716-I/SO (Microchip)
HD64F36077GH (Renesas)
8-bit Microcomputer
16-bit Microcomputer
Vdd=5.0V
Vcc=5.0V
H
H
EVALUATION BOARD
IC : PIC16F716-I/SO(HS)
IC : HD64F36077GH
10
16
15
GND
11
6
L
0.1μF
1MΩ
CERALOCKr
CERALOCKr
H: 3, 7, 12
L: 8, 9
V1
V2
V1
V2
C1
C2
CERALOCKr: CSTCE12M0G52-R0
C1=10pF (Typ.)
CERALOCKr: CSTCE8M00G52-R0
C1=10pF (Typ.)
C1
C2
C2=10pF (Typ.)
C2=10pF (Typ.)
Continued on the following page.
28
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
!Note
P16E.pdf
Jan.15,2014
Application Circuits Utilization
Continued from the preceding page.
µPD70F3215HYGC (Renesas)
32-bit Microcomputer
Vdd=5.0V
ATmega128 (Atmel)
c
c
8-bit Microcomputer
Vcc=5.0V
H
14
H
IC : μPD70F3215HYGC
13
IC : ATmega128
23
12
10
L
24
L
10μF
CERALOCKr
CERALOCKr
H: 1, 5, 9, 34, 70
L: 2, 8, 11, 33, 69
H: 21, 52, 64
L: 22, 53, 63
V1
V2
V1
V2
C1
C1
C2
C2
CERALOCKr: CSTCR5M00G55-R0
C1=39pF (Typ.)
CERALOCKr: CSTCE8M00G52-R0
C1=10pF (Typ.)
C2=39pF (Typ.)
C2=10pF (Typ.)
ST7FLITE29F2B6 (ST Microelectronics)
TMS320F2810PBKA (Texas Instruments)
c
c
8-bit Microcomputer
32-bit Microcomputer
4
Vdd=5.0V
Vdd1=1.8V
Vdd2=3.3V
H
18
H1
H2
IC : ST7FLITE29F2B6
14
IC : TMS320F2810PBKA
57
15
L
58
L
H1: 20, 29, 42, 56, 63, 74, 82, 94, 99,
100, 102, 110, 114
H2: 1, 13, 14, 25, 49, 52, 83, 104, 118
L: 12, 15, 17, 26, 30, 39, 53, 59, 62, 73,
88, 95, 103, 109, 115, 117, 128
100Ω
CERALOCKr
CERALOCKr
H: 17
L: 16
V1
V2
V1
V2
C1
C2
CERALOCKr: CSTCE16M0V53-R0
C1=15pF (Typ.)
CERALOCKr: CSTCE15M0V53-R0
C1=15pF (Typ.)
C1
C2
C2=15pF (Typ.)
C2=15pF (Typ.)
29
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
!Note
P16E.pdf
Jan.15,2014
Ceramic Resonators (CERALOCKr)
MHz Lead Type -Standard Frequency Tolerance for General Usage-
8.0±±.0
3.0±±.0
MURATA's ceramic resonator, CERALOCK(R) with built-in
load capacitors, has been widely applied as the most
suitable component for clock oscillators in a broad
range of microprocessors.
∗∗∗
The CSTLS series can be used in the design of
oscillation circuits not requiring external load
capacitors, enabling both high-density mounting and
cost reduction.
70.07 (Ref.)
2.5±0.2
(3)
(2)
(±)
CSTLS_G
3.40-10.00MHz
2.5±0.2
: Weekly Date Code
(in mm)
∗∗∗
Features
c
1. Oscillation circuits do not require external load
capacitors.
T ∗±
There is some variation in built-in capacitance
values applicable to various IC.
5.5±±.0
2. Stable over a wide temperature range.
3. Compact, lightweight and exhibit
superior shock resistance performance.
4. Enable the design of oscillator circuits
requiring no adjustment.
∗
(3)
(2)
(±)
5
5. Cost-effective and reliable availability
T
∗±: 3.5±±.0 (±6.00ꢀ32.ꢁꢁ9MH)
3.0±±.0 (33.00ꢀ70.009MH)
∗
: EIAJ 9onthly Code
CSTLS_X
Applications
1. DTMF generators
c
16.00-70.00MHz
2.5±0.2 2.5±0.2
(in mm)
2. Clock oscillators for microcomputers
3. Remote control units
4. Automated office equipment
Oscillating
Frequency
(MHz)
Temperature
Range
Initial
Tolerance
Temperature Stability
(%)
Part Number
(°C)
CSTLS_G
CSTLS_X
3.40 to 10.00
16.00 to ꢃ0.00
0.5ꢀ
0.5ꢀ
0.2 ꢁ-0.4ꢀ to ꢂ0.2ꢀ%:uilt-in Capacitance 4ꢃpF typeꢄ
0.2
-20 to 80
-20 to 80
Irregular or stopped oscillation may occur under unmatched circuit conditions. Please check the actual conditions prior to use.
The order quantity should be an integral multiple of the "Minimum Quantity" shown in the packaging page.
Oscillation Frequency Measuring Circuit
c
CSTLS_G/CSTLS_X
VDD
To Frequency Counter
Rf
Rd
(±)
(3)
C±
C2
(2)
30
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
!Note
P16E.pdf
Jan.15,2014
Oscillation Frequency Temperature Stability
c
CSTLS_G
CSTLS_X
+0.50
0.3
0.2
0.±
0.0
+0.25
0
–50
–30
–±0
±0
30
50
70
ꢁ0
±±0
±30
–40
0
40
80
±20
Temperature (°C)
Temperature (°C)
–
–
–
0.±
0.2
0.3
–0.25
–0.50
5
31
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
!Note
P16E.pdf
Jan.15,2014
Application Circuits Utilization
M38235G6HP (Renesas)
LC87F5G32A (Sanyo)
c
c
8-bit Microcomputer
8-bit Microcomputer
Vcc=5.0V
Vdd=5.0V
510Ω
47000pF
10kΩ
10kΩ
100pF
H
25
26
H'
6
H
2
M38235G6HP
29
IC : LC87F5G32A
7
28
L
L'
L
H: 8, 19, 39
L: 5, 20, 40
H': 29, 31, 35
L': 30, 32~34, 36
2.2kF
CERALOCKr
10kF
CERALOCKr
H: 71
L: 30, 73
V1
V2
V1
V2
C1
C2
CERALOCKr: CSTLS8M00G53-B0
C1=15pF (Typ.)
CERALOCKr: CSTLS5M00G53-B0
C1=15pF (Typ.)
C1
C2
C2=15pF (Typ.)
C2=15pF (Typ.)
5
32
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
!Note
P16E.pdf
Jan.15,2014
Notice for General Usage -MHz Chip Type-
Soldering and Mounting (CSTCC Series)
c
1. Soldering
(1) Reflow soldering
Please mount component on a circuit board by reflow
soldering. Flow soldering is not acceptable.
Recommendable Flux and Solder
Please use rosin based flux,
not water soluble flux.
Flux
Please use solder (Sn-3.0Ag-0.5Cu) under
the following conditions: Standard thickness
of soldering paste: 0.10 to 0.15mm.
Peak
260
245
220
Solder
Heating
(220°C min.)
180
150
Pre-heating
(150 to 180°C)
Recommendable Soldering Profile
Gradual
Cooling
150 to 180°C
60 to 120s
30 to 60s
1s max.
Pre-heating
220°C min.
Heating
upper limit: 260°C
lower limit: 245°C
Peak Temperature
5s max.
60 to 120s
30 to 60s
Temperature shall be measured on the surface of component.
(2) Soldering with Iron
If compelled to mount the component by using soldering
iron, please do not directly touch the component with the
soldering iron. The component terminals or electrical
characteristics may be damaged if excessive thermal
stress is applied.
Recommendable Soldering with Iron
Heating of the soldering iron
350°C max.
30W max.
Watt
ø3mm max.
Shape of the soldering iron
Soldering Time
Solder
5s max. at one terminal
Sn-3.0Ag-0.5Cu
(3) Solder Volume
Please make the solder volume less than the height of
the substrate to avoid damage to the seal between the
metal cap and the substrate.
(4) Other
Do not reuse components removed from a circuit board
after soldering.
(5) Conditions for Placement Machines
The component is recommended with placement
machines that employ optical placement capabilities. The
component may be damaged by excessive mechanical
force. Please make sure that you have evaluated by
using placement machines before going into mass
production. Do not use placement machines that utilize
mechanical positioning. Please contact Murata for details
beforehand.
Continued on the following page.
33
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
!Note
P16E.pdf
Jan.15,2014
Notice for General Usage -MHz Chip Type-
Continued from the preceding page.
2. Wash
Some series do not withstand washing.
Series
Wash
Please check the list at right before use.
CSTCC (2.00 to 3.49MHz)
CSTCC (3.50 to 3.99MHz)
Not Available
Available
(1) Cleaning Solvents
HCFC, Isopropanol, Tap water, Demineralized water,
Cleanthrough750H, Pine alpha 100S, Techno care FRW
(2) Temperature Difference : dT *1
dTV60°C (dT=Component-solvent)
*1 ex. If the component is immersed at +90°C into
cleaning solvent at +60°C, then dT=30°C.
(3) Conditions
(a) Ultrasonic Wash
(b) Immersion Wash
1 minute max. in above solvent at +60°C max.
(Frequency: 28kHz, Output: 20W/l)
5 minutes max. in above solvent at +60°C max.
(c) Shower or Rinse Wash
5 minutes max. in above solvent at +60°C max.
(4) Drying
5 minutes max. by air blowing at +80°C max.
(5) Other
(a) Total washing time should be within 10 minutes.
(b) The component may be damaged if it is washed with
chlorine, petroleum, or alkali cleaning solvent.
3. Coating
Conformal coating of the component is acceptable.
However, the resin material, curing temperature, and
other process conditions should be evaluated to confirm
stable electrical characteristics are maintained.
34
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
!Note
P16E.pdf
Jan.15,2014
Notice for General Usage -MHz Chip Type-
Soldering and Mounting (CSTCR/CSTCE_V/CSTCG/CSACN/CSACM/CSTCE_G Series)
c
1. Soldering
(1) Reflow soldering
Please mount component on a circuit board by reflow
soldering. Flow soldering is not acceptable.
Recommendable Flux and Solder
Please use rosin based flux,
not water soluble flux.
Flux
Please use solder (Sn-3.0Ag-0.5Cu) under
the following conditions: Standard thickness
of soldering paste: 0.10 to 0.15mm.
Peak
260
245
220
Solder
Heating
(220°C min.)
180
150
Pre-heating
(150 to 180°C)
Recommendable Soldering Profile
Gradual
Cooling
150 to 180°C
60 to 120s
30 to 60s
1s max.
Pre-heating
220°C min.
Heating
upper limit: 260°C
lower limit: 245°C
Peak Temperature
5s max.
60 to 120s
30 to 60s
Temperature shall be measured on the surface of component.
(2) Soldering with Iron
If compelled to mount the component by using soldering
iron, please do not directly touch the component with the
soldering iron. The component terminals or electrical
characteristics may be damaged if excessive thermal
stress is applied.
Recommendable Soldering with Iron
350°C max.
30W max.
Heating of the soldering iron
Watt
ø3mm max.
Shape of the soldering iron
Soldering Time
Solder
5s max. at one terminal
Sn-3.0Ag-0.5Cu
(3) Solder Volume
Please make the solder volume less than the height of
the substrate to avoid damage to the seal between the
metal cap and the substrate.
(4) Other
Do not reuse components removed from a circuit board
after soldering.
(5) Conditions for Placement Machines
The component is recommended with placement machines
that employ optical placement capabilities. The component
may be damaged by excessive mechanical force. Please
make sure that you have evaluated by using placement
machines before going into mass production. Do not use
placement machines that utilize mechanical positioning.
Please contact Murata for details beforehand.
2. Washing / Coating
Conformal coating or washing of the component is not
acceptable, because it is not hermetically sealed.
Please contact us if you need a washable component.
Continued on the following page.
35
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
!Note
P16E.pdf
Jan.15,2014
Notice for General Usage -MHz Chip Type-
Continued from the preceding page.
Soldering and Mounting (CSACW/CSTCW Series)
c
1. Soldering
(1) Reflow soldering
Please mount component on a circuit board by reflow
soldering. Flow soldering is not acceptable.
Recommendable Flux and Solder
Please use rosin based flux,
not water soluble flux.
Flux
Please use solder (Sn-3.0Ag-0.5Cu) under
the following conditions: Standard thickness
of soldering paste: 0.10 to 0.15mm.
Peak
260
245
220
Solder
Heating
(220°C min.)
180
150
Pre-heating
(150 to 180°C)
Recommendable Soldering Profile
Gradual
Cooling
150 to 180°C
60 to 120s
30 to 60s
1s max.
Pre-heating
220°C min.
Heating
upper limit: 260°C
lower limit: 245°C
Peak Temperature
5s max.
60 to 120s
30 to 60s
Temperature shall be measured on the surface of component.
(2) Soldering with Iron
If compelled to mount the component by using soldering
iron, please do not directly touch the component with the
soldering iron. The component terminals or electrical
characteristics may be damaged if excessive thermal
stress is applied.
Recommendable Soldering with Iron
350°C max.
30W max.
Heating of the soldering iron
Watt
ø3mm max.
Shape of the soldering iron
Soldering Time
Solder
5s max. at one terminal
Sn-3.0Ag-0.5Cu
(3) Other
Do not reuse components removed from a circuit board
after soldering.
(4) Conditions for Placement Machines
The component is recommended with placement
machines that employ optical placement capabilities. The
component may be damaged by excessive mechanical
force. Please make sure that you have evaluated by
using placement machines before going into mass
production. Do not use placement machines that utilize
mechanical positioning. Please contact Murata for details
beforehand.
2. Washing / Coating
Conformal coating or washing of the component is not
acceptable, because it is not hermetically sealed.
Please contact us if you need a washable component.
36
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
!Note
P16E.pdf
Jan.15,2014
Notice for General Usage -MHz Chip Type-
c Storage and Operating Conditions
1. Product Storage Conditions
(2) Please do not put the products directly on the
floor without anything under them to avoid damp
and/or dusty places.
Please store the products in a room where the
temperature/humidity is stable, and avoid
such places where there are large temperature
changes. Please store the products under the
following conditions:
(3) Please do not store the products in places
such as: in a damp heated place, in a place where
direct sunlight comes in, in a place applying
vibrations.
Temperature: -10 to +40°C
Humidity: 15 to 85% R.H.
(4) Please use the products immediately after the
package is opened, because the characteristics
may be reduced in quality, and/or be degraded in
the solderability due to storage under the poor
conditions.
2. Expiration Date on Storage
Expiration date (Shelf life) of the products is six
months after delivery under the conditions of a
sealed and unopened package. Please use the
products within six months after delivery. If you
store the products for a long time (more than six
months), use carefully because the products may
be degraded in solderability and/or rusty.
Please confirm solderability and characteristics
for the products regularly.
(5) Please do not drop the products to avoid cracking
of ceramic elements.
4. Other
Conformal coating or washing of the component is not
acceptable because it is not hermetically sealed.
Please be sure to consult with our sales representatives
or engineers whenever and prior to using the products.
3. Notice on Product Storage
(1) Please do not store the products in a chemical
atmosphere (Acids, Alkali, Bases, Organic gas,
Sulfides and so on), because the characteristics
may be reduced in quality, and/or be degraded in
the solderability due to the storage in a
chemical atmosphere.
c Rating
The component may be damaged if excessive mechanical
stress is applied.
c Handling
"CERALOCK" may stop oscillating or oscillate
irregularly under improper circuit conditions.
37
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
!Note
P16E.pdf
Jan.15,2014
Notice for General Usage -MHz Lead Type-
c Soldering and Mounting
The component cannot withstand washing.
Please do not apply excessive mechanical stress to the
component and lead terminals during soldering.
c Storage and Operating Conditions
1. Product Storage Conditions
(2) Please do not put the products directly on the
floor without anything under them to avoid damp
and/or dusty places.
Please store the products in a room where the
temperature/humidity is stable, and avoid
such places where there are large temperature
changes. Please store the products under the
following conditions:
(3) Please do not store the products in places
such as: in a damp heated place, in a place where
direct sunlight comes in, in a place applying
vibrations.
Temperature: -10 to +40°C
Humidity: 15 to 85% R.H.
(4) Please use the products immediately after the
package is opened, because the characteristics
may be reduced in quality, and/or be degraded in
the solderability due to storage under the poor
conditions.
2. Expiration Date on Storage
Expiration date (Shelf life) of the products is six
months after delivery under the conditions of a
sealed and unopened package. Please use the
products within six months after delivery. If you
store the products for a long time (more than six
(5) Please do not drop the products to avoid cracking
of ceramic elements.
months), use carefully because the products may
be degraded in solderability and/or rusty.
Please confirm solderability and characteristics
for the products regularly.
4. Other
Conformal coating or washing of the component is not
acceptable because it is not hermetically sealed.
Please be sure to consult with our sales representatives
or engineers whenever and prior to using the products.
3. Notice on Product Storage
(1) Please do not store the products in a chemical
atmosphere (Acids, Alkali, Bases, Organic gas,
Sulfides and so on), because the characteristics
may be reduced in quality, and/or be degraded in
the solderability due to the storage in a
chemical atmosphere.
c Rating
The component may be damaged if excessive mechanical
stress is applied.
c Handling
"CERALOCK" may stop oscillating or oscillate
irregularly under improper circuit conditions.
38
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
!Note
P16E.pdf
Jan.15,2014
Packaging for General Usage -MHz Chip Type-
Minimum Quantity
Part Number
CSTCC_G
c
Plastic Tape ø180mm
2,000
Plastic Tape ø330mm
Bulk
500
500
500
500
-
Dimensions
6,000
9,000
9,000
9,000
-
a
a
a
a
b
b
b
b
b
b
b
b
b
b
b
b
CSTCR_G
3,000
CSTCR_G15L
CSTCR_GH5L
CSACN_G
3,000
3,000
3,000
CSTCE_G
3,000
9,000
9,000
9,000
-
500
500
500
-
CSTCE_G15L
CSTCE_GH5L
CSACM_G
3,000
3,000
3,000
CSTCE_V
3,000
9,000
9,000
9,000
9,000
9,000
9,000
9,000
500
500
500
500
500
500
500
CSTCE_V13L
CSTCE_VH3L
CSTCG_V
3,000
3,000
3,000
CSTCW_X
3,000
CSTCW_X11
CSACW_X
3,000
3,000
(pcs.)
The order quantity should be an integral multiple of the "Minimum Quantity" shown above.
c Dimensions of Reel
a
b
Trailer
160-190
Leader
Cover Film
Leader
Trailer
160-190
Cover Film
Empty
Components
Empty
160 min.
Empty Components
Empty
160 min.
400-560
400-560
ø13.0 0.2
ø13.0 0.2
2.0 0.5
2.0 0.5
+1.0
0
+1.0
–0
13.0
9.0
13.0 1.0
17.0 1.0
(in mm)
Dimensions of Taping
c
CSTCR_G15L/CSTCR_GH5L
CSTCE_G15L/CSTCE_GH5L
4.0 0.1
+0.1
+0.1
ø1.5
4.0 0.1
ø1.5
-0.0
-0
2.0 0.05
2.0 0.05
+0.1
ø1.5
4.0 0.1
+0.2
-0.0
ø1.0
4.0 0.1
-0
+0.10
1.50
2.2 0.1
The cover film peel strength force 0.1 to 0.7N
The cover film peel speed 300mm/min.
-0.05
The cover film peel strength force 0.1 to 0.7N
The cover film peel speed 300mm/min.
(3˚)
(3°)
Cover Film
Cover Film
10°
10°
Direction of Feed
(in mm)
(in mm)
Direction of Feed
Continued on the following page.
39
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
!Note
P16E.pdf
Jan.15,2014
Packaging for General Usage -MHz Chip Type-
Continued from the preceding page.
Dimensions of Taping
c
CSACN_G
CSTCE_V13L/CSTCE_VH3L
Dimensions of Carrier Tape
Dimensions of Carrier Tape
4.0 0.ꢀ
4.0 0.ꢀ
+0.ꢀ
øꢀ.5 -0.0
+0.ꢀ
øꢀ.5 -0.0
2.0 0.05
2.0 0.05
+0.ꢀ
øꢀ.0 -0.0
+0.20
øꢀ.0 -0.00
+0.ꢀ0
ꢀ.8 -0.05
4.0 0.ꢀ
+0.ꢀ0
ꢀ.50 -0.05
4.0 0.ꢀ
The cover film peel strength force 0.ꢀ to 0.7N
The cover film peel speed 300mm/min.
The cover film peel strength force 0.ꢀ to 0.7N
The cover film peel speed 300mm/min.
(3°)
3° max.
Cover Film
Cover Film
ꢀ0°
ꢀ0°
(in mm)
Direction of Feed
Direction of Feed
(in mm)
CSTCW_X11
CSTCC_G
4.0 0.ꢀ
2.0 0.05
4.0 0.ꢀ
+0.ꢀ
øꢀ.55 0.05
øꢀ.5
2.0 0.ꢀ
-
0.0
+0.3
-0.0
4.0 0.ꢀ
+0.2
øꢀ.0
øꢀ.5
4.0 0.ꢀ
2.3 0.ꢀ
The cover film peel strength force 0.ꢀ to 0.7N
The cover film peel speed 300mm/min.
-
0.0
The cover film peel strength force 0.ꢀ to 0.7N
The cover film peel speed 300mm/min.
ꢀ0°
3.3 0.ꢀ
(3°)
Cover Film
ꢀ0°
(3°)
Cover Film
Direction of Feed
∗ꢀ, ∗2: Dimensions vary with product thickness of CERALOCKr.
Direction of Feed
∗ꢀ, ∗2: Dimensions vary with frequency range of CERALOCKr.
Thickness of CERALOCKr
ꢀ.40–ꢀ.20
ꢀ.48 0.ꢀ
2.ꢀ max.
ꢀ.ꢀ5–ꢀ.00
ꢀ.30 0.ꢀ
ꢀ.9 max.
0.95–0.90
ꢀ.ꢀ2 0.ꢀ
ꢀ.7 max.
Frequency Range
2.00–2.99MHz
ꢀ.85 0.05
2.45 max.
3.00–3.99MHz
ꢀ.65 0.05
2.25 max.
tꢀ
t2
∗ꢀ
∗2
tꢀ
t2
∗ꢀ
∗2
(in mm)
(in mm)
CSTCR_G
CSTCE_G
4.0 0.ꢀ
+0.ꢀ
+0.ꢀ
øꢀ.5
4.0 0.ꢀ
øꢀ.5
-0.0
-0
2.0 0.05
2.0 0.05
+0.ꢀ
4.0 0.ꢀ
+0.2
-0.0
øꢀ.0
øꢀ.5
4.0 0.ꢀ
-0
2.2 0.ꢀ
+0.ꢀ0
ꢀ.50
The cover film peel strength force 0.ꢀ to 0.7N
The cover film peel speed 300mm/min.
-0.05
The cover film peel strength force 0.ꢀ to 0.7N
The cover film peel speed 300mm/min.
(3˚)
(3°)
Cover Film
Cover Film
ꢀ0°
ꢀ0°
Direction of Feed
(in mm)
(in mm)
Direction of Feed
CSTCE_V
CSACM_G
Dimensions of Carrier Tape
4.0 0.ꢀ
4.0 0.ꢀ
+0.ꢀ
øꢀ.5 -0.0
+0.ꢀ
øꢀ.5 -0.0
2.0 0.05
2.0 0.05
+0.ꢀ
øꢀ.0 -0.0
ꢀ.85 0.ꢀ
(5°)
4.0 0.ꢀ
øꢀ.0 0.ꢀ
+0.ꢀ0
ꢀ.50 -0.05
4.0 0.ꢀ
The cover film peel strength force 0.ꢀ to 0.7N
The cover film peel speed 300mm/min.
The cover film peel strength force 0.ꢀ to 0.7N
The cover film peel speed 300mm/min.
(3°)
Cover Film
Cover Film
ꢀ0°
ꢀ0°
(in mm)
Direction of Feed
(in mm)
Direction of Feed
Continued on the following page.
40
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
!Note
P16E.pdf
Jan.15,2014
Packaging for General Usage -MHz Chip Type-
Continued from the preceding page.
Dimensions of Taping
c
CSTCG_V
CSACW_X
4.0 0.ꢀ
4.0 0.ꢀ
+0.ꢀ
øꢀ.ꢁ -0.0
+0.ꢀ
2.0 0.ꢀ
øꢀ.ꢁ
-0.0
2.0 0.0ꢁ
+0.2
øꢀ.0
-0.0
4.0 0.ꢀ
2.3 0.ꢀ
The cover film peel strength force 0.ꢀ to 0.7N
The cover film peel speed 300mm/min.
Cover Film
+0.ꢀ
øꢀ.0 -0.0
4.0 0.ꢀ
(3°)
ꢀ.ꢁ0 0.ꢀ
ꢀ0°
The cover film peel strength force 0.ꢀ to 0.7N
The cover film peel speed 300mm/min.
(3°)
Cover Film
ꢀ0°
Direction of Feed
∗ꢀ, ∗2: Dimensions vary with product thickness of CERALOCKr.
Thickness of CERALOCKr
ꢀ.40–ꢀ.20
ꢀ.48 0.ꢀ
2.ꢀ max.
ꢀ.ꢀꢁ–ꢀ.00
ꢀ.30 0.ꢀ
ꢀ.9 max.
0.9ꢁ–0.90
ꢀ.ꢀ2 0.ꢀ
ꢀ.7 max.
tꢀ
t2
∗ꢀ
∗2
Direction of Feed
(in mm)
(in mm)
CSTCW_X
4.0 0.ꢀ
+0.ꢀ
øꢀ.ꢁ
2.0 0.ꢀ
-
0.0
+0.2
øꢀ.0
4.0 0.ꢀ
2.3 0.ꢀ
The cover film peel strength force 0.ꢀ to 0.7N
The cover film peel speed 300mm/min.
-
0.0
Cover Film
ꢀ0°
(3°)
Direction of Feed
∗ꢀ, ∗2: Dimensions vary with product thickness of CERALOCKr.
Thickness of CERALOCKr
ꢀ.40–ꢀ.20
ꢀ.48 0.ꢀ
2.ꢀ max.
ꢀ.ꢀꢁ–ꢀ.00
ꢀ.30 0.ꢀ
ꢀ.9 max.
0.9ꢁ–0.90
ꢀ.ꢀ2 0.ꢀ
ꢀ.7 max.
tꢀ
t2
∗ꢀ
∗2
(in mm)
41
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
!Note
P16E.pdf
Jan.15,2014
Packaging for General Usage -MHz Lead Type-
Minimum Quantity
Part Number
c
Ammo Pack
2,000
Bulk
500
500
CSTLS_G (3.40 to 10.0MHz)
CSTLS_X (16.00 to 70.00MHz)
2,000
(pcs.)
The order quantity should be an integral multiple of the "Minimum Quantity" shown above.
Tape Dimensions of CSTLS_G
c
P2
P
dh dh
dS
D
M
M
∗∗∗
∗∗∗
d
D0
P1 F1 F2
P0
t
Direction of Feed
Item
Code
Dimensions
Tolerance
1.0
Remarks
Width of diameter
Height of resonator
D
A
8.0
5.5
0.5
Dimensions of terminal
d
ø0.48
5.0 min.
12.7
12.7
3.85
0.05
–
Lead length under the hold down tape
Pitch of component
L1
P
0.5
Tolerance for Pitches 10xP0=127 1
Pitch of sprocket hole
P0
P1
0.2
Length from sprocket hole center to lead
0.5
Length from sprocket hole center to
component center
P2
6.35
0.5
Lead spacing (I)
F1
F2
2.5
0.2
0.2
1.0
0.5
–
Lead spacing (II)
2.5
Slant forward or backward
Width of carrier tape
dh
W
0
1mm max.
18.0
6.0 min.
9.0
Width of hold down tape
Position of sprocket hole
Gap of hold down tape and carrier tape
W0
W1
W2
Hold down tape does not exceed the carrier tape.
0.5
W0.5
0
Y0
Distance between the center of
sprocket hole and lead stopper
H0
18.0
0.5
Total height of resonator
Diameter of sprocket hole
Total tape thickness
Body tilt
H1
D0
t
23.5
ø4.0
0.6
0
1.0
0.2
0.2
1.0
dS
(in mm)
Continued on the following page.
42
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
!Note
P16E.pdf
Jan.15,2014
Packaging for General Usage -MHz Lead Type-
Continued from the preceding page.
Tape Dimensions of CSTLS_X
c
P2
P
dh dh
D
dS
d
D0
P1 F1 F2
P0
Direction of Feed
t
Item
Width of diameter
Code
D
Dimensions
5.5
Tolerance
1.0
Remarks
Height of resonator
Dimensions of terminal
A
6.5
0.5
d
ø0.48
5.0 min.
12.7
0.05
–
Lead length under the hold down tape
Pitch of component
L1
P
0.5
Tolerance for Pitches 10xP0=127 1
Pitch of sprocket hole
P0
P1
12.7
0.2
Length from sprocket hole center to lead
3.85
0.5
Length from sprocket hole center to
component center
P2
6.35
0.5
Lead spacing (I)
F1
F2
2.5
0.2
0.2
1.0
0.5
–
Lead spacing (II)
2.5
Slant forward or backward
Width of carrier tape
dh
W
0
1mm max.
18.0
6.0 min.
9.0
Width of hold down tape
Position of sprocket hole
Gap of hold down tape and carrier tape
W0
W1
W2
Hold down tape does not exceed the carrier tape.
0.5
W0.5
Y0.0
0
Distance between the center of
sprocket hole and lead stopper
H0
18.0
0.5
Total height of resonator
Diameter of sprocket hole
Total tape thickness
Body tilt
H1
D0
t
24.5
ø4.0
0.6
0
1.0
0.2
0.2
1.0
dS
(in mm)
43
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
!Note
P16E.pdf
• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Jan.15,2014
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