BLM18HD102SN1K [MURATA]
Ferrite Chip, 1 Function(s), 0.05A, EIA STD PACKAGE SIZE 0603;
| 型号： | BLM18HD102SN1K |
| 厂家： | 
muRata |
| 描述： | Ferrite Chip, 1 Function(s), 0.05A, EIA STD PACKAGE SIZE 0603 |
| 文件： | 总10页 (文件大小：186K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
This is the PDF file of catalog No.C31E-6
C31E6.pdf 01.5.29
On-Board Type (DC) EMI Suppression Filters(EMIFILr)
2
GHz Noise Suppression Chip Ferrite Beads BLM18H Series
0.4±0.2
The chip ferrite bead BLM18H series comprises ferrite
bead inductors in the shape of a chip. This inductor
generates a high impedance which at high frequencies
mainly consists of a resistance element. The BLM18H
series is effective in circuits without stable ground
1.6±0.2
lines because the BLM18H series does not need a
0.8±0.15
connection to ground.
■ Features
in mm
The BLM18HG, BLM18HD series has a modified internal
electrode structure, that minimizes stray capacitance
and increases the effective frequency range. Impedance
values of 1000 ohm can be attained at frequency of 1Ghz
and greater.
1. The BLM18HG, BLM18HD series is similar to the
exiting BLM at frequency below 100MHz, however at
1GHz the impedance is approx. 3 times larger.
2. The BLM18HG is intended for standard signal lines
as this series provides significant impedance across
a broad frequency range. The BLM18HD provides a
sharper roll-off after the cut off frequency,
therefore this series is ideal for high speed signal
lines.
3. The magnetic shielded structure minimizes crosstalk.
The BLM18HK series is chip ferrite beads for GHz range
noise suppression of digital interface.The BLM18HK
series has a modified internal electrode structure that
minimizes stray capacitance and increases the effective
frequency range.
Resistance especially grows in the lower frequency range,
therefore BLM18HK series cansuppress the ringing.
■ Features
1. The BLM18HK series is realized high impedance at 1GHz
and suitable for noise suppression from 500MHz to GHz
range.
2. The BLM18HK series is effective in suppressing the
ringing because resistance especially grows in the
lower frequency.
3. The magnetic shielded structure minimizes cross talk.
■ Applications
• Interface line of computer that has high-speed CPU &
high-speed bus and other digital equipment like HDD.
• Suitable for noise suppression from 500MHz to GHz
range.
55
This is the PDF file of catalog No.C31E-6
C31E6.pdf 01.5.29
Impedance (at 100MHz)
Rated Current
(mA)
DC Resistance(max.)
(ohm)
Operating Temperature Range
Part Number
(ohm)
(°C)
BLM18HD471SN1
BLM18HD601SN1
BLM18HD102SN1
BLM18HG471SN1
BLM18HG601SN1
BLM18HG102SN1
BLM18HK331SN1
BLM18HK471SN1
BLM18HK601SN1
BLM18HK102SN1
470 ±25% (1000 ohm (Typ.) at 1GHz)
600 ±25% (1200 ohm (Typ.) at 1GHz)
1000 ±25% (1700 ohm (Typ.) at 1GHz)
470 ±25% (600 ohm (Typ.) at 1GHz)
600 ±25% (700 ohm (Typ.) at 1GHz)
1000 ±25% (1000 ohm (Typ.) at 1GHz)
330 (400 ohm (Typ.) at 1GHz)
100
100
50
1.20
1.50
1.80
0.85
1.00
1.60
0.50
0.70
0.90
1.50
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
2
200
200
100
200
200
100
50
470 (600 ohm (Typ.) at 1GHz)
600 (700 ohm (Typ.) at 1GHz)
1000 (1200 ohm (Typ.) at 1GHz)
■ Equivalent Cirucit
■ Impedance-Frequency (Typical)
BLM18HD Series
4000
3000
BLM18HD102SN1
2000
BLM18HD601SN1
BLM18HD471SN1
(Resistance element becomes dominant
at high frequencies.)
1000
0
1000 2000
1
10
100
Frequency (MHz)
■ Impedance-Frequency Characteristics
BLM18HD471SN1
BLM18HD601SN1
2000
2000
1500
1000
1500
1000
Z
Z
R
X
500
500
0
R
X
0
1000 2000
1
10
100
Frequency(MHz)
1000 2000
1
10
100
Frequency(MHz)
BLM18HD102SN1
4000
3000
2000
Z
1000
0
X
R
1000 2000
1
10
100
Frequency(MHz)
56
This is the PDF file of catalog No.C31E-6
C31E6.pdf 01.5.29
■ Impedance-Frequency (Typical)
BLM18HG Series
2000
2
1500
BLM18HG102SN1
BLM18HG601SN1
1000
BLM18HG471SN1
500
0
1
10
100
1000
2000
Frequency (MHz)
■ Impedance-Frequency Characteristics
BLM18HG471SN1
BLM18HG601SN1
1000
800
750
500
600
Z
Z
R
X
R
400
X
250
0
200
0
1000 2000
1
10
100
Frequency(MHz)
1000 2000
1
10
100
Frequency(MHz)
BLM18HG102SN1
2000
1500
1000
Z
R
500
0
X
1000 2000
1
10
100
Frequency(MHz)
■ Impedance-Frequency (Typical)
BLM18HK Series
1600
HK102SN1
1200
HK601SN1
800
HK471SN1
HK331SN1
400
0
1000 2000
1
10
100
Frequency (MHz)
57
This is the PDF file of catalog No.C31E-6
C31E6.pdf 01.5.29
■ Impedance-Frequency Characteristics
BLM18HK331SN
BLM18HK471SN
800
600
2
600
400
450
Z
Z
R
R
300
200
0
150
X
X
0
1000 2000
1
10
100
Frequency (MHz)
1000 2000
1
10
100
Frequency (MHz)
BLM18HK601SN
BLM18HK102SN
1000
750
500
250
0
1600
1200
800
Z
Z
R
R
400
0
X
X
1000 2000
1
10
100
Frequency (MHz)
1000 2000
1
10
100
Frequency (MHz)
58
This is the PDF file of catalog No.C31E-6
C31E6.pdf 01.5.29
Noise Suppression Effect of BLM18H Series
2
!Noise Suppression in UHF Range
[Testing Circuit]
Measured radiation at 3m distance
74HCU04
10MHz
74AC04
74HC00
BLM
Type of Filter
EMI Suppression Effect
Description
70
60
50
40
30
20
10
Initial
(No filter)
300
400
400
400
500
500
500
600
700
800
800
800
900 1000
Frequency [MHz]
Current BLM are effective in suppressing
noise in the range between 300MHz and
700MHz.
70
60
50
40
30
20
10
Initial
Conventional Type
BLM18AG102SN1
(1000Ω at 100MHz)
300
600
700
900 1000
Frequency [MHz]
In addition to the effectiveness of current
BLM, BLM18HG suppresses noise in the
range beyond 700MHz.
70
60
50
40
30
20
10
Initial
BLM18AG102SN1
for GHz Noize Suppression
BLM18HG102SN1
(1000Ω at 100MHz)
300
600
700
900 1000
Frequency [MHz]
Comparison between BLM18HG102SN1 and
BLM18AG102SN1 (CURRENT ITEM)
2000
1500
1000
500
BLM18HG102SN1
BLM18AG102SN1
0
1
10
100
1000 2000
Frequency [MHz]
59
This is the PDF file of catalog No.C31E-6
C31E6.pdf 01.5.29
BLM Series Notice (Soldering and Mounting)
2
1. Standard Land Pattern Dimensions
Do not apply narrower pattern than listed above to
BLM_P.
Narrow pattern can cause excessive heat or open circuit.
Land Pattern
Solder Resist
BLM Series
(Except BLM21P/31P/41P)
BLM21P/31P/41P
a
b
a
b
Size (mm)
Type
L
W
a
b
c
Size (mm)
BLM15 (Reflow)
BLM18 (Flow)
BLM18 (Reflow)
BLM21
1.0 0.5 0.4
1.6 0.8 0.7
1.6 0.8 0.7
2.0 1.25 1.2
3.2 1.6 2.0
4.5 1.6 3.0
1.2-1.4
2.2-2.6
1.8-2.0
3.0-4.0
4.2-5.2
5.5-6.5
0.5
0.7
0.7
1.0
1.2
1.2
Rated
Current
(A)
Land pad thickness
and Dimension d
Type
a
b
c
18µm 35µm 70µm
1.0 1.0 1.00
1.2 1.0 1.00
BLM21PG331SN1 1.5
BLM31
BLM21PG221SN1
BLM21PG300SN1
BLM21PG600SN1
BLM21PG220SN1
BLM31PG330SN1
BLM31PG500SN1
BLM31PG121SN1
BLM31PG391SN1
2
BLM41
1.2 3.0-4.0 1.0
3
2.4 1.2 1.00
6.4 3.3 1.65
2.4 1.2 1.20
BLM15 is specially adapted for refiow soldering.
6
6
Flow Mounting in High Density for BLM31/41
3
2
2.0 4.5-5.2 1.2
a
BLM31PG601SN1 1.5
BLM41PF800SN1
BLM41PG102SN1 1.5
b
d
1
1.2 1.2 1.20
e
Size (mm)
c
BLM41PG471SN1
BLM41PG750SN1
BLM41PG181SN1
BLM41PG600SN1
2
3
6
Type
3.0 5.5-6.5 1.2
a
b
d
e
2.4 1.2 1.20
6.4 3.3 1.65
BLM31
BLM41
2.0
3.0
4.2-5.2
5.5-6.5
1.2 1.3 1.35
1.2 1.8 1.5
2. Solder Paste Printing and Adhesive Application
When reflow soldering the chip EMI suppression filter, the
printing must be conducted in accordance with the
following cream solder printing conditions. If too much
solder is applied, the chip will prone to be damaged by
mechanical and thermal stress from the PCB and may
crack. In contrast, if too little solder is applied, there is the
potential that the termination strength will be insufficient,
creating the potential for detachment. Standard land
dimensions should be used for resist and copper foil
patterns.
When flow soldering the EMI suppression filter, apply the
adhesive in accordance with the following conditions. If
too much adhesive is applied, then it may overflow into
the land or termination areas and yield poor solderability.
In contrast, if insufficient adhesive is applied, or if the
adhesive is not sufficiently hardened, then the chip may
become detached during flow soldering process.
Continued on the following page.
60
This is the PDF file of catalog No.C31E-6
C31E6.pdf 01.5.29
BLM Series Notice (Soldering and Mounting)
Continued from the preceding page.
2
(1) Solder Paste Printing
BLM Series
o Ensure that solder is applied smoothly to a minimum
height of 0.2mm to 0.3mm at the end surface of the
part.
o Coat the solder paste a thickness of 100µm to 200µm.
(2) Adhesive Application
BLM Series
a:20µm−70µm
b:30µm−35µm
c:50µm−105µm
o Coating amount is illustrated in the following diagram.
Chip Solid Inductor
a
c
b
Bonding agent
PCB
Land
3. Standard Soldering Conditions
(1) SOLDERING METHODS
Allowable Flow Soldering Temperature and Time
Use flow and reflow soldering methods only.
Use standard soldering conditions when soldering chip
EMI suppression filters.
280
270
In cases where several different parts are soldered, each
having different soldering conditions, use those
conditions requiring the least heat and minimum time.
o Ensure that solder is applied smoothly to a minimum
height of 0.2mm to 0.3mm at the end surface of the
part.
260
BLM
(Except for BLM15)
250
240
230
o Coat the solder paste a thickness of 100µm to 200µm.
0
5
10
15
20
25
30
(2) SOLDERING TEMPERATURE AND TIME
Time [s]
To prevent external electrode solder leaching and
performance deterioration, solder within the temperature
and time combinations illustrated by the slanted lines in
the following graphs. If soldering is repeated, please note
that the allowed time is the accumulated time.
Allowable Reflow Soldering Temperature and Time
280
270
260
BLM
250
Solder : H60A H63A solder(JIS Z 3238)
Flux :
o Use Rosin-based fulx(when using RA type solder, clean
products sufficiently to avoid residual fulx.
o Do not use strong acidic fulx(with chlorine content
exceeding 0.20wt%)
240
230
o Do not use water-soluble fulx.
0
20
30
40
50
60
70
80
90
Time [s]
Continued on the following page.
61
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C31E6.pdf 01.5.29
BLM Series Notice (Soldering and Mounting)
Continued from the preceding page.
2
(3) SOLDERING CONDITIONS
Flow Solder
Gradual cooling
Pre-heating
Soldering
(in air)
300
250
200
150
100
50
Max. Temp. 250°C
0
60s Min.
10s Max.
Reflow Solder
Gradual cooling
Soldering
(in air)
Pre-heating
300
250
Max. Temp. 230°C
230°C
200
150
100
50
183°C
0
20s Max.
60s Max.
60s Min.
(4) REWORKING WITH SOLDER IRON
The following conditions must be strictly followed when
using a soldering iron.
Pre-heating
: 150°C 60 second Min.
Soldering iron power output
: 30W Max.
Temperature of soldering iron tip : 280°C Max.
Soldering time : 10 second Max.
Do not allow the tip of the soldering iron directly to
contact the chip.
For additional methods of reworking with soldering iron,
please contact Murata engineering.
4. Cleaning
Following conditions should be observed when cleaning
chip EMI filter.
b) Aqueous cleaning agent
Surface active agent (Clean Thru 750H)
Hydrocarbon (Techno Cleaner 335)
(1) Cleaning Temperature : 60degree C max. (40degree C
max. for CFC alternatives and alcohol cleaning agents)
(2) Ultrasonic
High grade alcohol (Pine Alpha ST-100S)
Alkaline saponifier ( Aqua Cleaner 240 -cleaner should
be diluted within 20% using deionized water.)
(4) Ensure that flux residue is completely removed.
Component should be thoroughly dried after aqueous
agent has been removed with deionized water.
(5) Some products may become slightly whitened.
However, product performance or usage is not affected.
For additional cleaning methods, please contact Murata
engineering.
Output
: 20W/liter max.
Duration : 5 minutes max.
Frequency : 28kHz to 40kHz
(3) Cleaning agent
The following list of cleaning agents have been tested on
the individual components. Evaluation of final assembly
should be completed prior to production.
a) CFC alternatives and alcohol cleaning agents
Isopropyl alcohol (IPA)
HCFC-225
62
This is the PDF file of catalog No.C31E-6
C31E6.pdf 01.5.29
Outlines of EMI Suppression Filter (EMIFILr) for DC Line
oChip Ferrite Bead
oFerrite Bead Inductor
Chip Ferrite Bead .............P.24–65
Ferrite Bead Inductor ..........P.129–130
BLM15
BLM18
BLM21
BL01
BL02RN1R3J2B
BL02RN2R3J2B
BLA31
BLM31
BLM41
BL02RN1
BL02RN2R1M2B BL03RN2R1M1B
"ꢀInductor type EMI suppression filters are effective for fre-
quencies ranging from a few MHz to a few GHz. Inductor
type filters are widely used as a low noise
[Equivalent Circuit]
R(f)
countermeasure, as well as a universal noise
suppression component.
" The inductor type EMIFILr produce a micro inductance in
the low frequency range. At high frequencies, however,
the resistive component of the inductor produces the
primary impedance. When inserted in series in the noise
producing circuit, the resistive impedance of the inductor
prevents noise propagation.
[Impedance-Frequency Characteristics(typical)]
1000
800
600
Z
400
200
0
R
X
1
10
100
1000
Frequency [MHz]
R : Real Part (Resistive Portion) X : Imaginary Part (Inductive Portion)
17
This is the PDF file of catalog No.C31E-6
C31E6.pdf 01.5.29
The structure of the "Global Part Numbers" that have been adopted since June 2001 and the meaning of each code are described herein.
If you have any questions about details, inquire at your usual Murata sales office or distributor.
o Part Numbering
(
)
Chip EMIFILr Inductor Type
(Global Part Number)
N
1 D
BL
M
18 AG 102
S
q
w
e
r
t
y
u
i o
qProduct ID
tImpedance
Expressed by three figures. The unit is in ohm (Ω). The first and
second figures are significant digits, and the third figure
expresses the number of zeros which follow the two figures.
Product ID
BL
Chip Ferrite Beads
wType
yPerformance
Expressed by an alphabet.
Code
A
Type
Ex.)
Array Type
Code
Performance
M
Monolithic Type
Monoblock Type
S
Sn Plating
D
uCategory
eDimension (LgW)
Code
N
Category
Standard Type
Code
15
Dimension (LgW)
1.00g0.50mm
1.60g0.80mm
2.00g1.25mm
3.20g1.60mm
3.20g2.50mm
4.50g1.60mm
EIA
0402
0603
0805
1206
1210
1806
H
for Automotive Electoronics
18
iNumbers of Circuit
21
31
Code
Numbers of Circuit
1Circuit
32
1
4
6
8
41
4Circuit
6Circuit
rCharacteristics
8Circuit
Code
Ap *1
Bp *2
Pp *3
RK
Characteristics
for General Use
oPackaging
for High-speed Signal Lines
for Power Supplies
Code
K
Packaging
Plastic Taping (ø330mm Reel)
Plastic Taping (ø180mm Reel)
Bulk
for Digital Interface
L
HG
for GHz Band General Use
for GHz Band High-speed Signal Line
B
HD
J
Paper Taping (ø330mm Reel)
Paper Taping (ø180mm Reel)
Bulk Case
D
*1 For standard type, is expressed by "G".
p
*2
*3
is expressed by "A", "B" or "D".
is expressed by "G", "M", "B", "F".
p
p
C
2
相关型号：
BLM18HD471SN1B
EMIFIL (Inductor type) Chip Ferrite Bead for GHz Noise BLM18H Series (0603 Size)
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BLM18HD471SN1D
EMIFIL (Inductor type) Chip Ferrite Bead for GHz Noise BLM18H Series (0603 Size)
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BLM18HD471SN1J
EMIFIL (Inductor type) Chip Ferrite Bead for GHz Noise BLM18H Series (0603 Size)
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