BLM31PG121SN1B [MURATA]
This reference specification applies to Chip Ferrite Bead BLM31_SN Series.;
| 型号： | BLM31PG121SN1B |
| 厂家： | 
muRata |
| 描述： | This reference specification applies to Chip Ferrite Bead BLM31_SN Series. |
| 文件： | 总9页 (文件大小：297K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Reference Only
Spec. No. JENF243A-0006Z-01
P.1/9
Chip Ferrite Bead BLM31□□□□□SN1□ Reference Specification
1. Scope
This reference specification applies to Chip Ferrite Bead BLM31_SN Series.
2. Part Numbering
(ex.) BL
(1)
M
(2)
31
(3)
PG
(4)
601
(5)
S
N
1
L
(6) (7) (8) (9)
(6)Performance
(7)Category
(1)Product ID
(2)Type
(3)Dimension (L×Ｗ)
(4)Characteristics
(8)Numbers of Circuit
(9)Packaging (L:Taping / B:Bulk)
(5)Typical Impedance at 100MHz
3. Rating
Rated
Current
(mA)
(Note1)
DC
Resistance
(Ω) max.
Impedance
Customer
Part Number
MURATA
Part Number
(Ω)
Remark
(at 100MHz, Under Standard
Values
Testing Condition)
Initial
Values
at 85°C at 125°C
After
Testing
BLM31PG330SN1L
BLM31PG330SN1B
BLM31PG500SN1L
BLM31PG500SN1B
BLM31PG121SN1L
BLM31PG121SN1B
BLM31PG391SN1L
BLM31PG391SN1B
BLM31PG601SN1L
BLM31PG601SN1B
BLM31SN500SN1L
BLM31SN500SN1B
33±25%
35 min.
6000
3500
3500
2000
1500
3500
2300
2000
1250
1000
0.009
0.015
0.02
0.018
0.03
0.04
0.10
0.16
120±25%
390±25%
600±25%
50±25%
For DC power line
0.05
0.08
12000 10000 0.0016 0.0021
• Operating Temperature: -55°C to +125°C • Storage Temperature: -55°C to +125°C
（Note1）Rated Current is derated as right figure
depending on the operating temperature.
85℃
125℃
0
85
125
Operating Temperature (°C)
4. Style and Dimensions
3.2±0.2
1.6±0.2
■ Equivalent Circuit
0.7±0.3
Resistance element becomes
dominant at high frequencies.
(
)
: Electrode
(in mm)
■ Unit Mass (Typical value)
0.025 g
MURATA MFG.CO., LTD.
Reference Only
Spec. No. JENF243A-0006Z-01
P.2/9
5.Marking
No marking.
6. Standard Testing Conditions
< Unless otherwise specified >
Temperature : Ordinary Temp. (15 °C to 35 °C )
< In case of doubt >
Temperature : 20°C±2 °C
Humidity : Ordinary Humidity (25%(RH) to 85%(RH))
Humidity : 60%(RH) to 70%(RH)
Atmospheric pressure : 86kPa to 106kPa
7. Specifications
7-1. Electrical Performance
No. Item
Specification
Meet item 3.
Test Method
7-1-1 Impedance
Measuring Frequency : 100MHz±1MHz
Measuring Equipment : KEYSIGHT4291A or the equivalent
Test Fixture : KEYSIGHT16192A or the equivalent
Measuring Equipment : Digital multi meter
7-1-2 DC Resistance
Meet item 3.
*Except resistance of the Substrate and Wire
7-2. Mechanical Performance
No. Item
7-2-1 Appearance and
Dimensions
Specification
Meet item 4.
Test Method
Visual Inspection and measured with Slide Calipers.
It shall be soldered on the substrate.
Applying Force(F) : 9.8N
7-2-2 Bonding
Strength
Meet Table 1.
Applying Time : 5s±1s
Applied direction:Parallel to substrate
Table 1
Side view
Appearance No damage
Impedance
Ｆ
Ｆ
Change
(at 100MHz)
DC
Within ±30%
R0.5
Meet item 3.
Resistance
Substrate
It shall be soldered on the substrate.
Substrate: Glass-epoxy 100mm×40mm×1.6mm
Deflection: 1.0mm
7-2-3 Bending
Strength
Speed of Applying Force : 0.5mm/s
Pressure jig
Keeping Time : 30s
R340
F
Deflection
Product
45mm
45mm
MURATA MFG.CO., LTD.
Reference Only
Spec. No. JENF243A-0006Z-01
No. Item
P.3/9
Specification
Meet Table 1.
Test Method
7-2-4 Vibration
It shall be soldered on the substrate.
Oscillation Frequency : 10Hz to 55Hz to 10Hz for 1 min
Total Amplitude : 1.5mm
Testing Time : A period of 2 hours in each of 3 mutually
perpendicular directions. (Total 6 h)
Pre-Heating : 150°C±10°C, 60s～90s
Solder : Sn-3.0Ag-0.5Cu
Solder Temperature : 270°C±5°C
Immersion Time : 10s±0.5s
Immersion and emersion rates : 25mm/s
Then measured after exposure in the room condition
for 48h±4h.
Meet Table 2.
Table 2
7-2-5 Resistance
to Soldering
Heat
Appearance
Impedance
Change
No damage
Within ±30%
(for BLM31SN
within ±50%)
(at 100MHz)
DC
Resistance
Meet item 3.
7-2-6 Drop
Products shall be no failure after It shall be dropped on concrete or steel board.
tested.
Method : free fall
Height : 75cm
Attitude from which the product is dropped : 3 direction
The number of times : 3 times for each direction
(Total 9 times)
7-2-7 Solderability
The electrodes shall be at least Flux : Ethanol solution of rosin,25(wt)%
95% covered with new solder
coating.
Pre-Heating : 150°C±10°C, 60s～90s
Solder : Sn-3.0Ag-0.5Cu
Solder Temperature : 240°C±5°C
Immersion Time : 4s±1s
Immersion and emersion rates : 25mm/s
7-3. Environmental Performance
It shall be soldered on the substrate.
No.
Item
Specification
Meet Table 2.
Test Method
7-3-1 Temperature
Cycle
1 cycle:
1 step: -55 °C(+0 °C,-3 °C) / 30min±3min
2 step: Ordinary temp. / 10min to 15min
3 step: +125 °C(+3 °C,-0 °C) / 30min±3min
4 step: Ordinary temp. / 10min to 15min
Total of 100 cycles
Then measured after exposure in the room condition
for 48h±4h.
7-3-2 Humidity
Temperature : 40°C±2°C
Humidity : 90%(RH) to 95%(RH)
Time : 1000h(+48h,-0h)
Then measured after exposure in the room condition
for 48h±4h.
7-3-3 Heat Life
Temperature : 85°C±3°C
Applying Current : Rated Current
Time : 1000h(+48h,-0h)
Then measured after exposure in the room condition
for 48h±4h.
7-3-4 Cold Resistance
Temperature : -55±2°C
Time : 1000h(+48h,-0h)
Then measured after exposure in the room condition
for 48h±4h.
MURATA MFG.CO., LTD.
Reference Only
Spec. No. JENF243A-0006Z-01
P.4/9
8. Specification of Packaging
8-1. Appearance and Dimensions (8mm-wide plastic tape)
2.0±0.05
4.0±0.1 4.0±0.1
1.3±0.1
0.2±0.1
+0.1
φ
1.5
-0
1.9±0.1
Direction of feed
1.0+0.3
-
0
(in mm)
φ
*Dimension of the Cavity is measured at the bottom side.
(1) Taping
Products shall be packaged in the each embossed cavity of 8mm-wide, 4mm-pitch and plastic tape
continuously and sealed by cover tape.
(2) Sprocket hole : The sprocket holes are to the right as the tape is pulled toward the user.
(3) Spliced point : The cover tape has no spliced point.
(4) Missing components number
Missing components number within 0.025% of the number per reel or 1 pc., whichever is greater,
and are not continuous. The specified quantity per reel is kept.
8-2. Tape Strength
(1)Pull Strength
Plastic tape
Cover tape
5N min.
10N min.
165 to 180 degree
F
Cover tape
Plastic tape
(2) Peeling off force of Cover tape
0.2N to 0.7N (Minimum value is typical.)
*Speed of Peeling off:300mm/min
8-3. Taping Condition
(1) Standard quantity per reel
Quantity per 180mm reel : 3000 pcs. / reel
(2) There shall be leader-tape (cover tape only and empty tape ) and trailer- tape (empty tape) as follows.
(3) Marking for reel
The following items shall be marked on a label and the label is stuck on the reel.
(Customer part number, MURATA part number, Inspection number (∗1), RoHS marking (∗2) , Quantity, etc)
∗1) « Expression of Inspection No. »
□□ OOOO ×××
(1) (2) (3)
(1) Factory Code
(2) Date
First digit
: Year / Last digit of year
Second digit
: Month / Jan. to Sep. → 1 to 9, Oct. to Dec. → O, N, D
Third, Fourth digit : Day
(3) Serial No.
∗2) « Expression of RoHS marking »
ROHS – Y (△)
(1) (2)
(1) RoHS regulation conformity parts.
(2) MURATA classification number
(4) Outside package
These reels shall be packed in the corrugated cardboard package and the following items shall be marked
on a label and the label is stuck on the box.
(Customer name, Purchasing order number, Customer part number, MURATA part number,
RoHS marking (∗2), Quantity, etc)
MURATA MFG.CO., LTD.
Reference Only
Spec. No. JENF243A-0006Z-01
P.5/9
(5) Dimensions of reel and taping (leader-tape, trailer-tape)
8-4. Specification of Outer Case
Outer Case Dimensions
Label
Standard Reel Quantity in Outer Case
(Reel)
(mm)
D
H
W
H
186
186
93
5
D
∗ Above Outer Case size is typical. It depends on a quantity of an order.
W
9. ！ Caution
9-1. Surge current
Excessive surge current (pulse current or rush current) than specified rated current applied to the product may cause a
critical failure, such as an open circuit, burnout caused by excessive temperature rise.
Please contact us in advance in case of applying the surge current.
9-2. Limitation of Applications
Please contact us before using our products for the applications listed below which require especially high
reliability for the prevention of defects which might directly cause damage to the third party's life, body or property.
(1)Aircraft equipment
(6)Disaster prevention / crime prevention equipment
(7)Traffic signal equipment
(8)Transportation equipment (vehicles,trains,ships,etc.)
(9) Data-processing equipment
(10)Applications of similar complexity and /or reliability requirements
to the applications listed in the above
(2)Aerospace equipment
(3)Undersea equipment
(4)Power plant control equipment
(5)Medical equipment
10. Notice
This product is designed for solder mounting.
Please consult us in advance for applying other mounting method such as conductive adhesive.
10-1. Land pattern designing
• Standard land dimensions (Flow and Reflow soldering)
Rated
Current
(A)
Land pad thickness and
Chip Ferrite Bead
dimension d
Type
18µm
1.8
2.4
6.4
-
35µm
1.8
1.8
3.3
9.8
70µm
1.8
1.8
1.8
4.9
1.5/2
3.5
6
c
d
BLM31PG
BLM31SN
10～12
(in mm)
a
b
*The excessive heat by land pads may cause
deterioration at joint of products with substrate.
Solder Resist
Pattern
Type
BLM31PG
BLM31SN
Soldering
Flow
Reflow
a
2.4
2.0
b
4.7
4.3
c
1.2
1.8
MURATA MFG.CO., LTD.
Reference Only
Spec. No. JENF243A-0006Z-01
P.6/9
• Land dimensions on Flow soldering for 2.5mm pitch mounting
Chip Ferrite Bead
*As for BLM31PG type, taking land pad thickness
and rated current into account.
a
b
c
d
e
2.4
4.7
1.2
1.3
1.35
(in mm)
e
e
a
b
*The pattern shall be designed to above drawing to
prevent causing the solder bridge when products
are mounted by 2.5mm pitch flow soldering.
c
d
c
Solder Resist
Pattern
e
e
a
b
d
10-2. Soldering Conditions
Products can be applied to reflow and flow soldering.
(1) Flux,Solder
Flux
Use rosin-based flux, but not highly acidic flux (with chlorine content exceeding 0.2(wt)%. )
Do not use water-soluble flux.
Solder
Use Sn-3.0Ag-0.5Cu solder
Standard thickness of solder paste : 100 µm to 200 μm
(2) Soldering conditions
• Pre-heating should be in such a way that the temperature difference between solder and ferrite surface is limited
to 150℃ max. Also cooling into solvent after soldering should be in such a way that the temperature difference
is limited to 100℃ max.
Insufficient pre-heating may cause cracks on the ferrite, resulting in the deterioration of product quality.
• Standard soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and / or resulting in the
deterioration of product quality.
(3) soldering profile
□Flow soldering profile
Temp.
(℃)
265℃±3℃
250℃
Limit Profile
150
Heating Time
Standard Profile
60s min.
Time.(s)
Standard Profile
Limit Profile
Pre-heating
Heating
150°C、60s min.
250°C、4～6s
2 times
265°C±3°C、5s max.
Cycle of flow
2 times
MURATA MFG.CO., LTD.
Reference Only
Spec. No. JENF243A-0006Z-01
P.7/9
□Reflow soldering profile
Temp.
(℃)
260℃
245℃±3℃
230℃
220℃
Limit Profile
180
150
Standard Profile
30s～60s
60s max.
90s±30s
Time.(s)
Standard Profile
Limit Profile
Pre-heating
150～180°C 、90s±30s
Heating
above 220°C、30s～60s above 230°C、60s max.
Peak temperature
Cycle of reflow
245±3°C
260°C,10s
2 times
2 times
10-3. Reworking with soldering iron
• Pre-heating: 150°C, 1 min
• Soldering iron output: 80W max.
• Tip diameter:φ3mm max.
• Times : 2times max.
• Tip temperature: 350°C max.
• Soldering time : 3(+1,-0) seconds.
Note :Do not directly touch the products with the tip of the soldering iron in order to prevent the crack
on the ferrite material due to the thermal shock.
10-4. Solder Volume
Solder shall be used not to be exceed as shown below.
Upper Limit
Recommendable
1/3T≦t≦T
(T:Chip thickness)
t
Accordingly increasing the solder volume, the mechanical stress to product is also increased.
Exceeding solder volume may cause the failure of mechanical or electrical performance.
10-5. Attention regarding P.C.B. bending
The following shall be considered when designing and laying out P.C.B.'s.
(1) P.C.B. shall be designed so that products are not subject to the mechanical stress for board warpage.
<Products direction>
a
Products shall be located in the sideways
direction (Length:a<b) to the mechanical
b
stress.
Poor example
〈
〉
Good example
〈
〉
MURATA MFG.CO., LTD.
Reference Only
Spec. No. JENF243A-0006Z-01
P.8/9
(2)Components location on P.C.B. separation.
It is effective to implement the following measures, to reduce stress in separating the board.
It is best to implement all of the following three measures; however, implement as many measures as possible
to reduce stress.
Contents of Measures
Stress Level
(1) Turn the mounting direction of the component parallel to the board separation surface.
(2) Add slits in the board separation part.
(3) Keep the mounting position of the component away from the board separation surface.
A
A
A
>
D *1
B
C
>
>
C
Perforation
B
D
A
Slit
*1 A > D is valid when stress is added vertically to the perforation as with Hand Separation.
If a Cutting Disc is used, stress will be diagonal to the PCB, therefore A > D is invalid.
(3) Mounting Components Near Screw Holes
When a component is mounted near a screw hole, it may be affected by the board deflection that occurs during
the tightening of the screw. Mount the component in a position as far away from the screw holes as possible.
Recommended
Screw Hole
10-6. Mounting density
Add special attention to radiating heat of products when mounting the inductor near the products with heating.
The excessive heat by other products may cause deterioration at joint of this product with substrate.
10-7. Operating Environment
Do not use this product under the following environmental conditions, on deterioration of the Insulation
Resistance of the Ferrite material and/or corrosion of Inner Electrode may result from the use.
(1) in the corrodible atmosphere such as acidic gases, alkaline gases, chlorine, sulfur gases, organic gases and etc
(the sea breeze, Cl2, H2S, NH3, SO2, NO2,etc)
(2) in the atmosphere where liquid such as organic solvent, may splash on the products.
(3) in the atmosphere where the temperature / humidity changes rapidly and it is easy to dew.
10-8. Resin coating
The impedance value may change and/or it may affect on the product's performance due to high cure-stress of
resin to be used for coating / molding products. So please pay your careful attention when you select resin. In prior
to use, please make the reliability evaluation with the product mounted in your application set.
MURATA MFG.CO., LTD.
Reference Only
Spec. No. JENF243A-0006Z-01
P.9/9
10-9. Cleaning
Excessive ultrasonic oscillation during cleaning can cause the PCBs to resonate, resulting in cracked chips or
broken solder joints. Before starting your production process, test your cleaning equipment / process to insure it
does not degrade this product.
10-10. Handling of a substrate
After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the
substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to
the substrate.
Excessive mechanical stress may cause cracking in the product.
Bending
Twisting
10-11. Storage Conditions
(1) Storage period
Use the products within 6 months after delivered.
Solderability should be checked if this period is exceeded.
(2) Storage conditions
• Products should be stored the warehouse on the following conditions.
Temperature : -10°C to 40°C
Humidity
: 15% to 85% relative humidity
No rapid change on temperature and humidity
• Don't keep products in corrosive gases such as sulfur, chlorine gas or acid, or it may cause oxidization
of electrode, resulting in poor solderability.
• Products should be stored on the palette for the prevention of the influence from humidity, dust and so on.
• Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on.
• Avoid storing the product by itself bare (i.e.exposed directly to air).
(3) Delivery
Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock.
11.
!
Note
(1)Please make sure that your product has been evaluated in view of your specifications with our product being
mounted to your product.
(2)You are requested not to use our product deviating from the reference specifications.
(3)The contents of this reference specification are subject to change without advance notice. Please approve our
product specifications or transact the approval sheet for product specifications before ordering.
MURATA MFG.CO., LTD.
相关型号：
BLM31PG121SZ1B
This reference specification applies to Chip Ferrite Bead for Automotive Electronics BLM31_SZ Series based on AEC-Q200 except for Power train and Safety.
MURATA
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