BLM31PG601SN1C [MURATA]
Ferrite Chip, 1 Function(s), 1.5A, EIA STD PACKAGE SIZE 1206, 2 PIN;
| 型号： | BLM31PG601SN1C |
| 厂家： | 
muRata |
| 描述： | Ferrite Chip, 1 Function(s), 1.5A, EIA STD PACKAGE SIZE 1206, 2 PIN |
| 文件： | 总8页 (文件大小：193K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
This is the PDF file of catalog No.C31E-6
C31E6.pdf 01.5.29
1
BLM31 Series(3216 Size)
0.7±0.3
3.2±0.2
1.6±0.2
in mm
Impedance (at 100MHz)
Rated Current
(mA)
DC Resistance(max.)
(ohm)
Operating Temperature Range
Part Number
(ohm)
(°C)
BLM31AF700SN1
BLM31AJ260SN1
BLM31AJ601SN1
BLM31BE601FN1
BLM31PG330SN1
BLM31PG500SN1
BLM31PG121SN1
BLM31PG391SN1
BLM31PG601SN1
70 ±25%
26 ±25%
600 ±25%
600 ±25%
33 (Typ.)
50 (Typ.)
120 (Typ.)
390 (Typ.)
600 (Typ.)
200
500
0.15
0.05
0.90
0.35
0.01
0.025
0.025
0.05
0.09
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
200
300
6000
3000
3000
2000
1500
BLM31P series require derating above 85°C ambient. Please contact us for details.
■ Equivalent Cirucit
■ Impedance-Frequency (Typical)
BLM31 Series
800
AJ601SN1
600
PG601SN1
PG391SN1
400
200
0
BE601FN1
PG500SN1
AF700SN1
PG330SN1
PG121SN1
(Resistance element becomes dominant
at high frequencies.)
AJ260SN1
1
10
100
Frequency (MHz)
1000
■ Impedance-Frequency Characteristics
BLM31AF700SN1
BLM31AJ260SN1
40
100
Z
30
20
75
Z
R
R
50
X
10
25
X
0
1
0
10
100
Frequency (MHz)
1000
1
10
100
Frequency (MHz)
1000
Continued on the following page.
49
This is the PDF file of catalog No.C31E-6
C31E6.pdf 01.5.29
Continued from the preceding page.
■ Impedance-Frequency Characteristics
1
BLM31AJ601SN1
BLM31BE601SN1
800
800
Z
600
600
400
Z
R
R
400
X
200
200
0
X
0
1
10
100
Frequency (MHz)
1000
1
10
100
1000
Frequency (MHz)
BLM31PG330SN1
BLM31PG500SN1
80
60
Z
60
40
45
30
Z
R
R
X
X
20
0
15
0
1
10
100
Frequency (MHz)
1000
1
10
100
1000
Frequency (MHz)
BLM31PG121SN1
BLM31PG391SN1
200
600
150
100
450
300
Z
Z
R
R
50
0
150
0
X
X
1
10
100
Frequency (MHz)
1000
1
10
100
Frequency (MHz)
1000
BLM31PG601SN1
800
600
400
Z
R
X
200
0
1
10
100
Frequency (MHz)
1000
50
This is the PDF file of catalog No.C31E-6
C31E6.pdf 01.5.29
Noise Suppression Effect of BLM_R Series
1
!Waveform Distortion Suppressing
Performance of BLM--R Series
[Measuring Circuits]
Measuring Point
AC00
AC04
Filter
Pattern20cm
1MHz
Type of Filter
EMI Suppression Effect / Description
Signal waveform (100nsec/div, 2V/div) Expand (10nsec/div, 2V/div)
Spectrum
85
80
75
70
65
60
55
50
45
Initial
(No filter)
30 50
100
150
200
250
250
250
300
300
300
Frequency [MHz]
Ringing is caused on the signal waveform
Such ringing contains several hundred MHz harmonic components and generates noise.
Signal waveform (100nsec/div, 2V/div) Expand (10nsec/div, 2V/div)
Spectrum
85
80
75
70
65
60
55
50
45
Resister (47Ω) is used
30 50
100
150
200
Frequency [MHz]
Comparing initial waveform, ringing is suppresed a little.
However there still remains high level waveform distortion.
Signal waveform (100nsec/div, 2V/div) Expand (10nsec/div, 2V/div)
Spectrum
85
80
75
70
65
60
55
50
45
BLM18RK221SN1
(220Ω at 100MHz)
is used
30 50
100
150
200
Frequency [MHz]
BLM18R has excellent performance for noise suppression and waveform distortion suppression.
BLM18R suppresses drastically not only spectrum level in more than 100MHz range but waveform distortion.
54
This is the PDF file of catalog No.C31E-6
C31E6.pdf 01.5.29
Outlines of EMI Suppression Filter (EMIFILr) for DC Line
oChip Ferrite Bead
oFerrite Bead Inductor
Chip Ferrite Bead .............P.24–65
Ferrite Bead Inductor ..........P.129–130
BLM15
BLM18
BLM21
BL01
BL02RN1R3J2B
BL02RN2R3J2B
BLA31
BLM31
BLM41
BL02RN1
BL02RN2R1M2B BL03RN2R1M1B
"ꢀInductor type EMI suppression filters are effective for fre-
quencies ranging from a few MHz to a few GHz. Inductor
type filters are widely used as a low noise
[Equivalent Circuit]
R(f)
countermeasure, as well as a universal noise
suppression component.
" The inductor type EMIFILr produce a micro inductance in
the low frequency range. At high frequencies, however,
the resistive component of the inductor produces the
primary impedance. When inserted in series in the noise
producing circuit, the resistive impedance of the inductor
prevents noise propagation.
[Impedance-Frequency Characteristics(typical)]
1000
800
600
Z
400
200
0
R
X
1
10
100
1000
Frequency [MHz]
R : Real Part (Resistive Portion) X : Imaginary Part (Inductive Portion)
17
This is the PDF file of catalog No.C31E-6
C31E6.pdf 01.5.29
The structure of the "Global Part Numbers" that have been adopted since June 2001 and the meaning of each code are described herein.
If you have any questions about details, inquire at your usual Murata sales office or distributor.
o Part Numbering
(
)
Chip EMIFILr Inductor Type
(Global Part Number)
N
1 D
BL
M
18 AG 102
S
q
w
e
r
t
y
u
i o
qProduct ID
tImpedance
Expressed by three figures. The unit is in ohm (Ω). The first and
second figures are significant digits, and the third figure
expresses the number of zeros which follow the two figures.
Product ID
BL
Chip Ferrite Beads
wType
yPerformance
Expressed by an alphabet.
Code
A
Type
Ex.)
Array Type
Code
Performance
M
Monolithic Type
Monoblock Type
S
Sn Plating
D
uCategory
eDimension (LgW)
Code
N
Category
Standard Type
Code
15
Dimension (LgW)
1.00g0.50mm
1.60g0.80mm
2.00g1.25mm
3.20g1.60mm
3.20g2.50mm
4.50g1.60mm
EIA
0402
0603
0805
1206
1210
1806
H
for Automotive Electoronics
18
iNumbers of Circuit
21
31
Code
Numbers of Circuit
1Circuit
32
1
4
6
8
41
4Circuit
6Circuit
rCharacteristics
8Circuit
Code
Ap *1
Bp *2
Pp *3
RK
Characteristics
for General Use
oPackaging
for High-speed Signal Lines
for Power Supplies
Code
K
Packaging
Plastic Taping (ø330mm Reel)
Plastic Taping (ø180mm Reel)
Bulk
for Digital Interface
L
HG
for GHz Band General Use
for GHz Band High-speed Signal Line
B
HD
J
Paper Taping (ø330mm Reel)
Paper Taping (ø180mm Reel)
Bulk Case
D
*1 For standard type, is expressed by "G".
p
*2
*3
is expressed by "A", "B" or "D".
is expressed by "G", "M", "B", "F".
p
p
C
2
This is the PDF file of catalog No.C31E-6
C31E6.pdf 01.5.29
BLM Series Notice (Soldering and Mounting)
2
1. Standard Land Pattern Dimensions
Do not apply narrower pattern than listed above to
BLM_P.
Narrow pattern can cause excessive heat or open circuit.
Land Pattern
Solder Resist
BLM Series
(Except BLM21P/31P/41P)
BLM21P/31P/41P
a
b
a
b
Size (mm)
Type
L
W
a
b
c
Size (mm)
BLM15 (Reflow)
BLM18 (Flow)
BLM18 (Reflow)
BLM21
1.0 0.5 0.4
1.6 0.8 0.7
1.6 0.8 0.7
2.0 1.25 1.2
3.2 1.6 2.0
4.5 1.6 3.0
1.2-1.4
2.2-2.6
1.8-2.0
3.0-4.0
4.2-5.2
5.5-6.5
0.5
0.7
0.7
1.0
1.2
1.2
Rated
Current
(A)
Land pad thickness
and Dimension d
Type
a
b
c
18µm 35µm 70µm
1.0 1.0 1.00
1.2 1.0 1.00
BLM21PG331SN1 1.5
BLM31
BLM21PG221SN1
BLM21PG300SN1
BLM21PG600SN1
BLM21PG220SN1
BLM31PG330SN1
BLM31PG500SN1
BLM31PG121SN1
BLM31PG391SN1
2
BLM41
1.2 3.0-4.0 1.0
3
2.4 1.2 1.00
6.4 3.3 1.65
2.4 1.2 1.20
BLM15 is specially adapted for refiow soldering.
6
6
Flow Mounting in High Density for BLM31/41
3
2
2.0 4.5-5.2 1.2
a
BLM31PG601SN1 1.5
BLM41PF800SN1
BLM41PG102SN1 1.5
b
d
1
1.2 1.2 1.20
e
Size (mm)
c
BLM41PG471SN1
BLM41PG750SN1
BLM41PG181SN1
BLM41PG600SN1
2
3
6
Type
3.0 5.5-6.5 1.2
a
b
d
e
2.4 1.2 1.20
6.4 3.3 1.65
BLM31
BLM41
2.0
3.0
4.2-5.2
5.5-6.5
1.2 1.3 1.35
1.2 1.8 1.5
2. Solder Paste Printing and Adhesive Application
When reflow soldering the chip EMI suppression filter, the
printing must be conducted in accordance with the
following cream solder printing conditions. If too much
solder is applied, the chip will prone to be damaged by
mechanical and thermal stress from the PCB and may
crack. In contrast, if too little solder is applied, there is the
potential that the termination strength will be insufficient,
creating the potential for detachment. Standard land
dimensions should be used for resist and copper foil
patterns.
When flow soldering the EMI suppression filter, apply the
adhesive in accordance with the following conditions. If
too much adhesive is applied, then it may overflow into
the land or termination areas and yield poor solderability.
In contrast, if insufficient adhesive is applied, or if the
adhesive is not sufficiently hardened, then the chip may
become detached during flow soldering process.
Continued on the following page.
60
This is the PDF file of catalog No.C31E-6
C31E6.pdf 01.5.29
BLM Series Notice (Soldering and Mounting)
Continued from the preceding page.
2
(1) Solder Paste Printing
BLM Series
o Ensure that solder is applied smoothly to a minimum
height of 0.2mm to 0.3mm at the end surface of the
part.
o Coat the solder paste a thickness of 100µm to 200µm.
(2) Adhesive Application
BLM Series
a:20µm−70µm
b:30µm−35µm
c:50µm−105µm
o Coating amount is illustrated in the following diagram.
Chip Solid Inductor
a
c
b
Bonding agent
PCB
Land
3. Standard Soldering Conditions
(1) SOLDERING METHODS
Allowable Flow Soldering Temperature and Time
Use flow and reflow soldering methods only.
Use standard soldering conditions when soldering chip
EMI suppression filters.
280
270
In cases where several different parts are soldered, each
having different soldering conditions, use those
conditions requiring the least heat and minimum time.
o Ensure that solder is applied smoothly to a minimum
height of 0.2mm to 0.3mm at the end surface of the
part.
260
BLM
(Except for BLM15)
250
240
230
o Coat the solder paste a thickness of 100µm to 200µm.
0
5
10
15
20
25
30
(2) SOLDERING TEMPERATURE AND TIME
Time [s]
To prevent external electrode solder leaching and
performance deterioration, solder within the temperature
and time combinations illustrated by the slanted lines in
the following graphs. If soldering is repeated, please note
that the allowed time is the accumulated time.
Allowable Reflow Soldering Temperature and Time
280
270
260
BLM
250
Solder : H60A H63A solder(JIS Z 3238)
Flux :
o Use Rosin-based fulx(when using RA type solder, clean
products sufficiently to avoid residual fulx.
o Do not use strong acidic fulx(with chlorine content
exceeding 0.20wt%)
240
230
o Do not use water-soluble fulx.
0
20
30
40
50
60
70
80
90
Time [s]
Continued on the following page.
61
This is the PDF file of catalog No.C31E-6
C31E6.pdf 01.5.29
BLM Series Notice (Soldering and Mounting)
Continued from the preceding page.
2
(3) SOLDERING CONDITIONS
Flow Solder
Gradual cooling
Pre-heating
Soldering
(in air)
300
250
200
150
100
50
Max. Temp. 250°C
0
60s Min.
10s Max.
Reflow Solder
Gradual cooling
Soldering
(in air)
Pre-heating
300
250
Max. Temp. 230°C
230°C
200
150
100
50
183°C
0
20s Max.
60s Max.
60s Min.
(4) REWORKING WITH SOLDER IRON
The following conditions must be strictly followed when
using a soldering iron.
Pre-heating
: 150°C 60 second Min.
Soldering iron power output
: 30W Max.
Temperature of soldering iron tip : 280°C Max.
Soldering time : 10 second Max.
Do not allow the tip of the soldering iron directly to
contact the chip.
For additional methods of reworking with soldering iron,
please contact Murata engineering.
4. Cleaning
Following conditions should be observed when cleaning
chip EMI filter.
b) Aqueous cleaning agent
Surface active agent (Clean Thru 750H)
Hydrocarbon (Techno Cleaner 335)
(1) Cleaning Temperature : 60degree C max. (40degree C
max. for CFC alternatives and alcohol cleaning agents)
(2) Ultrasonic
High grade alcohol (Pine Alpha ST-100S)
Alkaline saponifier ( Aqua Cleaner 240 -cleaner should
be diluted within 20% using deionized water.)
(4) Ensure that flux residue is completely removed.
Component should be thoroughly dried after aqueous
agent has been removed with deionized water.
(5) Some products may become slightly whitened.
However, product performance or usage is not affected.
For additional cleaning methods, please contact Murata
engineering.
Output
: 20W/liter max.
Duration : 5 minutes max.
Frequency : 28kHz to 40kHz
(3) Cleaning agent
The following list of cleaning agents have been tested on
the individual components. Evaluation of final assembly
should be completed prior to production.
a) CFC alternatives and alcohol cleaning agents
Isopropyl alcohol (IPA)
HCFC-225
62
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